CN207705184U - A kind of radiator - Google Patents
A kind of radiator Download PDFInfo
- Publication number
- CN207705184U CN207705184U CN201721422635.6U CN201721422635U CN207705184U CN 207705184 U CN207705184 U CN 207705184U CN 201721422635 U CN201721422635 U CN 201721422635U CN 207705184 U CN207705184 U CN 207705184U
- Authority
- CN
- China
- Prior art keywords
- heat
- heat dissipation
- sealing plate
- sealing
- driving unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 85
- 238000007789 sealing Methods 0.000 claims abstract description 48
- 229910001338 liquidmetal Inorganic materials 0.000 claims description 24
- 229910045601 alloy Inorganic materials 0.000 claims description 14
- 239000000956 alloy Substances 0.000 claims description 14
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 11
- 229910052733 gallium Inorganic materials 0.000 claims description 11
- 229910000846 In alloy Inorganic materials 0.000 claims description 8
- 229910052738 indium Inorganic materials 0.000 claims description 8
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims description 5
- 229910052797 bismuth Inorganic materials 0.000 claims description 4
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 8
- 238000001816 cooling Methods 0.000 abstract description 5
- 230000005855 radiation Effects 0.000 description 6
- 230000010354 integration Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000010329 laser etching Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052755 nonmetal Inorganic materials 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- PSMFTUMUGZHOOU-UHFFFAOYSA-N [In].[Sn].[Bi] Chemical compound [In].[Sn].[Bi] PSMFTUMUGZHOOU-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a kind of radiator, including：Radiator structure, sealing plate, connecting conduit, driving unit, miniflow guidance tape and heat transferring medium；It is fitted closely between the radiator structure and the sealing plate, for the radiator structure in the one side being bonded with the sealing plate there are groove, the groove is bonded the sealing runner that direction constitutes unicom with the sealing plate along the radiator structure with the sealing plate；The connecting pipe connects the both ends of the driving unit, the miniflow guidance tape and the sealing runner, forms sealing circulation path；The heat transferring medium is sealed in the sealing circulation path, sealing circulation path described in lower edge can be driven to circulate in the driving unit.Further, the radiator further includes heat emission fan, and the heat emission fan is fixed on by support member above the radiator structure.The utility model can effectively improve cooling system integral heat sink efficiency, improve heat dissipation effect, promote the safe and reliable operation of heat source system.
Description
Technical Field
The utility model relates to a thermal control technical field, more specifically relates to a heat abstractor.
Background
Chip technology is an important backbone of the information industry as well as modern industries. The chip industry has developed dramatically over the half century toward a core goal of higher integration, lower cost, and lower energy consumption. With the increase in integration density, the number of transistors on a single chip has risen from thousands to billions four decades ago and continues to move toward higher integration densities following moore's law. However, the issue of heat dissipation is becoming a key bottleneck that limits the further advance to higher performance, higher density and lower power consumption.
Over the last decade, CPU thermal power has shown a spiral trend. CPU heating mainly comes from the joule heating effect of internal elements and the transistor leakage current heating effect, and the higher the integration level is, the larger the leakage power consumption is, the more remarkable the thermal phenomenon is. Too high chip temperature will cause 'electromigration', shortening the life of the CPU, and even direct burning of internal circuitry. Research shows that the service life of the electronic component at high temperature is exponentially reduced along with the rise of the temperature. Therefore, the reasonable heat dissipation technology has a crucial meaning for the stable operation of the high-performance CPU.
Most of the traditional heat dissipation devices are of a pure air-cooled type or adopt a heat pipe structure for heat dissipation. The simple air-cooled heat dissipation device generally includes a base and a plurality of heat dissipation fins extending from the top of the base, wherein the base contacts with the electronic component to absorb heat generated by the electronic component and diffuse the heat to the heat dissipation fins, and the heat dissipation fins dissipate the heat to the ambient air. The heat pipe structure generally includes a pipe shell, a heat exchange medium, and a capillary structure, the capillary structure is disposed in the pipe shell, and the heat exchange medium is sealed in the evacuated capillary structure. When the heat pipe is applied, the first end of the heat pipe is close to the heat source element, the heat exchange medium absorbs heat of the heat source element at the first end and then is changed into gas in a phase mode, then flows to the second end of the heat pipe in a gaseous mode, is changed into liquid in a phase mode after heat dissipation at the second end, and finally flows back to the first end under the action of the capillary structure, so that circular flow heat dissipation is realized.
