CN109842275A - Radiator structure and frequency converter for frequency converter - Google Patents
Radiator structure and frequency converter for frequency converter Download PDFInfo
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- CN109842275A CN109842275A CN201910105889.2A CN201910105889A CN109842275A CN 109842275 A CN109842275 A CN 109842275A CN 201910105889 A CN201910105889 A CN 201910105889A CN 109842275 A CN109842275 A CN 109842275A
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 85
- 238000010438 heat treatment Methods 0.000 claims abstract description 59
- 239000003507 refrigerant Substances 0.000 claims abstract description 24
- 238000012546 transfer Methods 0.000 claims abstract description 11
- 238000009434 installation Methods 0.000 claims description 44
- 239000002826 coolant Substances 0.000 claims description 13
- 238000002347 injection Methods 0.000 claims description 13
- 239000007924 injection Substances 0.000 claims description 13
- 239000003990 capacitor Substances 0.000 claims description 3
- 206010037660 Pyrexia Diseases 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 7
- 239000000758 substrate Substances 0.000 description 28
- 238000001816 cooling Methods 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 210000003205 muscle Anatomy 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000004378 air conditioning Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000002910 structure generation Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
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Abstract
The invention discloses a kind of radiator structures and frequency converter for frequency converter, the radiator structure includes the circuit heating module (1) in the frequency converter and the microchannel heat sink for radiating to the circuit heating module (1), the microchannel heat sink includes micro-channel flat (2), and multiple flat tube pipelines (23) for circulating for refrigerant are equipped in the micro-channel flat (2)；Wherein, the micro-channel flat (2) is additionally provided with flat tube heat dissipation contact plane (21), the circuit heating module (1) is equipped with module heat dissipating contact plane, and direct contact heat transfer and/or mediate contact heat transfer are formed between flat tube heat dissipation contact plane (21) and the module heat dissipating contact plane.It is radiated in a creative way using microchannel heat sink to the circuit heating module in frequency converter in radiator structure of the invention, the heat dissipation effect to circuit heating module is effectively promoted, to better ensure that the functional reliability of frequency converter.
Description
Technical field
The present invention relates to converter technology fields, and in particular, to a kind of radiator structure and frequency converter for frequency converter.
Background technique
Currently, for field of air conditioning frequency converter due to be equipped in cabinet body more circuit heating module and calorific value compared with
Greatly, it is therefore desirable to corresponding radiator structure be set to guarantee the normal work of each module, to guarantee the reliable operation of frequency converter
Property.
And the radiating mode of frequency converter is mostly wind-cooling heat dissipating, i.e., blower and inlet and outlet is arranged in frequency converter with by cabinet
Heat in body is quickly discharged outside machine, for some such as IGBT, the biggish component of diode calorific value, can also be arranged special
Radiator structure to improve heat dissipation effect, such as setting gilled radiator is to accelerate radiating rate.
But since wind-cooling heat dissipating is realized based on divulging information with the external world, when ambient temperature is also higher, ventilation and heat
Less effective, it cannot be guaranteed that the fast cooling of circuit heating module, the reliability of frequency converter is difficult to ensure.
Summary of the invention
In view of the above drawbacks of the prior art or insufficient, the present invention provides a kind of radiator structure for frequency converter and changes
Frequency device can further promote the heat dissipation effect to frequency converter, to more can guarantee the functional reliability of frequency converter.
To achieve the above object, the present invention provides a kind of radiator structure for frequency converter, the radiator structure includes
Circuit heating module in the frequency converter and the microchannel heat sink for radiating to the circuit heating module, it is described
Microchannel heat sink includes micro-channel flat, and multiple flat tube pipelines for circulating for refrigerant are equipped in the micro-channel flat；
Wherein, the micro-channel flat is additionally provided with flat tube heat dissipation contact plane, and the circuit heating module is dissipated equipped with module
Thermally contact plane, formed between flat tube heat dissipation contact plane and the module heat dissipating contact plane direct contact heat transfer and/
Or mediate contact heat transfer.
Optionally, the outer profile of the module heat dissipating contact plane is located at the outer profile of flat tube heat dissipation contact plane
It is interior.
Optionally, the module heat dissipating contact plane and flat tube heat dissipation contact plane are rectangular planes, multiple
The flat tube pipeline extends along the length direction of flat tube heat dissipation contact plane, the length side of the module heat dissipating contact plane
It is mutually perpendicular to the length direction with flat tube heat dissipation contact plane, the length of the module heat dissipating contact plane is L, described
The width of flat tube heat dissipation contact plane is W, is met: W >=L and 90mm≤W≤200mm.
