CN109434296A - A kind of preparation method of fluid channel radiator - Google Patents
A kind of preparation method of fluid channel radiator Download PDFInfo
- Publication number
- CN109434296A CN109434296A CN201811121903.XA CN201811121903A CN109434296A CN 109434296 A CN109434296 A CN 109434296A CN 201811121903 A CN201811121903 A CN 201811121903A CN 109434296 A CN109434296 A CN 109434296A
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- CN
- China
- Prior art keywords
- fluid channel
- radiator
- preparation
- cover board
- coolant liquid
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention belongs to minute yardstick field of radiating, and in particular to a kind of preparation method of fluid channel radiator.The present invention uses laser etching techniques, and direct etching forms fluid channel groove on substrate, using laser ablation one-pass molding, and can be formed directly with the fluid channel grooved inner surface relief fabric of benefit；And the highly regulated of fluid channel grooved inner surface micro-structure can be realized by energy, sweep spacing, scan period and the scan path of control laser.Present invention process is simple, making apparatus relative moderate.
Description
Technical field
The invention belongs to minute yardstick field of radiating, and in particular to a kind of preparation method of fluid channel radiator.
Background technique
As the application of electronic equipment gradually tends to multifunction and micromation, the integrated level of circuit is sharply increased.It generates
Heat also sharply increase, cause heat flow density to increase, in turn result in electronic equipment temperature raising.Electronic equipment long-term work in
Under high temperature, its service life can be shortened, and then electronic equipment is made to fail.According to statistics, electronic equipment failure and service life drop are being caused
In low many factors, temperature is excessively high to occupy significant proportion.Experiment with research shows that: the every raising of the temperature of single semiconductor element
10 DEG C, reliability will reduce by 50%, and the failure more than 55% electronic equipment is caused since temperature is excessively high.
Fluid channel radiator is mentioned as the very promising radiating mode of one of existing electronic device cooling mode from it
Since out, scholars have done a large amount of research in terms of the heat-sinking capability for improving fluid channel radiator.At present mainly by following
Several classes carry out the design of fluid channel radiator: (1) changing the cross sectional shape of fluid channel, such as round, trapezoidal, triangle etc.；(2) change
Become the shape of fluid channel, such as sinusoidal pattern, intermediate partition-type etc.；(3) selection of coolant liquid, such as deionized water, are added in a fluid
Nano-metal particle, low melting point coolant liquid etc.；(4) change (such as fluid channel ditches such as runner inner surface state, smooth, porosity and looseness
The relief fabric of slot inner surface increases the contact area of fluid channel inner surface and coolant liquid, and increasing being capable of band in the unit time
The heat walked).The change that above several aspects are carried out to fluid channel, can improve the thermal diffusivity of fluid channel to a certain extent
Energy.
But the preparation process of fluid channel radiator mostly uses MEMS technology to prepare greatly, need complicated processing step and
Expensive equipment is supported, if desired changes the surface state of fluid channel, it is also necessary to more steps.
Summary of the invention
For above-mentioned there are problem or deficiency, to improve, existing fluid channel radiator preparation process is complicated, making apparatus is high
Expensive problem；The present invention provides a kind of preparation methods of fluid channel radiator, and preparation process is simple, and fluid channel obtained
Radiator can directly form porous structure, realize heat dissipation performance more preferably effect.
The preparation method of the fluid channel radiator, comprising the following steps:
Step 1 prepares preset fluid channel groove by laser ablation on fluid channel substrate or fluid channel cover board, leads to
Energy, sweep spacing, scan period and the scan path of control laser are crossed, realizes fluid channel grooved inner surface porous microstructure
Regulation.Compared to traditional fluid channel preparation method, such as plasma etching, laser ablation can be straight on fluid channel grooved inner surface
Connect the porous structure to form fluctuating.
The coolant liquid entrance of fluid channel is prepared on fluid channel substrate or fluid channel cover board by laser ablation, it is cooling
Liquid entrance is connected to by fluid channel groove；Coolant inlet is external to coolant liquid driving device, cooling liquid outlet by conduit
Next stage cooling device is drawn out to by conduit.
Fluid channel substrate made from step 1 and fluid channel cover board are bonded together by step 2, form fluid channel radiator.
The present invention uses laser etching techniques, and direct etching forms fluid channel groove on substrate, utilizes laser ablation one
Secondary molding, and the fluid channel grooved inner surface relief fabric of beneficial (heat dissipation performance is more preferable) can be formed directly with；And control can be passed through
Energy, sweep spacing, scan period and the scan path of laser processed realize the height tune of fluid channel grooved inner surface micro-structure
Control.Its preparation process is simple, making apparatus relative moderate.
Detailed description of the invention
Fig. 1 is the schematic three dimensional views of embodiment fluid channel radiator；
Fig. 2 is the sectional view of embodiment fluid channel radiator；
Fig. 3 is the fluid channel grooved inner surface SEM figure of embodiment laser ablation preparation；
Fig. 4 is the fluid channel grooved inner surface SEM figure of embodiment DRIE preparation；
Fig. 5 is that two kinds of fluid channel radiators of embodiment are passed through the heat dissipation test comparison chart after coolant liquid.
