JP2019079908A - Cooling device and semiconductor module including the same - Google Patents

Abstract

To provide a cooling device capable of improving a cooling capacity while suppressing an increase in pressure loss.SOLUTION: A cooling device includes a base plate provided with a heating element, a top plate provided so as to face the base plate, a first flow path formed in parallel in the width direction between the base plate and the top plate and communicating with a downstream portion located on the top plate side via a first replacement portion from the upstream portion located on the base plate side, which is one of flow paths through which a refrigerant flows, and a second flow path arranged in combination with the first flow path and communicating with the downstream portion located on the base plate side via a second replacement portion from the upstream portion located on the top plate side, which is one of the flow paths through which a refrigerant flows.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a cooling device for cooling the heat generation of an electronic device.

  In recent years, the heat generation density tends to increase as the size and output of electronic devices decrease. Therefore, in order to operate electronic devices stably, it is important to develop highly efficient cooling technology. As such a cooling technique, conventionally, a cooling device has been known in which a plurality of heat radiation fins are arranged in parallel, and a refrigerant is allowed to flow in one direction between the fins to cool the electronic device. However, in this conventional cooling device, since the heat transfer coefficient in the thickness direction in which the electronic device is provided is small, it has been difficult to perform sufficient heat exchange. On the other hand, for example, Patent Document 1 discloses a cooling device that promotes heat exchange by agitating the refrigerant in a refrigerant flow path in which diagonal members are provided between a plurality of vertical members stacked in the thickness direction. ing.

JP, 2010-114174, A (page 8, FIG. 3)

  However, in the case of a cooling device in which a plurality of flow paths cross each other and the refrigerant is agitated, a sudden change in the flow path cross section generates a swirl and pressure loss increases, so the flow rate of the refrigerant flowing into the cooling device decreases. There is a problem that the cooling capacity for the equipment is reduced.

  The present invention has been made to solve the problems as described above, and it is an object of the present invention to provide a cooling device capable of improving the cooling capacity by suppressing an increase in pressure loss.

  The cooling device according to the present invention is formed in parallel in the width direction between the base plate provided with the heating element, the top plate provided opposite to the base plate, and the base plate and the top plate, and the refrigerant flows And a first flow path communicating with the downstream portion located on the top plate side via the first replacement portion from the upstream portion located on the base plate side, and the first flow path It is another one of the flow paths through which the refrigerant flows, which is arranged in combination, and is communicated from the upstream portion located on the top plate side to the downstream portion located on the base plate side via the second replacement portion. And a second flow path.

  A semiconductor module according to the present invention comprises a cooling device, and a semiconductor element as a heating element on at least one surface of a base plate or a top plate of the cooling device.

  According to the present invention, a low temperature refrigerant can be supplied in the vicinity of a base plate provided with a heating element, and a cooling device that improves the cooling capacity by suppressing an increase in pressure loss can be realized. In addition, a semiconductor module with high cooling capacity can be realized.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic block diagram of the cooling system provided with the cooling device which concerns on Embodiment 1 of this invention. It is a schematic block diagram which shows the cooling device which concerns on Embodiment 1 of this invention. It is a schematic block diagram which shows the flow-path structure of the cooling device which concerns on Embodiment 1 of this invention. It is a schematic block diagram which shows the flow-path cross section of the cooling device which concerns on Embodiment 1 of this invention. It is a schematic block diagram which shows the flow-path cross section of the cooling device which concerns on Embodiment 1 of this invention. It is the schematic which shows the numerical analysis model about a part of comb heat sink which is comparison object of the cooling device which concerns on Embodiment 1 of this invention. It is the schematic which shows the numerical analysis model about a part of cooling device which concerns on Embodiment 1 of this invention. It is a graph which shows the temperature of the base plate of the cooling device and the relationship of pressure loss which concern on Embodiment 1 of this invention. It is a temperature contour figure which shows refrigerant | coolant temperature of a cooling device and the cross-sectional temperature distribution of a base plate which concern on Embodiment 1 of this invention. It is a schematic block diagram which shows the cooling device which concerns on Embodiment 2 of this invention. It is a schematic block diagram which shows the cooling device which concerns on Embodiment 3 of this invention. It is a schematic block diagram which shows the cooling device concerning Embodiment 4 to this invention. It is a schematic block diagram which shows the cooling device which concerns on Embodiment 5 of this invention. It is a schematic block diagram which shows the semiconductor module concerning Embodiment 6 of this invention.

  Hereinafter, embodiments according to the present invention will be described with reference to the drawings.

Embodiment 1
FIG. 1 is a schematic configuration view showing a cooling system provided with a cooling device according to Embodiment 1 of the present invention. As shown in FIGS. 1A and 1B, the cooling system 100 includes a cooling device 1 and a refrigerant driving device 2. The refrigerant drive device 2 supplies the refrigerant 3 flowing in the flow direction 32 in the cooling pipe 31 to the cooling device 1. The cooling device 1 circulates the refrigerant 3, receives heat, and dissipates heat to the external environment. The cooling system 100 is a system in which, for example, as shown in FIG. 1A, the refrigerant 3 circulates by returning to the refrigerant driving device 2 again after flowing through the cooling device 1. Further, as shown in FIG. 1 (b), it may be a system in which the refrigerant 3 is discharged to the outside environment as it is without being circulated. Here, the refrigerant 3 may be a gas or a liquid, and includes air, hydrogen, water, ethanol, acetone and the like.

  The refrigerant driving device 2 uses a fan in the case of the air cooling type and a pump in the case of the water cooling type. Here, as the fan, for example, an axial fan, a centrifugal fan, a mixed flow fan, a cross flow fan or the like can be used. The pump may be, for example, a turbo pump such as an axial flow pump, a centrifugal pump or a mixed flow pump, or a positive displacement pump. In addition, for example, a pump using the jet injection force of water or steam, a pump using compressed air, or the like may be used.

  FIG. 2 is a schematic configuration view showing a cooling device according to the present invention. FIG. 2A is a perspective view of the cooling device in which the heating element is disposed. FIG.2 (b), FIG.2 (c) is the top view and side view which saw through a part of the inside of the cooling device of FIG. 2 (a). A coordinate axis in which the width direction of the cooling device 1 is X axis, the longitudinal direction is Y axis, and the thickness direction is Z axis will be described.

  As shown in FIG. 2 (c), the cooling device 1 is configured to have a base plate 11 and a top plate 12. A heating element 4 is disposed on the base plate 11 of the cooling device 1. The cooling device 1 is attached to the heating element 4 via a grease having excellent thermal conductivity, a sheet, a heat spreader having high thermal diffusivity, a carbon fiber member (graphite sheet), and the like. The heat generated from the heating element 4 exchanges heat with the refrigerant 3 flowing through the cooling device 1 and is dissipated. Here, FIG. 2 shows an example in which the heating element 4 is provided on the base plate 11, but it may be provided on the top plate 12 as long as it is provided on at least one side.

  Between the base plate 11 and the top plate 12 of the cooling device 1, a refrigerant flow path 10 in which the Y direction is the flow direction 32 is formed. The refrigerant channel 10 has, for example, inlets 181 and 182 of the two stages of the refrigerant 3 in the Z direction, and two channels of the first channel 5 and the second channel 6 are combined and configured. Further, as shown in FIGS. 2A and 2B, a plurality of refrigerant channels 10 are formed in parallel in the X direction. The material of the cooling device 1 may be, for example, a metal having a high thermal conductivity, such as aluminum or copper.

  FIG. 3 is a schematic configuration view showing a flow passage structure of the cooling device according to the present invention. FIG. 3A is a perspective view of a flow channel structure in which the first flow channel and the second flow channel are combined. FIG.3 (b), FIG.3 (c) is the perspective view which each isolate | separated the 1st flow path and the 2nd flow path. As shown in FIG. 3A, in the refrigerant flow path 10, the first flow path 5 and the second flow path 6, which are formed separately from each other, are combined, and the refrigerant 3 flows in the process of flowing The positional relationship with the top plate 12 is interchanged.

  As shown in FIG. 3B, the first flow path 5 has an inlet 181 branched into two on the base plate 11 side, and is branched into two in the upstream portion located on the base plate 11 side. Flow paths merge. After merging, it is branched into two again at the downstream portion via the first switching portion 171 communicating with the upstream portion on the base plate 11 side to the downstream portion on the top plate 12 side, and two flows on the top plate 12 side It has an outlet 191. Further, as shown in FIG. 3C, the second flow path 6 has an inlet 182 branched into two on the top plate 12 side, and is branched at an upstream portion located on the top plate 12 side. The channels merge. After merging, it is branched into two again at the downstream portion via the second switching portion 172 communicating with the upstream portion on the top plate 12 side to the downstream portion on the base plate 11 side, and two flows on the top plate 12 side It has an outlet 192.

  As described above, the first flow path 5 and the second flow path 6 can exchange the positional relationship between the base plate 11 side on which the heating element 4 is provided and the top plate 12 side. Since the first flow path 5 and the second flow path 6 are separately formed, the heat of the refrigerant 3 flowing in the respective flow paths is less likely to be transmitted to each other, and the base plate 11 side provided with the heating element 4 The refrigerants 3 having different temperatures can be generated on the top plate 12 side.

  Here, the first flow path 5 and the second flow path 6 are formed of, for example, the first member and the second member of the same size and shape, and one is rotated 180 degrees around the Y axis and combined with one another. It forms a shape. The rectangular parallelepiped shape is a shape in which all surfaces are formed in a rectangular shape. Here, it goes without saying that the surface on which the refrigerant 3 flows in and out is opened. By being formed in this manner, a plurality of two combined flow paths can be provided in parallel in the width direction of the cooling device 1 without enlarging the entire cooling device 1.

  FIG. 4 is a perspective view of the first channel and the second channel, and a channel sectional view at each position. Here, the flow channel cross section is a cross section orthogonal to the flow direction 32 of the refrigerant 3. The first flow path 5 and the second flow path 6 have branch flow path portions 13a and 13b, merging flow path portions 14a and 14b, L-shaped flow path portions 15a and 15b, and parallel flow path portions 16a.

  The first channel 5 is located on the base plate 11 side, and the second channel 6 is located on the top plate 12 as branch channel 13a, merging channel 14a, and L-shaped channel 15a. The first flow path 5 is located on the top plate 12 side, and the second flow path 6 is located on the base plate 11 side. The flow path portion 13b, the merging flow path portion 14b, and the L-shaped flow path portion 15b Do. Here, the flow path portion refers to a partial flow path at each position along the flow direction 32 of the refrigerant 3 of the first flow path 5 and the second flow path 6.

  The first flow path 5 and the second flow path 6 form a branch flow path portion 13a and a merging flow path portion 14a sequentially in the upstream portion, and an L-shaped flow path portion 15a, a parallel flow path portion 16a, and an L-shaped It communicates with the junction flow path portion 14b and the branch flow path portion 13b at the downstream portion via the flow path portion 15b. A portion in which the L-shaped flow passage portion 15a, the parallel flow passage portion 16a, and the L-shaped flow passage portion 15b communicate in this order is referred to as a replacement portion 17a. The replacement portion 17 a corresponds to a portion obtained by putting together the first replacement portion 171 formed in the first flow path 5 and the second replacement portion 172 formed in the second flow path 6 described above.

  In the upstream branch flow path portion 13a, the first flow path 5 and the second flow path 6 are arranged in two upper and lower stages, and are branched into two in the width direction. The positional relationship between the first flow path 5 and the second flow path 6 is such that the first flow path 5 is located on the base plate 11 side and the second flow path 6 is located on the top plate 12 side. The refrigerant 3 flows in parallel to the four flow paths. Here, the number of branches is not limited to two, and may be further branched. As described above, the plurality of flow paths are branched in the upstream branch flow path portion 13a, so that the heat exchange between the refrigerant 3 and the heating element 4 can be efficiently performed.

  In the merging channel portion 14a, the first channel 5 and the second channel 6 are branched into two channels, and each channel is connected to form one channel. The first flow path 5 is connected to the upper end of the flow path, and the second flow path 6 is connected to the lower end. Here, the first flow path 5 and the second flow path 6 are formed such that the flows in the X direction when the refrigerants 3 merge become opposite to each other. For example, when the refrigerant 3 flowing in the first flow path 5 flows in the negative direction of X, the refrigerant 3 flowing in the second flow path 6 flows in the positive direction of X.

  In the branch flow passage portion 13a and the merging flow passage portion 14a, the refrigerant 3 flowing in the first flow passage 5 located on the base plate 11 side receives heat generated from the heating element 4 provided in the base plate 11, The temperature rises. On the other hand, the refrigerant 3 flowing in the second flow path 6 located on the top plate 12 side is disposed with the second flow path 6 separated from the base plate 11 and separately from the first flow path 5 Therefore, the temperature is lower than that of the refrigerant 3 flowing through the first flow path 5. As described above, in the branch flow channel portion 13a and the merging flow channel portion 14a, the first flow channel 5 on the base plate 11 side and the second flow channel 6 on the top plate 12 side are separately disposed separately and arranged. , Refrigerants 3 having different temperatures can be produced.

  In the L-shaped flow path portion 15a, the first flow path 5 is formed at the bottom on the base plate 11 side and one side in the width direction as viewed from the flow direction 32 of the refrigerant 3, and the second flow path 6 is And the other side in the width direction on the top plate 12 side of the refrigerant flow passage 10 and has an L-shaped flow passage cross section. In the parallel flow passage portion 16a, the first flow passage 5 and the second flow passage 6 are respectively formed on one side and the other side of the refrigerant flow passage 10 in the width direction, and are arranged in parallel. Furthermore, in the L-shaped flow passage portion 15b passing through the parallel flow passage portion 16a, the first flow passage 5 is formed in the upper portion on the top panel 12 side and one side portion in the width direction. It is formed on the bottom on the side of the base plate 11 and the other side in the width direction, and has an L-shaped channel cross section.

  FIG. 5 is a schematic configuration view showing a cross section of the flow passage in the replacement part. As shown in FIG. 5, in the alternate portion 17 a, in the cross section orthogonal to the flow direction 32 of the refrigerant 3, the first flow path 5 is centered on a position where the width direction and thickness direction are middle, ie, the middle position. The second flow path 6 is formed to turn clockwise or counterclockwise in the course of the flow path. Thus, it is possible to generate a swirling flow based on the Y axis in the process of circulating the refrigerant 3 in the first flow passage 5 and the second flow passage 6. By this swirling flow, the flow can be disturbed to improve the heat transfer to the base plate 11 on which the heating element 4 is provided.

  Further, in the L-shaped flow path portions 15 a and 15 b, the mutually facing surfaces of the first flow path 5 and the second flow path 6 are formed to be inclined with respect to the flow direction 32. Therefore, in the L-shaped flow passage portion 15a, the side portions in the width direction of each of the first flow passage 5 and the second flow passage 6 are gradually elongated, and in the L-shaped flow passage portion 15b, gradually shortened. Change. Further, the first flow path 5 and the second flow path 6 are shaped so as to be point-symmetrical with respect to the center of the swirl, and are formed to have the same flow area in the cross section orthogonal to the flow direction 32 There is. As described above, by forming the L-shaped flow path portions 15a and 15b, even in the flow path process in which the refrigerant 3 is switched so that the refrigerant 3 is swirled, the change in the cross-sectional area of the flow path can be suppressed small. It is possible to suppress an increase in pressure loss due to the road resistance. Moreover, the flow path part which the refrigerant | coolant 3 turns is made into the flow-path cross section of L character, and the increase in pressure loss can be suppressed more by enlarging the equivalent diameter of a flow path. Furthermore, when the refrigerant 3 flows from the top plate 12 side to the base plate 11 side, a collision flow to the base plate 11 can be generated, and heat transfer to the base plate 11 can be locally improved.

  In the merging channel portion 14 b, the first channel 5 and the second channel 6 are arranged in two upper and lower stages. The first flow path 5 is located on the top plate 12 side, and its upper end is bifurcated. The second flow path 6 is located on the side of the base plate 11, and the lower end is separated into two. In the branch flow channel portion 13b, the first flow channel 5 and the second flow channel 6 each form a flow channel branched into two in the width direction.

  As described above, the refrigerant whose temperature is high due to the structure in which the first flow path 5 and the second flow path 6 combined with each other are interchanged in the thickness direction on the side of the base plate 11 and the top plate 12 side where the heating element 4 is provided. The refrigerant 3 having a low temperature can be supplied from the top plate 12 side to the base plate 11 side from the base plate 11 side to the top plate 12 side. By supplying the low temperature refrigerant 3 in the vicinity of the base plate 11 on which the heating element 4 is provided, the cooling capacity can be improved.

  Next, the effects of the cooling device 1 according to the first embodiment of the present invention will be described. In order to grasp the flow of the cooling device 1 according to the first embodiment, three-dimensional numerical thermal fluid analysis was performed using numerical analysis software (FLOW-DESIGNER).

  As a comparison object of the cooling device 1 according to the first embodiment, a plurality of conventional fins 20 are arranged in parallel, and a comb-shaped heat sink that circulates the refrigerant 3 in one direction between the fins 20 is used. FIG. 6 is a schematic diagram showing a numerical analysis model for a part of the comb heat sink. FIG. 6A is a perspective view of the comb-shaped heat sink. FIG. 6 (b) is a front view of the comb-shaped heat sink viewed from the flow direction.

  The thickness of the base plate 11 of the comb-shaped heat sink is 1.5 mm, the thickness of the fins 20 is 0.5 mm, the pitch of the fins 20 is 1 mm, the height of the fins 20 is 5 mm, the depth is 50 mm, the material is aluminum (thermal conductivity It was set as = 220 W / m * K). The coolant 3 is water at a temperature of 25 ° C., the inlet 183 has a flow velocity of 0.28 m / s, 0.42 m / s, 0.56 m / s, and the outlet 193 has a pressure of 0 Pa. Further, on the bottom surface of the comb-shaped heat sink, a heating element 4 with a calorific value of 20 W is simulated. In addition, the number of meshes is 4 million mesh, and calculation was performed by a laminar flow model.

  FIG. 7 is a schematic view showing a numerical analysis model of a part of the cooling device according to Embodiment 1 of the present invention. FIG. 7A shows a perspective view of a model of a part of the cooling device 1. FIG.7 (b) is a front view of the cooling device seen from the flow direction. FIG. 7C is a side view of the cooling device. The model of the cooling device 1 has the same thickness as the comb-like heat sink in FIG. 6, the thickness of the base plate 11, the thickness, the pitch, the height, the depth, and the material of the fins 20. In addition, the thickness of the fins 20 in the Z direction of the branch flow path portions 13a and 13b is 0.5 mm, and the inclination angle of the replacement portion 17a is 30 °. Hereinafter, FIG. 6 is referred to as a model A (comb-shaped heat sink), and FIG. 7 is referred to as a model B (first embodiment).

  FIG. 8 is a graph showing the results of numerical analysis of temperature [° C.]-Pressure loss [Pa] of the base plate of model A (comb-shaped heat sink) and model B (embodiment 1). It can be confirmed that the temperature of the base plate 11 of the model B (Embodiment 1) is lowered by about 1 K at the same pressure loss as compared with the conventional model A (comb-shaped heat sink). Therefore, the cooling device 1 according to the first embodiment can improve the heat transfer to the base plate 11 on which the heating element 4 is provided, without depending on the ability of the refrigerant driving device 2.

