CN108321135B - A kind of columnar chip enhanced boiling heat transfer micro-structure of combined type and its manufacturing method - Google Patents
A kind of columnar chip enhanced boiling heat transfer micro-structure of combined type and its manufacturing method Download PDFInfo
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- CN108321135B CN108321135B CN201810069645.9A CN201810069645A CN108321135B CN 108321135 B CN108321135 B CN 108321135B CN 201810069645 A CN201810069645 A CN 201810069645A CN 108321135 B CN108321135 B CN 108321135B
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- 238000009835 boiling Methods 0.000 title claims abstract description 46
- 238000012546 transfer Methods 0.000 title claims abstract description 37
- 238000004519 manufacturing process Methods 0.000 title abstract description 7
- 238000000034 method Methods 0.000 claims description 14
- 230000008569 process Effects 0.000 claims description 9
- 230000007797 corrosion Effects 0.000 claims description 8
- 238000005260 corrosion Methods 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 238000001259 photo etching Methods 0.000 claims description 3
- 229920002120 photoresistant polymer Polymers 0.000 claims description 3
- 230000004907 flux Effects 0.000 abstract description 23
- 239000007788 liquid Substances 0.000 description 17
- 239000012530 fluid Substances 0.000 description 11
- 238000005516 engineering process Methods 0.000 description 7
- 238000001802 infusion Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 230000001965 increasing effect Effects 0.000 description 5
- 238000011160 research Methods 0.000 description 4
- 239000013589 supplement Substances 0.000 description 4
- 238000004364 calculation method Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000003014 reinforcing effect Effects 0.000 description 3
- 238000005728 strengthening Methods 0.000 description 3
- 238000009834 vaporization Methods 0.000 description 3
- 230000008016 vaporization Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 208000021760 high fever Diseases 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of columnar chip enhanced boiling heat transfer micro-structure of combined type and its manufacturing methods, heat sink including chip surface, several assembled units are provided on heat sink, each assembled unit is made of five microtrabeculaes, assembled unit center is cylindrical micro-pillars, the surrounding of cylindrical micro-pillars is symmetrically arranged with four I-shaped microtrabeculaes, each I-shaped microtrabeculae is identical parabolic surface towards cylindrical micro-pillars and backwards to two faces of cylindrical micro-pillars, other two side and top surface are plane, and an I-shaped microtrabeculae is shared between every two adjacent assembled unit.The present invention can greatly increase steam bubble nucleus of boiling number, significantly improve nucleate boiling heat exchange property and critical heat flux density.
Description
Technical field
The invention belongs to superelevation heat flow density boiling enhanced heat exchange technologies, are related to a kind of suitable for the micro- electricity of superelevation heat flow density
Sub- chip efficient cooling technology, and in particular to a kind of columnar chip enhanced boiling heat transfer micro-structure of combined type and its manufacturer
Method.
Background technique
With the high speed development of MEMS semiconductor packaging, the size of electronic component is constantly reducing, work
Frequency is higher and higher, however the two change brings be electronic device heat flow density be continuously improved, heat dissipation problem at
Restrict the key that electronic device integrated level further increases.Therefore the heat dissipation problem for efficiently solving electronic device becomes current electricity
The key technology of sub- device manufacture.
Currently, carrying out the cooling extensive concern for having caused lot of domestic and international scholar to electronic chip using liquid, especially will
Electronic chip is directly immersed in non-conductive liquid, is cooled down in the way of boiling phase-change heat transfer to it.But compare water
For, non-conductive liquid generally wall surface wetting characteristics with higher and lower boiling heat transfer coefficient, surface heat transfer thermal resistance at
For the dominant thermal resistance of the total diabatic process of electronic chip, therefore, boiling heat transfer is improved using strengthening surface technology seems especially heavy
It wants.
