JP2008166423A - Cooling tube and manufacturing method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cooling tube and a manufacturing method therefor, with the number of its components reduced. <P>SOLUTION: The cooling tube is a compressed cooling tube 2, used in a laminar type cooler for cooling a plurality of electronic components from both their surfaces, and its compressed crust is constituted by jointing compressed components on each other in its thickness direction. Inside this crust, it has a pair of crust plates 201, constituting a cooling-medium passage for making a cooling medium flow therein; intermediate plates 202 are interposed in between the pair of crust plates 201 as to divide the cooling-medium passage into a plurality of passages in its thickness direction; and wave-shaped inner fins 203 provided in the plurality of passages. The intermediate plate 202 and the inner fins 203 are integrally molded as an integrated inner-fin member 100. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a cooling pipe used in a stacked cooler that cools by sandwiching a plurality of electronic components from both sides, and is applied to, for example, a stacked cooler that cools a semiconductor module used in an inverter for a hybrid vehicle. It is preferable.

  2. Description of the Related Art Conventionally, as a cooling pipe used in a stacked cooler that cools by sandwiching a plurality of electronic components from both sides, for example, a cooling pipe disclosed in Patent Document 1 is known. That is, the cooling pipe is disposed inside the flat cooling pipe on the second refrigerant surface side and the first refrigerant flow path in contact with the electronic component arranged on the first surface side of the cooling pipe. And a second coolant channel that contacts the electronic component. As a result, when the heat generation amount differs between the electronic component on the first surface side and the electronic component on the second surface side, the heat of the electronic component with the larger heat generation amount is smaller with the heat generation amount via the refrigerant. The cooling ability is improved by preventing transmission to electronic components.

  Furthermore, inner fins are provided in the first and second refrigerant flow paths, and the refrigerant flow paths are divided into a plurality at positions where the electronic components are in contact with each other, thereby increasing the heat transfer area between the refrigerant and the cooling pipe. , Improving the cooling capacity.

Such a cooling pipe can be constituted by, for example, a so-called drone cup structure in which a pair of outer shell plates are joined together to form an outer shell of the cooling pipe. In the case of such a drone cup structure, an intermediate plate is disposed between a pair of outer shell plates, thereby dividing the refrigerant flow path into two stages, and further, between each outer shell plate and the intermediate plate. An inner fin member is provided to constitute the cooling pipe.
JP 2005-191527 A

  However, when the cooling pipe having the above-described drone cup structure is configured, in addition to the three parts of the pair of outer shell plate and the intermediate plate, at least two of the first and second refrigerant flow paths are provided. An inner fin member is required. In addition, normally, a plurality of inner fin members are arranged in each of the first and second refrigerant flow paths in accordance with the area where the electronic components are in contact as described above, which further increases the number of components. .

  Furthermore, since a stacked type cooler is configured by stacking a plurality of such cooling pipes, the number of parts of the entire cooler becomes very large.

  In view of the above problems, an object of the present invention is to provide a cooling pipe with a reduced number of parts and a method for manufacturing the same.

  In order to achieve the above object, the present invention employs the following technical means.

  The invention according to claim 1 is a flat cooling tube used in a laminated cooler (1) for cooling a plurality of electronic components (6) from both sides, and is joined in the thickness direction of the flat shape, Between the pair of outer shell plates (201) and the pair of outer shell plates (201) that constitute the flat-shaped outer shell and that constitute the refrigerant flow path (21) through which the refrigerant flows inside the outer shell. An intermediate plate (202) that is disposed and divides the refrigerant flow path (21) into a plurality of flow paths (211 and 212) in the thickness direction, and a wave shape that is disposed in the multiple flow paths (211 and 212). The inner fin (203) is provided, and the intermediate plate (202) and the inner fin (203) are integrally formed as an integral inner fin member (100).

  Thus, by integrally molding the intermediate plate (202) and the inner fin (203), which are configured by conventional individual members, the number of parts constituting the cooling pipe (2) can be reduced. Further, by reducing the number of parts, the number of assembling steps of the cooling pipe (2) can also be reduced.

  The integral inner fin member (100) can be constituted by, for example, bending a planar plate member (100a) as in the invention described in claim 2. An intermediate plate portion (202a) constituting the intermediate plate (202) and a corrugated inner fin portion (203a) constituting the inner fin (203) are formed in parallel on the plate member (100a) via a boundary line. The integrated inner fin member (100) can be formed by bending the plate member (100a) along the boundary line so that the inner fin portion (203a) contacts the surface of the intermediate plate portion (202a). In this way, the integral inner fin member (100) can be easily configured.

  As in the third aspect of the invention, the refrigerant flow path (21) is divided into two stages of the first refrigerant flow path (211) and the second refrigerant flow path (212) by the intermediate plate (203). In addition, as in the invention described in claim 4, the inner fins (203) provided at the corresponding positions of the first refrigerant flow path (211) and the second refrigerant flow path (212) are set as one set, for example, outside According to a region where the electronic component (6) is disposed in contact with the outer surface of the shell plate (201), a plurality of sets of inner fins (203) arranged in parallel at a predetermined interval in the refrigerant flow direction are provided. In some cases, the integral inner fin member (100) can be configured to have at least one of a plurality of sets of inner fins (203).

