JP4766110B2 - Semiconductor cooling structure - Google Patents

Description

  The present invention relates to a semiconductor cooling structure having a semiconductor module containing a semiconductor element and a cooling pipe disposed in close contact with the semiconductor module.

For example, a power conversion device such as an inverter is provided with a plurality of semiconductor modules containing semiconductor elements, and a large current flows through the semiconductor modules. Therefore, in order to prevent the temperature of the semiconductor element from rising, there is a structure in which a cooling pipe for circulating a cooling medium for cooling the semiconductor element is disposed in close contact with the semiconductor module (see Patent Document 1).
In addition, fins are provided in the refrigerant flow path inside the cooling pipe so as to form a non-uniform cooling efficiency distribution on the cooling surface in the width direction of the refrigerant flow path according to the temperature distribution on the surface of the semiconductor element. , Fins are arranged. Here, the width direction is a direction orthogonal to both the direction in which the cooling medium flows and the direction orthogonal to the cooling surface.

JP 2006-60114 A

  However, in the conventional semiconductor cooling structure described above, there is a possibility that a temperature distribution is generated in a direction orthogonal to the cooling surface in the refrigerant flow path. That is, the temperature of the cooling medium flowing near the cooling surface in close contact with the semiconductor module in the cooling pipe is more likely to rise than the temperature of the cooling medium flowing away from the semiconductor module. Therefore, heat exchange between the cooling medium and the semiconductor module is not efficient.

  In addition, even when the semiconductor module is closely arranged on both surfaces of the cooling pipe, if there is a difference in the amount of heat generated between the semiconductor element arranged on one side of the cooling pipe and the semiconductor element arranged on the other side, In the conventional semiconductor cooling structure, there is a possibility that a temperature distribution is generated in a direction perpendicular to the cooling surface in the refrigerant flow path. As a result, similarly, it may be difficult to sufficiently increase the cooling efficiency of the semiconductor element.

  The present invention has been made in view of such conventional problems, and an object of the present invention is to provide a semiconductor cooling structure excellent in cooling efficiency of a semiconductor element.

The present invention relates to a semiconductor cooling structure having a semiconductor module containing a semiconductor element, and a cooling pipe disposed in close contact with the semiconductor module.
The cooling pipe has a refrigerant inlet for introducing a cooling medium and a refrigerant outlet for discharging the cooling medium, and has a refrigerant flow path for circulating the cooling medium from the refrigerant inlet toward the refrigerant outlet. And
The said refrigerant passage, Ri Na provided refrigerant moving means for moving the cooling medium to have a velocity vector perpendicular to the cooling surface perpendicular to the cooling surface in close contact with the semiconductor module,
The cooling pipe has an intermediate plate that partitions the refrigerant flow path in a direction perpendicular to the cooling surface, and the cooling medium flows alternately through the first flow path and the second flow path partitioned by the intermediate plate. Has been
The intermediate plate communicates the first flow path and the second flow path at both ends in the cooling surface width direction orthogonal to the refrigerant flow direction from the refrigerant inlet to the refrigerant outlet and parallel to the cooling surface. Having a communication part,
The first flow path and the second flow path are each provided with inclined fins formed obliquely with respect to the refrigerant flow direction and the cooling surface width direction,
The inclined fins in the first flow path and the inclined fins in the second flow path are opposite in inclination direction,
The inclined fin is formed between the pair of communicating portions in the intermediate plate,
The semiconductor module opposes the inclined fin and opposes a cooling medium that moves obliquely between the pair of communicating portions along the inclined fin with respect to the refrigerant flow direction and the cooling surface width direction. The semiconductor cooling structure is arranged in such a manner (claim 1).

Next, the effects of the present invention will be described.
In the semiconductor cooling structure, refrigerant moving means for moving the cooling medium so as to have a velocity vector in the direction perpendicular to the cooling surface is provided in the refrigerant flow path of the cooling pipe. Therefore, it can suppress that the cooling medium introduced into the refrigerant flow path forms a temperature distribution in the direction perpendicular to the cooling surface. That is, the cooling surface in the refrigerant flow path is also used when the semiconductor module is closely disposed on only one cooling surface of the cooling pipe, or when the semiconductor modules having different calorific values are closely disposed on both cooling surfaces. The occurrence of temperature distribution in the vertical direction can be suppressed.
As a result, the entire cooling medium supplied to the refrigerant flow path can be efficiently used for heat exchange with the semiconductor element. Therefore, the semiconductor cooling structure can improve the cooling efficiency of the semiconductor element.

  As described above, according to the present invention, it is possible to provide a semiconductor cooling structure excellent in cooling efficiency of a semiconductor element.

In the present invention (Claim 1), the semiconductor module may include one semiconductor element or a plurality of the semiconductor elements.
Moreover, the said semiconductor cooling structure can be made into the structure which comprises some power converters, such as an inverter, for example.
In the semiconductor cooling structure, the cooling medium has a velocity vector in the direction perpendicular to the cooling surface by the cooling moving means. Here, “so that the cooling medium has a velocity vector in the direction perpendicular to the cooling surface” means that the velocity vector of the cooling medium flowing through the refrigerant flow path has a component in the direction perpendicular to the cooling surface. Hereinafter, simply saying “the cooling medium moves in the direction perpendicular to the cooling surface” means that “the cooling medium moves in the direction perpendicular to the cooling surface with a velocity vector”.