For strengthening electronic chip boiling heat transfer, lot of domestic and foreign scholar has conducted extensive research work, wherein strengthening table
Face structure is a kind of effectively raising critical heat flux density, reduces the method for wall superheat degree.With the hair of micro-processing technology
Exhibition, enhanced surface features research enter the minute yardstick epoch, due to micro-structure surface chip boiling heat transfer when microchannel table
Face power and viscous force are opposite to act on enhancing, and the effect of inertia force becomes smaller, therefore the heat exchange efficiency of micro-structure surface chip can be with
It greatly improves.
Initial smooth chip is due to its nucleus of boiling is few, and the effect is relatively poor for boiling heat transfer, and boiling curve is oblique
Rate very little, critical heat flux density are low, it is easy to form film boiling and lead to heat transfer deterioration.Micro-channel structure is processed on chip
The vaporization nucleus calculation of chip wall surface can effectively be increased, the heat exchange in chip low-heat current density area has obtained significant reinforcing, but
Be due to not being connected between its conduit, and the flow resistance in conduit with conduit length increase and gradually increase so that conduit
Interior fluid infusion is difficult, therefore chip leads to heat transfer deterioration in the film boiling easy to form of high heat flux density area.
Wei Jinjia and Honda etc. conducts in-depth research square column micro-structure surface, and discovery is interconnected using this
Microchannel, critical heat flux density value can be improved significantly, and very steep in high heat flux density area boiling curve, wall surface
Temperature is more stable, and wall surface temperature is far below the ceiling temperature of chip operation when reaching critical heat flux density.But this square column is micro-
Structure is limited by the shape and arrangement mode of its own microtrabeculae, will lead to the flowing of liquid microchannel between micro-structure square column
Resistance is very big, causes it relatively difficult in the fluid infusion in high heat flux density area.
Cylinder micro-structure surface can well solve the big problem of flow resistance, but due to microchannel in fluid infusion table
Face power and viscous force play an important role, and cylinder micro-structure is while reducing flow resistance but also its capillary pump
Power reduces, therefore there is also some problems for fluid infusion of this micro-structure surface in high heat flux density area.Therefore how to improve " capillary
This problem of pressure head increase synchronous with flow resistance or synchronous reduction " is the electronic devices surface boilings such as further reinforcing chip
The key factor of heat exchange.
In recent years the study found that heat exchange surface generates big in high heat flux density area or when close to critical heat flux density
Measure gas and be detached from heat exchange surface, the frictional resistance between gas-liquid two-phase significantly increases, thus increase fresh liquid perpendicular to
Supply difficulty on heat exchange surface direction, this is that critical heat flux density is caused to be difficult to the main reason for further increasing.Therefore subtract
Gas is detached from channel and liquid feed channel and separated by frictional resistance between the small gas-liquid two-phase perpendicular on heat exchange surface direction,
To further increasing heat exchange surface high heat flux density area's heat exchange property and critical heat flux density plays an important role.
Summary of the invention
For existing enhanced surface features to deficiency and defect existing for superelevation heat flow density electronic device cooling, the present invention
Provide a kind of columnar chip enhanced boiling heat transfer micro-structure of combined type and its manufacturing method.The present invention is imitated with high heat transfer
Rate increases the effect of capillary pressure head, reduces flow resistance, increase the advantage of critical heat flux density.
In order to achieve the above objectives, the present invention adopts the following technical scheme:
A kind of columnar chip enhanced boiling heat transfer micro-structure of combined type, the heat sink including chip surface, on heat sink
Several assembled units are provided with, each assembled unit is made of five microtrabeculaes, and assembled unit center is cylindrical micro-pillars, cylindrical
The surrounding of microtrabeculae is symmetrically arranged with four I-shaped microtrabeculaes, and each I-shaped microtrabeculae is towards cylindrical micro-pillars and backwards to cylindrical micro-
Two faces of column are identical parabolic surface, and other two side and top surface are plane, and every two adjacent combination is single
An I-shaped microtrabeculae is shared between member.
Further, the assembled unit is distributed on heat sink in array.
Further, the height h of each assembled unit is 50 μm~200 μm.
