CN213694645U

CN213694645U - Liquid cooling type heat dissipation device

Info

Publication number: CN213694645U
Application number: CN202022620241.XU
Authority: CN
Inventors: 陈建佑; 叶恬利; 林仁豪; 陈建安
Original assignee: Chunhong Electronic Technology Chongqing Co ltd
Current assignee: Chunhong Electronic Technology Chongqing Co ltd
Priority date: 2019-12-19
Filing date: 2020-11-12
Publication date: 2021-07-13
Anticipated expiration: 2030-11-12
Also published as: TWI729960B; TW202125155A; CN113015396A; CN113015396B

Abstract

A liquid-cooled heat dissipation device comprises a water-cooling head module, a water tank module, a first water-cooling row, a second water-cooling row and a power module. The water-cooling head module comprises a base, a top plate, a spacing structure and a heat conduction unit. The partition structure is connected between the base and the top plate, a first cavity is defined between the top plate, the partition structure and the base, a second cavity and a third cavity are defined between the partition structure and the top plate, and the first cavity, the second cavity and the third cavity are isolated from each other. The heat conducting unit is connected with the base, is partially positioned in the first chamber and is partially exposed out of the base. The first water cooling row and the second water cooling row are respectively connected with the top plate and are communicated between the water cooling head module and the water tank module. The power module is configured to drive the working medium to flow between the water head module and the water tank module through the first water cooling row and the second water cooling row. The liquid-cooled heat dissipation device can effectively reduce the overall resistance generated when the air flow passes through the liquid-cooled heat dissipation device, thereby being beneficial to the liquid-cooled heat dissipation device to exert better heat dissipation effect.

Description

Liquid cooling type heat dissipation device

Technical Field

The utility model relates to a liquid cooling type heat abstractor.

Background

Along with the improvement of living standard of people, the demand of people on computer equipment is increasing. Accordingly, manufacturers are also working to improve computer devices to meet the increasing demands of consumers.

In addition to improving the performance of the computer equipment, how to improve the heat dissipation performance of the heat dissipation device in the computer equipment, for example, is undoubtedly an important issue of great concern in the industry.

SUMMERY OF THE UTILITY MODEL

An object of the present invention is to provide a liquid-cooled heat dissipating device, which can effectively reduce the overall resistance generated when the air flow passes through the liquid-cooled heat dissipating device, thereby helping the liquid-cooled heat dissipating device to exert a better heat dissipating effect.

According to the utility model discloses an embodiment, a liquid-cooled heat abstractor contains water-cooling head module, water tank module, first water-cooling row, second water-cooling row and power module. The water-cooling head module comprises a base, a top plate, a spacing structure and a heat conduction unit. The top plate comprises a first sub top plate, a second sub top plate and a third sub top plate, and the first sub top plate is connected between the second sub top plate and the third sub top plate. The spacing structure is connected between the base and the top plate, a first cavity is defined between the second sub-top plate, the third sub-top plate, the spacing structure and the base, a second cavity and a third cavity are defined between the spacing structure and the first sub-top plate, and the first cavity, the second cavity and the third cavity are isolated from each other. The heat conduction unit is connected with the base, at least part of the heat conduction unit is located in the first cavity and at least part of the heat conduction unit is exposed out of the base, and the heat conduction unit is configured to abut against the heat source. The first water-cooling row is connected with the top plate and communicated between the water-cooling head module and the water tank module, and at least part of the second sub-top plate is abutted to the first water-cooling row. The second water-cooling row is connected with the top plate and communicated between the water-cooling head module and the water tank module, and at least part of the third sub-top plate is abutted to the second water-cooling row. The power module is configured to drive the working medium to flow between the water head module and the water tank module through the first water cooling row and the second water cooling row.

In one or more embodiments of the present invention, the above-mentioned spacer structure includes a spacer, a first spacer, a second spacer and a third spacer, the first spacer, the second spacer and the third spacer are respectively connected to the spacer and configured to abut against the top plate, a second cavity is defined between the first spacer and the second spacer, and a third cavity is defined between the second spacer and the third spacer.

In one or more embodiments of the present invention, the first sub top plate has a plurality of first through holes, a plurality of second through holes, a plurality of third through holes and a plurality of fourth through holes, the second spacing portion is located between the second through holes and the third through holes, the second through holes are located between the first through holes and the second spacing portion, and the third through holes are located between the fourth through holes and the second spacing portion. The second sub top plate is provided with a plurality of fifth through holes, the first through holes are located between the fifth through holes and the second through holes, the third sub top plate is provided with a plurality of sixth through holes, the fourth through holes are located between the sixth through holes and the third through holes, the spacing structures are located between the fifth through holes and the sixth through holes, and the fifth through holes and the sixth through holes are respectively communicated with the first chamber.

In one or more embodiments of the present invention, the water tank module includes a tank body and a cover body. The box body comprises a bottom plate, a wall plate and a plurality of partition pieces, wherein the wall plate surrounds and is connected with the bottom plate, the partition pieces are respectively connected with the wall plate and the bottom plate so as to define a fourth chamber, a fifth chamber, a sixth chamber and a seventh chamber which are isolated from each other, the bottom plate is provided with a plurality of seventh through holes, a plurality of eighth through holes, a plurality of ninth through holes, a plurality of tenth through holes, a plurality of eleventh through holes and a plurality of twelfth through holes, the seventh through holes and the eighth through holes are respectively communicated with the fourth chamber, the ninth through holes are communicated with the fifth chamber, the tenth through holes are communicated with the sixth chamber, and the eleventh through holes and the twelfth through holes are respectively communicated with the. The cover is configured to connect the wall plate and the partition member to seal the fourth chamber, the fifth chamber, the sixth chamber and the seventh chamber.

In one or more embodiments of the present invention, the bottom plate has a first opening and a second opening, the first opening communicates with the fifth chamber, and the second opening communicates with the sixth chamber. The power module includes a pump. The pump communicates the first opening with the second opening to be configured to be pressurized with a working medium.

In one or more embodiments of the present invention, the first water cooling row and the second water cooling row are arranged along a first direction, the first water cooling row includes a plurality of first heat dissipation fins, a plurality of first pipes, a plurality of second pipes and a plurality of third pipes, the second pipes are located between the first pipes and the third pipes along the first direction, the first pipes, the second pipes and the third pipes are respectively separated from each other and at least partially arranged along the second direction, the second direction is substantially perpendicular to the first direction, the first pipes are communicated between the fifth through holes and the seventh through holes, the second pipes are communicated between the first through holes and the eighth through holes, the third pipes are communicated between the second through holes and the ninth through holes, the first heat dissipation fins are separated from each other along the third direction and are distributed among the first pipes, the second pipes and the third pipes along the second direction, the third direction is perpendicular to the first direction and the second direction, and the first pipeline, the second pipeline and the third pipeline are configured to allow the working medium to flow therein.

