TWI735939B - Liquid-cooled head structure - Google Patents

Abstract

A liquid-cooled head structure comprises a substrate and a cover. One side of the substrate forms a heat exchange surface having a plurality of heat dissipating fins disposed thereon. A flow passage is formed between each two adjacent fins. A first side of the cover and the heat exchange surface of the substrate are mated together to define a heat exchange chamber therebetween for flowing of a cooling liquid. Also, the first side is formed with a restricted section and attached correspondingly to the heat dissipating fins. The restricted section has a guiding channel in fluid communication with the flow passage and the heat exchange chamber. A water inlet and a water outlet are formed on the cover, wherein the water inlet and the water outlet are respectively in fluid communication with the guiding channel and the heat exchange chamber. Through this structure design, the heat dissipation efficiency can be greatly enhanced.

Description

Liquid-cooled radiator head structure

This creation is about a liquid-cooled radiator head structure, especially a liquid-cooled radiator head structure that can greatly increase the heat exchange efficiency.

With the advancement of semiconductor processing technology, the computing speed of semiconductor wafers has also doubled compared to the past, but the increase in computing efficiency has also been accompanied by the generation of doubled heat energy. For the heat generated by semiconductor wafers today, the traditional air forced cooling mechanism is no longer sufficient. Therefore, liquid cooling mechanisms such as water cooling systems are bound to be the driving force in the future.

The water-cooling head is a component used in the water-cooling system to contact a heat source (such as a semiconductor chip). Its general working method is to exchange heat with the heat source by heat conduction to remove the heat generated during the work of the heat source, and then by Cooling liquid (for example, water) flows into the water block and exchanges heat with the heat dissipation fins or columns of the water block in a convective manner to transfer heat energy to the cooling liquid, and takes away the water block as the cooling liquid flows out. Therefore, the flow channel design in the water-cooled head is closely related to its thermal convection performance. Generally, a plurality of heat dissipation columns or fins are arranged in the water-cooled head to form a flow channel for the cooling liquid to flow through the heat dissipation columns or fins for heat exchange. Because the traditional water block system directly causes the cooling liquid to flow from an inlet into the flow channel of the radiating fins, because the cooling liquid flows inside the water block, there is no similar restriction or restriction structure to guide the direction of the water flow. As a result, the cooling liquid will flow in a non-directional turbulent flow, only when the cooling liquid inlet and the heat dissipation pillars or fins near the inlet have partial heat exchange, and for the middle section or the distance from the inlet The farther heat dissipation pillars or heat dissipation fins have poor heat exchange rate or even no heat exchange rate, which leads to insignificant heat exchange efficiency of the traditional water block.

In this regard, in order to effectively solve the above-mentioned problems, the main purpose of this creation is to provide a liquid-cooled heat sink structure that can greatly increase the heat exchange efficiency.

The secondary purpose of this creation is to provide a liquid-cooled radiating head structure that can make the flow of the cooling liquid smoother.

In order to achieve the above-mentioned purpose, this invention provides a liquid-cooled heat dissipation head structure, which includes a substrate and a cover. A flow channel is formed between the radiating fins. The cover has a first side and a second side. The first side corresponds to the heat exchange surface of the substrate and jointly defines a heat exchange chamber for a heat exchange chamber. The cooling liquid flows, the first side of the cover forms a restricting portion correspondingly attached to the radiating fins, and the restricting portion defines a guide passage connecting the flow passage and the heat exchange chamber, an inlet and an outlet The water port is separately arranged on the cover body, the water inlet is connected to the guide channel, and the water outlet is connected to the heat exchange chamber, wherein the restricting portion and the cover system are integrally formed or formed by injection molding.

Through the design of this structure, the restricting part and the cover system can be integrally formed, or the restricting part is formed on the cover through an integral over-injection molding method, so that the cooling liquid can be made The flow direction of the fins enters from the center of the radiating fins and discharges to both sides, so as to greatly increase the heat exchange efficiency between the cooling liquid and the radiating fins.

2: Liquid-cooled radiator head structure

20: substrate

201: Heat conduction surface

202: Heat Exchange Surface

203: cooling fins

204: Runner

21: Lid

211: first side

2111: Restricted Department

2112: Guidance Road

2113: Heat Exchange Chamber

212: second side

22: water inlet

23: water outlet

3: Cooling liquid

Figure 1 is a three-dimensional exploded view of the first embodiment of the creative liquid-cooled heat sink structure; Figure 2 is a three-dimensional assembly view of the first embodiment of the creative liquid-cooled heat sink structure; This is a top view of the first embodiment of the creative liquid-cooled heat sink structure; Figure 4 is a partial three-dimensional sectional view of the first embodiment of the creative liquid-cooled heat sink structure.

The above-mentioned purpose of this creation and its structural and functional characteristics will be described based on the preferred embodiments of the accompanying drawings.