Appended drawing reference: fluid channel substrate -1, fluid channel cover board -2, fluid channel radiator water inlet/water outlet -3,4, miniflow
Road side wall -5, fluid channel groove -6, fluid channel trench length-a, fluid channel groove width-b.
Specific embodiment
Invention is further described in detail with reference to the accompanying drawings and examples.
Embodiment
Prepare fluid channel radiator as shown in Figure 1, the size of fluid channel substrate 1 and fluid channel cover board 2 is 12mm*
10mm, with a thickness of 0.5mm；The diameter of round coolant liquid entrance 3,4 is 1mm；The length and width of fluid channel groove 6, respectively 5mm,
0.1mm, fluid channel etching depth are 0.3mm.
As shown in Fig. 2, the entrance and exit of round coolant liquid is located at fluid channel substrate both sides of the edge, by being located at fluid channel
The fluid channel groove of lower surface of base plate is connected to；Sealing fluid channel is formed after fluid channel substrate 1 and the alignment bonding of fluid channel cover board 2.
Laser ablation is respectively adopted and deep reaction ion etching (DRIE) prepares the fluid channel radiator.
Fig. 3 is the fluid channel grooved inner surface SEM figure of laser ablation preparation；Fig. 4 is deep reaction ion etching (DRIE) system
Standby fluid channel grooved inner surface SEM figure.The surface that laser ablation known to comparison goes out is compared to the table that deep reaction ion etching goes out
Face has richer pattern, directly forms relief fabric；And DRIE process requirement is reprocessed can just form fluid channel
The relief fabric of grooved inner surface, it is seen that opposite DRIE preparation process needs more preparation process steps if you need to form relief fabric
Suddenly.
Fig. 5 is shown when the power for adding 1.5W to the simulation heat source for being integrated in fluid channel upper surface of base plate, is passed through coolant liquid
(deionized water) flow is 100ml/h, and the temperature of two kinds of embodiment fluid channel simulation heat source surfaces increases comparative situation.It can be seen that micro-
The relief fabric of runner trench inner surface can promote the heat dissipation performance of fluid channel radiator conscientiously.
Claims (2)
1. a kind of preparation method of fluid channel radiator, comprising the following steps:
Step 1 prepares preset fluid channel groove by laser ablation on fluid channel substrate or fluid channel cover board；
The coolant liquid entrance of fluid channel is prepared on fluid channel substrate or fluid channel cover board by laser ablation, coolant liquid enters and leaves
Mouth is connected to by fluid channel groove；Coolant inlet is external to coolant liquid driving device by conduit, and cooling liquid outlet is by leading
Pipe is drawn out to next stage cooling device；
Fluid channel substrate made from step 1 and fluid channel cover board are bonded together by step 2, form fluid channel radiator.
2. the preparation method of fluid channel radiator as described in claim 1, it is characterised in that: by controlling the energy of laser, sweeping
Interval, scan period and scan path are retouched, realizes the regulation of fluid channel grooved inner surface porous microstructure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811121903.XA CN109434296A (en) | 2018-09-26 | 2018-09-26 | A kind of preparation method of fluid channel radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811121903.XA CN109434296A (en) | 2018-09-26 | 2018-09-26 | A kind of preparation method of fluid channel radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109434296A true CN109434296A (en) | 2019-03-08 |
Family
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| CN201811121903.XA Pending CN109434296A (en) | 2018-09-26 | 2018-09-26 | A kind of preparation method of fluid channel radiator |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114734147A (en) * | 2022-03-09 | 2022-07-12 | 五邑大学 | Laser direct writing analysis method, processing method, equipment and storage medium of micro-channel |
| CN115579715A (en) * | 2022-11-18 | 2023-01-06 | 中国航天三江集团有限公司 | Optical element, cooling device and method, cooling flow channel structure and manufacturing method thereof |
| CN115609140A (en) * | 2022-09-20 | 2023-01-17 | 东莞赛诺高德蚀刻科技有限公司 | Vapor chamber preparation method and device based on laser-induced etching |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114734147A (en) * | 2022-03-09 | 2022-07-12 | 五邑大学 | Laser direct writing analysis method, processing method, equipment and storage medium of micro-channel |
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| CN115609140A (en) * | 2022-09-20 | 2023-01-17 | 东莞赛诺高德蚀刻科技有限公司 | Vapor chamber preparation method and device based on laser-induced etching |
| CN115609140B (en) * | 2022-09-20 | 2023-09-05 | 东莞赛诺高德蚀刻科技有限公司 | Soaking plate preparation method and equipment based on laser-induced etching |
| CN115579715A (en) * | 2022-11-18 | 2023-01-06 | 中国航天三江集团有限公司 | Optical element, cooling device and method, cooling flow channel structure and manufacturing method thereof |
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Application publication date: 20190308 |