JP4265509B2 - Stacked cooler - Google Patents

Description

  The present invention relates to a stacked cooler for cooling a plurality of electronic components from both sides.

Conventionally, as shown in FIGS. 20 and 21, in order to radiate heat from a semiconductor module 91 containing a semiconductor element, a laminated cooling system in which a cooling pipe 92 is provided so as to sandwich the semiconductor module 91 from both sides. There is a container 9 (see Patent Document 1).
The stacked cooler 9 has a configuration in which the semiconductor modules 91 and the cooling pipes 92 are alternately stacked. The plurality of stacked cooling pipes 92 are communicated by a communication member 93 so that a cooling medium flows through each cooling pipe 92.

However, if a large difference in heat generation occurs between the semiconductor module 91 disposed on one surface of the cooling pipe 92 and the semiconductor module 91 disposed on the other surface, the semiconductor module 91 There is a risk of heat transfer to the other semiconductor module 91 via the cooling pipe 92. This may increase the temperature of the semiconductor module 91 that generates a small amount of heat.
Therefore, the cooling capacity of the stacked cooler may be insufficient.

JP 2002-26215 A

  The present invention has been made in view of such conventional problems, and an object of the present invention is to provide a stacked cooler having an excellent cooling capacity.

A first invention is a stacked type cooler for cooling a plurality of electronic components from both sides,
The stacked cooler has a plurality of flat cooling pipes provided with a refrigerant flow path for circulating a cooling medium, and a communication member that communicates the plurality of cooling pipes.
The plurality of cooling pipes are stacked so that the electronic components arranged alternately with the cooling pipes can be sandwiched from both sides, two outer cooling pipes arranged at both ends in the stacking direction, and these It consists of a plurality of inner cooling pipes arranged between
The inner cooling pipe includes at least a first coolant channel facing a first pipe wall having a first main surface that comes into contact with the electronic component, and a first coolant channel that contacts the electronic component on the opposite side of the first main surface. provided a second refrigerant flow path facing the second wall having a second major surface, Ri and the coolant channel name to form two or more stages in the thickness direction of the inner cooling tube,
The inner cooling pipe has inner fins for dividing the refrigerant flow path into a plurality of directions in a direction orthogonal to the thickness direction of the inner cooling pipe,
The inner cooling pipe includes a pair of outer shell plates constituting the first pipe wall and the second pipe wall, an intermediate plate disposed between the pair of outer shell plates, the intermediate plate, and the outer plate. A corrugated inner fin disposed between the shell plate and the intermediate plate and the outer shell plate, wherein the first coolant channel and the second coolant channel are respectively formed. And
The intermediate plate is composed of a core material and a brazing sheet in which a brazing material is disposed on both sides thereof, and the pair of outer shell plates join the inner side surfaces at the end portions to both surfaces at the end portions of the intermediate plate. The present invention is a stacked type cooler (claim 1).
A second invention is a stacked cooler for cooling a plurality of electronic components from both sides,
The stacked cooler has a plurality of flat cooling pipes provided with a refrigerant flow path for circulating a cooling medium, and a communication member that communicates the plurality of cooling pipes.
The plurality of cooling pipes are stacked so that the electronic components arranged alternately with the cooling pipes can be sandwiched from both sides, two outer cooling pipes arranged at both ends in the stacking direction, and these Consisting of multiple inner cooling pipes,
The inner cooling pipe includes at least a first coolant channel facing a first pipe wall having a first main surface that comes into contact with the electronic component, and a first coolant channel that contacts the electronic component on the opposite side of the first main surface. A second refrigerant channel facing the second pipe wall having two main surfaces, and the refrigerant channel is formed in two or more stages in the thickness direction of the inner cooling tube,
The inner cooling pipe has inner fins for dividing the refrigerant flow path into a plurality of directions in a direction orthogonal to the thickness direction of the inner cooling pipe,
The inner cooling pipe includes a pair of outer shell plates constituting the first pipe wall and the second pipe wall, an intermediate plate disposed between the pair of outer shell plates, the intermediate plate, and the outer plate. A corrugated inner fin disposed between the shell plate and the intermediate plate and the outer shell plate, wherein the first coolant channel and the second coolant channel are respectively formed. And
The intermediate plate is made of a material that is lower in potential than the core material of the outer shell plate, and the pair of outer shell plates are formed by joining the inner side surfaces of the end portions to each other. It exists in a lamination type cooler (Claim 2).

Next, the effects of the present invention will be described.
Two or more stages of the refrigerant flow paths are formed in the inner cooling pipe in the thickness direction of the inner cooling pipe, and the inner cooling pipe includes the first refrigerant flow path and the second refrigerant flow path. . Therefore, the electronic component placed in contact with the first main surface of the inner cooling pipe is cooled by the cooling medium flowing through the first refrigerant flow path, and the electronic component placed in contact with the second main face is moved into the second refrigerant flow path. It can cool with the cooling medium which distribute | circulates.

  Therefore, if the heat generation amount of the electronic component placed in contact with the first main surface (second main surface) is large, the cooling medium that receives the heat flows to the second main surface (first main surface) side. There is nothing. Thereby, heat can be prevented from reaching the second main surface (first main surface), and the temperature of the electronic component placed in contact with the second main surface (first main surface) can be prevented from increasing. be able to.

Further, when the cross-sectional area of the refrigerant flow path is constant, the heat transfer area between the cooling pipe and the cooling medium is increased as compared with the case of the single stage by providing the refrigerant flow path with two or more stages. be able to. Therefore, the cooling capacity of the stacked cooler can be improved.
Similarly, when there are two or more refrigerant channels, the equivalent diameter (diameter of a circle of the same area) of the cross section of each refrigerant channel can be reduced. Thereby, the heat transfer coefficient between the cooling pipe and the cooling medium is improved, and the cooling capacity of the stacked cooler is improved (see Reference Example 1 ).

  As described above, according to the present invention, it is possible to provide a stacked cooler having an excellent cooling capacity.

Oite the present invention, the electronic component may be, for example, a semiconductor module with a built-in semiconductor element and a diode such as IGBT. And this semiconductor module can be used for the inverter for motor vehicles, the motor drive inverter of industrial equipment, the air conditioner inverter for building air conditioning, etc.
In addition to the semiconductor module, for example, a power transistor, a power FET, or an IGBT can be used as the electronic component.

  Examples of the cooling medium include water mixed with ethylene glycol antifreeze, natural refrigerants such as water and ammonia, fluorocarbon refrigerants such as fluorinate, chlorofluorocarbon refrigerants such as HCFC123 and HFC134a, methanol, alcohol, and the like. Alcohol-based refrigerants such as acetone and ketone-based refrigerants such as acetone can be used.