When the heat source element has small heat productivity, the air-cooled heat dissipation device can meet the heat dissipation requirement, but is difficult to meet the heat dissipation requirement of the electronic element with higher integration level and higher processing speed at present; in the heat dissipation of the heat pipe structure, the heat exchange medium is changed into liquid and then flows back to the first end of the heat pipe through the capillary structure, the heat exchange medium is influenced by the gravity of the heat dissipation medium, the backflow speed is low, and the heat absorption is performed by approaching the heat source element through one end of the heat pipe, so that the overall heat dissipation efficiency is low, and the heat dissipation effect is poor.
SUMMERY OF THE UTILITY MODEL
In order to overcome the above-mentioned problem or solve above-mentioned problem at least partially, the utility model provides a heat abstractor to reach and effectively improve the whole radiating efficiency of cooling system, improve the radiating effect, promote the purpose of heat source system safety, reliable operation.
The utility model provides a heat dissipation device, include: the heat dissipation structure comprises a heat dissipation structure, a sealing plate, a connecting conduit, a driving unit, a micro-flow channel plate and a heat exchange medium; the heat dissipation structure is tightly attached to the sealing plate, one or more grooves are reserved on one surface, attached to the sealing plate, of the heat dissipation structure, and the grooves and the sealing plate form communicated sealing flow channels along the attachment direction of the heat dissipation structure and the sealing plate; the connecting pipeline is connected with the driving unit, the micro-flow channel plate and two ends of the sealed flow channel to form a sealed circulation passage; the heat exchange medium is sealed in the sealed circulation passage and can circularly flow along the sealed circulation passage under the driving of the driving unit.
And the back surface of the heat radiation structure, which is attached to the sealing plate, is provided with a fin-like or fin-like structure.
The heat dissipation structure is arranged to be an annular structure, and the fin-like or fin-like structure is arranged on the inner side or the outer side of the annular structure.
Wherein the heat exchange medium further comprises: a liquid metal.
Wherein the driving unit further includes: an electromagnetic pump.
Wherein the liquid metal is further specifically a gallium-indium alloy, a gallium-based alloy, an indium-based alloy, or a bismuth-based alloy.
Wherein the gallium-indium alloy further specifically comprises gallium and indium in the mass fractions of 75.5% and 24.5%.
Wherein, the micro-flow channel plate is formed by laser etching of a copper plate.
Furthermore, the heat dissipation device further comprises a heat dissipation fan, and the heat dissipation fan is fixed above the annular structure through a support member.
Wherein the liquid metal is also mixed with particles of a given metal or non-metal material.
The utility model provides a pair of heat abstractor adopts liquid metal as heat transfer medium, and combine the miniflow channel technique, through setting up the electromagnetic pump as drive unit, drive liquid metal flows through the miniflow channel board, take away the heat of heat source conduction for the miniflow channel board rapidly, then carry out distal end heat dissipation and circulation to heat radiation structure via connecting tube, in order to reach the purpose of control heat source temperature, can effectively improve the whole radiating efficiency of cooling system, improve the radiating effect, promote heat source system safety, the reliable operation.
Drawings
Fig. 1 is a schematic view of a first view angle structure of a heat dissipation device according to an embodiment of the present invention;
fig. 2 is a schematic view of a second view angle structure of a heat dissipation device according to an embodiment of the present invention;
fig. 3 is a schematic view of a sealed flow channel formed by a heat dissipation structure and a sealing plate according to an embodiment of the present invention;
fig. 4 is a schematic diagram of a micro flow channel plate structure according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the following description will clearly and completely describe the technical solutions of the present invention with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
As an embodiment of the present invention, this embodiment provides a heat dissipation device, refer to fig. 1 and fig. 2, fig. 1 is the utility model discloses a heat dissipation device's first visual angle structure schematic diagram, fig. 2 is the utility model provides a heat dissipation device's second visual angle structure schematic diagram, include: the heat dissipation structure 2, the sealing plate 3, the driving unit 4, the connecting conduit 5, the micro-channel plate 6 and the heat exchange medium 7. Wherein,
the heat dissipation structure 2 is tightly attached to the sealing plate 3, one or more grooves 201 are reserved on one surface, attached to the sealing plate 3, of the heat dissipation structure 2, and the grooves 201 and the sealing plate 3 form communicated sealing flow channels along the attachment direction of the heat dissipation structure 2 and the sealing plate 3; the connecting pipeline 5 is connected with the driving unit 4, the micro-channel plate 6 and two ends of the sealed channel to form a sealed circulation passage; the heat exchange medium 7 is sealed in the sealed circulation path and can circulate along the sealed circulation path under the driving of the driving unit 4.