  Specifically, for example, as in the invention described in claim 5, an integrated inner fin member (100) having one set of a plurality of sets of inner fins (203) is configured, and such an integrated inner fin member ( 100) can be arranged in parallel at the predetermined interval in the refrigerant flow direction.

  Since the integral inner fin member (100) having such a set of inner fins (203) can have a simple structure, it can be easily configured, for example, by bending as in the invention of claim 2. Can do. Further, by arranging the plurality of integral inner fin members (100) in the refrigerant flow path (21) at a predetermined interval in this way, the intermediate plate (203) can be eliminated at the predetermined interval. This improves the cooling capacity on the downstream side when the heat generation amount of the electronic components (6) arranged in contact with the outer surfaces of the pair of outer shell plates (201) on the upstream side is greatly different. Can be made.

  Or like the invention of Claim 6, the integral inner fin member (500, 600) which has all the said multiple sets of inner fins (203) can also be comprised. In this case, since the cooling pipe (2) can be composed of a pair of outer shell plates (201) and one integral inner fin member (500, 600), the number of parts and the number of assembly steps can be further reduced.

  The integral inner fin member (100) may be formed of a plate material in which a brazing material (205) is disposed on both surfaces of a first core material (305) made of a metal material, as in the seventh aspect of the invention. Thereby, it is possible to join between the intermediate plate (202) and the inner fin (203) in the integral inner fin member (100) and between the integral inner fin member (100) and the outer shell plate (201) by brazing.

  In addition, as in the invention described in claim 8, the first core member (305) used for the integral inner fin member (100) is more potential than the second core member (300) used for the outer shell plate (201). It is desirable to use a base material. In this way, the integral inner fin member (100) is made of a material having a lower corrosion potential than the outer shell plate (201), so that the integral inner fin member (100) is preferentially corroded over the outer shell plate (201). The pitting corrosion of the outer shell plate (201) can be prevented.

  As in the ninth aspect of the invention, for joining the pair of outer shell plates (201) such that the integral inner fin member (600) extends from the peripheral edge of the intermediate plate (202). If it is set as the structure provided with the junction part (605), for example, as an invention of Claim 7, an integral inner fin member (600) is comprised by the board | plate material which distribute | arranged the brazing material on both surfaces, and an outer shell is comprised by this brazing material. It is possible to join between the plates (201).

  In this case, since it is not necessary to arrange a brazing material, a layer made of the sacrificial anode material (204) can be provided on the inner surface of the outer shell plate (201), as in the invention of claim 10, Thereby, this sacrificial anode material (204) can be selectively corroded to prevent pitting corrosion of the outer shell plate (291).

  The cooling pipe of the present invention is applied to a stacked cooler (1) for cooling a plurality of semiconductor modules (6) used in an inverter for a hybrid vehicle from both sides, as in the invention described in claim 11. Is preferred.

  The invention according to claim 12 is a method for manufacturing a flat cooling pipe used in a laminated cooler (1) for cooling a plurality of electronic components (6) from both sides, and includes a planar intermediate plate portion ( 202a) and the corrugated inner fin portion (203a) constitute a plate member (100a) formed in parallel via a boundary line, and the plate member (100a) is bent along the boundary line to The inner fin portion (203a) is brought into contact with the surface of the plate portion (202a) to form an integral inner fin member (100) integrally including the intermediate plate (202) and the inner fin (203), and a flat outer shell is formed. The cooling pipe (2) is configured by disposing an integral inner fin member (100) between a pair of outer shell plates (201).

  As described above, the plate member (100a) having the intermediate plate portion (202a) and the inner fin portion (203a) is formed by bending, thereby integrating the intermediate plate (202) and the inner fin (203) integrally. (100) can be configured easily. Further, by integrally forming the intermediate plate (202) and the inner fin (203) in this way, the number of parts constituting the cooling pipe (2) can be reduced, and the number of assembly steps of the cooling pipe (2) can also be reduced. can do.

  Incidentally, the reference numerals in parentheses of each means described above are an example showing the correspondence with the specific means described in the embodiments described later.

(First embodiment)
A first embodiment of the present invention will be described with reference to FIGS. In the present embodiment, a cooling laminated cooler 1 (hereinafter referred to as a cooler) that cools a cooling module 2 according to the present invention by cooling a semiconductor module 6 (corresponding to an electronic component of the present invention) constituting a part of an inverter for a hybrid vehicle. ). The semiconductor module 6 includes an IGBT and a diode.

  First, the whole structure of the cooler 1 is demonstrated using FIG. FIG. 1 is a front view showing the overall configuration of the cooler 1. The cooler 1 cools a plurality of semiconductor modules 6 from both sides, and a plurality of flat cooling pipes 2 provided with a refrigerant flow path 21 for circulating the refrigerant 5 sandwich the semiconductor modules 6 from both sides. A plurality of layers are arranged. In the present embodiment, as shown in FIG. 1, two semiconductor modules 6 are disposed so as to be in contact with each outer surface of each cooling pipe 2.

