CN114521093B - Unit flow path, heat exchanger and liquid cooling plate - Google Patents
Unit flow path, heat exchanger and liquid cooling plate Download PDFInfo
- Publication number
- CN114521093B CN114521093B CN202210019804.0A CN202210019804A CN114521093B CN 114521093 B CN114521093 B CN 114521093B CN 202210019804 A CN202210019804 A CN 202210019804A CN 114521093 B CN114521093 B CN 114521093B
- Authority
- CN
- China
- Prior art keywords
- heat exchanger
- heat
- flow path
- flow
- unit flow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a unit flow path, a heat exchanger design method and a liquid cooling plate, wherein the unit flow path comprises the following components: a heat exchanger group formed by connecting two heat exchangers in parallel and two shunts; one diverter is positioned at the upstream of the heat exchanger group, and the other diverter is reversely positioned at the downstream of the heat exchanger group, so that a flow path topological structure of diverter-heat exchanger group-diverter is formed; the heat exchanger has an asymmetric upstream-downstream structure and corresponds geometrically to the power device to be cooled. The invention has the characteristics of high heat exchange efficiency, large power capacity, compact volume and intensive utilization of resources, can flexibly adjust the flow path according to the layout characteristics of the power devices, is particularly suitable for solving the cooling problem of high heat flux and high power electronic modules, and is beneficial to solving the array application problem of the electronic modules.
Description
Technical Field
The invention relates to a heat management and structural design suitable for miniaturized electronic equipment, which is used in the technical field of cooling of high heat flux power devices, in particular to a unit flow path, a heat exchanger and a liquid cooling plate.
Background
Cold plate (cooling plate) is a derivative of heat exchanger (heat exchanger) for effecting heat exchange between solids and fluids. At present, the integral liquid cooling plate with multiple return channels is a main flow form for heat dissipation of high-power electric, electronic and power equipment. The design principle is to design the uniform temperature of a large-area uniform heat source and maximize the heat side area, so that the cooling of the electronic module (or the electric module, hereinafter referred to as the electronic module for simplifying the description) with medium heat dissipation power and medium heat flux density can be realized, and the cooling device is insensitive to the types, the numbers and the arrangement sequence of the electronic modules and has good adaptability, and can be called as a universal liquid cooling plate. However, engineering practice finds that the liquid cooling plate with the uniform temperature design cannot strengthen the local heat exchange capacity aiming at the local high heat flux density point heat source, so that some areas exchange heat excessively, and other areas exchange heat less, thereby wasting the heat capacity of the cooling liquid. The design characteristics and performance of the electronic module are difficult to meet the cooling requirements of certain electronic modules with the characteristics of distributed point heat sources.
Some types of electronic modules generally include a circuit comprised of a plurality of power devices featuring a typical distributed point heat source. In addition, the continual chase for higher performance, higher integration, and integration environment adaptability also makes more efficient cooling of the electronic modules desirable. Therefore, for the cooling requirement of such electronic modules, it is necessary to develop a dedicated liquid cooling plate different from the general liquid cooling plate design concept. The special liquid cooling plate can strengthen the local heat exchange capacity according to the layout characteristics of the power devices, and better solves the cooling problem of non-uniform and distributed point heat sources.
Disclosure of Invention
In view of the above, the invention provides a unit flow path, a heat exchanger and a liquid cooling plate, which have the characteristics of high heat exchange efficiency, large power capacity, compact volume and intensive utilization of resources, and can flexibly adjust the flow path according to the layout characteristics of power devices, thereby being particularly suitable for solving the cooling problem of high heat flow density and high power electronic modules.
In one aspect, the invention discloses a unit flow path consisting of only a heat exchanger and a flow divider, comprising: a heat exchanger group formed by connecting two heat exchangers in parallel and two shunts; one diverter is positioned at the upstream of the heat exchanger group, and the other diverter is reversely positioned at the downstream of the heat exchanger group, so that a flow path topological structure of diverter-heat exchanger group-diverter is formed; the heat exchanger consists of a heat exchange area, an upstream structure and a downstream structure, wherein the heat exchanger is provided with an asymmetric upstream and downstream structure and corresponds to a power device to be cooled in geometric position, the upstream structure of the heat exchanger is a diffuser with an expansion angle, and the downstream structure of the heat exchanger is a spray pipe with a contraction angle.
Preferably, the upstream structure of the heat exchanger is a diffuser with a larger expansion angle, the expansion angle of the diffuser is between 120 and 150 degrees, and the contour turning part is designed with a rounded smooth transition; the downstream structure of the heat exchanger is a spray pipe with a small shrinkage angle, and the shrinkage angle of the spray pipe is between 45 and 90 degrees.
