CN210040184U

CN210040184U - Microchannel water-cooling plate

Info

Publication number: CN210040184U
Application number: CN201921975687.5U
Authority: CN
Inventors: 常青保
Original assignee: Chengdu Common Radiator Co Ltd
Current assignee: Chengdu Common Radiator Co Ltd
Priority date: 2019-11-15
Filing date: 2019-11-15
Publication date: 2020-02-07
Anticipated expiration: 2029-11-15

Abstract

The utility model relates to a microchannel water-cooling plate, including base and microchannel fin, it has the open-ended cavity to offer the top on the base, the one end of base is opened has the medium entry with the cavity intercommunication, the other end is opened has the medium export with the cavity intercommunication, the microchannel fin includes heat absorption base plate and heat dissipation dentate lamella, heat absorption base plate sealing connection is at the open-top of base department, the lower surface of heat absorption base plate is equipped with the heat dissipation dentate lamella, in the heat dissipation dentate lamella stretched into the cavity, the heat dissipation dentate lamella comprises the fin that the polylith is parallel to each other, form the microchannel between two adjacent blocks of fin, be equipped with power electronic components and parts on the upper surface. The utility model has the advantages that: in the limited volume space, the heat exchange area between the heat dissipation tooth sheet in the water cooling plate flow passage and the medium fluid is large, so that a larger heat exchange area is obtained, and a better heat dissipation effect is achieved; the product has compact structure, saves the structural space of the whole machine, saves the material cost and has high heat dissipation efficiency; low manufacturing cost and easy implementation.

Description

Microchannel water-cooling plate

Technical Field

The utility model relates to a radiator technical field, especially a microchannel water-cooling board.

Background

In recent years, with the development of scientific technology, the technologies available to people, such as convenient mobile technology, 5G mobile communication, intelligent LED street lamps, industrial 4.0 change, the continuous development of the Internet of things, new energy automobile technology and the like, make the life of people more convenient, safe and environment-friendly. High-reliability semiconductor power device products are developing towards miniaturization, high integration, high speed, high efficiency and high power, the semiconductor devices inevitably generate more heat than before, and if the heat dissipation problem of the semiconductor devices is not solved well, the high temperature directly causes the efficiency of the semiconductor devices to be reduced. In order to stabilize the performance of a semiconductor device, the heat dissipation design of the semiconductor device becomes extremely important, otherwise the performance of the device cannot be improved or the device cannot work normally, and the temperature of the semiconductor device exceeds the allowable maximum temperature, thereby causing the device to be damaged.

The existing radiator is generally divided into an air-cooled heat dissipation system and a water-cooled heat dissipation system, the water-cooled heat dissipation system is composed of a water-cooled plate, a water pipe and a water pump, the water-cooled plate is provided with a water inlet and a water outlet, the water inlet and the water outlet form a circulation water path through the water pipe and the water pump, and a cooling water channel is arranged inside the water-cooled plate. At present, as shown in fig. 1, in order to improve a water cooling effect, a water channel of an "M" structure is generally used in a conventional water cooling plate. The existing M-shaped water channel has limited heat exchange surface area, cannot fully utilize the surface of the whole water cooling plate, and has poor heat dissipation effect.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome prior art's shortcoming, provide a microchannel water-cooling board, in finite volume space, obtain the biggest heat exchange area to reach the best radiating effect.

The purpose of the utility model is realized through the following technical scheme:

the utility model provides a microchannel water-cooling plate, includes base and microchannel fin, it has the open-ended cavity to have seted up the top on the base, the one end of base is opened has the medium entry with the cavity intercommunication, and the other end is opened has the medium export with the cavity intercommunication, the microchannel fin includes heat absorption base plate and heat dissipation dentate lamina, heat absorption base plate sealing connection is at the open-top of base department, the lower surface of heat absorption base plate is equipped with the heat dissipation dentate lamina, the heat dissipation dentate lamina stretches into in the cavity, the heat dissipation dentate lamina comprises the fin that the polylith is parallel to each other, forms the microchannel between two adjacent fin, be equipped with power electronic components and parts on the upper surface of heat absorption base plate.

Further, the axis of the medium inlet is coincident with the axis of the medium outlet and is parallel to the length direction of the cavity.

Further, the radiating fins are perpendicular to the heat absorbing substrate, and the extending direction of the micro-channel is parallel to the axis of the medium inlet.

Furthermore, the heat dissipation tooth piece and the heat absorption substrate are of an integrated structure.

Further, the heat absorption substrate is hermetically connected to the top opening of the base in a welding mode.

Further, the welding mode is one of vacuum electron beam welding, diffusion welding or friction stir welding.

Furthermore, the base and the microchannel cooling plate are made of copper or aluminum.

Furthermore, internal threads are arranged on the inner wall of the medium inlet and the inner wall of the medium outlet.

The utility model has the advantages of it is following:

1. the utility model discloses a microchannel water-cooling board is in finite volume space, and the heat dissipation pick in the water-cooling board runner is big with medium fluidic heat exchange area, obtains great heat exchange area to reach better radiating effect.

2. The product has compact structure, saves the structural space of the whole machine, saves the material cost and has high heat dissipation efficiency.

3. The implementation is easy, the related research and development time such as a die does not need to be increased, and the radiating fins can be manufactured according to the thermal design requirement conditions.

