JP4544187B2 - Cooler - Google Patents

Description

  The present invention relates to a cooler that is used while attached to a heating element and cools the heating element by flowing a refrigerant.

There is a need for a cooler in various aspects. For example, the power controlled by the power module is increasing, and the amount of heat generated by the semiconductor device used in the power module is increasing. Therefore, there is a need for a cooler that efficiently cools the semiconductor device.
Patent Document 1 discloses a cooler that cools a heating element by flowing a refrigerant while attached to the heating element such as a semiconductor device. This cooler has a main channel inside, and a coolant such as water flows through the main channel. The heating element is in contact with the main channel via the outer wall, and the heating element is cooled by the refrigerant flowing through the main channel.

  The refrigerant flowing through the main channel is heated by cooling the heating element. Therefore, the ability to cool the heating element decreases as it goes downstream of the main flow path. Therefore, a sub-channel is provided separately from the main channel, and the refrigerant is supplied from the sub-channel to the main channel at a position where the refrigerant flowing through the main channel is heated and the cooling capacity is lowered. Then, the temperature of the refrigerant flowing through the main flow path is lowered, and the cooling capacity is recovered.

  In order for the above cooler to function as intended, it is necessary to prevent the refrigerant flowing through the sub-flow path from being heated while flowing through the sub-flow path. Therefore, in the technique of Patent Document 1, a sub-flow channel is formed on the side opposite to the heating element across the main flow channel. That is, when viewed from the direction of the heating element, the heating element, the outer wall that separates the heating element and the main channel, the main channel, the partition that separates the main channel and the sub channel, the sub channel, and the side opposite to the main channel of the sub channel It has a structure that is laminated in the order of the outer wall to close. Patent Document 1 also discloses a technique in which a sub-flow path is formed along the main flow path, and the main flow path and the communication path are connected by a tubular communication path. The tubular communication path is provided so as to cross the main flow path. A plurality of openings are provided in the tubular communication path. The cooling water flowing into the communication path from the sub-flow path is supplied from the opening to the main flow path. Further, in the cooler described in Patent Document 1, the outer wall that separates the heating element and the main flow path is formed of a material having high thermal conductivity, and the partition that separates the main flow and the sub flow path is formed of a material having low thermal conductivity. is doing.

JP 2005-79337 A

  A conventional cooler has a laminated structure of an outer wall that separates a heating element and a main channel, a main channel, a partition, a sub-channel, and an outer wall that closes the sub-channel, and is complicated and difficult to manufacture. Moreover, even if the auxiliary flow path is provided on both sides of the main flow path, a tubular communication path is formed in the main flow path, which is difficult to manufacture. In addition, the outer wall that separates the heating element and the main flow path is formed of a material having high thermal conductivity, while the partition wall needs to be formed of a material having low thermal conductivity, which also makes it difficult to manufacture a cooler. .

  The present invention provides a cooler that has high performance and is easy to manufacture.

The cooler of this invention is used in the state attached to the heat generating body, and cools a heat generating body by flowing a refrigerant | coolant. The cooler of the present invention includes a first member that forms an outer wall that separates the heat generating element from the flow path, and a second member that forms an outer wall that closes the opposite side of the flow path from the heat generating element. Although the cooler may be constituted by only the first member and the second member, the third and fourth members may be interposed between the first member and the second member. In the cooler of the present invention, a main flow path, a sub flow path, and a communication path are formed inside by overlapping member groups .
The width orthogonal to the flow direction of the main flow path is wider than the width of the heating element. The sub-channel extends in the width direction side of the main channel in parallel with the flow direction of the main channel in a state separated from the main channel by a partition wall that defines the width of the main channel. The communication path passes through the partition wall in the width direction and communicates the main flow path and the sub flow path in a part of the length direction of the main flow path.

With the above configuration, the main flow path, the sub flow path, and the communication path are formed in substantially the same layer. All the flow paths through which the refrigerant flows are completed simply by overlapping and fixing the first member constituting the outer wall on the side where the heating element is arranged and the second member constituting the outer wall on the side where the heating element is not arranged. If necessary, the third and fourth members may be interposed, but in any case, the cooler is completed by overlapping and fixing the first member and the second member. The cooler of the present invention is easy to manufacture.
In the cooler of the present invention, the sub-flow channel is located on the side of the main flow channel. When the flow path is provided in such a positional relationship, a range in which the sub flow path and the main flow path face each other becomes narrow. If the range where the sub-channel and the main channel face each other is narrow, heat exchange between them is suppressed, and the refrigerant flowing through the sub-channel is difficult to be heated. The temperature of the refrigerant flowing through the sub flow path is maintained at a low temperature. The main flow path is supplied with a low-temperature refrigerant that has flowed from the communication path through the sub-flow path. As a result, the temperature of the refrigerant flowing through the main flow path is lowered and the cooling capacity is recovered.
The main flow path and the sub flow path extend in parallel. The flow direction of the refrigerant may be the same direction or the opposite direction. When the flow direction is the opposite direction, the downstream of the main channel becomes upstream of the sub-channel, so that the temperature change in the length direction of the refrigerant flowing through the main channel can be easily suppressed.

In a preferred aspect of the present invention, the partition wall is formed of the first member and / or the second member.
When the partition wall is formed on the first member and / or the second member, it is not necessary to provide a separate member for providing the partition wall. According to the configuration of the present cooler, it can be easily manufactured at low cost.

In one preferable aspect of the present invention, the first member is a flat plate and the protrusion is formed on the second member. In that case, the partition wall is formed by bringing the tip of the protrusion of the second member into close contact with the first member, and the main flow path, the sub flow path, and the communication path are formed inside.
In the above-described cooler, it does not take time to process the first member. The manufacturing cost of the cooler can be reduced. The cooler of this configuration can be manufactured at low cost in addition to good cooling capacity of the heating element.

In another preferred aspect of the present invention, the first member and the second member are shared. That is, the members formed in the same shape are used for the first member and the second member. In this case, the main flow path, the sub flow path, and the communication path can be formed inside by bringing one of the first member and the second member into close contact with each other in an inverted posture.
If the first member and the second member are made common, the number of types of parts can be reduced, and the types of production facilities can be reduced. The cooler of this configuration can be manufactured at low cost in addition to good cooling capacity of the heating element.

In the cooler of the present invention, it is preferable that the first member and / or the second member are press-molded.
In general, a plate material used for press molding does not have a defect such as a nest inside. For this reason, the member obtained by press molding has higher thermal conductivity than the member obtained by die casting. If there are fine irregularities on the surface of the wall that defines the flow path, the refrigerant flow is disturbed. If the flow of the refrigerant is disturbed, fine bubbles are generated and the cooling capacity is deteriorated. When a cooler is manufactured by press-molding a plate having a smooth surface, the surface of the wall defining the flow path can be smoothly finished. When a member obtained by press molding is used, there is no defect such as a nest, and it is difficult for refrigerant to leak out. According to press molding, high-quality parts can be manufactured at low cost.
If a cooler is manufactured using a press-molded member, a cooler with excellent cooling capacity can be manufactured at low cost.

  The cooler of the present invention can be manufactured by brazing in a state where the member groups are overlapped. A cooler in which a plurality of members are firmly bonded can be easily obtained.

In the cooler of the present invention, it is preferable that a groove is formed between a surface of the partition wall that separates the main channel and the sub-channel and a surface that contacts the main channel and a surface that contacts the sub-channel. As the material constituting the cooler, a material having high heat transfer property is adopted in order to transmit heat from the heating element to the refrigerant. If a groove is formed between the surface in contact with the main flow path and the surface in contact with the sub flow path, the heat insulation between them is improved.
With such a configuration, even if the refrigerant flowing in the main flow path is heated, the refrigerant flowing in the sub flow path is difficult to be heated. Cold refrigerant can be supplied from the sub-channel to the refrigerant that is heated while flowing through the main channel.
Note that the “groove” may be provided so that a space is formed in a part of the partition wall. You may form continuously along the partition which isolate | separates a main flow path and a subflow path, and may be formed intermittently. It is not limited to the presence or absence of the groove bottom. Further, a groove formed in a tunnel shape in the partition wall is also included in the “groove” referred to herein.

  When the partition has a groove, it is particularly preferable that the groove penetrates the cooler. When the groove formed in the partition wall penetrates, the groove inactivates heat exchange between the main flow path and the sub flow path, and also provides a cooling function. It is possible to obtain a cooler having a high cooling capacity because the refrigerant in the sub-flow channel is reliably kept at a low temperature.

In the cooler of the present invention, it is preferable that the partition wall separating the main channel and the sub-channel is formed thicker than the outer wall separating the heating element and the main channel.
With the above configuration, heat exchange between the heating element and the main flow path is active, while heat exchange between the main flow path and the sub flow path is inactive. Even if the temperature of the refrigerant flowing through the main flow path rises, the refrigerant in the sub flow path is maintained at a low temperature. As a result, the refrigerant flowing through the sub-channel is kept at a low temperature, and a cooler with a high cooling capacity can be obtained.

It is preferable that the first member has a recess for attaching the heating element, and the height of the wall defining the heating element side of the main flow path is lower than the height of the wall defining the heating element side of the communication path.
Bubbles are generated in the refrigerant flowing through the cooler. In particular, when boil cooling is performed by flowing a refrigerant near the boiling point, the refrigerant boils due to the heat of the heating element. In the boiling refrigerant, bubbles are generated due to vaporization of the refrigerant. Further, when the refrigerant is supplied from the communication path to the main flow path, bubbles may enter from the communication path. If bubbles are included in the refrigerant that cools the heating element, the cooling capacity of the cooler deteriorates due to the heat insulating action of the bubbles.
In short, when the above configuration is provided, a relationship is obtained in which the ceiling of the main flow path is low and the ceiling of the communication path side is high, and bubbles generated in the refrigerant naturally gather on the communication path side where conversion is high. . Even if bubbles are mixed in the refrigerant supplied from the communication path to the main channel, the bubbles are difficult to move into the main channel having a low ceiling. Furthermore, when the collected bubbles are cooled by the low-temperature refrigerant flowing from the communication path and the temperature of the bubbles becomes lower than the boiling point, the bubbles disappear. Due to the bubbles moving toward the side edge of the main flow path, the bubbles are kept in a sparse state in the central region of the main flow path that cools the heating element. According to this structure, the fall of the cooling capability by the bubble of a refrigerant | coolant is suppressed.