It is understood that the heat dissipating device of the present embodiment includes several structural parts communicating with each other, a heat dissipating structure 2, a sealing plate 3, a driving unit 4, a connecting duct 5, and a micro flow channel plate 6. Wherein, a surface of the heat dissipation structure 2 is tightly attached to a surface of the sealing plate 3, and one or several grooves 201 are arranged on the surface of the heat dissipation structure 2 attached to the sealing plate 3.
Referring to fig. 3, for the embodiment of the present invention, a heat dissipation structure and a sealing plate constitute a schematic view of a sealing flow channel, the top of the groove 201 in the figure is sealed by the sealing plate 3, a sealing flow channel of the communication of the heat exchange medium 7 at the heat dissipation structure 2 is formed, and the sealing flow channel has two ports. The groove 201 may be provided with a rectangular cross section or a circular arc cross section.
The connecting conduit 5 is connected with the driving unit 4 and the micro flow channel plate 6 and communicated with the heat dissipation structure 2 through two ports connected with the heat dissipation structure 2 to form a complete sealed circulation passage. The heat exchange medium 7 is poured into a sealed circulation path formed by the microchannel plate 6, the drive unit 4, the heat dissipation structure 2, the sealing plate 3, and the connecting duct 5, which are generally fabricated by a microfabrication technique.
In one embodiment, the micro flow channel plate 6 is laser etched from a copper plate. Referring to fig. 4, a schematic diagram of a micro flow channel plate structure according to an embodiment of the present invention is shown. It is understood that the micro flow channel plate 6 of the embodiment of the present invention is generally fabricated by micro-machining technology, such as laser etching of copper plate. Likewise, other materials, such as copper and copper alloys, aluminum and aluminum alloys or silver plates, etc., may be used, and may be formed by other processing methods, such as laser etching, electrochemical etching or water jet cutting, etc. It should be understood that the type of materials and processing methods listed do not limit the scope of the invention.
When in application, the micro flow channel plate 6 is attached to a heat source through a thermal interface material. The heat generated by the heat source is transferred to the heat exchange medium 7 by the micro-flow channel plate 6, the heat exchange medium 7 is driven by the driving unit 4 to flow through the micro-flow channel plate 6, the heat transferred to the micro-flow channel plate 6 by the heat source system is rapidly taken away, and then the heat is transmitted to the heat dissipation structure 2 through the connecting conduit 5 to be dissipated at the far end. The heat exchange medium 7 circularly flows in the sealed circulation passage of the whole heat dissipation system, and the heat conducted by the micro-channel plate 6 is continuously conveyed to the heat dissipation structure 2 to be dissipated, so that the purpose of controlling the temperature of a heat source is achieved.
The embodiment of the utility model provides a pair of heat abstractor, through setting up drive unit to combine the miniflow channel technique, drive heat transfer medium flows through the miniflow channel board, takes away the heat of heat source conduction for the miniflow channel board rapidly, then carries to carry out distal end heat dissipation and circulation to heat radiation structure via connecting tube, with the purpose that reaches control heat source temperature, can effectively improve the whole radiating efficiency of cooling system, improve the radiating effect, promote heat source system safety, reliable operation.
Wherein optionally, referring to fig. 3, the heat dissipation structure 2 is provided with a fin-like or fin structure 202 on the back side attached to the sealing plate 3.
It is understood that, in order to improve the heat dissipation efficiency of the heat dissipation structure 2, it is considered to increase the surface area of the heat dissipation structure 2 in contact with the air. Meanwhile, in order to avoid the increase of the volume of the heat dissipation structure 2 due to the increase of the surface area of the heat dissipation structure 2, the back surface of one surface of the heat dissipation structure 2, which is attached to the sealing plate 3, is provided with a fin-like or fin-like structure.
An embodiment of the utility model provides a pair of heat abstractor through setting up heat radiation structure into class fin or fin structure, can further improve heat abstractor's radiating efficiency, can not bring too big influence to heat radiation structure's volume simultaneously.
In one embodiment, the heat dissipation structure 2 is provided as a ring-like structure with the fin-like or fin-like structure 202 provided inside or outside the ring-like structure.
It will be appreciated that, according to the above embodiment, the heat dissipating structure 2 may be provided as a fin-like or fin-like structure on the back side to which the sealing plate 3 is attached. Meanwhile, in order to make the structure of the heat dissipation mechanism 2 more compact, the heat dissipation mechanism 2 is configured to have an annular structure along the direction of attaching to the sealing plate 3.