Optionally, multiple flat tube pipelines are arranged successively along the width direction of flat tube heat dissipation contact plane, described
The cross section rectangular shaped of flat tube pipeline simultaneously including the pipeline parallel sides for being parallel to flat tube heat dissipation contact plane and is hung down
Directly in the pipeline vertical side edge of flat tube heat dissipation contact plane；
Wherein, two flat tube pipelines in the width direction along flat tube heat dissipation contact plane, positioned at both ends
The pipeline vertical side edge between maximum spacing be W1, meet: W1 >=90mm.
Optionally, the pipeline parallel sides include that the first pipe of the relatively close flat tube heat dissipation contact plane is parallel
Side and the second pipe parallel sides for being relatively distant from the flat tube heat dissipation contact plane, the first pipe parallel sides and institute
The vertical interval stated between flat tube heat dissipation contact plane is T1, is met: 3mm≤T1≤15mm.
Optionally, 6mm≤T1≤15mm.
Optionally, the micro-channel flat be additionally provided be parallel to flat tube heat dissipation contact plane non-heat dissipation contact it is flat
Face, the flat tube pipeline setting are radiated between contact plane and the non-heat dissipation contact plane in the flat tube, second pipe
Vertical interval between road parallel sides and the non-heat dissipation contact plane is T2, is met: 2mm≤T2≤4mm.
Optionally, along the flat tube heat dissipation contact plane width direction along, the adjacent flat tube pipeline it is described
Minimum spacing between pipeline vertical side edge is T3, is met: 0.8mm≤T3≤1.7mm.
Optionally, the width of the first pipe parallel sides and the second pipe parallel sides is X, is met:
28mm≤W1/X≤45mm。
Optionally, the microchannel heat sink include be separately positioned on the both ends of the flat tube pipeline cold media input tube and
Refrigerant efferent duct, the tube wall of the cold media input tube, which is equipped with, corresponds the multiple refrigerants being connected to multiple flat tube pipelines
Spray-hole.
Optionally, the coolant injection hole be circular hole or square hole, the centerline hole in the coolant injection hole with it is described flat
The central axis of pipeline overlaps.
Optionally, the circuit heating module includes the IGBT, capacitor and diode being mounted on stack bus bar, the mould
Block heat dissipation contact plane is the busbar plate face of the stack bus bar.
In addition, the present invention also provides a kind of frequency converters using above-mentioned radiator structure.
Optionally, the frequency converter includes cabinet body and the circuit heating module that is arranged in the cabinet body and described micro-
Channel heat radiator, the module heat dissipating contact plane of the circuit heating module and the flat tube of the microchannel heat sink
Heat dissipation contact plane directly contacts installation.
Optionally, the frequency converter include cabinet body, setting the intracorporal circuit heating module of the cabinet and setting exist
The microchannel heat sink outside the cabinet body, the circuit heating module pass through module heat dissipating contact plane fitting installation
On the inner wall of cabinet body wall, the microchannel heat sink is jointly mounted to the cabinet body by flat tube heat dissipation contact plane
It aligns in the outside wall surface of wall and with the circuit heating module and installs.
In the radiator structure for frequency converter of the invention, in a creative way using microchannel heat sink in frequency converter
Circuit heating module radiates, that is, passes through the flat tube heat dissipation contact plane and circuit in the micro-channel flat of microchannel heat sink
The direct contact or mediate contact of module heat dissipating contact plane on radiating module are to realize heat exchange.Due in micro-channel flat
The refrigerant of circulation is low compared with environment temperature and heat exchange area is bigger, therefore compared with traditional wind-cooling heat dissipating mode, of the invention
The heat dissipation effect of radiator structure is more preferable, more can guarantee frequency converter reliably working at appropriate temperatures.
Other features and advantages of the present invention will the following detailed description will be given in the detailed implementation section.
Detailed description of the invention
The drawings are intended to provide a further understanding of the invention, and constitutes part of specification, with following tool
Body embodiment is used to explain the present invention together, but is not construed as limiting the invention.In the accompanying drawings:
Fig. 1 is the structural schematic diagram of the radiator structure for frequency converter in a specific embodiment of the invention, electric at this time
Road heating module is directly installed in micro-channel flat.
Fig. 2 is the cross-sectional view of the micro-channel flat in the radiator structure of Fig. 1；
Fig. 3 is the structural schematic diagram of the microchannel heat sink in the radiator structure of Fig. 1；
Fig. 4 is the cross-sectional view for being applied to the micro-channel flat of A/C evaporator or condenser in the prior art；
Fig. 5 is the cross-sectional view of another micro-channel flat in the prior art；
Fig. 6 is the perspective view of another radiator structure for frequency converter in a specific embodiment of the invention；
Fig. 7 is the Structure explosion diagram of the radiator structure in Fig. 6.