Drawings

FIG. 1 is a schematic structural diagram of a conventional water-cooling plate;

FIG. 2 is a schematic view of the assembly structure of the present invention;

FIG. 3 is a schematic view of the explosive splitting structure of the present invention;

FIG. 4 is a schematic structural view of a microchannel heat sink of the present invention;

fig. 5 is a schematic view of the internal structure of the present invention;

FIG. 6 is a schematic cross-sectional view taken along line A-A in FIG. 5;

in the figure: the device comprises a base 1, a cavity 1a, a medium inlet 1b, a medium outlet 1c, a microchannel cooling fin 2, a heat absorption substrate 2a, a cooling toothed sheet 2b and a power electronic component 3.

Detailed Description

The invention will be further described with reference to the accompanying drawings, but the scope of the invention is not limited to the following description.

As shown in fig. 2 to 6, a microchannel water cooling plate comprises a base 1 and microchannel heat sinks 2, wherein the base 1 is provided with a cavity 1a having an opening at the top, one end of the base 1 is provided with a medium inlet 1b communicated with the cavity 1a, the other end is provided with a medium outlet 1c communicated with the cavity 1a, the microchannel heat sinks 2 comprise a heat absorbing substrate 2a and heat dissipating fins 2b, the heat absorbing substrate 2a is hermetically connected to the opening at the top of the base 1, the lower surface of the heat absorbing substrate 2a is provided with the heat dissipating fins 2b, the heat dissipating fins 2b extend into the cavity 1a, the heat dissipating fins 2b are composed of a plurality of heat sinks parallel to each other, a microchannel is formed between two adjacent heat sinks, the microchannel can be a straight channel or a curved channel, the upper surface of the heat absorbing substrate 2a is provided with a power electronic component 3, the power electronic component 3 is a heat source, and generally includes components such as an IGBT and a TEC, which emit a large amount of heat during operation.

Further, as shown in fig. 3 and 6, the axis of the medium inlet 1b coincides with the axis of the medium outlet 1c, and is parallel to the longitudinal direction of the chamber 1 a.

Further, as shown in fig. 4, 5 and 6, the heat radiation fins 2b are perpendicular to the heat absorbing substrate 2a, and the extension direction of the micro channel is parallel to the axis of the medium inlet 1 b.

Further, as shown in fig. 4, the heat dissipation fins 2b and the heat absorption substrate 2a are integrally formed, and have no thermal resistance, so as to ensure high thermal conductivity of the microchannel heat sink 2.

In this embodiment, the heat absorbing substrate 2a is hermetically connected to the top opening of the base 1 by welding. More preferably, the welding mode is one of vacuum electron beam welding, diffusion welding or friction stir welding, the welding modes are more environment-friendly, and the sealing effect after welding completely meets the requirement.

More preferably, the base 1 and the microchannel heat sink 2 are made of copper or aluminum, and both the copper material and the aluminum material have a good heat dissipation effect.

Further, the inner wall of the medium inlet 1b and the inner wall of the medium outlet 1c are both provided with internal threads. According to different flow rate designs of fluid media, different internal thread hole diameters are selected for connecting joints of the fluid media.

The working process of the utility model is as follows: the heat generated by the power electronic component 3 is transferred to the heat absorption substrate 2a, a cooling medium (cooling liquid such as deionized water, pure water, antifreeze and the like) enters the cavity 1a from the medium inlet 1b, and the temperature of the heat dissipation toothed sheet 2b is reduced because the heat dissipation toothed sheet 2b is positioned in the cavity 1a and is contacted with the heat dissipation toothed sheet 2b, so that when the temperature of the heat absorption substrate 2a is higher than that of the heat dissipation toothed sheet 2b, the heat on the heat absorption substrate 2a is transferred to the heat dissipation toothed sheet 2b, and is taken away by the continuous cooling medium and discharged from the medium outlet 1 c.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A microchannel water-cooling plate, characterized in that: comprises a base (1) and a microchannel cooling fin (2), wherein the base (1) is provided with a cavity (1 a) with an opening at the top, one end of the base (1) is provided with a medium inlet (1 b) communicated with the cavity (1 a), the other end is provided with a medium outlet (1 c) communicated with the cavity (1 a), the microchannel heat sink (2) comprises a heat absorbing substrate (2 a) and heat dissipating fins (2 b), the heat absorption substrate (2 a) is hermetically connected with the opening at the top of the base (1), the lower surface of the heat absorption substrate (2 a) is provided with a heat dissipation toothed sheet (2 b), the heat dissipation toothed sheet (2 b) extends into the cavity (1 a), the radiating tooth plates (2 b) are composed of a plurality of radiating fins which are parallel to each other, a micro-channel is formed between every two adjacent radiating fins, and a power electronic component (3) is arranged on the upper surface of the heat-absorbing substrate (2 a).

2. A microchannel water-cooling plate as recited in claim 1, wherein: the axis of the medium inlet (1 b) is coincident with the axis of the medium outlet (1 c) and is parallel to the length direction of the cavity (1 a).

3. A microchannel water-cooling plate as recited in claim 2, wherein: the radiating fins (2 b) are perpendicular to the heat absorbing substrate (2 a), and the extension direction of the micro-channel is parallel to the axis of the medium inlet (1 b).

4. A microchannel water-cooling plate as recited in claim 1, wherein: the heat dissipation tooth piece (2 b) and the heat absorption substrate (2 a) are of an integrated structure.

5. A microchannel water-cooling plate as recited in claim 1, wherein: the heat absorption substrate (2 a) is hermetically connected to the opening at the top of the base (1) in a welding mode.

6. A microchannel water cooled plate as claimed in any one of claims 1 to 5, wherein: the base (1) and the microchannel cooling fins (2) are made of copper or aluminum.

7. A microchannel water-cooling plate as recited in claim 1, wherein: internal threads are arranged on the inner wall of the medium inlet (1 b) and the inner wall of the medium outlet (1 c).