Further, the radius r of cylindrical micro-pillars is 10 μm~20 μm, and the central point and surrounding of cylindrical micro-pillars are I-shaped
The distance t of vertex of a parabola on microtrabeculae parabolic surface is 2.5r, the long W of the straight flange of I-shaped microtrabeculae and cylindrical micro-pillars
The distance between central point and two sides of parabolic surface m are 2r.
Further, the subtended angle α between two sides of the central point of cylindrical micro-pillars and parabolic surface is 60 °, cylindrical
Subtended angle β between the central point of microtrabeculae and the straight flange of two adjacent I-shaped microtrabeculaes is 30 °.
Further, distance is between the central point of adjacent cylindrical micro-pillars
A kind of manufacturing method of the columnar chip enhanced boiling heat transfer micro-structure of combined type, comprising the following steps:
Step 1: the mask pattern of photoetching process is made according to designed assembled unit dimensional parameters；
Step 2: by silicon chip by addition photoresist coating, exposure, dry corrosion and removal resist coating mistake
The mask pattern that step 1 obtains accurately is transferred on chip by Cheng Hou, by controlling the time of dry corrosion process, is obtained pre-
The etching depth of phase.
Compared with prior art, the invention has the following beneficial technical effects:
Vaporization nucleus can be greatly increased using the chip enhanced boiling heat transfer structure of combined type columnar microstructure of the invention
Calculation mesh significantly improves nucleate boiling heat exchange property and critical heat flux density.
Using the chip enhanced boiling heat transfer structure of combined type columnar microstructure of the invention, on the one hand guarantee interconnection
Fluid inlet position is relatively narrow, and spot size is wider among channel, the fluid capillary pump suction enhancing of lateral fluid infusion, fresh liquid
Body can be supplied in time by big capillary pump suction；The intermediate spot size of another aspect channel design is wider, reduces
The flow resistance of fluid can increase the supply capacity of fresh liquid while reducing nucleate boiling bubble and being detached from resistance.
This structure can strengthen the boiling heat transfer performance in high heat flux density area significantly, greatly improve the critical of chip boiling heat transfer
Heat flow density, for having the chip boiling heat transfer of superelevation critical heat flux density with very big attraction.
Every four I-shaped microtrabeculaes are vertical direction perpendicular to the spaced rectangular cavity of the plane composition of bottom surface
Fresh liquid supplement provides channel, and it is the curved channel in assembled unit that gas, which is detached from channel, allow bubble be detached from path and
Liquid supplements path separation, efficiently reduces the frictional force between gas-liquid two-phase in this way, can greatly strengthen high heat flux density area
Boiling heat transfer performance, postpone conversion of the nucleate boiling to film boiling, to improve critical heat flux density.
Detailed description of the invention
Fig. 1 is the three dimensional structure diagram of combined type columnar microstructure reinforced element of the invention；
Fig. 2 is the plan view of combined type columnar microstructure reinforced element of the invention；
Fig. 3 is assembled unit specific size schematic diagram of the invention.
Wherein, 1, heat sink；2, cylindrical micro-pillars；3, I-shaped microtrabeculae.
Specific embodiment
Present invention is further described in detail with reference to the accompanying drawing:
Referring to Fig. 1 to Fig. 3, it is an object of the invention to utilize " to increase nucleus of boiling number, enhance capillary force, subtract simultaneously
Small flow resistance, separates that bubble is detached from and liquid supplements path " enhanced heat exchange principle, provide it is a kind of there is high heat transfer efficiency,
Increase the effect of capillary pressure head, reduce flow resistance, the chip for increasing the microtrabeculae variable curvature type face of critical heat flux density strengthens boiling
Rise heat exchange structure, heat sink 1 including chip surface and heat sink 1 process above with dry corrosion technology to be formed it is several
A assembled unit, assembled unit are distributed in array, each assembled unit is made of five microtrabeculaes, each assembled unit center
It for a cylindrical micro-pillars 2, is surrounded on four sides by four identical I-shaped microtrabeculaes 3, each I-shaped microtrabeculae 3 is towards cylindrical micro-
Column 2 and backwards to cylindrical micro-pillars 2 two faces be identical parabolic surface, other two side and top surface are plane,
And an I-shaped microtrabeculae 3 is shared between every two adjacent assembled unit.
