CN214507771U - Water-cooling plate for double modules - Google Patents

Abstract

The utility model discloses a water-cooling board for double modules, including water-cooling base plate, first heat dissipation module and second heat dissipation module, be provided with first cooling chamber and second cooling chamber that are used for installing heat dissipation module on the water-cooling base plate, first cooling chamber with the second cooling chamber all is provided with inlet channel and water outlet channel, the inlet channel and the water outlet channel of second cooling chamber communicate respectively the inlet channel and the water outlet channel of first cooling chamber, the water-cooling base plate on be provided with respectively with the water outlet channel and the water inlet of inlet channel intercommunication of arbitrary cooling chamber; the first heat dissipation module and the second heat dissipation module are composed of a heat dissipation substrate and a plurality of heat dissipation fins located on the heat dissipation substrate, the heat dissipation fins are fixedly installed in corresponding cooling cavities and divide the cooling cavities into a plurality of mutually independent micro-channels, and two ends of each micro-channel are respectively communicated with a water inlet channel and a water outlet channel where the corresponding cooling cavities are located, so that uniform heat dissipation is realized, and heat dissipation efficiency is improved.

Description

Water-cooling plate for double modules

Technical Field

The utility model relates to a radiator field, in particular to water-cooling radiator field.

Background

An Insulated Gate Bipolar Transistor (IGBT) is a composite fully-controlled voltage-driven power semiconductor device consisting of a Bipolar Junction Transistor (BJT) and an insulated Gate field effect transistor (MOS). The IGBT is a core device for energy conversion and transmission, commonly known as the "CPU" of a power electronic device, and is used as a strategic emerging industry in the country, and has a wide application in the fields of rail transit, smart grid, aerospace, electric vehicles, new energy equipment, and the like.

Along with the development in the field of power electronic industry, the power and integration of used power electronic equipment are higher and higher, the size is miniaturized, and the like, the IGBT can generate a large amount of heat in the running process, so that the heat dissipation problem is more prominent, and the working performance and the reliability of the IGBT are directly influenced by the heat dissipation performance. The heat dissipation and cooling of the IGBT are important for ensuring the normal operation of related equipment.

The traditional radiator is an air-cooled or water-cooled radiator, has a single structure and a large volume, is easy to be limited by conditions in the radiating effect, and is not applicable to high-power IGBT parallel application any more; the existing water cooling plate usually adopts a deep hole drill processing mode to form a water channel, the water channel is single in structure, the heat exchange area is limited, and the heat dissipation effect is poor.

Moreover, the existing water cooling plates mostly adopt series-connected M-shaped water channels or arch-shaped water channels, and if IGBTs are connected in parallel, the problem of excessive heating of the IGBTs at the water outlet end can be caused (the series connection mode is that cooling liquid in the water cooling plate water channels absorbs heat and heats up after heat exchange between each IGBT and components, and the last IGBT is easy to influence the work of the IGBT because of excessive temperature rise after the cooling liquid gradually heats up), so that the normal work of the IGBT is influenced.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome prior art's not enough, provide a bimodulus is water-cooling board to realize even heat dissipation, improved the radiating efficiency.

The purpose of the utility model is realized through the following technical scheme:

the utility model provides a bimodulus is with water-cooling board, includes water-cooling base plate, first heat dissipation module and second heat dissipation module, treats refrigerated IGBT power module fixed mounting respectively on first heat dissipation module and the second heat dissipation module, the water-cooling base plate on set up the first cooling chamber that is used for installing first heat dissipation module and be used for installing second heat dissipation module's second cooling chamber, first cooling chamber with second cooling chamber all is provided with inlet channel and water outlet, the second cooling chamber the inlet channel intercommunication first cooling chamber the inlet channel forms inhalant canal, the second cooling chamber the water outlet channel intercommunication first cooling chamber the water outlet channel forms water outlet channel, the water-cooling base plate on be provided with the delivery port of exhalant canal intercommunication, with the water inlet of inhalant canal intercommunication.

The first heat dissipation module and the second heat dissipation module are composed of a heat dissipation substrate and a plurality of heat dissipation toothed sheets located on the heat dissipation substrate, the heat dissipation toothed sheets are fixedly installed in corresponding cooling cavities and divide the cooling cavities into a plurality of mutually independent micro-channels, and two ends of each micro-channel are respectively communicated with the water inlet channel and the water outlet channel where the corresponding cooling cavity is located.

Through adopting above-mentioned technical scheme, a plurality of rivers microchannel have been formed to the structural design of a plurality of heat dissipation fins, make to rise between the IGBT power module and lower the temperature the same, and then realized evenly dispelling the heat, the structure of microchannel fin can obtain great heat radiating area, and then has improved the radiating efficiency.

Optionally, the first heat dissipation module and the second heat dissipation module are formed by integrally molding the heat dissipation substrate and the plurality of heat dissipation fins.

By adopting the technical scheme, no thermal resistance exists between the radiating substrate and the radiating tooth sheets, and the radiating efficiency is improved.

Optionally, the heat dissipation fins are perpendicular to the heat dissipation substrate.

By adopting the technical scheme, under the condition that the internal space of the concave cavity is limited, the internal space of the concave cavity is fully utilized, and the heat conducting fins are arranged as many as possible, so that the heat radiating area is increased, and the heat radiating efficiency is improved.

Optionally, the heat dissipation fins are parallel to each other and are uniformly spaced.

By adopting the technical scheme, the flow of each water flow micro-channel connected in parallel is the same, the temperature rise and the temperature fall between the chip inside the single IGBT power module are the same, and the effect of uniform heat dissipation is achieved.

Optionally, the sizes of the first heat dissipation module and the second heat dissipation module are the same as the size of the IGBT power module to be cooled.

Through adopting above-mentioned technical scheme, make full use of the size of water-cooling base plate for whole water cooling plant's size is littleer.

Optionally, the water outlet and the water inlet are both threaded holes.

By adopting the technical scheme, the device for connecting the joint and the pipe fitting without water leakage is convenient.

Optionally, the heat-dissipating substrate and the heat-dissipating tooth piece are fixedly connected with the water-cooling substrate in a welding manner.

Through adopting above-mentioned technical scheme, make the water-cooling base plate with the heat dissipation tine has formed the required little seal chamber of water cooling plant, and welded mode has reduced the processing cost, has improved the efficiency of manufacturing, and then has improved the utility model discloses a synthesize the competitiveness.

Optionally, the first heat dissipation module and the second heat dissipation module are aluminum alloy heat dissipation modules

By adopting the technical scheme, the aluminum alloy has low cost and high heat-conducting property, and the heat-radiating efficiency of the whole equipment is improved while the cost is reduced; and simultaneously, the weight of the whole device is reduced.

To sum up, the utility model discloses a following at least one useful technological effect:

1) the structural design of a plurality of radiating fins of the radiating module and the cooling cavity form a plurality of micro-channels, so that a larger radiating area is obtained, and the radiating efficiency is improved.

2) The radiating tooth piece and the radiating substrate are of an integral structure and have no thermal resistance, so that the radiating efficiency is improved.

3) The two cooling cavities and the design of the corresponding pipelines form an innovative parallel water channel, so that all IGBT power modules can uniformly dissipate heat, the distance between the IGBT power modules can be optimized, the size of the heat dissipation device is reduced, and the production and manufacturing costs are reduced.

Drawings

FIG. 1 is a forward exploded view of a two-module water-cooled plate cooled IGBT power module;

FIG. 2 is an appearance diagram of a double-module water-cooling plate cooling IGBT power module;

FIG. 3 is a reverse exploded view of a dual module water cooled IGBT power module;

FIG. 4 is a schematic view of the flow direction of the cooling liquid inside the dual-mode water-cooling module;

in the figure, 1, a water-cooled substrate; 11. a first cooling chamber; 12. a second cooling chamber; 13. a water outlet; 14. a water inlet; 2. a first heat dissipation module; 3. a second heat dissipation module; 21. a heat-dissipating substrate; 22. a heat dissipating blade; 4. an IGBT power module.

Detailed Description

The technical solution of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution:

a water cooling plate for double modules comprises a water cooling base plate 1, a first heat dissipation module 2 and a second heat dissipation module 3, IGBT power modules 4 to be cooled are respectively and fixedly arranged on the first heat dissipation module 2 and the second heat dissipation module 3, the water-cooled base plate 1 is provided with a first cooling cavity 11 for installing the first heat dissipation module 2 and a second cooling cavity 12 for installing the second heat dissipation module 3, the first cooling cavity 11 and the second cooling cavity 12 are both provided with a water inlet channel and a water outlet channel, the water inlet channel of the second cooling cavity 12 is communicated with the water inlet channel of the first cooling cavity 11 to form a water inlet channel, the water outlet channel of the second cooling cavity 12 is communicated with the water outlet channel of the first cooling cavity 11 to form a water outlet channel, the water-cooling substrate 1 is provided with a water outlet 13 communicated with the water outlet channel and a water inlet 14 communicated with the water inlet channel.