In addition, it is preferable that a bubble guide plate that guides bubbles included in the refrigerant that has entered the main channel from the communication path toward the partition is formed in the main channel of the cooler.
By forming the bubble guide plate, even if bubbles enter the main flow path from the communication path, they do not enter the area where the heating element in the main flow path is cooled. When the temperature of the refrigerant exceeds the boiling point due to the heat of the heating element, bubbles are generated due to vaporization of the refrigerant. Bubbles generated in the main channel are also brought to the side of the main channel by the bubble guide plate. Further, when the refrigerant is supplied from the communication path to the main flow path, bubbles may enter from the communication path. Air bubbles entering from the communication passage are prevented from entering the central region by the bubble guide plate. In the central region of the main flow path for cooling the heating element, bubbles are kept sparse. According to this structure, the fall of the cooling capability by the bubble of a refrigerant | coolant is suppressed.
The member provided with the bubble guide plate is not limited. The bubble guide plate may be provided in the first member, may be provided in the second member, or may be provided in both the first member and the second member. Alternatively, it may be formed on the third and fourth members.

The features of the embodiments shown below are listed first.
(Mode 1) The cooler cools the power module.
(Mode 2) The refrigerant of the cooler is water, and the temperature of the cooling water is around the boiling point.
(Mode 3) The cooler is composed of two members formed by a die casting method.
(Mode 4) The cooler is composed of two members molded by a press molding method.
(Mode 5) The cooler is composed of four members formed by a press molding method.
(Mode 6) The members constituting the cooler are made of the same material.
(Mode 7) A refrigerant is supplied to one main channel from two sub-channels located on both sides.
(Mode 8) The sub-flow path is provided in a straight line, the main flow path is also provided in a straight line, and the main flow path and the sub-flow path are provided substantially in parallel.
(Mode 9) The cooler has a plurality of main flow paths extending in parallel, and cools the plurality of power modules.
(Embodiment 10) In Embodiment 8, the side flow dew extends between adjacent main flow paths.
(Mode 11) The refrigerant inlet of the main channel and the refrigerant inlet of the sub channel are provided separately, and the refrigerant discharge pipe of the main channel and the refrigerant discharge pipe of the sub channel are also provided separately.
(Mode 12) The direction in which the refrigerant flows in the sub-channel and the direction in which the refrigerant flows in the main channel are opposite.
(Mode 13) The main flow path and the sub flow path are merged in the upstream portion and the downstream portion, and the refrigerant inlet and the refrigerant discharge pipe are shared.

<First embodiment>
The cooler 10 of a present Example is demonstrated with reference to FIGS. The cooler 10 is for cooling a power module (an example of a heating element) 100 and has a flat shape with a wide upper surface and lower surface. The power module 100 is attached so that the lower surface of the power module 100 is in close contact with the upper surface of the cooler 10. The cooler 10 cools the power module 100 by passing a refrigerant therethrough. The refrigerant flowing through the main flow path 30 of the cooler 10 is water set near the boiling point. When the refrigerant absorbs the heat of the power module 100, the refrigerant boils. Water and other liquids absorb heat for boiling (boiling heat) from other media. When a coolant having a boiling point is used for cooling the power module 100, heat is well absorbed from the power module 100.
FIG. 1 is a partial plan view of the cooler 10. As shown in FIG. 1, a main flow path 30, sub flow paths 20 </ b> R and 20 </ b> L, and a communication path 40 are formed inside the cooler 10. In FIG. 1, the installation site | part of the power module 100 is shown with the virtual line. As shown in FIG. 1, the width W <b> 1 orthogonal to the refrigerant flow direction in the main flow path 30 is wider than the width W <b> 2 of the power module 100. The power module 100 is installed so that the entire area of the lower surface is located above the main flow path 30. In FIG. 1, the near side of the paper is the upper part of the cooler 10, and the far side of the paper is the lower part of the cooler 10.

As shown in FIG. 1, the sub-flow channel 20L, the main flow channel 30, and the sub-flow channel 20R are provided in the cooler 10 in a state of being arranged side by side in the width direction. The sub flow paths 20 </ b> R and 20 </ b> L are provided along both sides of the main flow path 30. The cooler 10 has a symmetrical structure with the main channel 30 as the center. A communication path 40 is provided between the sub flow paths 20R, 20L and the main flow path 30. The communication path 40 is provided intermittently in the length direction of the main flow path 30.
The arrows shown in FIG. 1 indicate the direction in which the refrigerant flows. The refrigerant flowing through the main flow path 30 is supplied from a main flow path refrigerant supply pipe 76 provided at one end of the main flow path 30 and from a main flow path refrigerant discharge pipe (not shown) provided at the other end. Discharged. As described above, the refrigerant flowing in the main channel 30 is water near the boiling point. When the power module 100 is cooled, the refrigerant boils.
The refrigerant flowing in the sub-channels 20R and 20L is supplied from a sub-channel refrigerant supply pipe (not shown) at the end on the main channel refrigerant discharge pipe side, and is supplied to the end on the main channel refrigerant supply pipe 76 side. The refrigerant is discharged from the side sub-channel refrigerant discharge pipe 60 side. The sub-channels 20R and 20L are supplied with a refrigerant having a temperature similar to that of the main channel 30 or a refrigerant having a temperature lower than that flowing through the main channel 30. The sub-channel refrigerant discharge pipe 60 can be omitted. When the sub-channel refrigerant discharge pipe 60 is omitted, all of the refrigerant supplied to the sub-channels 20R and 20L flows into the main channel 30. At this time, all the refrigerant flowing through the cooler 10 is discharged from the main channel cooling discharge pipe. As shown by the arrows in FIG. 1, the direction in which the refrigerant flows through the sub-channels 20R and 20L is opposite to the direction in which the refrigerant flows through the main channel 30.
In the communication path 40, the refrigerant in the sub flow paths 20 </ b> R and 20 </ b> L flows toward the main flow path 30. The refrigerant on the upstream side of the sub-channels 20R and 20L is supplied on the downstream side of the main channel 30, and the refrigerant on the downstream side of the sub-channels 20R and 20L is supplied on the upstream side of the main channel 30. The refrigerant flowing through the main flow path 30 is heated by cooling the power module 100. As described above, the refrigerant flowing in the main channel 30 is water near the boiling point. By absorbing heat from the power module 100, the refrigerant (water) flowing through the main flow path 30 boils. When bubbles are generated due to boiling of the refrigerant, a heat-insulating action due to the bubbles works, and a burnout phenomenon is likely to occur in which the ability to cool the power module 100 is reduced. The burnout phenomenon is a phenomenon in which the temperature of the heating element rapidly increases because heat transfer is deteriorated due to generation of bubbles due to boiling from boiling with good heat transfer. In the present cooler 10, the low-temperature refrigerant is supplied to the main flow path 30 through the communication path 40, so that bubbles generated by boiling in the main flow path 30 are liquefied. As a result, the bubbles in the main channel 30 disappear and the burnout phenomenon is suppressed. By supplying the low-temperature refrigerant from the sub-channels 20R and 20L to the downstream side of the main channel 30, the temperature of the refrigerant flowing on the downstream side of the main channel 30 is lowered. As a result, the refrigerant flowing through the main flow path 30 is overheated, and the cooling efficiency of the power module 100 disposed on the downstream side of the main flow path 30 is suppressed.

A detailed configuration of the cooler 10 will be described with reference to FIGS. FIG. 2 is an exploded perspective view of the cooler 10. 3 is a cross-sectional view taken along line III-III in FIG. In FIG. 3, the cross-sectional shape of the area | region where the communicating path 40 is not provided is shown. 4 is a cross-sectional view taken along line IV-IV in FIG. In FIG. 4, the cross-sectional shape of the area | region in which the communicating path 40 was provided is shown.
As shown in FIGS. 2 to 4, the cooler 10 is assembled by superposing an upper wall member 12 (an example of the first member) and a lower wall member (an example of the second member) 14. The upper wall member 12 and the lower wall member 14 are the same material and have the same shape, and are the same. The upper wall member 12 and the lower wall member 14 are die-cast using the same mold. On one surface of the upper wall member 12 and the lower wall member 14, grooves 32 and 34 for main flow passages, grooves 22 and 24 for sub flow passages, and grooves 42 and 44 for communication passages are provided. . Supply pipes for supplying the refrigerant to the respective flow paths and discharge pipes for discharging the refrigerant are piped at the ends of the main flow path grooves 32 and 34 and the auxiliary flow path grooves 22 and 24. (In FIG. 2, the main flow path refrigerant supply pipe 76 and the sub flow path refrigerant discharge pipe 60 are shown.) For this reason, at the edges of the upper wall member 12 and the lower plate 13, a pipe groove 62, 64, 77 and 78 are provided.
In the cooler 10, the upper wall member 12 and the lower wall member 14 are made of the same material (for example, copper, copper alloy, aluminum, or aluminum alloy). By simply superimposing these and brazing the joining surface 15, it can be manufactured very easily. A supply pipe for supplying a refrigerant to each flow path (in FIG. 2, a main flow path refrigerant supply pipe 76 is shown) and a discharge pipe (in FIG. 2, a sub flow path refrigerant discharge pipe 60 is shown) After the upper wall member 12 and the lower wall member 14 are fixed, the upper wall member 12 and the lower wall member 14 may be fixed at the same time by fixing by press-fitting, screwing, brazing, or the like.

  In the case of the cooler 10, the wall thickness of the partition walls 46 and 48 separating the main flow path 30 and the sub flow paths 20R and 20L is thicker than the thickness of the upper wall member 12 in the region where the power module 100 is disposed. For example, the thickness of the region constituting the upper wall of the main channel 30 of the upper wall member 12 is 2 mm to 10 mm, whereas the thickness of the partition walls 46 and 48 is 10 mm or more (for example, 20 mm). If the partition walls 46 and 48 are thick, it is difficult for the heat of the power module 100 to propagate to the refrigerant flowing through the auxiliary flow paths 20R and 20L. When such thick partition walls 46 and 48 are provided, the temperature of the refrigerant flowing through the sub-channels 20R and 20L is difficult to increase. The temperature of the refrigerant supplied from the sub-channels 20R and 20L to the main channel 30 is kept low. As a result, the refrigerant in the main channel 30 is also kept at a low temperature, and bubbles generated by boiling in the main channel 30 can be effectively liquefied and removed. Since the bubbles due to the boiling of the refrigerant in the main flow path 30 disappear, the burnout phenomenon is less likely to occur in the cooler 10. As a result, the cooler 10 can cool the power module 100 well.

<Second embodiment>
The cooler 110 according to the present embodiment will be described with reference to FIGS. 5 and 6. In addition, the description which overlaps with the said 1st Example is abbreviate | omitted.
FIG. 5 shows a cross-sectional shape of a region where the communication path 140 of the cooler 110 is not provided. FIG. 6 shows a cross-sectional shape of a region where the communication path 140 of the cooler 110 is provided. In FIG. 6, the arrow written in the communication path 140 portion indicates the flow direction of the refrigerant from the sub flow path 120 toward the main flow path 130.