Further, the two or more stages of the refrigerant flow paths provided in the inner cooling pipe are preferably separated from each other by an intermediate wall disposed between the first pipe wall and the second pipe wall ( Claim 3 ).
In this case, the above-described two or more refrigerant flow paths can be easily formed.

The inner cooling pipe has inner fins for dividing the refrigerant flow path into a plurality of sections in a direction orthogonal to the thickness direction of the inner cooling pipe .
In this case, the contact area between the inner cooling pipe and the cooling medium can be further improved by the presence of the inner fin.
Examples of the cooling pipe having such a configuration include a flat extruded tube as described later and a so-called drone cup structure tube.

The inner cooling pipe includes a pair of outer shell plates constituting the first pipe wall and the second pipe wall, an intermediate plate disposed between the pair of outer shell plates, and the intermediate plate; The inner fin having a wave shape arranged between the outer shell plate and the first refrigerant flow path and the second refrigerant flow path are formed between the intermediate plate and the outer shell plate, respectively. Has been .

In this case, after the outer shell plate, the intermediate plate, and the inner fin are separately press-molded, the inner cooling pipe having a so-called drone cup structure can be obtained by joining them. Therefore, the inner cooling pipe can be easily manufactured.
Moreover, it becomes easy to form the said inner fin in a desired part. Thereby, for example, the inner fin is not disposed at a connection portion of the inner cooling pipe with the communication member, and the connection portion can be easily processed.

Further, the inner fin is preferably at least the electronic component is formed on the entire region in contact with the cooling tube (claim 4).
In this case, a heat transfer area between the cooling pipe and the cooling medium can be ensured in a region where the electronic component is in contact with the cooling pipe. Thereby, the said electronic component can be cooled reliably.

Further, the inner fin is divided into two or more in the flow direction of the cooling medium, and a gap of 1 mm or more is preferably formed between the inner fins in the flow direction ( Claim 5 ).
In this case, when the cooling medium is circulated through the cooling pipe, the boundary layer of the cooling medium flow formed in the region where the inner fins are provided disappears once in the gap. Thereby, it can prevent that the said boundary layer is formed large. Therefore, the cooling capacity of the stacked cooler can be improved.
When the gap is less than 1 mm, the boundary layer cannot be sufficiently eliminated, and it may be difficult to sufficiently improve the cooling capacity of the stacked cooler.
In addition, it is preferable that the said clearance does not enter into the area | region where an electronic component contacts a cooling pipe. Thereby, a small stacked cooler can be easily obtained while ensuring a heat transfer area.

The outer shell plate preferably has a core made of a metal material and has a bare surface on the outer surface of which the metal material constituting the core material is exposed ( Claim 6 ).
In this case, the inner cooling pipe and the electronic component can be brought into contact with each other through the bare surface. Therefore, the plate surface (cooling tube surface) is not roughened by brazing. Therefore, the contact thermal resistance between the electronic component and the plate is reduced, and the cooling efficiency is improved.

  As the metal material constituting the core material, aluminum (including an aluminum alloy), copper (including a copper alloy), or the like can be used. Aluminum is most preferable from the viewpoints of performance, corrosion resistance, weight reduction, and other aspects.

Further, the shell plate is preferably made of a brazing sheet which arranged sacrificial anode material on the inner surface of the core material (claim 7).
In this case, it is possible to prevent the cooling medium from leaking due to opening of the inner cooling pipe due to corrosion. That is, by disposing the sacrificial anode material on the inner side surface of the core material of the outer shell plate, the sacrificial anode material can be selectively corroded and corrosion of the core material of the outer shell plate can be prevented. Thereby, corrosion does not advance in the thickness direction of the outer shell plate, and it is possible to prevent the inner cooling pipe from opening a hole.

  As the brazing material, a metal material having a melting point lower than that of the core material can be used. In particular, when the core material is made of aluminum, it is preferable to use aluminum having a lower melting point.

Further, the shell plate, it has a three-layer structure further arranged a brazing material on said sacrificial anode material arranged on the inner surface of the core material is preferred (claim 8). In this case, the brazing material can be easily joined to the corrugated inner fin, the sacrificial anode material is present on the inner surface of the core material after brazing, and the outer shell plate has holes. Opening can be suppressed.

Further, the shell plate is also preferably made of a brazing sheet arranged a brazing material on the inner surface of the core material (claim 9). When the core material is sufficiently protected against corrosion, an outer shell plate in which a brazing material is disposed without using the sacrificial anode material can be employed, thereby reducing the cost of the outer shell plate. be able to.

The inner fin is preferably made of a material that is lower in potential than the core material of the outer shell plate ( claim 10 ). In this case, it becomes easy to make the inner fins more easily corroded than the outer shell plate, and the progress of corrosion of the outer shell plate can be suppressed.
The “base metal than the core material” refers to a metal having a lower corrosion potential than the metal used as the core material. For example, when aluminum (Al) is used as the core material and the brazing material, a metal material in which zinc (Zn) is added to the core material used for the inner fin can be used.

Further, the inner fin is preferably made of a brazing sheet which arranged brazing material on both surfaces of the core material (claim 11). In this case, the outer plate and the inner fin or the intermediate plate and the inner fin can be easily joined using the brazing material disposed on the inner fin.

In the first aspect of the invention, the intermediate plate is composed of a core material and a brazing sheet in which a brazing material is disposed on both sides thereof, and the pair of outer shell plates has an inner surface at an end portion of the intermediate plate. Bonded to both sides at the end of the plate .
In this case, the intermediate plate and the pair of outer shell plates can be easily brazed and joined.

In the second aspect of the invention, the intermediate plate is made of a material that is lower in potential than the core material of the outer shell plate, and the pair of outer shell plates have the inner surfaces at the end portions of each other. Joined . In this case, for example, the intermediate plate and the inner fin can be joined by brazing with a brazing material disposed on the inner fin. Further, the intermediate plate can be preferentially corroded with respect to the outer shell plate, and corrosion of the outer shell plate can be prevented. Thereby, leakage of the cooling medium from the cooling pipe can be prevented. Further, since the brazing material is disposed on the joining surfaces of the pair of outer shell plates, the pair of outer shell plates can be easily brazed and joined, and the cooling pipe can be easily manufactured. .

Further, the inner fin is preferably divided into a plurality of segments in the length direction, and is constituted by an offset fin formed by arranging a large number of wavy segments while shifting the positions of the peaks in a staggered manner. ( Claim 12 ).
In this case, the heat exchange efficiency in the inner fin is higher, and a stacked cooler with better cooling performance can be obtained.

Further, the flow path width wf of adjacent said inner fin is smaller than the height hf of the inner fins (wf <hf) is preferable (claim 13). In this case, when the width of the cooling pipe is constant, the heat transfer area with the cooling medium can be increased as the height hf of the inner fin is made larger than the flow path width wf. Can be increased.

Further, the channel width wf of the inner fin is preferably 1.5 mm or less ( claim 14 ). The smaller the inner fin channel width wf, the larger the number of refrigerant channels, and the higher the heat transfer area with the cooling medium. When the inner fin channel width wf is 1.5 mm or less, the effect of improving the heat transfer area with the cooling medium is sufficiently exhibited, and a more excellent cooling effect can be obtained. Note that if the inner fin channel width wf becomes too narrow, in the unlikely event that foreign matter is mixed in the cooling medium, the foreign matter may be clogged and flowability may be hindered. For this reason, the inner fin channel width wf is preferably about 0.9 mm.

Further, the height hf of the inner fin is preferably in the range of 1 to 5 mm ( claim 15 ). As the height hf of the inner fin is increased, the heat transfer area with the cooling medium is improved. However, if the size is larger than 5 mm, there is a problem that the whole is excessively enlarged. On the other hand, when the thickness is less than 1 mm, problems such as an increase in resistance when circulating the cooling medium may occur.

The thickness tf of the inner fin is preferably the less than the first wall and the second wall thickness tp (claim 16). By maintaining this relationship, it is possible to prevent the adhesion between the first tube wall and the second tube wall and the electronic component from being lowered when the electronic component is brought into pressure contact with the outer shell plate. This is because the inner fins are thinner than the first tube wall and the second tube wall, so that the inner fins are easily deformed, the first tube wall and the second tube wall are easily adapted to the surface of the electronic component, and the contact thermal resistance is reduced. This reduces the cooling efficiency.

The thickness tf of the inner fin is preferably in the range of 0.03～1.0Mm (claim 17). When the thickness tf of the inner fin is 1.0 mm or less, it becomes easy to obtain a sufficient cooling capacity for cooling the electronic component. On the other hand, when the thickness is less than 0.03 mm, there arises a problem that the rigidity is too low due to the structure and a manufacturing problem that the production becomes difficult.

Moreover, it is preferable that thickness tp of the said 1st tube wall and the said 2nd tube wall exists in the range of 0.1-5.0 mm ( Claim 18 ). As the thickness tp of the first tube wall and the second tube wall is reduced, the heat transfer property is improved and the cooling effect is enhanced. And when thickness tp of the 1st tube wall and the 2nd tube wall is 5.0 mm or less, it becomes easy to obtain sufficient cooling capacity for cooling of the above-mentioned electronic parts. On the other hand, when the thickness is less than 0.1 mm, the structure is too low in rigidity, resulting in a problem that the adhesion with the electronic component is lowered.

Further, the communicating member comprises a stretchable bellows tube extending direction, it is preferably configured to be able to vary the distance of each cooling tube (claim 19).
In this case, the electronic component can be sandwiched between the cooling pipes easily and reliably.

The outer cooling pipe is formed by forming the refrigerant flow path in one stage in the thickness direction of the cooling pipe, and the refrigerant flow path formed in the outer cooling pipe and the refrigerant flow path formed in the inner cooling pipe are: it is preferred to have the same cross-sectional area from each other (claim 20).
In this case, the flow path resistance of the refrigerant flow path of the outer cooling pipe and the flow path resistance of the refrigerant flow path of the inner cooling pipe can be made substantially uniform. Therefore, the plurality of electronic components can be efficiently cooled.

Furthermore, the outer cooling tube, the thickness of the outer tube wall on the side not in contact placing the electronic component is preferably greater than the thickness of other tube wall (claim 21).
In this case, the strength of the outer tube wall of the outer cooling tube can be ensured and pitting corrosion can be prevented more reliably.
That is, due to the structure of the stacked cooler, the pressure of the introduced cooling medium is greatly applied to the outer tube wall of the outer cooling tube. Therefore, by increasing the thickness of the outer tube wall and improving the strength, deformation due to the pressure of the cooling medium can be prevented. Further, when a brazing material is disposed on the inner surface of the outer tube wall, it is difficult to dispose a sacrificial anode material. Therefore, by increasing the thickness of the outer tube wall, pitting corrosion (opening of holes due to corrosion) is prevented without disposing the sacrificial anode material.

Further, the outer tube wall preferably has a thickness of at least 1 mm (claim 22).
In this case, the strength of the outer tube wall can be sufficiently secured to prevent pitting corrosion more reliably, and a lightweight stacked cooler can be obtained.
When the thickness of the outer tube wall is less than 1 mm, it may be difficult to ensure the strength and pitting corrosion resistance of the outer tube wall. On the other hand, when the thickness exceeds 2 mm, it may be difficult to obtain a lightweight stacked cooler. Therefore, the thickness of the outer tube wall is preferably 2 mm or less.

( Reference Example 1 )
A stacked cooler according to a reference example of the present invention will be described with reference to FIGS.
As shown in FIGS. 1 and 2, the stacked cooler 1 cools a plurality of electronic components 6 from both sides.
The stacked cooler 1 includes a plurality of flat cooling pipes 2 provided with a refrigerant flow path 21 through which a cooling medium 5 flows, and a communication member 3 that communicates the plurality of cooling pipes 2. The plurality of cooling pipes 2 are arranged in a stacked manner so that the electronic component 6 can be sandwiched from both sides.
The cooling pipe 2 includes two outer cooling pipes 2b arranged at both ends in the stacking direction and a plurality of inner cooling pipes 2a arranged therebetween.

In the inner cooling pipe 2a, as shown in FIG. 3, the refrigerant flow path 21 is formed in two stages in the thickness direction of the inner cooling pipe 2a.
That is, the inner cooling pipe 2a includes a first refrigerant flow path 211 facing the first pipe wall 231 constituting the first main surface 221 of the inner cooling pipe 2a, and a second on the opposite side of the first main surface 221. And a second coolant channel 212 facing the second tube wall 232 constituting the main surface 222.
The two-stage refrigerant flow path 21, that is, the first refrigerant flow path 211 and the second refrigerant flow path 212 are separated from each other by the intermediate wall 24.

In addition, a plurality of the first refrigerant flow paths 211 and the second refrigerant flow paths 212 are respectively formed and arranged in a line in the width direction of the cooling pipe 2. Specifically, a large number of inner fins 29 are provided, and the refrigerant flow paths 211 and 212 are partitioned into a plurality in the direction orthogonal to the thickness direction of the cooling pipe 2.
As shown in FIG. 2, the outer cooling pipe 2 b is formed by forming the refrigerant flow path 21 in one stage in the thickness direction of the cooling pipe 2. The one-stage refrigerant flow path 21 formed in the outer cooling pipe 2b and the one-stage refrigerant flow path 21 formed in the inner cooling pipe 2a have the same cross-sectional area.

The communication member 3 is composed of a bellows tube that can be expanded and contracted in the communication direction, and is configured so that the interval between the cooling tubes 2 can be changed.
As shown in FIG. 1, the communication member 3 is connected to two end portions 25 in the length direction of the cooling pipe 2 and communicates the plurality of cooling pipes 2. That is, the cooling pipe 2 is formed with openings on the first main surface 221 and the second main surface 222 at the end portion 25, and the communication member 3 is connected to the opening. In addition, a refrigerant inlet 41 for introducing the cooling medium 5 into the stacked cooler 1 and the cooling medium 5 are discharged from the stacked cooler 1 at the two end portions 25 of the one outer cooling pipe 2b. And a refrigerant discharge port 42 for connecting to each other.

The cooling pipe 2 and the communication member 3 are joined by brazing.
The cooling pipe 2 is made of an extruded product of aluminum, and both end surfaces in the length direction are closed by side sealing members 26. The side sealing material 26, the refrigerant inlet 41 and the refrigerant outlet 42 are also joined to the cooling pipe 2 by brazing.
The side sealing material 26, the refrigerant inlet 41, the refrigerant outlet 42, and the communication member 3 are also made of aluminum.

The cooling medium 5 introduced from the refrigerant introduction port 41 flows into the respective cooling pipes 2 from one end portion 25 through the communication member 3, and passes through the respective refrigerant flow paths 21 toward the other end portion 25. Flowing. Then, the cooling medium 5 is discharged from the refrigerant discharge port 42 through the communication member 3 connected to the end portion 25.
Thus, while the cooling medium 5 flows through the refrigerant flow path 21, heat exchange is performed with the electronic component 6 to cool the electronic component 6.

The electronic component 6 is a semiconductor module including a semiconductor element such as an IGBT and a diode. And this semiconductor module comprises a part of inverter for motor vehicles.
As the cooling medium 5, water mixed with an ethylene glycol antifreeze is used.
Further, the electronic component 6 can be arranged in a state of being in direct contact with the cooling pipe 2. However, in some cases, an insulating plate such as ceramic, thermally conductive grease, or the like may be interposed between the electronic component 6 and the cooling pipe 2.

Next, the function and effect of this example will be described.
In the inner cooling pipe 2a, the refrigerant flow path 21 is formed in two stages in the thickness direction of the inner cooling pipe 2a. The inner cooling pipe 2a includes the first refrigerant flow path 211 and the second refrigerant flow path 212. And have. Therefore, the electronic component 6 arranged in contact with the first main surface 221 of the inner cooling pipe 2a is cooled by the cooling medium 5 flowing through the first refrigerant flow path 211 and arranged in contact with the second main surface 222. Can be cooled by the cooling medium 5 flowing through the second refrigerant channel 212.

  Therefore, if the heat generation amount of the electronic component 6 arranged in contact with the first main surface 221 (second main surface 222) is large, the cooling medium 5 receiving the heat is transferred to the second main surface 222 (first main surface 222). It does not flow to the surface 221) side. Thereby, heat can be prevented from reaching the second main surface 222 (first main surface 221), and the temperature of the electronic component 6 arranged in contact with the second main surface 222 (first main surface 221) can be reduced. It can be prevented from rising.

In addition, when the cross-sectional area of the refrigerant flow path 21 is constant, the heat transfer area between the cooling pipe 2 and the cooling medium 5 is made by making the refrigerant flow path 21 two stages as compared with the case of one stage. Can be increased. Therefore, the cooling capacity of the stacked cooler 1 can be improved.
Similarly, when the refrigerant flow path 21 has two or more stages, the equivalent diameter (diameter of a circle having the same area) of the cross section of each refrigerant flow path 21 can be reduced. Thereby, the heat transfer coefficient between the cooling pipe 2 and the cooling medium 5 is improved, and the cooling capacity of the stacked cooler 1 is improved.

The heat transfer coefficient (α) can be expressed by the following equation (1) using the equivalent diameter (d), Nusselt number (Nu), and thermal conductivity (λ).
α = Nu · λ / d (1)
Therefore, the heat transfer coefficient α can be improved by reducing the equivalent diameter d.

In this example, the equivalent diameter d is calculated as follows. That is, the cross-section of the refrigerant flow path 21 is rectangular, and the equivalent diameter d is calculated by the following equation (2), where H is the long side length and W is the short side length.
d = 4W · H / (2H + 2W) (2)

Further, the refrigerant flow paths 21 provided in the inner cooling pipe 2 a are partitioned from each other by an intermediate wall 24. Thereby, the two-stage refrigerant flow path 21 can be easily formed.
Moreover, the said communication member 3 consists of a bellows tube, and is comprised so that the space | interval of each cooling pipe 2 can be changed. Therefore, the electronic component 6 can be sandwiched between the cooling pipes 2 easily and reliably.

  Further, as shown in FIG. 2, the outer cooling pipe 2b is formed by forming the refrigerant flow path 21 in one stage in the thickness direction, and the one-stage refrigerant flow path 21 formed in the outer cooling pipe 2b and the inner cooling. The one-stage refrigerant flow path 21 formed in the pipe 2a has the same cross-sectional area. Thereby, the flow path resistance of the refrigerant flow path 21 of the outer cooling pipe 2b and the flow path resistance of the refrigerant flow path 21 of the inner cooling pipe 2a can be made substantially uniform. Therefore, the plurality of electronic components 6 can be efficiently cooled.

  As described above, according to this example, it is possible to provide a stacked type cooler having an excellent cooling capacity.

( Reference Example 2 )
As shown in FIG. 4, this example is an example of a stacked cooler 1 in which a plurality of flat extruded tubes 27 each having a refrigerant flow path 21 are stacked and joined to form an inner cooling pipe 2 a.
In this example, the extruded tube 27 has a one-stage refrigerant passage 21 formed in the thickness direction. And the intermediate wall 24 is comprised by the pipe wall piled up mutually.
Others are the same as in Reference Example 1 .

In this case, a large number of extruded tubes 27 having the same shape are formed, and when used as the inner cooling tube 2a, a plurality of the extruded tubes 27 can be stacked and joined.
The outer cooling pipe 2b can also be constituted by the extruded tube 27. In this case, the extruded tube 27 is used alone without being overlapped.
In this way, both the inner cooling pipe 2a and the outer cooling pipe 2b can be constituted by one type of extruded tube 27. Therefore, the manufacturing cost of the stacked cooler 1 can be reduced.
In addition, the same effects as those of Reference Example 1 are obtained.