First heat dissipation module 2 and second heat dissipation module 3 by heat dissipation base plate 21 and be located a plurality of heat dissipation teeth 22 on the heat dissipation base plate 21 constitute, the heat dissipation teeth 22 fixed mounting of first heat dissipation module 2 is in first cooling chamber 11, the heat dissipation teeth 22 fixed mounting of second heat dissipation module 3 is in second cooling chamber 12, heat dissipation teeth 22 all will first cooling chamber 11 with second cooling chamber 12 separates into a plurality of mutually independent microchannels, the both ends of microchannel communicate its corresponding cooling chamber place respectively the inlet channel with go out the water course.

Further, the water-cooling substrate 1 is provided with an assembly hole and an IGBT chip mounting screw hole.

Further, the first heat dissipation module 2 and the second heat dissipation module 3 are formed by a scraping process, so that the heat dissipation substrate 21 and the heat dissipation fins 22 are integrally formed.

Further, the heat dissipation fins 22 are perpendicular to the heat dissipation substrate 21.

Further, the heat dissipation fins 22 are parallel to each other and are uniformly spaced.

Further, the sizes of the first heat dissipation module 2 and the second heat dissipation module 3 are the same as the size of the IGBT power module 4 to be cooled.

Furthermore, the inner walls of the water outlet 13 and the water inlet 14 are provided with threads which are convenient for connecting joints, non-drip pipe fittings and other devices.

Further, the heat-dissipating substrate 21 and the heat-dissipating fins 22 are fixedly connected to the water-cooling substrate 1 by using a soldering, friction welding or other mature process.

Furthermore, the first heat dissipation module 2 and the second heat dissipation module 3 are both aluminum alloy heat dissipation modules, and by combining the technical scheme, the aluminum alloy added with any one or more other alloy elements in any proportion can achieve the technical effect of the scheme.

Furthermore, the water is collected through the designed water channel and then returns to the heat exchange device and the cooling tower through the water outlet of the water cooling plate, so that the heat is conveniently recycled and dissipated.

Furthermore, the scheme of combining the water cooling plate for the double modules can also design the water cooling plate for the multiple modules.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

The foregoing is illustrative of the preferred embodiments of the present invention, and it is to be understood that the invention is not limited to the precise forms disclosed herein, and that various other combinations, modifications, and environments may be resorted to, falling within the scope of the invention as defined by the appended claims. But that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the invention, which is to be limited only by the claims appended hereto.

Claims (8)

1. The utility model provides a water-cooling board for bimodulus, includes water-cooling base plate (1), first heat dissipation module (2) and second heat dissipation module (3), treats that refrigerated IGBT power module is fixed mounting respectively on first heat dissipation module (2) and second heat dissipation module (3), its characterized in that: the water-cooling substrate (1) is provided with a first cooling cavity (11) for installing a first heat dissipation module (2) and a second cooling cavity (12) for installing a second heat dissipation module (3), the first cooling cavity (11) and the second cooling cavity (12) are both provided with a water inlet channel and a water outlet channel, the water inlet channel of the second cooling cavity (12) is communicated with the water inlet channel of the first cooling cavity (11) to form a water inlet channel, the water outlet channel of the second cooling cavity (12) is communicated with the water outlet channel of the first cooling cavity (11) to form a water outlet channel, and the water-cooling substrate (1) is provided with a water outlet (13) communicated with the water outlet channel and a water inlet (14) communicated with the water inlet channel;

first heat dissipation module (2) and second heat dissipation module (3) by heat dissipation base plate (21) and be located a plurality of heat dissipation teeth piece (22) on heat dissipation base plate (21) are constituteed, heat dissipation teeth piece (22) fixed mounting is in its cooling chamber that corresponds and separates into a plurality of mutually independent microchannels with this cooling chamber, the both ends of microchannel communicate its corresponding cooling chamber place respectively the inlet channel with the outlet channel.

2. The dual module water cooled panel of claim 1, wherein: the first heat dissipation module (2) and the second heat dissipation module (3) are integrally formed by the heat dissipation substrate (21) and the plurality of heat dissipation tooth sheets (22).

3. The dual module water cooled panel of claim 1, wherein: the heat dissipation fins (22) are perpendicular to the heat dissipation substrate (21).

4. The dual module water cooled panel of claim 1, wherein: the radiating fins (22) are parallel to each other and are evenly spaced.

5. The dual module water cooled panel of claim 1, wherein: the sizes of the first heat dissipation module (2) and the second heat dissipation module (3) are the same as the size of the IGBT power module (4) to be cooled.

6. The dual module water cooled panel of claim 1, wherein: the water outlet (13) and the water inlet (14) are both threaded holes.

7. The dual module water cooled panel of claim 1, wherein: the heat dissipation base plate (21) and the heat dissipation tooth sheets (22) are fixedly connected with the water cooling base plate (1) in a welding mode.

8. The dual module water cooled panel of claim 1, wherein: the first heat dissipation module (2) and the second heat dissipation module (3) are both aluminum alloy heat dissipation modules.

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