  FIG. 9 is a temperature contour diagram showing the refrigerant temperature between the fins of the model A (comb-shaped heat sink) and the model B (embodiment 1) and the cross-sectional temperature distribution of the base plate when the flow velocity is 0.28 m / s. . FIG. 9A is a cross-sectional temperature distribution when each model is viewed from the side. FIG.9 (b) is cross-sectional temperature distribution which expanded base plate 11 exit vicinity of FIG. 9 (a). Since the model A (comb-shaped heat sink) is a uniform flow in one direction along the base plate 11, it can be confirmed that the temperature boundary layer is developed as it goes from the upstream portion to the downstream portion.

  On the other hand, in Model B (Embodiment 1), the low temperature refrigerant 3 flows from the top plate 12 side to the base plate 11 side, whereby the temperature on the base plate 11 side is lowered in the replacement portion 17a. You can confirm that. Therefore, the cooling device 1 according to the first embodiment can cause the leading edge effect to thin the temperature boundary layer by circulating the low temperature refrigerant 3 to the base plate 11 side, and the heat transfer to the base plate 11 can be achieved. It can be improved.

  As described above, in the present embodiment, the first flow path 5 and the second flow path 6 combined with each other are replaced by the base plate 11 side and the top plate 12 side, whereby the heating element 4 is provided. The low temperature refrigerant 3 can be supplied near the base plate 11 to improve the cooling capacity. Further, by forming the L-shaped flow path portion 15a, the parallel flow path portion 16a, and the L-shaped flow path portion 15b, a swirling flow and a collision flow are generated, and heat transfer to the base plate 11 provided with the heating element 4 Can be improved. Furthermore, in the flow path process in which the refrigerant 3 is turned upside down, the change in cross-sectional area of the flow path is suppressed to a small value, whereby an increase in pressure loss can be suppressed.

  As a matter of course, the first flow path 5 and the second flow path 6 are interchanged, and the first flow path 5 communicates from the top panel 12 side to the base plate 11 side, and the second flow path 6 from the base plate 11 side It may be in communication with the top plate 12 side.

  In addition, dimensions such as height, width, length, etc. of the branch flow paths 13a and 13b, the merging flow paths 14a and 14b, the L-shaped flow path 15a, and the parallel flow path 16a of the cooling device 1 The angle of inclination of and the like may be changed as appropriate. The shape of each flow path may be, for example, a rectangular flow path, a circular flow path, or a trapezoidal flow path.

  Moreover, the 1st flow path 5 and the 2nd flow path 6 should just be the structure where the base board 11 side and the top-plate 12 side mutually interchange, and the structure which does not comprise branch flow-path part 13a, 13b is also possible.

Second Embodiment
A cooling device 1 according to a second embodiment for carrying out the present invention will be described with reference to FIG. FIG. 10 is a schematic configuration view showing a cooling device according to Embodiment 2 of the present invention. The description overlapping with that of the cooling device 1 according to the first embodiment is appropriately simplified or omitted.

  In this embodiment, in addition to the interchanged portion 17a communicating with the L-shaped flow passage portion 15a, the parallel flow passage portion 16a, and the L-shaped flow passage portion 15b in order, the L-shaped flow passage portion 15b and the parallel flow passage portion 16b, it has composition which has exchange part 17b connected in order of L character type channel part 15a. Here, the parallel flow passage portion 16b is a flow passage portion having an L-shaped flow passage portion 15b at the upstream portion and an L-shaped flow passage portion 15a at the downstream portion.

  As shown in FIG. 10, in the first flow path 5, after communicating from the upstream portion located on the base plate 11 side to the downstream portion located on the top plate 12 side, the top plate 12 side further communicates from the top plate 12 side Do. Further, in the second flow path 6, after communicating from the upstream portion located on the top plate 12 side to the downstream portion located on the base plate 11 side, the second channel 6 further communicates from the base plate 11 side to the top plate 12 side.

  Even in such a configuration, as in the first embodiment, the first flow path 5 and the second flow path 6 are formed so as to be interchanged on the base plate 11 side and the top plate 12 side, thereby improving the cooling capacity. It can be done. Furthermore, in the present embodiment, the first flow path 5 and the second flow path 6 are provided with the replacement portion 17b, so that the swirl flow is promoted and heat transfer to the base plate 11 on which the heating element 4 is provided is improved. It can be done.

  In the present embodiment, the first flow path 5 and the second flow path 6 are configured to have one replacement portion 17a and one replacement portion 17b, but the number of replacement portions 17a and 17b is the same as that of the present invention. You may increase suitably in the range which does not deviate from the meaning. By providing a plurality of replacement parts 17a and 17b as described above, the low temperature refrigerant 3 can be supplied at a plurality of positions of the base plate 11 where the heating element 4 is provided, and the cooling capacity can be improved. Further, the swirling flow is further promoted, and the heat transfer to the base plate 11 on which the heating element 4 is provided can be improved.

Third Embodiment
A cooling device 1 according to a third embodiment for carrying out the present invention will be described with reference to FIG. FIG. 11 is a schematic side view showing a cooling device according to Embodiment 3 of the present invention. In addition, the description which overlaps with the cooling device 1 which concerns on Embodiment 1 and 2 is simplified or abbreviate | omitted suitably.

  In the present embodiment, a plurality of refrigerant channels 10 configured by the first channel 5 and the second channel 6 are stacked between the base plate 11 and the top plate 12. The refrigerant flow path 10 formed on the top plate 12 does not contact the base plate 11 on which the heating element 4 is provided, so that the low temperature refrigerant 3 always flows.

  Even in such a configuration, as in the first embodiment, the first flow path 5 and the second flow path 6 are formed so as to be interchanged on the base plate 11 side and the top plate 12 side, thereby improving the cooling capacity. It can be done. Furthermore, in the present embodiment, it is possible to always supply the low temperature refrigerant 3 to the base plate 11 by using two or more laminated flow paths, and heat transfer to the base plate 11 on which the heating element 4 is provided. It can be improved.

Fourth Embodiment
In the first to third embodiments, the flow paths through which the refrigerant 3 flows in and out are the branch flow paths 13a and 13b, respectively. However, the present invention is not limited to this. FIG. 12 is a schematic configuration view showing a cooling device according to Embodiment 4 of the present invention. The first flow path 5 and the second flow path 6 are, from the upstream side, a parallel flow path portion 16b, an L-shaped flow path portion 15a, a merging flow path portion 14a, a branch flow path portion 13a, a merging flow path portion 14a, an L-shaped The flow path portion 15a, the parallel flow path portion 16a, the L-shaped flow path portion 15b, the merging flow path portion 14b, and the branch flow path portion 13b are formed to be continuous in this order. As described above, if the first flow path 5 and the second flow path 6 are formed so as to be exchanged between the base plate 11 side and the top plate 12 side in the process of circulating the refrigerant 3, The shape does not matter.

Embodiment 5
A cooling device 1 according to a fifth embodiment for carrying out the present invention will be described with reference to FIG. FIG. 13 is a schematic side view showing a cooling device according to Embodiment 5 of the present invention. The description overlapping with that of the cooling device 1 according to the first to fourth embodiments is appropriately simplified or omitted.

  In the present embodiment, the flow passage cross section of the refrigerant flow passage 10 configured by the first flow passage 5 and the second flow passage 6 is L-shaped flow passage portion 15a, parallel flow passage portion 16a, L-shaped flow passage portion It is formed to circulate in order of 15b, the parallel flow path part 16b, and the L-shaped flow path part 15a. That is, in the first flow path 5 and the second flow path 6, the replacement portion 17a and the replacement portion 17b are alternately formed.

  In such a configuration, while the refrigerant 3 flows in the Y direction, a clockwise or counterclockwise swirling flow is always generated on the ZX plane, and the flow is disturbed so that the heat to the base plate 11 provided with the heating element 4 is generated. Transmission can be improved.

Sixth Embodiment
A semiconductor module 200 according to a sixth embodiment of the present invention will be described with reference to FIG. FIG. 14 is a side view showing a semiconductor module according to the sixth embodiment of the present invention. The description overlapping with that of the cooling device 1 according to the first to fifth embodiments is appropriately simplified or omitted.