The cooling pipe includes an intermediate plate that partitions the refrigerant flow path in a direction perpendicular to the cooling surface, and the cooling medium alternately flows through the first flow path and the second flow path partitioned by the intermediate plate. as that has been configured.
Thereby , the said cooling medium can be reliably moved to the said cooling surface perpendicular | vertical direction, and the temperature distribution in a refrigerant | coolant flow path can be suppressed effectively.

The intermediate plate has the first flow path and the second flow path at both ends in the cooling surface width direction orthogonal to the refrigerant flow direction from the refrigerant inlet to the refrigerant outlet and parallel to the cooling surface. The first flow path and the second flow path are each provided with an inclined fin formed obliquely with respect to the refrigerant flow direction, and the inclination in the first flow path is provided. and the fin, and the above-mentioned inclined fins in the second flow path, the tilt directions Ru opposite der each other.

Thereby, for example, the cooling medium introduced into the first flow path from the refrigerant inlet flows obliquely with respect to the refrigerant flow direction along the inclined fins and is guided to one of the communication portions. Then, the cooling medium moves from the first flow path to the second flow path via the communication section, and is guided to the other communication section along the inclined fins in the second flow path. The cooling medium again moves to the first flow path through this communication portion. As described above, the cooling medium spirally flows through the refrigerant flow path while moving alternately between the first flow path and the second flow path via the two communication portions. Thereby, a cooling medium can be efficiently moved to the said cooling surface perpendicular | vertical direction, and formation of the temperature distribution in a refrigerant | coolant flow path can be suppressed.
Further, with this configuration , the cooling medium can be efficiently moved also in the cooling surface width direction, so that formation of a temperature distribution in this direction can also be suppressed. Therefore, the cooling efficiency of the semiconductor element can be sufficiently improved.

The cooling pipe divides the refrigerant flow path in a cooling surface width direction that is orthogonal to the refrigerant flow direction from the refrigerant inlet to the refrigerant outlet and parallel to the cooling surface, and is parallel to the refrigerant flow direction. be provided with a straight fin formed, the straight to the plurality of divided refrigerant flow paths divided by the fins, have good partly be the protrusion protruding to the coolant flow path is disposed.
In this case, due to the provision of the protrusions, in the circulating cooling medium, a pressure difference is generated in the cooling surface vertical direction, and a flow having a velocity vector in the cooling surface vertical direction is generated. Thereby, formation of the temperature distribution in a refrigerant flow path can be suppressed.

Further, the protruding portion is not preferably disposed on the upstream side of the arrangement position of the semiconductor element.
In this case, since the cooling medium moves in the direction perpendicular to the cooling surface before the semiconductor element, the cooling medium having a relatively low temperature can be brought close to the semiconductor element and the cooling can be performed efficiently.

Further, the protrusion but it may also be formed on a part of the outer shell portion of the cooling tube.
In this case, the protrusion can be easily formed. Further, when the cooling pipe is assembled, the protruding portion can be used as a positioning means for the straight fin and the outer shell portion.
Moreover, the said protrusion part may be formed in a part of said straight fin.

The cooling pipe includes an intermediate plate that partitions the refrigerant flow path in a direction perpendicular to the cooling surface, and the cooling medium flows through a first flow path and a second flow path partitioned by the intermediate plate, respectively. In the first flow path and the second flow path, the refrigerant is perpendicular to the refrigerant flow direction from the refrigerant inlet to the refrigerant outlet and parallel to the cooling face in the cooling face width direction. The flow path is divided and provided with straight fins formed parallel to the refrigerant flow direction, and the plurality of divided refrigerant flow paths divided by the straight fins partially protrude toward the refrigerant flow path side. and protrusions are disposed, projecting portion, Ru can be configured to be formed on a part of the intermediate plate.

  In this case, in the first flow path and the second flow path, the protrusion is disposed, so that in the circulating cooling medium, a pressure difference is generated in the cooling surface vertical direction, and the cooling surface vertical A flow with a velocity vector in the direction occurs. Thereby, formation of the temperature distribution in a refrigerant flow path can be suppressed. Moreover, the said protrusion part can be formed easily. Further, when the cooling pipe is assembled, the protruding portion can be used as a positioning means for the straight fin and the intermediate plate.

In addition to the intermediate plate, the protrusion may be formed on a part of the outer shell of the cooling pipe.
In this case, since the protrusion is formed on both the intermediate plate and the outer shell of the cooling pipe, the formation of the temperature distribution in the refrigerant flow path can be further suppressed. Moreover, the said protrusion part can be formed easily. Further, when the cooling pipe is assembled, the protruding portion can be used as a positioning means for the straight fin and the outer shell portion.
Moreover, the said protrusion part may be formed in a part of said straight fin.

In the above configuration, it is preferable that the projecting portion is disposed upstream of the position where the semiconductor element is disposed.
In this case, since the cooling medium moves in the direction perpendicular to the cooling surface before the semiconductor element, the cooling medium having a relatively low temperature can be brought close to the semiconductor element and the cooling can be performed efficiently.

Further, in the present invention, the protruding portion can be variously changed in the arrangement position, the number, the protruding height, and the like.
Moreover, the said protrusion part can be formed by directly pressing the said outer shell part of the said cooling pipe | tube, or the said intermediate plate, for example. Moreover, it can also form by adhere | attaching, welding, etc. the another member used as the said protrusion part with respect to the said outer shell part of the said cooling pipe, or the said intermediate plate.

The cooling pipe divides the refrigerant flow path in a cooling surface width direction that is orthogonal to the refrigerant flow direction from the refrigerant inlet to the refrigerant outlet and parallel to the cooling surface, and is parallel to the refrigerant flow direction. The formed straight fin is provided, and the straight fin is provided with an inclined rib formed to protrude toward a plurality of divided refrigerant flow paths divided by the straight fin, and the inclined rib is formed of the refrigerant. it is not preferable that are inclined with respect to the flow direction and the cooling surface.
In this case, by providing the inclined ribs, a pressure difference is generated in the cooling medium vertical direction in the cooling medium flowing through each divided refrigerant flow path, and a velocity vector is provided in the cooling surface vertical direction. A flow occurs. Thereby, formation of the temperature distribution in a refrigerant flow path can be suppressed.

Moreover, the inclined ribs are formed in plural along the refrigerant flow direction, the inclined ribs adjacent to the refrigerant flow direction, Ru can be configured inclination directions to each other are opposite.
A plurality of the inclined ribs are formed along the refrigerant flow direction, and the plurality of inclined ribs form a plurality of inclined rib groups including the inclined ribs having the same inclination direction. the inclined ribs of the inclined rib group adjacent to the flow direction, Ru can be configured inclination directions to each other are opposite.
In these cases, the cooling medium flowing through each divided refrigerant flow path flows in the refrigerant distribution direction while moving in the vertical direction of the cooling surface while being swung by the inclined ribs. Therefore, the cooling medium can be smoothly moved in the direction perpendicular to the cooling surface.

A plurality of the inclined ribs are formed not only in the refrigerant flow direction but also in the vertical direction of the cooling surface, and the inclined ribs adjacent to each other in the vertical direction of the cooling surface have opposite inclination directions. Ru can be.
Further, a plurality of the inclined ribs are formed in the direction perpendicular to the cooling surface in addition to the refrigerant flow direction, and the plurality of inclined ribs include an inclined rib group including the inclined ribs having the same inclination direction. and forming a plurality of said inclined ribs in the inclined rib group adjacent to the cooling surface vertical, Ru can be configured inclination directions to each other are opposite.
In these cases, the cooling medium flowing through each divided refrigerant flow path moves in the vertical direction of the cooling surface while being swung by the inclined ribs formed in the refrigerant distribution direction and the cooling surface vertical direction. It will flow in the distribution direction. Therefore, the cooling medium can be smoothly moved in the direction perpendicular to the cooling surface.

In addition to the inclined rib, the straight fin is provided with an orthogonal rib formed to project toward a plurality of divided refrigerant flow paths divided by the straight fin, and the orthogonal rib is provided with the refrigerant flow. Ru can be configured to be formed in the direction orthogonal to the direction and the cooling surface.
In this case, the cooling medium flowing through each of the divided refrigerant channels flows in the refrigerant circulation direction while moving in the direction perpendicular to the cooling surface by the inclined ribs and the orthogonal ribs. Therefore, the cooling medium can be smoothly moved in the direction perpendicular to the cooling surface.

The cooling pipe divides the refrigerant flow path in a cooling surface width direction that is orthogonal to the refrigerant flow direction from the refrigerant inlet to the refrigerant outlet and parallel to the cooling surface, and is parallel to the refrigerant flow direction. The straight fin is provided, and the straight fin is provided with an orthogonal rib formed to project toward a plurality of divided refrigerant flow paths divided by the straight fin, and the orthogonal rib is formed of the refrigerant. Ru can be configured to be formed in the direction perpendicular to the flow direction and the cooling surface.
In this case, since the orthogonal ribs are arranged, a pressure difference is generated in the vertical direction of the cooling surface in the cooling medium flowing through each divided refrigerant flow path, and a velocity vector is provided in the vertical direction of the cooling surface. A flow occurs. Thereby, it can suppress effectively that the temperature distribution of the said cooling surface perpendicular | vertical direction is formed in a refrigerant | coolant flow path.
In the case of the above configuration, it is necessary to consider the position of the orthogonal rib so that the cooling medium generates a flow having a velocity vector in the direction perpendicular to the cooling surface.

In the cooling pipe, the straight fin may be provided with a combination of the orthogonal rib and the inclined rib.
In this case, the cooling medium flowing through each of the divided refrigerant channels flows in the refrigerant circulation direction while moving in the direction perpendicular to the cooling surface by the inclined ribs and the orthogonal ribs. Therefore, the cooling medium can be smoothly moved in the direction perpendicular to the cooling surface.

In the present invention, the inclined ribs can be variously changed in arrangement position, number, inclination angle, length, protrusion height, and the like.
The orthogonal ribs can be variously changed in arrangement position, number, length, protrusion height, and the like.
In addition, even when both the inclined rib and the orthogonal rib are disposed, the combination of the disposed positions can be variously changed.

  The inclined rib and the orthogonal rib can be formed by, for example, directly pressing the straight fin. Moreover, it can also form by adhere | attaching, welding, etc. the separate member used as the said inclination rib and the said orthogonal rib with respect to the said straight fin.

Here, the effect by having arrange | positioned said protrusion part, an inclination rib, and an orthogonal rib is demonstrated in detail.
For example, as shown in FIG. 35, when the protrusion 6 is provided, the velocity vector is set in a direction perpendicular to the refrigerant flow direction Y of the cooling medium W (cooling surface vertical direction X) due to the pressure difference generated thereby. Flow (W1, W2, W3 in the figure) occurs. That is, when the cooling medium W collides with the protrusion 6, the cooling medium W flows along the protrusion 6 (W 1), or flows to the low pressure side so as to bypass the protrusion 6 (W 2). Moreover, even when it does not collide with the protrusion part 6, it changes direction to a low voltage | pressure side, and flows (W3).