  The plurality of cooling pipes 2 include a first outer cooling pipe 2a and a second outer cooling pipe 2b arranged at both ends in the stacking direction, and a plurality of inner cooling pipes 2c arranged therebetween. In addition, although mentioned later for details, the refrigerant | coolant 5 distribute | circulates through these each cooling pipe 2 from the left side of FIG.

  The second outer cooling pipe 2b and the inner cooling pipe 2c have the same configuration, and open in the stacking direction at both ends of the refrigerant flow direction, and a protruding pipe portion 22 is provided so as to protrude from the opening. ing. The projecting tube portion 22 includes an inner projecting tube portion 222 projecting downward from the opening in the stacking direction shown in FIG. 1 and an outer projecting tube portion 223 projecting upward, and the inner projecting tube portion of the adjacent inner cooling tube 2c. The supply header portion 11 and the discharge header portion 12 are formed at both ends of the cooler 1 by fitting between 222 and the outer protruding tube portion 223 and joining the side walls of these protruding tube portions 222 and 223 to each other. ing.

  The outer projecting tube portion 223 of the second outer cooling tube 2b is fitted and joined to the inner projecting tube portion 222 of the inner cooling tube 2c adjacent to the upper side in the stacking direction, and the supply header unit 11 and the discharge header unit as described above. 12 is formed. On the other hand, the two inner projecting pipe portions 222 at both ends of the second outer cooling pipe 2b are respectively provided with a refrigerant inlet 31 for introducing the refrigerant 5 into the cooler 1 and for discharging the refrigerant 5 from the cooler 1. The refrigerant discharge ports 32 are connected to each other.

  The first outer cooling pipe 2a is opened only on the lower surface side of both ends thereof, and has an inner protruding pipe part 222 so as to protrude from the opening. The inner protruding pipe part 222 is fitted and joined to the outer protruding pipe part 223 of the inner cooling pipe 2c adjacent to the lower side to form the supply header part 11 and the discharge header part 12.

  In addition, although the detail of the material which comprises the cooling pipe 2 is mentioned later, in this cooler 1, the cooling pipe 2, the refrigerant | coolant inlet 31, and the refrigerant | coolant discharge port 32 are all comprised with aluminum.

  In the present embodiment, the coolant 5 is water mixed with an ethylene glycol antifreeze. In addition to this, the refrigerant 5 includes natural refrigerants such as water and ammonia, fluorocarbon refrigerants such as fluorinate, chlorofluorocarbon refrigerants such as HCFC123 and HFC134a, alcohol refrigerants such as methanol and alcohol, and ketones such as acetone. A system refrigerant or the like can be used.

  Next, a detailed configuration of each cooling pipe 2 will be described with reference to FIGS. 2 and 3. Here, although the said inner side cooling pipe 2c and the 2nd outer side cooling pipe 2b are demonstrated, it is substantially the same also about the structure of the 1st outer side cooling pipe 2a except said difference.

  FIG. 2 is a cross-sectional perspective view of the cooling pipe 2. As shown here, the cooling pipe 2 has a so-called drone cup structure in this embodiment. That is, the cooling pipe 2 has a flat outer shell formed by joining a pair of outer shell plates 201 to each other, and is discharged from the end on the supply header 11 side between the pair of outer shell plates 201. A coolant channel 21 through which the coolant flows toward the header 12 side end is formed.

  And the semiconductor module 6 is arrange | positioned so that the outer surface of these outer shell plates 201 may be contacted. As described above, two semiconductor modules 6 are juxtaposed in the refrigerant flow direction, two on each outer surface.

  The cooling pipe 2 further includes an intermediate plate 202 disposed between the outer shell plates 201 and a wave-shaped inner fin 203 disposed between the intermediate plates 202 and the outer shell plates 201. Yes.

  A first coolant channel 211 and a second coolant channel 212 are formed between the intermediate plate 202 and the outer shell plates 201 on both sides thereof. That is, the refrigerant flow path 21 of the cooling pipe 2 is divided into two stages in the thickness direction of the cooling pipe 2 by the intermediate plate 202. The inner fin 203 divides the first refrigerant flow path 211 and the second refrigerant flow path 212 into a plurality of flow paths from the supply header portion 11 side toward the discharge header portion 12 side.

  And in this 1st refrigerant | coolant flow path 211 and the 2nd refrigerant | coolant flow path 212, as shown in FIG. 3, two intermediate | middle plates 202 and inner fins 203 are arrange | positioned in the refrigerant | coolant distribution direction, Between these. A gap δ of 1 mm or more is formed. In this way, the intermediate plate 202 and the inner fins 203 are formed in a region that includes the entire region where the semiconductor module 6 contacts the cooling pipe 2 and is larger than that.

  In the present embodiment, the intermediate plate 202 and the inner fins 203 are constituted by an integral inner fin member 100 formed by integrally molding them. Hereinafter, the details of the integral inner fin member 100 will be described with reference to FIGS. 4 is a perspective view showing the integral inner fin member 100, and FIG. 5 is a perspective view showing a plate member 100a constituting the integral inner fin member 100. As shown in FIG.

  The integral inner fin member 100 is formed by integrally forming the intermediate plate 202 and the inner fin 203 as described above, and the inner fins 203 are formed on both surfaces of the intermediate plate 202.

  The integral inner fin member 100 is formed by bending a plate member 100a shown in FIG. The plate member 100a has a planar intermediate plate portion 202a that constitutes the intermediate plate 202 at the center thereof, and has wave-shaped inner fin portions 203a that constitute the inner fins 203 on both sides thereof.

  FIG. 6 shows a state in the middle of forming the integral inner fin member 100 by bending the plate member 100a. As shown here, one inner fin portion 203a of the plate member 100a is on the boundary line with the intermediate plate portion 202a so as to be in contact with one surface of the intermediate plate portion 202a (the surface on the first refrigerant flow path 211 side). Accordingly, the inner fin 203 is formed in the first refrigerant flow path 211. The other inner fin portion 203a of the plate member 100a is similarly bent so as to be in contact with the other surface of the intermediate plate portion 202a (the surface on the second refrigerant channel 212 side). The inner fin 203 is constituted.

  In the present embodiment, the thickness of the outer shell plate 201 is about 0.4 mm, and the thickness of the intermediate plate 201 and the inner fin 203 is about 0.2 mm. Further, as shown in an enlarged view in FIG. 7, the outer shell plate 201 is configured by arranging a brazing material 205 on the inner surface of a core material 300 (corresponding to the second core material of the present invention) made of aluminum, The intermediate plate 202 and the inner fin 203 are configured by disposing a brazing material 205 on both surfaces of an aluminum core material 305 containing zinc (corresponding to the first core material of the present invention).

  Next, a method for manufacturing the cooler 1 according to the present embodiment will be described with reference to FIGS. FIG. 8 is a process diagram showing a method for manufacturing the cooler 1. First, a plate material for configuring the plate member 100a is prepared, and the inner fin portion 203a is formed by press molding using the plate material, thereby forming two plate members 100a as shown in FIG.

  By bending these plate members 100a as shown in FIG. 6, two integral inner fin members 100 are formed.

  On the other hand, a plate material for constituting the outer shell plate 201 is prepared, and a pair of outer shell plates 201 is formed by press molding using the plate material.

  Next, as shown in FIG. 9, the two integral inner fin members 100 are arranged between the pair of outer shell plates 201 to assemble the cooling pipe 2.

  The first outer cooling pipe 2a is similar to the inner cooling pipe 2c and the second outer cooling pipe 2b except that the opening and the outer protruding pipe portion 223 are not formed in one outer shell plate 201. It is constructed in this way.

  As shown in FIG. 1, the assembled cooling pipes 2 are stacked in plural, and the inner protruding pipe 222 and the outer protruding pipe 223 of the adjacent cooling pipes 2 are fitted, and further the inner side of the second outer cooling pipe 2 b. The refrigerant introduction port 31 and the refrigerant discharge port 32 are fitted into the protruding tube 222. In this way, the cooler 1 is configured.

  The cooler 1 is placed in a furnace and heated to the melting point of the brazing material, thereby brazing the whole. Since the brazing material 205 is arranged on the surface of the outer shell plate 201 and the integral inner fin member 100 as described above, the outer shell plates 201 are joined to each other at the peripheral edge in each cooling pipe 2 by this brazing. At the same time, the wavy ends of the inner fins 204 are joined to the surface of the intermediate plate 202 and the inner surface of the outer shell plate 201. Moreover, in the cooler 1, the cooler 1 is connected between the projecting pipe portions 22 of the adjacent cooler pipes 2 and between the second outer cooling pipe 2b and the refrigerant introduction port 31 and the refrigerant discharge port 32. Complete.

  The semiconductor module 6 is disposed between the cooling pipes 2 of the completed cooler 1. At this time, the semiconductor module 6 is disposed in direct contact with the cooling pipe 2, or an insulating plate such as ceramic or thermally conductive grease is interposed between the semiconductor module 6 and the cooling pipe 2. Arranged.

  After the semiconductor module 6 is disposed between the cooling pipes 2, the entire cooler 1 is pressed from above and below so that the interval between the cooling pipes 2 is equal to the thickness of the semiconductor module 6. At this time, in each cooling pipe 2, the root of the protruding pipe portion 22 bites into the cooling pipe 2, thereby reducing the interval between the cooling pipes 2 and holding the semiconductor module 6 between the cooling pipes 2. .

  As shown in FIG. 1, when the refrigerant 5 is introduced into the cooler 1 from the refrigerant introduction port 31, the refrigerant 5 flows into the cooling pipes 2 from the supply header portion 11. In each cooling pipe 2, the refrigerant 5 is divided into a first refrigerant flow path 211 and a second refrigerant flow path 212 at a portion where the intermediate plate 202 and the inner fin 203 are formed, and is divided into a plurality by the inner fins 203. The divided flow paths are circulated, and at this time, heat exchange is performed with the semiconductor module 6 to cool the semiconductor module 6.

  Thereafter, the boundary layer of the flow of the refrigerant 5 formed by the inner fins 203 once disappears in the gap δ at the central portion in the refrigerant flow direction of the cooling pipe 2 where the intermediate plate 202 and the inner fins 203 are not disposed. In the gap δ, the first and second refrigerant flow paths 211 and 212 also once become one refrigerant flow path 21.

  In the portion where the intermediate plate 202 and the inner fins 203 on the downstream side of the cooling pipe 2 are disposed, the refrigerant 5 flows in the same manner as the upstream side to cool the semiconductor module 6.

  After the refrigerant 5 circulates in each cooling pipe 2 in this manner, the refrigerant 5 flows out from the end of the cooling pipe 2 at the discharge header portion 12 side, flows through the discharge header portion 12 and passes through the refrigerant discharge port 32 to cool the cooler 1. It is discharged outside.

  As described above, in the present embodiment, the intermediate plate 202 and the inner fin 203 are integrally formed as the integral inner fin member 100, thereby reducing the number of components constituting each cooling pipe 2 as compared with the conventional case. . Thereby, the assembly man-hour of the cooling pipe 2 is also reduced. Further, by reducing the number of parts and the number of assembling steps of each cooling pipe 2, the number of parts and the number of assembling steps of the entire cooler 1 configured by stacking such cooling pipes 2 are greatly reduced. be able to.

  As in this embodiment, the integral inner fin member 100 can be easily configured by forming a plate member 100a having an intermediate plate portion 202a and an inner fin portion 203a and bending the plate member 100a.

  In the present embodiment, the coolant channel 21 is divided into the first coolant channel 211 and the second coolant channel 212 in the region where the cooling pipe 2 is in contact with the semiconductor module 6. Even when the semiconductor module 6 in contact with the first refrigerant channel 211 side and the semiconductor module 6 in contact with the second refrigerant channel 212 side have different calorific values, the heat of the semiconductor module 6 with the larger calorific value is the calorific value. The temperature is not increased by being transmitted to the smaller semiconductor module.

  Further, in the region where the cooling pipe 2 is in contact with the semiconductor module 6, the inner fins 203 are disposed in the first refrigerant flow path 211 and the second refrigerant flow path 212, respectively, so that the space between the cooling pipe 2 and the refrigerant 5 is set. The heat transfer area is ensured so that the semiconductor module 6 can be reliably cooled.

  Further, by forming a gap δ of 1 mm or more between the two integral inner fin members 100 arranged in parallel in the refrigerant flow direction, the boundary layer of the flow of the refrigerant 5 formed by the inner fins 203 is once extinguished in the gap δ. As a result, a decrease in cooling capacity downstream of the cooling pipe 2 is prevented.

  Further, since the intermediate plate 202 is not provided in the gap δ between the two integral inner fin members 100, the first and second refrigerant channels 211 and 212 once become one refrigerant channel 21. This improves the cooling capacity on the downstream side when the semiconductor module 6 in contact with the first refrigerant channel 211 on the upstream side and the semiconductor module 6 in contact with the second refrigerant channel 212 have greatly different heat generation amounts. Can be made.

  In the present embodiment, zinc is contained in the core material of the plate material constituting the integral inner fin member 100, so that the integral inner fin member 100 has a lower corrosion potential than the outer shell plate 201. The plate 202 is preferentially corroded to prevent pitting corrosion (opening of holes due to corrosion) of the outer shell plate 201.

(Second Embodiment)
A second embodiment of the present invention is shown in FIGS. In the first embodiment, the two integral inner fin members 100 are disposed on the upstream side and the downstream side in the refrigerant flow direction of the cooling pipe 2, whereas in the present embodiment, one inner fin member 500 is provided as the cooling pipe. 2 is arranged over the entire refrigerant distribution direction.

  As shown in FIG. 10, the integral inner fin member 500 has an intermediate plate 202 disposed over the entire refrigerant flow direction of the cooling pipe 2, and two inner fins 203 on each of both surfaces of the intermediate plate 202. It is comprised.

  Thus, in this embodiment, since the intermediate plate 202 is provided over the entire refrigerant flow direction of the cooling pipe 2, the refrigerant flow path 21 is the first refrigerant flow path over the entire refrigerant flow direction. 211 and the second refrigerant channel 212.

  And in the 1st refrigerant | coolant flow path 211 and the 2nd refrigerant | coolant flow path 212, the inner fins 203 each provide two clearance gaps (delta) more than 1 mm in the upstream and downstream similarly to the said 1st Embodiment. It is arranged. Thereby, in the area | region which includes the whole area | region where the semiconductor module 6 contacts the cooling pipe 2, and is larger than that, the 1st refrigerant | coolant flow path 211 and the 2nd refrigerant | coolant flow path 212 are divided into the several flow path.

  The integral inner fin member 500 is formed by bending a planar plate member 500a as shown in FIG. The plate member 500 a has a total of four inner fin portions 503 a, two on each side of the intermediate plate portion 502 a constituting the intermediate plate 202.

  The two inner fin portions 503a provided on one side of the intermediate plate portion 502a are bent along a boundary line with the intermediate plate portion 502a so as to contact the surface of the intermediate plate portion 502a on the first refrigerant flow path 211 side. Thus, the inner fin 203 is configured in the first refrigerant flow path 211. The two inner fin portions 503a provided on the other side of the intermediate plate portion 502a are similarly bent so as to be in contact with the surface of the intermediate plate portion 502a on the second refrigerant flow path 212 side, whereby the second refrigerant flow An inner fin 203 is formed in the path 212.

  The other configuration of the cooling pipe 2 in the present embodiment is the same as that in the first embodiment.

  Next, with respect to the method for manufacturing the cooling pipe 2 in the present embodiment, differences from the first embodiment will be mainly described. In the first embodiment, the two inner fin members 100 are formed by the two plate members 100a, whereas in the present embodiment, the single plate member 500a as shown in FIG. One integral inner fin member 500 is formed.

  Specifically, the plate member 500a is formed by press molding using a plate material, and this is bent to form the integrated inner fin member 500.

  The integrated inner fin member 500 is disposed between a pair of outer shell plates 201 configured in the same manner as in the first embodiment, and the cooling pipe 2 is assembled. Further, a plurality of cooling pipes 2 are stacked, the cooler 1 is assembled, and the whole is brazed. Thereby, each part of the cooler 1 is joined, and the cooler 1 is completed.

  In the cooling pipe 2 of the present embodiment, the refrigerant 5 that has flowed in from the supply header portion 11 is divided into the first refrigerant flow path 211 and the second refrigerant flow path 212 and circulates, and the area where the inner fins 203 are provided. In, the flow is divided into a plurality of channels by the inner fins 203.

  In the gap δ at the central portion in the refrigerant flow direction of the cooling pipe 2 where the inner fins 203 are not disposed, the boundary layer of the flow of the refrigerant 5 formed by the inner fins 203 disappears once as in the first embodiment.

  However, in the first embodiment, the first refrigerant flow path 211 and the second refrigerant flow path 212 once become one refrigerant flow path 21 in the gap δ, whereas in the present embodiment, The refrigerant 5 flows through the gap δ while being divided into the first refrigerant flow path 211 and the second refrigerant flow path 212.

  As described above, in the present embodiment, the two integrated inner fin members 100 provided separately on the upstream side and the downstream side in the first embodiment are configured as one integrated inner fin member 500, whereby the cooling pipe 2 The number of parts is further reduced.

(Third embodiment)
A third embodiment of the present invention is shown in FIGS. In the present embodiment, an integrated inner fin member 600 similar to the integrated inner fin member 500 of the second embodiment is provided, and a joint portion for joining the outer shell plates 201 to the peripheral edge portion of the integral inner fin member 600. 605 is formed.

  FIG. 12 is a perspective view showing a configuration of the integral inner fin member 600 in the present embodiment. As shown here, the integral inner fin member 600 has an intermediate plate 202 disposed over the entire refrigerant flow direction of the cooling pipe 2, and two inner fins 203 are provided on each side of the intermediate plate 202. It is configured. Furthermore, the joint part 605 is provided in the peripheral part of the integral inner fin member 600, and this joint part 605 respond | corresponds to the part to which a pair of outer shell plate 201 is joined.

  In the present embodiment, since the intermediate plate 202 is provided over the entire refrigerant flow direction of the cooling pipe 2, the refrigerant flow path 21 is the same over the entire refrigerant flow direction as in the second embodiment. The coolant is divided into a first coolant channel 211 and a second coolant channel 212.

  And in the 1st refrigerant | coolant flow path 211 and the 2nd refrigerant | coolant flow path 212, two inner fins 203 are each provided, and the clearance gap (delta) of 1 mm or more is provided in the upstream and downstream. Thereby, in the area | region which includes the whole area | region where the semiconductor module 6 contacts the cooling pipe 2, and is larger than that, the 1st refrigerant | coolant flow path 211 and the 2nd refrigerant | coolant flow path 212 are divided into the several flow path.

  The integral inner fin member 600 is formed by bending a planar plate member 600a as shown in FIG. The plate member 600a has a total of four inner fin portions 603a, two on each side of the intermediate plate portion 602a constituting the intermediate plate 202. Further, an extended portion 605a is provided so as to extend from the peripheral edge portion of the intermediate plate portion 602a.

  The two inner fin portions 603a provided on one side of the intermediate plate portion 602a are bent along a boundary line with the intermediate plate portion 602a so as to contact the surface of the intermediate plate portion 602a on the first refrigerant flow path 211 side. Thus, the inner fin 203 is configured in the first refrigerant flow path 211. The two inner fin portions 603a provided on the other side of the intermediate plate portion 602a are similarly bent so as to be in contact with the surface of the intermediate plate portion 602a on the second refrigerant flow path 212 side, whereby the second refrigerant flow An inner fin 203 is formed in the path 212.

  The expansion portion 605a of the plate member 600a corresponds to the joint portion 605 of the integral inner fin member 600. In the state where the plate member 600a is formed into the integral inner fin member 600 by bending, the expansion portion 605a is joined to the joint portion 605. Is configured.

  In the present embodiment, as shown in FIG. 14, the integrated inner fin member 600 has a brazing material 205 disposed on both sides of an aluminum core material 305 containing zinc, as in the first and second embodiments. On the other hand, in the first and second embodiments, the outer shell plate 201 has a configuration in which the brazing material 205 is disposed inside the core material 300 made of aluminum. In the embodiment, a layer made of the sacrificial anode material 204 is provided inside the core material 300 made of aluminum.

  Other configurations of the cooling pipe 2 in the present embodiment are the same as those in the first and second embodiments.

  Next, the manufacturing method of the cooling pipe 2 in the present embodiment will be described mainly with respect to differences from the second embodiment. A plate member 600a as shown in FIG. 13 is formed by press molding using a plate material, and this is bent to form an integral inner fin member 600 as shown in FIG.

  The integrated inner fin member 600 is disposed between a pair of outer shell plates 201 configured in the same manner as in the first and second embodiments, and the cooling pipe 2 is assembled. At this time, in the first and second embodiments, the outer shell plates 201 are directly in contact with each other at the peripheral edge portion, whereas in the present embodiment, an integral inner fin member is provided between the outer shell plates 201. 600 joints 605 are arranged.

  In the present embodiment, as described above, the integrated inner fin member 600 is a plate material in which the brazing material 205 is arranged on both surfaces of the zinc core aluminum 305 as in the first and second embodiments. Therefore, the joint portion 605 also has a layer made of the brazing material 205 on both sides thereof.

  Therefore, after a plurality of cooling pipes 2 assembled as described above are stacked to constitute the cooler 1, the entire cooler 1 is heated to the melting point of the brazing material 205. It is joined by the brazing material on both sides of the joint portion 605 via the portion 605.

  As described above, in this embodiment, the intermediate plate 202 and the inner fin 203 are configured as one integral inner fin member 600, thereby reducing the number of parts of the cooling pipe 2.

  Further, in this embodiment, the integral inner fin member 600 has the joint portion 605, and the outer shell plates 201 are joined by the brazing material 205 disposed on both surfaces of the joint portion 605. There is no need to place brazing material on the inside surface. Therefore, in the present embodiment, the sacrificial anode material 204 is disposed on the inner side surface of the outer shell plate 201, whereby the sacrificial anode material 204 is selectively corroded and the core material 300 of the outer shell plate 201 is corroded. Is preventing.

(Other embodiments)
In each of the above embodiments, the plate members 100a, 500a, and 600a constituting the integral inner fin members 100, 500, and 600 are disposed on both sides of the intermediate plate portions 202a, 502a, and 602a along the refrigerant circulation direction along the inner fin portions 203a, 503a, and However, the configuration of the plate member is not limited to this, and any configuration can be used as long as the inner fins 203 can be formed on both sides of the intermediate plate 202 by bending, for example, as shown in FIG. As described above, the two inner fin portions 203a may be formed side by side on one side of the intermediate plate portion 202a. Such a plate member can constitute the integrated inner fin member 100 similar to that of the first embodiment by bending the two inner fin portions 203a around the intermediate plate portion 202a.

  In each of the above embodiments, the refrigerant flow path 21 of the cooling pipe 2 is divided into the first refrigerant flow path 211 and the second refrigerant flow path 212 by the intermediate plate 202. The refrigerant flow path 21 may be divided into three or more stages.

  For example, when the refrigerant flow path 21 is divided into three stages by the intermediate plate 202, a plate member having two intermediate plate portions 202a and three inner fin portions 203a as shown in FIG. The integrated inner fin member can be formed by bending the plate member in a manner similar to that of the first embodiment.

  In each of the above embodiments, two semiconductor modules 6 are arranged in contact with each outer surface of each cooling pipe 2, but this is not a limitation, and for example, three semiconductor modules 6 are arranged. There may be. In this case, as in the first embodiment, three integrated inner fin members 100 including one set of inner fins 203 may be disposed in each cooling pipe 2, or the second and third embodiments. Similarly, one integral inner fin member including three inner fins 203 may be disposed in each cooling pipe 2.

  Thus, by increasing the number of semiconductor modules 6 brought into contact with each cooling pipe 2, when the number of semiconductor modules 6 to be cooled in the entire cooler 1 is fixed, the number of cooling pipes 2 to be stacked is reduced. In addition, the intermediate plate 202 and the inner fin 203 of the cooling pipe 2 in that case are configured by one integral inner fin member as in the second and third embodiments, so that the components of the entire cooler 1 can be obtained. The number can be greatly reduced.

  In each of the embodiments described above, the stacked cooler 1 having the cooling pipe 2 of the present invention is applied to cooling the semiconductor module 6 used in the hybrid vehicle inverter. It can be applied to cooling semiconductor modules used in inverters, air conditioner inverters for building air conditioning, and the like. Further, it can be applied to cooling electronic components such as power transistors, power FETs, and IGBTs instead of modules.