That is, the bonded heat dissipation structure 2 and sealing plate 3 are bent in the direction of the heat dissipation structure 2 or in the direction of the sealing plate 3 with the surface of the heat dissipation structure 2 bonded to the sealing plate 3 as a reference plane, thereby forming an annular structure. If the bending direction is the direction of the heat dissipation structure 2, the fin-like or fin-like structure 202 is inside the annular structure; if the bending direction is the direction of the sealing plate 3, the fin-like or fin-like structure 202 is outside the ring-shaped structure.
The ring structure may be a closed ring structure or a near ring structure having a gap. The annular structure can be understood as an annular structure with a plane projection of a circular ring, a square ring or any other set shape.
Wherein optionally, the heat exchange medium 7 further comprises liquid metal. In one embodiment, the driving unit 4 further comprises: an electromagnetic pump.
It is to be understood that the heat exchange medium 7 according to the above-described embodiment is provided as a liquid metal medium. The liquid metal medium has superior electrical conductivity and heat conductivity. The electromagnetic pump is a device which utilizes the interaction of a magnetic field and current in conductive fluid to enable the fluid to generate pressure gradient under the action of electromagnetic force so as to push liquid metal to move, and can provide driving force for the circulating flow of the liquid metal in a sealed circulating passage. In addition, the electromagnetic pump can be used for controlling the flow rate of the liquid metal in the circulating pipeline, so that the electromagnetic pump can be suitable for occasions with different heat flow densities.
Optionally, the liquid metal is further specifically a gallium-indium alloy, a gallium-based alloy, an indium-based alloy, or a bismuth-based alloy.
It is understood that gallium-indium alloys with different proportions can be provided according to the liquid metal in the above embodiments. The liquid metal alloys with different melting points and heat-conducting properties can be obtained by different content proportions. Similarly, other metal materials can be used for the liquid metal, including gallium-based alloys, indium-based alloys, bismuth-based alloys, and the like. Specifically, gallium indium tin alloy or bismuth indium tin alloy, etc. It should be understood that the type of material listed does not limit the scope of the invention.
In one embodiment, the gallium indium alloy is further specifically composed of 75.5 mass percent gallium and 24.5 mass percent indium.
It is understood that the liquid metal used in this embodiment is a gallium-indium alloy consisting of 75.5 mass% of gallium and 24.5 mass% of indium, and the alloy has a melting point of 10.35 ℃ and is in a liquid state at normal temperature. It should be understood that the recited liquid metal mass fraction ratios do not limit the scope of the present invention.
In one embodiment, the liquid metal is also intermixed with particles of a given metallic or non-metallic material.
It will be appreciated that the liquid metal component is modified in order to improve the thermal properties of the liquid metal, such as incorporating particles of a given type and amount of metal or non-metal material into the liquid metal according to the embodiments described above.
Further, the heat dissipation device further comprises a heat dissipation fan 1, and the heat dissipation fan 1 is fixed above the annular structure through a support member.
It is understood that, in order to further improve the heat dissipation efficiency of the heat dissipation structure 2, the heat dissipation fan 1 is provided in the heat dissipation device according to the above-described embodiment. The heat fan 1 is fixed directly above the heat dissipation structure 2 by a support member (not shown in the drawings). When the heat dissipation structure 2 is provided as a ring structure, the heat fan 1 is fixed above the ring structure. When the heat dissipation device operates, the driving unit 4 drives the heat exchange medium 7 to convey the heat absorbed by the heat source of the micro-flow channel plate 6 to the heat dissipation structure 2. At heat dissipation mechanism 2 department, heat dissipation fan 1 cooperates heat dissipation structure 2 to distribute away the heat more fast, reaches the purpose that makes heat transfer medium 7 rapid cooling.
An embodiment of the utility model provides a pair of heat abstractor through setting up the heat dissipation fan in heat dissipation mechanism department, strengthens heat radiation structure's radiating efficiency to further improve heat abstractor's whole radiating efficiency and radiating effect.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (10)
1. A heat dissipating device, comprising: the heat dissipation structure comprises a heat dissipation structure, a sealing plate, a connecting conduit, a driving unit, a micro-flow channel plate and a heat exchange medium;
the heat dissipation structure is tightly attached to the sealing plate, one or more grooves are reserved on one surface, attached to the sealing plate, of the heat dissipation structure, and the grooves and the sealing plate form communicated sealing flow channels along the attachment direction of the heat dissipation structure and the sealing plate;
the connecting conduit is connected with the driving unit, the micro-flow channel plate and two ends of the sealed flow channel to form a sealed circulation passage;
the heat exchange medium is sealed in the sealed circulation passage and can circularly flow along the sealed circulation passage under the driving of the driving unit.
