CN110610911B - Novel three-dimensional uniform distribution manifold type microchannel - Google Patents
Novel three-dimensional uniform distribution manifold type microchannel Download PDFInfo
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Abstract
The invention discloses a novel three-dimensional uniform flow distribution manifold type microchannel, which relates to the technical field of heat dissipation and cooling of electronic components and comprises a pore plate, a manifold plate, a microchannel, a water storage area, a water injection hole, a water outlet channel and a water inlet channel; the orifice plate lower surface evenly is equipped with the water injection hole, leaves the water storage area in certain space between water injection hole to the orifice plate, and the orifice plate side is equipped with exhalant canal, and the orifice plate top is equipped with inhalant canal, and the branch manifold plate sets up in the orifice plate bottom. The invention adopts the inlet section effect and the header effect, shortens the flow length of the fluid in the microchannel, enhances the flow heat exchange, improves the surface temperature uniformity of the heat source, reduces the occurrence of hot spots, enhances the heat dissipation capacity of the high heat flow density surface, and further improves the use stability of the electronic component.
Description
Technical Field
The invention relates to the technical field of heat dissipation and cooling of electronic components, in particular to a novel three-dimensional uniform flow distribution manifold type microchannel.
Background
The current global problems about environment and energy are increasingly serious, and how to greatly improve the effective utilization rate of non-renewable energy sources such as coal, petroleum, natural gas and the like and reduce heat loss becomes a problem to be solved urgently. Meanwhile, with the advent of miniaturization technology, high-power integrated circuits are rapidly developed, and the cooling heat flux density of electronic chips breaks through kW/cm2In order of magnitude, excessive temperatures can damage semiconductor nodes and circuit connections, increase resistance, and even cause mechanical stress damage. As the temperature non-uniformity of the electronic components increases, the system reliability may decrease dramatically. The conventional convective and conductive cooling method cannot meet the development requirements of new generation integrated circuits, and thus a more efficient chip cooling method is urgently needed.
In conventional electronic cooling, the presence of thermal interface material between the chip and the remote heat sink increases the thermal conduction resistance and thus makes it difficult to maintain the temperature of the chip surface within a safe operating range. As shown in fig. 1, recently, the remarkable heat exchange effect and heat exchange performance of efficient and compact microchannels have attracted much attention, and microchannels are generally defined as heat sinks with equivalent size less than 1mm, and are widely used in the fields of electronic chip cooling, air conditioning, aerospace, nuclear reactors and the like. The embedded cooling of etching the microchannel on the back of the semiconductor substrate eliminates multilayer thermal resistance caused by a traditional cooling thermal interface material, compared with a traditional heat exchange device, the microchannel heat sink has the characteristics of high heat exchange efficiency, more stable operation, low manufacturing cost, long service life and the like, and has wide development prospect as a heat exchange mode.
In addition, a great deal of research shows that the multi-end short channel has better heat exchange performance than a single-section long channel, and meanwhile, the two-phase heat exchange is increased in temperature uniformity compared with the single-phase flow heat exchange. As shown in fig. 2, considering that the fluid inlet section has a thin flow boundary layer and a good heat exchange effect, in order to fully utilize the inlet section effect and reduce the length of the flow section, a large number of manifold-type microchannels are used for achieving the purpose of eliminating high heat flow dissipation. The manifold microchannel heat exchanger consists of a manifold plate and a microchannel substrate, wherein alternating liquid supplementing runners and steam collecting runners are arranged on the manifold plate and are vertically placed on the microchannel substrate, fluid firstly enters from the liquid supplementing runners on the manifold plate and flows downwards into the microchannel to be heated and evaporated to form steam, and the steam then flows out through the steam collecting runners on the manifold plate. The manifold microchannel heat exchanger has many excellent performances, such as higher heat exchange coefficient, small pressure drop, vapor-liquid separation and the like, and has wider application background in the field of microsystems, so that more and more researchers turn the attention to the research of flow heat exchange in the manifold microchannel, how to further innovate and optimize the structure of the manifold microchannel heat exchanger is a hot problem in the field at present.
However, the conventional microchannel and the conventional manifold microchannel have the following problems:
1. because the temperature of the fluid is increased along with the increase of the length of the flow channel, the temperature distribution uniformity of the traditional micro-channel is poor, and the hot spot problem exists, so that the service efficiency and the service life of electronic components are influenced, and the system maintenance and processing and manufacturing cost is increased;
2. the traditional micro-channel and the traditional manifold micro-channel are uneven in fluid distribution, and the flow of fluid entering each flow channel is inconsistent, so that the imbalance of flow resistance is caused, and finally, the temperature of some points is overhigh and the temperature distribution of the whole surface is uneven, and the service life of electronic components is also influenced;
3. the inlet of the traditional micro-channel is arranged in parallel to the flow direction of the micro-channel, which belongs to the one-dimensional flow problem; the traditional manifold type microchannel inlet is arranged on a plane vertical to the flow direction of the microchannel, and belongs to the problem of two-dimensional flow; the two dimensions are single, and certain adverse effect is caused on the uniformity of fluid flow distribution.