( Example 1 )
In this example, as shown in FIGS. 5 to 8, the inner cooling pipe 2 a is a so-called drone cup structure.
That is, as shown in FIG. 6, the inner cooling pipe 2 a is disposed between a pair of outer shell plates 201 constituting the first pipe wall 231 and the second pipe wall 232 and the pair of outer shell plates 201. An intermediate plate 202 constituting the intermediate wall 24; and a corrugated inner fin 203 disposed between the intermediate plate 202 and the outer shell plate 201.

A first coolant channel 211 and a second coolant channel 212 are formed between the intermediate plate 202 and the outer shell plate 201, respectively.
As shown in FIGS. 5 and 7, the inner fin 203 is formed in a region that includes the entire region where the electronic component 6 contacts the cooling pipe 2 and is larger than that.

Two inner fins 203 are arranged in the flow direction of the cooling medium 5, and a gap δ of 1 mm or more is formed between the inner fins 203.
As shown in FIG. 8, the outer shell plate 201 is composed of a brazing sheet having a sacrificial anode material 204 disposed on the inner surface, and the intermediate plate 202 is composed of a brazing sheet having brazing material 205 disposed on both sides.

  As shown in FIG. 5, the outer cooling pipe 2b includes an inner pipe wall 233 on the side where the electronic component 6 is placed in contact, an outer pipe wall 234 on the opposite side, and an inner fin disposed between the two. 203. The inner tube wall 233 is made of a brazing sheet having the sacrificial anode material 204 disposed on the inner surface thereof, and the outer tube wall 234 is made of a brazing sheet having the brazing material 205 disposed on the inner surface thereof.

In addition, the thickness of the outer tube wall 234 in the outer cooling tube 2b is larger than the thickness of the other tube walls and has a thickness of 1 mm. The other tube walls, that is, the inner tube wall 233, the first tube wall 231, the second tube wall 232, and the intermediate wall 24 each have a thickness of 0.4 mm.
The inner fin 203 has a thickness of 0.2 mm.
The communicating member 3 has a tube wall thickness of 0.3 mm, and a sacrificial anode material is disposed on the inner surface and a brazing material is disposed on the outer surface. Moreover, the tube wall thickness of the refrigerant | coolant inlet 41 and the refrigerant | coolant discharge port 42 is 1 mm, and arrange | positions sacrificial anode material on the inner surface.
Others are the same as in Reference Example 1 .

In the case of this example, after the outer shell plate 201, the intermediate plate 202, and the inner fin 203 are separately press-molded or the like, the inner cooling pipe 2a having a so-called drone cup structure can be obtained by joining them. . Therefore, the inner cooling pipe 2a can be easily manufactured.
Further, it becomes easy to form the inner fin 203 at a desired portion. As a result, it is possible to easily process the opening as the connecting portion without providing the inner fin 203 at the connecting portion of the inner cooling pipe 2a with the communicating member 3.

  The inner fin 203 is formed in a region that includes the entire region where the electronic component 6 contacts the cooling pipe 2 and is larger than that. Therefore, a heat transfer area between the cooling pipe 2 and the cooling medium 5 can be ensured in a region where the electronic component 6 is in contact with the cooling pipe 2. Thereby, the said electronic component 6 can be cooled reliably.

  As shown in FIG. 7, a gap δ of 1 mm or more is formed between the two inner fins 203 arranged in the flow direction of the cooling medium 5. Therefore, when the cooling medium 5 is circulated through the cooling pipe 2, the boundary layer of the flow of the cooling medium 5 formed in the region where the inner fins 203 are provided once disappears in the gap δ. Thereby, it can prevent that the said boundary layer is formed large. Therefore, the cooling capacity of the stacked cooler 1 can be improved.

The outer shell plate 201 is made of a brazing sheet having a sacrificial anode material 204 disposed on the inner surface, and the intermediate plate 202 is made of a brazing sheet having brazing material 205 disposed on both sides.
Therefore, it is possible to prevent the cooling medium 5 from leaking due to the opening of the inner cooling pipe 2a due to corrosion. That is, by disposing the sacrificial anode material 204 on the inner surface of the outer shell plate 201, the sacrificial anode material 204 can be selectively corroded and the core material of the outer shell plate 201 can be prevented from corroding. Thereby, corrosion does not advance in the thickness direction of the outer shell plate 201, and it is possible to prevent the inner cooling pipe 2a from opening a hole.
Further, by forming the intermediate plate 202 with a brazing sheet in which the brazing material 205 is disposed on both sides, the intermediate plate 202 and the pair of outer shell plates 201 can be easily brazed and joined.

  The one-stage refrigerant flow path 21 formed in the outer cooling pipe 2b and the one-stage refrigerant flow path 21 formed in the inner cooling pipe 2a have the same cross-sectional area. Therefore, the flow path resistance of the refrigerant flow path 21 of the outer cooling pipe 2b and the flow path resistance of the refrigerant flow path 21 of the inner cooling pipe 2a can be made substantially uniform. Therefore, the plurality of electronic components 6 can be efficiently cooled.

  Moreover, the thickness of the outer tube wall 234 of the outer cooling tube 2b is larger than the thickness of other tube walls. Therefore, it is possible to secure the strength of the outer tube wall 234 and more reliably prevent pitting corrosion. That is, due to the structure of the stacked cooler 1, the pressure of the introduced cooling medium 5 is greatly applied to the outer tube wall 234 of the outer cooling tube 2b. Therefore, by increasing the thickness of the outer tube wall 234 to improve the strength, deformation of the cooling medium 5 due to the pressure can be prevented. Further, the outer tube wall 234 is not provided with the sacrificial anode material 204 as described above. Therefore, by increasing the thickness of the outer tube wall 234, pitting corrosion (opening of holes due to corrosion) is prevented.

Further, since the thickness of the outer tube wall 234 is 1 mm, the strength of the outer tube wall 234 can be sufficiently ensured to prevent pitting corrosion more reliably, and the lightweight laminated cooler 1 can be obtained. Can do.
In addition, the same effects as those of Reference Example 1 are obtained.

( Example 2 )
In this example, as shown in FIG. 9, the inner fin 203 of the cooling pipe 2 is configured by offset fins in which a large number of wave-shaped segments 208 are arranged while shifting the positions of the peak portions 209 in a staggered manner. .
That is, as shown in FIG. 9, a large number of segments 208 formed in substantially the same wave shape are alternately arranged in the length direction of the cooling pipe 2 while being shifted by a quarter wavelength of the wave shape. By doing so, the inner fin 203 is configured.
Others are the same as in the first embodiment .

