JP2010010418A - Laminated cooler - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laminated cooler having an excellent cooling capacity. <P>SOLUTION: The laminated cooler for cooling a plurality of electronic components 6 from both sides. The laminated cooler includes a plurality of cooling tubes 2 in which cooling medium channels 21 are disposed for flowing a cooling medium, and a communication part for communicating a plurality of the cooling tubes 2. The cooling tube 2 includes a plurality of the cooling medium flow channels 21 partitioned by middle plates 26 in the lamination direction. In at least one of the plurality of cooling flow channels 21, a plurality of inner fins 7 are disposed in layers in the lamination direction. Between the inner fins 7 piled in layers, a flat plate shaped middle fin 25 is disposed contacting both of the inner fin. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a stacked cooler for cooling a plurality of electronic components from both sides.

Conventionally, as shown in part of FIG. 13, in order to dissipate heat from a semiconductor module 91 containing a semiconductor element, a laminated type in which a cooling pipe 92 is disposed so as to sandwich the semiconductor module 91 from both sides. There is a cooler 9 (Patent Document 1).
The stacked cooler 9 has a configuration in which the semiconductor modules 91 and the cooling pipes 92 are alternately stacked (see FIG. 3). The plurality of stacked cooling pipes 92 are communicated with each other by a communicating portion, and a cooling medium is configured to flow through each cooling pipe 92.

The cooling pipe 92 of the stacked cooler 9 has a refrigerant flow path divided into two in the stacking direction. As a result, when the amount of heat generated between the semiconductor module 91 arranged in contact with one surface of the cooling pipe 92 and the semiconductor module 91 arranged in contact with the other surface are different, they are mutually affected by the heat of both. Can be prevented.
Each refrigerant flow path 921 is provided with an inner fin 97 having an uneven cross section. Thereby, the heat transfer area between the cooling medium and the cooling pipe 92 is increased to improve the heat radiation efficiency.

JP 2004-252886 A

However, with the recent miniaturization and higher performance of inverters and the like, the heat generation density of each semiconductor module 91 tends to increase, and there is a demand for a stacked type cooler with better cooling performance.
From the viewpoint of expansion of the heat transfer area by the inner fins 97, it is preferable that the inner fins 97 are arranged as densely as possible in the refrigerant flow path 921, but if the arrangement density is too high, the flow of the cooling medium due to clogging or the like. There is a problem that the resistance becomes too large and the cooling efficiency decreases. Therefore, it is conceivable to improve the cooling efficiency by designing the flow resistance and the heat transfer area of the cooling medium to have an appropriate balance. Thus, the inventors have found that the flow resistance is unlikely to decrease if the cross section of the small flow path 923 in which the refrigerant flow path 921 is partitioned by the inner fins 7 is larger than a circle having a diameter of 0.9 mm.

  On the other hand, in the conventional laminated cooler 9, the small flow path 923 in which the refrigerant flow path 921 is partitioned by the inner fins 7 has a large height L3 in the laminating direction, for example, L3 = 1.89 mm. A vessel 9 is used. Accordingly, there is room for increasing the heat transfer area, and there is room for improving the cooling efficiency.

  The present invention has been made in view of such conventional problems, and an object of the present invention is to provide a stacked cooler having an excellent cooling capacity.

A first invention is a stacked type cooler for cooling a plurality of electronic components from both sides,
The stacked cooler has a plurality of cooling pipes provided with a refrigerant flow path for circulating a cooling medium, and a communication portion that communicates the plurality of cooling pipes.
The cooling pipe has a plurality of refrigerant flow paths partitioned in the stacking direction by an intermediate plate,
At least one of the plurality of refrigerant channels is provided with a plurality of inner fins stacked in the stacking direction,
A laminated cooler is characterized in that flat-plate intermediate fins that are in contact with each other are interposed between the inner fins stacked on each other.

Next, the effects of the present invention will be described.
In the cooling pipe, a plurality of inner fins stacked in the stacking direction are disposed in at least one of the plurality of refrigerant flow paths, and the intermediate fins are interposed between the inner fins stacked on each other. . Thereby, the heat transfer area between the cooling medium and the inner fins in the refrigerant flow path can be increased. As a result, the cooling efficiency of the electronic component can be improved.

  As described above, according to the present invention, it is possible to provide a stacked cooler having an excellent cooling capacity.