Preferably, the heat exchange area of the heat exchanger is rectangular in a forward flow direction, the forward flow direction is a rectangular long side, and the forward flow direction is a rectangular short side along the flow direction; the length of the heat exchanger consists of 3 sections of the length of the heat exchange area, the length of the diffuser and the length of the spray pipe, and the width of the heat exchanger is equal to the short side of the heat exchange area.
Preferably, the two said diverters are identical in structure, the function of which is determined by the combination of the diverter structure and the direction of flow of the cooling liquid; when the cooling liquid flows forward, the flow divider realizes dynamic pressure uniform two-split by virtue of the symmetrical structure and wedge angle of the joint points of the main circuit and the two branches; when the cooling liquid flows reversely, the flow divider realizes two-in-one confluence; at the junction point of the main circuit and the two branches, the included angle of the two branches of the flow divider is not more than 150 degrees; the joint of the main road and the branch road contour is designed with a round angle smooth transition.
On the other hand, the invention also discloses a heat exchanger adapting to the laminar flow characteristic of microchannel heat transfer, which is suitable for the unit flow path, wherein the heat exchanger is provided with an asymmetric upstream and downstream structure and corresponds to a power device to be cooled in geometric position, the upstream structure of the heat exchanger is a diffuser with an expansion angle, and the downstream structure of the heat exchanger is a spray pipe with a contraction angle; the heat exchanger also comprises a heat exchange area formed by alternately arranging a plurality of micro channels and heat dissipation teeth, wherein the heat exchange area is rectangular in forward flow direction, the long side of the rectangular in forward flow direction is rectangular in short side of the rectangular in flow direction, and the heat of the power device is guided to be mainly conducted to the heat dissipation teeth along the direction perpendicular to the flow plane and exchanges heat with cooling liquid.
Preferably, the height-to-width ratio of the micro-channel section of the heat exchanger is less than 15, the ratio of the thickness of the heat dissipation teeth to the width of the micro-channel is greater than 0.8, and the channel length of the micro-channel is not greater than the laminar flow thermal initial section length.
Preferably, a single heat exchanger can be used for heat collection of 1-2 power devices; the long side of the heat exchange area is equal to the channel length of the micro channel, the short side of the heat exchange area is equal to the side length of 1 power device or the sum of the side lengths of 2 power devices, and the length-width ratio of the heat exchange area is between 1.5 and 3.
On the other hand, the invention also discloses a liquid cooling plate, which comprises a plurality of unit flow paths which are communicated in series, wherein the number of the unit flow paths can be increased or decreased according to the number of the power devices.
Preferably, the number of the unit flow paths is 2; the single-return flow path consisting of 2 unit flow paths, an interstage section, a liquid inlet cavity, a liquid outlet cavity, a first drainage section and a second drainage section enables the liquid inlet and the liquid outlet to be on the same side; the 2 unit flow paths are a first unit flow path and a second unit flow path; the liquid inlet cavity is communicated with the first unit flow path through the first drainage section, the liquid outlet of the first unit flow path is communicated with the second unit flow path through the interstage section, and the liquid outlet of the second unit flow path is communicated with the liquid outlet cavity through the second drainage section.
Preferably, the liquid inlet cavity is matched with the liquid inlet, and the liquid outlet cavity is matched with the liquid outlet; the heights of the liquid inlet cavity and the liquid outlet cavity are equal to the height of the liquid cooling plate, and the heights of the first drainage section and the second drainage section are equal to the height of a micro-channel of the heat exchanger; and a transition bevel is arranged between the liquid inlet cavity and the first drainage section and between the liquid outlet cavity and the second drainage section.
Due to the adoption of the technical scheme, the invention has the following advantages: the heat exchange device has the characteristics of high heat exchange efficiency, large power capacity, compact volume and intensive utilization of resources, can flexibly adjust a flow path according to the layout characteristics of the power devices, is particularly suitable for solving the cooling problem of high-heat-flux high-power electronic modules, and is beneficial to solving the array application problem of the electronic modules. This liquid cooling plate example can be used for the most commonly used such electronic modules. Through engineering prototype verification, the micro-channel heat exchanger with the characteristic dimension of 0.2mm slot width can be used for effectively solving the cooling problem of a power device with the heat flux density not exceeding 200W/cm < 2 > and the heat dissipation power not exceeding 75W.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments described in the embodiments of the present invention, and other drawings may be obtained according to these drawings for those skilled in the art.
