CN101997400A - Hot plate cooler for wind power generation insulated gate bipolar transistor (IGBT) converter power module - Google Patents

Hot plate cooler for wind power generation insulated gate bipolar transistor (IGBT) converter power module Download PDF

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Publication number
CN101997400A
CN101997400A CN2009101016468A CN200910101646A CN101997400A CN 101997400 A CN101997400 A CN 101997400A CN 2009101016468 A CN2009101016468 A CN 2009101016468A CN 200910101646 A CN200910101646 A CN 200910101646A CN 101997400 A CN101997400 A CN 101997400A
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CN
China
Prior art keywords
hot plate
power generation
heat
wind power
radiating fin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2009101016468A
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Chinese (zh)
Inventor
陆国栋
周健伟
孔芬霞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HANGZHOU YINLUN SCIENCE AND TECHNOLOGY Co Ltd
Zhejiang Yinlun Machinery Co Ltd
Original Assignee
HANGZHOU YINLUN SCIENCE AND TECHNOLOGY Co Ltd
Zhejiang Yinlun Machinery Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HANGZHOU YINLUN SCIENCE AND TECHNOLOGY Co Ltd, Zhejiang Yinlun Machinery Co Ltd filed Critical HANGZHOU YINLUN SCIENCE AND TECHNOLOGY Co Ltd
Priority to CN2009101016468A priority Critical patent/CN101997400A/en
Publication of CN101997400A publication Critical patent/CN101997400A/en
Pending legal-status Critical Current

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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/70Wind energy
    • Y02E10/76Power conversion electric or electronic aspects

Abstract

The invention discloses a hot plate cooler for a wind power generation insulated gate bipolar transistor (IGBT) converter power module, which comprises an aluminum substrate, hot plates, radiating fins and a wind scooper, wherein all the parts are assembled together by bolts; and the heat of the aluminum substrate is transferred to the radiating fins by the hot plates, and is dissipated in an air cooling way. The hot plate cooler has the advantages that: 1) the hot plates can uniformly transfer a heat flow with non-uniform density produced by the IGBT converter power module on the back of the aluminum substrate to the radiating fins on the other sides of the hot plates by the peculiar performance of the hot plates to ensure a good radiating effect; 2) the side effect of cantilever stress is avoided by adopting the hot plates to transfer the heat; and 3) the hot plate cooler has a small volume, the total height of the hot plates and the radiating fins is reduced by 84 percent compared with the height of a radiator adopting a hot pipe structure, and the compact structure also satisfies the needs of users.

