201021167 六、發明說明： 【先前技術】 ❹ 電子裂置朝向更小型尺寸演進，特別是半導體製造㈣ 更小設計製程，已使得現代半導體之功率密度增加為較先 月"史計之半導體之功率密度高出數個等級。一些單位面積 功率密度的增加係藉由電源電麼之減小及同時發生的工作 電流之減小而抵消。然而，現代半導體之操作頻率遠高於 先前技術，這抵消了源於電壓較低而獲得之節電（量）。功 率密度等於單位面積熱消散；因此，朝著小型、高速之積 體電路（κ:雜展之趨勢導致熱負荷更高，且從廣義而言， 冷卻解決方案所面臨的挑戰更大。 參 對於任何冷卻裝置而言，理想的情形是維持整個表面上 溫度分佈均勻。均勻之溫度分佈亦稱為等溫性，且達成此 目標的唯-途徑是將熱自熱源儘可能快速並高效地轉移到 該冷部器之任何其他部分。較之藉由任何固態材料進行之 被動熱傳遞，主動傳遞之熱傳遞效率更高。一廣泛認可之 實例為内燃機之液體冷卻系統中之熱量係經由水吸收，而 水則自該引擎被抽出至一遠端散熱器，於此該熱量隨後被 釋放至環境中。對於電子裝置，液體冷卻業已用於特殊設 計中’但其在主流消費裝置中，一直未被廣泛接受。缺乏 廣泛接受之主要因素尤其包括’(液體)濺出之固有風險、 泵浦之壽命、總成本、安裝（包括配管之路徑選擇及或多 或少之大型散熱器之構形）之複雜性。 任何冷卻系統之效率不會高出負責除去來自該熱源之熱 138276.doc -4- 201021167201021167 VI. Description of the invention: [Prior Art] ❹ E-cracking towards smaller size, especially semiconductor manufacturing (4) Smaller design process, has increased the power density of modern semiconductors to the power density of semiconductors A few levels higher. Some of the increase in power density per unit area is offset by a reduction in power supply and a reduction in the operating current that occurs simultaneously. However, the operating frequency of modern semiconductors is much higher than that of the prior art, which offsets the power savings (quantity) obtained from lower voltages. The power density is equal to the heat dissipation per unit area; therefore, towards a small, high-speed integrated circuit (κ: the trend of hybridization leads to higher thermal loads, and in a broad sense, the cooling solution faces greater challenges. For any cooling device, it is desirable to maintain a uniform temperature distribution across the surface. A uniform temperature distribution is also referred to as isothermal, and the only way to achieve this is to transfer the thermal self-heating source as quickly and efficiently as possible to Any other part of the cold pack, the heat transfer efficiency of the active transfer is higher than the passive heat transfer by any solid material. A widely recognized example is that the heat in the liquid cooling system of the internal combustion engine is absorbed by water, The water is drawn from the engine to a remote radiator where the heat is subsequently released into the environment. For electronic devices, liquid cooling has been used in special designs' but it has not been used in mainstream consumer devices. Widely accepted. The main factors lacking widespread acceptance include, inter alia, the inherent risks of (liquid) spills, pump life, total cost, installation ( Path comprising pipe and the selection of more or less of the large radiator configuration) complexity of any higher efficiency of the cooling system is not responsible for the removal of heat from the heat sources 138276.doc -4- 201021167
能之主要介面之效率。對於電子產品，似乎將該半導體直 接浸入該冷卻劑中時可獲得最大效率。然而鑒於實用之 目的，在消費性裝置領域，由於上述之該等原』：該方法 不可為-解決方案。-更為可行之解決方案必須包含—獨 立的、密閉之系統。另-方面’冑閉系統係依賴介於該半 導體晶粒與該冷卻劑間之熱介面之效率。關於此特定/區 域，人們已提出基於由銅或銀製造之水冷頭之諸多不同之 方案。然而，即便是銅或銀，其導熱性相對上仍低於碳結 構’例如金剛石。另-方面，將金剛石用於主流之冷卻裝 置’不僅太過昂貴’且將其加卫成—合適之形狀亦近乎不' 可能。人們已討論過將碳奈米f (CNT)及碳m维⑽〇 作為可行之導熱體，但是當下，獲得純淨之cnt結構費用 高昂，仍令人望之卻步。_解碳是一種極佳之導熱材料， 其為一種類似石墨之碳材料，但是其在個別石墨片之間另 之間具有額外交聯 其可用以增加來自 具有共價鍵。該特定結合配置（石墨片 之形式）導致獨特的熱傳遞分布特點， 任何熱源之淨熱傳遞。 以碳為主之介面 田剛用以將熱量自電子組件傳遞出之方法中應用到多種 材料，主要以銅或鋁為主作為該主要介面。以碳為主之解 決方案已躲實驗性設計但尚未獲得廣泛認可。碳材料未 獲得廣泛認可之原因是其缺乏三維的熱傳遞，導致由該石 墨片雖可進行良好的（熱）層狀傳導但是（熱）幾乎完全無法 消散至環境中。因&，在以石墨為主之冷卻器之後端之表 138276.doc •5· 201021167 面面積大致與前端之表面面積大小一樣十每片之橫截 面在促進熱向環境W散方面不具任何優點。