FIG. 1 is a schematic illustration of a unit flow path profile consisting of only a heat exchanger and a flow splitter according to an embodiment of the invention;
FIG. 2 is a schematic illustration of a geometric definition of a cross section of a heat exchanger according to an embodiment of the present invention;
FIG. 3 is a schematic illustration of geometrical parameter definitions of a planar profile of a heat exchanger according to an embodiment of the present invention;
FIG. 4 (a) is a schematic flow diagram of an asymmetric upstream-downstream heat exchanger according to an embodiment of the present invention;
FIG. 4 (b) is a schematic flow diagram of a symmetrical upstream-downstream configuration heat exchanger of the prior art;
FIG. 5 is a schematic diagram of a fluid cooling plate flow path for cooling a certain type of electronic module according to an embodiment of the present invention;
FIG. 6 is a schematic diagram illustrating the position of an integrated liquid cooling plate and power device for cooling an electronic module according to an embodiment of the present invention;
fig. 7 is a schematic diagram of an integrated liquid cooling structure for cooling an electronic module according to an embodiment of the present invention.
Reference numerals: the cooling plate box body-1, the runner cover plate-2, the diffuser-3, the heat exchange area-4 and the spray pipe-5.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and examples, wherein it is apparent that the examples described are only some, but not all, of the examples of the present invention. All other embodiments obtained by those skilled in the art are intended to fall within the scope of the embodiments of the present invention.
In order to more clearly describe the technical scheme of the invention, the following explanation is made:
heat exchanger: the heat dissipation device comprises a structural whole body formed by a plurality of regularly arranged heat dissipation teeth, a wall plate and a runner (comprising an upstream expansion section and a downstream expansion section), wherein two surfaces are respectively used as a fluid inlet and a fluid outlet, and the rest surfaces are closed surfaces; the structure can be in the form of independent structural components (such as cooling devices of a CPU or a GPU of a commercial computer), and obvious structure separable surfaces exist, or can be in the form of integration (such as in the invention) without the structure separable surfaces. The invention is used for describing the overall design of the flow path unit, and the structural characteristics of the flow path unit can be split into different parts.
Flow passage: a large cross-section channel designed to accommodate the flow of cooling fluid.
At the heart of some types of electronic modules are groups of regularly arranged power devices. The heat dissipation power of a power device is typically up to more than 90% of the heat dissipation power of such an electronic module. Because the circuit components in a single group are identical, and all groups are connected in parallel, the power devices are orderly arranged and concentrated in a certain local area of the planar circuit, and the power device has the characteristic of typical non-uniform and distributed point heat sources. The single power device has the properties of high heat flux density and high power at the same time, the point heat source is characterized by outstanding characteristics, and the (plane) heat expansion effect of the heat conductor is very poor.
The embodiment of the invention can be well suitable for cooling the power device.
Embodiment one:
referring to fig. 1, a schematic diagram of a unit flow path consisting of only a heat exchanger and a flow divider according to an embodiment of the present invention includes: a heat exchanger group formed by connecting two heat exchangers in parallel and two shunts; one diverter is positioned at the upstream of the heat exchanger group, and the other diverter is inversely positioned at the downstream of the heat exchanger group to form a flow path topological structure of the diverter, the heat exchanger group and the diverter; referring to fig. 4 (a), the heat exchanger has an asymmetric upstream-downstream structure and geometrically corresponds to the power device to be cooled.
In the embodiment, the upstream structure of the heat exchanger is a diffuser 3 with a larger expansion angle, the expansion angle a of the diffuser 3 is between 120 and 150 degrees, and the contour turning part is designed with a rounded smooth transition; the downstream structure of the heat exchanger is a jet pipe 5 with a small contraction angle, and the contraction angle b of the jet pipe 5 is between 45 and 90 degrees.
The upstream and downstream structures of the heat exchanger are auxiliary structures of the heat exchanger, the embodiment of the invention provides an asymmetric upstream and downstream structure in the axial alignment, a diffuser 3 (upstream structure) with a larger expansion angle is utilized to form a higher pressure potential to promote the liquid to be more uniformly distributed into each micro-channel, and the vortex size of the back step flow is greatly compressed; the flow is accelerated by the nozzle 5 (downstream structure) with smaller contraction angle, the pumping effect is enhanced, and the forward pressure flow in the micro-channel is promoted. In order to balance the contradiction between the flow function and the compactness of the structure, the expansion angle a of the diffuser 3 is between 120 and 150 degrees, and the contraction angle b of the nozzle 5 is between 45 and 90 degrees. The diffuser 3 is designed with a larger rounded corner at the contour turn to smooth the transition.