Chip enhanced boiling heat transfer structure of the invention has enough vaporization nucleus calculations, can greatly improve nucleate boiling
The heat transfer efficiency of heat exchange.The variable cross-section arc formed between the parabolic surface and cylindrical surface of combined type micro-structure of the invention is logical
Road is conducive to increase its capillary pump suction when lateral fluid infusion, while the inhomogeneities of curved channel distribution also helps the de- of bubble
From.The vertical spaced rectangular cavity of every four I-shaped microtrabeculaes provides channel for the fresh liquid supplement of vertical direction,
So that bubble is detached from channel and fluid infusion channel separation, efficiently reduces the frictional force between gas-liquid two-phase, can greatly strengthen high fever
The boiling heat transfer in current density area improves critical heat flux density.
Below with reference to embodiment, the present invention will be described in detail:
If structure of the invention includes the heat sink 1 of chip surface and is formed in heat sink 1 above with dry rot etching technique
Dry assembled unit, and assembled unit is distributed in array, each assembled unit is made of 5 microtrabeculaes, and assembled unit center is
One cylindrical micro-pillars 2,2 surrounding of cylindrical micro-pillars are surrounded by four identical I-shaped microtrabeculaes 3, each I-shaped microtrabeculae 3 towards
Cylindrical micro-pillars 2 and backwards to cylindrical micro-pillars 2 two faces be identical parabolic surface, other two side and top surface are equal
For plane, and an I-shaped microtrabeculae 3, the length A and width B root of heat sink 1 are shared between every two adjacent assembled unit
Depending on chip size, A=B=10mm in the present embodiment, when research achievement shows that microstructure height is 50~200 μm, surface
Boiling heat transfer best performance；One timing of height is being kept, lesser microstructure size can significantly increase heat exchange area, play more
Enhanced heat transfer effect well；Channel between microtrabeculae can effectively reduce fluid resistance when being curved surface, enhance liquid supply capacity, from
And improve the critical heat flux density on surface.In addition, mature minimum 10 μm of the attainable accurate dimension of dry corrosion processing technology
Left and right.Each assembled unit height can be determined under the conditions of taking into account heat exchange property reinforcing and difficulty of processing according to information above
H is 50 μm~200 μm, and assembled unit central cylindrical microtrabeculae radius r is 10 μm~20 μm, cylindrical micro-pillars central point and surrounding
The distance t of I-shaped microtrabeculae vertex of a parabola be 2.5r, the long W of straight flange of four uniformly distributed I-shaped microtrabeculaes of assembled unit surrounding,
Two side distance m of cylindrical micro-pillars central point and parabolic surface are 2r, and the central point and parabola of cylindrical micro-pillars 2 are bent
Subtended angle α between the side Liang Tiao of face is 60 °, between the central point of cylindrical micro-pillars 2 and the straight flange of two adjacent I-shaped microtrabeculaes 3
Angle beta is 30 °, and the distance between cylindrical micro-pillars central point is
The manufacturing method of the chip enhanced boiling heat transfer structure of combined type columnar microstructure, includes the following steps:
Step 1: making the mask pattern of photoetching process according to designed chip surface microstructure size parameter；
Step 2: by silicon chip by addition photoresist coating, exposure, dry corrosion and removal resist coating etc.
After process, the mask pattern that the first step obtains accurately is transferred on chip, and by the time of control dry corrosion process, is obtained
To expected etching depth.Size, graph outline and the arrangement of combined type columnar microstructure on mask plate being capable of essences
It really is transferred on silicon chip, and is not in the recessed defect in side.
Claims (7)
1. a kind of columnar chip enhanced boiling heat transfer micro-structure of combined type, which is characterized in that the heat sink including chip surface
(1), several assembled units are provided on heat sink (1), each assembled unit is made of five microtrabeculaes, and assembled unit center is circle
Cylindricality microtrabeculae (2), the surrounding of cylindrical micro-pillars (2) are symmetrically arranged with four I-shaped microtrabeculaes (3), each I-shaped microtrabeculae (3) face
To cylindrical micro-pillars (2) and backwards to cylindrical micro-pillars (2) two faces be identical parabolic surface, other two side and
Top surface is plane, and an I-shaped microtrabeculae (3) is shared between every two adjacent assembled unit.