In addition, as shown in FIG. 36, when the inclined rib 53 is provided, the velocity vector in the direction perpendicular to the refrigerant flow direction Y of the cooling medium W (cooling surface vertical direction X) due to the pressure difference generated thereby. (W4, W5 in the figure) having That is, the cooling medium W flows along the inclined rib 53 when it does not get over the inclined rib 53 (W4). Further, when the vehicle passes over the inclined rib 53, the flow is changed to the low pressure side (W5).
The orthogonal ribs have the same function and effect as the inclined ribs 53.

Example 1
A semiconductor cooling structure according to an embodiment of the present invention will be described with reference to FIGS.
As shown in FIG. 1, the semiconductor cooling structure 1 of this example includes a semiconductor module 2 containing a semiconductor element 21 and a cooling pipe 3 disposed in close contact with the semiconductor module 2.
The cooling pipe 3 has a refrigerant inlet 311 for introducing the cooling medium and a refrigerant outlet 312 for discharging the cooling medium, and has a refrigerant flow path 32 through which the cooling medium flows from the refrigerant inlet 311 toward the refrigerant outlet 312. Have.
As shown in FIG. 3, the refrigerant flow path 32 is provided with refrigerant moving means for moving the cooling medium in the cooling surface vertical direction X (FIGS. 1 and 2) perpendicular to the cooling surface 33 in close contact with the semiconductor module 2. .

  As shown in FIGS. 2 and 3, the cooling pipe 3 has an intermediate plate 34 that partitions the refrigerant flow path 32 in the cooling surface vertical direction X, and the cooling medium is divided into the first flow path 321 and the first flow path 321 partitioned by the intermediate plate 34. The two flow paths 322 are configured to flow alternately. In FIG. 2, the description of the fins 4 is omitted.

  As shown in FIG. 3 (B), the intermediate plate 34 is disposed at both ends of the cooling surface width direction Z perpendicular to the refrigerant flow direction Y from the refrigerant inlet 311 to the refrigerant outlet 312 and parallel to the cooling surface 33. A communication portion 341 that communicates the 321 and the second flow path 322 is provided. As shown in FIGS. 3A and 3C, the first flow path 321 and the second flow path 322 are each provided with inclined fins 4 formed obliquely with respect to the refrigerant flow direction Y. . The inclined fins 4 in the first flow path 321 and the inclined fins 4 in the second flow path 322 are opposite in inclination direction.

Further, the inclination angle α of the inclined fin 4 with respect to the refrigerant flow direction Y can be set to 45 °, for example.
In this example, the intermediate plate 34 provided with the communication portion 341 and the inclined fin 4 constitute the refrigerant moving means.

  The cooling pipe 3 is composed of a plurality of members made of aluminum or an alloy thereof. That is, as shown in FIG. 2, the cooling pipe 3 brazes a pair of outer shell plates 35 constituting the outer shell portion and an intermediate plate 34 disposed between the pair of outer shell plates 35 at the periphery thereof. It joins by etc. The pair of outer shell plates 35 form recesses that recede in a direction away from each other inside the periphery. A first flow path 321 and a second flow path 322 are formed between the recess and both surfaces of the flat intermediate plate 34, respectively.

  As shown in FIG. 3, the outer shell plate 35 and the intermediate plate 34 have long shapes in the refrigerant flow direction Y. The outer shell plate 35 is formed with a refrigerant inlet 311 and a refrigerant outlet 312 at both ends thereof. Further, the intermediate plate 34 is provided with openings 342 at positions facing the refrigerant inlet 311 and the refrigerant outlet 312 of the outer shell plate 35, respectively. Further, as described above, a pair of communication portions 341 are formed along the refrigerant flow direction Y in the vicinity of both ends of the intermediate plate 35 in the cooling surface width direction Z.

A plurality of inclined fins 4 parallel to each other are disposed between the intermediate plate 34 and the outer shell plate 35. These inclined fins 4 are brazed to either one or both of the intermediate plate 34 and the outer shell plate 35.
As shown in FIG. 3 (A), the inclined fins 4 disposed in the first flow path 321 are directed from the refrigerant inlet 311 toward the upper communication portion 341u in the intermediate plate 34 or from the lower communication portion 341d to the upper side. It is formed toward the communication part 341u or the refrigerant outlet 312.

On the other hand, as shown in FIG. 3C, the inclined fins 4 disposed in the second flow path 322 are directed from the refrigerant inlet 311 toward the lower communication portion 341d of the intermediate plate 34 or the upper communication portion 341u. To the lower communication portion 341 d or the refrigerant outlet 312.
Here, “upper side” and “lower side” are expressions for convenience meaning up and down in FIG. 3, and do not particularly limit the configuration of the present invention. The same applies to the following.

  As shown in FIG. 1, the semiconductor module 2 is disposed in close contact with the main surface (cooling surface 33) of the cooling pipe 3 configured as described above. In this example, the semiconductor module 2 includes two semiconductor elements 21. The semiconductor module 2 has a pair of heat sinks 22 arranged so as to sandwich the two semiconductor elements 21. Further, the semiconductor element 21 is in direct contact with one of the heat radiating plates 22, but a spacer 23 having excellent thermal conductivity is interposed between the semiconductor element 21 and the other heat radiating plate 22.

  Examples of the semiconductor element 21 include a MOSFET (Metal Oxide Semiconductor Field Effect Transistor), an IGBT (Insulated Gate Bipolar Transistor), and a diode. In this example, one semiconductor element 21 built in the semiconductor module 2 is an IGBT, and the other semiconductor element 21 is a flywheel diode.

  In addition, two semiconductor modules 2 are arranged in the refrigerant flow direction Y, two for each of the one cooling surface 33 and the other cooling surface in the cooling pipe 3. Further, an insulating member having excellent thermal conductivity may be interposed between the heat radiating plate 22 and the cooling pipe 3 in the semiconductor module 2.

  The semiconductor cooling structure 1 of this example can be a structure that constitutes a part of a power conversion device such as an inverter. As shown in FIG. 4, a stacked type in which cooling pipes 3 and semiconductor modules 2 are alternately stacked. It has a cooling structure. That is, the cooling pipes 3 adjacent to each other in the stacking direction connect the refrigerant inlet 311 and the refrigerant outlet 312 provided at both ends in the refrigerant flow direction Y to each other by the connecting pipe 36. The cooling pipe 3 disposed at one end in the stacking direction includes a refrigerant introduction pipe 371 for introducing a cooling medium into the entire stack of the cooling pipes 3 and a refrigerant discharge pipe 372 for discharging the cooling medium from the entire stack. Are arranged.

The connecting pipe 36 may be constituted by a part of the outer shell plate 35 constituting a part of the cooling pipe 3, or may be fixed to the refrigerant inlet 311 and the refrigerant outlet 312 using a member different from the cooling pipe 3. Also good.
Further, the cooling pipes 3 arranged at both ends in the stacking direction have cooling surfaces 33 that are in close contact with the semiconductor module 2 only on one side, and the other cooling pipes 3 have cooling surfaces on both sides as shown in FIG. 33.

  With this configuration, the cooling medium W introduced from the refrigerant introduction pipe 371 is distributed to the plurality of cooling pipes 3 via the connection pipe 36. That is, the cooling medium W is introduced from the refrigerant inlet 311 in each cooling pipe 3 and flows through the respective refrigerant flow paths 32. At this time, the cooling medium W performs heat exchange with the semiconductor module 2 disposed in close contact with each cooling pipe 3. The cooling medium W after the heat exchange reaches the refrigerant discharge pipe 372 through the connection pipe 36 from the refrigerant outlet 312 in each cooling pipe 3 and is discharged.

  Cooling media include natural refrigerants such as water and ammonia, water mixed with ethylene glycol antifreeze, fluorocarbon refrigerants such as fluorinate, chlorofluorocarbon refrigerants such as HCFC123 and HFC134a, alcohol refrigerants such as methanol and alcohol, A refrigerant such as a ketone-based refrigerant such as acetone can be used.

Next, the function and effect of this example will be described.
In the semiconductor cooling structure 1, the refrigerant flow means 32 for moving the cooling medium in the cooling surface vertical direction X is provided in the refrigerant flow path 32 of the cooling pipe 3. Therefore, it is possible to suppress the cooling medium introduced into the refrigerant flow path 32 from forming a temperature distribution in the cooling surface vertical direction X. That is, as shown in FIG. 5, when the semiconductor module 2 is disposed in close contact with only one cooling surface 33 in the cooling pipe 3, or as shown in FIG. Even when different semiconductor modules 2 are arranged in close contact with each other, it is possible to prevent the temperature distribution from occurring in the cooling surface vertical direction X in the refrigerant flow path 32.

  As a result, the entire cooling medium supplied to the refrigerant flow path 32 can be efficiently used for heat exchange with the semiconductor element 21. Therefore, the semiconductor cooling structure 1 can improve the cooling efficiency of the semiconductor element 21. The semiconductor module 2 in FIGS. 5 and 6 shows only the semiconductor element 21 and the heat dissipation plate 22 on one side, and other descriptions are omitted.

  As described above, the cooling pipe 3 includes the intermediate plate 34, and the cooling medium is configured to flow alternately through the first flow path 321 and the second flow path 322 partitioned by the intermediate plate 34. . That is, the intermediate plate 34 has communication portions 341 at both ends in the cooling surface width direction Z, and the first flow path 321 and the second flow path 322 are each provided with the inclined fins 4. The inclined fins 4 in the first flow path 321 and the inclined fins 4 in the second flow path 322 are opposite in inclination direction.

  Thereby, the cooling medium introduced into the refrigerant flow path 32 from the refrigerant inlet 311 flows obliquely with respect to the refrigerant flow direction Y along the inclined fins 4 and is guided to one communication portion 341u. Then, the cooling medium moves from the first flow path 321 to the second flow path 322 via the communication portion 341u, and is guided to the other communication portion 341d along the inclined fins 4 in the second flow path 322. The cooling medium moves to the first flow path 321 again through the communication portion 341d. As described above, the cooling medium spirally flows through the refrigerant flow path 32 while moving alternately between the first flow path 321 and the second flow path 322 via the two communication portions 341 (FIGS. 5 and 5). 6). Thereby, a cooling medium can be efficiently moved to the cooling surface perpendicular | vertical direction X, and formation of temperature distribution can be suppressed.

For example, as shown in FIG. 5, when two semiconductor modules 2 are arranged in close contact with each other in the refrigerant flow direction Y only on one cooling surface 33 (side closer to the first flow path 321) of the cooling pipe 3. The cooling medium exchanges heat with the semiconductor module 2 as follows.
That is, first, the cooling medium W introduced into the first flow path 321 from the refrigerant inlet 311 performs heat exchange with the semiconductor module 2 on the upstream side. The cooling medium W that has risen in temperature through this heat exchange moves to the downstream second flow path 322 toward the refrigerant outlet 312 while moving spirally in the refrigerant flow path 32 as described above.

On the other hand, the cooling medium W introduced into the second flow path 322 from the refrigerant inlet 311 spirals in the refrigerant flow path 32 while maintaining a low temperature with little heat exchange with the upstream semiconductor module 2. To the first flow path 321 on the downstream side. The low-temperature cooling medium W transferred to the downstream first flow path 321 performs heat exchange with the downstream semiconductor module 2.
In this way, even when a plurality of semiconductor modules 2 are arranged only on one side of the cooling pipe 3, the plurality of semiconductor modules 2 can be efficiently used by utilizing the entire cooling medium introduced into the refrigerant flow path 32. Can be cooled.

  Further, for example, as shown in FIG. 6, a case where the semiconductor modules 2 having different heat generation amounts are arranged in close contact with both cooling surfaces 33 of the cooling pipe 3 will be considered below. That is, two semiconductor modules 2 </ b> H incorporating the semiconductor element 21 with a large amount of heat generation are arranged in close contact with each other in the refrigerant flow direction Y on the cooling surface 33 on the side close to the first flow path 321 in the cooling pipe 3. In addition, two semiconductor modules 2 </ b> L incorporating the semiconductor element 21 with a small amount of heat generation are arranged in close contact with each other in the refrigerant flow direction Y on the cooling surface 33 near the second flow path 322 in the cooling pipe 3.

In this state, the cooling medium W introduced into the first flow path 321 from the refrigerant inlet 311 exchanges heat with the semiconductor module 2H having a large calorific value, and then moves in a spiral manner in the refrigerant flow path 32 while downstream. Move to second flow path 322. Then, in the second flow path 322 on the downstream side, heat exchange is performed with the semiconductor module 2 </ b> L having a small heat generation amount, and the flow proceeds to the refrigerant outlet 312.
On the other hand, the cooling medium W introduced into the second flow path 322 from the refrigerant inlet 311 exchanges heat with the semiconductor module 2L having a small calorific value, and then moves in a spiral manner in the refrigerant flow path 32 while moving downstream. Move to one flow path 321. Then, in the first flow path 321 on the downstream side, heat exchange is performed with the semiconductor module 2 </ b> H having a large calorific value, and the flow proceeds to the refrigerant outlet 312.

  As described above, even when the semiconductor modules 2 having different heat generation amounts are arranged on both surfaces of the cooling pipe 3, the cooling medium performs heat exchange while moving in the cooling surface vertical direction X. It can suppress that temperature distribution arises in the direction X, and can suppress that a difference arises in cooling efficiency in the both surfaces side of the cooling pipe 3. FIG. The plurality of semiconductor modules 2 can be efficiently cooled using the entire cooling medium.

  Further, as described above, the cooling medium moves obliquely along the fins in the first flow path 321 and the second flow path 322, and can also move efficiently in the cooling surface width direction Z. It is also possible to suppress the formation of a temperature distribution for. Therefore, the cooling efficiency of the semiconductor element 21 can be sufficiently improved.

  As described above, according to this example, it is possible to provide a semiconductor cooling structure with excellent cooling efficiency of a semiconductor element.

(Example 2)
In this example, as shown in FIG. 7, the individual inclined fins 4 are shortened, and the inclined fins 4 adjacent to each other in the forming direction are offset.
In the first embodiment, as shown in FIG. 3, the inclined fin 4 extends from the vicinity of the refrigerant inlet 311 to the communication portion 341 in the intermediate plate 34, or from one communication portion 341 to the other communication portion 341, or the communication portion. It is continuously formed from 341 to the vicinity of the refrigerant outlet 312.

On the other hand, in this example, as shown in FIG. 7, while having the same directionality as described above, the short inclined fins 4 are intermittently formed, and the inclined fins 4 are offset from each other. Yes.
Others are the same as in the first embodiment.
Also in the case of this example, the same effect as Example 1 can be obtained.

( Comparative Example 1 )
In this example, as shown in FIGS. 8 to 10, the cooling pipe 3 is provided with straight fins 5 that divide the refrigerant flow path 32 in the cooling surface width direction Z and that are formed in parallel with the refrigerant flow direction Y. 5 is an example in which a plurality of divided refrigerant flow paths 323 divided by 5 are provided with protruding portions 6 that partially protrude toward the refrigerant flow path 32 side.
In this example, this protrusion 6 constitutes the refrigerant moving means of the present invention.

  The straight fin 5 is formed by forming an aluminum plate or the like into a rectangular wave shape as shown in FIG. 9, and abuts against the outer shell plate 35 of the cooling pipe 3 at the top surface portion 51 constituting the peak portion of the rectangular wave. Are brazed and joined. The straight fins 5 divide the refrigerant flow path 32 into a plurality in the cooling surface width direction Z, thereby forming a plurality of divided refrigerant flow paths 323.

  In each divided refrigerant channel 323, three protrusions 6 are formed. That is, as shown in FIG. 8, in accordance with the arrangement of the semiconductor elements 21 built in the semiconductor module 2 arranged in close contact with the cooling pipe 3, the protrusions are located at positions corresponding to between the semiconductor elements 21 adjacent to each other in the refrigerant flow direction Y. 6 is formed. As a result, a protruding portion is formed on the upstream side of the position where the semiconductor elements 21 other than the semiconductor element 21 arranged on the most upstream side are disposed.

As shown in FIG. 10, the protrusion 6 is provided by press molding on the outer shell plate 35 that constitutes the outer shell of the cooling pipe 3. And the protrusion part 6 is formed in the position where the top surface part 51 in the straight fin 5 is not contact | abutting. Therefore, the protruding portions 6 in the adjacent divided refrigerant flow paths 323 are formed on the outer shell plates 35 on the opposite sides.
Further, the protruding portion 6 has a substantially hemispherical shape, and the diameter in plan view seen from the protruding direction is substantially equal to the formation interval of the side surface portions 52 of the straight fin 5. Further, the protruding height t1 of the protruding portion 6 is, for example, 20% of the height of the coolant channel 32 in the vertical direction X of the cooling surface.
Others are the same as in the first embodiment.

In the case of this example, since the protrusion 6 is disposed, in the circulating cooling medium, a pressure difference is generated in the cooling surface vertical direction X, and a flow having a velocity vector in the cooling surface vertical direction X is generated. Thereby, formation of the temperature distribution in the refrigerant flow path 32 can be suppressed.
Further, since the protruding portion 6 is disposed upstream of the position where the semiconductor element 21 is disposed, the cooling medium moves in the cooling surface vertical direction X in front of the semiconductor element 21. Therefore, the cooling medium having a relatively low temperature can be brought close to the semiconductor element 21 and the cooling can be performed efficiently.

  In addition, although the protrusion part 6 was provided in the upstream of the semiconductor element 21 other than the most upstream, this is a cooling medium in which the temperature distribution is generated in the cooling surface vertical direction X by exchanging heat with the semiconductor element 21 on the upstream side. This is because the protrusion 6 is particularly useful for suppressing the temperature distribution by moving the element in the vertical direction X of the cooling surface upstream of the semiconductor element 21.

Moreover, since the protrusion part 6 is formed in a part of outer shell part (outer shell plate 35) of the cooling pipe 3, the protrusion part 6 can be formed easily. Further, when the cooling pipe 3 is assembled, the protruding portion 6 can be used as a positioning means for the straight fin 5 and the outer shell portion (outer shell plate 35).
In addition, the same effects as those of the first embodiment are obtained.

( Comparative Example 2 )
In this example, as shown in FIGS. 11 to 15, the straight fins 5 are provided with inclined ribs 53 formed so as to protrude toward the plurality of divided refrigerant flow paths 323.
In this example, the inclined rib 53 constitutes the refrigerant moving means in the present invention.
As shown in FIG. 13, the inclined rib 53 is inclined with respect to the refrigerant flow direction Y and the cooling surface 33.

  The inclined rib 53 is formed on the side surface portion 52 of the straight fin 5 by press molding. Further, as shown in FIG. 12, inclined ribs 53 are formed on both side surfaces 52 of the straight fin 5 so as to protrude from both sides. Since the inclined fins 53 arranged on both sides of the side surface portion 52 cannot be formed so as to overlap each other, they are formed at positions shifted from each other as shown in FIGS. In addition, since the inclined rib 53 is formed by pressing, a concave portion 531 is formed on the surface of the side surface portion 52 opposite to the inclined rib 53.

The inclination angle β of the inclined rib 53 with respect to the refrigerant flow direction Y can be set to 45 °, for example. Further, the protruding height t2 of the inclined rib 53 can be, for example, 10% of the size t3 (FIG. 12) of the fin gap between the adjacent straight fins 5.
Further, as shown in FIGS. 11 and 13, a plurality of inclined ribs 53 are formed along the refrigerant flow direction Y, and the inclined ribs 53 adjacent to the refrigerant flow direction Y are opposite in inclination direction.
Others are the same as in the first embodiment.

  In the case of this example, since the inclined ribs 53 are provided, a pressure difference is generated in the cooling surface vertical direction X in the cooling medium flowing through each divided refrigerant flow path 323, and the velocity in the cooling surface vertical direction X is increased. A flow with vectors occurs. Thereby, formation of the temperature distribution in the refrigerant flow path 32 can be suppressed.

In addition, since the inclined ribs 53 adjacent to each other in the refrigerant flow direction Y have opposite inclination directions, the cooling medium flowing through each of the divided refrigerant flow paths 323 undulates by the inclined ribs 53 and is perpendicular to the cooling surface. The refrigerant flows in the refrigerant distribution direction Y while moving in the direction X. Therefore, the cooling medium can be smoothly moved in the cooling surface vertical direction X.
In addition, the same effects as those of the first embodiment are obtained.

( Comparative Example 3 )
In this example, as shown in FIGS. 16 to 18, the straight fins 5 are provided with tapered ribs 54 formed so as to protrude toward the plurality of divided refrigerant flow paths 323.
As shown in FIG. 17, the taper rib 54 has its longitudinal direction formed along the cooling surface vertical direction X, and gradually protrudes in the cooling surface width direction Y from one end to the other end as shown in FIG. It has such a taper shape.