2. The heat dissipating device of claim 1, wherein the heat dissipating structure is provided as a fin-like or fin-like structure on a back side that is attached to the sealing plate.
3. The heat dissipating device of claim 2, wherein the heat dissipating structure is provided as a ring structure, and the fin-like or fin-like structure is provided inside or outside the ring structure.
4. The heat dissipating device of claim 1, wherein the heat exchange medium further comprises: a liquid metal.
5. The heat dissipating device of claim 4, wherein the driving unit further comprises: an electromagnetic pump.
6. The heat dissipating device of claim 4, wherein the liquid metal is further specified as a gallium-indium alloy, a gallium-based alloy, an indium-based alloy, or a bismuth-based alloy.
7. The heat sink as recited in claim 6 wherein the gallium indium alloy further comprises, by mass, 75.5% gallium and 24.5% indium.
8. The heat sink of claim 1, wherein the microchannel plate is laser etched from a copper plate.
9. The heat dissipating device of claim 3, further comprising a heat dissipating fan fixed above the ring structure by a support member.
10. The heat sink of claim 4, wherein the liquid metal is further intermixed with particles of a given metallic or non-metallic material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721422635.6U CN207705184U (en) | 2017-10-30 | 2017-10-30 | A kind of radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721422635.6U CN207705184U (en) | 2017-10-30 | 2017-10-30 | A kind of radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207705184U true CN207705184U (en) | 2018-08-07 |
Family
ID=63021748
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721422635.6U Active CN207705184U (en) | 2017-10-30 | 2017-10-30 | A kind of radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207705184U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109434296A (en) * | 2018-09-26 | 2019-03-08 | 电子科技大学 | A kind of preparation method of fluid channel radiator |
| CN111129919A (en) * | 2019-12-17 | 2020-05-08 | 中国科学院理化技术研究所 | High-power solid laser gain module, laser oscillator and laser amplifier |
-
2017
- 2017-10-30 CN CN201721422635.6U patent/CN207705184U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109434296A (en) * | 2018-09-26 | 2019-03-08 | 电子科技大学 | A kind of preparation method of fluid channel radiator |
| CN111129919A (en) * | 2019-12-17 | 2020-05-08 | 中国科学院理化技术研究所 | High-power solid laser gain module, laser oscillator and laser amplifier |
| CN111129919B (en) * | 2019-12-17 | 2021-10-26 | 中国科学院理化技术研究所 | High-power solid laser gain module, laser oscillator and laser amplifier |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107567248B (en) | Liquid cooling heat radiator | |
| CN106535564B (en) | A kind of liquid cooling heat radiator | |
| CN2736933Y (en) | Liquid metal chip radiator driven by thermoelectric-electromagnetic pump | |
| US20130213612A1 (en) | Heat pipe heat dissipation structure | |
| CN104465562A (en) | Chain type staggered micro-channel structure | |
| CN101764547B (en) | Liquid metal cooled cascade semiconductor temperature difference power generation device | |
| CN205491593U (en) | A heat radiation structure and cooling parts for electronic equipment | |
| CN102478930A (en) | Case back plate with liquid metal heat dissipation mechanism | |
| CN103188912A (en) | Lotus-type regular porous metal microchannel heat sink using liquid metal working medium | |
| CN207705184U (en) | A kind of radiator | |
| CN113437031B (en) | Embedded microchannel heat abstractor based on liquid metal | |
| CN105281198A (en) | Thermal management device of semiconductor laser | |
| CN105491859A (en) | Radiating method, radiating structure and radiating part for electronic equipment | |
| WO2018176535A1 (en) | Novel mechanical pump liquid-cooling heat-dissipation system | |
| CN110146956A (en) | A kind of inside thermotransport micro-structure of optical module | |
| CN202352731U (en) | Self-driven LED heat dissipation device based on liquid metal thermosiphon effect cooling | |
| CN206042666U (en) | Integral liquid metal heat transfer plate | |
| CN109287100B (en) | Liquid metal heat abstractor and electronic equipment | |
| CN104125753B (en) | Integrated cavity type conductive fluid heat expander | |
| CN220123320U (en) | Liquid cooling radiator | |
| CN210040184U (en) | Microchannel water-cooling plate | |
| CN219612082U (en) | Novel water-cooled LED driving power supply | |
| CN115346939A (en) | Heterogeneous embedded pin fin micro-channel radiator | |
| CN211578734U (en) | Heat conducting device for electronic device | |
| CN113923950A (en) | Device and method for cooling high-heat-flux-density device by using magnetic field and micro-channel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |