CN115540640A

CN115540640A - Heat exchange assembly

Info

Publication number: CN115540640A
Application number: CN202210974991.8A
Authority: CN
Inventors: 曾宏波; 李成; 胡航空; 郝明亮
Original assignee: Bitmain Technologies Inc
Current assignee: Bitmain Technologies Inc
Priority date: 2022-08-15
Filing date: 2022-08-15
Publication date: 2022-12-30

Abstract

A heat exchange assembly, the heat exchange assembly comprising: the heat conducting piece is configured to be in heat conducting connection with an object to be heated; the heat transfer runner is formed in on the heat conduction piece, the heat transfer runner includes the feed liquor section and goes out the liquid section, the heat transfer runner follows the feed liquor section begins to be in after extending a section distance on the heat conduction piece buckle, after buckling the heat transfer runner continues to extend to with the direction that is close to the feed liquor section go out the liquid section, wherein, before buckling the heat transfer runner forms first runner, after buckling the heat transfer runner is as the second runner, first runner with the second runner is adjacent to be set up, turns round after beginning to extend a section distance from the feed liquor end on the heat conduction piece through the heat transfer runner, forms two runners that parallel, and two runners that parallel are heat-conducting each other can also equalize heat-sinking capability everywhere the heat transfer runner, reduce heat transfer runner feed liquor section and play liquid section temperature difference, realize treating heat transfer thing balanced heat dissipation, effectively improve the control by temperature homogeneity of waiting to heat transfer thing.

Description

Heat exchange assembly

Technical Field

The application relates to the field of electronic component heat dissipation, especially, relate to heat exchange assemblies.

Background

The electronic components operating at high frequency and high speed generate a large amount of heat, which causes the temperature of the electronic components to be high, which poses a serious threat to the performance and the operating stability of the electronic components.

At present, a commonly used heat dissipation method is liquid cooling heat dissipation, which generally uses a pipeline or a flow channel to transport heat exchange liquid for heat dissipation, that is, the pipeline or the flow channel is disposed on an electronic element or an electronic element array that needs heat dissipation, and then flowing heat exchange liquid is introduced, when the heat exchange liquid flows through the electronic element or the electronic element array, the heat exchange liquid takes away heat of the electronic element, so as to achieve the purpose of heat dissipation of the electronic element or the electronic element array.

Disclosure of Invention

The application provides a heat exchange assembly, it is circuitous to begin to extend one section distance after bending through the heat transfer runner on heat-conducting member from the feed liquor end, forms two runners that parallel, reduces the highest operating temperature who treats the heat transfer thing.

In a first aspect, an embodiment of the present application provides a heat exchange assembly, including:

the heat conducting piece is configured to be in heat conducting connection with an object to be heated;

the heat transfer runner is formed in on the heat conduction piece, the heat transfer runner includes the feed liquor section and goes out the liquid section, the heat transfer runner follows the feed liquor section begins to be in extend one section distance back buckling on the heat conduction piece, after buckling the heat transfer runner continues to extend to with being close to the direction of feed liquor section go out the liquid section, wherein, before buckling the heat transfer runner forms first runner, after buckling the heat transfer runner is as the second runner, first runner with the second runner is adjacent to be set up.

In the heat exchange assembly that this application embodiment provided, the heat transfer runner uses the kink as first end to the feed liquor section is held as the second with going out the liquid section, the heat transfer runner is followed the second end begins to the first end stacks to lay.

In the heat exchange assembly provided by the embodiment of the application, the heat exchange flow channel is arranged on the heat conducting piece in a shape of a clip needle, so that the first end of the heat exchange flow channel is arranged in the middle of the heat conducting piece.

In the heat exchange assembly provided by the embodiment of the application, the first flow channel includes a plurality of first liquid guiding sections and a plurality of second liquid guiding sections, the second liquid guiding sections extend from one end of the first liquid guiding sections in a bending manner, the second flow channel includes a plurality of third liquid guiding sections and a plurality of fourth liquid guiding sections, and the fourth liquid guiding sections extend from one end of the third liquid guiding sections in a bending manner; the third liquid guiding section is arranged between the two adjacent first liquid guiding sections, and/or the fourth liquid guiding section is arranged between the two adjacent second liquid guiding sections.

In the heat exchange assembly provided by the embodiment of the application, the first liquid guide section is parallel to the third liquid guide section, and the second liquid guide section is parallel to the fourth liquid guide section.

In the heat exchange assembly provided by the embodiment of the application, the heat conducting member comprises a first heat exchange plate and a second heat exchange plate, and the first heat exchange plate and the second heat exchange plate are connected to form the heat exchange flow channel.

In the heat exchange assembly provided by the embodiment of the application, the heat exchange flow channel is along the direction of height of the heat conducting piece has a first wall surface and a second wall surface which are arranged oppositely, the first wall surface and the connection surface of the heat conducting piece are separated by a first distance, the second wall surface and the connection surface are separated by a second distance, the heat exchange flow channel is extended in a mode that the first distance is kept unchanged and the second distance is gradually reduced along the flowing direction of the fluid, and the connection surface is used for being connected with the object to be heated in a heat conduction mode.

In the heat exchange assembly that this application embodiment provided, the feed liquor section and the play liquid section of heat transfer runner are located same one side of heat-conducting piece.

In the heat exchange assembly provided by the embodiment of the application, the heat exchange flow channel close to one side of the object to be heated is provided with the flow distribution sheet along the height direction of the heat conducting piece.

In the heat exchange assembly provided by the embodiment of the application, the number of the splitter plates arranged at the rear part of the heat exchange flow channel is less than that of the splitter plates arranged at the front part of the heat exchange flow channel.

In the heat exchange assembly provided by the embodiment of the application, the first wall surface of the heat exchange flow channel is provided with the convex ribs.

The embodiment of the application provides a pair of heat exchange assembly, it is circuitous to begin to extend one section distance after to bend through the heat transfer runner on heat-conducting piece from the feed liquor end, form two runners that parallel, two runners heat transfer each other, not only can effectively reduce the highest operating temperature who treats the heat transfer thing, can also equalize heat transfer runner heat-sinking capability everywhere, reduce heat transfer runner feed liquor section and go out the liquid section temperature difference, realize treating the heat transfer thing balanced heat dissipation, effectively improve the control by temperature change homogeneity of treating the heat transfer thing.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the description below are some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

FIG. 1 is a schematic view of an overall structure of a heat exchange assembly provided in an embodiment of the present application;

FIG. 2 is a schematic view of an expanded structure of a heat exchange assembly provided in an embodiment of the present application;

fig. 3 is a schematic view of a heat exchange flow passage structure of a heat exchange assembly provided in an embodiment of the present application;

fig. 4 is a schematic structural view of a heat exchange flow channel of a heat exchange assembly provided in an embodiment of the present application;

fig. 5 is a schematic structural view of a heat exchange flow channel of a heat exchange assembly provided in an embodiment of the present application;

FIG. 6 is a schematic view of one of the heat exchange flow channels provided in the embodiments of the present application;

FIG. 7 is a schematic view of one of the heat exchange flow channels provided in the embodiments of the present application;

fig. 8 is a schematic structural view of a heat exchange flow channel of a heat exchange assembly provided in an embodiment of the present application.

Description of the main elements and symbols:

10. a splitter plate; 11. a liquid inlet section; 12. a liquid outlet section; 13. a direction of flow; 14. a rib;

15. a heat exchange flow channel; 151. an inlet section; 152. a main body section; 153. an outlet section; 154. a sub-channel; 155. a first flow passage; 1551. a first drainage section; 1552. a second drainage section; 156. a second flow passage; 1561. a third drainage section; 1562. a fourth liquid guiding section;

16. a heat conductive member; 161. a first heat exchange plate; 162. a second heat exchange plate; 163. a connecting surface;

17. a spacing region;

18. a first end; 19. a second end;

20. a height direction; 21. a first wall surface; 22. a second wall surface;

30. a first loop; 31. a second loop; 32. a third loop; 33. a fourth collar.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, of the embodiments of the present application. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.

Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.

It is to be understood that the terminology used in the description of the present application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the specification of the present application and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It should be understood that, for the convenience of clearly describing the technical solutions of the embodiments of the present application, the words "first", "second", and the like are used in the embodiments of the present application to distinguish the same items or similar items with basically the same functions and actions. For example, the first and second grooves are only used for distinguishing different grooves, and the sequence thereof is not limited. Those skilled in the art will appreciate that the terms "first," "second," etc. do not denote any order or quantity, nor do the terms "first," "second," etc. denote any order or importance.

It should be further understood that the term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items. The electronic components operating at high frequency and high speed generate a large amount of heat, which causes the temperature of the electronic components to be high, which poses a serious threat to the performance and the operating stability of the electronic components.

At present, a commonly used heat dissipation method is liquid cooling heat dissipation, which generally uses a way of conveying a heat exchange liquid through a pipeline or a flow channel to dissipate heat, that is, a pipeline or a flow channel is arranged on an electronic element or an electronic element array which needs to dissipate heat, and then a flowing heat exchange liquid is introduced, when the heat exchange liquid flows through the electronic element or the electronic element array, the heat exchange liquid takes away heat of the electronic element, so as to achieve the purpose of dissipating heat for the electronic element or the electronic element array.

For example, referring to fig. 6, a second in fig. 6 shows a heat dissipation layout of a current heat exchange flow channel 15, and the layout scheme of the second is simplified and extracted to obtain the layout scheme of the first, that is, the liquid flows in a direction away from the inlet, which causes that the temperature of the liquid at the inlet is gradually increased from the temperature of the liquid at the outlet when the liquid flows through the flow channel.

This application is through starting to extend one section distance back to bend circuitously from the feed liquor end with heat transfer runner 15 on heat-conducting member 16, form two runners that parallel, two runners that parallel transfer heat each other, not only can effectively reduce the highest operating temperature who treats the heat transfer thing, can also equalize the heat-sinking capability of 15 each departments of heat transfer runner, reduce heat transfer runner 15 feed liquor section 11 and play liquid section 12 temperature difference, realize the balanced heat dissipation to treating the heat transfer thing, effectively improve the control by temperature change homogeneity of treating the heat transfer thing.

With reference to fig. 1, 3, 7, 8, the present application provides a heat exchange assembly characterized by comprising:

a heat conducting member 16 configured to be in heat conducting connection with an object to be heat exchanged;

the heat exchange flow channel 15 is formed on the heat conducting member 16, the heat exchange flow channel 15 includes a liquid inlet section 11 and a liquid outlet section 12, the heat exchange flow channel 15 starts to extend for a distance from the liquid inlet section 11 to the heat conducting member 16 and then bends, the bent heat exchange flow channel 15 continues to extend to the liquid outlet section 12 in a direction close to the liquid inlet section 11, wherein the heat exchange flow channel 15 before bending forms a first flow channel 155, the bent heat exchange flow channel 15 serves as a second flow channel 156, and the first flow channel 155 and the second flow channel 156 are arranged adjacently.

In this embodiment, the object to be heated may be an electronic component, or an array of electronic components, and the electronic component or the array of electronic components may transfer heat to the heat conducting member 16; the object to be heated can also be other circuit parts.

In this embodiment, the object to be heated may be an electronic component that needs to dissipate heat, and may also be an electronic component that needs to be heated, where the difference is that the temperature of the liquid flowing through the heat exchange flow channel 15 is different, where the liquid flowing through the heat exchange flow channel 15 includes purified water or antifreeze as a freezing medium.

In this embodiment, the liquid inlet section 11 and the liquid outlet section 12 may be a long flow passage, may be a port, or may be a pipe connected to the heat conducting member 16.

For example, referring to fig. 7 and 3, after the liquid enters the heat conducting member 16 through the liquid inlet section 11 of the heat exchanging flow channel 15, the liquid flows out from the liquid outlet section 12, because the heat exchanging flow channel 15 is bent, the two flow channels are close to each other, so that heat is transferred between the heat exchanging flow channels 15, especially, the outlet is opposite to the inlet, so that heat of the electronic element taken away by the gradual flowing of the liquid can be exchanged between the two heat exchanging flow channels 15, the overall heat of the liquid is balanced, the overall temperature of the electronic element is also balanced, and the temperature of the electronic element is conveniently controlled.

In one embodiment provided by the present application, the heat exchange flow channel 15 has a first end 18 at a bend, and a second end 19 at the liquid inlet section 11 and the liquid outlet section 12, and the heat exchange flow channel 15 is stacked from the second end 19 to the first end 18.

In this embodiment, the bending of the heat exchange flow channel 15 may be ninety degrees, seventy degrees, or one hundred degrees, or thirty degrees, preferably one hundred eighty degrees, so that the heat exchange flow channel 15 flows back in parallel to the previous heat exchange flow channel 15; when the heat exchanging channel 15 is one hundred degrees or other values, the heat exchanging channel 15 can be bent again as required, so that the heat exchanging flow can be close to the heat exchanging channel 15 before bending, and heat exchanging between the two heat exchanging channels 15 is facilitated.

Exemplarily, referring to fig. 7, as a further optimization of the first, it has been assumed that the heat exchange flow channel 15 has a first end 18 at a bent position, and a second end 19 at the liquid inlet section 11 and the liquid outlet section 12, and the heat exchange flow channel 15 is spirally arranged from the second end 19 to the first end 18;

as further optimization of the A, the T is the first end 18 of the heat exchange flow channel 15 at a bent position, the liquid inlet section 11 and the liquid outlet section 12 are the second end 19, and the heat exchange flow channel 15 is arranged from the second end 19 to the first end 18 in a shape of Chinese character 'hui';

as a further optimization of the first step, the penta is that the heat exchange flow channel 15 takes a bent part as a first end 18, the liquid inlet section 11 and the liquid outlet section 12 as a second end 19, and the heat exchange flow channel 15 is folded from the second end 19 to the first end 18;

wherein, A, B, C, D, E, and F are respectively a code number, and are used as a layout scheme of the heat exchange flow channel 15.

In this embodiment, the heat exchanging channels 15 are stacked to make the temperature of the liquid in the heat exchanging channels 15 more uniform, and at the same time, the area of the heat conducting member 16 is saved, and the temperature equalizing effect is increased.

In one embodiment provided by the present application, the heat exchange flow channel 15 is arranged on the heat conducting member 16 in a zigzag needle shape, such that the first end 18 of the heat exchange flow channel 15 is arranged in the middle of the heat conducting member 16.

In this embodiment, the heat conducting member 16 can be fully covered by the arrangement, so that the heat exchange flow channel 15 occupies an area of the heat conducting member 16, and the heat exchange effect is increased.

In one embodiment provided by the present application, referring to fig. 5, the heat exchange flow passage 15 comprises an inlet section 151, a main section 152 and an outlet section 153, the main section 152 is used for flowing the liquid on the heat conduction member 16 and performing the main heat exchange, the inlet section 151 is used for the liquid to enter the heat conduction member 16, the outlet section 153 is used for the liquid to flow out of the heat conduction member 16, and the flow of the liquid on the inlet section 151, the main section 152 and the outlet section 153 is shown as the flow direction 13 in fig. 3.

In one embodiment provided herein, the first flow channel 155 comprises a plurality of first fluid conducting segments 1551 and a plurality of second fluid conducting segments 1552, the second fluid conducting segments 1552 are bent and extended from one end of the first fluid conducting segments 1551, the second flow channel 156 comprises a plurality of third fluid conducting segments 1561 and a plurality of fourth fluid conducting segments 1562, and the fourth fluid conducting segments 1562 are bent and extended from one end of the third fluid conducting segments 1561; the third fluid guide section 1561 is disposed between two adjacent first fluid guide sections 1551, and/or the fourth fluid guide section 1562 is disposed between two adjacent second fluid guide sections 1552.

In one embodiment provided herein, the first fluid conducting section 1551 is parallel to the third fluid conducting section 1561 and the second fluid conducting section 1552 is parallel to the fourth fluid conducting section 1562.

In this embodiment, the parallel liquid guiding segments can have better heat conducting effect and distribution, and reduce the useless area of the heat conducting member 16.

In one embodiment provided herein, the main body segment 152 extends from the inlet segment 151 a first distance along the X-axis, then bends and extends a second distance along the Y-axis, bends and continues to extend a third distance along the X-axis, and bends and extends a fourth distance along the Y-axis to form a first loop, wherein the fourth distance is less than the second distance;

the main body section 152 continues to form a second loop in a manner of forming the first loop with the terminal end of the first loop as a starting end, the main body section 152 forms a third loop in a manner opposite to the first loop with the terminal end of the second loop as a starting end, and the main body section 152 forms a fourth loop in a manner of forming the third loop with the terminal end of the third loop as a starting end.

In one embodiment provided herein, referring to fig. 2, the heat conduction member 16 includes a first heat exchange plate 161 and a second heat exchange plate 162, and the first heat exchange plate 161 and the second heat exchange plate 162 are connected to form the heat exchange flow passage 15.

In this embodiment, the first heat exchanging plate 161 and the second heat exchanging plate 162 are coated with oil and soldered with solder paste and aligned with the cross section, and then are soldered to a finished heat conducting member 16 by an electric heating furnace, the first heat exchanging plate 161 and the second heat exchanging plate 162 are provided with sub-channels 154, and the sub-channels 154 on the two heat exchanging plates are combined together to form the heat exchanging channel 15 of the heat conducting member 16.

In one embodiment provided by the present application, the first heat exchange plate 161 and the second heat exchange plate 162 are connected by a fastener, and the fastener is disposed at a gap between the heat exchange flow passage 15 of the second heat exchange plate 162 and the spacing region 17 between the heat exchange flow passages 15 of the first heat exchange plate 161, and the fastener is used for fixing the heat conducting member 16 on the object to be heated.

In one embodiment provided herein, the connecting position of the fastener is coated with a thermally conductive paste or a soft metal, such as indium sheet with a thickness of 0.1-1 mm, to ensure that the thermal contact resistance between the electronic component and the heat conducting member 16 does not occur at the connecting position, and the fastener includes a bolt and a hole, the hole is disposed on the heat conducting member 16, and the bolt passes through the hole to connect.

In an embodiment of the present application, referring to fig. 1, first heat exchange plate 161 has connection face 163, and connection face 163 is a face that is used for connecting electronic component or electronic component array, is provided with a plurality of flanges on connection face 163, the flange has the heat conductivity, the flange corresponds with heat transfer runner 15's position, and through setting up the flange, can avoid connecting face 163 and the local contact of the surperficial unevenness of electronic component array for it is in the same place to connect face 163 can be laminated better with the electronic component array, sets up the flange simultaneously, can make heat exchange assemblies only be connected with the radiating electronic component heat conduction, and can not contact with other spare parts of electronic plate.

In one embodiment provided by the present application, the heat exchange flow channel 15 has a first wall surface 21 and a second wall surface 22 that are disposed opposite to each other along a height direction 20 of the heat conducting member 16, the first wall surface 21 and a connection surface 163 of the heat conducting member 16 are separated by a first distance, the second wall surface 22 and the connection surface 163 are separated by a second distance, the heat exchange flow channel 15 extends in a manner that the first distance is kept constant and the second distance gradually decreases along a fluid flowing direction, and the connection surface 163 is used for being connected to an object to be heat exchanged in a heat conduction manner.

In this embodiment, through this mode, can accelerate the terminal velocity of flow of heat transfer runner 15 for the terminal hotter liquid of heat transfer runner 15 can accelerate the outflow, improves the radiating effect.

In one embodiment provided by the present application, the liquid inlet section 11 and the liquid outlet section 12 of the heat exchange flow channel 15 are disposed on the same side of the heat conducting member 16.

In one embodiment provided by the present application, referring to fig. 4, a dividing plate 10 is disposed in the heat exchange flow channel 15 near the side of the object to be heat exchanged along the height direction 20 of the heat conducting member 16.

By arranging the flow dividing sheet 10, the contact area of the liquid and the heat conducting piece 16 can be increased, and then the heat exchange effect of the heat conducting piece 16 is increased, and the heat conducting piece 16 has a certain thickness, so that the sectional area of the heat exchange flow channel 15 can be reduced, the flowing speed of the liquid in the heat exchange flow channel 15 is increased, and the heat dissipation effect is enhanced; the splitter 10 is a rectangular thin plate, the thickness of the heat conducting fin 16 is the thickness of the rectangular thin plate, and the width of the heat conducting fin 16 is the height of the heat exchange flow channel 15.

In one embodiment provided by the present application, in the heat exchange flow channel 15, along the height of the cross section, 1,2,3,4,5 is selected, N number of splitter vanes 10 are arranged, the thickness of the splitter vane 10 is 1.0mm to 3.0mm, the height of the splitter vane 10 is consistent with the rectangular height of the outline of the heat exchange flow channel 15, and the splitter vane 10 divides the heat exchange flow channel 15 into a plurality of flow channels flowing in parallel, thereby further enhancing the heat exchange effect.

In one embodiment provided by the present application, the number of the flow dividing plates 10 disposed at the rear of the heat exchange flow passage 15 is less than the number of the flow dividing plates 10 disposed at the front of the heat exchange flow passage 15.

In one embodiment provided herein, referring to fig. 4, the ribs 14 are provided on the first wall 21 of the heat exchange flow channel 15.

Through setting up fin 14, can make the stable state of flowing of liquid in heat transfer runner 15 break by fin 14, produce the torrent for the liquid stream produces the mixture, improves the heat conduction effect of liquid stream itself, improves the heat conduction efficiency of heat-conducting piece 16 then.

In one embodiment provided by the present application, the shape of the convex rib 14 is V-shaped, and the tip of the cam is directed to the incoming flow direction of the liquid, the included angle of the tip of the cam ranges from 30 to 160 °, the height of the convex rib 14 ranges from 0.3 to 1.5mm, and the distance between adjacent convex ribs 14 on the wall surface of the same heat exchange flow channel 15 is 5 to 20 times the rib height of the convex rib 14.

Through the arrangement, the convex ribs 14 can reduce the flowing resistance of the liquid in the heat exchange flow channel 15, so that the power stability of a pump or other power equipment for providing power for the flowing of the liquid is ensured, the power reduction of the power equipment caused by the overlarge resistance of the convex ribs to the liquid is avoided, and the problem that the flow speed of the liquid is slowed down is avoided.

In the embodiment that this application provided, liquid inlet section 11 and play liquid section 12 all are provided with the pipe fitting, set up the pipe fitting and are convenient for link together heat transfer runner 15 and outside feed liquor pipe.

In one embodiment provided by the present application, the outline of the cross section of the heat exchange flow channel 15 is a rectangular structure, and the maximum height of the heat exchange flow channel 15 is 0.5-2.0 cm.

Through the arrangement, the overall performance of the heat conducting piece can be ensured to be appropriate, and if the flow channel is too wide, the required liquid is more, and the power of the power equipment for driving the liquid is higher.

Meanwhile, the corners of the rectangle are provided with chamfers of 0.2-2 mm, so that the resistance generated when the liquid is bent is reduced.

In one embodiment provided herein, the height of the downstream heat exchange flow channel 15 is 0.75 to 0.95 times the height of the upstream flow channel adjacent and in series with the downstream heat exchange flow channel 15 as liquid flows therethrough each heat exchange flow channel 15, the width of the heat exchange flow channel 15 remaining constant.

Through the setting, can be so that the velocity of flow of liquid is faster and faster in the runner, the radiating effect is also better, and especially the liquid is higher at the position temperature behind heat transfer runner 15, in order to obtain better radiating effect, needs the liquid flow velocity of increasingly fast.

The present application also provides a method of manufacturing a heat exchange assembly, the method of manufacturing comprising:

any heat exchange flow channel 15 and the built-in part of the heat exchange flow channel 15 provided by the embodiment of the present application are molded on the first heat exchange plate 161 and the second heat exchange plate 162 by a die and die casting, and then coated with solder paste, and the first heat exchange plate 161 and the second heat exchange plate 162 are placed in an electric heating furnace for preheating and welding, or welded into a first heat exchange plate 161 and a second heat exchange plate 162 by a brazing method to form a heat exchange assembly after welding; then, the heat exchange assembly is attached to an integrated circuit board with a matrix type computational power chip through TIM (time Material) such as thermal conductive paste, purified water or antifreeze is selected as a liquid cooling working medium, after the liquid cooling working medium is introduced, the chip with the matrix type layout starts to work and generates a large amount of heat, the liquid cooling working medium in the heat exchange assembly carries away heat dissipation of the chip in a convection mode, and the working temperature of the chip is guaranteed.

Through the heat exchange assembly that this application provided, on the basis that the assurance cost does not increase, increase substantially the control by temperature change performance of chip, promptly:

the temperature control uniformity of the chip is improved, and the temperature difference is reduced to 3-4 ℃ from the original 10 ℃, so that the temperature uniformity of the working chip is effectively improved;

the maximum operation temperature of the chip is effectively improved and reduced by more than 5 ℃.

While the invention has been described with reference to specific embodiments, the scope of the invention is not limited thereto, and those skilled in the art can easily conceive various equivalent modifications or substitutions within the technical scope of the invention. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A heat exchange assembly, comprising:

2. The heat exchange assembly of claim 1, wherein the heat exchange flow passage has a first end at a bend and a second end at an inlet section and an outlet section, and the heat exchange flow passage is stacked from the second end to the first end.

3. The heat exchange assembly of claim 2, wherein the heat exchange flow channel is arranged in a hollow-core configuration on the heat conductive member such that the first end of the heat exchange flow channel is disposed in a middle portion of the heat conductive member.

4. The heat exchange assembly of claim 3, wherein the first flow channel comprises a plurality of first liquid-conducting segments and a plurality of second liquid-conducting segments extending from one end of the first liquid-conducting segments in a bent manner, the second flow channel comprises a plurality of third liquid-conducting segments and a plurality of fourth liquid-conducting segments extending from one end of the third liquid-conducting segments in a bent manner; the third liquid guiding section is arranged between the two adjacent first liquid guiding sections, and/or the fourth liquid guiding section is arranged between the two adjacent second liquid guiding sections.

5. The heat exchange assembly of claim 4, wherein the first liquid conducting section is parallel to the third liquid conducting section and the second liquid conducting section is parallel to the fourth liquid conducting section.

6. A heat exchange assembly according to any one of claims 1 to 3, wherein the heat conducting member comprises a first heat exchange plate and a second heat exchange plate, the first heat exchange plate and the second heat exchange plate being connected to form the heat exchange flow passage.

7. A heat exchange assembly according to any one of claims 1 to 3, wherein the heat exchange flow passage has a first wall surface and a second wall surface which are oppositely arranged in the height direction of the heat conducting member, the first wall surface is spaced from a connecting surface of the heat conducting member by a first distance, the second wall surface is spaced from the connecting surface by a second distance, the heat exchange flow passage extends in such a manner that the first distance is constant and the second distance is gradually reduced in the fluid flow direction, and the connecting surface is used for heat conduction connection with an object to be heat exchanged.

8. A heat exchange assembly according to any one of claims 1 to 3, wherein the liquid inlet section and the liquid outlet section of the heat exchange flow passage are provided on the same side of the heat conducting member.

9. A heat exchange assembly according to any one of claims 1 to 3, wherein a flow dividing plate is arranged in the heat exchange flow passage near the object to be heat exchanged along the height direction of the heat conducting member.

10. A heat exchange assembly as claimed in claim 9, in which the number of fins disposed at the rear of the heat exchange flow passage is less than the number of fins disposed at the front of the heat exchange flow passage.

11. A heat exchange assembly according to any one of claims 1 to 3, wherein the first wall of the heat exchange flow passage is provided with ribs.