JP2010177484A - Stacked cooling device, and method of manufacturing cooling tube used for the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a stacked cooling device capable of effectively cooling an electronic component on the downstream side. <P>SOLUTION: The stacked cooling device is constituted by alternately stacking cooling tubes 2 and the electronic components. The inside of cooling tube is divided into four layers, and includes a first cooling medium switching portion 5a which exchanges, inside the tube, a cooling medium 7 of a first flow channel and a cooling medium of a second flow channel. In addition, the inside of cooling tube includes a second cooling medium switching portion 5b which exchanges, inside the tube, a cooling medium 7 of a third flow channel and a cooling medium 7 of a fourth flow channel. Thus, the electronic component 3 on the downstream side can be cooled by the cooling medium 7 which is low in temperature. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a stacked cooling apparatus capable of effectively cooling an electronic component and a method of manufacturing a cooling pipe used therefor.

  2. Description of the Related Art Conventionally, a multilayer cooling device is known in which electronic components that generate heat when energized and cooling pipes are alternately stacked and the electronic components are cooled by the cooling pipes.

FIG. 14 shows a partial cross-sectional view of a conventional stacked cooling apparatus. As shown in the figure, the stacked cooling device 90 is configured by alternately stacking cooling pipes 91 and electronic components 92. Two electronic components 92 (an upstream electronic component 92 a and a downstream electronic component 92 b) are in contact with one surface of each cooling pipe 91. In the cooling pipe 91, a refrigerant 94 flows in the pipe, and the electronic components 92 a and 92 b are cooled by the refrigerant 94.
An inner fin 95 made of corrugated plates is provided in the cooling pipe 91. The inner fin 95 increases the contact area with the refrigerant 94, so that the cooling efficiency of the electronic component 92 can be increased.

JP 2005-191527 A

As shown in FIG. 14, the conventional stacked cooling device 90 cools the upstream electronic component 92 a and the downstream 92 b by a single cooling pipe 91. Therefore, the temperature of the refrigerant 94 rises due to the heat of the electronic component 92a on the upstream side, and the electronic component 92b on the downstream side is cooled by using the refrigerant 94 whose temperature has increased. There is a problem that the cooling efficiency of the component 92b is not improved.
FIG. 15 is a sectional view taken along the line CC in FIG. As shown in the figure, the refrigerant 94 is in a state called laminar flow in which only the vicinity 94a of the surface of the inner fin 95 has a high temperature and the portion 94b far from the surface has a low temperature. Since the laminar flow is difficult to be stirred in the cooling pipe, it flows downstream as it is, and the electronic component 92b on the downstream side is cooled by the high temperature portion 94a. In such a state, there is a problem that the cooling efficiency of the electronic component 92b on the downstream side does not particularly increase.

  The present invention has been made in view of such a conventional problem, and an object of the present invention is to provide a stacked cooling device capable of effectively cooling a downstream electronic component.

The present invention is a stacked cooling device configured to alternately stack electronic components that generate heat when energized and cooling tubes in which refrigerant flows in the tubes, and cool the electronic components from both sides,
The cooling pipe has a first pipe wall and a second pipe wall that come into contact with the electronic components on both outer surfaces thereof,
A first flow path, a second flow path, a third flow path, and a fourth flow path are sequentially formed between the first tube wall and the second tube wall from the first tube wall side. The first partition, the second partition, and the third partition are arranged in parallel,
In the middle of the first partition, the refrigerant flowing through the first flow path flows into the second flow path, and the refrigerant flowing through the second flow path flows into the first flow path. A first refrigerant switching unit that switches a flow direction of the refrigerant;
In the middle of the third partition, the refrigerant flowing through the third flow path flows into the fourth flow path, and the refrigerant flowing through the fourth flow path flows into the third flow path. A second refrigerant switching unit that switches a flow direction of the refrigerant;
The first pipe wall is in contact with the electronic component at a first upstream cooling surface and a first downstream cooling surface located upstream and downstream of the first refrigerant switching unit, respectively.
The second pipe wall is configured to be in contact with the electronic component at a second upstream cooling surface and a second downstream cooling surface located upstream and downstream of the second refrigerant switching unit, respectively. The present invention resides in a stacked cooling device (claim 1).