In this case, the heat exchange efficiency in the inner fins 203 becomes higher, and the stacked cooler 1 with better cooling performance can be obtained.
In addition, the same effects as those of the first embodiment are obtained .

  In the above-described embodiment, the example in which the refrigerant flow path 21 in the inner cooling pipe 2a is formed in two stages in the thickness direction of the cooling pipe 2 has been described, but the refrigerant flow path may be three or more stages.

( Reference Example 3 )
In this example, as shown in FIG. 10, the dimensional relationship of the inner cooling pipe 2a shown in Reference Example 2 (FIG. 4) is described in more detail.
As shown in the figure, the inner cooling pipe 2a of this example is divided into a flat outer portion 230 including the first pipe wall 231 or the second pipe wall 232 and a plurality of the refrigerant flow paths 211 and 212 therein. A plurality of flat extruded tubes 27 integrally provided with the inner fins 29 to be joined are overlapped and joined.
Further, the electronic component 6 to be cooled was assumed to have a heat generation amount of 400 W / piece.

As shown in the figure, the dimensional relationship of each part is as follows.
First, the channel width wf of two adjacent inner fins 29 is smaller than the height hf of the inner fins 29.
Further, the channel width wf of the inner fin 29 is 1.5 mm or less.
The height hf of the inner fin 29 is in the range of 1 to 5 mm.
Further, the thickness tf of the inner fin 29 is smaller than the thickness tp of the first tube wall 231 and the second tube wall 232.
Further, the thickness tf of the inner fin 29 is in the range of 0.03 to 1.0 mm.
Moreover, the thickness tp of the 1st tube wall 231 and the 2nd tube wall 232 exists in the range of 0.1-5.0 mm.
Furthermore, in this example, the width wp of the flat portion of the first tube wall 231 and the second tube wall 232 is larger than the width we of the electronic component 6.

More specifically, the inner fin 29 has a channel width wf = 0.9 mm, a height hf = 1.8 mm, a thickness tf = 0.2 mm, and a thickness tp of the first tube wall 231 and the second tube wall 232 = Set to 0.4 mm.
Thus, since the inner side cooling pipe 2a of this example satisfies all the dimensional relationships as described above, the same operational effects as those of Reference Examples 1 and 2 can be more reliably exhibited.

( Example 3 )
In this example, as shown in FIG. 11, the dimensional relationship of the inner cooling pipe 2a shown in Example 1 (FIG. 6) is described in more detail.
As shown in the figure, the inner cooling pipe 2a of this example is an example having a drone cup structure.
That is, as shown in FIG. 6, the inner cooling pipe 2 a is disposed between a pair of outer shell plates 201 constituting the first pipe wall 231 and the second pipe wall 232 and the pair of outer shell plates 201. An intermediate plate 202 constituting the intermediate wall 24; and a corrugated inner fin 203 disposed between the intermediate plate 202 and the outer shell plate 201.

And as shown in the same figure, the dimensional relationship of each part is as follows.
First, the channel width wf of two adjacent inner fins 203 is smaller than the height hf of the inner fins 203. Here, the flow path width wf of the inner fin 203 in this example is the width dimension of the central portion in the height direction that is just an average value, as shown in FIG.
Moreover, the channel width wf of the inner fin 203 is 1.5 mm or less.
The height hf of the inner fin 203 is in the range of 1 to 5 mm.
The thickness tf of the inner fin 203 is smaller than the thickness tp of the first tube wall 231 and the second tube wall 232.
The thickness tf of the inner fin 203 is in the range of 0.03 to 1.0 mm.
Moreover, the thickness tp of the 1st tube wall 231 and the 2nd tube wall 232 exists in the range of 0.1-5.0 mm.
Furthermore, in this example, the width wp of the flat portion of the first tube wall 231 and the second tube wall 232 is larger than the width we of the electronic component 6.

More specifically, as in the case of the reference example 3 , the flow path width wf of the inner fin 203 is 0.9 mm, the height hf is 1.8 mm, the thickness tf is 0.2 mm, the first tube wall 231 and The thickness tp of the second tube wall 232 was set to 0.4 mm.
Thus, since the inner side cooling pipe 2a of this example satisfy | fills all the above dimensional relationships, the effect similar to Example 1 , 2 can be exhibited more reliably.

( Example 4 )
In this example, the inner cooling pipe 2a having the drone cup structure shown in the third embodiment is used, and the relationship between the above-described dimensions and the cooling capacity is examined.
First, the height hf of the inner fin 203 is fixed to 1.8 mm, the thickness tf is set to 0.2 mm, and the thickness tp of the first tube wall 231 and the second tube wall 232 is fixed to 0.4 mm. The specifications of the cooling capacity were examined by varying the values. The cooling capacity was calculated by calculating the surface temperature Tw of the first tube wall 231 of the inner cooling pipe 2a in contact with the electronic component 6, and determining that the cooling capacity was higher as the temperature Tw was lower. In addition, the electronic component 6 employs a heat generation amount of 400 W / piece, and the other configuration is the same as that of the first embodiment .
Further, the surface temperature Tw was set to 110 ° C. or less as a temporary guide based on past experience.

The specification review results are shown in FIG. In the drawing, the horizontal axis represents the flow width wf (mm) of the inner fin, and the vertical axis represents the surface temperature Tw (° C.) of the inner cooling pipe.
As can be seen from the figure, by setting the flow width wf of the inner fin to at least 1.5 mm or less, the target cooling capacity could be exhibited.

  Next, the channel width wf = 0.9 mm, the thickness tf = 0.2 mm, and the thickness tp = 0.4 mm of the first tube wall 231 and the second tube wall 232 are fixed, and the height hf of the inner fin 203 is set. The specifications of the cooling capacity were examined. Others were the same as above.

The specification review results are shown in FIG. In the figure, the horizontal axis represents the height hf (mm) of the inner fin, and the vertical axis represents the surface temperature Tw (° C.) of the inner cooling pipe.
As can be seen from the figure, the inner fin height hf was at least 5 mm or less, which was the specification examination range, and the cooling capacity did not adversely affect any of them. In addition, in the case of less than 1 mm, there is a possibility that a foreign matter, that is, a manufacturing problem may occur.

  Next, the channel width wf = 0.9 mm, the height hf = 1.8 mm, the thickness tp = 0.4 mm of the first tube wall 231 and the second tube wall 232 are fixed, and the thickness of the inner fin 203 is fixed. The specification of the cooling capacity was examined by varying tf. Others were the same as above.

