TWM588361U - Structure of liquid-cooling heat dissipation head - Google Patents

Abstract

A liquid-cooled heat sink structure includes a substrate and a cover. A heat exchange surface is formed on one side of the substrate. The heat exchange surface is provided with a plurality of heat dissipation fins and a first channel is formed between each two heat dissipation fins. A first side correspondingly merges with the heat-exchange surface cover to define a heat-exchange chamber for a cooling liquid to flow, and a restriction portion is formed on the first side to correspond to the heat-dissipating fins. The restriction portion has a A guide channel is connected to the flow channel and the heat exchange chamber. A water inlet and a water outlet are separately arranged on the cover. The water inlet is connected to the guide channel. The water outlet is connected to the heat exchange chamber. The creative structural design can achieve the effect of greatly improving the heat exchange efficiency.

Description

Liquid-cooled heat sink structure

This creation is about a liquid-cooled heat sink structure, especially a liquid-cooled heat sink structure that can significantly increase heat exchange efficiency.

With the advancement of semiconductor processing technology, the computing speed of semiconductor wafers has also doubled compared to the past, but the increase in computing efficiency also accompanies the doubling of thermal energy. For the thermal energy produced by today's semiconductor wafers, the traditional forced air cooling mechanism is no longer sufficient, so liquid cooling mechanisms such as water-cooled systems are bound to be the driving force in the future.
The water cooling head is a component used to contact a heat source (such as a semiconductor wafer) in a water cooling system. Its general working method is to perform heat exchange with the heat source in a thermally conductive manner to remove the heat generated during the work of the heat source, and then The cooling liquid (such as water) flows into the water-cooling head to exchange heat with the cooling fins or columns of the water-cooling head by heat convection to transfer heat energy to the cooling liquid, which is taken away from the water-cooling head as the cooling liquid flows out. Therefore, the design of the flow channel in the water-cooled head is closely related to its thermal convection performance. Generally, a plurality of cooling columns or fins are provided in the water-cooled head to form a flow channel for the cooling liquid to flow through the cooling columns or fins for heat exchange. Since the traditional water cooling head directly causes the cooling liquid to flow into the flow channel of the radiating fins from an inlet, there is no similar restriction or restricting structure to guide the direction of the water flow during the flow of the cooling liquid inside the water cooling head. In this way, the cooling liquid will flow in a non-directional turbulence when it is flowing, except that the cooling liquid flow inlet and the heat radiation column or fins near the inlet have a partial complete heat exchange. The farther heat radiation columns or heat radiation fins have poor or even no heat exchange rate, which causes the traditional water cooling head heat exchange efficiency to be inconspicuous.

Therefore, in order to effectively solve the above problems, the main purpose of this creation is to provide a liquid-cooled heat sink structure that can greatly increase the heat exchange efficiency.
The secondary purpose of this creation is to provide a liquid-cooled heat sink structure that makes the flow of cooling liquid smoother.
In order to achieve the above purpose, the present invention provides a liquid-cooled heat sink structure, which includes a substrate and a cover. One side of the substrate forms a heat exchange surface. The heat exchange surface is provided with a plurality of heat dissipation fins, two adjacent to each other. A first channel is formed between the heat dissipation fins. The cover has a first side and a second side. The first side is corresponding to cover the heat exchange surface of the substrate and collectively defines a heat exchange chamber for one. The cooling liquid flows. A restricting portion is formed on the first side of the cover body to cover the heat dissipation fins. The restricting portion provides a guide channel to connect the flow channel and the heat exchange chamber, a water inlet and an outlet. A water outlet is separately provided on the cover body, the water inlet is connected to the guide channel, and the water outlet is connected to the heat exchange chamber, wherein the restriction portion and the cover system are integrally formed or formed by injection molding.
Through the design of this structure, the restricting part and the cover system can be integrally formed, or the restricting part is formed on the cover body by integral overmolding, so that the cooling liquid can be made. The flow direction has the effect of entering from the center of the radiating fins and discharging to both sides, so as to greatly increase the heat exchange efficiency between the cooling liquid and the radiating fins.