It is a front view which shows the whole structure of the cooler in 1st Embodiment. It is a cross-sectional perspective view which shows the structure of the cooling pipe in 1st Embodiment. It is arrow sectional drawing in the position shown by III-III in FIG. It is a perspective view which shows the structure of the integral inner fin member in 1st Embodiment. It is a perspective view which shows the structure of the plate member in 1st Embodiment. It is explanatory drawing which shows the manufacturing method of the integral inner fin member in 1st Embodiment. It is an expanded sectional view showing details of composition of a cooling pipe in a 1st embodiment. It is process drawing which shows the manufacturing method of the cooler in 1st Embodiment. It is a disassembled perspective view which shows the structure of the cooling pipe in 1st Embodiment. It is a perspective view which shows the structure of the integral inner fin member in 2nd Embodiment. It is a perspective view which shows the structure of the plate member in 2nd Embodiment. It is a perspective view which shows the structure of the integral inner fin member in 3rd Embodiment. It is a perspective view which shows the structure of the plate member in 3rd Embodiment. It is an expanded sectional view showing details of composition of a cooling pipe in a 3rd embodiment. It is a perspective view which shows the structure of the plate member in other embodiment. It is a perspective view which shows the structure of the plate member in other embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Stack type cooler 2 Cooling pipe 6 Semiconductor module (electronic component)
21 refrigerant flow channel 100 integral inner fin member 100a plate member 211 first refrigerant flow channel 212 second refrigerant flow channel 201 outer shell plate 202 intermediate plate 202a intermediate plate portion 203 inner fin 203a inner fin portion 204 sacrificial anode material 205 brazing material 300 core material ( Second core material)
305 Core material (first core material)
500 Integrated inner fin member 500a Plate member 502a Intermediate plate portion 503a Inner fin portion 600 Integrated inner fin member 600a Plate member 602a Intermediate plate portion 603a Inner fin portion 605 Joint portion

Claims (12)

A flat cooling tube used in a laminated cooler (1) for cooling a plurality of electronic components (6) from both sides,
A pair of outer shell plates (201) which constitute a refrigerant flow path (21) in which the refrigerant is circulated in the outer shell while constituting the flat outer shell by joining in the thickness direction of the flat shape. When,
An intermediate plate (202) disposed between the pair of outer shell plates (201) and dividing the coolant channel (21) into a plurality of channels (211 and 212) in the thickness direction;
Wavy inner fins (203) disposed in the plurality of flow paths (211 and 212),
The cooling pipe, wherein the intermediate plate (202) and the inner fin (203) are integrally formed as an integral inner fin member (100). The integral inner fin member (100) is formed by bending a planar plate member (100a),
The plate member (100a) has an intermediate plate portion (202a) that constitutes the intermediate plate (202) and a wavy inner fin portion (203a) that constitutes the inner fin (203). Are formed in parallel,
The integral inner fin member (100) is configured by bending the plate member (100a) along the boundary line so that the inner fin portion (203a) is in contact with the surface of the intermediate plate portion (202a). The cooling pipe according to claim 1.   The refrigerant path (21) is divided into a first refrigerant path (211) and a second refrigerant path (212) by the intermediate plate (203). The described cooling pipe. Plural sets of inner fins (203) provided at positions corresponding to the first refrigerant flow path (211) and the second refrigerant flow path (212) as a set, arranged in parallel at a predetermined interval in the refrigerant flow direction. The inner fin (203) is provided as the inner fin,
The cooling pipe according to claim 3, wherein the integral inner fin member (100) has at least one set of the plurality of sets of inner fins (203). The integral inner fin member (100) has one set of the plurality of sets of inner fins (203),
The cooling pipe according to claim 4, wherein a plurality of the integral inner fin members (100) are arranged in parallel at the predetermined interval in the refrigerant flow direction.   The cooling pipe according to claim 4, wherein the integral inner fin member (500, 600) has all of the plurality of sets of inner fins (203).   The said integral inner fin member (100) is comprised by the board | plate material which distribute | arranged the brazing material (205) on both surfaces of the 1st core material (305) which consists of metal materials, The one of Claim 1 thru | or 6 characterized by the above-mentioned. The cooling pipe according to one. The outer shell plate (201) is configured to have a second core material (300) made of a metal material,
The cooling pipe according to claim 7, wherein the first core member (305) is made of a material that is lower in potential than the second core member (300). The integral inner fin member (600) includes a joint (605) extending from a peripheral edge of the intermediate plate (202),
The said joint part (605) is arrange | positioned between said pair of outer shell plates (201), and has joined between said pair of outer shell plates (201). The cooling pipe as described in any one.   The cooling pipe according to claim 9, wherein the outer shell plate (201) has a layer made of a sacrificial anode material (204) on an inner surface thereof.   The cooling pipe according to any one of claims 1 to 10, wherein the electronic component is a semiconductor module (6) used in an inverter for a hybrid vehicle. A method of manufacturing a flat cooling tube used in a stacked cooler (1) for cooling a plurality of electronic components (6) from both sides,
The planar intermediate plate portion (202a) and the wave-shaped inner fin portion (203a) constitute a plate member (100a) formed in parallel via a boundary line,
By bending the plate member (100a) along the boundary line, the inner fin part (203a) is brought into contact with the surface of the intermediate plate part (202a), and the intermediate plate (202) and the inner fin (203) are brought into contact with each other. Constituting an integral inner fin member (100) provided integrally;
Manufacture of a cooling pipe, wherein the integral inner fin member (100) is arranged between a pair of outer shell plates (201) constituting the flat outer shell to constitute a cooling pipe (2). Method.

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