JP2011192730A - Cooler, laminated cooler, and intermediate plate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cooler, a laminated cooler, and an intermediate plate which improve a degree of freedom of arrangement of an inner fin. <P>SOLUTION: The cooler includes: a shell plate 110; a shell plate 111 oppositely arranged to the shell plate 110, and defining a refrigerant distribution space in which the refrigerant 107 can distribute in cooperation with the shell plate 110; an intermediate plate 113 arranged between the shell plate 110 and the shell plate 111; and a plurality of inner fins 114, 115, 116 arranged in the refrigerant distribution space. A hole part 117 for receiving the plurality of inner fins 114, 115, 116 is formed on the intermediate plate 113. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a cooler, a stacked cooler, and an intermediate plate, and more particularly to a cooler and a stacked cooler that cool an electric device such as an inverter, and an intermediate plate mounted on these coolers.

  Conventionally, various proposals have been made regarding coolers that cool electric devices such as inverters. For example, a stacked cooler described in Japanese Patent Application Laid-Open No. 2006-5014 cools an electronic component from both sides.

  The stacked cooler includes a plurality of flat cooling tubes, and the cooling tubes are arranged so as to sandwich electronic components from both sides. The cooling pipe has a supply header section that supplies a cooling medium to the refrigerant flow path, and a discharge header section that discharges the cooling medium from each refrigerant flow path. Further, the cooling pipe has a pair of outer shell plates, an intermediate plate disposed between the pair of outer shell plates, and a wave-shaped inner fin disposed between the intermediate plate and the outer shell plate. .

  A semiconductor cooling device described in JP 2009-105325 A includes a first outer shell plate, a second outer shell plate, and an intermediate plate, and the first outer shell plate and the second outer shell cooling device. The plates are arranged so as to sandwich the intermediate plate. The first outer shell plate and the outer peripheral edge portion of the intermediate plate are brazed, and the second outer shell plate and the outer peripheral edge portion of the intermediate plate are brazed.

  A second refrigerant passage is formed between the first inner fin and the intermediate plate, and a third refrigerant passage is formed between the intermediate plate and the second inner fin. A through hole is formed in the intermediate plate, and the second refrigerant passage and the third refrigerant passage communicate with each other.

  A cooling pipe described in Japanese Patent Application Laid-Open No. 2008-166423 is disposed between a pair of outer shell plates constituting a refrigerant passage and the pair of outer shell plates, and the refrigerant flow path is provided with a plurality of flow channels in the thickness direction. It includes an intermediate plate that is divided into paths, and wavy inner fins that are arranged in the flow paths.

  In the cooling pipe described in Japanese Patent Application Laid-Open No. 2008-166423, the intermediate plate and the inner fin are integrally formed.

  A semiconductor cooling structure described in Japanese Patent Application Laid-Open No. 2007-165620 includes a cooling pipe, and the cooling pipe includes a pair of outer shell plates, an intermediate plate disposed between the pair of outer shell plates, and an intermediate plate. A corrugated inner fin is included between the plate and the shell plate.

  The stacked heat exchanger described in Japanese Patent Application Laid-Open No. 2007-53307 includes a plurality of flat channel pipes, and the flow pipe is provided between a pair of outer shell plates and the pair of outer shell plates. An intermediate plate, and a corrugated inner fin disposed between the intermediate plate and the outer shell plate.

JP 2006-5014 A JP 2009-105325 A JP 2008-166423 A JP 2007-165620 A JP 2007-53307 A

  In the cooling pipe described in Japanese Patent Application Laid-Open No. 2006-5014, since the intermediate plate is disposed between the outer shell plates, the inner fin is formed between the intermediate plate and the outer shell plate. For this reason, the inner plate has to be arranged on the upper surface or the lower surface of the intermediate plate, and the degree of freedom of arrangement of the inner plate is low.

  In the semiconductor cooling device described in Japanese Patent Application Laid-Open No. 2009-105325, though the through holes are formed in the intermediate plate, the first inner fin and the second inner fin are arranged on the upper surface or the lower surface of the intermediate plate. Yes.

  In the cooling pipe described in Japanese Patent Laid-Open No. 2008-166423, the cooling pipe described in Japanese Patent Laid-Open No. 2007-165620, and the flow path pipe described in Japanese Patent Laid-Open No. 2007-53307, the intermediate plate Inner fins are arranged on the upper surface or the lower surface.

  As described above, since the intermediate plate is disposed between the pair of outer shell plates, an area where the inner fin can be disposed is limited.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a cooler, a stacked cooler, and an intermediate plate in which the degree of freedom of arrangement of inner fins is improved. is there.

  The cooler according to the present invention is arranged to face the first outer shell plate and the first outer shell plate, and cooperates with the first outer shell plate to define a refrigerant circulation space in which a refrigerant can flow. It includes a shell plate, an intermediate plate disposed between the first outer shell plate and the second outer shell plate, and an inner fin disposed in the refrigerant circulation space. The intermediate plate is formed with a hole that can receive the inner fin. Preferably, a claw portion for supporting the inner fin is formed on the inner peripheral edge portion of the hole portion.

  Preferably, a plurality of the inner fins are provided to be stacked, and the inner fins are a first inner fin disposed in the hole, a second inner fin disposed adjacent to the first inner fin, A third inner fin disposed opposite to the second inner fin with respect to the first inner fin. A plurality of first groove portions extending in the refrigerant flow direction are formed on the front and back surfaces of the second inner fin, and a plurality of second groove portions extending in the refrigerant flow direction are formed on the front and back surfaces of the third inner fin. The The depth of the second groove portion is formed to be deeper than the depth of the first groove portion, and the first inner fin is provided with a retracting portion that is separated from the second inner fin. In the stacked cooler according to the present invention, a plurality of the coolers are arranged at intervals.

  An intermediate plate according to the present invention is an intermediate plate disposed between a first outer shell plate and a second outer shell plate disposed opposite to the first outer shell plate. The intermediate plate includes inner fins. Is formed.

  According to the cooler, the stacked cooler, and the intermediate plate according to the present invention, it is possible to improve the degree of freedom related to the arrangement of the inner fins.

1 is a front view of an electric unit including a multilayer cooler 100 according to Embodiment 1 of the present invention and a plurality of electronic components 102. FIG. 2 is an exploded perspective view of a cooler 101. FIG. 4 is a cross-sectional view of an outer shell plate 110. FIG. 4 is a plan view of an intermediate plate 113. FIG. 4 is a perspective view showing a portion of a claw portion 124 and an intermediate plate 113. FIG. 2 is a cross-sectional view of the cooler 101. FIG. FIG. 6 is a cross-sectional view showing a first modification of cooler 101. FIG. 10 is a plan view showing a first modification of intermediate plate 113. FIG. 10 is a plan view showing a second modification of intermediate plate 113. It is sectional drawing of the cooler 101 which concerns on this Embodiment 2. FIG.

  The cooler, stacked cooler, and intermediate plate according to the present invention will be described with reference to FIGS. Note that in the embodiments described below, when referring to the number, amount, and the like, the scope of the present invention is not necessarily limited to the number, amount, and the like unless otherwise specified. In the following embodiments, each component is not necessarily essential for the present invention unless otherwise specified. In addition, when there are a plurality of embodiments below, it is planned from the beginning to appropriately combine the features of each embodiment unless otherwise specified.

(Embodiment 1)
FIG. 1 is a front view of an electric unit including a stacked cooler 100 according to Embodiment 1 of the present invention and a plurality of electronic components 102.

  As shown in FIG. 1, the electric unit includes a plurality of electronic components 102 and a stacked cooler 100 that cools the electronic components 102. The electronic component 102 is a high-voltage electronic device such as an inverter or a converter mounted on the vehicle. The stacked cooler 100 includes a plurality of flat coolers 101, and a supply pipe 103 and a discharge pipe 104 that connect the coolers 101 to each other.

  An inlet pipe 105 and an outlet pipe 106 are connected to the multilayer cooler 100, and the refrigerant 107 is supplied from the inlet pipe 105 to the multilayer cooler 100, and the refrigerant 107 in the multilayer cooler 100 is discharged from the outlet pipe 106. The And the refrigerant | coolant 107 distribute | circulates the inside of the cooler 101, and the laminated cooler 100 cools both the main surfaces of the electronic component 102. FIG.

  FIG. 2 is an exploded perspective view of the cooler 101, and FIG. 3 is a cross-sectional view of the outer shell plate 110. As shown in FIGS. 2 and 3, the cooler 101 includes an outer shell plate 110 and an outer shell plate 111 disposed to face the outer shell plate 110. The outer shell plate 110 and the outer shell plate 111 cooperate with each other to form the refrigerant circulation space 112 shown in FIG. The refrigerant 107 flows in the refrigerant circulation space 112.

  The cooler 101 includes an intermediate plate 113 disposed between the outer shell plate 110 and the outer shell plate 111, and a plurality of inner fins 114, 115, 116 stacked in the refrigerant circulation space 112. Inner fins 114, 115, 116 are formed in a corrugated shape, and grooves are formed on the front and back surfaces of each inner fin 114, 115, 116.

  In the first embodiment, the inner fin 114 is disposed adjacent to the inner fin 115, and the inner fin 116 is disposed on the opposite side to the inner fin 114 with respect to the inner fin 115. .

  The intermediate plate 113 is formed in a plate shape. The intermediate plate 113 is formed with holes 117 that can receive the inner fins 115, and the inner fins 115 are disposed in the holes 117.

  Thus, since the hole 117 which can receive an inner fin is formed in the intermediate | middle plate 113, it is suppressed that the area | region where an inner fin is arrange | positioned in the refrigerant | coolant circulation space 112 by the intermediate | middle plate 113 is divided. Yes. For this reason, the freedom degree of the area | region which can arrange | position an inner fin is raised, and it can change suitably also about the number of inner fins which can be arrange | positioned.

  In the example shown in FIGS. 2 and 3, three inner fins are stacked. However, four or five inner fins can be appropriately stacked.

  In FIG. 2, the cooler 101 is formed in a flat shape and is formed long in the direction in which the refrigerant 107 flows. Similarly, the outer shell plate 110 and the outer shell plate 111 are also formed long. The outer shell plate 110 is formed with outer projecting tubes 120 and 121 formed so as to project from the outer shell plate 110. The outer protruding tube 120 is formed on one end side of the outer shell plate 110, and the outer protruding tube 121 is formed on the other end side.

  The outer shell plate 111 is formed with inner protruding pipes 122 and 123 formed so as to protrude from the outer shell plate 111. The inner projecting tube 122 is formed on one end side of the outer shell plate 111, and the inner projecting tube 123 is formed on the other end side of the outer shell plate 111.

  The outer projecting tube 120 and the inner projecting tube 122 are arranged in the stacking direction of the cooler 101, and the outer projecting tube 121 and the inner projecting tube 123 are arranged in the stacking direction of the cooler 101.

  And as shown in FIG. 3, the supply pipe | tube 103 is formed by the outer side protrusion pipe | tube 120 and the inner side protrusion pipe | tube 122 connecting. In addition, the supply pipe | tube 103 is formed because a part of inner side protrusion pipe | tube 122 enters in the outer side protrusion pipe | tube 120. FIG. The discharge pipe 104 is formed by connecting the outer protruding pipe 121 and the inner protruding pipe 123.

  FIG. 4 is a plan view of the intermediate plate 113. As shown in FIGS. 4 and 2, the intermediate plate 113 is formed in a flat plate shape, and is formed in a long shape in the flow direction of the refrigerant 107. A supply port 127 is formed on one end side of the intermediate plate 113, and a discharge port 126 is formed on the other end side.

  The supply port 127 is formed in a portion of the intermediate plate 113 that faces the outer protruding tube 120 and the inner protruding tube 122, and the discharge port 126 of the intermediate plate 113 faces the outer protruding tube 121 and the inner protruding tube 123. It is formed in the part to be.

  A brazing material 140 is applied to both main surfaces of the intermediate plate 113. The brazing material 140 is formed along the outer peripheral edge of the intermediate plate 113. As shown in FIG. 2, a flange 128 is formed on the outer peripheral edge of the outer shell plate 110. Similarly, a flange portion 129 is also formed on the outer peripheral edge portion of the outer shell plate 111.

  When the intermediate plate 113 is sandwiched between the outer shell plate 110 and the outer shell plate 111, the intermediate plate 113 and the flange portion 128 are bonded by the brazing material 140, and similarly, the intermediate plate 113 and the flange portion 129 are bonded. To do. In this way, the outer shell plate 110, the intermediate plate 113, and the outer shell plate 111 are integrated.

  The inner surface of the outer shell plate 110 and the inner surface of the outer shell plate 111 are coated with anti-rust paint. Thereby, corrosion of the outer shell plate 110 and the outer shell plate 111 is suppressed, and leakage of the refrigerant 107 in the cooler 101 is suppressed. A plurality of claw parts 124 and claw parts 125 are formed at the opening edge of the hole 117 formed in the intermediate plate 113.

  FIG. 5 is a perspective view showing part of the claw portion 124 and the intermediate plate 113. As shown in FIG. 5, the claw portion 124 is formed so as to warp toward the outer shell plate 110. The claw portion 125 is formed so as to warp toward the outer shell plate 111. The claw portion 124 and the claw portion 125 support the outer peripheral edge portion of the inner fin 115 and suppress the displacement of the inner fin 115.

  FIG. 6 is a cross-sectional view of the cooler 101. In FIG. 6, the inner fins 114, 115, and 116 are formed by processing a plate-shaped metal plate into a wave shape.

  A groove portion 130 is formed on the surface of the inner fin 115 facing the inner fin 116, and a groove portion 131 is formed on the surface facing the inner fin 114. A groove 132 is formed on the surface of the inner fin 114 facing the inner fin 115, and a groove 133 is formed on the surface facing the outer shell plate 110.

  A groove 135 is formed on the surface of the inner fin 116 facing the inner fin 115, and a groove 134 is formed on the surface facing the outer shell plate 111. Each of the groove portions 130 to 135 extends in the extending direction of the cooler 101 and extends from one end portion of each inner fin 114, 115, 116 to the other end portion.

  Here, a channel through which the refrigerant 107 can flow is formed by the surface of the outer shell plate 110 and the groove 133, and a channel 137 through which the refrigerant can flow is formed by the groove 132 and the groove 131. The groove part 130 and the groove part 135 form a flow path 136 through which the refrigerant 107 can flow, and the groove part 134 and the outer shell plate 111 form a flow path through which the refrigerant can flow.

  By disposing the inner fin 115 between the inner fin 114 and the inner fin 116, the flow path 136 and the flow path 137 are newly formed as compared with the case where only the inner fin 114 and the inner fin 116 are disposed. be able to.

  In the flow path 136, the refrigerant can go back and forth in the groove part 130 and the groove part 135, and the disturbance in the vertical direction of the refrigerant is large.

  Similarly, in the flow path 137, the refrigerant travels in and out of the groove 132 and the groove 131, so that the refrigerant is highly disturbed in the vertical direction. In this way, the heat absorption efficiency is increased by increasing the disturbance of the refrigerant. As a result, the electronic component 102 shown in FIG. 1 can be efficiently cooled.

  Note that the number of inner fins to be stacked is not limited to three, and may be a larger number. FIG. 7 is a cross-sectional view showing a first modification of the cooler 101. In the example shown in FIG. 7, four inner fins are stacked.

  FIG. 8 is a plan view showing a first modification of the intermediate plate 113. In the example shown in FIG. 8, a plurality of holes 117 a and 117 b are formed in the intermediate plate 113 between the discharge port 126 and the supply port 127.

  Different inner fins 115a and 115b are arranged in the holes 117a and 117b, respectively. A beam 141 is formed between the hole 117a and the hole 117b, and the hole 117a and the hole 117b are separated from each other.

  In the example shown in FIG. 8, the hole 117 a and the hole 117 b are arranged in the longitudinal direction of the intermediate plate 113, but the hole 117 a and the hole 117 b are arranged in the width direction of the intermediate plate 113. You may form as follows.

  FIG. 9 is a plan view showing a second modification of the intermediate plate 113. In the example shown in FIG. 9, the hole 117 c is formed so as to also function as the discharge port 126 and the supply port 127. Specifically, the intermediate plate 113 is formed so as to extend from a position facing the supply pipe 103 to a position facing the discharge pipe 104.

  A plurality of locking portions 142 for positioning the inner fin 115 are formed at the inner peripheral edge of the hole 117c.

(Embodiment 2)
The stacked cooler, cooler, and intermediate plate according to the second embodiment will be described with reference to FIG. Note that, in the configuration illustrated in FIG. 10, configurations that are the same as or correspond to the configurations illustrated in FIG. 1 to FIG.

  FIG. 10 is a cross-sectional view of the cooler 101 according to the second embodiment. As shown in FIG. 10, an inner fin (first inner fin) 150 disposed in the hole 117 and an inner fin disposed closer to the outer shell plate 110 than the inner fin 150 are disposed in the refrigerant circulation space 112. A (second inner fin) 152 and an inner fin (third inner fin) 151 disposed closer to the outer shell plate 111 than the inner fin 150 are disposed.

  The inner fin 151 is disposed on the opposite side of the inner fin 152 with respect to the inner fin 150. The inner fins 151 and 152 are formed by processing a metal plate-like member into a corrugated shape, and a plurality of grooves 154 and 153 are formed on the front and back surfaces of the inner fins 151 and 152. The groove portions 154 and 153 extend in the extending direction of the inner fins 151 and 152 (the refrigerant flow direction), and extend across both end portions of the inner fins 151 and 152.

  The depth D2 of the groove 154 formed in the inner fin 151 is formed to be deeper than the depth D1 of the groove 153 formed in the inner fin 152. Further, the number of the groove portions 153 is larger than the number of the groove portions 154, and the groove width of the groove portions 153 is narrower than the groove width of the groove portions 154.