In the embodiment, the structures of the two flow splitters are the same, and the functions of the two flow splitters are determined by combining the flow splitter structures and the flowing direction of the cooling liquid; when the cooling liquid flows forward, the flow divider realizes dynamic pressure uniform two-split by virtue of the symmetrical structure and wedge angle of the joint points of the main circuit and the two branches; when the cooling liquid flows reversely, the flow divider realizes two-in-one confluence; at the junction point of the main path and the two branches, the included angle of the two branches of the flow divider is not more than 150 degrees, and a wedge angle is formed for flow guiding; the joint of the main road and the branch road contour is designed with a rounded smooth transition so as to eliminate the phenomenon of flow shrinkage at the turning part caused by the sharp corner.
A certain length of connecting flow passage exists between the branch of the flow divider and the heat exchanger. The longer the direct current channel is, the better the rectifying effect is; the shorter the straight flow channel, the more compact the unit flow channel.
Embodiment two:
aiming at the characteristics of high heat flux and high power of the power device, the micro-channel heat exchanger is necessary to enhance the cooling capacity. To adapt to the laminar flow characteristics of micro-channel heat transfer and effectively utilize the higher convection heat transfer coefficient of the underdeveloped section laminar flow. Referring to fig. 2, 3, 4 (a) and 4 (b), the present invention provides an embodiment of a heat exchanger adapted to the laminar flow characteristics of heat transfer of a micro-channel, which is suitable for the heat exchanger in the first embodiment, and the heat exchanger further includes a heat exchange area 4 formed by alternately arranging a plurality of micro-channels and heat dissipation teeth, wherein the heat exchange area 4 is rectangular in downstream direction, the downstream direction is a long side of the rectangle, the downstream direction is a short side of the rectangle, the heat of the power device is guided to be mainly conducted to the heat dissipation teeth in a direction perpendicular to a flow plane, and exchanges heat with cooling liquid, and the heat expansion effect in the flow plane is almost negligible.
In the embodiment, the aspect ratio of the micro-channel section of the heat exchanger is [ ]l/w) The thickness of the heat dissipation teeth and the width of the micro-channels are less than 15t/w) The ratio is greater than 0.8, the channel length of the micro-channel is not greater than the length of the laminar flow thermal initial sectionX fd,t And laminar flow hot initial segment lengthX fd,t Satisfy formula (1):
wherein, the liquid crystal display device comprises a liquid crystal display device,Re D in order to achieve a reynolds number,Prin the form of a prandtl number,D h is the hydraulically equivalent diameter of the channel.
First, regarding the selection of heat exchanger cross-sectional geometry parameters, it includes: tooth height (or channel height)lChannel widthwWidth of tootht. According to the definition of the biot number (Bi) in heat transfer theory:
wherein, the liquid crystal display device comprises a liquid crystal display device,k s is the heat conductivity coefficient of the solid,hfor the convective heat transfer coefficient,Lis the characteristic length; bi represents the relative strength between convective heat transfer and solid heat transfer. Typically, the heat transfer capacity is arranged from high to low: liquid convection heat exchange, metal solid heat conduction and gas convection heat exchange.
For the air cooling plate, the metal solid has larger heat conduction depth, and the channel section of the heat exchanger is suitable for adopting a larger aspect ratiol/w) The value is often greater than 20, resulting in a larger thickness of the air-cooled panel. The thickness of the radiating teeth of the air cooling plate is smaller, and the ratio of the thickness of the radiating teeth to the width of the channel is always smaller than 0.2.
For the liquid cooling plate, the metal solid has smaller heat conduction depth, and the cross section of the heat exchanger channel is suitable for adopting a smaller height-width ratiol/w) The value is always less than 15, and the height is related to the ratio of the thickness of the heat dissipation teeth to the width of the channelt/w) Resulting in a smaller liquid cooling plate thickness. The liquid cooling plate has larger heat dissipation tooth thickness, and the ratio of the heat dissipation tooth thickness to the channel width is always larger than 0.8.
In this embodiment, a single heat exchanger may be used for heat collection for 1-2 power devices (single point or dual point heat sources); the long side of the heat exchange area 4 is equal to the channel length of the micro channelL f Short side of heat exchange area 4WEqual to the sum of the side lengths of 1 power device or the side lengths of 2 power devices, the length-width ratio of the heat exchange area 4L f /WBetween 1.5 and 3.
As the fluid flows into the interior of the pipe, a flow boundary layer is formed at the wall. The thickness of the flow boundary layer increases along the flow direction, and the flow boundary layer enters the full-development section after the opposite side flow boundary layers are contacted with each other. The coefficient of friction decreases monotonically from the initial point of the flow boundary layer and then remains constant over a sufficiently developed period. When there is a temperature difference between the fluid and the tube wall, a thermal boundary layer is formed at the wall surface. The thickness of the thermal boundary layer also increases along the flow direction, and when the opposite thermal boundary layers contact each other, the thermal boundary layer enters the thermal full-development section. The convective heat transfer coefficient decreases monotonically from the initial point of the thermal boundary layer and then remains constant during the fully developed period.
Channel length of micro-channelL f Is selected from the group consisting of:
as the fluid flows into the interior of the pipe, a flow boundary layer is formed at the wall. The thickness of the flow boundary layer increases along the flow direction, and the flow boundary layer enters the full-development section after the opposite side flow boundary layers are contacted with each other. The coefficient of friction decreases monotonically from the initial point of the flow boundary layer and then remains constant over a sufficiently developed period. When there is a temperature difference between the fluid and the tube wall, a thermal boundary layer is formed at the wall surface. The thickness of the thermal boundary layer also increases along the flow direction, and when the opposite thermal boundary layers contact each other, the thermal boundary layer enters the thermal full-development section. The convective heat transfer coefficient decreases monotonically from the initial point of the thermal boundary layer and then remains constant during the fully developed period.
According to the definition of prandtl number (Pr) in heat transfer science:
wherein, the liquid crystal display device comprises a liquid crystal display device,νin the form of a coefficient of viscosity,αis the thermal diffusivity; pr number characterizes the relative strong and weak relationship of momentum diffusion and thermal diffusion. Pr number of water is about 6, pr number of common cooling liquid is about 54, indicating that water or common cooling liquid is used as mediumThe development of the flow boundary layer is much faster than that of the thermal boundary layer, and the flow direction length of the heat exchanger can be designed by utilizing the small friction coefficient of the fluid in the fully-developed flow section and the large convection heat exchange coefficient in the initial thermal section.
Initial segment length of flow of laminar flow regimeX fd,h And thermal initial segment lengthX fd,t Can be calculated as follows:
wherein, the liquid crystal display device comprises a liquid crystal display device,Re D in order to achieve a reynolds number,Prin the form of a prandtl number,D h is the hydraulically equivalent diameter of the channel.
The long side of the heat exchange area 4 is equal to the length of the flow channelL f Short side of heat exchange area 4WAbout equal to the power device side length. In general, the aspect ratio of the heat exchange zone 4L f /W) Between 1.5 and 3, the contradiction between the inlet section effect of the flow and the economic heat exchanger can be well balanced.
In this embodiment, the heat exchanger lengthLFrom the length of the heat exchange zone 4L f The length of the diffuser 3 and the length of the spray pipe 5 are 3 sections, and the width of the heat exchangerWEqual to the short side of the heat transfer area 4.
Embodiment III:
referring to fig. 5, 6 and 7, fig. 7 shows a cross-sectional view A-A and a cross-sectional view B-B of the liquid cooling structure. As an application of the unit flow paths, the invention provides an embodiment of the liquid cooling plate, the liquid cooling plate comprises a plurality of unit flow paths in the first embodiment which are communicated in series, and the number of the unit flow paths can be increased or decreased according to the number of the power devices. Referring to fig. 6, the liquid cooling plate is in contact with the power device to be cooled, and specifically, the heat exchanger in the liquid cooling plate corresponds to the position of the power device.
As the simplest example, the number of unit flow paths is 2; the single-return flow path consisting of 2 unit flow paths, an interstage section, a liquid inlet cavity, a liquid outlet cavity, a first drainage section and a second drainage section enables the liquid inlet and the liquid outlet to be on the same side; the 2 unit flow paths are a first unit flow path and a second unit flow path; the liquid inlet cavity is communicated with the first unit flow path through the first drainage section, the liquid outlet of the first unit flow path is communicated with the second unit flow path through the interstage section, and the liquid outlet of the second unit flow path is communicated with the liquid outlet cavity through the second drainage section. The liquid cooling plate in this embodiment further includes a cooling plate box body 1 and a flow passage cover plate 2, and the 2 unit flow passages and the flow passage cover plate 2 are all disposed in the liquid cooling plate, and the flow passage cover plate 2 is disposed above the 2 unit flow passages. The cold plate box 1 comprises oppositely arranged structural mounting surfaces. The heat exchanger in the unit flow path corresponds to the position of the power device to be cooled, so that the purpose of cooling the power device is achieved. The drainage channel in fig. 7 is referred to as a second drainage segment.
Flow of cooling liquid in liquid cooling plate: (1) The cooling liquid flows from the liquid inlet to the first-stage unit flow path through the liquid inlet cavity and the drainage section, is equally divided into two paths by the flow divider, respectively enters into 2 heat exchangers which are connected in parallel and fully exchanges heat, and then is converged into one path by the downstream inverted flow divider to flow out; (2) The flow passes through the interstage section to the second-stage unit flow path, is equally divided into two paths by the diverter, respectively enters 2 heat exchangers which are connected in parallel and fully exchanges heat, and is converged into one path by the downstream inverted diverter to flow out; and (3) flowing to the liquid outlet through the drainage channel and the liquid outlet cavity for discharging.
In the embodiment, the liquid inlet cavity is matched with the liquid inlet, and the liquid outlet cavity is matched with the liquid outlet; the heights of the liquid inlet cavity and the liquid outlet cavity are equal to the height of the liquid cooling plate, and the heights of the first drainage section and the second drainage section are equal to the height of the micro-channel of the heat exchanger; a transition bevel is arranged between the liquid inlet cavity and the first drainage section and between the liquid outlet cavity and the second drainage section.
More specifically, the first unit flow path comprises a first flow divider, a first heat exchanger, a second heat exchanger and a second flow divider which are connected in parallel, and the first flow divider is communicated with the second flow divider through the first heat exchanger and the second heat exchanger which are connected in parallel; the liquid inlet end of the first flow divider is communicated with the liquid outlet end of the first drainage section, and the liquid outlet end of the second flow divider is communicated with the liquid inlet end of the interstage section. The second unit flow path comprises a third flow divider, a third heat exchanger, a fourth heat exchanger and a fourth flow divider which are connected in parallel, and the third flow divider is communicated with the fourth flow divider through the third heat exchanger and the fourth heat exchanger which are connected in parallel; the liquid outlet end of the fourth flow divider is communicated with the liquid inlet end of the second drainage section, and the liquid inlet end of the third flow divider is communicated with the liquid outlet end of the interstage section.
There is a functional relationship between flow resistance, convective heat transfer effect, flow velocity and flow channel structure. When the flow velocity is equal, the smaller the sectional area of the flow channel is, the smaller the equivalent hydraulic diameter is, the larger the flow resistance is, and the better the convective heat exchange effect is. In the aspect of intensive utilization of the cooling liquid, the liquid cooling plate is only provided with a runner below the power device, so that the cooling liquid flows through all the heat exchangers and exchanges heat sufficiently, the cooling liquid does not flow in air, and the micro-channel heat exchanger is used for enhancing the cooling effect. In the aspect of intensive utilization of power resources, the heat exchanger is distributed with larger flow resistance for higher heat exchange efficiency, and the rest part of the flow channel is designed with low flow resistance as far as possible, such as larger channel section, rectification, liquid infiltration area reduction, and the like.
The integrated liquid cooling plate provided by the embodiment of the invention consists of the cold plate box body and the runner cover plate, and is connected into a whole through welding.
The embodiment of the invention provides a unit flow path design method and device for cooling a power device, which have the characteristics of high heat exchange efficiency, large power capacity, compact volume and intensive resource utilization, can flexibly adjust a flow path according to the layout characteristics of the power device, are particularly suitable for solving the cooling problem of high-heat-flow-density and high-power electronic modules, and are beneficial to solving the array application problem of the electronic modules. This liquid cooling plate example can be used for the most commonly used such electronic modules. Proved by engineering prototyping, the micro-channel heat exchanger with the characteristic dimension of 0.2mm of groove width can effectively solve the problem that the heat flux density is not more than 200W/cm 2 The power device cooling problem of heat dissipation power of not more than 75W.
Finally, it should be noted that: the above embodiments are only for illustrating the technical aspects of the present invention and not for limiting the same, and although the present invention has been described in detail with reference to the above embodiments, it should be understood by those of ordinary skill in the art that: modifications and equivalents may be made to the specific embodiments of the invention without departing from the spirit and scope of the invention, which is intended to be covered by the claims.
Claims (9)
1. A unit flow path consisting only of a heat exchanger and a flow divider, comprising: a heat exchanger group formed by connecting two heat exchangers in parallel and two shunts; one diverter is positioned at the upstream of the heat exchanger group, and the other diverter is reversely positioned at the downstream of the heat exchanger group, so that a flow path topological structure of diverter-heat exchanger group-diverter is formed; the heat exchanger consists of a heat exchange area, an upstream structure and a downstream structure, wherein the heat exchanger is provided with an asymmetric upstream and downstream structure and corresponds to a power device to be cooled in geometric position, the upstream structure of the heat exchanger is a diffuser with an expansion angle, and the downstream structure of the heat exchanger is a spray pipe with a contraction angle.
2. The unit flow path according to claim 1, wherein the upstream structure of the heat exchanger is a diffuser having a large expansion angle, the expansion angle of the diffuser is between 120 ° and 150 °, and the contour turning is designed with a rounded smooth transition; the downstream structure of the heat exchanger is a spray pipe with a small shrinkage angle, and the shrinkage angle of the spray pipe is between 45 and 90 degrees.
3. The unit flow path according to claim 1, wherein the heat exchange area of the heat exchanger is rectangular in a forward flow direction, the forward flow direction is a rectangular long side, and the forward flow direction is a rectangular short side; the length of the heat exchanger consists of 3 sections of the length of the heat exchange area, the length of the diffuser and the length of the spray pipe, and the width of the heat exchanger is equal to the short side of the heat exchange area.
4. The unit flow path according to claim 1, wherein the two flow splitters are identical in structure, the functions of which are determined by a combination of the flow splitter structure and the flow direction of the coolant; when the cooling liquid flows forward, the flow divider realizes dynamic pressure uniform two-split by virtue of the symmetrical structure and wedge angle of the joint points of the main circuit and the two branches; when the cooling liquid flows reversely, the flow divider realizes two-in-one confluence; at the junction point of the main circuit and the two branches, the included angle of the two branches of the flow divider is not more than 150 degrees; the joint of the main road and the branch road contour is designed with a round angle smooth transition.
5. A heat exchanger adapted to the laminar flow characteristics of microchannel heat transfer, adapted to the unit flow path of any one of claims 1 to 4, wherein the heat exchanger has an asymmetric upstream-downstream configuration and geometrically corresponds to the power device to be cooled, the upstream configuration of the heat exchanger being a diffuser having an expansion angle, the downstream configuration of the heat exchanger being a nozzle having a contraction angle; the heat exchanger also comprises a heat exchange area formed by alternately arranging a plurality of micro channels and heat dissipation teeth, wherein the heat exchange area is rectangular in forward flow direction, the long side of the rectangular in forward flow direction is rectangular in short side of the rectangular in flow direction, and the heat of the power device is guided to be mainly conducted to the heat dissipation teeth along the direction perpendicular to the flow plane and exchanges heat with cooling liquid.
6. The heat exchanger of claim 5 wherein the heat exchanger has a microchannel cross section having an aspect ratio of less than 15, a ratio of heat dissipating tooth thickness to microchannel width of greater than 0.8, and a microchannel channel length of no greater than the laminar flow hot initial section length.
7. The heat exchanger according to claim 5 or 6, wherein a single heat exchanger can be used for heat collection of 1-2 power devices; the long side of the heat exchange area is equal to the channel length of the micro channel, and the short side of the heat exchange area is equal to the side length of 1 power device or the sum of the side lengths of 2 power devices.
8. A liquid cooling plate comprising a plurality of unit flow paths according to any one of claims 1 to 4 connected in series, the number of the unit flow paths being increased or decreased according to the number of power devices.
9. The liquid cooling plate according to claim 8, wherein the number of the unit flow paths is 2; the single-return flow path consisting of 2 unit flow paths, an interstage section, a liquid inlet cavity, a liquid outlet cavity, a first drainage section and a second drainage section enables the liquid inlet and the liquid outlet to be on the same side; the 2 unit flow paths are a first unit flow path and a second unit flow path; the liquid inlet cavity is communicated with the first unit flow path through the first drainage section, the liquid outlet of the first unit flow path is communicated with the second unit flow path through the interstage section, and the liquid outlet of the second unit flow path is communicated with the liquid outlet cavity through the second drainage section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210019804.0A CN114521093B (en) | 2022-01-10 | 2022-01-10 | Unit flow path, heat exchanger and liquid cooling plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210019804.0A CN114521093B (en) | 2022-01-10 | 2022-01-10 | Unit flow path, heat exchanger and liquid cooling plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114521093A CN114521093A (en) | 2022-05-20 |
| CN114521093B true CN114521093B (en) | 2023-05-16 |
Family
ID=81597417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210019804.0A Active CN114521093B (en) | 2022-01-10 | 2022-01-10 | Unit flow path, heat exchanger and liquid cooling plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114521093B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115666112B (en) * | 2022-12-22 | 2023-04-11 | 苏州浪潮智能科技有限公司 | Immersion liquid cooling system, method and server |
| CN116033639B (en) * | 2023-02-15 | 2024-04-05 | 上海超群检测科技股份有限公司 | Built-in liquid cooling circulation system of X-ray source |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204006804U (en) * | 2014-08-07 | 2014-12-10 | 成都波威特斯空调技术有限公司 | Heat exchanger of air condition is optimized structure |
| CN204375724U (en) * | 2015-02-05 | 2015-06-03 | 杭州沈氏节能科技股份有限公司 | A kind of microchannel cooling |
| CN207074697U (en) * | 2017-06-21 | 2018-03-06 | 安徽广通汽车制造股份有限公司 | A kind of electric motor coach electrokinetic cell water-cooling heat radiating system |
| CN108443880A (en) * | 2018-05-15 | 2018-08-24 | 芜湖美的厨卫电器制造有限公司 | Distributor and apply its burner and water heater |
| CN113514491A (en) * | 2021-04-20 | 2021-10-19 | 中国电子科技集团公司第二十研究所 | Bionic topology microchannel heat exchanger and fluid heat exchange experimental system thereof |
| CN215418962U (en) * | 2021-07-14 | 2022-01-04 | 青沃精密仪器(苏州)有限公司 | High-power semiconductor laser for liquid refrigeration |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202254976U (en) * | 2011-08-27 | 2012-05-30 | 徐福昌 | Built-in plate type heat exchanger |
| US10306802B1 (en) * | 2015-08-28 | 2019-05-28 | Lockheed Martin Corporation | Micro jet impingement heat sink |
| US11149745B2 (en) * | 2017-12-15 | 2021-10-19 | Ford Global Technologies, Llc | Water-cooled casing treatment |
| CN210398075U (en) * | 2019-06-28 | 2020-04-24 | 宁德时代新能源科技股份有限公司 | Liquid shunting device and battery pack with same |
-
2022
- 2022-01-10 CN CN202210019804.0A patent/CN114521093B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204006804U (en) * | 2014-08-07 | 2014-12-10 | 成都波威特斯空调技术有限公司 | Heat exchanger of air condition is optimized structure |
| CN204375724U (en) * | 2015-02-05 | 2015-06-03 | 杭州沈氏节能科技股份有限公司 | A kind of microchannel cooling |
| CN207074697U (en) * | 2017-06-21 | 2018-03-06 | 安徽广通汽车制造股份有限公司 | A kind of electric motor coach electrokinetic cell water-cooling heat radiating system |
| CN108443880A (en) * | 2018-05-15 | 2018-08-24 | 芜湖美的厨卫电器制造有限公司 | Distributor and apply its burner and water heater |
| CN113514491A (en) * | 2021-04-20 | 2021-10-19 | 中国电子科技集团公司第二十研究所 | Bionic topology microchannel heat exchanger and fluid heat exchange experimental system thereof |
| CN215418962U (en) * | 2021-07-14 | 2022-01-04 | 青沃精密仪器(苏州)有限公司 | High-power semiconductor laser for liquid refrigeration |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114521093A (en) | 2022-05-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN114521093B (en) | Unit flow path, heat exchanger and liquid cooling plate | |
| US6446442B1 (en) | Heat exchanger for an electronic heat pump | |
| US6619044B2 (en) | Heat exchanger for an electronic heat pump | |
| Kandlikar | Single-phase liquid flow in minichannels and microchannels | |
| CN101483173B (en) | Semiconductor cooling structure | |
| CN108112218B (en) | Fractal micro-channel cold plate with bidirectional flow path | |
| CN110610911B (en) | Novel three-dimensional uniform distribution manifold type microchannel | |
| US20040068991A1 (en) | Heat exchanger for an electronic heat pump | |
| US20090145581A1 (en) | Non-linear fin heat sink | |
| CN112151478B (en) | Micro-channel radiator and preparation method and application thereof | |
| US7992625B1 (en) | Fluid-operated heat transfer device | |
| JP4013883B2 (en) | Heat exchanger | |
| CN113490394A (en) | Vein bionic microchannel coupling jet flow heat exchange system | |
| CN109890186B (en) | Cooler flow path with symmetrical topological structure and double-radiating-surface liquid cooling plate | |
| US20090178788A1 (en) | Semiconductor cooling structure | |
| JP2003511648A (en) | Heat exchanger for electronic heat pump | |
| CN115540640A (en) | Heat exchange assembly | |
| CN115696873A (en) | Microchannel evaporator structure for inhibiting backflow | |
| WO2021131175A1 (en) | Cooling structure and heatsink | |
| JP2011119555A (en) | Heat sink using bent louver-like heat dissipation unit | |
| TW202334598A (en) | Liquid cooling device and liquid cooling system having the liquid cooling device | |
| JP4572911B2 (en) | Heat exchanger | |
| US8451610B2 (en) | Electrical circuit component carrier | |
| CN113675160B (en) | Impact flow double-layer diversion micro-channel heat sink suitable for high heat flow density device | |
| CN218333780U (en) | Periodic fractal tree-like structure microchannel heat exchanger system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |