CN115346939A - Heterogeneous embedded pin fin micro-channel radiator - Google Patents

Abstract

The invention relates to an embedded pin-fin micro-channel radiator, which is mainly composed of a cover plate, a pin-fin heat dissipation module and a base plate. The pin fin heat dissipation module of the radiator is mainly processed by high thermal conductivity materials. Its main characteristic structure is ribs and pin fins. The flow channels are formed between the ribs and the ribs, and the pin fins are distributed among them. The pin fin heat dissipation module effectively solves the problem of The problem of hot spots improves the local cooling capacity of the micro-channel radiator. On the basis of retaining the small volume and strong heat exchange capacity of the micro channel, the invention further improves the heat dissipation capacity of the micro flow channel radiator for local heat sources, and has higher heat exchange capacity and heat exchange limit. The invention has compact structure and good heat exchanging ability, and has good application prospect in the cooling of high heat-generating equipment such as electronic chips, lasers and rectifiers.

Description

A Heterogeneous Embedded Pin-fin Microfluidic Heat Sink

technical field

The invention relates to a new type of micro-channel heat sink, especially an improved micro-channel heat sink with an embedded pin-fin module, which can be used for cooling high heat-generating devices such as electronic chips, high-power LEDs and lasers.

Background technique

A multi-component chip is a component that assembles multiple unpackaged VLSI chips and ASIC chips on one substrate. As the feature size of transistors decreases, the number of transistors that can be integrated on a chip is also increasing, resulting in high heat flux density in the chip and generating a large amount of heat at the same time. If the heat cannot be transferred in time, and with the increase of heat flux density, the existence of hot spots on the PCB will reduce the working life of electronic components or directly cause the failure of the chip.

Contents of the invention

In order to solve the above technical problems, the object of the present invention is to provide a novel heterogeneous embedded pin-fin microfluidic heat sink, which can improve the hot spot problem, enhance the heat dissipation performance, and increase the heat dissipation limit.

In order to achieve the above object, the technical scheme adopted in the present invention is as follows:

The heterogeneous embedded pin-fin micro-channel heat sink, cover plate, base plate, and pin-fin heat dissipation module designed by the present invention. A water inlet and a water outlet are arranged on the cover plate. The cooling liquid flows in from the water inlet, flows through the sub-chip fin cooling module and the surrounding ordinary micro-channels respectively, and finally converges at the water outlet to flow out.

The pin fin heat dissipation module is made of materials with good thermal conductivity, such as copper and silver, and has ribs and pin fin structures on it. The size of the pin fins and ribs can be determined according to actual needs, on the order of millimeters or microns. The cross-section of the needle fin can be in the shape of circle, square, trapezoid or triangle. Both pin fins and ribs are embedded in the substrate. The pin-fin cooling module can be formed by micro-electro-mechanical processing technology and 3D printing.

The pin-fin cooling module is embedded in the substrate, sealed and connected by means of heat-conducting adhesive bonding or welding.

Compared with the traditional micro-channel heat sink, the present invention has the following features and advantages: For the traditional micro-channel heat sink (see Figure 1), the present invention adopts pin fins and ribs on the cooling module, and the ribs will be formed by the micro-channel The coming liquid is shunted into the channel on the pin-fin heat dissipation module, and the turbulence intensity of the cooling liquid is increased under the action of the pin-fin to enhance the heat dissipation performance of the micro-channel. At the same time, the pin-fin heat dissipation module adopts materials with low thermal conductivity , so that the coolant can quickly take away the heat. Effectively improve the comprehensive heat transfer capacity and heat transfer limit of the radiator.

Description of drawings

Figure 1 is a schematic diagram of a traditional microchannel radiator

Fig. 2 is a structural schematic diagram of an embodiment of the present invention

Figure 3 Schematic diagram of the cover plate structure

Fig. 4 is a schematic diagram of the pin fin cooling module of the present invention

Figure 5 Schematic diagram of the substrate with flow channels

Fig. 6 working schematic diagram of the present invention

Fig. 7 is a schematic diagram of the cooling liquid flow of the present invention.