以碳為主之 解決方案的另-不足之處在於，其熱容量或緩衝能力非常 低，會造成不利的副作用’例如該碳介面之後端之任何液 體冷卻媒體會發生暫時、局部的彿騰。 膨脹儲液器 使用電子組件之大多數液體冷却系統係依靠一遠端儲液 器、-系浦及連接在該等個別組件間之或多或少之複雜管 路。該儲液器亦用以補償該冷卻劑之溫度依存性膨服，以 防止壓力堆積，其可能會最終破壞該系統之密封。膨脹儲 液器通常相當簡單，在一些密閉系統中，該穩壓室只是未 被完全填充，而是含有氣泡，其在液體冷卻劑溫度升高且 發生聯動熱膨脹之情形下被壓縮u，㈣統中存在之 空氣會導致冷卻效果崩潰。在一獨立式小型冷卻系統中， 部分填充亦可造成同樣的不利影響，另一方面，壓力改變 可造成機械應力’應僮可能加以避免。 具有熱交換器之以碳為主之水冷頭 在先前專利申請案（Robins〇n，2〇〇7)中已有揭示經加工 以包含微通道、具有-氣密、獨立的液體冷卻系統之碳介 面之組合。然而，所描述之發明未解決該冷卻系統之該流 體後端上之溫度快速瞬變現象之緩衝問題，亦未解決該密 閉系統中壓力補償之問題。現有冷却器之上述缺陷更深化 了使用高功率密度電子組件之使用者對更先進之解決方案 之需要。 138276.doc -6- 201021167 【發明内容】 本文揭示一種冷卻裝置，其利用熱解碳之熱傳遞特點， 加強自一半導體除去熱之效果。沿著該等片之X及γ軸之 高導熱性可用以至少在一個維度内膨脹朝向該熱源之初始 接觸區域（吸熱區域卜即，解理面一般係定位成相對該晶 片介面表面正交定向，而最佳導熱性却是發現於該等片中 任何平行於該解理面之方向上。此定向使得對於取決於該 碳介面塊厚度之熱能會膨脹該「釋放」之介面表面區域。 由於該釋放之表面上之額外熱慣性，一導熱材料層被結合 至該碳塊，其亦見容於將任何表面增加結構（諸如微觀通 道或宏觀通道）加工入該金屬層中之標準過程。該金屬層 自身係作為在其表面之間抽運之液體冷卻劑之一介面。之 後可將該冷卻劑導入一被熱連接至一冷卻散熱片陣列之一 管系統中。一泵浦抽運該流體，使其流經該通道及管道系 統。該整個系統可為氣密的，且一般包含一膜片，以允許 當溫度升高時，流體發生膨脹。在一實施例中，一松鼠籠 式類型之扇可扇動空氣，吹過該散熱片陣列以吸收熱且將 之消散至環境中。由於該冷卻器效率高，故可對於該主冷 卻器添加額外的冷卻塊，此等衛星式冷卻器因此可被通至 該冷卻劑且用以進行額外組件（諸如晶片組、穩壓器、電 源電晶體或甚至離散圖形處理器）之熱管理。 用途 簡§之，本文所揭示之較佳配置之優點可總結如下： a)藉由該碳介面，可自該熱源吸收之熱最多。 138276.doc 201021167 b) 較之使用熱解碳吸收熱量，該熱消散區域發生膨 服。 c) 碳與金屬結合增加了該介面之熱慣性，防止該冷 卻侧上產生局部熱點。 d) 液體冷卻劑可將熱量自該熱源充分消除。 e) 膨脹膜片可適應該冷卻劑之熱膨脹，不會造成該 系統中壓力變化或空氣進入。 f) 獨立式冷卻系統好用且易於安裝。 g) 該主冷却器效率高，使得可接通衛星式冷卻塊， 用於額外組件之熱管理。 初步說明 >本發明提供一效率極高之獨立式冷卻系、统。該獨立式、 氣密構形確保其安裝簡易，且該冷卻系統永久無需維護。 冷卻性能之高效性係得益於諸多特徵，每個特徵自身便極 具重要性，且經組合可才目互增效以將熱量自冑功率密度裝 置中除去並以一高速率將其消散至環境中。 對該熱量之初步吸收係藉由—碳介面來達成。熱解礙沿 著平行於該等石墨片之該（該等）解理面之χ&γ方向上之導 熱性為約1400 W/m/C。由於熱傳導係發生在兩個維度内而 非不定向’此情況可用於以一幾乎無損耗之方式使該介面 區域膨脹，這亦減小了該碳塊之該背面上之功率密度。該 熱解碳介面係經定向成以該（該等）解理面大體上正交於該 碳塊之該等正面及背面。該背面相較於該正面之膨服（程 度）係取決於所採用之碳塊之厚度’且比率一般為Η或更 138276.doc 201021167 熱解碳之熱容量或緩衝能力極低，因而，在該塊令傳播 之熱量瞬變極快，無大量衰減。在流體冷卻情形丁，這可 能導致該冷卻劑沸騰或熱量不足以消散至該冷卻劑中，且 任一種情形均會導致該熱源上發生瞬變溫度尖峰。為避免 發生此等熱瞬變，有利的做法是將一緩衝器以例如銅或鋁 的形式添加至該碳塊之背面，進而形成一混合介面塊。熱 容量增加’則可導致該混合塊產生熱慣性，其大大降低了 該熱源處之熱起伏。此外，加工銅或鋁極為容易，以散熱 片或釘狀物之形式添加表面增設物，其等促進熱向該冷卻 劑傳遞。 所揭示之冷卻裝置通常為一單一獨立式結構，其被安裝 於一標準處理器，其實例為當前由超微設備公司（AMD)或 英代爾公司製造的中央處理單元，或由AMD或nVidia(恩 威迪雅）製造的其他圖形處理器。此等處理器每種設計下 • 均具有軚準女裝支架，以便原裝及後期的市場冷卻裝置成 為可互換設備。在大多情況下，所接合的是一爽子，或者 通常亦使用木釘或螺釘。通常，一背板用以強化該印刷電 路板，以防止該板在系統運輸且可能遭受碰撞或撞擊之情 況下，因該冷卻器之重量而發生彎曲。 由於該冷卻器之獨立式、氣密的性質，故其需適應若該 處理器發出熱時該冷卻劑發生之熱膨脹。欲達成該目的， 可使用各種不同的設計’例如可採用—具備不常見優點之 可撓性膨脹儲液器。此類型之儲液器之-變體爲-凹面膜 138276.doc 201021167 片，依據該系統中之冷卻劑之麼力，其可向内或向外翻 轉。此一可撓性膜片易於製造且實施於任何冷卻劍容器之 *本文所揭不之冷卻器功率極高絲決於其大小這意味 著增加散熱器之數量，則將增加可消散至環境令之執量。 這允許將該冷卻裝置延展至該中央處理器之外，且使用被 /〜同；^部循n统之衛星式附件，以對該穩廢器 模組、該晶片組及潛在的離散製圖進行熱管理。除了該等 衛星ί者之外’上述组件無—需要任何其他冷卻裝置。 田引所使用之冷却器大多採用的是軸流式風扇，主要因 其效率高且成本低。然而，較之具有相同較值之離心風 扇（亦稱為籠型風扇），轴流式風扇__般噪音較大。當該冷 置在附近之情形下，所提供之該離心風扇之另一優點 疋背麼很小且空氣係無定向地穿過該等冷卻散熱片。該離 傾扇與圍繞其周圍之—散熱器組合，可在極高程度之空 氣流動下超靜音地運行。 亦可提供遠端散熱器裝置。 【實施方式】 ，參見圖1所示之較佳冷卻裝置，其包含-殼體10,其 界疋第-及第二橫向延伸之液體冷卻劑流動腔室η及U， 其等係、由-中央通道13流動連通。此通道可由—栗浦η 形成，泵浦14係位於該殼體中且將流體自腔室以自中央抽 運至腔至11，即如箭頭15所示。該液體被導向一層17之不 規則頂表面16以除去熱或將熱自該表面傳遞至在殼體中之 138276.doc 201021167 通道18及19中於相反方向流動之冷卻劑中。在一高度小型 構型中，該冷卻劑自該等通道經由管道2〇及2 1流動至由40 大體指出之機構，諸如散熱片41 ’其等運作以將熱自該冷 卻劑中除去’並經由管道42及43使冷卻劑回流至上腔室12 中。 腔室12之上壁22包括一膜片，其係於23處環繞地安裝至 該殼體環形物10a，以允許該膜片回應於冷卻劑流體膨脹 而向上彎曲。一殼體蓋板23’在該膜片上延伸且係附接至該 殼體表面24’藉此該等腔室1丨及12以及該膜片成為氣密 狀。 一電氣組件124接合於熱解碳塊25之該下側25a，熱解碳 塊25係環繞地安裝於由殼體壁26形成之該有界空間中，層 17亦環繞地安裝於該空間中。由塊25接收之熱係經由自電 氣組件之傳導而傳遞至該層17，層17包括一金屬介面塊 (介於水與碳塊25之間其上表面是不規則的，例如層中 具有凹部28，這增加了該表面區域與該腔室12内之冷卻劑 之接觸面積，進而加強熱傳遞。該塊25及該層17之結構及 功此防止該冷卻劑（例如水）發生彿騰。 表不塊25中之分子解理面之該等面3〇，係指向層17，以 使熱傳遞操作效率最高。