  The inner fin 150 is hooked in a hole 117 formed in the intermediate plate 113. The inner fin 150 is formed with a retreat groove 160 extending from one end of the inner fin 150 to the other end and extending in the refrigerant flow direction.

  The inner fin 150 extends along the hole 117 of the intermediate plate 113 and has a flange 163 that is hooked on the intermediate plate 113, a peripheral wall 162 that hangs down from the flange 163, and a bottom 161 that is connected to the peripheral wall 162. including. A retreating groove 160 is formed by the peripheral wall portion 162 and the bottom portion 161.

  The bottom (retracting portion) 161 is formed so as to be separated from the inner fin 152. The inner fin 151 is disposed on the bottom 161. For this reason, the channel area of the channel formed between the inner fin 152 and the inner fin 150 and the channel area of the channel formed between the inner fin 150 and the inner fin 151 are approximate to each other. is doing.

  Therefore, the flow rate and flow rate of the refrigerant that flows through the flow path formed between the inner fin 150 and the inner fin 152, and the flow rate and flow rate that flows through the flow path formed between the inner fin 150 and the inner fin 151. Is an approximation.

  When the flow rate and flow rate of the refrigerant are approximately or the same, the cooling efficiency of the inner fin 152 in which the fine groove is formed is higher than the cooling efficiency of the inner fin 151.

  For this reason, the electronic component 102 arrange | positioned on the outer shell plate 110 can be positively cooled. For this reason, when there is an electronic component 102 to be cooled preferentially among the plurality of electronic components 102, the electronic component 102 is positively disposed by placing it on the outer shell plate 110 of the cooler 101 shown in FIG. Can be cooled.

  Although the embodiment of the present invention has been described above, it should be considered that the embodiment disclosed this time is illustrative and not restrictive in all respects. The scope of the present invention is defined by the terms of the claims, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims. Furthermore, numerical values and the like are examples and are not limited to numerical values and ranges.

  The present invention can be applied to a cooler, a stacked cooler, and an intermediate plate, and is particularly suitable for a cooler and a stacked cooler that cool an electric device such as an inverter, and an intermediate plate mounted on these coolers. It is.

  DESCRIPTION OF SYMBOLS 100 Laminated cooler, 101 Cooler, 102 Electronic component, 103 Supply pipe, 104 Discharge pipe, 105 Introducing pipe, 106 Outlet pipe, 107 Refrigerant, 110 Outer shell plate, 111 Outer shell plate, 112 Refrigerant circulation space, 113 Intermediate plate 114, 115, 116, 151, 152 Inner fin, 117, 117a, 117b Hole, 120, 121 Outer protruding tube, 122, 123 Inner protruding tube, 124, 125 Claw portion, 126 Discharge port, 127 Supply port, 128 , 129 collar part, 130, 131, 132, 133, 134, 135 groove part, 136, 137 flow path, 140 brazing material, 141 beam, 142 locking part, 153, 154 groove part, 160 retraction groove, 161 bottom part, 162 peripheral wall Part, 163 buttocks.

Claims (5)

A first shell plate;
A second outer shell plate that is disposed opposite to the first outer shell plate, and that cooperates with the first outer shell plate to define a refrigerant circulation space in which a refrigerant can flow;
An intermediate plate disposed between the first shell plate and the second shell plate;
Inner fins disposed in the refrigerant circulation space;
Including
The cooler, wherein the intermediate plate has a hole that can receive the inner fin.   The cooler according to claim 1, wherein a claw portion that supports the inner fin is formed at an inner peripheral edge portion of the hole portion. A plurality of the inner fins are provided to be laminated,
The inner fin includes a first inner fin disposed in the hole, a second inner fin disposed adjacent to the first inner fin, and the second inner fin with respect to the first inner fin. And a third inner fin disposed on the opposite side,
A plurality of first grooves extending in the refrigerant flow direction are formed on the front and back surfaces of the second inner fin,
A plurality of second grooves extending in the refrigerant flow direction are formed on the front and back surfaces of the third inner fin,
The depth of the second groove is formed to be deeper than the depth of the first groove,
The cooler according to claim 1 or 2, wherein the first inner fin is formed with a retracting portion that is separated from the second inner fin.   A stacked cooler in which a plurality of coolers according to claim 1 are arranged at intervals. An intermediate plate disposed between the first outer shell plate and the second outer shell plate disposed opposite to the first outer shell plate,
The intermediate plate is formed with a hole capable of receiving an inner fin.

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