In one or more embodiments of the present invention, the number of the first pipelines is greater than the number of the second pipelines.

In one or more embodiments of the present invention, the second water cooling row includes a plurality of second heat dissipation fins, a plurality of fourth pipelines, a plurality of fifth pipelines and a plurality of sixth pipelines, the fifth pipeline is located between the fourth pipeline and the sixth pipeline in the first direction, the fourth pipeline, the fifth pipeline and the sixth pipeline are separated from each other and at least partially arranged along the second direction, the fourth pipeline is communicated between the third perforation and the tenth perforation, the fifth pipeline is communicated between the fourth perforation and the eleventh perforation, the sixth pipeline is communicated between the sixth perforation and the twelfth perforation, the second heat dissipation fins are separated from each other along the third direction and distributed between the fourth pipeline, the fifth pipeline and the sixth pipeline along the second direction, and the fourth pipeline, the fifth pipeline and the sixth pipeline are configured to allow the working medium to flow therethrough.

In one or more embodiments of the present invention, the number of the sixth pipelines is greater than the number of the fifth pipelines.

In one or more embodiments of the present invention, a pressure relief space is defined between the first water-cooling row and the second water-cooling row.

In one or more embodiments of the present invention, the liquid-cooled heat dissipation device further includes two side covers. The side cover body is respectively connected with one side of the water cooling head module and one side of the water tank module to cover the pressure relief space, and the pressure relief space is positioned between the side cover bodies.

The present invention provides a water cooling system, comprising a first water cooling row and a second water cooling row, wherein the first water cooling row and the second water cooling row are arranged along a first direction, the side cover body comprises a main cover body, two tapering sections and two sub-cover bodies, the main cover body is connected between the tapering sections along the first direction, the tapering sections are connected between the main cover body and the corresponding sub-cover bodies, a first distance is defined between the main cover body, a second distance is defined between the sub-cover bodies and the corresponding sub-cover bodies, and the second distance is greater than the first distance.

In one or more embodiments of the present invention, the first water cooling bar further includes a plurality of third heat dissipation fins. The third heat dissipation fins are positioned corresponding to the sub-cover body.

In one or more embodiments of the present invention, the second water cooling bar further includes a plurality of fourth heat dissipation fins. The position of the fourth heat dissipation fin corresponds to the sub-cover body.

The present invention is directed to a power module, which is disposed between a first water-cooling row and a second water-cooling row, and the power module is connected to a water tank module or a water-cooling head module.

In one or more embodiments of the present invention, the heat conducting unit includes a heat conducting plate and a heat conducting structure. The heat conducting plate is connected to the base and has a heat absorbing surface facing away from the water tank module and configured to abut the heat source. The heat conducting structure is located in the first cavity and connected to the heat conducting plate.

The utility model discloses above-mentioned embodiment has following advantage at least:

(1) after the working medium absorbs the heat energy of the heat source through the heat absorption surface of the water-cooling head module, the working medium can flow in the water-cooling head module, the second water-cooling bar, the water tank module and the first water-cooling bar through the driving of the power module so as to form fluid circulation in the liquid-cooling heat dissipation device, and the working medium is cooled once by heat dissipation when passing through the first water-cooling bar and the second water-cooling bar respectively, so that the heat dissipation efficiency of the liquid-cooling heat dissipation device can be greatly improved.

(2) Because the second distance between the sub-cover body and the other sub-cover body is greater than the first distance between the main cover body and the other main cover body, when the air flow enters from the outside of the liquid-cooled heat dissipation device and sequentially passes through the second water-cooling row and the first water-cooling row, the air flow is guided by the tapered section between the main cover body and the sub-cover body to increase the flow velocity of the air flow, and further the heat dissipation efficiency is effectively improved.

(3) When the airflow passes through the second water-cooling bank, the airflow generates fluid resistance among the sixth pipeline, the fifth pipeline, the fourth pipeline and the second heat dissipation fins, however, because the pressure relief space is defined between the first water-cooling bank and the second water-cooling bank, when the airflow reaches the pressure relief space after passing through the second water-cooling bank, the airflow does not encounter the fluid resistance any more, and can continue to flow to the first water-cooling bank. Therefore, the process that the airflow flows through the second water cooling row and the first water cooling row in sequence can be smoother, and the overall fluid resistance generated when the airflow passes through the liquid cooling type heat dissipation device can be effectively reduced, so that the liquid cooling type heat dissipation device can be helped to exert a better heat dissipation effect.

The utility model relates to a liquid cooling type heat abstractor, it contains:

a water-cooled head module, comprising:

a base;

a top plate, including a first sub top plate, a second sub top plate and a third sub top plate, wherein the first sub top plate is connected between the second sub top plate and the third sub top plate;

a spacing structure connected between the base and the top plate, a first chamber defined between the second sub-top plate, the third sub-top plate, the spacing structure and the base, a second chamber and a third chamber defined between the spacing structure and the first sub-top plate, and a first chamber and a second chamber

The chamber and the third chamber are isolated from each other; and

a heat conducting unit connected to the base, at least a part of the heat conducting unit being located in the first chamber and at least a part of the heat conducting unit being exposed outside the base, the heat conducting unit being configured to abut against a heat source;

a water tank module;

the first water cooling row is connected with the top plate and communicated between the water cooling head module and the water tank module, and at least part of the second sub top plate is abutted against the first water cooling row;

the second water cooling row is connected with the top plate and communicated between the water cooling head module and the water tank module, and at least part of the third sub top plate is abutted against the second water cooling row; and

and the power module is configured to drive a working medium to flow between the water-cooling head module and the water tank module through the first water-cooling discharge and the second water-cooling discharge.

Preferably, the spacer structure includes a spacer plate, a first spacer portion, a second spacer portion and a third spacer portion, the first spacer portion, the second spacer portion and the third spacer portion are respectively connected to the spacer plate and configured to abut against the top plate, the second chamber is defined between the first spacer portion and the second spacer portion, and the third chamber is defined between the second spacer portion and the third spacer portion.

Preferably, the first sub-top plate has a plurality of first through holes, a plurality of second through holes, a plurality of third through holes, and a plurality of fourth through holes, the second partition is located between the second through holes and the third through holes, the second through holes are located between the first through holes and the second partition, the third through holes are located between the fourth through holes and the second partition, the second sub-top plate has a plurality of fifth through holes, the first through holes are located between the fifth through holes and the second through holes, the third sub-top plate has a plurality of sixth through holes, the fourth through holes are located between the sixth through holes and the third through holes, the partition is located between the fifth through holes and the sixth through holes, and the fifth through holes and the sixth through holes respectively communicate with the first chamber.