As shown in FIGS. 5 and 6, the cooler 110 includes a main flow path 130, a pair of sub flow paths 120, and a communication path 140. The pair of sub flow paths 120 are provided on both sides of the main flow path 130. The main flow path 130, the pair of sub flow paths 120, and the communication path 140 are provided side by side in the width direction so as to be within one layer. As shown in FIG. 6, the cooler 110 is provided such that the communication path 140 is along the upper wall member 112 side. The cooler 110 is assembled by superposing the upper wall member 112 and the lower wall member 114. The upper wall member 112 is a flat plate material. The upper wall member 112 has no protrusions or grooves. On one surface of the lower wall member 114, a main channel groove 132, a pair of sub-channel channels 122, a communication channel groove 142, and a pair of ribs 148 are formed. Is provided. The lower wall member 114 is obtained by die casting. Although a thick rolled material may be cut and manufactured, in general, in the case of mass production, the manufacturing cost is lower when manufactured by die casting. Although not shown, a supply pipe for supplying a refrigerant to each of the flow paths and a discharge pipe for discharging the refrigerant are piped at the ends of the main flow path groove 132 and the pair of sub flow path grooves 122. .
The cooler 110 may also be manufactured very simply by simply superimposing the upper wall member 112 and the lower wall member 114, which are flat plate members, and the pipe, and brazing the joining surface 115.

  In the cooler 110, the wall thickness of the partition wall 148 that separates the main flow path 130 and the sub flow path 120 is thicker than the thickness of the upper wall member 112 in the region where the power module is disposed. If the partition wall 148 is thick, the heat of the power module is difficult to propagate to the refrigerant flowing through the sub-channel 120. With such a thick partition wall 148, the temperature of the refrigerant flowing through the sub-channel 120 is difficult to rise. The main channel 130 is supplied with the low-temperature refrigerant of the sub-channel 120. As a result, bubbles generated by boiling in the main channel 130 are effectively liquefied and disappear. Since the bubbles due to the boiling of the refrigerant in the main channel 130 disappear, the burnout phenomenon is less likely to occur in the cooler 110. As a result, the cooler 110 can cool the power module 100 well.

<Third embodiment>
The cooler 210 according to this embodiment will be described with reference to FIGS. In addition, the description which overlaps with another Example is abbreviate | omitted.
FIG. 7 shows a partial plan view of the cooler 210. As shown in FIG. 7, the cooler 210 includes a main flow path 230, a pair of sub flow paths 220, and a communication path 240.
In FIG. 7, the front side of the sheet is the upper part of the cooler 210, and the back side of the sheet is the lower part of the cooler 210. 8 is a cross-sectional view taken along line VIII-VIII in FIG. FIG. 8 shows a cross-sectional shape of a region where the communication path 140 is not provided. 9 is a cross-sectional view taken along line IX-IX in FIG. FIG. 9 shows a cross-sectional shape of a region where the communication path 240 is provided. In FIG. 9, an arrow written in the communication path 240 portion indicates the flow direction of the refrigerant from the sub flow path 220 toward the main flow path 230.

As shown in FIGS. 7 to 9, the cooler 210 includes a main flow path 230, a pair of sub flow paths 220, and a communication path 240. Two sub-channels 220 are provided along both sides of the main channel 230. The main flow path 230, the sub flow path 220, and the communication path 240 are provided side by side so as to be contained in one layer. The cooler 210 is assembled by overlapping the upper wall member 212 and the lower wall member 214. On one surface of each of the upper wall member 212 and the lower wall member 214, grooves 232 and 234 for the main flow path, a pair of grooves 222 and 224 for the pair of sub flow paths, and grooves 242 and 244 for the communication path are provided. Is provided. The upper wall member 212 and the lower wall member 214 are vertically symmetrical. The upper wall member 212 and the lower wall member 214 are obtained by die casting using a common mold. At the ends of the main flow path 230 and the pair of sub flow paths 220, a supply pipe that supplies the refrigerant to each flow path and a discharge pipe that discharges the refrigerant are piped. FIG. 7 shows a main channel refrigerant supply pipe 276 that supplies a refrigerant to the main channel 230 and a sub channel refrigerant discharge pipe 260 that discharges the refrigerant from the sub channel 220.
In the cooler 210, the upper wall member 212 and the lower wall member 214 are made of the same material. The cooler 210 can be manufactured very simply by simply superimposing them and brazing the joining surface 215.

  Grooves 248, 249, 252, and 254 are formed in the partition wall 246 of the main flow path 230 and the sub flow path 220 of the cooler 210. The grooves 248 and 252 are cut in a continuous state from the upper surface side of the upper wall member 312. The grooves 249 and 254 are cut in a continuous state from the lower surface side of the lower wall member 314. The grooves 248 and 249 are formed in a region where the communication path 240 is not provided. The grooves 252 and 254 are formed in a region where the communication path 240 is provided. The depths of the grooves 248 and 249 are deeper than the depths of the grooves 252 and 254, but may be the same depth as long as they do not penetrate. When the grooves 248, 249, 252, and 254 are formed in the partition wall 246, the heat insulation state of the main channel 230 and the sub-channel 220 is improved. In the cooler 210 of this embodiment, the heat of the refrigerant in the main channel 230 that has been warmed is very difficult to propagate to the refrigerant in the sub-channel 220. By maintaining the sub flow path 220 at a low temperature, the low temperature refrigerant of the sub flow path 220 is supplied to the main flow path 230. As a result, bubbles generated by boiling in the main channel 230 are effectively liquefied and disappear. Since the bubbles due to the boiling of the refrigerant in the main channel 230 disappear, the burnout phenomenon hardly occurs in the cooler 210. As a result, the cooler 210 can cool the power module 100 well. The cooler 210 exhibits an excellent cooling capacity.

<Modification 1: Modification of the shape of the groove provided in the partition wall>
The present modification is different from the cooler 210 of the third embodiment except that the shape of the grooves 356 formed in the pair of partition walls 346 formed between the main channel 330 and the pair of sub channels 320 is different. Since this is the same, redundant description is omitted. FIG. 10 shows a cross section of a region where no communication path is provided.

The upper wall member 312 and the lower wall 314 of the cooler 310 are vertically symmetrical members. The upper wall member 312 and the lower wall member 314 are brazed with the joint surfaces 315 overlapped. An inner groove 356 is formed in a partition 346 of the main flow path 330 and the sub flow path 320, where a communication path is not provided. The internal groove 356 may be a through groove penetrating the upper surface and the lower surface of the cooler 310 as indicated by a broken line in FIG. When the internal groove 356 penetrates in the vertical direction, the heat insulating properties of the main flow path 330 and the sub flow path 320 are further improved. Although not shown, a groove is cut from the outside in the partition wall where the communication path is provided, as in the cooler 210 of the third embodiment. In addition, when the influence of the heat propagation of the part in which the communicating path 340 is provided is small, the groove | channel provided in the outer side of a communicating path can be abbreviate | omitted.
The cooler 310 has a structure in which the heat of the refrigerant in the main flow path 330 is difficult to transfer to the refrigerant in the sub flow path 320. The main flow path 330 is supplied with the low-temperature refrigerant of the sub flow path 320. Bubbles generated by boiling in the main channel 330 are effectively liquefied and disappear. Since the bubbles due to the boiling of the refrigerant in the main flow path 330 disappear, the burnout phenomenon hardly occurs in the cooler 310. As a result, the cooler 310 can cool the power module 100 well.

<Fourth embodiment>
The cooler 410 according to the present embodiment will be described with reference to FIGS. In addition, the description which overlaps with another Example is abbreviate | omitted.
FIG. 11 shows a cross-sectional shape of a region where the communication path 440 is not provided. FIG. 12 shows a cross-sectional shape of a region where the communication path 440 is provided.

As shown in FIGS. 11 and 12, the cooler 410 includes a main flow path 430, a pair of sub flow paths 420, and a communication path 440. The pair of sub flow paths 420 are provided on both sides of the main flow path 430. The main flow path 430, the pair of sub flow paths 420, and the communication path 440 are provided side by side so as to be within one layer. As shown in FIG. 12, the communication path 440 is provided along the upper wall member 412 side. The cooler 410 is assembled by overlapping the upper wall member 412 and the lower wall member 414. The upper wall member 412 is a flat plate material. The upper wall member 412 has no protrusions or grooves. On one surface of the lower wall member 414, a main channel groove 432, a pair of sub-channel channels 422, a communication channel groove, and a protrusion 446 for a partition wall 446 are provided. Yes. The lower wall member 414 is obtained by die casting. Although not shown, a supply pipe for supplying a refrigerant to each of the flow paths and a discharge pipe for discharging the refrigerant are piped at the ends of the main flow path groove 432 and the pair of sub flow path grooves 422. .
The cooler 410 can also be manufactured very simply by simply superimposing the upper wall member 412 and the lower wall member 414, which are flat plate members, and the pipe, and brazing the joining surface 415.

  Grooves 448 and 450 are provided in the partition wall 446 that separates the main channel 430 and the sub-channel 420. The grooves 448 and 450 are cut in a continuous state from the lower surface side of the lower wall member 414. The groove 448 is formed in a region where the communication path 440 is not provided. The groove 450 is formed in a region where the communication path 440 is provided. The depth of the groove 448 may be deeper than the depth of the groove 450 or may be the same depth as long as it does not penetrate the communication path 440. When the grooves 448 and 450 are formed in the partition wall 446, the heat insulating state of the main channel 430 and the sub channel 420 is improved. In the cooler 410 of the present embodiment, the heat of the heated refrigerant in the main channel 430 is extremely difficult to propagate to the refrigerant in the sub-channel 420. The refrigerant in the sub flow path 420 is maintained at a low temperature. The main channel 430 is supplied with the low-temperature refrigerant of the sub-channel 420. As a result, bubbles generated by boiling in the main channel 430 are effectively liquefied and disappear. Since the bubbles due to the boiling of the refrigerant in the main channel 430 disappear, the burnout phenomenon is less likely to occur in the cooler 410. As a result, the cooler 410 can cool the power module 100 well.

<Fifth embodiment>
The cooler 510 of the present embodiment will be described with reference to FIGS. In addition, the description which overlaps with another Example is abbreviate | omitted.
FIG. 13 shows a cross-sectional shape of a region where the communication path 540 is not provided. FIG. 14 shows a cross-sectional shape of a region where the communication path 540 is provided.

As shown in FIGS. 13 and 14, the cooler 510 includes a main flow path 530, a pair of sub flow paths 520, and a communication path 540. The pair of sub flow paths 520 are provided on both sides of the main flow path 530. The main flow path 530, the pair of sub flow paths 520, and the communication path 540 are provided side by side so as to be within one layer. As shown in FIG. 14, the communication path 540 is provided along the upper wall member 512 side. The cooler 510 is assembled by overlapping the upper wall member 512 and the lower wall member 514. A recess 513 is formed in the central region of the main channel 530 of the upper wall member 512. The upper wall member 512 is not formed with a clear protrusion or a clear groove. On one surface of the lower wall member 514, a main channel groove 532, a pair of sub-channel channels 522, a communication channel groove, and a protrusion 546 for a partition wall 546 are provided. Yes. The lower wall member 514 is obtained by die casting. Although not shown, a supply pipe for supplying a refrigerant to each of the flow paths and a discharge pipe for discharging the refrigerant are piped at the ends of the main flow path grooves 532 and the pair of sub flow path grooves 522. .
The cooler 510 can also be manufactured very simply by simply superimposing the upper wall member 512 and the lower wall member 514, which are flat plate members, and piping to braze the joining surface 515.

  In the cooler 510, grooves 548 and 550 are provided in a partition wall 546 that separates the main flow path 530 and the sub flow path 520. The grooves 548 and 550 are cut in a continuous state from the lower surface side of the lower wall member 514. The groove 548 is formed in a region where the communication path 540 is not provided. The groove 550 is formed in a region where the communication path 540 is provided. The depth of the groove 548 may be deeper than the depth of the groove 550, or the same depth as long as it does not penetrate through the communication path 540. When the grooves 548 and 550 are formed in the partition wall 546, the heat insulating state of the main channel 530 and the sub channel 520 is improved. In the cooler 510, the heated heat of the refrigerant in the main channel 530 is extremely difficult to propagate to the sub-channel 520. By maintaining the sub-flow path 520 at a low temperature, the cooler 510 exhibits an excellent cooling capacity.

  In the cooler 510, a recess 513 is formed in a region where the power module of the upper wall member 512 is disposed. When the cross-sectional shape of the main channel 530 is observed, the ceiling on the partition wall 546 side is higher than the ceiling at the center. Bubbles in the main flow path 530 formed in the refrigerant flow process are brought close to the partition-side corner 535 on the partition side, as shown in FIG. When the air bubbles are collected in the partition wall side corner 535, the air bubbles are hardly formed in the depression 513 portion that mainly cools the power module. The cooler 510 can avoid the occurrence of a burnout phenomenon due to boiling of the refrigerant. The cooler 510 can suppress a decrease in cooling capacity due to bubble formation.

  Furthermore, as shown in FIG. 14, in this cooler 510, a communication path 540 is formed at the top. The low-temperature refrigerant supplied to the main flow path 530 through the communication path 540 is introduced toward the bubbles brought to the partition wall side corner 535. Due to the action of the low-temperature refrigerant introduced from the communication path 540, the bubbles brought toward the partition wall side corner portion 535 are cooled and disappear. Mixing with the low-temperature refrigerant supplied from the sub-channel 520 to the communication channel 540 is promoted, and the boiling bubbles in the main channel 530 are efficiently eliminated. The disappearance of the bubbles, which is one of the factors that lower the cooling capacity, suppresses the decrease in the cooling capacity of the cooler.

<Sixth embodiment>
The cooler 610 according to the present embodiment will be described with reference to FIGS. In addition, the description which overlaps with another Example is abbreviate | omitted.
FIG. 15 shows a partial plan view of the cooler 610. As shown in FIG. 15, a main flow path 630, a pair of sub flow paths 620, and a communication path 640 are provided inside the cooler 610. Two sub-channels 620 are provided along both sides of the main channel 630.
In FIG. 15, the near side of the page is the upper part of the cooler 610, and the far side of the page is the lower part of the cooler 610. 16 is a cross-sectional view taken along line XVI-XVI in FIG. FIG. 16 shows a cross-sectional shape of a region where the communication path 640 is not provided. 17 is a cross-sectional view taken along line XVII-XVII in FIG. FIG. 17 shows a cross-sectional shape of a region where the communication path 640 is provided. In FIG. 17, an arrow written in the communication path 640 portion indicates the flow direction of the refrigerant from the sub flow path 620 toward the main flow path 630.

As shown in FIGS. 15 to 17, the cooler 610 includes a main flow path 630, a pair of sub flow paths 620, and a communication path 640. The main flow path 630, the sub flow path 620, and the communication path 640 are provided side by side so as to be contained in one layer. The cooler 610 is assembled by overlapping the upper wall member 612 and the lower wall member 614. On one surface of each of the upper wall member 612 and the lower wall member 614, grooves 632 and 634 for the main flow path, a pair of grooves 622 and 624 for the pair of sub flow paths, and grooves 642 and 644 for the communication path are provided. Is provided. The upper wall member 612 and the lower wall member 614 are vertically symmetrical. The upper wall member 612 and the lower wall member 614 can be obtained very easily by press molding using a common press mold. At the ends of the main flow path 630 and the sub flow path 620, a supply pipe for supplying a refrigerant to each flow path and a discharge pipe for discharging the refrigerant are connected (in FIG. 15, a main flow path refrigerant supply pipe 676). A sub-channel refrigerant discharge pipe 660 is shown.).
In the cooler 610, the upper wall member 612 and the lower wall member 614 are made of the same material. The cooler 610 can be manufactured very simply by simply superimposing them and brazing the joining surface 615.

  Grooves 648, 649, 652, 654 are formed between the main flow path 630 and the sub flow path 620. The grooves 648 and 652 are formed continuously from the upper surface side of the upper wall member 612. The grooves 649 and 654 are continuously cut from the lower surface side of the lower wall member 614. The grooves 648 and 649 are formed in a region where the communication path 640 is not provided. The grooves 652 and 654 are formed in a region where the communication path 640 is provided. The depths of the grooves 648 and 649 are deeper than the depths of the grooves 652 and 654. When the grooves 648, 649, 652, and 654 are formed in the partition wall 646, the heat insulation state of the main channel 630 and the sub-channel 620 is improved. In the cooler 610 of this embodiment, the heat of the heated refrigerant in the main channel 630 is extremely difficult to propagate to the sub-channel 620. By maintaining the sub flow path 620 at a low temperature, the cooler 610 exhibits an excellent cooling capacity.

<Seventh embodiment>
The cooler 710 according to this embodiment will be described with reference to FIGS. In addition, the description which overlaps with another Example is abbreviate | omitted.
FIG. 18 shows a cross-sectional shape of a region where the communication path 740 of the cooler 710 is not provided. FIG. 19 shows a cross-sectional shape of a region where the communication path 740 of the cooler 710 is provided.

As shown in FIGS. 18 and 19, the cooler 710 includes a main flow path 730, a pair of sub flow paths 720, and a communication path 740 as flow paths through which the refrigerant flows. Two pairs of sub-channels 720 are provided along both sides of the main channel 730. The main flow path 730, the sub flow path 720, and the communication path 740 are provided side by side so as to be contained in one layer. As shown in FIG. 18, the communication path 740 is provided along the upper wall member 712 side. The cooler 710 is assembled by overlapping the upper wall member 712 and the lower wall member 714. The upper wall member 712 is a flat plate material. No protrusions or grooves are formed on the upper wall member 712. One surface of the lower wall member 714 is provided with a main channel groove 732, a pair of sub-channel channels 722, a communication channel groove and a partition rib 746. The lower wall member 714 is obtained by press molding a single plate material. Although not shown, a supply pipe that supplies a refrigerant to each of the flow paths and a discharge pipe that discharges the refrigerant are piped at the ends of the main flow path groove 732 and the pair of sub flow path grooves 722. .
The cooler 710 can also be manufactured very simply by simply superposing the upper wall member 712 and the lower wall member 714, which are flat plate members, and piping to braze the joint surface 715.

  Grooves 748 and 750 are provided in the partition wall 746 that separates the main channel 730 and the sub-channel 720. The grooves 748 and 750 are provided in a continuous state from the lower surface side of the lower wall member 714. The groove 748 is formed in a region where the communication path 740 is not provided. The groove 750 is formed in a region where the communication path 740 is provided. The depth of the groove 748 is deeper than the depth of the groove 750. When the grooves 748 and 750 are formed in the partition wall 746, the heat insulating state of the main channel 730 and the sub channel 720 is improved. In the cooler 710 of this embodiment, the heat of the heated refrigerant in the main channel 730 is extremely difficult to propagate to the sub-channel 720. By maintaining the sub-channel 720 at a low temperature, the cooler 710 exhibits an excellent cooling capacity.

<Eighth embodiment>
The cooler 810 of the present embodiment will be described with reference to FIGS. In addition, the description which overlaps with another Example is abbreviate | omitted.
FIG. 20 shows a cross-sectional shape of a region where the communication path 840 is not provided. FIG. 21 shows a cross-sectional shape of a region where the communication path 840 is provided.

As shown in FIGS. 20 and 21, the cooler 810 includes a main flow path 830, a sub flow path 820, and a communication path 840. Two pairs of sub-channels 820 are provided along both sides of the main channel 830. The main flow path 830, the pair of sub flow paths 820, and the communication path 840 are provided side by side so as to be contained in one layer. As shown in FIG. 20, the communication path 840 is provided along the upper wall member 812 side. The cooler 810 is assembled by overlapping the upper wall member 812 and the lower wall member 814. The upper wall member 812 is a plate material in which a recess 813 is formed in the central region of the main flow path 830. The upper wall member 812 has no obvious protrusions or obvious grooves. The depression 813 of the upper wall member 812 is obtained by press molding. On one surface of the lower wall member 814, a main channel groove 832, a sub channel groove 822, a communication channel groove 842, and a protrusion for a partition wall 846 are provided. The lower wall member 814 is obtained by press molding. Although not shown, a supply pipe for supplying a refrigerant to each of the flow paths and a discharge pipe for discharging the refrigerant are provided at ends of the main flow path groove 832 and the sub flow path groove 822.
The cooler 810 can also be manufactured very simply by simply superimposing the upper wall member 812, the lower wall member 814, and the piping to braze the joint surface 815.

  In the cooler 810, grooves 848 and 850 are provided in the partition wall 846 of the main channel 830 and the sub channel 820. The grooves 848 and 850 are cut in a continuous state from the lower surface side of the lower wall member 814. The groove 848 is formed in a region where the communication path 840 is not provided. The groove 850 is formed in a region where the communication path 840 is provided. The depth of the groove 848 is deeper than the depth of the groove 850. When the grooves 848 and 850 are formed in the partition wall 846, the heat insulation state of the main channel 830 and the sub-channel 820 is improved. In the cooler 810, the heated heat of the refrigerant in the main channel 830 is very difficult to propagate to the sub-channel 820. By maintaining the sub flow path 820 at a low temperature, the cooler 810 exhibits an excellent cooling capacity.