Description of symbols:
1 circuit heating module, 2 micro-channel flat
3 cold media input tube, 4 refrigerant efferent duct
5 are auxiliarily fixed the main connection fixture of substrate 6
78 welded nuts of secondary connection fixture
11 module installation through-hole, 21 flat tube heat dissipation contact plane
22 non-23 flat tube pipelines of heat dissipation contact plane
The main 25 flat tube pair installation through-hole of installation through-hole of 24 flat tubes
The main 52 substrate pair installation through-hole of installation through-hole of 51 substrates
53 substrate mounting grooves
231 pipeline vertical side edge, 232 first pipe parallel sides
233 second pipe parallel sides, 531 groove bottom wall
532 groove sidewalls
Specific embodiment
It is described in detail below in conjunction with specific embodiment of the attached drawing to the embodiment of the present invention.It should be understood that this
Locate described specific embodiment and be merely to illustrate and explain the present invention embodiment, is not intended to restrict the invention embodiment.
It should be noted that in the absence of conflict, the feature in embodiment and embodiment in the present invention can phase
Mutually combination.
In embodiments of the present invention, in the absence of explanation to the contrary, the noun of locality used such as " upper and lower, top, bottom " is logical
Be often for direction shown in the drawings either for it is vertical, vertically or on gravity direction for the mutual position of each component
Set relationship description word.
The present invention will be described in detail below with reference to the accompanying drawings and in conjunction with exemplary embodiment.
The exemplary embodiment of the present invention provides a kind of radiator structures for frequency converter, as shown in Figure 1 to Figure 3, should
Radiator structure includes the circuit heating module 1 being arranged in frequency converter and micro- logical for radiating to circuit heating module 1
Road radiator.It is equipped with micro-channel flat 2 in the microchannel heat sink, is equipped in micro-channel flat 2 more for circulating for refrigerant
A flat tube pipeline 23.Wherein, micro-channel flat 2 is additionally provided with flat tube heat dissipation contact plane 21, and circuit heating module 1 is dissipated equipped with module
Thermally contact plane, and flat tube heat dissipation contact plane 21 and module heat dissipating contact plane between can be formed direct contact heat transfer or
Transmission of heat by contact is connect, alternatively, while forming direct contact heat transfer between the circuit heating module 1 and micro-channel flat 2 of part,
Mediate contact heat transfer is formed between remaining circuit heating module 1 and micro-channel flat 2.
Compared with prior art, in a creative way using microchannel heat sink to change in the radiator structure of the present exemplary embodiment
Circuit heating module 1 in frequency device radiates, by utilizing the flat tube heat dissipation contact plane 21 and circuit in micro-channel flat 2
Directly contact or the mediate contact of module heat dissipating contact plane on radiating module 1, and by continuous in cooperation flat tube pipeline 23
The refrigerant of flowing is, it can be achieved that rapid cooling to circuit heating module 1.Compared with heat dissipations sides such as wind-cooling heat dissipatings in the prior art
Formula, the refrigerant temperature in the radiator structure of the present exemplary embodiment is low compared with environment temperature, and heat exchange area is larger, Neng Gouqu
To better heat dissipation effect, guarantee that frequency converter works within the scope of suitable temperature always, thus improve its job stability and
Reliability.
To further increase radiating efficiency, the outer profile of module heat dissipating contact plane can be set to connect positioned at flat tube heat dissipation
In the outer profile for touching plane 21.In other words, in the upright projection of module heat dissipating contact plane and flat tube heat dissipation contact plane 21,
Module heat dissipating contact plane is completely covered in flat tube heat dissipation contact plane 21, to maximize the heat transfer area between two planes.
And the Assembly stability under such configuration, between circuit heating module 1 and micro-channel flat 2 is higher.
It should be noted that existing microchannel heat sink is mainly used in the evaporator or condenser of air-conditioning system.
Referring to Fig. 4, the width W and thickness h of the micro-channel flat of the microchannel heat sink are minimum, therefore intensity is poor, easily deforms,
The flatness to guarantee its mounting plane can not be machined out.
For the fault of construction for overcoming above-mentioned intensity difference, referring to Fig. 5, some producers are by the mounting plane of microchannel heat sink
Wall thickness increases to biggish thickness H by lesser thickness h.After wall thickness increases, it can beat threaded hole on mounting plane.
However, the value due to H is very big, consumable quantity and processing capacity is necessarily caused to greatly increase, so as to cause being produced into
This is also greatly increased.In addition, when wall thickness is excessive, the heat exchange efficiency of micro-channel flat necessarily declines, to reduce its heat dissipation effect
Rate.
Therefore, the case where needing using flat tube heat dissipation contact plane 21 and module heat dissipating contact plane direct contact heat transfer
Under, i.e., in the case that circuit radiating module 1 is directly installed in micro-channel flat 2, need to the property such as intensity of micro-channel flat 2
It can be carried out optimization, therefore to make corresponding parameter setting, relevant explanation will be made below.
It is assemblied in micro-channel flat 2 firstly the need of guaranteeing that circuit heating module 1 can be stablized.For example, in some implementations
In example, module heat dissipating contact plane and flat tube heat dissipation contact plane 21 are rectangular planes, and multiple flat tube pipelines 23 are along flat tube
The length direction of heat dissipation contact plane 21 extends, length direction and flat tube the heat dissipation contact plane 21 of module heat dissipating contact plane
Length direction is mutually perpendicular to.Wherein, the length of module heat dissipating contact plane is L, and the width of flat tube heat dissipation contact plane 21 is W,
Comprehensively consider the structure size of circuit heating module 1 and the problem of above-mentioned Assembly stability, meet between W and L: meeting: W
>=L and 90mm≤W≤200mm.
Further, multiple flat tube pipelines 23 are arranged successively along the width direction of flat tube heat dissipation contact plane 21, flat tube pipe
The cross section rectangular shaped in road 23 and including be parallel to flat tube heat dissipation contact plane 21 pipeline parallel sides and perpendicular to flat
The pipeline vertical side edge 231 of pipe heat dissipation contact plane 21.In the width direction along flat tube heat dissipation contact plane 21, it is located at both ends
Two flat tube pipelines 23 pipeline vertical side edge 231 between maximum spacing be W1.
In some embodiments, the module for the multiple circuit heating modules 1 being mounted on flat tube heat dissipation contact plane 21 dissipates
The length for thermally contacting plane is different, if the maximum length of multiple module heat dissipating contact planes is L and minimum length is L1.From heat dissipation
Effect and economy consider that the value of W1 is better closer to the length of module heat dissipating contact plane, i.e., preferably W1 is arranged
Be it is suitable with L, allow W1 be slightly less than L, but must assure that W1 be greater than L1.Based on this design philosophy and comprehensive actual conditions consider,
The value range of W1 is set as meeting: W1 >=90mm.
Specifically, pipeline parallel sides include the first pipe parallel sides of relatively close flat tube heat dissipation contact plane 21
232 and be relatively distant from flat tube heat dissipation contact plane 21 second pipe parallel sides 233, first pipe parallel sides 232 with it is flat
Vertical interval between pipe heat dissipation contact plane 21 is T1.To guarantee that micro-channel flat 2 has the processing for being suitable for flatness processing
Intensity and installation strength, T1 cannot be too small, and in order to guarantee that radiating efficiency, T1 cannot comprehensively consider too greatly as far as possible, T1's
Value range preferably satisfies: 3mm≤T1≤15mm.And in order to guarantee the equal energy of circuit heating module 1 with different outer dimensions
It is mounted on same flat tube heat dissipation contact plane 21, the value of T1 is necessary for relative maximum, enables to flat in microchannel
Most deep threaded hole is beaten on pipe 2 to install the circuit heating module 1 with maximum outer dimension.
In addition, micro-channel flat 2 is additionally provided with the non-heat dissipation contact plane 22 for being parallel to flat tube heat dissipation contact plane 21, flat tube
The setting of pipeline 23 is radiated between contact plane 21 and non-heat dissipation contact plane 22 in flat tube, second pipe parallel sides 233 with it is non-
Vertical interval between heat dissipation contact plane 22 is T2.Since circuit heating module 1 need not be installed on non-heat dissipation contact plane 22,
Also it need not guarantee flatness, as long as therefore ensuring that non-heat dissipation contact plane 22 with certain voltage endurance capability, is saving material
Under the premise of material, the value range of T2 is preferably satisfied: 2mm≤T2≤4mm.
Further, in the width direction along flat tube heat dissipation contact plane 21, the pipeline of adjacent flat tube pipeline 23 hangs down
Minimum spacing between straight sided 231 is T3.From the foregoing, it can be seen that T1 usually differs larger with the value of T2, therefore by squeezing
It is molded and during producing micro-channel flat 2, between the continuity of flat tube pipeline 23 and adjacent flat tube pipeline 23
The continuity of muscle position is relatively difficult to guarantee, that is, forms second-rate, and reliability is lower.And the value range by the way that T3 is rationally arranged, energy
Enough guarantee intensity of the micro-channel flat 2 during limit voltage-withstand test, guarantee flat tube pipeline 23 in mold extrusion forming process
In integrality and muscle continuity.
For T3, value is related to the cross section overall circumference of flat tube pipeline 23, when the cross section of flat tube pipeline 23 is such as
Shown in figure when rectangle, overall circumference is N* (X+Y) * 2, wherein X is that first pipe parallel sides 232 or second pipe are flat
The width of row side 233, Y are the length of pipeline vertical side edge 231, and N is the number of flat tube pipeline 23.
For T3 and N* (X+Y) * 2, the value of the two is the bigger the better, and when T3 value is larger, can guarantee microchannel
Intensity of the flat tube 2 during limit voltage-withstand test, guarantee integrality of the flat tube pipeline 23 during mold extrusion forming with
And the continuity of muscle.When the value of N* (X+Y) * 2 is larger, the heat exchange area of the refrigerant to circulate in flat tube pipeline 23 is larger,
Radiating efficiency is higher.
Preferably, microchannel heat sink includes the cold media input tube 3 and refrigerant for being separately positioned on the both ends of flat tube pipeline 23
Efferent duct 4, the tube wall of cold media input tube 3, which is equipped with, corresponds the coolant injection hole being connected to multiple flat tube pipelines 23.It is more excellent
Selection of land, coolant injection hole may be configured as circular hole, molding easy to process.In addition, coolant injection hole may also be configured to square hole or its
The through-hole of his shape, the centerline hole in coolant injection hole and the central axis of the flat tube pipeline 23 overlap.At this point,
Need to consider the distributing uniformity of the refrigerant in each flat tube pipeline 23, the i.e. diameter phi of cold media input tube 3 and refrigerant efferent duct 4
M is smaller, and refrigerant distribution is more uniform, and the heat-sinking capability of micro-channel flat 2 is also better, it can be seen that, the value of Y is related to φ M,
After having chosen cold media input tube 3 and refrigerant efferent duct 4, the value of Y determines therewith, i.e., the value of Y is certain.
It is strong during the radiating efficiency of overall balance micro-channel flat 2, micro-channel flat 2 are in limit voltage-withstand test
Degree, integrality of the flat tube pipeline 23 during mold extrusion forming, the continuity of muscle and meet cost and assembly intensity is wanted
In the case where asking, through performance simulation emulation and mold runner design of Simulation, and by 10 times or more die sinkings, repeatedly change mould and
A large amount of heat dissipation experiment assessment test, finally obtains: as W1 >=90mm, 6mm≤T1≤15mm, 2mm≤T2≤4mm, 0.8mm
≤ T3≤1.7mm, 28mm≤W1/X≤45mm.
In addition, exemplary embodiment of the present invention additionally provides another radiator structure for being used for frequency converter, such as Fig. 6 and figure
Shown in 7, which need not optimize the structure of micro-channel flat 2 too much, can avoid the occurrence of flat tube due to intensity deficiency
And it deforms or leads to problems such as Assembly stability insufficient.
Specifically, which includes circuit heating module 1 in the frequency converter being cascading, microchannel heat dissipation
Device and it is auxiliarily fixed substrate 5, microchannel heat sink includes micro-channel flat 2, circuit heating module 1, micro-channel flat 2 and auxiliary
Fixed substrate 5 is respectively equipped with the main installation through-hole 24 of module installation through-hole 11, flat tube and the main installation through-hole 51 of substrate, and radiator structure is also
Including main connection fixture 6.Wherein, main connection fixture 6 successively wears main 24 and of installation through-hole of gang mould block installation through-hole 11, flat tube
The main installation through-hole 51 of substrate is with the circuit heating module 1 of fastening superimposed setting, microchannel heat sink and substrate 5 is auxiliarily fixed.
It can be seen that in the radiator structure of the present exemplary embodiment, it need only be in the micro-channel flat 2 of microchannel heat sink
On process the main installation through-hole 24 of flat tube, and substrate 5 is auxiliarily fixed to secure it within by the company of wearing of main connection fixture 6
On, while under the company of wearing of main connection fixture 6, stablize assembly between circuit heating module 1 and micro-channel flat 2.Therefore, should
Radiator structure is lower to the intensity requirement of micro-channel flat 2, so that the peace of circuit heating module 1 will need not be used to install in flat tube
Dress planar thickening not only can guarantee the radiating efficiency between flat tube and circuit heating module 1 while reducing installation cost, but also
It can reinforce the assembly intensity between flat tube and circuit heating module 1.