Description

A kind of wind power generation IGBT unsteady flow power model hot plate type cooler
Technical field
The present invention relates to a kind of wind power generation IGBT unsteady flow power model cooler, specifically a kind of hot plate type cooler.
Background technology
IGBT unsteady flow power model in wind power generation all is fixed on the metal substrate usually, because the power difference, therefore the density of heat flow rate that produces just has very big-difference.The heat that produces sees through substrate, is taken away by the radiator of substrate opposite side.Now common to directly being fixed in the substrate opposite side with radiating fin, the heat that IGBT unsteady flow power model is produced loses by air cooling way.Because the density of heat flow rate difference that IGBT unsteady flow power model produces, thereby radiating effect is unsatisfactory.
The radiator that also has has utilized hot pipe technique, is about to the heat pipe tube bank and takes root in aluminium base, and the heat delivered that the electric elements on the aluminium base are distributed is taken away heat by air cooling way to the condensation segment of heat pipe again.Although heat pipe is described as the superconductor of heat in the heat exchange field, but the mode that adopts heat pipe to take root, every heat pipe and aluminium base contact-making surface also have only the area of bore, and heating surface (area) (HS is limited relatively, therefore need a lot of heat pipes.Because heat pipe is longer, the entire radiator volume is bigger again.Heat-pipe type radiator also exists because of IGBT unsteady flow power model generation density of heat flow rate difference, the unfavorable situation of radiating effect.In addition because of aluminium base is vertical arrangement, so the heat pipe tube bank is cantilever position and arranges that heat pipe and aluminium base connecting portion stress are bigger, and reliability is had considerable influence.
Summary of the invention
What the present invention will solve is the above-mentioned defective that prior art exists, and aims to provide a kind of hot plate type radiator.
The technical scheme that addresses the above problem employing is: a kind of wind power generation IGBT unsteady flow power model hot plate type cooler, comprise aluminium base, hot plate, radiating fin and wind scooper, by bolt together with each component-assembled, the heat of aluminium base passes to radiating fin by hot plate, loses by air cooling way again.
According to the present invention, the hot plate size is wanted the heat dissipation region of aluminium coating substrate back electric elements.
According to the present invention, radiating fin is identical with the hot plate area.
According to the present invention, a radiating fin and a hot plate constitute a heat-sink unit, and one or more heat-sink units are disposed on the described aluminium base, and a total wind scooper is set on it.
According to the present invention, described hot plate metal material is a copper, and interior media is a water.Can operate as normal for ensureing in-40 ℃ even lower environment, in the hot plate medium, be added with 60~80 purpose water smoke copper powders.
According to the present invention, the radiating fin material is an aluminium, and space width is 4mm, and fin height is 40~50mm, and fin top width degree is 1.5mm, and wing root width is 2.5mm, and the fin substrate thickness is 5mm.
According to the present invention, the position flatness of aluminium base, hot plate and radiating fin contact-making surface requires to be no more than 0.5, and the contact-making surface face applies with heat-conducting glue, is assembled together with bolt again.
Advantage of the present invention:
1) the uneven density of heat flow rate that adopts the hot plate mode aluminium base back side IGBT unsteady flow power model can be produced by the distinctive performance of hot plate, passes to the radiating fin of hot plate opposite side equably, has ensured better heat radiating effect.
2) adopt the hot plate structure to transmit heat, the side effect of no cantilever stress.
3) volume is little, and hot plate adds that the height of radiating fin compares with the radiator of heat pipe structure, and volume has reduced 84%.Compact structure also meets user's requirement.
Description of drawings
The invention will be further described below in conjunction with drawings and Examples.
Fig. 1 is the aluminium base schematic diagram.
Fig. 2 is the hot plate schematic diagram.
Fig. 3 is a radiating fin.
Fig. 4 is the wind scooper schematic diagram.
Fig. 5 is the combination schematic diagram of aluminium base, hot plate and radiating fin.
Fig. 6 is the assembling schematic diagram of aluminium base, hot plate and radiating fin.
Fig. 7 is an entire radiator assembly schematic diagram.
Embodiment
With reference to Fig. 1, the installing hole on the aluminium base 1 all is equipped with steel-wire screw-socket.
With reference to Fig. 6, hot plate 2 is placed on the aluminium base 1, and its position is corresponding with the electric component heat dissipation region at aluminium base 1 back side, radiating fin 3 is pressed on the hot plate again, each contact-making surface face applies with heat-conducting glue, with bolt radiating fin 3, hot plate 2 and aluminium base 1 is fastened again.Like this, finished the installation of a heat-sink unit.
In the present embodiment, radiating fin 3 is identical with hot plate 2 areas.Described hot plate metal material is a copper, and interior media is a water.Can operate as normal for ensureing in-40 ℃ even lower environment, in the hot plate medium, be added with 60~80 purpose water smoke copper powders.The radiating fin material is an aluminium, and space width is 4mm, and fin height is 40~50mm, and fin top width degree is 1.5mm, and wing root width is 2.5mm, and the fin substrate thickness is 5mm.
With reference to Fig. 7, a plurality of heat-sink units are disposed on the aluminium base 1 successively with identical method, with bolt a total wind scooper 4 is fixed on the aluminium base 1 again.
What should be understood that is: the foregoing description is just to explanation of the present invention, rather than limitation of the present invention, and any innovation and creation that do not exceed in the connotation scope of the present invention all fall within protection scope of the present invention.