A second invention is a stacked cooler for cooling a plurality of electronic components from both sides,
The stacked cooler has a plurality of cooling pipes provided with a refrigerant flow path for circulating a cooling medium, and a communication portion that communicates the plurality of cooling pipes.
The cooling pipe is provided with a plurality of inner fins stacked in the stacking direction in the refrigerant flow path,
Among the plurality of inner fins, at least one inner fin is a wave fin whose cross-sectional shape orthogonal to the stacking direction is a wave shape,
The inner fins adjacent to each other in the stacking direction are arranged so that their shapes do not overlap each other when viewed from the stacking direction (claim 8).

Next, the effects of the present invention will be described.
The cooling pipe includes a plurality of inner fins stacked in the stacking direction in the refrigerant flow path, and at least one of the inner fins is the wave fin. Wave inner fins have a larger surface area than straight inner fins having the same longitudinal length in the refrigerant flow path. Therefore, by providing the wave fin, the contact area with the cooling medium is increased. That is, the heat transfer area of the cooling pipe from the cooling medium can be increased, and the heat transfer efficiency can be improved. As a result, the cooling efficiency of the electronic component can be improved.

  Further, by providing the wave fins, at least a part of the cooling medium flowing through the refrigerant flow path advances while meandering along the wave fins instead of going straight through the cooling pipe. Therefore, the cooling medium is easily mixed in the refrigerant flow path, and the cooling efficiency can be further improved.

  Further, the wave fin can easily secure a space between the wave fin and another inner fin adjacent in the stacking direction without using the intermediate fin in the first invention (invention 1). Therefore, since it is not necessary to provide the intermediate fins, the cooling medium can be moved between the refrigerant flow paths between the inner fins and mixed with each other, so that the cooling efficiency can be further improved.

  As described above, according to the present invention, it is possible to provide a stacked cooler having an excellent cooling capacity.

In the first invention (invention 1) and the second invention (invention 8), the electronic component can be, for example, a semiconductor module incorporating a semiconductor element such as an IGBT and a diode. And this semiconductor module can be used for the inverter for motor vehicles, the motor drive inverter of industrial equipment, the air conditioner inverter for building air conditioning, etc.
In addition to the semiconductor module, for example, a power transistor, a power FET, or an IGBT can be used as the electronic component.

Examples of the cooling medium include water mixed with ethylene glycol antifreeze, natural refrigerants such as water and ammonia, fluorocarbon refrigerants such as fluorinate, chlorofluorocarbon refrigerants such as HCFC123 and HFC134a, methanol, alcohol, and the like. Alcohol-based refrigerants such as acetone and ketone-based refrigerants such as acetone can be used.
In this specification, the “stacking direction” refers to a direction in which a plurality of the electronic components and a plurality of the cooling pipes are stacked.

  In the first invention (invention 1), it is preferable that a plurality of inner fins are laminated in all of the plurality of refrigerant flow paths in the cooling pipe. In this case, the heat transfer area can be increased over the entire cooling pipe, and the cooling capacity of the stacked cooler can be further improved.

It is preferable that a through hole is formed in the intermediate fin.
In this case, it becomes possible for the cooling medium to move between the adjacent refrigerant flow channels with the intermediate fin interposed therebetween through the through hole, and the cooling efficiency can be improved.

Moreover, it is preferable that the intermediate fin is formed with a protruding portion protruding in the thickness direction.
In this case, the flow of the cooling medium can be disturbed at the protrusion. Thereby, the cooling medium which a partial temperature difference produced can be mixed, and cooling efficiency can be improved more.

Further, the inner fin has a concave-convex shape in which a cross-sectional shape orthogonal to the longitudinal direction of the cooling pipe is continuous, and the inner fin overlapped with each other via the intermediate fin has the concave-convex shape of one inner fin. It is preferable that the convex portion and the concave portion of the other inner fin are arranged to face each other.
In this case, the heat transfer area between the cooling medium and the inner fin can be improved, and the load bearing strength in the stacking direction of the cooling pipes can be improved.

Preferably, the one intermediate fin and the two inner fins adjacent to the intermediate fin are formed by folding one metal plate.
In this case, the productivity of the cooling pipe can be improved.

Further, the inner fin may be a straight fin whose cross-sectional shape perpendicular to the stacking direction is parallel to the longitudinal direction of the cooling pipe.
In this case, a sufficient heat transfer area between the cooling medium and the inner fin can be secured easily and reliably.

