CN115346939A

CN115346939A - Heterogeneous embedded pin fin micro-channel radiator

Info

Publication number: CN115346939A
Application number: CN202210782286.8A
Authority: CN
Inventors: 李春泉; 李雪斌; 阎德劲; 黄红艳; 林奈; 王侨; 王玉斌; 张皓; 成鹏琳
Original assignee: Guilin University of Electronic Technology
Current assignee: Guilin University of Electronic Technology
Priority date: 2022-07-05
Filing date: 2022-07-05
Publication date: 2022-11-15

Abstract

The invention relates to an embedded pin fin micro-channel radiator which mainly comprises a cover plate, a pin fin radiating module and a substrate. The pin fin heat dissipation module of the heat radiator is mainly formed by processing materials with high heat conductivity coefficient, and is mainly characterized in that ribs and pin fins are arranged, a flow channel is formed between the ribs, the pin fins are distributed among the ribs, the pin fin heat dissipation module effectively solves the problem of hot spots, and the heat dissipation capacity of the micro-flow channel heat radiator for local parts is improved. The invention further improves the heat dissipation capability of the micro-channel radiator aiming at local heat sources on the basis of keeping small volume and strong heat exchange capability of the micro-channel, and has higher heat exchange capability and heat exchange limit. The invention has compact structure and good heat exchange capability, and has good application prospect in cooling high-heat-generating equipment such as electronic chips, lasers, rectifiers and the like.

Description

Heterogeneous embedded pin fin micro-channel radiator

Technical Field

The invention relates to a novel micro-channel heat radiator, in particular to an improved micro-channel heat radiator with an embedded pin fin module, which can be used for cooling high-heat-generating equipment such as electronic chips, high-power LEDs and lasers.

Background

A multi-component chip is a component that assembles multiple unpackaged vlsi chips and asics onto a substrate. As the feature size of transistors decreases, the number of transistors that can be integrated on a chip increases, resulting in a chip that generates high heat flux density while generating a large amount of heat. If the heat can not be transferred in time, and the existence of hot spots on the PCB can reduce the service life of electronic components or directly cause the failure of chips along with the improvement of heat flux density.

Disclosure of Invention

In order to solve the above technical problems, an object of the present invention is to provide a novel heterogeneous embedded pin fin micro channel heat sink, which can improve the hot spot problem, enhance the heat dissipation performance, and improve the heat dissipation limit.

In order to achieve the purpose, the technical scheme adopted by the invention is as follows:

the invention relates to a heterogeneous embedded pin fin micro-channel radiator, which comprises a cover plate, a substrate and a pin fin radiating module. The cover plate is provided with a water inlet and a water outlet. The cooling liquid flows in from the water inlet, flows through the pin fin heat dissipation module below the chip and the surrounding common micro flow channels respectively through the shunt, and finally converges at the water outlet to flow out.

The pin fin heat dissipation module is made of materials with good heat conduction performance, such as copper, silver and the like, ribs and pin fin structures are arranged on the pin fin heat dissipation module, and the sizes of the pin fins and the ribs can be determined according to actual requirements and are in millimeter or micrometer scale. The section of the pin fin can be in a shape of circle, square, trapezoid or triangle. The pin fins and the ribs are embedded in the substrate. The pin fin heat dissipation module can be formed by micro-electro-mechanical processing technology and 3D printing.

The pin fin heat dissipation module is embedded in the substrate and sealed and connected through heat conducting glue, welding or the like.

Compared with the traditional micro-channel radiator, the invention has the following characteristics and advantages: for a traditional micro-channel radiator (see fig. 1), the pin fins and the ribs are arranged on the pin fin radiating module, the ribs are used for distributing liquid from the micro-channel into the channels on the pin fin radiating module, the turbulent flow intensity of cooling liquid is increased under the action of the pin fins, and therefore the radiating performance of the micro-channel is enhanced. The comprehensive heat exchange capacity and the heat exchange limit of the radiator are effectively improved.

Drawings

FIG. 1 is a schematic view of a conventional microchannel heat sink

FIG. 2 is a schematic structural diagram of an embodiment of the present invention

FIG. 3 is a schematic view of a cover plate

FIG. 4 is a schematic diagram of a pin fin heat dissipation module according to the present invention

FIG. 5 is a schematic view of a substrate with flow channels

FIG. 6 is a schematic diagram of the operation of the present invention

FIG. 7 is a schematic flow diagram of the coolant of the present invention.