Please refer to Figures 1 and 2, which are the three-dimensional exploded view and the three-dimensional assembly view of the first embodiment of the liquid-cooled heat sink structure. As shown in the figure, a liquid-cooled heat sink structure 2 includes a substrate 20 and a cover 21. The substrate 20 has a heat conduction surface 201 and a heat exchange surface 202, the heat conduction surface 201 is in contact with a heat source (not shown), and the heat exchange surface 202 is arranged at intervals There are a plurality of heat dissipation fins 203, and a first channel 204 is formed between every two adjacent heat dissipation fins 203; a water inlet 22 and a water outlet 23 are provided on a top and one side of the cover 21, and the cover A first side 211 and a second side 212 are formed on both sides of 21. The first side 211 covers the heat exchange surface 202 of the substrate 20 and forms a heat exchange chamber 2113 with the substrate 20. (Please also refer to Figure 4), the heat exchange chamber 2113 is in communication with the water outlet 23 on the side of the cover 21, and the heat exchange chamber 2113 is for a cooling liquid 3 to flow (please also refer to Figure 4) (Shown), the first side 211 of the cover 21 corresponds to the heat dissipation fins 203 to form a restriction portion 2111, and the restriction portion 2111 is correspondingly attached to the top surface of the free end of the heat dissipation fin 203, A guide passage 2112 is provided on the restricting portion 2111 to communicate with the water inlet 22 on the top of the cover 21, and the guide passage 2112 is used to restrict the cooling liquid 3 from only passing through the guide passage 2112 and It flows into each flow channel 204 between the heat dissipation fins 203 to achieve a smooth flow direction of the cooling liquid 3; the heat dissipation fins 203 have two outermost heat dissipation fins, and the guide channel 2112 has a first end An edge and a second end of the first side 211 of the cover body 21 extend toward the direction in which the water outlet 22 is arranged.

Please continue to refer to Figures 3 and 4, which are a top view and a partial three-dimensional cross-sectional schematic diagram of the cooling liquid 3 flowing in the liquid-cooled heat sink structure 2 of this creation. Through the structure design of this creation, the description is The restricting portion 2111 and the cover body 21 can be integrally formed, or the restricting portion 2111 is formed on the cover body 21 by integral injection molding. The first end of the guide channel 2112 exceeds one of the outermost sides to dissipate heat. An upper edge of the fin 203, and the second end corresponds to an upper edge of the other outermost heat dissipation fin 203 Therefore, the water inlet 22 is located above the plurality of heat dissipation fins 203 and corresponds to a part of the heat dissipation fins 203. When the cooling liquid 3 passes through the cover 21 through the water inlet 22, it is guided by the restricting portion 2111 After the channel 2112, the cooling liquid 3 will then flow into the flow channels 204 of the heat dissipation fins 203, and the cooling liquid 3 will flow out to the heat exchange chamber 2113 toward the two ends of the heat dissipation fins 203 respectively. Then it flows out through the water outlet 23 to complete the internal circulation of the cooling liquid 3 in the liquid-cooled heat sink structure 2. In other words, the aforementioned restricting portion 2111 can be formed integrally with the cover body 21, or alternatively used integrally The cover is formed on the cover 21 by injection molding. In this way, the cooling liquid can flow from the center of the heat dissipation fins 203 to the sides and discharge to both sides, so as to greatly enhance the cooling liquid 3 and the heat dissipation fins. 203 heat exchange efficiency.

As mentioned above, this creation has the following advantages compared with the prior art: 1. It greatly increases the heat exchange efficiency; 2. It can make the flow of the cooling liquid smoother.

This creation has been described in detail above, but what is described above is only a preferred embodiment of this creation, and should not limit the scope of implementation of this creation. That is to say, all equal changes and modifications made in accordance with the scope of the application for this creation shall still fall within the scope of the patent for this creation.

201: Heat conduction surface

202: Heat Exchange Surface

203: cooling fins

204: Runner

211: first side

2111: Restricted Department

2112: Guidance Road

212: second side

22: water inlet

23: water outlet

Claims (4)

A liquid-cooled radiating head structure includes: a substrate, one side of which forms a heat exchange surface, the heat exchange surface is provided with a plurality of radiating fins, and a flow path is formed between every two adjacent radiating fins; and a cover The body has a first side and a second side. The first side corresponds to the heat exchange surface of the substrate and defines a heat exchange chamber for the flow of a cooling liquid. The first side forms a restriction Correspondingly pasted on the radiating fins, the restricting portion has a guide passage connecting the flow passage and the heat exchange chamber, and a water inlet and a water outlet are separately provided on a top and one side of the cover , The water inlet communicates with the guide channel from the top of the cover, and the water outlet communicates with the heat exchange chamber from the side of the cover ; wherein the plurality of heat dissipation fins have two outermost heat dissipation fins, and the guide The prop has a first end located at the first side edge of the cover and a second end extending toward the water outlet. The first end exceeds an upper edge of one of the outermost heat dissipation fins, and the second end corresponds to the other An upper edge of the outermost heat dissipation fin, and the water inlet is located above the plurality of heat dissipation fins and corresponds to a part of the heat dissipation fins. The liquid-cooled heat dissipation head structure according to claim 1, wherein the restricting portion and the cover system are integrally formed or overmolded. The liquid-cooled heat sink structure according to claim 1, wherein the other side of the substrate opposite to the heat exchange surface further forms a heat conduction surface, and the heat conduction surface is in contact with a heat source. The liquid-cooled heat dissipation head structure according to claim 1, wherein the restriction portion is corresponding to the top surface of the free end of the heat dissipation fin attached to the top surface so that the cooling liquid flows through the guide channel to the After the flow channel, it flows to the heat exchange chamber, and then flows to the water outlet.

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