The specification review results are shown in FIG. In the drawing, the horizontal axis represents the thickness tf (mm) of the inner fin, and the vertical axis represents the surface temperature Tw (° C.) of the inner cooling pipe.
As can be seen from the figure, the inner fin thickness tf is at least 1 mm, which is the specification study range, and the cooling capacity is sufficient. However, it can be seen that the cooling capacity improves as the thickness decreases. However, since it is difficult to make the thickness of the inner fin less than 0.03 mm due to structural and manufacturing problems, it is understood that at least a range of 0.03 to 1 mm is preferable.

  Next, the channel width wf = 0.9 mm, the height hf = 1.8 mm, and the thickness tf = 0.2 mm of the inner fin 203 are fixed, and the thicknesses of the first tube wall 231 and the second tube wall 232 (plate thickness) ) The specification of the cooling capacity was examined by changing tp. Others were the same as above.

The specification review results are shown in FIG. In the figure, the horizontal axis represents the thickness (plate thickness) tp (mm) of the first tube wall and the second tube wall, and the vertical axis represents the surface temperature Tw (° C.) of the inner cooling tube.
As can be seen from the figure, the plate thickness tp has a sufficient cooling capacity at least 5 mm or less, which is the specification examination range, but it can be seen that the cooling capacity is improved as the thickness is reduced. However, it is difficult to make it less than 0.1 mm due to problems such as adhesion to electronic components, and it is understood that at least a range of 0.1 to 5 mm is preferable.

( Example 5 )
In this example, as shown in FIGS. 16 to 19, a modified example of the configuration of the inner cooling pipe 2 a having the drone cup structure shown in the first embodiment is shown.
In the inner cooling pipe 2 a of the type shown in FIG. 16, the pair of outer shell plates 201 is made of an aluminum bare material and has a bare surface 281. In the pair of outer shell plates, the inner side surfaces at the end portions are joined to both surfaces at the end portions of the intermediate plate. The intermediate plate 202 is made of a brazing sheet in which a brazing material 205 is disposed on both surfaces of a core material made of aluminum not containing Zn. The inner fin 203 is a brazing sheet in which a Zn-containing aluminum material is used for the core material and the brazing material 205 is disposed on both surfaces thereof.

  In this case, first, since the surface of the outer shell plate 201 is the bare surface 281, the plate surface (cooling tube surface) is not roughened by brazing, and the contact state with the electronic component can be improved. it can. Further, since the Zn-containing aluminum material is adopted as the core material of the inner fin 203, the inner fin 203 is preferentially corroded with a lower potential than the outer shell plate 201, and the outer shell plate 201 is not perforated. Can be suppressed.

  The inner cooling pipe 2a of the type shown in FIG. 17 has a pair of outer shell plates 201 made of a core material having an aluminum bare surface 281 on the outer surface, and a sacrificial anode material 204 arranged on the inner surface. Become. The configuration of the intermediate plate 202 and the inner fin 203 is the same as the type shown in FIG.

  In this case, the corrosion resistance of the outer shell plate 201 can be further improved as compared with the type shown in FIG. That is, the sacrificial anode material 204 disposed on the inner surface of the outer shell plate 201 is selectively corroded, and corrosion of the core material of the outer shell plate 201 can be suppressed.

The inner cooling pipe 2a of the type shown in FIG. 18 has a pair of outer shell plates 201 made of a core material having an aluminum bare surface 281 on its outer surface, and a brazing material 205 arranged on its inner surface. . The pair of outer shell plates are formed by joining the inner side surfaces at the ends. The intermediate plate 202 uses a Zn-containing aluminum material as a core material. The structure of the inner fin 203 is the same as the type shown in FIGS.
In addition, the outer shell plate 201 has been a pair of upper and lower parts so far. However, since the intermediate plate 202 is not sandwiched, the upper and lower plates can be processed integrally, bent at one end, and joined to the inner surfaces of the remaining ends. it can.

In this case, since it is not necessary to join the intermediate plate 202 between the outer shell plates 201, it is easy to manufacture and the joining structure of the outer shell plate 201 can be simplified. Reliability can also be improved.
Further, by integrating the outer shell plate 201 vertically, the number of parts to be handled can be reduced, and the cost can be reduced. Furthermore, since one end is bent, the joining length of the remaining end portion is shortened, so that the reliability of the joining portion by brazing can be improved.

  The inner cooling pipe 2a of the type shown in FIG. 19 has a pair of outer shell plates 201 made of a core material having an aluminum bare surface 281 on its outer surface, and a sacrificial anode material 204 and a brazing material on its inner surface. 205. Others are the same as the type shown in FIG.

  In this case, in addition to the above effects, the sacrificial anode material 204 disposed on the inner surface of the outer shell plate 201 is selectively corroded after the intermediate plate 202 and the inner fin 203 are corroded. Further, it is possible to further suppress the vacancy of the outer shell plate 201.

The top view of the laminated cooler in the reference example 1. FIG. FIG. 2 is a cross-sectional view taken along line AA in FIG. 1. The cross-sectional perspective view of the inner side cooling pipe in the reference example 1. FIG. The cross-sectional perspective view of the inner side cooling pipe in the reference example 2. FIG. FIG. 3 is a plan view of the stacked cooler in the first embodiment . FIG. 3 is a cross-sectional perspective view of the inner cooling pipe in the first embodiment . FIG. 6 is a sectional view taken along line B-B in FIG. 5. Sectional explanatory drawing of the outer shell plate in Example 1. FIG. Sectional drawing of the inner side cooling pipe in Example 2. FIG. Sectional drawing of an inner side cooling pipe in the reference example 3. FIG. Sectional drawing of an inner side cooling pipe in Example 3. FIG. Explanatory drawing which shows the relationship between the inner fin channel width wf and surface temperature Tw in Example 4. FIG. Explanatory drawing which shows the relationship between the inner fin height hf and the surface temperature Tw in Example 4. FIG. Explanatory drawing which shows the relationship between inner fin thickness tf and surface temperature Tw in Example 4. FIG. Explanatory drawing which shows the relationship between plate board thickness tp and surface temperature Tw in Example 4. FIG. Sectional drawing of an inner side cooling pipe in Example 5. FIG. Sectional drawing of an inner side cooling pipe in Example 5. FIG. Sectional drawing of an inner side cooling pipe in Example 5. FIG. Sectional drawing of an inner side cooling pipe in Example 5. FIG. The horizontal sectional view of a lamination type cooler in a conventional example. The CC sectional view taken on the line of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Stack type cooler 2 Cooling pipe 2a Inner cooling pipe 2b Outer cooling pipe 21 Refrigerant flow path 211 1st refrigerant flow path 212 2nd refrigerant flow path 221 1st main surface 222 2nd main surface 231 1st pipe wall 232 2nd Tube wall 24 Intermediate wall 3 Communication member 5 Cooling medium 6 Electronic component