Next, the effects of the present invention will be described.
In the present invention, the refrigerant in the first channel and the refrigerant in the second channel are exchanged in the cooling pipe. That is, the refrigerant that flows upstream of the first flow path and is warmed by the electronic component on the first upstream cooling surface flows downstream of the second flow path. Moreover, the refrigerant | coolant which flows the upstream of a 2nd flow path and is low temperature is flowed to the downstream of the 1st flow path. Therefore, the downstream electronic component can be cooled using a refrigerant having a low temperature.
Moreover, in this invention, the refrigerant | coolant of a 3rd flow path and the refrigerant | coolant of a 4th flow path are replaced in the cooling pipe. That is, the refrigerant that flows upstream of the fourth flow path and is warmed by the electronic component on the second upstream cooling surface flows downstream of the third flow path. And the refrigerant | coolant which flows the upstream of the 3rd flow path and is low temperature is flowed to the downstream of the 4th flow path. Therefore, the downstream electronic component can be cooled using a refrigerant having a low temperature.

  As described above, according to the present invention, it is possible to provide a stacked cooling device capable of effectively cooling downstream electronic components.

FIG. 3 is an exploded perspective view of the stacked cooling device according to the first embodiment. FIG. 2 is a partially cutaway perspective view of the cooling pipe in the first embodiment, which is written with the cooling pipe of FIG. FIG. 3 is a partially cutaway perspective view in which the first flow path and the second flow path are removed from the cooling pipe of FIG. 2. AA sectional drawing of FIG. BB sectional drawing of FIG. FIG. 3 is an enlarged perspective view of the first refrigerant switching unit and its periphery in the first embodiment. FIG. 3 is an enlarged perspective view of a second refrigerant switching unit and its periphery in the first embodiment. The expanded perspective view of the components for 1st refrigerant | coolant switching parts in Example 1. FIG. The figure for demonstrating the manufacturing process of the cooling pipe in Example 1. FIG. FIG. 3 is a circuit diagram in which electronic components are combined in the first embodiment. The figure for demonstrating the manufacturing process of the cooling pipe in Example 2. FIG. The figure following FIG. Sectional drawing of the cooling pipe in Example 3. FIG. Sectional drawing of the laminated | stacked cooling device in a prior art example. CC sectional drawing of FIG.

A preferred embodiment of the present invention described above will be described.
In the present invention, positions corresponding to the first upstream cooling surface and the first downstream cooling surface in the first flow path, and the second upstream cooling surface and the second downstream side in the fourth flow path. Inner fins for increasing the contact area with the refrigerant and increasing the cooling efficiency are provided at positions corresponding to the cooling surface, and the inner fins are provided in the second flow path and the third flow path. It is preferable that there is no (claim 2).
In this case, since the inner fins are arranged only in the flow paths (first flow path and fourth flow path) necessary for cooling the electronic component, compared to the case where the inner fins are arranged in all the flow paths, The resistance of the refrigerant can be reduced.

Further, the first refrigerant switching unit includes a first cutout portion cut out so as to divide the first partition wall into an upstream side and a downstream side,
A first partition plate provided in the first notch so as to be orthogonal to the first partition wall and partitioning the first flow path and the second flow path in the width direction;
At the upstream end edge of the first cutout portion, the first mixing prevention plate that blocks one side in the width direction of the first flow path defined by the first partition plate and the first partition plate A second mixing prevention plate for closing the other side in the width direction of the second flow path;
At the downstream edge of the first notch, the third mixing prevention plate that blocks the other side in the width direction of the first flow path defined by the first partition plate and the first partition plate A fourth mixing prevention plate for closing one side in the width direction of the second flow path,
The second refrigerant switching unit includes a second cutout portion cut out to divide the third partition wall into an upstream side and a downstream side;
A second partition plate provided in the second notch so as to be orthogonal to the third partition wall, and dividing the third channel and the fourth channel in the width direction;
At the upstream end edge of the second notch, the fifth mixing prevention plate that closes one side in the width direction of the third flow path defined by the second partition plate and the second partition plate A sixth mixing prevention plate for closing the other side in the width direction of the fourth flow path;
At the downstream edge of the second notch, the seventh mixing prevention plate that blocks the other side in the width direction of the third flow path defined by the second partition plate and the second partition plate Preferably, the fourth flow path is constituted by an eighth mixing prevention plate that closes one side in the width direction of the fourth flow path.
In this case, a part of the refrigerant flowing through the first flow path is blocked by the first mixing preventing plate in the first refrigerant switching unit, and the first partition plate and the third mixing plate are blocked. Due to the presence of the prevention plate, it flows into the second flow path through the first notch and proceeds. Similarly, a part of the refrigerant flowing through the second flow path is blocked by the second mixing prevention plate, and passes through the first notch due to the presence of the first partition plate and the fourth mixing prevention plate. And flows into the first flow path.
And the refrigerant | coolant which flowed through the said 3rd flow path and the 4th flow path changes a flow direction in a 2nd refrigerant | coolant switching part similarly to the above. Thereby, the flow of the refrigerant can be switched reliably in the cooling pipe, and the problem that the high temperature refrigerant and the low temperature refrigerant are mixed is less likely to occur. Therefore, it is possible to effectively cool the electronic component on the downstream side.

The method of manufacturing the cooling pipe used in the stacked cooling device includes the first refrigerant switching in which the first partition plate and the first to fourth mixing prevention plates are integrated by pressing a sheet metal. Manufacturing a part part, manufacturing a second refrigerant switching part part in which the second partition plate and the fifth to eighth mixing prevention plates are integrated, and the first notch part A step of arranging and fixing the first refrigerant switching part component and a step of arranging and fixing the second refrigerant switching part component in the second notch portion are provided (claim 4). ).
In this case, since the first refrigerant switching part component and the second refrigerant switching part component are formed by pressing one sheet metal, compared with the case where the individual prevention plates are formed by brazing or the like. Thus, the first refrigerant switching part component and the second refrigerant switching part component can be easily manufactured.

In addition, a method of manufacturing a cooling pipe used in the stacked cooling device includes the steps of processing the first partition to form the first to fourth mixing prevention plates and the first notch, and the first notch. A step of arranging and fixing the first partition plate at a portion, a step of processing the third partition wall to form the fifth to eighth mixing prevention plates and the second cutout portion, and the second cutout portion. And a step of disposing and fixing the second partition plate (Claim 5).
When the first to fourth mixing prevention plates and the first partition plate are integrated by pressing, a relatively complicated shape is required, but the first partition is processed as described above. When the first to fourth mixing prevention plates are formed, a mold having a relatively simple shape can be used. In addition, the fifth to eighth mixing prevention plates can be manufactured with a mold having the same shape.

Example 1
A stacked cooling apparatus according to an embodiment of the present invention will be described with reference to FIGS. FIG. 1 is an exploded perspective view of the laminated cooling apparatus 1, and FIG. 2 is a partially cutaway perspective view of the cooling pipe 2. FIG. 3 is a partially cutaway perspective view showing only the lower half of FIG. 4 is a cross-sectional view taken along the line AA in FIG. 2, and FIG. 5 is a cross-sectional view taken along the line BB in FIG.

