TW202231171A - Water-cooling heat dissipation device - Google Patents
Water-cooling heat dissipation device Download PDFInfo
- Publication number
- TW202231171A TW202231171A TW109146238A TW109146238A TW202231171A TW 202231171 A TW202231171 A TW 202231171A TW 109146238 A TW109146238 A TW 109146238A TW 109146238 A TW109146238 A TW 109146238A TW 202231171 A TW202231171 A TW 202231171A
- Authority
- TW
- Taiwan
- Prior art keywords
- water
- inlet
- outlet
- water inlet
- water outlet
- Prior art date
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
本發明係有關於水冷散熱裝置,特別指一種水冷散熱裝置。The present invention relates to a water-cooled heat-dissipating device, in particular to a water-cooled heat-dissipating device.
按,隨著電腦處理速度的提升,藉由不同的功能介面卡可使電腦發揮更大的效益,為了滿足使用者的需求,在介面卡上之晶片的工作時脈都高達數億赫茲(Hz),而如此高頻率的工作速度,熱量問題應蘊而生。當介面卡溫度過高時,輕者造成耗電量的增加,重者可能損害到電子元件而縮短處理器的壽命,如此將嚴重影響到處理器的效率、可靠度與穩定性。因此,為了排除介面卡的熱量,習知有以泵浦、水冷頭、散熱器組成的水冷散熱系統,其一般的工作方式是熱交換件與介面卡的熱源進行熱交換,再藉由冷卻液體(例如水)流入熱交換件內進行熱交換而將熱能轉移至冷卻液體中,由泵浦將冷卻液體加壓流入散熱器,而達到快速散熱的功效,使介面卡可正常運作。 然而,習知的水冷散熱系統僅將水冷頭設置於主要發熱元件(例如圖形處理器)上,對主要發熱元件進行散熱,但主要發熱元件周邊也同時設有其他的發熱元件,習知的水冷散熱系統無法對其他的發熱元件進行散熱,導致介面卡的散熱效果不佳。 因此,如何解決上述問題是本領域技術人員所要努力的方向。 Press, with the improvement of computer processing speed, different functional interface cards can make the computer more effective. In order to meet the needs of users, the working clock of the chip on the interface card is as high as hundreds of millions of hertz (Hz). ), and with such a high frequency of work, heat problems should arise. When the temperature of the interface card is too high, the power consumption will increase in the lightest case, and the life of the processor may be shortened in the severe case, which will seriously affect the efficiency, reliability and stability of the processor. Therefore, in order to remove the heat of the interface card, there is known a water-cooled heat dissipation system composed of a pump, a water-cooling head, and a radiator. The general working method is that the heat exchange element exchanges heat with the heat source of the interface card, and then cools the liquid by cooling the liquid. (For example, water) flows into the heat exchange element for heat exchange and transfers the heat energy to the cooling liquid. The cooling liquid is pressurized by the pump and flows into the radiator, so as to achieve the effect of rapid heat dissipation, so that the interface card can operate normally. However, the conventional water cooling system only sets the water cooling head on the main heating element (such as a graphics processor) to dissipate heat from the main heating element, but other heating elements are also arranged around the main heating element. The heat dissipation system cannot dissipate heat from other heating elements, resulting in poor heat dissipation of the interface card. Therefore, how to solve the above-mentioned problems is the direction that those skilled in the art should strive for.
本發明之一目的,在提供對電子裝置上複數發熱元件進行散熱,進而增加散熱效果的一種水冷散熱裝置。 為達成上述之目的,本發明提供一種水冷散熱裝置,係包含:一乘載本體、一水冷頭、一泵浦、一蓋件、一第一管體、一第二管體; 所述乘載本體具有一第一側面、一第二側面、一孔口,該孔口貫穿該乘載本體之第一、二側面;所述水冷頭具有一上部及一下部,該水冷頭對應設置於該孔口內,該水冷頭之下部一接觸面選擇凸出或切齊該第二側面,該水冷頭上部具有一進水口及一出水口連通該水冷頭內部之一第一空間;所述泵浦設置於該乘載本體的第一側面,具有一第一入水口及一第一出水口;所述蓋件內部呈中空並且一側呈開放狀,對應蓋合於該乘載本體的該第一側面並共同形成一第二空間,該蓋件具有一第二入水口及一第二出水口並與該第二空間相連通;該第一管體兩端分別連接該泵浦之第一出水口及該水冷頭之進水口;所述第二管體兩端分別連通該水冷頭的出水口及該蓋件的第二入水口。 藉由本發明此設計,可透過該承載本體一側對應與一電子裝置組設,並吸附該電子裝置上複數發熱元件所產生的熱量,再由另一側的水冷頭及承載本體將該熱量透過水冷之方式進行散熱,進而可達到電子裝置的散熱效果的功效。 One object of the present invention is to provide a water-cooled heat dissipation device that dissipates heat from a plurality of heating elements on an electronic device, thereby increasing the heat dissipation effect. In order to achieve the above object, the present invention provides a water-cooled heat dissipation device, which comprises: a carrying body, a water-cooling head, a pump, a cover, a first tube body, and a second tube body; The riding body has a first side surface, a second side surface, and an opening, and the opening passes through the first and second side surfaces of the riding body; the water-cooling head has an upper part and a lower part, and the water-cooling head corresponds to Set in the orifice, a contact surface on the lower part of the water-cooled head is selected to protrude or cut into the second side surface, and the upper part of the water-cooled head has a water inlet and a water outlet connected to a first space inside the water-cooled head; so The pump is arranged on the first side of the riding body, and has a first water inlet and a first water outlet; the cover is hollow inside and one side is open, corresponding to the cover closed on the riding body. The first side surfaces together form a second space, the cover has a second water inlet and a second water outlet and communicates with the second space; both ends of the first pipe body are respectively connected to the first water outlet of the pump A water outlet and a water inlet of the water block; two ends of the second pipe body are respectively connected to the water outlet of the water block and the second water inlet of the cover. Through the design of the present invention, one side of the carrying body can be correspondingly assembled with an electronic device, and the heat generated by the plurality of heating elements on the electronic device can be absorbed, and then the heat can be transmitted through the water-cooling head and the carrying body on the other side. The heat dissipation is carried out by means of water cooling, thereby achieving the effect of the heat dissipation effect of the electronic device.
本發明之上述目的及其結構與功能上的特性,將依據所附圖式之較佳實施例予以說明。
請參考第1、2a、2b、3圖,係為本發明水冷散熱裝置之第一實施例之立體分解圖及立體組合及水冷頭立體分解圖,如圖所示,所述水冷散熱裝置,係包含:一乘載本體1、一水冷頭2、一泵浦3、一蓋件4、一第一管體5、一第二管體6;
所述乘載本體1具有一第一側面11、一第二側面12、一孔口13,所述第一、二側面11、12分設於該乘載本體1之兩側面,該孔口13貫穿該乘載本體1之第一、二側面11、12。
所述水冷頭2具有一上部21及一下部22,該水冷頭2設置於前述孔口1內,該水冷頭2之下部22置入該孔口13中,並具有一接觸面23選擇凸出或切齊該乘載本體1之第二側面12,該水冷頭2上部21具有一進水口211及一出水口212連通該水冷頭2內部之一第一空間(圖中未示)。
所述泵浦3設置於該乘載本體1的第一側面11具有一第一入水口31及一第一出水口32。
所述蓋件4內部呈中空,並且一側呈開放狀,對應蓋合於該乘載本體1的該第一側面11並共同形成一第二空間41,該蓋件4具有一第二入水口42及一第二出水口43並與該第二空間相41連通。
該水冷頭2更具有一殼體24、一板體25及一導流件26,該殼體24及該板體25對應蓋合界定一熱交換腔室(圖中未示),該板體25一面係為一熱交換面251對應該熱交換腔室,該板體25另一面係為一吸熱面252接觸一第一發熱元件(圖中未示),該吸熱面252具有複數鰭片2521,每兩相鄰的鰭片2521之間形成一通道2522,該導流件26設置於該等鰭片2521上,並該導流件26開設一導流道261連通所述通道2522及熱交換腔室(圖中未示),並該第二入水口42連通所述導流道261及熱交換腔室(圖中未示),該導流件26係對應設置在所述鰭片2521呈自由端之頂面,所述水冷頭2之殼體24為一中空之結構體,故當殼體24與該板體25對應蓋合後則自然形成該密閉的熱交換腔室,故未在圖示中特別揭露。
該水冷頭2的進、出水口211、212係分別設有一第二接頭7,該蓋件4的第二入、出水口42、43係分別設有一第三接頭8。
所述第一管體5兩端分別連接該泵浦3之第一出水口32及該水冷頭2之進水口211;所述第二管體6兩端分別連通該水冷頭2的出水口212及該蓋件4的第二入水口42。
所述第二側面12相對應與複數發熱源(圖中未示)貼設,並該蓋件4恰設於對應有該等發熱源處的另一側。
一第三管體c及一第四管體d,該泵浦3的第一入水口31連通該第三管體c之一端,該蓋件4的第二出水口43連通該第四管體d之一端,並所述第三、四管體c、d之另一端分別連接一水排f,藉此形成一水冷迴路。
請參閱第4圖,係為本發明水冷散熱裝置之第二實施例之立體組合圖,如圖所示,本實施例部分結構及功能係與上述第一實施例相同,故在此將不再贅述,惟本實施例與上述第一實施例之不同處係為本實施例更包含一水箱9設置於該乘載本體1的第一側面11具有一第四入水口91、一第四出水口92、一第五入水口93、一第五出水口94、一第一腔室95及一第二腔室96,該第一、二腔室95、96彼此隔離獨立設置,該第四入、出水口91、92連通該第一腔室95,該第五入、出水口93、94連通該第二腔室96,一第三管體c之一端連通該第四入水口91,該第四出水口92連通該泵浦3的第一入水口31,該第五入水口93連通該泵浦3的第一出水口32,該第一管體5之一端通過該第五出水口94,該水箱9的第四入水口92及第五出水口93係分別設有一第四接頭10。
該泵浦3的第一入、出水口31、32係分別設有一第三接頭8向外凸出並插入該水箱9的第四出水口92及第五入水口93,並所述乘載本體1的第二側面12向一介面卡e貼設並由該第二側面12吸附該介面卡e所產生之熱量。
藉由本發明此設計,可以改善習知水冷頭係直接令冷卻液體由入水口流入至散熱鰭片之間通道內,但並沒有任何導流元件導引冷卻液體的流動方向,導致冷卻液體在流入散熱鰭片間的通道之前無方向性地亂流,僅於冷卻液體流入口與近入口處之散熱柱或散熱鰭片有完全熱交換之外,而對於離入口中段或較遠之散熱柱或散熱鰭片則熱交換率較差或甚至沒有熱交換,導致習知水冷頭換熱效率不佳的問題。本案的導流件26可限制該冷卻液體的流動方向,以達到增加換熱效率的功效。
以上已將本發明做一詳細說明,惟以上所述者,僅為本發明之一較佳實施例而已,當不能限定本發明實施之範圍。即凡依本發明申請範圍所作之均等變化與修飾等,皆應仍屬本發明之專利涵蓋範圍。
The above-mentioned objects of the present invention and their structural and functional characteristics will be described with reference to the preferred embodiments of the accompanying drawings.
Please refer to Figures 1, 2a, 2b and 3, which are an exploded perspective view, a three-dimensional assembly, and a three-dimensional exploded view of a water-cooling head of the first embodiment of the water-cooled heat sink of the present invention. As shown in the figures, the water-cooled heat sink is a Including: a carrying
1:乘載本體 11:第一側面 12:第二側面 13:孔口 2:水冷頭 21:上部 211:進水口 212:出水口 22:下部 23:接觸面 24:殼體 25:板體 251:熱交換面 252:吸熱面 2521:鰭片 2522:通道 26:導流件 261:導流道 3:泵浦 31:第一入水口 32:第一出水口 4:蓋件 41:第二空間 42:第二入水口 43:第二出水口 5:第一管體 6:第二管體 7:第二接頭 8:第三接頭 9:水箱 91:第四入水口 92:第四出水口 93:第五入水口 94:第五出水口 95:第一腔室 96:第二腔室 10:第四接頭 c:第三管體 d:第四管體 e:介面卡 f:水排 1: Ride the body 11: The first side 12: Second side 13: Orifice 2: water cooling head 21: Upper 211: water inlet 212: water outlet 22: lower part 23: Contact surface 24: Shell 25: Board body 251: heat exchange surface 252: Endothermic Surface 2521: Fins 2522: Channel 26: deflector 261: diversion channel 3: Pump 31: The first water inlet 32: The first water outlet 4: Cover 41: Second space 42: Second water inlet 43: The second water outlet 5: The first tube body 6: The second tube body 7: Second connector 8: The third connector 9: water tank 91: Fourth water inlet 92: Fourth outlet 93: Fifth water inlet 94: Fifth outlet 95: first chamber 96: Second chamber 10: Fourth connector c: the third body d: Fourth tube body e: interface card f: water drain
第1圖係為本發明水冷散熱裝置之第一實施例之立體分解圖; 第2a圖係為本發明水冷散熱裝置之第一實施例之立體組合圖; 第2b圖係為本發明水冷散熱裝置之第一實施例之立體局部剖視圖; 第3圖係為本發明水冷散熱裝置之水冷頭立體分解圖; 第4圖係為本發明水冷散熱裝置之第二實施例之立體組合圖; FIG. 1 is an exploded perspective view of the first embodiment of the water-cooled heat sink of the present invention; Figure 2a is a three-dimensional combined view of the first embodiment of the water-cooled heat sink of the present invention; Figure 2b is a perspective partial cross-sectional view of the first embodiment of the water-cooled heat sink of the present invention; Figure 3 is an exploded perspective view of the water cooling head of the water cooling device of the present invention; FIG. 4 is a three-dimensional combined view of the second embodiment of the water-cooled heat dissipation device of the present invention;
1:乘載本體 1: Ride the body
11:第一側面 11: The first side
12:第二側面 12: Second side
13:孔口 13: Orifice
2:水冷頭 2: water cooling head
21:上部 21: Upper
211:進水口 211: water inlet
212:出水口 212: water outlet
22:下部 22: lower part
23:接觸面 23: Contact surface
3:泵浦 3: Pump
31:第一入水口 31: The first water inlet
32:第一出水口 32: The first water outlet
4:蓋件 4: Cover
42:第二入水口 42: Second water inlet
43:第二出水口 43: The second water outlet
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109146238A TWI759033B (en) | 2020-12-25 | 2020-12-25 | Water-cooling heat dissipation device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109146238A TWI759033B (en) | 2020-12-25 | 2020-12-25 | Water-cooling heat dissipation device |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI759033B TWI759033B (en) | 2022-03-21 |
TW202231171A true TW202231171A (en) | 2022-08-01 |
Family
ID=81710803
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109146238A TWI759033B (en) | 2020-12-25 | 2020-12-25 | Water-cooling heat dissipation device |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI759033B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112835433A (en) * | 2020-12-25 | 2021-05-25 | 奇宏电子(深圳)有限公司 | Water-cooling heat dissipation device |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM259215U (en) * | 2004-01-02 | 2005-03-11 | Global Win Technology Co Ltd | Liquid-cooling type heat dissipation apparatus |
TWM442535U (en) * | 2012-07-23 | 2012-12-01 | Asia Vital Components Co Ltd | Heat-dissipating device and heat-dissipating module |
TWM526103U (en) * | 2016-03-17 | 2016-07-21 | 東莞永騰電子制品有限公司 | Heat dissipation structure |
TWM565471U (en) * | 2018-05-10 | 2018-08-11 | 國格金屬科技股份有限公司 | Liquid cooling heat dissipation structure |
TWM610072U (en) * | 2020-12-25 | 2021-04-01 | 大陸商奇宏電子(深圳)有限公司 | Water cooling apparatus |
-
2020
- 2020-12-25 TW TW109146238A patent/TWI759033B/en active
Also Published As
Publication number | Publication date |
---|---|
TWI759033B (en) | 2022-03-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN107567248B (en) | Liquid cooling heat radiator | |
US20080128114A1 (en) | Liquid cooling device | |
JP4551261B2 (en) | Cooling jacket | |
US20090205810A1 (en) | Liquid cooling device | |
TWI768877B (en) | Vapor chamber structure | |
US20070039716A1 (en) | Heat dissipating unit | |
US20050178531A1 (en) | Fluid passage arrangement of a heat absorber for use in a liquid-cooling type cooling apparatus | |
TWM610072U (en) | Water cooling apparatus | |
CN217360724U (en) | Heat radiation module | |
TWI759033B (en) | Water-cooling heat dissipation device | |
CN216982389U (en) | Heat sink and electrical device | |
CN108109976B (en) | Light liquid cooling plate set with plastic frame and heat dissipation system | |
US7661465B2 (en) | Integrated cooling system with multiple condensing passages for cooling electronic components | |
WO2017049867A1 (en) | Heat dissipation device and heat dissipation plate thereof | |
CN213958007U (en) | Water-cooling heat dissipation device | |
CN212061096U (en) | Water-cooling heat dissipation device and expansion card assembly | |
CN108260328B (en) | Water cooling bar structure with built-in interlayer | |
JP2006135275A (en) | Cooler of liquid-cooled cooling device | |
TW202137865A (en) | Liquid cooling module and its liquid cooling head | |
US20070158051A1 (en) | Integrated cooling system for electronic components | |
CN112835433A (en) | Water-cooling heat dissipation device | |
EP3760959B1 (en) | Heat dissipation device | |
CN213694645U (en) | Liquid cooling type heat dissipation device | |
TWI839974B (en) | A heat dissipation module for heat exchange between two phase flow circulation vapor chamber and cold liquid fuild | |
TWI735939B (en) | Liquid-cooled head structure |