  In the present embodiment, the semiconductor element 4 which is a heating element is disposed on the base plate 11 of the cooling device 1 to form the semiconductor module 200. The semiconductor element 4 is attached to the cooling device 1 via a grease having excellent thermal conductivity, a sheet, a heat spreader having high thermal diffusivity, a carbon fiber member (graphite sheet), and the like. The semiconductor element 4 is disposed, for example, in the vicinity of the upstream side of the replacement portion 17 a of the first flow path 5 and the second flow path 6.

  Even in such a configuration, as in the first embodiment, the first flow path 5 and the second flow path 6 are formed so as to be interchanged on the base plate 11 side and the top plate 12 side, thereby improving the cooling capacity. It can be done. Furthermore, in the present embodiment, the semiconductor element 4 is attached to the cooling device 1 to form the semiconductor module 200. Thus, a semiconductor module with high cooling capacity can be realized. In addition, by arranging the semiconductor element 4 in the vicinity of the upstream side of the replacement portion 17a of the first flow path 5 and the second flow path 6, it is possible to efficiently cool the region where the temperature is relatively high, that is, the hot spot. Can.

  DESCRIPTION OF SYMBOLS 100 Cooling system, 200 semiconductor module, 1 cooling device, 2 refrigerant drive device, 3 refrigerant, 32 flow direction, 4 heat generating body, 5 1st flow path, 6 2nd flow path, 10 refrigerant flow path, 11 base plate, 12 Top plate, 13a, 13b branch flow channel section, 14a, 14b merge flow channel section, 15a, 15b L-shaped flow channel section, 16a, 16b parallel flow channel section, 17a, 17b replacement section, 181, 182, 183 inlet 191, 192, 193 outlet, 20 fins.

Claims (11)

A base plate provided with a heating element;
A top plate provided opposite to the base plate;
A plurality of parallel formed in the width direction between the base plate and the top plate, which is one of the flow paths through which the refrigerant flows, from the upstream portion located on the base plate side through the first replacement portion A first flow passage communicating with the downstream portion located on the top plate side;
It is another one of the flow paths which is disposed in combination with the first flow path and through which the refrigerant flows, and from the upstream portion located on the top plate side to the base via the second replacement portion A cooling device comprising: a second flow passage communicating with a downstream portion located on a plate side. Each of the first and second replacement sections is configured to pivot about an intermediate position between the first flow path and the second flow path in a cross section orthogonal to the flow of the refrigerant. The cooling device according to claim 1, wherein the cooling device is formed in Each of the upstream portions of the first flow path and the second flow path is branched into a plurality of portions, and the upstream portions are joined together before reaching the first switching portion and the second switching portion. The cooling device according to claim 1. The cross section which intersects perpendicularly to the flow of the refrigerant is L character at least one of the 1st exchange part and the 2nd exchange part according to any one of claims 1 to 3 characterized by the above-mentioned Cooling system. The cooling device according to any one of claims 1 to 4, wherein the first flow path and the second flow path are combined with each other to have a rectangular parallelepiped shape. The first flow path communicates with the base plate further from the downstream portion located on the top plate side, and the second flow path further extends from the downstream portion located on the base plate side The cooling device according to any one of claims 1 to 5, wherein the cooling device is in communication with The cooling device according to any one of claims 1 to 6, wherein a plurality of the first flow paths and the second flow paths are stacked between the base plate and the top plate. The cooling device according to any one of claims 1 to 7,
A semiconductor module comprising a semiconductor element as a heating element on at least one surface of the base plate or the top plate of the cooling device. Base plate,
A first flow path receiving heat from the base plate;
And a second flow passage which is separated from the first flow passage and whose positional relationship with the first flow passage is interchanged along the surface direction of the base plate. The first channel is formed in a first member, and the second channel is formed in a second member,
The cooling device according to claim 9, wherein the first member and the second member are combined with each other. The cooling device according to claim 9, wherein one of the first flow path and the second flow path is positioned on the base plate side in the positional relationship.

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