As shown in FIG. 1, the present invention is a stacked cooling apparatus in which electronic parts 3 that generate heat when energized and cooling pipes 2 in which a refrigerant 7 flows are alternately stacked, and the electronic parts 3 are cooled from both sides. 1.
As shown in FIG. 2, the cooling pipe 2 has a first pipe wall 2 a and a second pipe wall 2 b that are in contact with the electronic component 3 on both outer surfaces thereof.
As shown in FIGS. 2, 4, and 5, the first flow path 21 and the second flow path 22 are sequentially arranged between the first tube wall 2a and the second tube wall 2b from the first tube wall 2a side. The first partition 4a, the second partition 4b, and the third partition 4c are sequentially arranged in parallel so as to form the third channel 23 and the fourth channel 24.
In the middle of the first partition wall 4a, the refrigerant 7 flowing through the first flow path 21 flows into the second flow path 22, and the refrigerant 7 flowing through the second flow path 22 flows into the first flow path 21. It has the 1st refrigerant | coolant switching part 5a which switches the flow direction of the refrigerant | coolant 7 so that it may do.
Further, as shown in FIGS. 3 to 5, in the middle of the third partition wall 4 c, the refrigerant 7 flowing through the third flow path 23 flows into the fourth flow path 24 and flows through the fourth flow path 24. A second refrigerant switching unit 5b that switches the flow direction of the refrigerant 7 so that the refrigerant 7 flows into the third flow path 23.
As shown in FIGS. 4 and 5, the first pipe wall 2 a is formed on the first upstream cooling surface 20 a and the first downstream cooling surface 20 b that are located upstream and downstream of the first refrigerant switching unit 5 a. Each is in contact with the electronic component 3.
And the 2nd pipe wall 2b is comprised so that it may contact with the electronic component 3 in the 2nd upstream cooling surface 20c and the 2nd downstream cooling surface 20d located in the upstream and downstream rather than the 2nd refrigerant | coolant switching part 5b, respectively. Has been.
Further details will be described below.

As shown in FIG. 1, the stacked cooling apparatus 1 includes a connecting portion 10 for connecting adjacent cooling pipes 2 to each other, an introduction pipe 11 for the refrigerant 7, and a lead-out pipe 12. By introducing the refrigerant 7 from the introduction pipe 11, the refrigerant 7 flows through all the cooling pipes 2 and cools the electronic component 3.
An IGBT element and a flywheel diode are sealed inside the electronic component 3 (see FIG. 10), and this electronic component 3 constitutes an inverter described later.

  On the other hand, as shown in FIG. 2, the cooling pipe 2 includes a first side wall 2c and a second side wall 2d. The first tube wall 2a, the second tube wall 2b, the first side wall 2c, and the second side wall 2d described above constitute the outer wall of the cooling tube 2 having a square cross section.

2-5, the position corresponding to the 1st upstream cooling surface 20a and the 1st downstream cooling surface 20b in the 1st flow path 21, and the 2nd upstream cooling surface in the 4th flow path 24 are shown. Inner fins 6 for increasing the contact area with the refrigerant 7 and increasing the cooling efficiency are provided at positions corresponding to the 20c and the second downstream cooling surface 20d, respectively, and the second flow path 22 and the third flow path 23 are provided. Are not provided with inner fins 6.
The inner fin 6 is formed of a corrugated plate as shown in FIG. 2, and is in contact with the first tube wall 2a or the second tube wall 2b. The heat generated from the electronic component 3 is transmitted to the inner fin 6 through the first tube wall 2a or the second tube wall 2b and is cooled by the refrigerant 7.

Moreover, as shown in FIG. 6, the 1st refrigerant | coolant switching part 5a is provided with the 1st notch part 201 notched so that the 1st partition 4a might be divided into the upstream and the downstream.
Moreover, the 1st partition plate 61 provided in the 1st notch part 201 so as to be orthogonal to the 1st partition 4a and partitioning the 1st flow path 21 and the 2nd flow path 22 in the width direction is provided.
A first mixing prevention plate 51 that closes one side in the width direction of the first flow path 21 partitioned by the first partition plate 61 at the upstream edge 203 of the first notch 201 and the first partition plate 61. The second mixing prevention plate 52 is provided to close the other side in the width direction of the second flow path 22 partitioned by.
Furthermore, a third mixing prevention plate 53 that closes the other side in the width direction of the first flow path 21 defined by the first partition plate 61 at the downstream edge 204 of the first notch 201, and the first partition plate 61. And a fourth mixing prevention plate 54 that closes one side in the width direction of the second flow path 22 partitioned by.