  In the cooler 810, a recess 813 is formed in a region where the power module of the upper wall member 812 is disposed. When the cross-sectional shape of the main channel 830 is observed, the ceiling on the partition wall 846 side is higher than the ceiling at the center. Bubbles in the main flow path 830 formed in the refrigerant flow process are brought close to the partition-side corner 835 on the partition 846 side, as shown in FIG. When the air bubbles are collected in the partition wall side corner 835, the air bubbles are hardly formed in the depression 813 portion that mainly cools the power module. The cooler 810 can avoid the occurrence of a burnout phenomenon due to boiling of the refrigerant. The cooler 810 can suppress a decrease in cooling capacity due to the formation of bubbles.

  Furthermore, as shown in FIG. 21, in this cooler 810, a communication path 840 is formed at the top. The low-temperature refrigerant supplied to the main flow path 830 through the communication path 840 is introduced toward the bubbles brought to the partition wall side corner 835. Due to the action of the low-temperature refrigerant introduced from the communication path 840, the bubbles brought to the partition-side corner 835 are cooled and disappear. Mixing with the low-temperature refrigerant supplied from the sub-channel 820 to the communication channel 840 is promoted, and the boiling bubbles in the main channel 830 are efficiently eliminated. The disappearance of the bubbles suppresses a decrease in the cooling capacity of the cooler.

<Ninth embodiment>
The cooler 910 of the present embodiment will be described with reference to FIGS. In addition, the description which overlaps with another Example is abbreviate | omitted.
FIG. 22 shows a partial plan view of the cooler 910. As shown in FIG. 22, the inside of the cooler 910 includes a main flow path 930, a pair of sub flow paths 920, and a communication path 940. Two pairs of sub-channels 920 are provided along both sides of the main channel 930. The arrows shown in FIG. 22 indicate the flow direction of the refrigerant flowing through the cooler 910.
In FIG. 22, the near side of the page is the upper part of the cooler 910, and the far side of the page is the lower part of the cooler 910. 23 is a cross-sectional view taken along line XXIII-XXIII in FIG. FIG. 23 shows a cross-sectional shape of a region where the communication path 940 is not provided.

As shown in FIGS. 22 and 23, the cooler 910 includes a main flow path 930, a pair of sub flow paths 920, and a communication path 940. The main flow path 930, the pair of sub flow paths 920, and the communication path 940 are provided side by side within a single layer. The cooler 910 is assembled by overlapping the upper wall member 912 and the lower wall member 914. The lower wall member 914 is provided with a groove 932 for a main flow path, a pair of grooves 922 for a sub flow path, and a groove for a communication path. The upper wall member 912 and the lower wall member 914 can be obtained very easily by press molding using a press die. At the ends of the main flow path 930 and the sub flow path 920, a supply pipe for supplying a refrigerant to each flow path and a discharge pipe for discharging the refrigerant are piped (in FIG. 22, a main flow path refrigerant supply pipe 976 and A sub-channel refrigerant discharge pipe 960 is shown.).
The cooler 910 can be manufactured very simply by simply overlapping the upper wall member 912 and the lower wall member 914 and brazing the joining surface 915.

  A through groove 954 that penetrates the upper wall member 912 and the lower wall member 914 of the cooler 910 is formed in a region where the communication path 940 is not provided between the main flow path 930 and the sub flow path 920. When the through groove 954 is formed between the main channel 930 and the sub channel 920, the hole portion of the through channel 954 is difficult to transfer heat. The heat insulation state of the main channel 930 and the sub channel 920 is further improved. In the cooler 910 of this embodiment, the heat of the refrigerant in the main channel 930 is extremely difficult to propagate to the sub channel 920. By maintaining the sub-channel 920 at a low temperature, the cooler 910 exhibits a particularly excellent cooling capacity.

<Tenth embodiment>
The cooler 1010 according to the present embodiment will be described with reference to FIGS. In addition, the description which overlaps with another Example is abbreviate | omitted.
FIG. 24 shows a partial plan view of the cooler 1010. As shown in FIG. 24, the cooler 1010 includes a main channel 1030, a pair of sub-channels 1020, and a communication channel 1040 as channels through which the refrigerant flows. Two pairs of sub-channels 1020 are provided along both sides of the main channel 1030. The cooler 1010 is provided with a main channel refrigerant supply pipe 1076 for supplying refrigerant to the main channel 1030 and a sub channel refrigerant supply pipe 1066 for supplying refrigerant to the sub channel. The main channel coolant supply pipe 1076 and the sub channel coolant supply pipe 1066 are provided at opposite ends. In the cooler 1010, the refrigerant discharge pipe 1070 is provided only in the main flow path 1030, and the refrigerant discharge pipe is not provided in the sub flow path 1020. All the refrigerant flowing through the sub flow channel 1020 flows into the main flow channel 1030. The refrigerant flowing in the main flow path 1030 and the sub flow path 1020 is discharged in common from the refrigerant discharge pipe 1070 provided in the main flow path 1030. The arrows shown in FIG. 24 indicate the flow direction of the refrigerant flowing through the cooler 1010. 25 is a sectional view taken along line XXV-XXV in FIG. FIG. 25 shows a cross-sectional shape of a region where the communication path 1040 is provided. 26 is a cross-sectional view taken along line XXVI-XXVI in FIG. FIG. 26 shows a cross-sectional shape of a region where the communication path 1040 is not provided.

As shown in FIGS. 24 to 26, the cooler 1010 includes a main flow path 1030, a pair of sub flow paths 1020, and a communication path 1040 as flow paths through which the refrigerant flows. The main flow path 1030, the pair of sub flow paths 1020, and the communication path 1040 are provided in a side-by-side state within a single layer. As shown in FIGS. 25 and 26, the cooler 1010 includes four plates, an upper wall plate 1012 that constitutes the upper wall, an upper middle plate 1014, a lower middle plate 1016, and a lower wall plate 1018 that constitutes the lower wall. It is comprised from the board material.
Each plate material 1012, 1014, 1016, 1018 is obtained by press-cutting a rolled material. The rolled material can reduce the thickness of the plate material. On the other hand, it is difficult to reduce the thickness of a plate obtained from a cast material such as die casting. When a rolled material capable of reducing the thickness is used, the heat of the power module is quickly propagated to the refrigerant. Further, a cast material such as die casting has a lower thermal conductivity than a rolled material. For example, when aluminum is used as the main material, the thermal conductivity of the rolled material is 238 W / mK, while the thermal conductivity of the die-cast material is 90 to 150 W / mK. When aluminum is rolled, high-purity aluminum can be used. On the other hand, when aluminum is cast, an additive such as silicon is used for aluminum. Since the cast material has poor aluminum purity, the thermal conductivity is low. The cooling capacity is further improved by adopting a press-formed product of a rolled material as a constituent member. Detailed shapes of the plate members 1012, 1014, 1016, and 1018 will be described later.

  In a region where the communication path 1040 is not provided between the main flow path 1030 and the pair of sub flow paths 1020, an upper wall plate 1012, an upper middle plate 1014, a lower middle plate 1016, A through groove 1054 that penetrates through four of the lower wall plates 1018 constituting the wall is formed. When the through groove 1054 is formed between the main channel 1030 and the sub channel 1020, the hole portion of the through channel 1054 is a portion where heat exchange is inactive. Between the main flow path 1030 and the sub flow path 1020, it is excellent in a heat insulation state. Since the refrigerant in the sub-channel 1020 supplied to the main channel 1030 is kept at a low temperature, the temperature rise of the entire refrigerant flowing in the cooler 1010 is suppressed, and the burnout phenomenon is suppressed. As a result, the cooling capacity of the cooler 1010 is increased.

  As shown in FIG. 25, in the communication passage 1040 of the cooler 1010, the flat portion 1058 of the lower middle plate 1016 and the flat portion 1056 of the upper middle plate 1014 face each other so as to form a step of the communication passage 1040. Thereby, the communication path 1040 is bent. Air bubbles in the sub flow path 1020 are unlikely to pass through the bent communication path 1040. When the communication path 1040 is bent, the bubbles in the sub flow path 1020 are difficult to be introduced into the main flow path 1030. In the main flow path 1030, introduction of bubbles from the communication path 1040 is suppressed. By reducing the bubble generation elements in the main flow path 1030, the cooling capacity of the cooler 1010 increases. As will be described later, the upper intermediate plate 1014 has a flat portion 1056 so that the partition wall region 1046 is not divided and is easy to manufacture. Similarly, the lower intermediate plate 1016 has a flat portion 1058 so that the partition region 1048 is not divided and is easy to manufacture.

Next, the plate material of the upper wall plate 1012, the upper middle plate 1014, the lower middle plate 1016, and the lower wall plate 1018 constituting the cooler 1010 and the manufacturing method of the cooler 1010 will be described.
FIG. 27 is a partial plan view of the upper wall plate 1012. As shown in FIG. 27, the upper wall plate 1012 has intermittent through holes 1054a in regions along the partition walls of the main flow path 1030 and the sub flow path 1020. The through groove 1054 formed in the partition wall of the cooler 1010 is formed by overlapping the through hole 1054a and the through holes 1054b, 1054c, and 1054d of other constituent plates.

FIG. 28 is a partial plan view of the upper middle plate 1014. As shown in FIG. 28, the upper intermediate plate 1014 is provided with a sub-flow channel hole 1022, a main flow channel hole 1032 and a through hole 1054b. Further, as a cut for piping, a cut 1077 for the refrigerant supply pipe 1076 for the main flow path, a cut 1067 for the refrigerant supply pipe 1066 for the auxiliary flow path, and a cut 1071 for the refrigerant discharge pipe 1070 are provided. Since the cooler 1010 has a common refrigerant discharge pipe 1070 for discharging the refrigerant, a cut for the refrigerant discharge pipe is not formed on the sub-flow path 1020 side. Since the upper intermediate plate 1014 is not finely cut at the edge, positioning with the other plate members 1012, 1016, and 1018 is easy. The upper middle plate 1014 has a partition wall region 1046 that forms the partition wall 1040 of the cooler 1010. The through-hole 1054b is intermittently formed along the partition wall region 1046. The through groove 1054 formed in the partition wall of the cooler 1010 is formed by overlapping the through hole 1054b and the through holes 1054a, 1054c, and 1054d of other component plates. In the partition wall region 1046, a notch 1042 for communication passage is formed between the adjacent through holes 1054b and 1054b. The communication passage cut 1042 is formed in a substantially rectangular shape on the side of the sub-flow channel hole 1022. The refrigerant in the communication path 1040 of the cooler 1010 flows between the notch 1042 and a notch 1044 in the lower middle plate 1016 described later. A region between adjacent through-holes 1054b where the communication path cut 1042 is not formed has a flat portion 1056 that becomes a step of the communication path 1040 of the cooler 1010. When the flat portion 1056 is provided, the region between the adjacent communication path 1040 and the communication path 1040 is not finely divided, so that the upper middle plate 1014 can be easily manufactured. Further, when joining with other plate members 1012, 1016, 1018, positioning is easy.
The upper surface of the upper intermediate plate 1014 is a region other than the sub-flow passage hole 1022, the main flow-path hole 1032, the through-hole 1054b, the piping cuts 1067, 1077, and 1071, and the communication passage cut 1042. Is joined to the lower surface of the upper wall plate 1012. The lower surface of the upper intermediate plate 1014 is connected to the sub-flow hole 1022, the main flow-path hole 1032, the through-hole 1054b, the communication path cut 1044, the flat portion 1056, the pipe cuts 1067, 1077, and 1071. A region other than the notch 1042 for the passage is joined to the upper surface of the lower middle plate 1016.