Detailed Description

The present invention will be described in further detail in order to make the objects, technical solutions and advantages of the present invention more apparent. The description herein is intended to be illustrative only and not limiting with respect to the specific embodiments described.

In the present embodiment, a heterogeneous embedded pin fin micro flow channel heat sink is described, as shown in fig. 2, which is composed of a cover plate 1, a pin fin heat dissipation module 2, and a substrate 3.

Referring to fig. 3, the cover plate 1 comprises a water inlet 1-1, a water outlet 1-2 and a pin fin heat dissipation module embedded groove 1-3. The general material of apron is the lower material of coefficient of heat conductivity, adopts LTCC in this embodiment. The positions of the embedded grooves 1-3 on the pin fin heat dissipation module on the back side of the cover plate are combined with a heating device through heat conduction silica gel or heat conduction silicone grease and the like. The cooling working medium adopts deionized water, and flows in from the water inlet 1-1 and flows out from the water outlet 1-2. The depth of the embedding groove on the pin fin heat dissipation module is set to be half of the thickness of the cover plate, the specific size is set according to the material, the strength and the thickness of the cover plate, the main function of the pin fin heat dissipation module is to reduce the thermal resistance of the pin fin heat dissipation module and play a role in positioning by reducing the thickness of the cover plate, and the specific size is determined according to requirements.

Referring to fig. 4, the pin fin heat dissipation module 2 includes pin fins 2-1 and ribs 2-2. The pin fin heat dissipation module is made of copper with high heat conductivity coefficient so as to enhance the heat exchange capability. The pin fins 2-1 on the pin fin heat dissipation module are of cylindrical structures, and the pin fins mainly serve for increasing heat exchange area and destroying laminar flow and thermal boundary layers so as to achieve the effect of enhancing heat dissipation. The height of the ribs 2-2 on the pin fin heat dissipation module is the same as that of the micro flow channels on the substrate, the spacing between the ribs is in millimeter or micron order, the heat exchange capacity is enhanced mainly by increasing the heat exchange area, destroying laminar flow and shunting cooling working media onto the pin fins, and the specific size is determined according to requirements.

Referring to fig. 5, the substrate 3 includes a micro flow channel 3-1, a guide rib 3-2, and a pin fin heat dissipation module lower embedded groove 3-3. The substrate is made of LTCC. The cross-sectional dimension of the micro flow channel is in the millimeter or micron order. The guide ribs are mainly used for guiding the cooling working medium into the pin fins, and the pin fin heat dissipation modules are partially embedded into the lower embedded grooves of the pin fin heat dissipation modules.

Referring to fig. 6, the working schematic diagram of this embodiment can be seen, in which the cooling working medium flows in from the water inlet, passes through the micro flow channel, flows through the pin fin under the action of the guide rib and the rib, collects in the micro flow channel, and finally flows out from the water outlet.

It will be understood by those skilled in the art that the foregoing is merely a preferred embodiment of the present invention, and is not intended to limit the invention, such that any modification, equivalent replacement or improvement made within the spirit and principle of the present invention shall be included within the scope of the present invention.

Claims

1. The utility model provides an embedded pin fin miniflow way radiator which characterized in that, the radiator comprises apron (1), pin fin heat dissipation module (2), base plate (3): the structural layers are sequentially superposed to form the whole radiator through bonding, sintering or welding;

the embedded pin-fin micro-channel heat sink as claimed in claim 1, wherein the cover plate (1) has pin-fin heat sink module embedded slots for positioning and reducing the local cover plate thickness.

2. The embedded pin fin micro flow channel heat sink according to claim 1, wherein the pin fin heat sink module (2) is made of a metal material with good thermal conductivity, and has two structures of pin fins and ribs, the cross-sectional shape of the ribs can be square, trapezoid, or triangle, the cross-sectional shape of the pin fins can be square, circular, trapezoid, or triangle, and the size of the pin fins and the ribs is in the millimeter or micrometer range.

3. The embedded pin fin micro flow channel heat sink as claimed in claim 1, wherein the substrate (3) has guiding ribs for guiding the cooling medium to the pin fin heat sink module and limiting the pin fin heat sink module.

4. The embedded pin fin micro flow channel heat sink of claim 1, wherein the water inlet and outlet can be provided on both the substrate and the cover plate.

5. The embedded pin-fin micro-channel heat sink according to claim 1, wherein the cover plate (1) and the substrate (3) are made of LTCC, and the embedded pin-fin micro-channel heat sink can be used as a substrate or a PCB.