2. the columnar chip enhanced boiling heat transfer micro-structure of a kind of combined type according to claim 1, which is characterized in that institute
Several assembled units are stated to be distributed on heat sink (1) in array.
3. the columnar chip enhanced boiling heat transfer micro-structure of a kind of combined type according to claim 1, which is characterized in that every
The height h of a assembled unit is 50 μm~200 μm.
4. the columnar chip enhanced boiling heat transfer micro-structure of a kind of combined type according to claim 1, which is characterized in that circle
The radius r of cylindricality microtrabeculae (2) is 10 μm~20 μm, the central point and the I-shaped microtrabeculae of surrounding (3) parabola of cylindrical micro-pillars (2)
The distance t of vertex of a parabola on curved surface is 2.5r, the long W of straight flange of I-shaped microtrabeculae (3) and the center of cylindrical micro-pillars (2)
The distance between point and two sides of parabolic surface m are 2r.
5. the columnar chip enhanced boiling heat transfer micro-structure of a kind of combined type according to claim 4, which is characterized in that circle
Subtended angle α between two sides of central point and parabolic surface of cylindricality microtrabeculae (2) is 60 °, the central point of cylindrical micro-pillars (2) with
Subtended angle β between the straight flange of two adjacent I-shaped microtrabeculaes (3) is 30 °.
6. the columnar chip enhanced boiling heat transfer micro-structure of a kind of combined type according to claim 4, which is characterized in that phase
Distance is between the central point of adjacent cylindrical micro-pillars (2)
7. a kind of manufacturer of the columnar chip enhanced boiling heat transfer micro-structure of the described in any item combined types of claim 4-6
Method, which comprises the following steps:
Step 1: the mask pattern of photoetching process is made according to designed assembled unit dimensional parameters；
Step 2: by silicon chip by addition photoresist coating, exposure, dry corrosion and removal resist coating process
Afterwards, the mask pattern that step 1 obtains accurately is transferred on chip, by controlling the time of dry corrosion process, it is expected that
Etching depth.
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| CN109378303B (en) * | 2018-08-21 | 2024-03-22 | 华北电力大学（保定） | Micro-needle rib cluster array micro-channel micro-heat exchanger |
| CN110707059B (en) * | 2019-09-26 | 2020-12-22 | 上海交通大学 | Multi-dimensional mesh-shaped mixed micro-channel fluid radiator |
| CN116487269A (en) * | 2020-08-26 | 2023-07-25 | 曙光数据基础设施创新技术(北京)股份有限公司 | Preparation method of chip heat dissipation structure |
| CN112492853B (en) * | 2020-12-03 | 2021-12-28 | 西安交通大学 | Liquid cavity heat dissipation device based on pool boiling heat dissipation |
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| JPS59202657A (en) * | 1983-04-29 | 1984-11-16 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | Integral structure heat sink |
| CN101402446B (en) * | 2008-11-06 | 2011-06-01 | 西安交通大学 | Method for manufacturing drag reduction surface |
| US9425124B2 (en) * | 2012-02-02 | 2016-08-23 | International Business Machines Corporation | Compliant pin fin heat sink and methods |
| CN102683305B (en) * | 2012-05-14 | 2014-12-10 | 西安交通大学 | Chip reinforced boiling heat transfer structure of multi-pore microcolumn variable camber molded surfaces |
| CN106102414B (en) * | 2016-06-22 | 2019-01-15 | 西安交通大学 | A kind of parent of compound columnar microstructure/hydrophobic enhanced boiling heat transfer piece |
| CN106653711A (en) * | 2016-10-27 | 2017-05-10 | 湖北工程学院 | Cooling device with internal micro-channel heat sink module |
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