The inner fin is preferably a wave fin having a corrugated cross section perpendicular to the stacking direction.
In this case, the heat transfer area between the cooling medium and the inner fin can be further increased, and the flow of the cooling medium can be meandered. Thereby, the cooling efficiency of an electronic component can be improved effectively.

Next, in the second invention (invention 8), it is preferable that the plurality of inner fins arranged in the cooling pipe are all composed of the wave fins (invention 9).
In this case, it is possible to further increase the heat transfer area and to form and mix the turbulent flow of the cooling medium, thereby improving the cooling efficiency of the electronic component.

In addition, a plurality of the wave fins are arranged adjacent to the cooling pipe, and the wave fins adjacent to each other in the stacking direction are located at the same position in the longitudinal direction of the cooling pipe. (Claim 10).
In this case, the cooling medium flowing along one wave fin and the cooling medium flowing along the other wave fin are in a meandering manner opposite to each other. Cooling efficiency can be improved. Further, the heat transfer area with the cooling medium can be increased. Furthermore, the load bearing strength in the stacking direction of the cooling pipes can be improved.

Preferably, three or more inner fins are arranged in the stacking direction in the cooling pipe.
In this case, the heat transfer area between the cooling medium and the inner fin can be further improved, and the cooling efficiency can be improved.

Further, it is preferable that the two inner fins adjacent to each other in the stacking direction are formed by folding one metal plate.
In this case, the productivity of the cooling pipe can be improved.

Example 1
A stacked cooler according to an embodiment of the present invention will be described with reference to FIGS.
The stacked cooler 1 of this example cools a plurality of electronic components 6 from both sides.
As shown in FIG. 3, the stacked cooler 1 includes a plurality of cooling pipes 2 provided with a refrigerant flow path 21 through which the cooling medium 5 circulates, and a communication portion 3 that communicates the plurality of cooling pipes 2.

  The cooling pipe 2 has two refrigerant channels 21 partitioned in the stacking direction by the intermediate plate 26. Each refrigerant channel 21 is provided with a plurality of inner fins 7 stacked in the stacking direction. Between the adjacent inner fins 7, flat plate-shaped intermediate fins 25 that are in contact with both are interposed.

  The intermediate plate 26 is formed over the entire length of the cooling pipe 2. However, an opening is formed in the intermediate plate 26 at a position corresponding to a portion that forms the communication portion 3. When the heat generation amount between the electronic component 6 disposed in contact with one surface of the cooling pipe 21 and the electronic component 6 disposed in contact with the other surface is different due to the intermediate plate 26, the influence of the heat of the both is affected. You can prevent them from receiving each other.

As shown in FIG. 4, the intermediate fins 25 are spaced apart from each other at two locations in the longitudinal direction of the cooling pipe 3. The inner fin 7 is disposed in the same region as the portion where the intermediate fin 25 is disposed.
The region where the inner fins 7 are disposed includes a region where the electronic component 6 and the cooling pipe 2 are in contact with each other, and is a wider region.

As shown in FIGS. 1 and 2, the inner fin 7 has an uneven shape in which the shape of the cross section orthogonal to the longitudinal direction of the cooling pipe 2 is continuous. In the inner fins 7 that are adjacent to each other through the intermediate fins 25, the concave and convex portions 74 of the one inner fin 7 and the concave portions 75 of the other inner fin 7 are arranged to face each other. That is, the uneven shapes of the adjacent inner fins 7 are in opposite phases to each other.
As shown in FIG. 4, the inner fin 7 is a straight fin whose cross-sectional shape perpendicular to the stacking direction is parallel to the longitudinal direction of the cooling pipe 2.

  Further, as shown in FIG. 2, the small flow path 211 in which the refrigerant flow path 21 is partitioned by the inner fin 7 is L1 when the height in the stacking direction is L1 and the width in the direction orthogonal to the stacking direction and the longitudinal direction is L2. And L2 are both 0.9 mm or more. This is because it becomes difficult to prevent clogging when at least one of L1 and L2 is less than 0.9 mm. Here, L2 is a width measured at the center position in the stacking direction of the small flow paths 211.