所示之一離心風扇32係位於散熱 片41之群鎮41a之間的空間33内’以將冷卻空氣徑向地排 放至該等散熱片之間的通道41b中，從而將熱自該等散熱 片除去。 熱解碳是一種類似石墨之材料，但是熱解碳在其石墨片 138276.doc 201021167 之間具有一些共價鍵》—般是將一碳氫化合物加熱接近其 分解溫度’並使該石墨結晶（高溫分解），而製得該熱解 碳。 圖5顯示流體管道5 0及51，其等使得冷卻劑在12與冷卻 器54上之一晶片之間來回循環流動；及管道55及56，其等 使得冷卻劑在22與一穩壓器冷卻器57之間來回循環流動。 圖6包含板片23及位於該板片下方之圖1中之所有結構。 一蓋子70係位於板片23之上方且包含連接腔室12與一軟管 或管道71之通道’及具有一軟管或導管72之通道18及19。 軟管或管道71及72延伸至一散熱器73 ^風扇32及散熱片41 被省略，且其他裝置被簡化。 圖7類似圖6 ’只是該散熱器係較遠地定位，其係由該等 軟管或管道71及72中之斷裂71&及72&所表示。 可提供冷卻風扇74將空氣經由該散熱器排放出去。 在圖8中，該等元件之配置係與圖丨中之配置大體相似， 相同數字代表相同的元件。 在圖8中，該流體自空間12向下流經中央開口 8〇且之後 由於該泵浦14之操作，於81處圍繞泵浦結構Ua分支向下 流動。該流體之後向下穿過該中央開口 13,以接觸金屬介 面/水冷頭17。如圖丨所描繪，該流體之後在18及19中橫向 通過。碳塊25直接在下方延伸且與塊口面-面接觸。電氣 組件124接合於塊25之下側面，以將熱向該處傳遞。塊17 係以-層之形式，其主要由選自包含紹、銅、銀及金之群 組之材料組成。碳塊25具有朝層17延伸之分子解理面。圖 138276.doc -12- 201021167 8之裝置係較佳的。 額外的小型配置之元件包含： -一包封物1 〇 A ’其圍繞該泵浦延伸且形成通道丨3，泵 浦14將冷卻劑流體經由通道13向塊17之該不規則上表面輸 送且與之接觸， -散熱器散熱片41A及41G，散熱片間之空間41B及熱交 換器40， -熱水（冷卻劑）管42及43， -離心風扇32，其在該等散熱片之内端33之間之一空間 内旋轉， -外殼體10，其圍繞該泵浦延伸且支撐殼體蓋23，該蓋 子上设有冷卻劑通道20及21且與形成於1 〇與丨〇A間之通道 1 8及19連通， -膜片22，其覆於開口 80之上，且位於該風扇32之下， 該膜片係由該蓋23所承載。 【圖式簡單說明】 圖1顯示該整合之液體冷卻器之一示意圖，該冷卻器包 含該碳介面，其上覆蓋有金屬，以提高熱慣性；一泵浦； 具有散熱器散熱片之水管；一離心風扇及進行熱膨脹補償 之膜片； 圖2係一傾斜的俯視圖’其用於例示與該等散熱器散熱 片及水管比較之該風扇配置； 圖3顯示一傾斜的底視圖，其用於例示該碳塊介面； 圖4顯示一熱膨脹補償膜片之一動作之一功能性例示； 138276.doc -13- 201021167 圖5示意性顯示用以對例如連接至該主冷卻器之晶片組 及穩壓器以進行熱管理之額外的衛星式冷卻劑； 圖6顯示另一散熱器及液體冷卻器構形； 圖7類似圖6，但顯示的為一較遠之散熱器；及 圖8係一類似圖1之視圖，其顯示一修飾案。 【主要元件符號說明】 10 殼體 10a 殼體環形物. 10A 包封物 11 ' 12 液體冷卻劑流動腔室 13 中央通道 14 泵浦 14a 泵浦結構 15 箭頭 16 頂面 17 層 18 ' 19 通道 20 > 21 管道 22 膜片 23 板片 23， 蓋板 24 殼體表面 25 熱解碳 25a 下側 138276.doc -14· 201021167The efficiency of the main interface. For electronic products, it appears that the semiconductor is directly immersed in the coolant for maximum efficiency. However, in view of the practical purpose, in the field of consumer devices, due to the above-mentioned original: the method cannot be a solution. - A more viable solution must include an independent, closed system. Another aspect is that the system is dependent on the efficiency of the thermal interface between the semiconductor die and the coolant. Regarding this specific/region, many different solutions based on water-cooled heads made of copper or silver have been proposed. However, even copper or silver, its thermal conductivity is relatively lower than that of a carbon structure such as diamond. On the other hand, the use of diamond for the mainstream cooling device is not only too expensive and it is added to it - a suitable shape is almost impossible. Carbon nano-f (CNT) and carbon m-dimensional (10) 〇 have been discussed as viable thermal conductors, but at present, the cost of obtaining a pure cnt structure is high, which is still prohibitive. _ Carbon dissolving is an excellent thermal conductive material which is a graphite-like carbon material, but with additional cross-linking between individual graphite flakes which can be used to increase the covalent bond. This particular combination configuration (in the form of a graphite sheet) results in a unique heat transfer distribution characteristic, the net heat transfer of any heat source. Carbon-based interface Tian Gang applies a variety of materials to the method of transferring heat from electronic components, mainly copper or aluminum as the main interface. Carbon-based solutions have been experimentally designed but have not yet gained