Claims (22)

A stacked cooler for cooling a plurality of electronic components from both sides,
The stacked cooler has a plurality of flat cooling pipes provided with a refrigerant flow path for circulating a cooling medium, and a communication member that communicates the plurality of cooling pipes.
The plurality of cooling pipes are stacked so that the electronic components arranged alternately with the cooling pipes can be sandwiched from both sides, two outer cooling pipes arranged at both ends in the stacking direction, and these It consists of a plurality of inner cooling pipes arranged between
The inner cooling pipe includes at least a first coolant channel facing a first pipe wall having a first main surface that comes into contact with the electronic component, and a first coolant channel that contacts the electronic component on the opposite side of the first main surface. provided a second refrigerant flow path facing the second wall having a second major surface, Ri and the coolant channel name to form two or more stages in the thickness direction of the inner cooling tube,
The inner cooling pipe has inner fins for dividing the refrigerant flow path into a plurality of directions in a direction orthogonal to the thickness direction of the inner cooling pipe,
The inner cooling pipe includes a pair of outer shell plates constituting the first pipe wall and the second pipe wall, an intermediate plate disposed between the pair of outer shell plates, the intermediate plate, and the outer plate. A corrugated inner fin disposed between the shell plate and the intermediate plate and the outer shell plate, wherein the first coolant channel and the second coolant channel are respectively formed. And
The intermediate plate is composed of a core material and a brazing sheet in which a brazing material is disposed on both sides thereof, and the pair of outer shell plates join the inner side surfaces at the end portions to both surfaces at the end portions of the intermediate plate. laminated cooler characterized by comprising Te.   A stacked cooler for cooling a plurality of electronic components from both sides,
  The stacked cooler has a plurality of flat cooling pipes provided with a refrigerant flow path for circulating a cooling medium, and a communication member that communicates the plurality of cooling pipes.
  The plurality of cooling pipes are stacked so that the electronic components arranged alternately with the cooling pipes can be sandwiched from both sides, two outer cooling pipes arranged at both ends in the stacking direction, and these It consists of a plurality of inner cooling pipes arranged between
  The inner cooling pipe includes at least a first coolant channel facing a first pipe wall having a first main surface that comes into contact with the electronic component, and a first coolant channel that contacts the electronic component on the opposite side of the first main surface. A second refrigerant channel facing the second pipe wall having two main surfaces, and the refrigerant channel is formed in two or more stages in the thickness direction of the inner cooling tube,
  The inner cooling pipe has inner fins for dividing the refrigerant flow path into a plurality of directions in a direction orthogonal to the thickness direction of the inner cooling pipe,
  The inner cooling pipe includes a pair of outer shell plates constituting the first pipe wall and the second pipe wall, an intermediate plate disposed between the pair of outer shell plates, the intermediate plate, and the outer plate. A corrugated inner fin disposed between the shell plate and the intermediate plate and the outer shell plate, wherein the first coolant channel and the second coolant channel are respectively formed. And
  The intermediate plate is made of a material that is lower in potential than the core material of the outer shell plate, and the pair of outer shell plates are formed by joining the inner side surfaces of the end portions to each other. Stacked cooler.   3. The refrigerant flow path of two or more stages provided in the inner cooling pipe is partitioned from each other by an intermediate wall disposed between the first pipe wall and the second pipe wall. A laminated cooler characterized by comprising:   4. The stacked cooler according to claim 1, wherein the inner fin is formed at least in an entire region where the electronic component is in contact with the cooling pipe. 5.   5. The inner fin according to any one of claims 1 to 4, wherein the inner fin is divided into two or more pieces in the flow direction of the cooling medium, and the inner fin has a distance of 1 mm or more in the flow direction. A stacked type cooler characterized in that a gap is formed.   The outer shell plate according to any one of claims 1 to 5, wherein the outer shell plate has a core made of a metal material, and has a bare surface in which an outer surface of the metal material constituting the core material is exposed. A featured stacked cooler.   7. The stacked cooler according to claim 1, wherein the outer shell plate is made of a brazing sheet in which a sacrificial anode material is disposed on an inner surface of the core member.   8. The stacked cooler according to claim 7, wherein the outer shell plate has a three-layer structure in which a brazing material is further disposed on the sacrificial anode material disposed on the inner surface of the core member. .   The laminated cooler according to any one of claims 1 to 6, wherein the outer shell plate is formed of a brazing sheet in which a brazing material is disposed on an inner surface of the core member.   10. The stacked cooler according to claim 1, wherein the inner fin is made of a material that is lower in potential than the core material of the outer shell plate. 11.   11. The laminated cooler according to claim 10, wherein the inner fin is made of a brazing sheet in which a brazing material is disposed on both surfaces of the core material.   The inner fin according to any one of claims 1 to 11, wherein the inner fin is divided into a plurality of portions in the length direction, and a plurality of wavy segments are arranged while shifting the positions of the peaks in a staggered manner. A laminated cooler comprising offset fins.   The stacked cooler according to any one of claims 1 to 12, wherein a channel width wf of the adjacent inner fins is smaller than a height hf of the inner fins.   14. The stacked cooler according to claim 1, wherein a flow path width wf of the inner fin is 1.5 mm or less.   The stacked cooler according to any one of claims 1 to 14, wherein a height hf of the inner fin is in a range of 1 to 5 mm.   16. The stacked cooler according to claim 1, wherein a thickness tf of the inner fin is smaller than a thickness tp of the first tube wall and the second tube wall.   17. The stacked cooler according to claim 1, wherein a thickness tf of the inner fin is in a range of 0.03 to 1.0 mm.   18. The stacked cooler according to claim 1, wherein a thickness tp of the first tube wall and the second tube wall is in a range of 0.1 to 5.0 mm.   The laminated structure according to any one of claims 1 to 18, wherein the communication member includes a bellows tube that can expand and contract in a communication direction, and is configured to be able to change the interval between the cooling tubes. Mold cooler.   20. The outer cooling pipe according to any one of claims 1 to 19, wherein the outer cooling pipe is formed with one stage of the refrigerant flow path in a thickness direction of the cooling pipe, and the refrigerant flow path formed in the outer cooling pipe and the inner cooling pipe. A laminated type cooler characterized in that the refrigerant flow paths formed in the pipe have the same cross-sectional area.   21. The laminated type according to any one of claims 1 to 20, wherein the outer cooling tube has a thickness of an outer tube wall on a side where the electronic component is not placed in contact with a larger thickness than other tube walls. Cooler.   The laminated cooler according to claim 21, wherein the outer tube wall has a thickness of 1 mm or more.

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