Claims (7)

1. wind power generation IGBT unsteady flow power model hot plate type cooler, comprise aluminium base (1), hot plate (2), radiating fin (3) and wind scooper (4), it is characterized in that described aluminium base (1), hot plate (2), radiating fin (3) and wind scooper (4) fit together by bolt.
2. wind power generation IGBT unsteady flow power model hot plate type cooler as claimed in claim 1 is characterized in that described hot plate (2) size wants the heat dissipation region of aluminium coating substrate (1) back side electric elements.
3. wind power generation IGBT unsteady flow power model hot plate type cooler as claimed in claim 2 is characterized in that described radiating fin (3) is identical with hot plate (2) area.
4. wind power generation IGBT unsteady flow power model hot plate type cooler as claimed in claim 3, it is characterized in that a radiating fin (3) and a hot plate (2) constitute a heat-sink unit, one or more heat-sink units are disposed on the described aluminium base (1), and a total wind scooper (4) is set on it.
5. wind power generation IGBT unsteady flow power model hot plate type cooler as claimed in claim 1 is characterized in that described hot plate (2) metal material is a copper, and interior media is a water, is added with 60~80 purpose water smoke copper powders in the hot plate medium.
6. wind power generation IGBT unsteady flow power model hot plate type cooler as claimed in claim 1 is characterized in that described radiating fin (3) is an aluminium, and space width is 4mm, fin height is 40~50mm, fin top width degree is 1.5mm, and wing root width is 2.5mm, and the fin substrate thickness is 5mm.
7. wind power generation IGBT unsteady flow power model hot plate type cooler as claimed in claim 1 is characterized in that the flatness of described aluminium base (1), hot plate (2) and radiating fin (3) contact-making surface requires to be no more than 0.5, connects the interface and applies with heat-conducting glue.
CN2009101016468A 2009-08-20 2009-08-20 Hot plate cooler for wind power generation insulated gate bipolar transistor (IGBT) converter power module Pending CN101997400A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009101016468A CN101997400A (en) 2009-08-20 2009-08-20 Hot plate cooler for wind power generation insulated gate bipolar transistor (IGBT) converter power module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009101016468A CN101997400A (en) 2009-08-20 2009-08-20 Hot plate cooler for wind power generation insulated gate bipolar transistor (IGBT) converter power module

Publications (1)

Publication Number Publication Date
CN101997400A true CN101997400A (en) 2011-03-30

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009101016468A Pending CN101997400A (en) 2009-08-20 2009-08-20 Hot plate cooler for wind power generation insulated gate bipolar transistor (IGBT) converter power module

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CN (1) CN101997400A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109842275A (en) * 2019-02-01 2019-06-04 广东美的暖通设备有限公司 Radiator structure and frequency converter for frequency converter
CN110199446A (en) * 2016-12-20 2019-09-03 六号元素技术有限公司 Radiator including diamond synthesis material
CN117438389A (en) * 2023-09-27 2024-01-23 杭州思拓瑞吉科技有限公司 Uniform heat dissipation device and method for parallel connection of multiple IGBT modules
CN117438389B (en) * 2023-09-27 2024-05-03 杭州思拓瑞吉科技有限公司 Uniform heat dissipation device and method for parallel connection of multiple IGBT modules

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110199446A (en) * 2016-12-20 2019-09-03 六号元素技术有限公司 Radiator including diamond synthesis material
CN109842275A (en) * 2019-02-01 2019-06-04 广东美的暖通设备有限公司 Radiator structure and frequency converter for frequency converter
CN117438389A (en) * 2023-09-27 2024-01-23 杭州思拓瑞吉科技有限公司 Uniform heat dissipation device and method for parallel connection of multiple IGBT modules
CN117438389B (en) * 2023-09-27 2024-05-03 杭州思拓瑞吉科技有限公司 Uniform heat dissipation device and method for parallel connection of multiple IGBT modules

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Application publication date: 20110330