wide acceptance. The reason why carbon materials are not widely recognized is that they lack three-dimensional heat transfer, resulting in good (thermal) lamellar conduction from the graphite sheet, but (heat) is almost completely unable to dissipate into the environment. Because &, at the end of the graphite-based cooler 138276.doc •5· 201021167 The surface area is roughly the same as the surface area of the front end. The cross section of each piece does not have any advantage in promoting heat to the environment. . Another disadvantage of carbon-based solutions is that their heat capacity or buffering capacity is very low, which can cause adverse side effects. For example, any liquid cooling medium at the rear end of the carbon interface will have a temporary, partial Fo Teng. Expansion Reservoirs Most liquid cooling systems that use electronic components rely on a remote reservoir, a system, and more or less complex piping connected between these individual components. The reservoir is also used to compensate for the temperature dependence of the coolant to prevent pressure build-up which may eventually damage the seal of the system. Expansion reservoirs are usually quite simple. In some closed systems, the plenum is simply not completely filled, but contains bubbles that are compressed in the event of elevated liquid coolant temperature and associated thermal expansion. The air present in it can cause the cooling effect to collapse. In a small independent cooling system, partial filling can also cause the same adverse effects. On the other hand, pressure changes can cause mechanical stresses to be avoided. A carbon-based water-cooled head with a heat exchanger has been disclosed in the prior patent application (Robins〇n, 2, 7) for processing a carbon-containing, gas-tight, independent liquid cooling system. A combination of interfaces. However, the described invention does not address the buffering of temperature transients on the back end of the fluid of the cooling system, nor does it address the problem of pressure compensation in the closed system. The aforementioned drawbacks of existing chillers deepen the need for more advanced solutions for users of high power density electronic components. 138276.doc -6-201021167 SUMMARY OF THE INVENTION [0005] Disclosed herein is a cooling device that utilizes the heat transfer characteristics of pyrolytic carbon to enhance the effect of removing heat from a semiconductor. The high thermal conductivity along the X and gamma axes of the sheets can be expanded toward the initial contact area of the heat source in at least one dimension (the endothermic region, i.e., the cleave plane is generally oriented orthogonally to the wafer interface surface). And the optimum thermal conductivity is found in any direction parallel to the cleavage plane in the sheet. This orientation causes the "release" interface surface area to expand for thermal energy depending on the thickness of the carbon interface block. The additional thermal inertia on the surface of the release, a layer of thermally conductive material is bonded to the carbon block, which is also seen in the standard process of machining any surface-increasing structure, such as a microchannel or macroscopic channel, into the metal layer. The metal layer itself acts as an interface for the liquid coolant pumped between its surfaces. The coolant can then be introduced into a tube system that is thermally coupled to a cooling fin array. A pump pumps the fluid. Passing through the channel and piping system. The entire system can be airtight and typically includes a diaphragm to allow fluid to expand as temperature increases. In an embodiment A squirrel cage type fan can fan the air, blowing through the array of fins to absorb heat and dissipate it into the environment. Because of the high efficiency of the cooler, additional cooling blocks can be added to the main cooler. These satellite chillers can therefore be passed to the coolant and used to perform thermal management of additional components such as wafer sets, voltage regulators, power supply transistors or even discrete graphics processors. The advantages of the preferred configuration disclosed can be summarized as follows: a) By the carbon interface, the heat absorbed from the heat source is the most. 138276.doc 201021167 b) The heat dissipation zone is inflated compared to the heat absorbed by the pyrolytic carbon. c) The combination of carbon and metal increases the thermal inertia of the interface and prevents localized hot spots on the cooling side. d) Liquid coolant removes heat from the heat source. e) The expansion diaphragm can accommodate the thermal expansion of the coolant without causing pressure changes or air ingress in the system. f) The stand-alone cooling system is easy to use and easy to install. g) The main cooler is highly efficient, allowing the satellite cooling block to be switched on for thermal management of additional components. Preliminary Description > The present invention provides an extremely efficient independent cooling system. This freestanding, airtight configuration ensures easy installation and the cooling system is permanently maintenance free. The efficiency of cooling performance benefits from a number of features, each of which is inherently important and can be combined to enhance heat removal from the power density device and dissipate it at a high rate to Environment. The initial absorption of this heat is achieved by a carbon interface. The thermal decomposition is about 1400 W/m/C in the χ& γ direction along the (the) cleavage plane parallel to the graphite sheets. Since the thermal conduction occurs in two dimensions rather than being oriented', this can be used to expand the interface region in a nearly lossless manner, which also reduces the power density on the back side of the carbon block. The pyrolytic carbon interface is oriented such that the (the) cleavage planes are substantially orthogonal to the front and back sides of the carbon block. The extent of the back side compared to the front side depends on the thickness of the carbon block used and the ratio is generally Η or 138276.doc 201021167 The heat capacity or buffer capacity of the pyrolytic carbon is extremely low, thus, The block causes the heat transients of the propagation to be extremely fast without substantial attenuation. In the case of fluid cooling, this may cause the coolant to boil or not heat enough to dissipate into the coolant, and in either case, a transient temperature spike may occur on the heat source. To avoid such thermal transients, it is advantageous to add a buffer