On the other hand, as shown in FIG. 7, the 2nd refrigerant | coolant switching part 5b is provided with the 2nd notch part 202 notched so that the 3rd partition 4c might be divided into the upstream and downstream.
In addition, a second partition plate 62 is provided in the second notch 202 so as to be orthogonal to the third partition wall 4c and partitions the third flow path 23 and the fourth flow path 24 in the width direction.
Then, at the upstream edge 205 of the second notch 202, a fifth mixing prevention plate 55 that closes one side in the width direction of the third flow path 23 partitioned by the second partition plate 62, and the second partition plate 62. The sixth mixing prevention plate 56 is provided to close the other side in the width direction of the fourth flow path 24 partitioned by.
Further, a seventh mixing prevention plate 57 that closes the other side in the width direction of the third flow path 23 partitioned by the second partition plate 62 at the downstream end edge 206 of the second notch 202, and the second partition plate 62. And an eighth mixing prevention plate 58 that closes one side in the width direction of the fourth flow path 24 partitioned by.

In other words, as shown in FIG. 6, the first mixing prevention plate 51 includes the upstream edge 203 of the first notch 201, the upstream edge 61 a of the first partition 61, and the first side wall 2 c (FIG. 6). And a portion surrounded by the first tube wall 2a is closed. The second mixing prevention plate 52 is surrounded by the upstream edge 203 of the first notch 201, the upstream edge 61a of the first partition 61, the second side wall 2d, and the second partition 4b. The part is blocked.
Further, the third mixing prevention plate 53 is surrounded by the downstream end edge 204 of the first notch 201, the downstream end edge 61b of the first partition plate 61, the second side wall 2d, and the first tube wall 2a. The part to be closed is blocked. The fourth mixing prevention plate 54 is surrounded by the downstream edge 204 of the first notch 201, the downstream edge 61b of the first partition 61, the first side wall 2c, and the second partition 4b. The part is blocked.

Further, as shown in FIG. 7, the fifth mixing prevention plate 55 includes an upstream end edge 205 of the second notch 202, an upstream end edge 62a of the second partition plate 62, and a first side wall 2c (in FIG. 7). And a portion surrounded by the second partition wall 4b is closed. The sixth mixing prevention plate 56 is surrounded by the upstream end edge 205 of the second notch 202, the upstream end edge 62a of the second partition plate 62, the second side wall 2d, and the second tube wall 2b. The part to be closed is blocked.
Furthermore, the seventh mixing prevention plate 57 is surrounded by the downstream end edge 206 of the second notch 202, the downstream end edge 62b of the second partition plate 62, the second side wall 2d, and the second partition wall 4b. The part is blocked. The eighth mixing prevention plate 58 is surrounded by the downstream end edge 206 of the second notch 202, the downstream end edge 62b of the second partition plate 62, the first side wall 2c, and the second tube wall 2b. The part to be closed is blocked.

  Next, the manufacturing method of the cooling pipe 2 used for the laminated cooling apparatus 1 of this example is demonstrated. First, as shown in FIG. 8, the first coolant switching part component 50 a in which the first partition plate 61 and the first to fourth mixing prevention plates 54 are integrated is manufactured by pressing a sheet metal. Similarly, the second refrigerant switching part component 50b in which the second partition plate 62 and the fifth to eighth mixing prevention plates 58 are integrated is manufactured by pressing the sheet metal.