Therefore, those skilled in the art are dedicated to develop a novel three-dimensional uniform distribution manifold type microchannel, which solves the problems of uneven temperature distribution, uneven fluid distribution, single dimension of microchannel structure and the like in the existing chip heat dissipation and cooling technology, enhances flow heat exchange, improves the surface temperature uniformity of a heat source, reduces hot spots, enhances the heat dissipation capacity of a high heat flow density surface, and further improves the use stability of electronic components.
Disclosure of Invention
In view of the above defects in the prior art, the technical problem to be solved by the present invention is how to enhance the flow heat exchange, improve the surface temperature uniformity of the heat source, reduce the occurrence of hot spots, and enhance the heat dissipation capability of the high heat flow density surface, thereby improving the use stability of the electronic component.
In order to achieve the purpose, the invention provides a novel three-dimensional uniform flow distribution manifold type microchannel, which comprises a pore plate, a manifold plate, a microchannel, a water storage area, a water injection hole, a water outlet channel and a water inlet channel; the orifice plate lower surface evenly is equipped with the water injection hole, shown water injection hole extremely leave certain space between the orifice plate the water storage area, the orifice plate side is equipped with exhalant canal, the orifice plate top is equipped with inhalant canal, branch manifold plate sets up the orifice plate bottom.
Furthermore, the water injection hole, the water outlet channel and the water inlet channel are etched on the pore plate in a laser etching mode, and then the shunting manifold plate is formed.
Further, the water injection hole sequence and the water outlet channel sequence are alternately arranged at the upper end of the pore plate.
Furthermore, the micro-channel is etched on the back surface of the silicon-based chip by adopting a method comprising a wet etching method and a laser etching method.
Further, the orifice plate is a flat plate, and the material comprises a glass plate and a silicon substrate.
Furthermore, the invention is formed by bonding the branch board and the chip engraved with the micro-channel.
Furthermore, the water inlet channel is used for injecting cold liquid, the water outlet channel is used for discharging hot gas, and the liquid supply and exhaust channels are separated.
Furthermore, the header effect is formed in the water storage area, so that the flow entering the water injection holes is uniformly distributed, and the initial temperature is consistent.
Further, the manifold plate is used for reducing the flow length of fluid in the micro-channel, and the flow resistance is reduced by utilizing the inlet section effect.
Furthermore, the invention can be used together with a jet flow heat dissipation technology, and further realizes high-efficiency and low-consumption heat management of the high-heating-power electronic component on the basis of the existing invention technology.
In a preferred embodiment of the present invention, the water injection holes are uniformly arranged on the lower surface of the pore plate, a water storage area with a certain space is left between the water injection holes and the pore plate, a third dimension structure is added, a header effect generated by the water storage area is utilized, and the microchannel is subjected to fluid infusion in a multi-dimension and multi-angle manner, so that the flow injected into the water injection holes is uniformly distributed, the initial temperature is uniform, the flow of the fluid entering the microchannel is uniform, and meanwhile, the cold fluid with lower initial temperature is continuously injected to keep the temperature in the microchannel at a lower level, thereby greatly improving the uniformity of the surface temperature of the heat source, reducing the occurrence of hot spots, and improving the use stability of the electronic component.
In another preferred embodiment of the present invention, the water outlet channel is disposed on the side surface of the orifice plate, the water inlet channel is disposed on the top of the orifice plate, and the water inlet channel and the water outlet channel are separated from each other, so that channels of the inlet cold fluid and the outlet hot fluid are not interfered with each other, evaporation is promoted, increase of flow resistance and heat exchange caused by possible mixing of the inlet cold fluid and the outlet hot fluid in a flowing process are reduced, temperature uniformity is increased by using two-phase heat exchange, heat exchange efficiency is improved, and flow resistance is reduced. Meanwhile, the manifold plate is arranged at the bottom of the pore plate, so that the inlet section effect is effectively utilized, the flow length of fluid in the micro-channel is shortened, the temperature of the fluid is prevented from increasing along with the increase of the flow length, the resistance in a flow channel is reduced, the pump work required by a system is reduced, and the heat dissipation capacity of the high heat flow density surface is enhanced.