FIG. 29 is a partial plan view of the lower middle plate 1016. As shown in FIG. 29, the lower intermediate plate 1016 is provided with a sub-channel hole 1024, a main channel hole 1034, and a through hole 1054c. Further, as a cut for piping, a cut 1078 for the refrigerant supply pipe 1076 for the main flow path, a cut 1068 for the refrigerant supply pipe 1066 for the auxiliary flow path, and a cut 1072 for the refrigerant discharge pipe 1070 are provided. Since the cooler 1010 has a common refrigerant discharge pipe 1070 for discharging the refrigerant, a cut for the refrigerant discharge pipe is not formed on the sub-flow path 1020 side. Since the edge of the lower middle plate 1016 is not cut finely, positioning with the other plate members 1012, 1014, and 1018 is easy. The lower middle plate 1016 has a partition wall region 1048 that forms the partition wall 1040 of the cooler 1010. The through-hole 1054c is intermittently formed along the partition wall region 1048. The through groove 1054 formed in the partition wall of the cooler 1010 is formed by overlapping the through hole 1054c and the through holes 1054a, 1054b, and 1054d of other constituent plates. In the partition wall region 1048, a notch 1044 for communication passage is formed between the adjacent through holes 1054c and 1054c. The notch 1044 for the communication path is formed in a substantially square shape on the side of the sub-channel hole 1024. The refrigerant in the communication passage 1040 of the cooler 1010 flows between the cut 1044 and the cut 1042 of the upper middle plate 1014 described above. A region between adjacent through-holes 1054c and where the communication path notch 1044 is not formed has a flat portion 1058 serving as a step of the communication path 1040 of the cooler 1010. When the flat portion 1058 is provided, the area between the adjacent communication path 1040 and the communication path 1040 is not divided finely, and therefore the lower middle plate 1016 can be easily manufactured. Further, when joining with other plate members 1012, 1014, 1018, positioning becomes easy.
The lower surface of the lower middle plate 1016 has a hole other than the sub-channel hole 1024, the main channel hole 1034, the through-hole 1054 c, the pipe cuts 1068, 1078, 1072, and the communication path cut-out 1044. The region is joined to the upper surface of the lower wall plate 1018. The upper surface of the lower middle plate 1016 has a sub-flow hole 1024, a main flow-path hole 1034, a through-hole 1054c, a communication path cut 1042, a flat portion 1058, and pipe cut-outs 1068, 1078, 1072, An area other than the notch 1044 for the communication path is joined to the lower surface of the upper middle plate 1014.

FIG. 30 is a partial plan view of the lower wall plate 1018 of the cooler 1010. As shown in FIG. 30, the lower wall plate 1018 has intermittent through-holes 1054d in regions along the partition walls of the main flow path 1030 and the sub flow path 1020. The through groove 1054 formed in the partition wall of the cooler 1010 is formed by overlapping the through hole 1054d and the through holes 1054a, 1054b, and 1054c of other constituent plates.
The cooler 1010 is manufactured by stacking the upper wall plate 1012, the upper middle plate 1014, the lower middle plate 1016, and the lower wall plate 1018 having the above shape, and brazing the joint surface 1015. The upper wall plate 1012, the upper middle plate 1014, the lower middle plate 1016, and the lower wall plate 1018 are made of the same material. The cooler 1010 can be manufactured by brazing each component plate 1012, 1014, 1016, 1018 at a time in a stacked state.

<Eleventh embodiment>
The cooler 1110 of the present embodiment will be described with reference to FIGS. FIG. 31 is a plan view schematically showing the cooler 1110. 32 is a cross-sectional view taken along line XXXII-XXXII in FIG. The arrows in FIGS. 31 and 32 indicate the direction in which the refrigerant flows through the cooler 1110.
As shown in FIGS. 31 and 32, the cooler 1110 is provided with a main channel 1130, a sub-channel 1120, and a communication channel 1140 that communicates the main channel 1130 and the sub-channel 1120 as a channel through which the refrigerant communicates. . The main flow path 1130, the sub flow path 1120, and the communication path 1140 are provided in the same layer in the cooler 1130.
As shown in the cross-sectional view of FIG. 32, the upper wall member 1112 has a main channel refrigerant discharge pipe 1170, a main channel refrigerant supply pipe 1176, a sub channel refrigerant discharge pipe 1160, and a sub channel channel projecting upward. A refrigerant supply pipe 1166 is provided. The cooler 1110 is manufactured by brazing an upper wall member 1120 and a lower wall member 1130 obtained by press molding of a plate material with a joint surface 1115.

As shown in FIGS. 31 and 32, the refrigerant flow through the cooler 1110 is such that the main flow path 1130 is provided in the central region of the cooler 1110 and the sub flow path 1120 surrounds the outer periphery of the main flow path 1130. Is provided. A communication path 1140 is provided between the sub flow path 1120 and the main flow path 1130.
The refrigerant flowing through the main flow path 1130 is supplied from a main flow path refrigerant supply pipe 1176 provided at one end of the main flow path 1130 and discharged from a main flow path refrigerant discharge pipe 1170 provided at the other end. . The refrigerant flowing in the sub-channel 1120 is supplied from one sub-channel refrigerant supply pipe 1166 at the end of the main channel 1130 on the main-channel refrigerant discharge pipe 1170 side. The refrigerant is discharged from the side sub-channel refrigerant discharge pipe 1160 side. The refrigerant flow in the sub-channel 1120 is first supplied from the sub-channel refrigerant supply pipe 1166 and branches in a direction perpendicular to the flow direction of the refrigerant flowing in the main channel 1130. Subsequently, it flows in the direction opposite to the flow direction of the main flow path 1130. And it merges toward the refrigerant | coolant discharge pipe 1160 for subchannels. A refrigerant on the upstream side of the sub-channel 1120 is supplied on the downstream side of the main channel 1130, and a refrigerant on the downstream side of the sub-channel 1120 is supplied on the upstream side of the main channel 1130. Since fresh refrigerant is supplied from the sub-channel 1120 toward the main channel 1130 through the communication path 1140, the temperature rise of the refrigerant flowing downstream of the main channel 1130 is also suppressed. As a result, the refrigerant flowing through the main flow path 1130 is maintained at a low temperature, and the burnout phenomenon is suppressed. The cooler 1110 is excellent in the ability to cool the power module.

<Twelfth embodiment>
The cooler 1210 of the present embodiment will be described with reference to FIG. FIG. 33 is a plan view schematically showing the cooler 1210. An arrow in FIG. 33 indicates a direction in which the refrigerant flows in the cooler 1210.
As shown in FIG. 33, the cooler 1210 has a main flow path 1230, a sub flow path 1220, and a communication path 1240. The main flow path 1230, the sub flow path 1220, and the communication path 1240 are provided in the same layer in the cooler 1230. On the upper surface of the cooler 1210, there are a refrigerant discharge pipe 1280 and a refrigerant supply pipe 1286 protruding upward. Note that the upper surface of the cooler 1210 is the front side of the sheet of FIG. The cooler 1230 is manufactured by brazing an upper wall member and a lower wall member obtained by press molding of a plate material at the joint surface in the same manner as the cooler 1110 of the eleventh embodiment.

As shown in FIG. 33, the refrigerant path flowing through the cooler 1210 is such that the main flow path 1230 is provided in the central region of the cooler 1210 and the sub flow path 1220 surrounds the outer periphery of the main flow path 1230. ing. A communication path 1240 is provided between the sub flow path 1220 and the main flow path 1230. The main flow path 1230 and the sub flow path 1220 communicate with each other at both ends.
The refrigerant flowing in the main flow path 1230 and the sub flow path 1220 is supplied from a refrigerant supply pipe 1286 provided in a region which is one end of the main flow path 1230 and communicates with the sub flow path 1220, and the other end. The refrigerant is discharged from a refrigerant discharge pipe 1280 provided in a region communicating with the auxiliary flow path 1220. The refrigerant supplied from the refrigerant supply pipe 1286 branches in a T-shape in three directions of the sub flow channel 1220, the main flow channel 1230, and the sub flow channel 1220. Subsequently, it flows in the direction opposite to the flow direction of the main flow path 1230. Next, the refrigerant flowing in the sub flow paths 1220 and 1220 bends at right angles so as to flow in the same direction as the flow of the refrigerant in the main flow path 1230. Then, the refrigerant flowing through the auxiliary flow paths 1220 and 1220 bends at a right angle again on the downstream side and merges with the main flow path 1230. The merged refrigerant in the main flow path 1230 and the sub flow path 1220 is discharged from the refrigerant discharge pipe 1280 in the merged portion.
The cooler 1210 has a common refrigerant supply pipe 1280 that supplies refrigerant to the main flow path 1230 and the sub flow path 1220 and a refrigerant discharge pipe 1286 that discharges the refrigerant. In the cooler 1210, the traveling direction of the refrigerant flowing through the main flow path 1230 and the sub flow path 1220 is the same, so the refrigerant flowing downstream of the sub flow path 1220 is supplied downstream of the main flow path 1230. The piping related to the supply and discharge of the refrigerant in the cooler 1210 is simple.

<Thirteenth embodiment>
The cooler 1310 of the present embodiment will be described with reference to FIGS. In addition, the description which overlaps with another Example is abbreviate | omitted.
FIG. 34 is a plan view schematically showing the cooler 1310. Illustration of the upper wall member 1312 is omitted. 35 is a cross-sectional view taken along line XXXV-XXXV in FIG. 34 and shows a cross-sectional shape of a region where the communication path 1340 of the cooler 1310 is provided.

As shown in FIG. 34, the cooler 1310 includes a main flow path 1330, a sub flow path 1320, and a communication path 1340. As shown in FIG. 35, the main flow path 1330, the sub flow path 1320, and the communication path 1340 are provided side by side so as to be contained in one layer.
As shown in FIG. 35, the cooler 1310 is provided so that the communication path 1340 is along the upper wall member 1312 side. The cooler 1310 is assembled by overlapping the upper wall member 1312 and the lower wall member 1314. A flat plate material is used for the upper wall member 1312 of the cooler 1310.
One surface of the lower wall member 1314 is provided with a groove 1332 for the main flow path, a groove 1322 for the sub flow path, a groove 1342 for the communication path, and a protrusion for the partition wall 1346. Further, the lower wall member 1314 is provided with a plurality of protrusions in the groove of the main flow path 1332. The plurality of protrusions constitute a bubble guide plate 1336 described later.
The lower wall member 1314 is obtained by press molding of a plate material. At the end of the main channel groove 1332, a main channel refrigerant supply pipe 1376 that supplies a refrigerant to the main channel and a main channel refrigerant discharge pipe 1370 that discharges the refrigerant are piped. At the end of the sub-channel groove 1322, a sub-channel refrigerant supply pipe 1366 that supplies a refrigerant to the sub-channel 1320 and a sub-channel refrigerant discharge pipe 1366 that discharges the refrigerant of the sub-channel 1320 are piped. Is done.
The cooler 1310 can also be manufactured very simply by simply superimposing the upper wall member 1312, the lower wall member 1314, and the pipe to braze the joint surface 1315.

  The cooler 1310 includes a bubble guide plate 1336 provided in the main channel 1330 from the center of the main channel toward the partition wall. Bubbles in the main flow path 1330 formed in the refrigerant flow process are drawn to the partition wall side corner 1335. In addition, bubbles generated when flowing into the main flow path 1330 from the communication path 1340 are pushed back to the partition side due to the presence of the bubble guide plate 1336 and are brought to the partition side corner 1335 as shown in FIG. When the air bubbles are collected at the partition side corner 1335, it becomes difficult to generate air bubbles in a region where the power module of the main flow path 1330 is mainly cooled. The cooler 1310 can suppress a decrease in cooling capacity due to the formation of bubbles.

  Furthermore, as shown in FIG. 35, the cooler 1310 has a communication path 1340 formed in the upper part. The refrigerant supplied to the main flow path 1330 through the communication path 1340 is introduced toward the bubbles brought to the partition side corner 1335. In the present cooler 1310, a communication path 1340 is formed in the upper part. The low-temperature refrigerant supplied to the main flow path 1330 through the communication path 1340 is introduced toward the bubbles brought to the partition wall side corner 1335. Due to the action of the low-temperature refrigerant introduced from the communication path 1340, the bubbles brought toward the partition wall side corner 1335 are cooled and disappear. Mixing with the low-temperature refrigerant supplied from the sub-flow path 1320 to the communication path 1340 is promoted, and the boiling bubbles in the main flow path 1330 are efficiently eliminated. The disappearance of the bubbles, which is one of the factors that lower the cooling capacity, suppresses the decrease in the cooling capacity of the cooler.

<14th embodiment>
A partial plan view of the cooler 1410 of this embodiment is shown in FIG. The cooler 1410 cools the two power modules 100 disposed on the upper surface. The cooler 1410 of this embodiment includes two main flow paths 1430a and 1430b, three sub flow paths 1420a, 1420b, and 1420c, and a communication path 1440. The main channel 1430a is provided between the sub-channel 1420a and the sub-channel 1420b. The main channel 1430b is provided between the sub-channel 1420b and the sub-channel 1420c. One of the two power modules 100 is disposed on the upper surface of the main channel 1430a, and the other is disposed on the upper surface of the main channel 1430b.
The communication path 1440 is formed between the sub flow path 1420a and the main flow path 1430a, between the main flow path 1430a and the sub flow path 1420b, between the sub flow path 1420b and the main flow path 1430b, and between the main flow path 1430b and the sub flow path 1420c. A plurality of them are provided between them. The main flow paths 1430a and 1430b, the sub flow paths 1420a, 1420b and 1420c, and the communication path 1440 are provided in one layer between the upper wall member and the lower wall member. The cooler 1410 can be manufactured very simply by brazing the joint surface between the upper wall member and the lower wall member.

The arrows shown in FIG. 36 indicate the direction in which the refrigerant flows. The main flow paths 1430a and 1430b include main flow path refrigerant supply pipes 1476a and 1476b provided at one end of each, and a main flow path refrigerant discharge pipe (not shown) provided at the other end of each. ). The refrigerant flowing through the main flow paths 1430a and 1430b is supplied from the main flow path refrigerant supply pipes 1476a and 1476b, and is discharged from the main flow path refrigerant discharge pipe.
The sub-channels 1420a, 1420b, and 1420c are each provided with a sub-channel refrigerant supply pipe (not shown) provided at one end of each, and the main channel refrigerant provided at the other end of each. Discharge pipes 1460a, 1460b, and 1460c are provided. The refrigerant flowing through the sub-channels 1420a, 1420b, and 1420c is supplied from the sub-channel refrigerant supply pipe and discharged from the sub-channel refrigerant discharge pipes 1460a, 1460b, and 1460c. As shown by the arrows in FIG. 35, the flow directions of the refrigerant in the main flow paths 1430a and 1430b are the same direction. The direction in which the refrigerant flows in the sub-channels 1420a, 1420b, and 1420c is the same direction. The direction in which the refrigerant flows in the main flow paths 1430a and 1430b is opposite to the direction in which the refrigerant flows in the sub flow paths 1420a, 1420b, and 1420c. In the communication path 1440, the refrigerant in the sub flow paths 1420a, 1420b, and 1420c flows toward the main flow paths 1430a and 1430b. The refrigerant on the upstream side of the sub-channels 1420a, 1420b, 1420c is supplied downstream of the main channels 1430a, 1430b, and the refrigerant on the downstream side of the sub-channels 1420a, 1420b, 1420c is supplied upstream of the main channels 1430a, 1430b. Is done. Since fresh refrigerant is supplied from the auxiliary flow paths 1420a, 1420b, and 1420c toward the main flow paths 1430a and 1430b through the communication path 1440, an increase in the temperature of the refrigerant that flows downstream of the main flow paths 1430a and 1430b is also suppressed. By supplying fresh refrigerant in the sub-channels 1420a, 1420b, and 1420c to the downstream side of the main channels 1430a and 1430b, the temperature of the refrigerant flowing in the downstream side of the main channels 1430a and 1430b decreases. As a result, overheating of the refrigerant flowing through the main flow paths 1430a and 1430b is suppressed. According to the configuration of the present cooler 1440, even if the two power modules 100 are arranged in parallel on the upper surface, a high cooling capacity is exhibited. The cooler 1440 shows an example in which two power modules 100 are arranged. If this cooler 1440 is applied and a flow path configuration in which main flow paths and sub flow paths are alternately arranged is adopted, more power modules can be arranged.

<Fifteenth embodiment>
FIG. 37 is a cross-sectional view showing the configuration of the cooler 1500 of this example. FIG. 37 shows a cross-sectional shape of a region in which the communication path 1540 of each cooling unit 1510, the connection parts 1574 and 1573 that connect the main flow paths 1530 and 1530, and the connection part 1564 that connects the sub-flow paths 1520 and 1520 are shown. Yes. In the cooling unit 1510, the cross-sectional shape of the region where the communication path 1540 is not provided is closed at the communication path 1540 portion.
The cooler 1500 has a laminated structure in which five cooling units 1510a, 1510b, 1510c, 1510d, and 1510e are stacked from below. In the following description, the cooling units 1510a, 1510b, 1510c, 1510d, and 1510e are described as the cooling unit 1510 except for the case where each characteristic description is given.
The power module 100 is disposed between the adjacent cooling units 1510 and 1510. The cooler 1500 cools the four power modules 100.

The cooling unit 1510 of the cooler 1500 will be described.
The cooling unit 1510 includes a main channel 1530, a sub channel 1520, and a communication channel 1540 as channels through which the refrigerant flows. The sub channel 1520 is provided along one side of the main channel 1530. The main flow path 1530, the sub flow path 1520, and the communication path 1540 are provided side by side so as to be accommodated in one layer.

As shown in FIG. 37, the upper wall member 1512 of the cooling unit 1510 protrudes from the upper surface of the upper refrigerant supply pipe 1575 protruding from the upper surface of the main flow path 1530 on the sub flow path 1520 side and the upper surface on the opposite side of the sub flow path 1520. An upper refrigerant discharge pipe 1571 is provided. The upper refrigerant discharge pipe 1571 and the upper refrigerant supply pipe 1575 of the uppermost cooling unit 1510e are provided with plugs 1582, respectively. Further, it is also possible to configure the cooling unit 1510e in a shape that does not form the upper refrigerant discharge pipe 1571 and the upper refrigerant supply pipe 1575 in advance. The plug 1582 is provided to completely close the upper wall of the main flow path 1530 of the cooling unit 1510e, thereby forming a refrigerant flow indicated by an arrow in FIG. The refrigerant flow in the cooler 1500 will be described in detail later.
Further, the upper wall member 1512 is provided with a refrigerant discharge pipe 1560 protruding from the upper surface of the sub flow path 1520. Among the five cooling units 1510, the refrigerant discharge pipe 1560 of the upper wall member 1512 of the uppermost cooling unit 1510 e discharges the refrigerant in the sub flow path 1520 of the five cooling units 1510. It is.

The lower wall member 1514 of the cooling unit 1510 includes a lower refrigerant discharge pipe 1570 protruding from the lower surface of the main flow path 1530 on the sub flow path 1520 side and a lower refrigerant supply pipe 1576 protruding from the lower surface on the opposite side of the sub flow path 1520. Is provided. The lower refrigerant discharge pipe 1570 and the above-described upper refrigerant supply pipe 1575 face each other, and the lower refrigerant supply pipe 1576 and the upper refrigerant discharge pipe 1571 face each other. Further, the lower wall member 1514 is provided with a refrigerant supply pipe 1566 protruding from the lower surface of the sub flow path 1520. The refrigerant supply pipe 1566 and the above-described refrigerant discharge pipe 1560 are opposed to each other.
The lower refrigerant supply pipe 1576 of the cooling unit 1510a at the lowermost part is a main flow path refrigerant supply pipe 1578 for supplying refrigerant to the main flow paths 1530 of the five cooling units 1510. Further, the lower refrigerant discharge pipe 1570 of the cooling unit 1510a is a main flow path refrigerant discharge pipe 1572 for discharging the refrigerant of the main flow paths 1530 of the five cooling units 1510. Further, the refrigerant supply pipe 1566 of the cooling unit 1510a at the lowermost part is a sub-channel refrigerant supply pipe 1568 that supplies refrigerant to the sub-flow channels 1520 of the five cooling units 1510.
The cooling unit 1510 is easily manufactured by superposing and brazing the upper wall member 1512 and the lower wall member 1514 obtained by press molding of a plate material.