  On the other hand, as shown in FIG. 9, a member A in which a part of the first side wall 2c and the second side wall 2d and the first tube wall 2a are integrated, a part of the first side wall 2c and the second side wall 2d, A member 2B in which the two pipe walls 2b are integrated is prepared. As shown in the figure, the member 2B, the inner fin 6, the third partition 4c, the second refrigerant switching part component 50b, the second partition 4b, the first refrigerant switching part component 50a, and the first partition 4a The inner fin 6 and the member 2A are sequentially arranged. A brazing material is attached to the first to third partition walls 4c, the first refrigerant switching part component 50a, and the second refrigerant switching part component 50b, and is brazed by heating so that these members are fixed. The

Next, a circuit diagram of the inverter 8 configured by connecting the electronic component 3 is shown in FIG. As illustrated, the electronic component 3 is sealed with an IGBT element 31 and a flywheel diode 32. The collector terminal of one electronic component 3a and the emitter terminal of the other electronic component 3b are DC input terminals. Also, the emitter terminal of one electronic component 3a and the collector terminal of the other electronic component 3b are connected to form an AC output terminal. Three-phase AC motors 81 and 82 are connected to the AC output terminal.
Further, a converter 83 for boosting the voltage of the DC power supply 80 and a smoothing capacitor 84 are provided.
The inverter 8 is mounted on a vehicle. The inverter 8 converts the voltage of the DC power source 80 into AC, and drives the three-phase AC motors 81 and 82 to drive the vehicle.

Next, the effect of the laminated cooling apparatus 1 of this example will be described.
As shown in FIGS. 2 to 5, in this example, the cooling pipe 2 is divided into four layers, and the refrigerant 7 in the first flow path 21 and the second flow path 22 is switched by the first refrigerant switching portion 5 a. That is, the refrigerant 7 that flows upstream of the first flow path 21 and is warmed by the electronic component 3 (first upstream cooling surface 20a) flows to the downstream side of the second flow path 22, and the upstream side of the second flow path 22 flows. The flowing refrigerant 7 having a low temperature is caused to flow downstream of the first flow path 21. Thereby, the downstream electronic component 3 (1st downstream cooling surface 20b) can be cooled using the refrigerant | coolant 7 with low temperature.
Further, the refrigerant 7 in the third flow path 23 and the fourth flow path 24 is exchanged by the second refrigerant switching unit 5b. That is, the refrigerant 7 that flows upstream of the fourth flow path 24 and is warmed to the electronic component 3 by the electronic component 3 (second upstream cooling surface 20c) flows to the downstream side of the third flow path 23. The refrigerant 7 having a low temperature that has flowed upstream of the flow channel 23 flows downstream of the fourth flow path 24. Thereby, the downstream electronic component 3 (2nd downstream cooling surface 20d) can be cooled using the refrigerant | coolant 7 with low temperature.

As shown in FIGS. 2 to 5, in this example, the inner fin 6 is provided only in the first flow path 21 and the fourth flow path 24 of the cooling pipe 2, and the second flow path 22 and the third flow path 23. No inner fin 6 is provided.
In this case, since the inner fins 6 are disposed only in the flow paths (the first flow path 21 and the fourth flow path 24) necessary for cooling the electronic component 3, the inner fins 6 are disposed in all the flow paths. As compared with, the resistance of the refrigerant 7 can be reduced.

Moreover, in this example, the 1st refrigerant | coolant switching part 5a and the 2nd refrigerant | coolant switching part 5b are made into the shape shown in FIG. 6, FIG. If it does in this way, a part of refrigerant 7 which has flowed through the 1st channel 21 will be blocked by the 1st mixing prevention board 51 in the 1st refrigerant change part 5a, and the 1st partition plate 61 and the 3rd mixing Due to the presence of the prevention plate 53, it flows into the second flow path 22 through the first notch 201 and proceeds. Similarly, a part of the refrigerant 7 flowing through the second flow path 22 is blocked by the second mixing prevention plate 52, and the first notch 201 is provided by the presence of the first partition plate 61 and the fourth mixing prevention plate 54. It flows into the 1st flow path 21 through, and advances.
Then, the refrigerant 7 that has flowed through the third flow path 23 and the fourth flow path 24 changes the flow direction in the second refrigerant switching section 5b in the same manner as described above. Thereby, the flow of the refrigerant | coolant 7 can be switched reliably within the cooling pipe 2, and it becomes difficult to produce the problem that the refrigerant | coolant 7 with a high temperature and the refrigerant | coolant 7 with a low temperature mix. Therefore, it is possible to effectively cool the downstream electronic component 3.

Moreover, in this example, the 1st refrigerant | coolant switching part component 50a and the 2nd refrigerant | coolant switching part component 50b of the shape shown in FIG. 8 are manufactured by pressing a sheet metal. Then, as shown in FIG. 9, the first refrigerant switching part component 50 a and the second refrigerant switching part component 50 b are arranged together with other components, and fixed by brazing to manufacture the cooling pipe 2.
In this case, since the first refrigerant switching unit 5a and the second refrigerant switching unit 5b are formed by pressing one sheet metal, the first part is compared with the case where each part is formed by brazing or the like. The first refrigerant switching part component 50a and the second refrigerant switching part component 50b can be easily manufactured.

  As described above, according to this example, it is possible to provide the stacked cooling device 1 that can effectively cool the electronic component 3 on the downstream side.

(Example 2)
In this example, the manufacturing method of the cooling pipe 2 is changed. First, as shown in FIG. 11, the 1st partition 4a in which the notch part is not formed is prepared. And as shown in FIG. 12, the 1st-4th mixing prevention board 54 and the 1st notch part 201 are formed by pressing the 1st partition 4a. Thereafter, the first partition plate 61 is disposed in the first notch 201 and fixed by brazing or the like.
Similarly, a third partition 4c in which a notch is not formed is prepared. And as shown in FIG. 12, the 5th-8th mixing prevention board 58 and the 2nd notch part 202 are formed by pressing the 3rd partition 4c. Then, a 2nd partition plate is arrange | positioned and fixed to the 2nd notch part 202. FIG.
In addition, the configuration is the same as that of the first embodiment.

When the first to fourth mixing prevention plates and the first partition plate are integrated by pressing, a relatively complicated shape is required, but the first partition is processed as described above. When the first to fourth mixing prevention plates are formed, a mold having a relatively simple shape can be used. In addition, the fifth to eighth mixing prevention plates can be manufactured with a mold having the same shape.
In addition, the same effects as those of the first embodiment are obtained.

(Example 3)
In this example, the shape of the cooling pipe 2 is changed. In this example, as shown in FIG. 13, a member 2A ′ including the first tube wall 2a and having the end portions 207 and 208 bent, and a member 2B ′ including the second tube wall 2b and having the end portions 207 and 208 bent. Is used. Then, the member 2A ′, the second partition wall 4b, and the member 2B ′ are overlapped and crimped at the end portions 207 and 208.
If it does in this way, member 2A 'and 2B' can be connected firmly.
In addition, the configuration and operational effects are the same as those of the first embodiment.

DESCRIPTION OF SYMBOLS 1 Stack type cooling device 2 Cooling pipe 2a 1st pipe wall 2b 2nd pipe wall 2c 1st side wall 2d 2nd side wall 20a 1st upstream cooling surface 20b 1st downstream cooling surface 20c 2nd upstream cooling surface 20d 2nd Downstream cooling surface 21 1st flow path 22 2nd flow path 23 3rd flow path 24 4th flow path 3 Electronic component 4a 1st partition 4b 2nd partition 4c 3rd partition 5a 1st refrigerant | coolant switching part 5b 2nd refrigerant | coolant switching Part 6 Inner fin 7 Refrigerant

Claims (5)