Preferably, the water tank module comprises:

a casing comprising a bottom plate, a wall plate and a plurality of spacers, wherein the wall plate surrounds and connects the bottom plate, the spacers connect the wall plate and the bottom plate respectively to define a fourth chamber, a fifth chamber, a sixth chamber and a seventh chamber which are isolated from each other, the bottom plate has a plurality of seventh through holes, a plurality of eighth through holes, a plurality of ninth through holes, a plurality of tenth through holes, a plurality of eleventh through holes and a plurality of twelfth through holes, the seventh through holes and the eighth through holes are respectively communicated with the fourth chamber, the ninth through holes are communicated with the fifth chamber, the tenth through holes are communicated with the sixth chamber, and the eleventh through holes and the twelfth through holes are respectively communicated with the seventh chamber; and

a cover configured to connect the wall plate and the spacer to seal the fourth chamber, the fifth chamber, the sixth chamber, and the seventh chamber.

Preferably, the bottom plate has a first opening and a second opening, the first opening communicates with the fifth chamber, the second opening communicates with the sixth chamber, the power module includes: and the pump is communicated with the first opening and the second opening so as to pressurize the working medium.

Preferably, the first water cooling bank and the second water cooling bank are arranged along a first direction, the first water cooling bank includes a plurality of first heat dissipation fins, a plurality of first pipes, a plurality of second pipes and a plurality of third pipes, the second pipes are located between the first pipes and the third pipes in the first direction, the first pipes, the second pipes and the third pipes are respectively separated from each other and at least partially arranged along a second direction, the second direction is substantially perpendicular to the first direction, the first pipes are communicated between the fifth through holes and the seventh through holes, the second pipes are communicated between the first through holes and the eighth through holes, the third pipes are communicated between the second through holes and the ninth through holes, the first heat dissipation fins are separated from each other along a third direction and distributed along the second direction between the first pipes, the seventh through holes, and the eighth through holes, The third direction is perpendicular to the first direction and the second direction, and the first pipe, the second pipe and the third pipe are configured to allow the working medium to flow therethrough.

Preferably, the number of the first pipes is greater than the number of the second pipes.

Preferably, the second water-cooling bank includes a plurality of second radiator fins, a plurality of fourth pipes, a plurality of fifth pipes, and a plurality of sixth pipes, the fifth pipe is located between the fourth pipe and the sixth pipe in the first direction, the fourth, fifth and sixth conduits are each spaced apart from one another and are at least partially aligned along the second direction, the fourth conduit communicates between the third and tenth apertures, the fifth conduit communicates between the fourth and eleventh apertures, the sixth pipe is communicated between the sixth through hole and the twelfth through hole, the second heat dissipation fins are separated from each other along the third direction and distributed among the fourth pipe, the fifth pipe and the sixth pipe along the second direction, the fourth, fifth and sixth conduits are configured to circulate the working medium therethrough.

Preferably, the number of the sixth pipes is greater than the number of the fifth pipes.

Preferably, a pressure relief space is defined between the first water-cooled bank and the second water-cooled bank.

Preferably, the liquid-cooled heat dissipating device further comprises: and the two side cover bodies are respectively connected with one sides of the water cooling head module and the water tank module so as to cover the pressure relief space, and the pressure relief space is positioned between the side cover bodies.

Preferably, the first water-cooling row and the second water-cooling row are arranged along a first direction, each of the side cover bodies includes a main cover body, two tapering sections and two sub cover bodies, the main cover body is connected between the tapering sections along the first direction, each of the tapering sections is connected between the main cover body and the corresponding sub cover body, a first distance is defined between the main cover bodies, a second distance is defined between each of the sub cover bodies and the corresponding sub cover body, and the second distance is greater than the first distance.

Preferably, the first water-cooled bank further comprises: and the positions of the third radiating fins correspond to the sub-cover body.

Preferably, the second water-cooled bank further comprises: and the positions of the fourth heat dissipation fins correspond to the positions of the sub-cover bodies.

Preferably, the power module is located between the first water-cooling row and the second water-cooling row, and the power module is communicated with the water tank module or the water-cooling head module.

Preferably, the heat conducting unit includes: a heat conducting plate connected to the base and having a heat absorbing surface facing away from the water tank module and configured to abut the heat source; and a heat conducting structure located in the first chamber and connected to the heat conducting plate.

Drawings

Fig. 1 is a perspective view illustrating a liquid-cooled heat dissipating device according to an embodiment of the present invention.

Fig. 2 is a perspective view illustrating the liquid-cooled heat dissipating device of fig. 1, in which a side cover is omitted.

Fig. 3 is an exploded view illustrating the liquid-cooled heat dissipating device of fig. 1.

Fig. 4 is a cross-sectional view showing fig. 2 along a line N-N.

Fig. 5 is a schematic top view showing the case of fig. 3.

Fig. 6 is a schematic top view illustrating the liquid-cooled heat sink of fig. 1 with a radiator module removed.

Fig. 7 is a schematic cross-sectional view illustrating a liquid-cooled heat dissipating device according to another embodiment of the present invention.

Fig. 8 is a schematic cross-sectional view illustrating a liquid-cooled heat dissipating device according to still another embodiment of the present invention.

Wherein the reference numerals are as follows:

100: liquid cooling type heat dissipation device

110: water-cooling head module

111: heat absorbing surface

112: base seat

1121: flow guiding block

1122: first support column

1123: second support pillar

113: top board

1131: first sub top plate

1132: second sub top plate

1133: third sub top plate

114: spacer structure

1141: partition board

1142: a first spacer

1143: second spacer portion

1144: third spacer

115: heat conduction unit

1151: heat conducting plate

1152: heat conduction structure

120: water tank module

121: box body

1211: base plate

1212: wall panel

1213: spacer member

122: cover body

130: the first water cooling row

131: first heat dissipation fin

1321: first pipeline

1322: second pipeline

1323: third pipeline

133: third heat sink fin

140: second water cooling bank

141: second heat dissipation fin

1421: the fourth pipeline

1422: fifth pipeline

1423: sixth pipeline

143: fourth heat dissipation fin

150: power module

151: pump and method of operating the same

152: first connecting pipe

153: second connecting pipe

160: side cover body

161: main cover body

162: tapered section

163: sub-cover body

200: heat source

CAF: cold air flow

C1: the first chamber

C2: second chamber

C3: third chamber

C4: the fourth chamber

C5: the fifth chamber

C6: the sixth chamber

C7: the seventh chamber

D1: a first direction

D2: second direction

D3: third direction

HAF: hot air flow

H1: first through hole

H2: second through hole

H3: third through hole

H4: fourth through hole

H5: fifth through hole

H6: sixth through hole

H7: seventh through hole

H8: eighth through hole

H9: ninth hole

H10: tenth hole of perforation

H11: eleventh hole

H12: twelfth hole of perforation

N-N: line segment

P1: first opening

P2: second opening

R: flow direction of

SP: pressure relief space

X1: first distance

X2: second distance

Detailed Description

In the following description, numerous implementation details are set forth in order to provide a more thorough understanding of the present invention. It should be understood, however, that these implementation details should not be used to limit the invention. That is, in some embodiments of the invention, details of these implementations are not necessary. Further, some of the conventional structures and elements are shown in simplified schematic form in the drawings for the sake of simplicity, and the same reference numerals will be used to refer to the same or like elements throughout the drawings. And features of different embodiments may be applied interactively if possible to implement.

Unless defined otherwise, all words (including technical and scientific terms) used herein have their ordinary meaning as is understood by those skilled in the art. Furthermore, the definitions of the above words and phrases in general dictionary should be read in the content of the present specification to be consistent with the meaning and meaning of the relevant fields of the present invention. Unless specifically defined otherwise, these terms are not to be interpreted in an idealized or overly formal sense.

Please refer to fig. 1-2. Fig. 1 is a perspective view illustrating a liquid-cooled heat dissipating device 100 according to an embodiment of the present invention. Fig. 2 is a perspective view illustrating the liquid-cooled heat dissipating device 100 of fig. 1, in which the side cover 160 is omitted. In the present embodiment, as shown in fig. 1 to 2, a liquid-cooled heat sink 100 includes a water-cooled head module 110, a tank module 120, a first water-cooled bank 130, a second water-cooled bank 140, and a power module 150. The water-cooled head module 110 is configured to abut against a heat source 200 (see fig. 4). The first water cooling bank 130 communicates between the water head module 110 and the water tank module 120. The second water cooling bank 140 is also connected between the water head module 110 and the water tank module 120, and a pressure relief space SP is defined between the first water cooling bank 130 and the second water cooling bank 140. The power module 150 is configured to drive a working medium (not shown), which may be a liquid or a gas, to flow between the water head module 110 and the water tank module 120 through the first water cooling bank 130 and the second water cooling bank 140. In practical applications, the liquid-cooled heat dissipating device 100 further includes two side covers 160 (see fig. 1, one of the two side covers 160 is located on the back of the liquid-cooled heat dissipating device 100, and is hidden from view). The side covers 160 respectively connect the water cooling head module 110 and one side of the tank module 120 to cover the relief space SP, in other words, the relief space SP is located between the side covers 160. In fig. 2, the side cover 160 is omitted to make the structure of the liquid-cooled heat dissipating device 100 more clear and understandable.

Please refer to fig. 3 to 4. Fig. 3 is an exploded view illustrating the liquid-cooled heat sink 100 of fig. 1. Fig. 4 is a cross-sectional view showing fig. 2 along a line N-N. In the present embodiment, as shown in fig. 3 to 4, the water-cooling head module 110 includes a base 112, a top plate 113, a spacer structure 114, and a heat transfer unit 115. The top panel 113 includes a first sub-top panel 1131, a second sub-top panel 1132, and two third sub-top panels 1133, and the first sub-top panel 1131 is connected between the second sub-top panel 1132 and the third sub-top panel 1133. A spacer structure 114 is connected between the base 112 and the top plate 113. Specifically, the first chamber C1 is defined between the second sub-top plate 1132, the third sub-top plate 1133, the partition structure 114 and the base 112, the second chamber C2 and the third chamber C3 are defined between the partition structure 114 and the first sub-top plate 1131, and the first chamber C1, the second chamber C2 and the third chamber C3 are isolated from each other, that is, the first chamber C1, the second chamber C2 and the third chamber C3 are not directly communicated with each other. The heat conducting unit 115 is connected to the base 112, the heat conducting unit 115 is at least partially located in the first chamber C1 and at least partially exposed outside the base 112, and the base 112 includes a flow guiding block 1121, and the flow guiding block 1121 is connected between the spacing structure 114 and the heat conducting unit 115. The heat conducting unit 115 is disposed to abut against the heat source 200. Further, the first water cooling bank 130 is connected to the top plate 113 and communicated between the water head module 110 and the water tank module 120, and the second sub-top plate 1132 at least partially abuts against the first water cooling bank 130. Similarly, the second water cooling bank 140 is also connected to the top plate 113 and communicates between the water head module 110 and the water tank module 120, and the third sub-top plate 1133 at least partially abuts against the second water cooling bank 140.

Furthermore, as shown in fig. 3 to 4, the base 112 further includes at least one first supporting column 1122 and at least one second supporting column 1123, the first supporting column 1122 and the second supporting column 1123 are located in the first chamber C1, and the flow guiding block 1121 is located between the first supporting column 1122 and the second supporting column 1123. When the spacer structure 114 is disposed on the base 112 and abuts against the flow guiding block 1121, the spacer structure 114 abuts against the first supporting column 1122 and the second supporting column 1123 at the same time, so that both sides of the spacer structure 114 are properly supported when the spacer structure 114 is disposed on the base 112.

Further, as shown in fig. 3 to 4, the spacer structure 114 includes a spacer 1141, a first spacer 1142, a second spacer 1143, and a third spacer 1144, and the first spacer 1142, the second spacer 1143, and the third spacer 1144 are respectively connected to the spacer 1141 and disposed to abut against the top plate 113. It is noted that the first and

second spacing portions

1142 and 1143 define a second chamber C2 therebetween, and the second and

third spacing portions

1143 and 1144 define a third chamber C3 therebetween. In other words, the second partition 1143 divides the second chamber C2 and the third chamber C3.

More specifically, as shown in fig. 3 to 4, the first sub top plate 1131 has a plurality of first through holes H1, a plurality of second through holes H2, a plurality of third through holes H3, and a plurality of fourth through holes H4, the second through holes H2 are located between the first through holes H1 and the second spacing portion 1143, and the third through holes H3 are located between the fourth through holes H4 and the second spacing portion 1143. In addition, the second sub-top plate 1132 has a plurality of fifth through holes H5, the first through hole H1 is located between the fifth through hole H5 and the second through hole H2, and the third sub-top plate 1133 has a plurality of sixth through holes H6, and the fourth through hole H4 is located between the sixth through hole H6 and the third through hole H3. It is noted that the spacing structure 114 is located between the fifth through hole H5 and the sixth through hole H6, and the fifth through hole H5 and the sixth through hole H6 are respectively communicated with the first chamber C1.

In the present embodiment, as shown in fig. 4, the first perforation H1 and the second perforation H2 communicate with the second chamber C2, respectively, and the third perforation H3 and the fourth perforation H4 communicate with the third chamber C3, respectively.

Please refer to fig. 5. Fig. 5 is a schematic top view illustrating the case 121 of fig. 3. As shown in fig. 3 to 5, the tank module 120 includes a tank body 121 and a cover 122. The casing 121 includes a bottom plate 1211, a wall plate 1212 and a plurality of partition members 1213, the wall plate 1212 is surrounded and connected to the bottom plate 1211, the partition members 1213 are respectively connected to the wall plate 1212 and the bottom plate 1211 to define a fourth chamber C4, a fifth chamber C5, a sixth chamber C6 and a seventh chamber C7, the fourth chamber C4, the fifth chamber C5, the sixth chamber C6 and the seventh chamber C7 are isolated from each other, that is, the fourth chamber C4, the fifth chamber C5, the sixth chamber C6 and the seventh chamber C7 are not directly connected to each other. The bottom plate 1211 has a plurality of seventh through holes H7, a plurality of eighth through holes H8, a plurality of ninth through holes H9, a plurality of tenth through holes H10, a plurality of eleventh through holes H11, and a plurality of twelfth through holes H12. The seventh perforation H7 and the eighth perforation H8 are respectively communicated with the fourth chamber C4, the ninth perforation H9 is communicated with the fifth chamber C5, the tenth perforation H10 is communicated with the sixth chamber C6, and the eleventh perforation H11 and the twelfth perforation H12 are respectively communicated with the seventh chamber C7. The cover 122 is configured to connect the wall 1212 and the partition 1213 to seal the fourth cavity C4, the fifth cavity C5, the sixth cavity C6, and the seventh cavity C7.

Furthermore, the bottom plate 1211 has a first opening P1 and a second opening P2, the first opening P1 communicates with the fifth chamber C5, and the second opening P2 communicates with the sixth chamber C6. The power module 150 includes a pump 151, a first connection pipe 152, and a second connection pipe 153. The pump 151 is configured to pressurize the working medium, the first connection pipe 152 is communicated between the pump 151 and the first opening P1, and the second connection pipe 153 is communicated between the pump 151 and the second opening P2.

In a specific structure, as shown in fig. 3 to 4, the first water cooling bank 130 and the second water cooling bank 140 are arranged along a first direction D1, the first water cooling bank 130 includes a plurality of first heat dissipation fins 131, a plurality of first pipes 1321, a plurality of second pipes 1322 and a plurality of third pipes 1323, the second pipes 1322 are located between the first pipes 1321 and the third pipes 1323 on the first direction D1, the first pipes 1321, the second pipes 1322 and the third pipes 1323 are respectively separated from each other and at least partially arranged along a second direction D2, and the second direction D2 is substantially perpendicular to the first direction D1.

Furthermore, in the present embodiment, the first pipe 1321 is communicated between the first chamber C1 and the fourth chamber C4 through the fifth perforation H5 and the seventh perforation H7, the second pipe 1322 is communicated between the second chamber C2 and the fourth chamber C4 through the first perforation H1 and the eighth perforation H8, and the third pipe 1323 is communicated between the second chamber C2 and the fifth chamber C5 through the second perforation H2 and the ninth perforation H9. The first heat dissipation fins 131 are separated from each other along a third direction D3 and distributed among the first pipe 1321, the second pipe 1322, and the third pipe 1323 along the second direction D2, the third direction D3 is perpendicular to the first direction D1 and the second direction D2, and the first pipe 1321, the second pipe 1322, and the third pipe 1323 are configured to circulate a working medium therethrough. In the present embodiment, the number of the first conduits 1321 is greater than the number of the second conduits 1322.

In practical applications, the first heat sink fins 131 may be selected from cut fins (skived fins) or other fins with a cylindrical shape, a sheet shape, or even an irregular shape, and the gaps between adjacent fins are used for the airflow to pass through, so that under the condition of increasing the contact area with the working medium (for example, increasing the density of the arrangement), the heat energy can be transferred to the airflow more quickly, so that the airflow can take away the heat energy.

In addition, the second water cooling bank 140 includes a plurality of second heat dissipation fins 141, a plurality of fourth pipes 1421, a plurality of fifth pipes 1422, and a plurality of sixth pipes 1423, the fifth pipes 1422 are located between the fourth pipes 1421 and the sixth pipes 1423 in the first direction D1, and the fourth pipes 1421, the fifth pipes 1422, and the sixth pipes 1423 are respectively separated from each other and at least partially arranged along the second direction D2.

Furthermore, in the present embodiment, the fourth pipe 1421 is communicated between the third chamber C3 and the sixth chamber C6 through the third through hole H3 and the tenth through hole H10, the fifth pipe 1422 is communicated between the third chamber C3 and the seventh chamber C7 through the fourth through hole H4 and the eleventh through hole H11, and the sixth pipe 1423 is communicated between the first chamber C1 and the seventh chamber C7 through the sixth through hole H6 and the twelfth through hole H12. The second heat dissipation fins 141 are spaced apart from each other along the third direction D3 and distributed among the fourth, fifth and

sixth pipes

1421, 1422 and 1423 along the second direction D2, and the fourth, fifth and

sixth pipes

1421, 1422 and 1423 are configured to allow a working medium to flow therethrough. In the present embodiment, the number of the sixth pipes 1423 is greater than the number of the fifth pipes 1422.

In practical applications, the second heat dissipation fins 141 may be selected from cut fins (skived fins) or other columnar, plate-shaped, or even irregular fins, and the gaps between adjacent fins are used for air flow to pass through, so that the heat energy can be transferred to the air flow more quickly under the condition of increasing the contact area with the working medium (for example, increasing the density of the arrangement), so as to take away the heat energy by the air flow.

In the present embodiment, as shown in fig. 3 to 4, the heat conducting unit 115 includes a heat conducting plate 1151 and a heat conducting structure 1152. The heat conductive plate 1151 is coupled to the base 112 and has a heat absorbing surface 111, the heat absorbing surface 111 facing away from the tank module 120 and configured to abut the heat source 200 to absorb heat energy from the heat source 200, so that the heat conductive plate 1151 may be selected from a metal material or other material having good thermal conductivity. The heat-conducting plate 1151 may be a one-piece structure or a composite structure composed of multiple layers or multiple elements, but the present invention is not limited thereto. Furthermore, the heat conducting structure 1152 is disposed in the first chamber C1 and connected between the heat conducting plate 1151 and the flow guiding block 1121 of the base 112. The heat conducting structure 1152 may be selected from a sliced fin (sliced fin), or other fin with a cylindrical, plate-like, or even irregular shape. The gaps between adjacent fins allow the working medium to pass through, and the heat energy can be more quickly transferred to the working medium under the condition of increasing the contact area with the working medium (for example, increasing the density of arrangement). After the heat absorbing surface 111 of the heat conducting plate 1151 is directly or indirectly in thermal contact with the heat source 200, the heat absorbing surface 111 of the heat conducting plate 1151 absorbs the heat energy and transfers the heat energy to the heat conducting structure 1152 located in the first chamber C1, and the heat conducting structure 1152 transfers the heat energy to the working medium in the water-cooled head module 110.

In practical applications, when the liquid-cooled heat sink 100 is in operation, the heat source 200 abuts the heat absorbing surface 111 of the heat conducting unit 115, and the heat energy of the heat source 200 is transferred to the working medium in the water-cooled head module 110 through the heat absorbing surface 111. The flow path of the working medium in the liquid-cooled heat dissipation device 100 is shown as the flow direction R in fig. 4. Under the action of the power module 150, the working medium in the water-cooling head module 110 flows from the first chamber C1 through the fifth perforation H5 into the first conduit 1321 of the first water-cooling row 130, and then flows from the seventh perforation H7 into the fourth chamber C4 of the water tank module 120; the working medium located in the fourth chamber C4 flows into the second pipe 1322 of the first water-cooled bank 130 through the eighth perforation H8, and then flows into the second chamber C2 of the water-cooled head module 110 from the first perforation H1; the working medium located in the second chamber C2 flows into the third pipe 1323 of the first water-cooled bank 130 through the second perforation H2, and then flows into the fifth chamber C5 of the water tank module 120 from the ninth perforation H9; the working medium located in the fifth chamber C5 flows from the first connection pipe 152 of the power module 150 into the pump 151 (the pump 151 please see fig. 3) through the first opening P1; the working medium is pressurized by the pump 151 and then flows into the sixth chamber C6 of the tank module 120 through the second connection pipe 153 of the power module 150 and the second opening P2. At this time, the heat energy absorbed by the working medium is guided by the first heat dissipation fins 131 of the first water cooling row 130 to be discharged outside the liquid cooling heat dissipation device 100.

Further, the working medium located in the sixth chamber C6 flows into the fourth pipe 1421 of the second water-cooled row 140 through the tenth penetration H10, and then flows into the third chamber C3 of the water-cooled head module 110 from the third penetration H3; the working medium located in the third chamber C3 flows into the fifth pipe 1422 of the second water-cooled bank 140 through the fourth penetration H4, and then flows into the seventh chamber C7 of the water tank module 120 from the eleventh penetration H11; the working medium located in the seventh chamber C7 flows into the sixth conduit 1423 of the second water-cooled bank 140 through the twelfth perforation H12, and then flows into the first chamber C1 of the water-cooled head module 110 from the sixth perforation H6. At this time, the working medium conducts heat for the second time through the second heat dissipation fins 141 of the second water cooling bank 140; the working medium in the first chamber C1 is guided by the flow guiding block 1121 to accelerate the flow of the working medium through the heat conducting structure 1152 of the heat conducting unit 115, thereby absorbing the heat energy guided by the heat conducting unit 115 from the heat source 200. Meanwhile, the cold airflow CAF takes away the heat energy absorbed by the working medium to form a hot airflow HAF, which is discharged to the outside of the liquid-cooled heat sink 100. It is noted that in the present embodiment, the cold air flow CAF flows from the sixth duct 1423 toward the first duct 1321. In other words, the cold air flow CAF flows through the sixth duct 1423 with a lower temperature first and then flows through the first duct 1321 with a higher temperature second to become the hot air flow HAF, so as to achieve a better heat dissipation effect.

In other words, after the working medium absorbs the heat energy of the heat source 200 through the heat absorbing surface 111 of the water cooling head module 110, the working medium flows through the water cooling head module 110, the second water cooling row 140, the water tank module 120 and the first water cooling row 130 by the driving of the power module 150 to form a fluid circulation in the liquid-cooled heat sink 100, and the working medium is cooled once by heat dissipation when passing through the first water cooling row 130 and the second water cooling row 140, so that the heat dissipation efficiency of the liquid-cooled heat sink 100 can be greatly improved.

It is noted that when the cold airflow CAF passes through the second water cooling row 140, the cold airflow CAF generates a fluid resistance between the sixth pipeline 1423, the fifth pipeline 1422, the fourth pipeline 1421 and the second heat dissipation fin 141, however, as described above, since the pressure relief space SP is defined between the first water cooling row 130 and the second water cooling row 140, when the cold airflow CAF reaches the pressure relief space SP after passing through the second water cooling row 140, the cold airflow CAF with a certain amount of heat energy no longer encounters the fluid resistance, and can continue to flow to the first water cooling row 130. Therefore, the process of the cold air flow CAF flowing through the second water-cooling row 140 and the first water-cooling row 130 to become the hot air flow HAF can be smoother, and the overall fluid resistance generated when passing through the liquid-cooled heat dissipation device 100 can be effectively reduced, thereby helping the liquid-cooled heat dissipation device 100 to exert a better heat dissipation effect.

In the present embodiment, as shown in fig. 1, 2 and 4, the power module 150 is in communication with the water tank module 120 and is located between the first water-cooled bank 130 and the second water-cooled bank 140. That is, the power module 150 is at least partially located within the pressure relief space SP.

Please refer to fig. 6. Fig. 6 is a schematic top view illustrating the liquid-cooled heat sink 100 of fig. 1 with the water tank module 120 removed. In the present embodiment, as shown in fig. 3 and 6, the side cover 160 includes a main cover 161, two tapered sections 162 and two sub-covers 163, the main cover 161 is connected between the tapered sections 162 along a first direction D1, the tapered sections 162 are connected between the main cover 161 and the corresponding sub-covers 163, a first distance X1 is defined between the main cover 161, a second distance X2 is defined between the sub-covers 163 and the corresponding sub-covers 163, and the second distance X2 is greater than the first distance X1.

As described above, the number of the first pipes 1321 is greater than the number of the second pipes 1322, and the number of the sixth pipes 1423 is also greater than the number of the fifth pipes 1422. Correspondingly, as shown in fig. 3 and 6, the first water cooling bar 130 further includes a plurality of third heat dissipation fins 133, and the third heat dissipation fins 133 correspond to the sub-cover 163. More specifically, the first pipe 1321 is located between the third radiator fins 133, and the third radiator fins 133 are shorter than the first radiator fins 131 in a length extending in the first direction D1 and are located at least partially between the first pipe 1321 and the corresponding sub-cover 163. Similarly, the second water cooling bank 140 further includes a plurality of fourth heat dissipation fins 143, and the positions of the fourth heat dissipation fins 143 correspond to the sub-cover 163. More specifically, the sixth duct 1423 is located between the fourth heat dissipation fins 143, and the fourth heat dissipation fins 143 are shorter than the second heat dissipation fins 141 in a length extending in the first direction D1 and are located at least partially between the sixth duct 1423 and the corresponding sub-cover 163.

Since the second distance X2 between the sub-cover 163 and the other sub-cover 163 is greater than the first distance X1 between the main cover 161 and the other main cover 161, when an air flow (e.g., an air flow generated by fan disturbance) enters from the outside of the liquid-cooled heat dissipating apparatus 100 and sequentially passes through the second water-cooled row 140 and the first water-cooled row 130, the air flow is guided by the tapered section 162 between the main cover 161 and the sub-cover 163 to increase the flow velocity of the air flow, thereby effectively improving the heat dissipating efficiency.

Please refer to fig. 7. Fig. 7 is a schematic cross-sectional view illustrating a liquid-cooled heat dissipating device 100 according to another embodiment of the present invention. In the present embodiment, according to practical conditions, the power module 150 communicates with the water-cooled head module 110, the second connection pipe 153 communicates with the second chamber C2, the first connection pipe 152 communicates with the third chamber C3, the fourth chamber C4 and the fifth chamber C5 of the water tank module 120 communicate with each other, and the sixth chamber C6 and the seventh chamber C7 of the water tank module 120 communicate with each other. In addition, the third partition 1144 of the partition structure 114 of the water-cooling head module 110 is retracted toward the first partition 1142, so that the fourth conduit 1421 of the second water-cooling row 140 is communicated between the third chamber C3 and the sixth chamber C6, the fifth conduit 1422 is communicated between the seventh chamber C7 and the first chamber C1, and the sixth conduit 1423 is communicated between the seventh chamber C7 and the first chamber C1, that is, in the present embodiment, the third chamber C3 is communicated with only the fourth conduit 1421, and the first chamber C1 is communicated with the first conduit 1321, the fifth conduit 1422 and the sixth conduit 1423 at the same time.

In the present embodiment, when the liquid-cooled heat sink 100 operates, the heat source 200 abuts against the heat absorbing surface 111 of the heat conducting unit 115, and the thermal energy of the heat source 200 is transferred to the working medium inside the water-cooled head module 110 through the heat absorbing surface 111. The flow path of the working medium in the liquid-cooled heat dissipation device 100 is shown in fig. 7 as the flow direction R. Under the action of the power module 150, the working medium in the water-cooling head module 110 flows from the first chamber C1 into the first pipeline 1321 of the first water-cooling row 130 through the fifth perforation H5, and then flows from the seventh perforation H7 into the fourth chamber C4 of the water tank module 120; part of the working medium in the fourth chamber C4 flows into the fifth chamber C5 of the water tank module 120, then flows into the second chamber C2 of the water-cooled head module 110 through the third pipe 1323 of the first water-cooled row 130, and part of the working medium in the fourth chamber C4 flows into the second chamber C2 of the water-cooled head module 110 through the second pipe 1322 of the first water-cooled row 130; the working medium in the second chamber C2 flows into the pump 151 (see fig. 3) through the first connection pipe 152 of the power module 150; the working medium is pressurized by the pump 151 and then flows into the third chamber C3 of the water-cooling head module 110 through the second connection pipe 153 of the power module 150 (the flow of the working medium from the first connection pipe 152 to the second connection pipe 153 is shown by a dotted line).

Further, the working medium in the third chamber C3 flows into the sixth chamber C6 of the tank module 120 through the fourth conduit 1421 of the second water-cooled bank 140; the working medium in the sixth chamber C6 flows into the seventh chamber C7 of the water tank module 120 and simultaneously flows into the first chamber C1 of the water-cooled head module 110 through the fifth pipe 1422 and the sixth pipe 1423 of the second water-cooled bank 140. The working medium in the first chamber C1 is guided by the flow guiding block 1121 to accelerate the flow of the working medium through the heat conducting structure 1152 of the heat conducting unit 115, thereby absorbing the heat energy guided by the heat conducting unit 115 from the heat source 200. Through the above-mentioned cycle of the working medium in the liquid-cooled heat dissipating device 100, the heat energy absorbed by the working medium is guided by the first heat dissipating fins 131 of the first water-cooled bank 130 and the second heat dissipating fins 141 of the second water-cooled bank 140 to be discharged outside the liquid-cooled heat dissipating device 100, and meanwhile, the heat energy absorbed by the working medium is taken away by the cold airflow CAF to form the hot airflow HAF to be discharged outside the liquid-cooled heat dissipating device 100.

Please refer to fig. 8. Fig. 8 is a schematic cross-sectional view illustrating a liquid-cooled heat dissipating device 100 according to still another embodiment of the present invention. In the present embodiment, according to practical situations, the power module 150 communicates with the water-cooled head module 110, the first connecting pipe 152 communicates with the second chamber C2, the second connecting pipe 153 communicates with the third chamber C3, the fourth chamber C4 and the fifth chamber C5 of the water tank module 120 communicate with each other, and the sixth chamber C6 and the seventh chamber C7 of the water tank module 120 communicate with each other. In addition, the first partition 1142 of the partition structure 114 of the water-cooling head module 110 is retracted toward the third partition 1144, so that the first conduit 1321 of the first water-cooling row 130 is communicated between the first chamber C1 and the fourth chamber C4, the second conduit 1322 is communicated between the first chamber C1 and the fourth chamber C4, and the third conduit 1323 is communicated between the second chamber C2 and the fifth chamber C5, that is, in the present embodiment, the second chamber C2 is only communicated with the third conduit 1323, and the first chamber C1 is simultaneously communicated with the first conduit 1321, the second conduit 1322 and the sixth conduit 1423.

In the present embodiment, when the liquid-cooled heat sink 100 operates, the heat source 200 abuts against the heat absorbing surface 111 of the heat conducting unit 115, and the thermal energy of the heat source 200 is transferred to the working medium inside the water-cooled head module 110 through the heat absorbing surface 111. The flow path of the working medium in the liquid-cooled heat dissipation device 100 is shown in fig. 8 as the flow direction R. Under the action of the power module 150, the working medium in the water cooling head module 110 flows from the first chamber C1 into the fourth chamber C4 of the water tank module 120 through the first pipeline 1321 and the second pipeline 1322 of the first water cooling bank 130 at the same time; the working medium in the fourth chamber C4 flows into the fifth chamber C5 of the water tank module 120, and then flows into the second chamber C2 of the water-cooled head module 110 through the third conduit 1323 of the first water-cooled row 130; the working medium in the second chamber C2 flows into the pump 151 (see fig. 3) through the first connection pipe 152 of the power module 150; the working medium is pressurized by the pump 151 and then flows into the third chamber C3 of the water-cooling head module 110 through the second connection pipe 153 of the power module 150 (the flow of the working medium from the first connection pipe 152 to the second connection pipe 153 is shown by a dotted line). At this time, the heat energy absorbed by the working medium is guided by the first heat dissipation fins 131 of the first water cooling bank 130 to be discharged outside the liquid cooling heat dissipation device 100, and meanwhile, the heat energy absorbed by the working medium is taken away by the cold airflow CAF to form a hot airflow HAF to be discharged outside the liquid cooling heat dissipation device 100.

Furthermore, the working medium in the third chamber C3 flows into the sixth chamber C6 and the seventh chamber C7 of the water tank module 120 through the fourth pipe 1421 and the fifth pipe 1422 of the second water-cooled row 140 at the same time; since the sixth chamber C6 and the seventh chamber C7 communicate with each other, the working medium flows into the first chamber C1 of the water-cooled head module 110 through the sixth pipe 1423 of the second water-cooled bank 140 after confluent in the seventh chamber C7. The working medium in the first chamber C1 is guided by the flow guiding block 1121 to accelerate the flow of the working medium through the heat conducting structure 1152 of the heat conducting unit 115, thereby absorbing the heat energy guided by the heat conducting unit 115 from the heat source 200. Through the above-mentioned cycle of the working medium in the liquid-cooled heat dissipating device 100, the heat energy absorbed by the working medium is guided by the first heat dissipating fins 131 of the first water-cooled bank 130 and the second heat dissipating fins 141 of the second water-cooled bank 140 to be discharged outside the liquid-cooled heat dissipating device 100, and meanwhile, the heat energy absorbed by the working medium is taken away by the cold airflow CAF to form the hot airflow HAF to be discharged outside the liquid-cooled heat dissipating device 100.

To sum up, the utility model discloses the disclosed technical scheme of above-mentioned embodiment has following advantage at least:

Claims

1. A liquid-cooled heat dissipation device, comprising:

a water-cooled head module, comprising:

a base;

the second sub-top plate, the third sub-top plate, the spacing structure and the base define a first chamber therebetween, a second chamber and a third chamber are defined therebetween, and the first chamber, the second chamber and the third chamber are isolated from each other; and

a water tank module;

2. The liquid-cooled heat sink as claimed in claim 1, wherein the partition structure comprises a partition plate, a first partition, a second partition and a third partition, the first partition, the second partition and the third partition are respectively connected to the partition plate and configured to abut against the top plate, the first partition and the second partition define the second chamber therebetween, and the second partition and the third partition define the third chamber therebetween.

3. The liquid-cooled heat sink as claimed in claim 2, wherein the first sub-top plate has a plurality of first through holes, a plurality of second through holes, a plurality of third through holes, and a plurality of fourth through holes, the second spacer is located between the second through hole and the third through hole, the second through hole is located between the first through hole and the second spacer, the third through hole is located between the fourth through hole and the second spacer, the second sub-top plate has a plurality of fifth through holes, the first through holes are located between the fifth through holes and the second through holes, the third sub-ceiling has a plurality of sixth perforations, the fourth perforations being located between the sixth perforations and the third perforations, the spacing structure is located between the fifth through hole and the sixth through hole, and the fifth through hole and the sixth through hole are respectively communicated with the first chamber.

4. The liquid-cooled heat sink of claim 3, wherein the tank module comprises:

5. The liquid-cooled heat sink as claimed in claim 4, wherein the base plate has a first opening and a second opening, the first opening communicates with the fifth chamber, the second opening communicates with the sixth chamber, the power module comprises:

and the pump is communicated with the first opening and the second opening so as to pressurize the working medium.

6. The liquid-cooled heat sink according to claim 4, wherein the first and second rows are arranged in a first direction, the first row comprises a plurality of first fins, a plurality of first tubes, a plurality of second tubes and a plurality of third tubes, the second tubes are located between the first and third tubes in the first direction, the first, second and third tubes are separated from each other and arranged at least partially in a second direction, the second direction is substantially perpendicular to the first direction, the first tubes are connected between the fifth and seventh through holes, the second tubes are connected between the first and eighth through holes, the third tubes are connected between the second and ninth through holes, the first fins are separated from each other in the third direction and distributed in the first and second directions, The third direction is perpendicular to the first direction and the second direction, and the first pipe, the second pipe and the third pipe are configured to allow the working medium to flow therethrough.

7. The liquid cooled heat sink of claim 6, wherein the number of first conduits is greater than the number of second conduits.

8. The liquid-cooled heat sink according to claim 6, wherein the second water-cooled bank includes a plurality of second heat fins, a plurality of fourth pipes, a plurality of fifth pipes and a plurality of sixth pipes, the fifth pipes are located between the fourth pipes and the sixth pipes in the first direction, the fourth pipes, the fifth pipes and the sixth pipes are respectively spaced apart from each other and are at least partially arranged along the second direction, the fourth pipes are connected between the third through holes and the tenth through holes, the fifth pipes are connected between the fourth through holes and the eleventh through holes, the sixth pipes are connected between the sixth through holes and the twelfth through holes, the second heat fins are spaced apart from each other in the third direction and are distributed among the fourth pipes, the fifth pipes and the sixth pipes along the second direction, the fourth, fifth and sixth conduits are configured to circulate the working medium therethrough.

9. The liquid cooled heat sink of claim 8, wherein the number of sixth conduits is greater than the number of fifth conduits.

10. The liquid-cooled heat sink of claim 1, wherein the first water-cooled bank and the second water-cooled bank define a pressure relief space therebetween.

11. The liquid-cooled heat sink of claim 10, further comprising:

and the two side cover bodies are respectively connected with one sides of the water cooling head module and the water tank module so as to cover the pressure relief space, and the pressure relief space is positioned between the side cover bodies.

12. The liquid-cooled heat dissipating device according to claim 11, wherein the first water-cooled row and the second water-cooled row are arranged along a first direction, each of the side covers comprises a main cover, two tapered sections and two sub-covers, the main cover is connected between the tapered sections along the first direction, each of the tapered sections is connected between the main cover and the corresponding sub-cover, a first distance is defined between the main covers, and a second distance is defined between each of the sub-covers and the corresponding sub-cover, and the second distance is greater than the first distance.

13. The liquid-cooled heat sink of claim 12, wherein the first water-cooled bank further comprises:

and the positions of the third radiating fins correspond to the sub-cover body.

14. The liquid-cooled heat sink of claim 12, wherein the second water-cooled bank further comprises:

and the positions of the fourth heat dissipation fins correspond to the positions of the sub-cover bodies.

15. The liquid-cooled heat sink of claim 1, wherein the power module is located between the first water-cooled bank and the second water-cooled bank, and the power module is in communication with the water tank module or the water head module.

16. The liquid-cooled heat dissipating device of claim 1, wherein the heat conducting unit comprises:

a heat conducting plate connected to the base and having a heat absorbing surface facing away from the water tank module and configured to abut the heat source; and

a heat conducting structure located in the first chamber and connected to the heat conducting plate.