Detailed ways

In order to make the object, technical solution and advantages of the present invention clearer, the present invention is further described in detail. The description herein is only used to explain the present invention when referring to specific examples, and does not limit the present invention.

What is described in this embodiment is a heat sink with heterogeneous embedded pin-fin micro-channels, as shown in FIG.

Referring to FIG. 3 , the cover plate 1 includes a water inlet 1-1, a water outlet 1-2, and an embedded groove 1-3 on the pin fin cooling module. The general material of the cover plate is a material with a low thermal conductivity, and LTCC is used in this embodiment. The position of the embedded groove 1-3 on the pin fin heat dissipation module on the back side of the cover plate is combined with the heating device through thermal conductive silicone or thermal grease. The cooling working medium is deionized water, and the cooling working medium flows in from the water inlet 1-1 and flows out from the water outlet 1-2. The depth of the embedding groove on the pin fin cooling module is set to half the thickness of the cover plate. The specific size is set according to the material, strength and thickness of the cover plate. Its main function is to reduce the thermal resistance here by reducing the thickness of the cover plate. The function and the role of positioning, the specific size is determined according to the demand.

Referring to FIG. 4 , the pin fin cooling module 2 includes pin fins 2 - 1 and ribs 2 - 2 . The pin fin cooling module is made of copper with high thermal conductivity to enhance heat transfer capability. The pin fin 2-1 on the pin fin heat dissipation module adopts a cylindrical structure, and the main function of the pin fin is to increase the heat exchange area and destroy the laminar flow and thermal boundary layer to enhance heat dissipation. The height of the ribs 2-2 on the pin-fin heat dissipation module is the same as the height of the micro-channels on the substrate, and the distance between the ribs is on the order of millimeters or microns. The pin fins are used to enhance the heat exchange capacity, and the specific size is determined according to the requirements.

Referring to FIG. 5 , the substrate 3 includes micro-channels 3-1, guide ribs 3-2, and embedded grooves 3-3 under the pin-fin cooling module. The substrate material is LTCC. The cross-sectional size of the microchannel is on the order of millimeters or microns. The function of the guide rib is mainly to introduce the cooling working fluid to the pin fin, and the pin fin heat dissipation module is partially embedded in the embedded groove under the pin fin heat dissipation module.

The working diagram of this embodiment can be seen in Figure 6. The cooling medium flows in from the water inlet, passes through the micro-channel, flows through the pin fins through the action of the guide ribs and ribs, collects in the micro-channel, and finally flows out from the water outlet.

Those skilled in the art can easily understand that the above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention are all Should be included within the protection scope of the present invention.

Claims (5)

1. The utility model provides an embedded pin fin miniflow way radiator which characterized in that, the radiator comprises apron (1), pin fin heat dissipation module (2), base plate (3): the structural layers are sequentially superposed to form the whole radiator through bonding, sintering or welding;

the embedded pin-fin micro-channel heat sink as claimed in claim 1, wherein the cover plate (1) has pin-fin heat sink module embedded slots for positioning and reducing the local cover plate thickness.

2. The embedded pin fin micro flow channel heat sink according to claim 1, wherein the pin fin heat sink module (2) is made of a metal material with good thermal conductivity, and has two structures of pin fins and ribs, the cross-sectional shape of the ribs can be square, trapezoid, or triangle, the cross-sectional shape of the pin fins can be square, circular, trapezoid, or triangle, and the size of the pin fins and the ribs is in the millimeter or micrometer range.

3. The embedded pin fin micro flow channel heat sink as claimed in claim 1, wherein the substrate (3) has guiding ribs for guiding the cooling medium to the pin fin heat sink module and limiting the pin fin heat sink module.

4. The embedded pin fin micro flow channel heat sink of claim 1, wherein the water inlet and outlet can be provided on both the substrate and the cover plate.

5. The embedded pin-fin micro-channel heat sink according to claim 1, wherein the cover plate (1) and the substrate (3) are made of LTCC, and the embedded pin-fin micro-channel heat sink can be used as a substrate or a PCB.

Images