An electronic component that generates heat when energized and a cooling tube in which a refrigerant flows in the tube are alternately stacked, and is a stacked cooling device configured to cool the electronic component from both sides,
The cooling pipe has a first pipe wall and a second pipe wall that come into contact with the electronic components on both outer surfaces thereof,
A first flow path, a second flow path, a third flow path, and a fourth flow path are sequentially formed between the first tube wall and the second tube wall from the first tube wall side. The first partition, the second partition, and the third partition are arranged in parallel,
In the middle of the first partition, the refrigerant flowing through the first flow path flows into the second flow path, and the refrigerant flowing through the second flow path flows into the first flow path. A first refrigerant switching unit that switches a flow direction of the refrigerant;
In the middle of the third partition, the refrigerant flowing through the third flow path flows into the fourth flow path, and the refrigerant flowing through the fourth flow path flows into the third flow path. A second refrigerant switching unit that switches a flow direction of the refrigerant;
The first pipe wall is in contact with the electronic component at a first upstream cooling surface and a first downstream cooling surface located upstream and downstream of the first refrigerant switching unit, respectively.
The second pipe wall is configured to be in contact with the electronic component at a second upstream cooling surface and a second downstream cooling surface located upstream and downstream of the second refrigerant switching unit, respectively. A laminated cooling device characterized by the above.   2. The position according to claim 1, corresponding to the first upstream cooling surface and the first downstream cooling surface in the first flow path, and the second upstream cooling surface and the second downstream position in the fourth flow path. Inner fins for increasing the contact area with the refrigerant and increasing the cooling efficiency are respectively provided at positions corresponding to the side cooling surfaces, and the inner fins are provided in the second flow path and the third flow path. A laminated cooling device characterized by not having any. In Claim 1 or Claim 2, the 1st refrigerant change part is the 1st notch which notched so that the 1st partition might be divided into the upper stream side and the lower stream side,
A first partition plate provided in the first notch so as to be orthogonal to the first partition wall and partitioning the first flow path and the second flow path in the width direction;
At the upstream end edge of the first cutout portion, the first mixing prevention plate that blocks one side in the width direction of the first flow path defined by the first partition plate and the first partition plate A second mixing prevention plate for closing the other side in the width direction of the second flow path;
At the downstream edge of the first notch, the third mixing prevention plate that blocks the other side in the width direction of the first flow path defined by the first partition plate and the first partition plate A fourth mixing prevention plate for closing one side in the width direction of the second flow path,
The second refrigerant switching unit includes a second cutout portion cut out to divide the third partition wall into an upstream side and a downstream side;
A second partition plate provided in the second notch so as to be orthogonal to the third partition wall, and dividing the third channel and the fourth channel in the width direction;
At the upstream end edge of the second notch, the fifth mixing prevention plate that closes one side in the width direction of the third flow path defined by the second partition plate and the second partition plate A sixth mixing prevention plate for closing the other side in the width direction of the fourth flow path;
At the downstream edge of the second notch, the seventh mixing prevention plate that blocks the other side in the width direction of the third flow path defined by the second partition plate and the second partition plate A laminated cooling apparatus comprising: an eighth mixing prevention plate that closes one side in the width direction of the fourth flow path.   4. A method of manufacturing a cooling pipe used in the stacked cooling device according to claim 3, wherein the first partition plate and the first to fourth mixing prevention plates are integrated by pressing a sheet metal. Manufacturing the first refrigerant switching part component, manufacturing the second refrigerant switching part component in which the second partition plate and the fifth to eighth mixing prevention plates are integrated, and the second And a step of arranging and fixing the first refrigerant switching part component in one notch, and a step of arranging and fixing the second refrigerant switching part component in the second notch. Manufacturing method for cooling pipe.   It is a manufacturing method of the cooling pipe used for the lamination type cooling device according to claim 3, and processes the above-mentioned 1st partition, and forms the above-mentioned 1st-the 4th mixed prevention board and the above-mentioned 1st notch part, A step of arranging and fixing the first partition plate in the first notch, a step of processing the third partition wall to form the fifth to eighth mixing prevention plates and the second notch, And a step of disposing and fixing the second partition plate in the second notch.

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