In some embodiments, micro-channel flat 2 is additionally provided with flat tube pair installation through-hole 25, and substrate 5 is auxiliarily fixed and is additionally provided with
Substrate pair installation through-hole 52, radiator structure further include secondary connection fixture 7.Wherein, which is used for the company's of wearing flat tube
The dress of secondary installation through-hole 25 and substrate pair installation through-hole 52 to further strengthen micro-channel flat 2 and be auxiliarily fixed between substrate 5
With stability, to further increase the reliability of radiator structure.
It should be noted that due to module installation through-hole 11, the main installation through-hole 24 of flat tube, flat tube pair installation through-hole 25, base
The main installation through-hole 51 of plate and substrate pair installation through-hole 52 need not be set as threaded hole, therefore it is flat greatly to reduce microchannel
The thickness of pipe 2, to greatly save material cost and processing cost.Further, since the thickness of micro-channel flat 2 is reduced,
It puts by micro-channel flat 2 and cold media input tube 3 and refrigerant efferent duct 4 to when soldering oven welding, can reduce soldering oven
Power improves the exploitation speed of soldering oven.At the same time, multiple microchannel heat sinks can be put into soldering oven simultaneously, effectively
The utilization rate for improving soldering oven, since welding cost can be greatlyd save without being welded on specific soldering oven.
In order to ensure the refrigerant normal stream in the flat tube pipeline 23 of micro-channel flat 2 passes to guarantee radiating efficiency, flat tube master
Installation through-hole 24 and flat tube pair installation through-hole 25 avoid the setting of flat tube pipeline 23, to avoid the heat dissipation in micro-channel flat 2
Structure is interfered with fixed structure generation, improves the reliability of micro-channel flat 2.
In some embodiments, micro-channel flat 2 is in a rectangular parallelepiped shape and including flat tube long side and flat tube short side, flat tube
Main installation through-hole 24 and flat tube pair installation through-hole 25 are sequentially arranged at intervals along the length direction of micro-channel flat 2 long in flat tube respectively
The contiguous zone of side, flat tube pair installation through-hole 25 is with respect to the main installation through-hole 24 of flat tube closer to flat tube long side.In this structure
Under, the main installation through-hole 24 of flat tube and flat tube pair installation through-hole 25 are arranged at the marginal position in micro-channel flat 2, therefore can stay
Enough areas are out to install multiple circuit heating modules 1, to improve the utilization rate of micro-channel flat 2.
Based on above structure, when being equipped with multiple circuit heating modules 1 in frequency converter, multiple circuit heating modules 1 are along micro-
The length direction of channel flat tube 2 is arranged successively installation, and the outer of circuit heating module 1 is arranged in flat tube pair installation through-hole 25 at this time
Side.
In some embodiments, substrate 5 is auxiliarily fixed and is equipped with substrate mounting groove 53, at this time the main installation through-hole 51 of substrate and base
Plate pair installation through-hole 52 may be provided in the groove bottom wall 531 of substrate mounting groove 53.And micro-channel flat 2 is then mounted on substrate peace
In tankage 53, and the both ends in the width direction of micro-channel flat 2 are connected to the groove sidewall 532 of substrate mounting groove 53 respectively.
In other words, the substrate mounting groove 53 in substrate 5, which is auxiliarily fixed, first to be guaranteed micro- before installing with the fastening of micro-channel flat 2
The pre-determined bit of channel flat tube 2 shifts when fixed using main connection fixture 6 without worry micro-channel flat 2, thus
Installation difficulty is reduced, effectively promotion assembly efficiency.
Under the above constitution, the cold media input tube 3 of microchannel heat sink and refrigerant efferent duct 4 are along micro-channel flat 2
Width direction extends, and cold media input tube 3 and refrigerant efferent duct 4 are connected to the both ends along its length of micro-channel flat 2
And be located at outside substrate mounting groove 53, be conducive to simplify the structure of substrate 5 is auxiliarily fixed, i.e., need to only guarantee to be auxiliarily fixed substrate 5, micro-
Assembly can be stablized between channel flat tube 2 and circuit heating module 1, and need not be exported according to cold media input tube 3 and refrigerant
The specific structure of pipe 4 designs the shape of substrate.
Similarly, can be arranged on the tube wall of cold media input tube 3 with multiple flat tube pipelines 23 one-to-one correspondence be connected to it is multiple
Coolant injection hole, to guarantee the uniformity of the refrigerant to circulate in each flat tube pipeline 23.Further, coolant injection hole is settable
It is easy to process for circular hole, alternatively, coolant injection hole may be arranged as the through-hole of square hole or other shapes, coolant injection hole
The central axis of centerline hole and flat tube pipeline 23 overlap.
To save installation cost and reducing installation difficulty, main connection fixture 6 and secondary connection fixture 7 are preferably arranged to
Bolt assembly.It is highly preferred that the bolt assembly includes being mutually matched the screw bolt and nut being spirally connected, wherein the nut is weldering in advance
It connects in the welded nut 8 being auxiliarily fixed on substrate 5, is conducive to further strengthen Assembly stability.
It should be noted that circuit heating module 1 mentioned in this article includes IGBT, the capacitor being mounted on stack bus bar
And diode, or other components being also possible in frequency converter.At this point, the circuit in a upper exemplary embodiment generates heat
The module heat dissipating contact plane of module 1 is the busbar plate face of the stack bus bar.
In addition, exemplary embodiment of the present invention additionally provides a kind of frequency converter using above-mentioned radiator structure, the change
Frequency device has the advantages that reliability and stability are high and production cost is low etc..
In some embodiments, which includes cabinet body and the circuit heating module 1 being arranged in cabinet body and microchannel
Radiator, the module heat dissipating contact plane of circuit heating module 1 and the flat tube heat dissipation contact plane 21 of microchannel heat sink are direct
Contact installation, thus directly contact heat dissipation.
Alternatively, in further embodiments, frequency converter includes cabinet body, is arranged in the intracorporal circuit heating module 1 of cabinet and sets
Set the microchannel heat sink outside cabinet body.Wherein, circuit heating module 1 is jointly mounted to cabinet body by module heat dissipating contact plane
On the inner wall of wall, microchannel heat sink by flat tube radiate contact plane 21 be jointly mounted in the outside wall surface of cabinet body wall and with
The contraposition installation of circuit heating module 1, so that mediate contact is radiated.
The optional embodiment of the embodiment of the present invention is described in detail in conjunction with attached drawing above, still, the embodiment of the present invention is simultaneously
The detail being not limited in above embodiment can be to of the invention real in the range of the technology design of the embodiment of the present invention
The technical solution for applying example carries out a variety of simple variants, these simple variants belong to the protection scope of the embodiment of the present invention.
It is further to note that specific technical features described in the above specific embodiments, in not lance
In the case where shield, it can be combined in any appropriate way, in order to avoid unnecessary repetition, the embodiment of the present invention pair
No further explanation will be given for various combinations of possible ways.
In addition, any combination can also be carried out between a variety of different embodiments of the embodiment of the present invention, as long as it is not
The thought of the embodiment of the present invention is violated, equally should be considered as disclosure of that of the embodiment of the present invention.
Claims (15)
1. a kind of radiator structure for frequency converter, which is characterized in that the radiator structure includes the circuit in the frequency converter
Heating module (1) and the microchannel heat sink for being used to radiate to the circuit heating module (1), the microchannel heat sink
Multiple flat tube pipelines (23) for circulating for refrigerant are equipped with including micro-channel flat (2), in the micro-channel flat (2)；
Wherein, the micro-channel flat (2) is additionally provided with flat tube heat dissipation contact plane (21), and the circuit heating module (1) is equipped with
Module heat dissipating contact plane is formed between flat tube heat dissipation contact plane (21) and the module heat dissipating contact plane and is directly connect
Touching heat transfer and/or mediate contact heat transfer.
2. the radiator structure according to claim 1 for frequency converter, which is characterized in that the module heat dissipating contact plane
Outer profile be located at the flat tube heat dissipation contact plane (21) outer profile in.
3. the radiator structure according to claim 2 for frequency converter, which is characterized in that the module heat dissipating contact plane
It is rectangular planes with flat tube heat dissipation contact plane (21), multiple flat tube pipelines (23) connect along flat tube heat dissipation
The length direction for touching plane (21) extends, the length direction of the module heat dissipating contact plane and flat tube heat dissipation contact plane
(21) length direction is mutually perpendicular to, and the length of the module heat dissipating contact plane is L, and the flat tube radiates contact plane (21)
Width be W, meet: W >=L and 90mm≤W≤200mm.
4. the radiator structure according to claim 3 for frequency converter, which is characterized in that multiple flat tube pipelines (23)
Width direction along flat tube heat dissipation contact plane (21) is arranged successively, and the cross section of the flat tube pipeline (23) is in rectangle shape
Shape and pipeline parallel sides including being parallel to flat tube heat dissipation contact plane (21) and radiating perpendicular to the flat tube contact
The pipeline vertical side edge (231) of plane (21)；
Wherein, two flat tube pipelines in the width direction along flat tube heat dissipation contact plane (21), positioned at both ends
(23) the maximum spacing between the pipeline vertical side edge (231) is W1, is met: W1 >=90mm.
5. the radiator structure according to claim 4 for frequency converter, which is characterized in that the pipeline parallel sides include
It the first pipe parallel sides (232) of relatively close flat tube heat dissipation contact plane (21) and is relatively distant from the flat tube and radiates
The second pipe parallel sides (233) of contact plane (21), the first pipe parallel sides (232) connect with flat tube heat dissipation
Touching the vertical interval between plane (21) is T1, is met: 3mm≤T1≤15mm.
6. the radiator structure according to claim 5 for frequency converter, which is characterized in that 6mm≤T1≤15mm.
7. the radiator structure according to claim 6 for frequency converter, which is characterized in that the micro-channel flat (2) is also
Equipped with the non-heat dissipation contact plane (22) for being parallel to flat tube heat dissipation contact plane (21), flat tube pipeline (23) setting exists
Between flat tube heat dissipation contact plane (21) and the non-heat dissipation contact plane (22), the second pipe parallel sides
(233) vertical interval between non-heat dissipation contact plane (22) is T2, is met: 2mm≤T2≤4mm.
8. the radiator structure according to claim 7 for frequency converter, which is characterized in that contacted radiating along the flat tube
Minimum in the width direction of plane (21), between the pipeline vertical side edge (231) of the adjacent flat tube pipeline (23)
Spacing is T3, is met: 0.8mm≤T3≤1.7mm.
9. the radiator structure according to claim 7 for frequency converter, which is characterized in that the first pipe parallel sides
(232) and the width of the second pipe parallel sides (233) is X, is met: 28mm≤W1/X≤45mm.
10. the radiator structure according to claim 1 for frequency converter, which is characterized in that the microchannel heat sink packet
Include the cold media input tube (3) and refrigerant efferent duct (4) for being separately positioned on the both ends of the flat tube pipeline (23), the refrigerant input
The tube wall of pipe (3), which is equipped with, corresponds the multiple coolant injection holes being connected to multiple flat tube pipelines (23).
11. the radiator structure according to claim 10 for frequency converter, which is characterized in that the coolant injection Kong Weiyuan
Hole or square hole, the centerline hole in the coolant injection hole and the central axis of the flat tube pipeline (23) overlap.
12. the radiator structure according to claim 1 for frequency converter, which is characterized in that the circuit heating module (1)
Including the IGBT, capacitor and diode being mounted on stack bus bar, the module heat dissipating contact plane is the stack bus bar
Busbar plate face.
13. a kind of frequency converter, which is characterized in that the frequency converter include according to claim 1~any one of 12 described in
Radiator structure for frequency converter.
14. frequency converter according to claim 13, which is characterized in that the frequency converter includes cabinet body and is arranged in the cabinet
The circuit heating module (1) and the microchannel heat sink in body, the module heat dissipating of the circuit heating module (1)
Contact plane directly contacts installation with the flat tube of microchannel heat sink heat dissipation contact plane (21).
15. frequency converter according to claim 13, which is characterized in that the frequency converter includes cabinet body, is arranged in the cabinet
The intracorporal circuit heating module (1) and the microchannel heat sink being arranged in outside the cabinet body, the circuit fever mould
Block (1) is jointly mounted on the inner wall of cabinet body wall by the module heat dissipating contact plane, and the microchannel heat sink passes through
Flat tube heat dissipation contact plane (21) be jointly mounted in the outside wall surface of the cabinet body wall and with the circuit heating module (1)
Contraposition installation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910105889.2A CN109842275A (en) | 2019-02-01 | 2019-02-01 | Radiator structure and frequency converter for frequency converter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910105889.2A CN109842275A (en) | 2019-02-01 | 2019-02-01 | Radiator structure and frequency converter for frequency converter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109842275A true CN109842275A (en) | 2019-06-04 |
Family
ID=66884557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910105889.2A Pending CN109842275A (en) | 2019-02-01 | 2019-02-01 | Radiator structure and frequency converter for frequency converter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109842275A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113192911A (en) * | 2021-04-29 | 2021-07-30 | 苏州汇川技术有限公司 | Micro-channel radiator |
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