The above-mentioned purpose of this creation and its structural and functional characteristics will be explained according to the preferred embodiments of the drawings.
Please refer to Figs. 1 and 2 for a three-dimensional exploded view and a three-dimensional assembled view of the first embodiment of the liquid-cooled heat sink structure. As shown in the figure, a liquid-cooled heat sink structure 2 includes a substrate. 20 and a cover 21, the substrate 20 has a heat conducting surface 201 and a heat exchanging surface 202. The heat conducting surface 201 is in contact with a heat source (not shown), and the heat exchanging surface 202 is arranged at intervals. A plurality of heat dissipation fins 203, and a first-rate track 204 is formed between two adjacent heat dissipation fins 203;
The cover 21 is provided with a water inlet 22 and a water outlet 23, and a first side 211 and a second side 212 are formed on both sides of the cover 21, and the first side 211 covers the substrate correspondingly. The heat exchange surface 202 of 20 forms a heat exchange chamber 2113 with the substrate 20 (please refer to FIG. 4 together). The heat exchange chamber 2113 is in communication with the water outlet 23 and the heat exchange chamber 2113 is used for a cooling liquid 3 to flow (please refer to FIG. 4 together). The first side 211 of the cover 21 corresponds to the heat dissipation fins 203 to form a restricting portion 2111, and the restricting portion 2111 is corresponding to the covering. A guide channel 2112 is opened on the top surface of the heat dissipation fin 203 at the free end, and is connected to the water inlet 22 on the restriction portion 2111. The guide channel 2112 is used to restrict the cooling liquid 3 Only the guide channel 2112 can pass through and flow into each of the flow channels 204 between the heat dissipation fins 203, thereby achieving a smooth flow direction of the cooling liquid 3;
Continue to refer to Figures 3 and 4, which are the top view and partial three-dimensional cross-sectional schematic diagram of the flow of the cooling liquid 3 in the liquid-cooled heat sink structure 2 for this creation. Through the structural design of this creation, The restricting portion 2111 and the cover 21 may be integrally formed, or the restricting portion 2111 is formed on the cover 21 by integral overmolding. When the cooling liquid 3 passes through the water inlet 22 and passes through the cover 21 After entering the guide channel 2112 of the restricting portion 2111, the cooling liquid 3 then flows into the flow channels 204 of the radiating fins 203, and the cooling liquid 3 flows out to both ends of the radiating fins 203 to The heat exchange chamber 2113 finally flows out through the water outlet 23 to complete the circulation of the cooling liquid 3 in the liquid-cooled heat sink structure 2. In other words, the aforementioned restricting portion 2111 can be selected with the cover 21 For integral molding, or choose to use integral overmolding on the cover 21, in this way, the flow of the cooling liquid can have the effect of entering from the center of the heat dissipation fin 203 and discharging to both sides, thereby achieving Substantially increase cooling liquid 3 and diffuse Heat exchange efficiency of the fin 203.
As mentioned above, this creation has the following advantages compared to conventional knowledge:
1. Significantly increase heat exchange efficiency;
2. Can make the flow of cooling liquid more smooth.
The creation has been described in detail above, but the above is only a preferred embodiment of the creation, and the scope of implementation of the creation cannot be limited. That is to say, all equal changes and modifications made in accordance with the scope of this creative application shall still be covered by the patent of this creative.

2‧‧‧ liquid-cooled heat sink structure
20‧‧‧ substrate
201‧‧‧ heat conduction surface
202‧‧‧Heat exchange surface
203‧‧‧Cooling Fin
204‧‧‧ runner
21‧‧‧ Cover
211‧‧‧first side
2111‧‧‧Restricted Department
2112‧‧‧Guide Road
2113‧‧‧Heat exchange chamber
212‧‧‧second side
22‧‧‧ water inlet
23‧‧‧ Outlet
3‧‧‧ cooling liquid

FIG. 1 is an exploded perspective view of the first embodiment of the liquid-cooled heat sink structure of the creation;
Figure 2 is a three-dimensional assembled view of the first embodiment of the liquid-cooled heat sink structure of the creative work;
FIG. 3 is a top view of the first embodiment of the structure of the liquid-cooled heat sink;
FIG. 4 is a partial three-dimensional cross-sectional schematic view of the first embodiment of the liquid-cooled heat sink structure of the creation.

Claims (4)

A liquid-cooled heat sink structure includes:
A substrate with a heat exchange surface formed on one side, the heat exchange surface is provided with a plurality of heat radiation fins, and a first channel is formed between two adjacent heat radiation fins; and a cover body having a first side and a second Side, the first side corresponds to the heat exchange surface of the substrate and merges with the heat exchange surface to define a heat exchange chamber for a cooling liquid to flow, and the first side forms a restricting portion corresponding to the heat dissipation fins, The restricting portion has a guide channel connecting the flow channel and the heat exchange chamber, a water inlet and a water outlet are separately arranged on the cover body, the water inlet is connected to the guide channel, and the water outlet is connected to the heat exchange Chamber. The liquid-cooled heat sink structure according to claim 1, wherein the restricting portion and the cover system are integrally formed or over-molded. The liquid-cooled heat sink structure according to claim 1, wherein the substrate further forms a heat conducting surface on the other side of the heat exchange surface, and the heat conducting surface is in contact with a heat source. The liquid-cooled heat sink structure according to claim 1, wherein the restricting portion is correspondingly attached to a top surface of the heat sink fin which is a free end to allow the cooling liquid to flow to the via the guide channel. The flow channel then flows to the heat exchange chamber and then to the water outlet.