The conception, the specific structure and the technical effects of the present invention will be further described with reference to the accompanying drawings to fully understand the objects, the features and the effects of the present invention.
Drawings
FIG. 1 is a schematic diagram of a conventional manifolded configuration of a novel three-dimensional uniform flow distribution manifolded microchannel according to a preferred embodiment of the invention;
FIG. 2 is a schematic diagram of a conventional single straight structure of a novel three-dimensional uniform flow distribution manifold-type microchannel according to a preferred embodiment of the present invention;
FIG. 3 is a schematic view of a novel structural orifice plate split-flow manifold plate of the novel three-dimensional uniform split-flow manifold microchannel of a preferred embodiment of the invention;
FIG. 4 is a schematic diagram of a microchannel with a novel structural composition of a novel three-dimensional uniform flow distribution manifold microchannel according to a preferred embodiment of the invention;
FIG. 5 is an assembly view of the novel structure of the novel three-dimensional uniform distribution manifold microchannel of a preferred embodiment of the present invention;
FIG. 6 is a schematic view of the external fluid flow direction of the novel structure of the novel three-dimensional uniform flow distribution manifold microchannel according to a preferred embodiment of the present invention;
fig. 7 is a schematic diagram of the direction of fluid flow within the unit of the novel structure of the novel three-dimensional uniform flow-dividing manifolded microchannel according to a preferred embodiment of the invention.
The device comprises a 1-pore plate, a 2-branch plate, a 3-microchannel, a 4-water storage area, a 5-water injection hole, a 6-water outlet channel and a 7-water inlet channel.
Detailed Description
The technical contents of the preferred embodiments of the present invention will be more clearly and easily understood by referring to the drawings attached to the specification. The present invention may be embodied in many different forms of embodiments and the scope of the invention is not limited to the embodiments set forth herein.
In the drawings, structurally identical elements are represented by like reference numerals, and structurally or functionally similar elements are represented by like reference numerals throughout the several views. The size and thickness of each component shown in the drawings are arbitrarily illustrated, and the present invention is not limited to the size and thickness of each component. The thickness of the components may be exaggerated where appropriate in the figures to improve clarity.
As shown in fig. 3, 4 and 5, a novel three-dimensional uniform flow-dividing manifold type microchannel comprises a pore plate 1, a manifold plate 2, a microchannel 3, a water storage area 4, a water injection hole 5, a water outlet channel 6 and a water inlet channel 7. Wherein, the lower surface of the pore plate 1 is uniformly provided with water injection holes 5, a water storage area 4 with a certain space is reserved between the water injection holes 5 and the pore plate 1, the side surface of the pore plate 1 is provided with a water outlet channel 6, and the top of the pore plate 1 is provided with a water inlet channel 7; the water injection hole 5, the water outlet channel 6 and the water inlet channel 7 are all etched on the pore plate 1 in a laser etching mode, so that a shunting manifold plate 2 is formed, and the manifold plate 2 is arranged at the bottom of the pore plate 1; the water injection holes 5 and the water outlet channels 6 are alternately arranged at the upper end of the pore plate 1. The back of the silicon-based chip is etched with a plurality of micro-channels 3 by a wet etching method or a laser etching method, and the whole structure is formed by bonding a branch manifold plate 2 of an orifice plate 1 and the chip etched with the micro-channels 3.
As shown in figures 6 and 7, the invention adopts an 'upper inlet and side outlet' flow mode, and utilizes an inlet section effect, cold liquid flows into a water storage area 4 from a water inlet channel 7 to form a header effect, and uniformly flows into a micro-channel 3 through the shunting action of water injection holes 5 on the lower surface of a pore plate 1, the cold liquid exchanges heat with a silicon-based chip in the micro-channel 3, and is discharged in a hot gas state through a water outlet channel 6 on the side surface of the pore plate 1 after the wall surface is heated and evaporated, so that the heat exchange between the cold liquid and an electronic component is realized.
As shown in figure 5, the invention adopts the header effect, adds a water storage area with a third dimension structure between the water injection hole 5 and the pore plate 1, and carries out fluid infusion on the micro-channel 3 in multiple dimensions and multiple angles, so that the flow injected into the water injection hole 5 is uniformly distributed, the initial temperature is consistent, and the flow of the fluid entering the micro-channel 3 is uniform. Because the cold liquid with lower initial temperature is continuously injected to keep the temperature in the micro-channel 3 lower, the uniformity of the surface temperature of the heat source is greatly improved, hot spots are reduced, and the use stability of the electronic component is improved.
As shown in fig. 5, the present invention separately arranges the water inlet channel 7 for injecting cold liquid and the water outlet channel 6 for discharging hot gas, so that the inlet channel and the outlet channel are not interfered with each other, evaporation is promoted, increase of flow resistance and heat exchange caused by possible mixing of the inlet channel and the outlet channel in the flowing process are reduced, temperature uniformity is increased by two-phase heat exchange, heat exchange efficiency is improved, and flowing resistance is reduced.
As shown in fig. 5, the present invention uses the inlet section effect, and forms the branch pipe plate 2 by etching the water injection hole 5, the water outlet channel 6, and the water inlet channel 7 on the pore plate 1, so as to shorten the flow length of the fluid in the micro channel 3, avoid the increase of the fluid temperature along with the increase of the flow length, reduce the resistance in the flow channel, reduce the pump work required by the system, and enhance the heat dissipation capability of the high heat flow density surface.
The above description is only a preferred embodiment of the method of the present invention and is not intended to limit the method of the present invention. In the practical implementation process, according to the materials of the manifold plate 2 and the microchannel 3 chip for preparing the orifice plate 1, the sizes, the arrangement intervals and the number of the pore diameters and the water outlet channels 6 on the orifice plate 1 and the manifold plate 2, and the differences of the intervals, the section sizes and the shapes of the microchannels 3, the microchannel 3 heat exchangers with different heat exchange efficiencies and temperature uniformity can be obtained. The processing method, the material type, the size and the shape of the novel structure, the selection of the cooling working medium and the application environment of the micro-channel 3 heat exchange equipment can be changed or replaced.
However, the above form of modification does not fundamentally alter the process of the present invention, namely: on the basis of the traditional manifold-type microchannel, the arrangement of a third-dimension water storage area is added to form a header effect, so that the flow of fluid entering the microchannel is as uniform as possible. They are therefore considered to be within the scope of the invention as defined by the claims.
The foregoing detailed description of the preferred embodiments of the invention has been presented. It should be understood that numerous modifications and variations could be devised by those skilled in the art in light of the present teachings without departing from the inventive concepts. Therefore, the technical solutions available to those skilled in the art through logic analysis, reasoning and limited experiments based on the prior art according to the concept of the present invention should be within the scope of protection defined by the claims.
Claims (8)
1. A novel three-dimensional uniform flow distribution manifold type microchannel is characterized by comprising a pore plate, a manifold plate, a microchannel, a water storage area, a water injection hole, a water outlet channel and a water inlet channel; the lower surface of the pore plate is uniformly provided with the water injection holes, a certain space is reserved between the water injection holes and the pore plate, the water storage area is of a third-dimensional structure, the side surface of the pore plate is provided with the water outlet channel, and the upper surface of the pore plate is provided with the water inlet channel; the water injection hole, the water outlet channel and the water inlet channel are all engraved on the pore plate in a laser etching mode to form a shunting type branching plate, and the branching plate is arranged at the bottom of the pore plate; the manifold-type microchannel is formed by bonding the manifold plate and a chip engraved with the microchannel.
2. The novel three-dimensional uniform flow distribution manifold microchannel of claim 1, wherein the water injection hole sequence and the water outlet channel sequence are arranged alternately at the upper end of the orifice plate.
3. The novel three-dimensional uniform flow distribution manifold type microchannel of claim 1, wherein the microchannel is etched on the back surface of the silicon-based chip by a method comprising a wet etching method and a laser etching method.
4. The novel three-dimensional uniform flow distribution manifold microchannel of claim 1, wherein the orifice plate is a flat plate and the material comprises a glass plate and a silicon substrate.
5. The novel three-dimensional uniform flow distribution manifold microchannel of claim 1, wherein the inlet channel is used for injecting cold liquid, and the outlet channel is used for discharging hot gas, and the inlet and outlet channels are separated.
6. The novel three-dimensional uniform flow distribution manifold microchannel of claim 1, wherein a header effect is formed in the impoundment area, so that the flow entering the water injection holes is uniformly distributed and the initial temperature is uniform.
7. The novel three-dimensional uniform flow distribution manifold microchannel of claim 1, wherein the manifold plate is configured to reduce the flow length of the fluid in the microchannel, and to reduce the flow resistance by using the inlet section effect.
8. The novel three-dimensional uniform flow-dividing manifold-type microchannel as claimed in claim 1, wherein the manifold-type microchannel can be used in combination with a jet flow heat dissipation technology to further realize high-efficiency low-consumption high-heating-power electronic component heat management.
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| CN114136129B (en) * | 2021-12-20 | 2023-02-03 | 山东大学 | Manifold micro-column array flat plate heat exchanger |
| CN115682796B (en) * | 2022-11-04 | 2023-11-10 | 山东高等技术研究院 | 3D printing porous medium cold plate and preparation process thereof |
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