  Further, the single intermediate fin 25 and the two inner fins 7 adjacent to the intermediate fin 25 are formed as a single body, and are formed by folding a single metal plate 70 as shown in FIG. That is, one rectangular metal plate 70 is divided into three regions with two straight lines parallel to a pair of parallel sides as boundaries, and the end region 702 other than the central region 701 is pressed into a corrugated shape. Mold. At this time, the corrugated shape formed in the two end regions 702 protrudes to the opposite surfaces with respect to the flat plate portion of the central region 701.

Then, the metal plate 70 is folded at the boundary line between the central region 701 and the end region 702 (arrow S). At this time, the surface on the side opposite to the protruding side of the concavo-convex shape formed in the end region 702 is folded so as to face the central region 701.
Thus, the central region 701 becomes the intermediate fin 25 and the end region 702 becomes the inner fin 7.

The metal plate 70 is made of aluminum and a brazing sheet in which a brazing material is disposed on both sides thereof. After the metal plate 70 is folded in three as described above, the inner fin 7 and the intermediate fin 25 are brazed and joined by applying heat.
Further, as shown in FIG. 1, the laminated body of the intermediate fin 25 and the pair of inner fins 7 is sandwiched between the outer shell plate 22 and the intermediate plate 26 that constitute the outer shell of the cooling pipe 2. The outer shell plate 22 and the intermediate plate 26 are made of aluminum. However, in the case of this example, these do not need to be a brazing sheet like the metal plate 70.

  As shown in FIG. 4, two stacked bodies of the intermediate fins 25 and the pair of inner fins 7 are arranged in the stacking direction at two locations in the longitudinal direction of one cooling pipe 2. And as shown in FIG. 1, the said laminated body will be arrange | positioned between the outer shell plate 22 and the intermediate | middle plate 26 of the cooling pipe 2, respectively.

  The communication portion 3 that communicates adjacent cooling pipes 2 is constituted by a part of the outer shell plate 22. That is, the outer shell plate 22 has an opening provided in the vicinity of both ends in the longitudinal direction, and an opening protrusion 31 in which an outer peripheral portion of the opening protrudes in the stacking direction. The communication portion 3 is configured by fitting the opening protrusion 31 between the adjacent cooling pipes 2.

  In addition, in the vicinity of both ends in the longitudinal direction of the cooling pipe 2 arranged at one end in the stacking direction, a refrigerant inlet 41 for introducing the cooling medium 5 into the stacked cooler 1 and the cooling medium 5 are stacked cooling. A refrigerant discharge port 42 for discharging from the container 1 is connected to each other.

The cooling medium 5 introduced from the refrigerant introduction port 41 flows into the respective cooling pipes 2 from one end through the communication part 3 and flows in the respective refrigerant flow paths 21 toward the other end. . Then, the cooling medium 5 is discharged from the refrigerant discharge port 42 through the communication portion 3 formed at the end portion.
Thus, while the cooling medium 5 flows through the refrigerant flow path 21, heat exchange is performed with the electronic component 6 to cool the electronic component 6.

The electronic component 6 is a semiconductor module including a semiconductor element such as an IGBT and a diode. And this semiconductor module comprises a part of inverter for motor vehicles.
As the cooling medium 5, water mixed with an ethylene glycol antifreeze is used.
Further, the electronic component 6 can be disposed in a state of being in direct contact with the cooling pipe 2. However, in some cases, an insulating plate such as ceramic, thermally conductive grease, or the like may be interposed between the electronic component 6 and the cooling pipe 2.

Next, the function and effect of this example will be described.
In the cooling pipe 2, a plurality of inner fins 7 stacked in the stacking direction are disposed in each refrigerant flow path 21, and intermediate fins 25 are interposed between the inner fins 7 stacked on each other. Thereby, the heat transfer area between the cooling medium and the inner fin 7 in the refrigerant flow path 21 can be increased. As a result, the cooling efficiency of the electronic component 6 can be improved.

Actually, the laminated cooler 1 of this example in which the dimensions of L1 and L2 shown in FIG.
On the other hand, the above-described conventional laminated cooler 9 shown in FIG. 13 was also produced. In the stacked cooler 9, the small flow path 211 in which the refrigerant flow path 21 is divided by the inner fins 7 is L3 = L3 = L3, and L4 = the width in the direction perpendicular to the stacking direction and the longitudinal direction. 1.89 mm and L4 = 0.9 mm.
When both were compared in this state, the heat transfer area of the inner fin 7 in the laminated cooler 1 of this example was improved by about 40% compared to the conventional case, and the thermal resistance could be reduced by about 20%.