  In adjacent cooling units 1510 and 1510, main flow paths 1530 and 1530 are connected to each other, and sub flow paths 1520 and 1520 are connected to each other. The cooling units 1510a and 1510b will be described in detail. The main channels 1530 and 1530 are the main channels connected to the lower discharge pipe 1571 of the cooling unit 1510a positioned below and the lower supply pipe 1576 of the cooling unit 1510b positioned above. A main flow path second connecting portion 1573 is formed by connecting the one connecting portion 1574 to the upper supply pipe 1575 of the cooling unit 1510a positioned below and the lower discharge pipe 1570 of the cooling unit 1510b positioned above. In the auxiliary flow paths 1520 and 1520, the discharge pipe 1560 of the cooling unit 1510 a positioned below and the supply pipe 1566 of the cooling unit 1510 b positioned above form a sub flow path connecting portion 1564.

Next, the path of the refrigerant flowing through the cooler 1500 will be described.
The arrows shown in FIG. 37 indicate the path of the refrigerant flowing through the cooler 1500.
In the cooler 1500, a part of the refrigerant supplied from the refrigerant supply pipe 1578 for the main flow path is supplied into the main flow path 1530 of the cooling unit 1510a, and the remaining part flows through the first connection part 1574 for the main flow path to the main flow of the cooling unit 1510b. Supplied to the channel 1530. The refrigerant remaining in the cooling unit 1510 a cools the power module 100 disposed on the upper surface and is discharged from the main flow path refrigerant discharge pipe 1572.
A part of the refrigerant supplied from the sub-channel refrigerant supply pipe 1568 remains in the sub-channel 1520 of the cooling unit 1510a while the remaining part of the refrigerant is supplied into the sub-channel 1520 of the cooling unit 1510a. It is supplied to the auxiliary flow path 1520 of the cooling unit 1510b through the connection interval 1564. The refrigerant remaining in the cooling unit 1510a is supplied to the sub flow path 1530 of the cooling unit 1510a through the communication path 1540. Since the refrigerant flow from the sub-flow path 1520 into the main flow path 1530 is ensured, overheating of the refrigerant in the cooling unit 1510a is prevented.

A part of the coolant supplied from the cooling unit 1510a to the cooling unit 1510b through the main flow path first connection portion 1574 is supplied into the main flow path 1530 of the cooling unit 1510b, and the remaining portion is cooled through the first connection portion 1574 for main flow path. It is supplied to the unit 1510b. The refrigerant remaining in the cooling unit 1510b cools the power modules 100 and 100 arranged on both the upper surface and the lower surface, and is supplied from the lower cooling discharge pipe 1570 to the cooling unit 1510a through the second connecting portion 1573.
A part of the refrigerant supplied from the cooling unit 1510a to the sub-flow channel 1520 of the cooling unit 1510b through the sub-flow channel connecting portion 1564 stays in the sub-flow channel 1520 of the cooling unit 1510b, and the remaining portion is the sub-flow channel connecting portion. 1564 is supplied to the auxiliary flow path 1520 of the cooling unit 1510c. The refrigerant remaining in the cooling unit 1510b is supplied to the auxiliary flow path 1530 of the cooling unit 1510b through the communication path 1540. Since the refrigerant flow from the sub-flow path 1520 into the main flow path 1530 is ensured, overheating of the refrigerant in the cooling unit 1510b is also prevented.
Since the refrigerant of the cooling units 1510c and 1510d has the same flow path as the refrigerant of the cooling unit 1510b, description thereof is omitted.

The refrigerant supplied from the cooling unit 1510d to the cooling unit 1510e through the main flow path first connecting portion 1574 is supplied into the main flow path 1530 of the cooling unit 1510e. In the main flow portion 1530 of the cooling unit 1510e, the upper refrigerant discharge pipe 1571 and the upper refrigerant supply pipe 1575 are provided with plugs 1582. For this reason, the refrigerant supplied to the main flow portion 1530 of the cooling unit 1510 through the first connection portion 1574 cools the power module 100 disposed on the lower surface, and cools the cooling unit through the second connection portion 1573 from the lower cooling discharge pipe 1570. 1510d.
A part of the refrigerant supplied from the cooling unit 1510d to the sub-flow path 1520 of the cooling unit 1510e through the sub-flow path connecting portion 1564 is supplied to the main flow path 1530 of the cooling unit 1510e through the communication path 1540. The remaining portion is discharged from the auxiliary flow path discharge pipe 1562. The sub-channel refrigerant discharge pipe 1562 may be plugged, or the sub-channel refrigerant discharge pipe 1562 may be omitted and the sub-channel refrigerant discharged from the main channel refrigerant discharge pipe 1572 may be discharged.
In the present cooler 1500, overheating of all the refrigerants in the internal cooling unit 1510 is prevented. For this reason, the cooler 1500 is excellent in the ability to cool the power module 100 group.

Specific examples of the present invention have been described in detail above, but these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and changes of the specific examples illustrated above.
For example, in the above-described embodiment, examples in which the pair of sub flow paths sandwich the main flow path are listed, but if the power module is small, the sub flow path may be provided only on one side of the main flow path.
In the cooler, in a region not involved in cooling or refrigerant circulation, the thickness of the member may be reduced to reduce the material.
In the above embodiment, brazing is used for joining the members constituting the cooler, but it may be screwed through a sealing material.
Moreover, the kind of the refrigerant | coolant which flows through a cooler is not limited. For example, in addition to water, an organic refrigerant such as fluorocarbon may be used.
In addition, the technical elements described in the present specification or drawings exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the technology illustrated in the present specification or the drawings achieves a plurality of objects at the same time, and has technical utility by achieving one of the objects.

It is a partial top view of the cooler of the 1st example. It is a disassembled perspective view of the cooler of the 1st example. It is the III-III sectional view taken on the line of FIG. It is the IV-IV sectional view taken on the line of FIG. It is sectional drawing which shows the mode of the partition of the cooler of 2nd Example. It is sectional drawing which shows the mode of the communicating path of the cooler of 2nd Example. It is a partial top view of the cooler of the 3rd example. It is the VIII-VIII sectional view taken on the line of FIG. It is the IX-IX sectional view taken on the line of FIG. It is sectional drawing which shows the mode of the partition of the cooler of a modification. It is sectional drawing which shows the mode of the partition of the cooler of 4th Example. It is sectional drawing which shows the mode of the communicating path of the cooler of 4th Example. It is sectional drawing which shows the bubble of the upper wall member and main flow path of the cooler of 5th Example. It is sectional drawing which shows the relationship between the bubble of the main flow path of the cooler of 5th Example, and a communicating path. It is a partial top view of the cooler of a 6th example. It is the XVI-XVI sectional view taken on the line of FIG. It is the XVI-XVI sectional view taken on the line of FIG. It is sectional drawing which shows the partition of the cooler of 7th Example. It is sectional drawing which shows the communicating path of the cooler of 7th Example. It is sectional drawing which shows the bubble of the upper wall member and main flow path of the cooler of 8th Example. It is sectional drawing which shows the mode of the bubble of the main flow path of the cooler of 8th Example, and a communicating path. It is a fragmentary sectional view of the cooler of a 9th example. It is the XXIII-XXIII sectional view taken on the line of FIG. It is a fragmentary top view which shows the cooler of 10th Example. It is the XXV-XXV sectional view taken on the line of FIG. FIG. 25 is a sectional view taken along line XXVI-XXVI in FIG. 24. It is a top view which shows one of the structural plates of 10th Example. It is a top view which shows one of the structural plates of 10th Example. It is a top view which shows one of the structural plates of 10th Example. It is a top view which shows one of the structural plates of 10th Example. It is a top view which shows the cooler of 11th Example. FIG. 32 is a sectional view taken along line XXXII-XXXII in FIG. 31. It is a top view which shows the cooler of 12th Example. It is a top view which shows the cooler of 13th Example. It is sectional drawing which shows the structure of the cooler of 13th Example. It is a partial top view which shows the cooler of 14th Example. It is sectional drawing which shows the structure of the cooler of 15th Example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Cooler 12 Upper wall member 14 Lower wall member 15 Joint surface 20 Subflow path 30 Main flow path 40 Communication path 60 Subflow path refrigerant discharge pipe 76 Main flow path refrigerant discharge pipe 46, 48 Partition 100 Power module 248 Groove

Claims (10)

A cooler that is used by flowing a refrigerant while attached to a heating element,
At least a first member that forms an outer wall that separates the heating element and the flow path, and a second member that forms an outer wall that closes the opposite side of the flow path to the heating element,
And the main flow path and the side-stream path and the communication path is formed inside by overlapping member groups,
The main flow path has a width that is perpendicular to the flow direction of the refrigerant and is wider than the width of the heating element,
The sub-channel extends in a direction parallel to the flow direction in the width direction of the main channel in a state separated from the main channel by a partition that defines the width of the main channel,
The communication passage is in a part of the length direction of the main flow path, penetrates the partition wall in the width direction, and communicates the main flow path and the sub flow path .
The cooler , wherein the partition wall is formed of the first member and / or the second member . The first member is a flat plate,
The second member has a protrusion,
2. The cooler according to claim 1, wherein a partition wall is formed by closely contacting a tip of the protrusion of the second member to the first member, and a main channel, a sub channel, and a communication channel are formed therein. . The first member and the second member have the same shape,
2. The cooler according to claim 1, wherein one of the first member and the second member is brought into close contact with the other in an inverted posture to form a main channel, a sub channel, and a communication channel therein. The cooler according to any one of claims 1 to 3 , wherein the first member and / or the second member is press-molded. The cooler according to any one of claims 1 to 3 , wherein the member groups are brazed in a state of being overlapped. The cooler according to any one of claims 1 to 5 , wherein a groove is formed between a surface of the partition wall that separates the main channel and the sub channel from the surface that contacts the main channel and a surface that contacts the sub channel. The cooler according to claim 6 , wherein the groove penetrates the cooler. The cooler according to any one of claims 1 to 7 , wherein a thickness of a partition wall separating the main flow path and the sub flow path is larger than a thickness of an outer wall separating the heating element and the main flow path. The first member includes a recess for attaching a heating element, and the height of the wall defining the heating element side of the main flow path is lower than the height of the wall defining the heating element side of the communication path. To 8 cooler. The cooler according to any one of claims 1 to 9 , wherein a bubble guide plate that guides bubbles contained in the refrigerant that has entered the main flow path from the communication path toward the partition is formed.

Images