to the back side of the carbon block in the form of, for example, copper or aluminum to form a hybrid interface block. The increase in heat capacity' can result in thermal inertia of the hybrid block, which greatly reduces thermal fluctuations at the heat source. In addition, it is extremely easy to process copper or aluminum, adding surface additions in the form of fins or spikes that promote heat transfer to the coolant. The disclosed cooling device is typically a single stand-alone structure that is mounted to a standard processor, an example of which is a central processing unit currently manufactured by AMD or Intel Corporation, or by AMD or nVidia. Other graphics processors manufactured by Envidia. Each of these processors has a female dressing bracket for each of the original and later market cooling units to be interchangeable. In most cases, it is a sink, or usually a dowel or screw is used. Typically, a backing plate is used to reinforce the printed circuit board to prevent it from bending due to the weight of the cooler when the system is transported and may be subject to impact or impact. Due to the free-standing, airtight nature of the cooler, it is desirable to accommodate the thermal expansion of the coolant if the processor emits heat. To achieve this, a variety of different designs can be used, e.g., a flexible expandable reservoir with uncommon advantages. A variant of this type of reservoir is a concave film 138276.doc 201021167 piece, which can be turned inward or outward depending on the force of the coolant in the system. This flexible diaphragm is easy to manufacture and is implemented in any cooling sword container. * The cooler power that is not disclosed herein is extremely high depending on its size. This means that increasing the number of heat sinks will increase the dissipation to the environment. Handling. This allows the cooling device to be extended beyond the central processor, and the satellite attachments of the system are used to perform the stabilization module, the chipset and the potential discrete graphics. Thermal management. Except for these satellites, the above components are not required - any other cooling device is required. Most of the coolers used by Tian cited are axial flow fans, mainly because of their high efficiency and low cost. However, axial fans are more noisy than centrifugal fans with the same value (also known as cage fans). Another advantage of the centrifugal fan provided when the chill is in the vicinity is that the backing is small and the air is directed through the cooling fins without orientation. The tilting fan is combined with a heat sink around it to operate ultra-quietly under extremely high airflow. A remote radiator unit is also available. [Embodiment] Referring to the preferred cooling device shown in Fig. 1, comprising a housing 10 having a liquid-coolant flow chambers η and U extending from the first and second laterally extending lines, The central passage 13 is in flow communication. This channel may be formed by a Lipu η in which the pump 14 is located and pumping fluid from the chamber to the chamber to the end 11 as indicated by arrow 15. The liquid is directed to the irregular top surface 16 of the layer 17 to remove heat or transfer heat from the surface to the coolant flowing in the opposite direction in the channels 138276.doc 201021167 in the housing. In a highly compact configuration, the coolant flows from the channels through conduits 2 and 21 to a mechanism generally indicated by 40, such as heat sink 41' which operates to remove heat from the coolant' and The coolant is returned to the upper chamber 12 via conduits 42 and 43. The upper wall 22 of the chamber 12 includes a diaphragm that is circumferentially mounted to the housing annulus 10a at 23 to allow the diaphragm to flex upwardly in response to expansion of the coolant fluid. A housing cover 23' extends over the diaphragm and is attached to the housing surface 24' whereby the chambers 1 and 12 and the diaphragm are airtight. An electrical component 124 is bonded to the lower side 25a of the pyrolytic carbon block 25, and the pyrolytic carbon block 25 is circumferentially mounted in the bounded space formed by the housing wall 26, and the layer 17 is also circumferentially mounted in the space. . The heat received by block 25 is transferred to the layer 17 via conduction from the electrical component, and layer 17 includes a metal interface block (between water and carbon block 25, the upper surface thereof is irregular, such as having a recess in the layer 28. This increases the area of contact of the surface area with the coolant in the chamber 12, thereby enhancing heat transfer. The structure of the block 25 and the layer 17 prevents the coolant (e.g., water) from occurring. The faces 3 of the molecular cleavage planes in the block 25 are directed to the layer 17 to maximize heat transfer operation. One of the centrifugal fans 32 shown is located between the towns 41a of the fins 41. 33 is 'discharged radially into the passage 41b between the fins to remove heat from the fins. Pyrolytic carbon is a graphite-like material, but pyrolytic carbon is in its graphite The film 138276.doc 201021167 has some covalent bonds "generally heating a hydrocarbon close to its decomposition temperature' and crystallizing the graphite (pyrolysis) to produce the pyrolytic carbon. Figure 5 shows the fluid pipeline 5 0 and 51, which make the coolant at 12 Circulating flow between one of the wafers on the device 54; and conduits 55 and 56, such that the coolant circulates back and forth between 22 and a regulator cooler 57. Figure 6 includes a plate 23 and is located on the plate All of the structures in Figure 1 below the sheet. A cover 70 is located above the sheet 23 and includes a passageway connecting the chamber 12 to a hose or conduit 71 and passages 18 and 19 having a hose or conduit 72. The hoses or pipes 71 and 72 extend to a radiator 73. The fan 32 and the fins 41 are omitted, and other devices are simplified. Fig. 7 is similar to Fig. 6 'only the radiator is positioned farther away, which is caused by the soft The breaks 71& and 72& in the tubes or conduits 71 and 72 are shown. A cooling fan 74 can be provided to vent air through the heat sink. In Figure 8, the configuration of the components is substantially similar to the configuration in the drawings. The same numerals represent the same elements. In Figure 8, the fluid flows downwardly from the space 12 through the central opening 8 and then flows downwardly around the pump structure Ua at 81 due to the operation of the pump 14. Then pass down through the central opening 13 to contact The interface/water-cooling head 17. As depicted in Figure ,, the fluid then passes laterally through 18 and 19. The carbon block 25 extends directly below and is in face-to-face contact with the block. The electrical component 124 is joined to the underside of the block 25. To transfer heat thereto, the block 17 is in the form of a layer consisting essentially of a material selected from the group consisting of sulphur, copper, silver, and gold. The carbon block 25 has a molecular cleavage plane extending toward the layer 17. Figure 138276.doc -12- 201021167 8 The device is preferred. The additional small configuration components include: - an enclosure 1 〇A 'which extends around the pump and forms a channel 丨3, which will cool The agent fluid is transported to and in contact with the irregular upper surface of the block 17 via the passage 13 - the radiator fins 41A and 41G, the space 41B between the fins and the heat exchanger 40, - the hot water (coolant) tube 42 And a centrifugal fan 32 that rotates in a space between the inner ends 33 of the fins, an outer casing 10 that extends around the pump and supports the housing cover 23 with cooling on the cover Agent channels 20 and 21 and communicate with channels 18 and 19 formed between 1 〇 and 丨〇A, - membrane 22, above the opening 80 which overlies, and is positioned below the fan 32, the diaphragm system 23 carried by the lid. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 shows a schematic view of the integrated liquid cooler, the cooler comprising the carbon interface, which is covered with metal to improve thermal inertia; a pump; a water pipe having a radiator fin; a centrifugal fan and a diaphragm for thermal expansion compensation; FIG. 2 is a sloping top view 'for exemplifying the fan configuration compared to the radiator fins and the water pipe; FIG. 3 shows a slanted bottom view for Illustrating the carbon block interface; Figure 4 shows a functional illustration of one of the actions of a thermal expansion compensation diaphragm; 138276.doc -13- 201021167 Figure 5 is a schematic representation of a wafer set for, for example, connection to the main cooler Additional satellite coolant for heat management; Figure 6 shows another radiator and liquid cooler configuration; Figure 7 is similar to Figure 6, but showing a farther radiator; and Figure 8 is a Similar to the view of Figure 1, it shows a modification. [Main component symbol description] 10 Housing 10a Housing ring. 10A Encapsulation 11 ' 12 Liquid coolant flow chamber 13 Central passage 14 Pump 14a Pump structure 15 Arrow 16 Top surface 17 Layer 18 ' 19 Channel 20 > 21 Pipe 22 Diaphragm 23 Plate 23, Cover 24 Shell surface 25 Pyrolytic carbon 25a Lower side 138276.doc -14· 201021167
26 殼體壁 28 凹部 30 面 32 離心風扇 33 散熱片内端 40 熱交換器 41 散熱片 41a 群簇 41A 、41G 散熱器散熱片 41B 空間 42 ' 43 管道 50、 51 液體導管 54 冷卻器 55 ' 56 導管 57 穩壓器冷卻器 70 蓋子 71 > 72 軟管/導管 73 散熱器 74 冷卻扇 80 中央開口 124 電氣組件 138276.doc •15-26 Housing wall 28 Concave 30 Face 32 Centrifugal fan 33 Heat sink inner end 40 Heat exchanger 41 Heat sink 41a Cluster 41A, 41G Heat sink fin 41B Space 42 ' 43 Pipe 50, 51 Liquid conduit 54 Cooler 55 ' 56 Catheter 57 Regulator Cooler 70 Cover 71 > 72 Hose / Catheter 73 Heat Sink 74 Cooling Fan 80 Central Opening 124 Electrical Components 138276.doc • 15-