  Further, the inner fin 7 has a concave-convex shape in a cross section orthogonal to the longitudinal direction of the cooling pipe 2, and the inner fin 7 adjacent via the intermediate fin 25 has a corrugated convex portion 74 of one inner fin 7. And the recess 75 of the other inner fin 7 are arranged to face each other. Therefore, the heat transfer area between the cooling medium 5 and the inner fin 7 can be improved, and the load bearing strength in the stacking direction of the cooling pipe 2 can be improved.

  Further, as shown in FIG. 5, one intermediate fin 25 and two inner fins 7 adjacent to the intermediate fin 25 are formed by folding one metal plate 70. Therefore, the productivity of the cooling pipe 2 can be improved. That is, since these constituent members can be supplied as one part, the assembly workability can be greatly improved.

  As described above, according to this example, it is possible to provide a stacked type cooler having an excellent cooling capacity.

(Example 2)
In this example, as shown in FIG. 6, a through hole 252 is provided in the intermediate fin 25.
A plurality of the through holes 252 are formed obliquely with respect to the longitudinal direction of the cooling pipe 2.
As shown in FIG. 6, the through hole 252 is provided in the central region 701 of the metal plate 70. The metal plate 70 is folded in the same manner as in the first embodiment to form a laminated body of the intermediate fin 25 and a pair of inner fins 7 disposed in contact with both surfaces thereof.
Others are the same as in the first embodiment.

In the case of this example, it becomes possible for the cooling medium 5 to move between the adjacent refrigerant flow paths 21 with the intermediate fins 25 interposed therebetween through the through holes 252, and the cooling efficiency can be improved.
In addition, the same effects as those of the first embodiment are obtained.

(Example 3)
In this example, as shown in FIGS. 7 and 8, the intermediate fin 25 is formed with a protruding portion 253 protruding in the thickness direction.
Various shapes of the protruding portion 253 and how to form the protruding portion 253 are conceivable.
For example, the protruding portion 253 shown in FIG. 7 is protruded by cutting and bending a part of the intermediate fin 25. In this case, a through hole is also formed in a part of the intermediate fin 25 as a result of cutting and bending.
Further, the protruding portion 253 shown in FIG. 8 is formed in a dimple shape by raising a part of the intermediate fin 25 in the thickness direction.
Others are the same as in the first embodiment.

In the case of this example, the flow of the cooling medium 5 can be disturbed at the protrusion 253. Thereby, the cooling medium 5 in which a partial temperature difference has occurred can be mixed, and the cooling efficiency can be further improved.
In addition, the same effects as those of the first embodiment are obtained.

Example 4
As shown in FIG. 9, this example is an example in which the formation method is changed when the laminated body of the intermediate fins 25 and the inner fins 7 on both sides thereof is formed by one metal plate 70.
That is, the metal plate 70 in this example is divided into five regions, and has one central region 703, intermediate regions 704 on both sides thereof, and end regions 705 at both ends. The inner fin 7 is provided in the central region 703 and the pair of end regions 705. The pair of intermediate regions 704 has a flat plate shape.

Then, at the boundary line between the central region 703 and the intermediate region 704, the pair of intermediate regions 704 are folded so as to overlap the central region 703 on the same plane side, and the boundary between the intermediate region 704 and the end region 705 In the line, the pair of end regions 705 are folded so as to overlap the same surface side of the central region 703 with the intermediate region 704 interposed therebetween.
Thereby, the laminated body which consists of the general intermediate | middle fin 25 and a pair of inner fin 7 of the structure similar to Example 1 can be obtained.
Others are the same as Example 1, and can obtain the same effect.

(Example 5)
In this example, as shown in FIGS. 10 and 11, as the inner fin 7, a wave fin having a corrugated cross-sectional shape orthogonal to the stacking direction is used.
As shown in FIG. 10, the inner fins 7 adjacent to each other in the stacking direction are arranged so that their shapes do not overlap each other when viewed from the stacking direction.

  Between the two inner fins 7 adjacent to each other in the stacking direction, those corresponding to the intermediate fins 25 in the first embodiment are not disposed, and the pair of inner fins 7 are in direct contact with each other. And the laminated body of a pair of inner fin 7 is the refrigerant | coolant flow path 21 in the cooling pipe 2 (FIG. 1) instead of the laminated body of the intermediate fin 25 in Example 1, and a pair of inner fin 7 distribute | arranged to the both surface side. 4). That is, two laminated bodies composed of a pair of inner fins 7 are arranged in the lamination direction at two locations in the longitudinal direction of one cooling pipe 2. Specifically, the laminates are respectively disposed in the refrigerant flow paths 21 between the outer shell plate 22 and the intermediate plate 26 of the cooling pipe 2.

The plurality of inner fins 7 arranged in the cooling pipe 2 are all made of wave fins, and the wave fins adjacent to each other in the stacking direction are such that the crests 71 and the troughs 72 are at the same position in the longitudinal direction of the cooling pipe 2 Is arranged. That is, they have shapes that are opposite in phase to each other. And in the intermediate position of the peak part 71 and the trough part 72, the inner fins 7 have overlapped. Moreover, the peak part 71 and the trough part 72 of one inner fin 7 and the trough part 72 and the peak part 71 of the other inner fin 7 overlap each other.
This is because the flow path width D (width in the longitudinal direction of the cooling pipe 2) of the small flow path 211 partitioned by the inner fin 7 is made equal to the wave amplitude of the inner fin 7.

Further, two adjacent inner fins 7 are formed by folding one metal plate 70 as shown in FIG. That is, a single metal plate 70 is divided into two regions, a first region 706 and a second region 707, and irregularities are formed so as to have a waveform having the same phase in plan view. Then, the first region 706 and the second region 707 are folded at the boundary line between them (arrow S) to form a laminate of two inner fins 7 as shown in FIG.
Others are the same as in the first embodiment.

Next, the function and effect of this example will be described.
The cooling pipe 2 includes a plurality of inner fins 7 stacked in the stacking direction in the refrigerant flow path 21, and the plurality of inner fins 7 are wave fins. The surface area of the wave fin is larger than that of a straight inner fin having the same length in the longitudinal direction in the refrigerant flow path 21. Therefore, by providing the wave fin, the contact area with the cooling medium is increased. That is, the heat transfer area of the cooling pipe 2 from the cooling medium can be increased, and the heat transfer efficiency can be improved. As a result, the cooling efficiency of the electronic component 6 can be improved.

  In addition, by providing the wave fins, the cooling medium flowing through the refrigerant flow path 21 does not travel straight through the cooling pipe 2 but proceeds while meandering along the wave fins. Therefore, the cooling medium 5 is easily mixed in the refrigerant flow path 21, and the cooling efficiency can be further improved.

  Further, the wave fin can easily secure a space between the inner fin 7 adjacent in the stacking direction without using the intermediate fin 25 shown in the first embodiment. Therefore, since it is not necessary to provide the intermediate fins 25, the cooling medium can move between the refrigerant flow paths 21 between the inner fins 7 and can be mixed with each other, so that the cooling efficiency can be further improved. it can.

Further, a plurality of wave fins are disposed adjacent to the cooling pipe 2, and the wave fins adjacent to each other are arranged such that the crests 71 and the troughs 72 are at the same position in the longitudinal direction of the cooling pipe 2. Has been. For this reason, the cooling medium 5 flowing along one wave fin and the cooling medium 5 flowing along the other wave fin are in a meandering direction opposite to each other. Cooling efficiency can be improved.
Moreover, the load bearing strength in the stacking direction can be improved.

Further, since four inner fins 7 are arranged in the stacking direction in the cooling pipe 2, the heat transfer area between the cooling medium 5 and the inner fins 7 can be further improved, and the cooling efficiency is improved. Can do.
In addition, the same effects as those of the first embodiment are obtained.

(Example 6)
This example is an example in which straight fins 7s and wave fins 7w are combined as shown in FIG.
That is, a combination of straight fins 7s and wave fins 7w is employed as a combination of inner fins 7 adjacent in the stacking direction.
The width of the small channel 211 formed by the straight fins 7s, the width of the small channel 211 formed by the wave fins 7w, and the wave amplitude of the wave fins 7w are formed to be equal.
Others are the same as in the first embodiment.
Also in the case of this example, the effect similar to Example 5 can be show | played.

  In the first to sixth embodiments, the pair of inner fins 7 or one general intermediate fin 25 and the pair of inner fins 7 are formed by folding one metal plate 70. These components can also be assembled by joining a plurality of metal plates independent of each other.

FIG. 4 is a partial cross-sectional view of the stacked cooler in Example 1, and is a cross-sectional view taken along line AA in FIG. FIG. 3 is a partial cross-sectional view of the cooling pipe in the first embodiment. FIG. 3 is a plan view of the stacked cooler in the first embodiment. FIG. 4 is a cross-sectional view taken along line B-B in FIG. 3. Sectional drawing and the top view of a metal plate in Example 1. FIG. Sectional drawing and the top view of a metal plate in Example 2. FIG. Sectional drawing of the intermediate | middle fin and the inner fin which provided the protrusion part by cutting and bending in Example 3. FIG. Sectional drawing of the intermediate | middle fin and inner fin which provided the protrusion part by the raising in Example 3. FIG. Sectional explanatory drawing explaining the process in which a metal plate is bent in Example 4. FIG. Sectional drawing and a top view of a pair of inner fin in Example 5. FIG. Sectional drawing and the top view of the metal plate for forming a pair of inner fin in Example 5. FIG. Sectional drawing and a top view of a pair of inner fin in Example 6. FIG. Sectional drawing of a part of laminated | stacked cooler in a prior art example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Stack type cooler 2 Cooling pipe 21 Refrigerant flow path 25 Intermediate fin 26 Intermediate plate 3 Communication part 5 Cooling medium 6 Electronic component 7 Inner fin

Claims (12)

A stacked cooler for cooling a plurality of electronic components from both sides,
The stacked cooler has a plurality of cooling pipes provided with a refrigerant flow path for circulating a cooling medium, and a communication portion that communicates the plurality of cooling pipes.
The cooling pipe has a plurality of refrigerant flow paths partitioned in the stacking direction by an intermediate plate,
At least one of the plurality of refrigerant channels is provided with a plurality of inner fins stacked in the stacking direction,
A laminated type cooler characterized in that a flat intermediate fin in contact with each other is interposed between the inner fins stacked on each other.   2. The stacked cooler according to claim 1, wherein the intermediate fin is formed with a through hole.   3. The stacked cooler according to claim 1, wherein the intermediate fin is formed with a protruding portion protruding in a thickness direction. 4.   The inner fin according to any one of claims 1 to 3, wherein the inner fin has a concavo-convex shape in which a shape of a cross section perpendicular to a longitudinal direction of the cooling pipe is continuous, and the inner fins are overlapped with each other via the intermediate fin. Is a laminated type cooler in which the concave-convex convex portion of one inner fin and the concave portion of the other inner fin are arranged to face each other.   The laminated cooling according to any one of claims 1 to 4, wherein the one intermediate fin and the two inner fins adjacent to the intermediate fin are formed by folding one metal plate. vessel.   6. The stacked cooler according to claim 1, wherein the inner fin is a straight fin whose cross-sectional shape perpendicular to the stacking direction is parallel to the longitudinal direction of the cooling pipe.   7. The stacked cooler according to claim 1, wherein the inner fin is a wave fin having a corrugated shape in a cross section perpendicular to the stacking direction. A stacked cooler for cooling a plurality of electronic components from both sides,
The stacked cooler has a plurality of cooling pipes provided with a refrigerant flow path for circulating a cooling medium, and a communication portion that communicates the plurality of cooling pipes.
The cooling pipe is provided with a plurality of inner fins stacked in the stacking direction in the refrigerant flow path,
Among the plurality of inner fins, at least one inner fin is a wave fin whose cross-sectional shape orthogonal to the stacking direction is a wave shape,
The above-described inner fins adjacent to each other in the stacking direction are arranged so that their shapes do not overlap each other when viewed from the stacking direction.   9. The stacked cooler according to claim 8, wherein the plurality of inner fins arranged in the cooling pipe are all made of the wave fins.   In Claim 8 or 9, a plurality of the wave fins are arranged adjacent to each other in the cooling pipe, and the wave fins adjacent to each other in the stacking direction have a crest and a trough of the cooling pipe. A stacked type cooler characterized by being arranged at the same position in the longitudinal direction.   11. The stacked cooler according to claim 8, wherein three or more inner fins are arranged in the stacking direction in the cooling pipe.   12. The stacked cooler according to claim 8, wherein the two inner fins adjacent to each other in the stacking direction are formed by folding a single metal plate.

Images