As shown in FIGS. 16 and 17, the taper rib 54 corresponds to the space between the semiconductor elements 21 adjacent to each other in the refrigerant flow direction Y in accordance with the arrangement of the semiconductor elements 21 built in the semiconductor module 2 arranged in close contact with the cooling pipe 3. Formed in position. Thereby, two taper ribs 54 are arranged in series in the refrigerant flow direction Y for each divided refrigerant flow path 323 on the upstream side of the arrangement position of each semiconductor element 21 other than the semiconductor element 21 arranged on the most upstream side. ing. As shown in FIGS. 18A and 18B, the taper ribs 54 arranged in series have opposite taper directions.
The tapered rib 54 can be formed by press-molding the side surface portion 52 of the straight fin 5 in the same manner as the inclined rib 53 in the comparative example 2 .
Others are the same as in the first embodiment.

In the case of this example, by appropriately providing the tapered fins 54 as described above, the cross-sectional area of the divided refrigerant flow path 323 at that portion can be changed along the cooling surface vertical direction X (FIG. 18). Thereby, when the cooling medium passes through the divided refrigerant flow path 323 in the portion where the tapered fins 54 are provided, a flow in which the cooling medium moves in the vertical direction X of the cooling surface is generated. Therefore, it is possible to effectively suppress the formation of the temperature distribution in the cooling surface vertical direction X in the refrigerant flow path 32.
In addition, the same effects as those of the first embodiment are obtained.

( Comparative Example 4 )
In this example, as shown in FIGS. 19 to 21, the cooling pipe 3 is provided with an intermediate plate 34 that partitions the refrigerant flow path 32 in the cooling surface vertical direction X, and the first flow path 321 partitioned by the intermediate plate 34 and the first flow path 321. The two flow paths 322 are provided with straight fins 5 that are divided in the cooling surface width direction Z and parallel to the refrigerant flow direction Y, and are divided by the straight fins 5. This is an example in which the protruding portion 6 that partially protrudes toward the refrigerant flow path 32 is disposed on the H.323.
In this example, this protrusion 6 constitutes the refrigerant moving means of the present invention.

  As shown in FIG. 20, the cooling pipe 3 has an intermediate plate 34 that partitions the coolant flow path 32 in the cooling surface vertical direction X. The cooling medium is configured to flow through the first flow path 321 and the second flow path 322 that are partitioned by the intermediate plate 34. That is, the intermediate plate 34 does not have the communication portion 341 (see FIGS. 2 and 3) that communicates the first flow path 321 and the second flow path 322 as in the first embodiment. The first flow path 321 and the second flow path 322 are completely partitioned and are configured not to communicate with each other.

  As shown in the figure, the straight fins 5 are provided in the first flow path 321 and the second flow path 322 in directions facing each other with the intermediate plate 34 interposed therebetween. The straight fin 5 formed in a rectangular wave shape is brought into contact with the outer shell plate 35 and the intermediate plate 34 of the cooling pipe 3 at the top surface portion 51 constituting the peak portion of the rectangular wave, and is brazed and joined. . By the straight fins 5, the first flow path 321 and the second flow path 322, which are the refrigerant flow paths 32, are each divided into a plurality in the cooling surface width direction Z, and a plurality of divided refrigerant flow paths 323 are formed.

  And as shown in FIG. 19, the protrusion part 6 is formed in every other divided refrigerant | coolant flow path 323. As shown in FIG. Further, the protrusion 6 is formed at a position corresponding to between the semiconductor elements 21 adjacent to each other in the refrigerant flow direction Y in accordance with the arrangement of the semiconductor elements 21 built in the semiconductor module 2 arranged in close contact with the cooling pipe 3. . Thereby, the protrusions 6 are formed on the upstream side of the arrangement positions of the semiconductor elements 21 other than the semiconductor element 21 arranged on the most upstream side.

Moreover, as shown in FIG. 21, the protrusion part 6 is provided in the intermediate | middle plate 34 by press molding. The protruding portion 6 is formed at a position where the top surface portion 51 of the straight fin 5 is not in contact with the intermediate plate 34. Further, the protruding portions 6 are formed so as to protrude alternately on the first flow path 321 side or the second flow path 322 side.
Others are the same as in the first embodiment.

In the case of this example, in the first flow path 321 and the second flow path 322, the protrusion 6 is disposed, so that a pressure difference occurs in the cooling surface vertical direction X in the circulating cooling medium, and the cooling surface A flow having a velocity vector in the vertical direction X is generated. Thereby, formation of the temperature distribution in the refrigerant flow path 32 can be suppressed.
Further, since the protruding portion 6 is disposed upstream of the position where the semiconductor element 21 is disposed, the cooling medium moves in the cooling surface vertical direction X in front of the semiconductor element 21. Therefore, the cooling medium having a relatively low temperature can be brought close to the semiconductor element 21 and the cooling can be performed efficiently.

Moreover, since the protrusion part 6 is formed in a part of intermediate | middle plate 34, the protrusion part 6 can be formed easily. Further, when assembling the cooling pipe 3, the protruding portion 6 can be used as a means for positioning the straight fin 5 and the intermediate plate 34.
In addition, the same effects as those of the first embodiment are obtained.

Moreover, it can also be set as the structure shown in FIGS. 22-24 as another example.
That is, as shown in FIG. 23, the straight fins 5 are provided in the same direction with the intermediate plate 34 interposed between the first flow path 321 and the second flow path 322, respectively. Further, as shown in FIG. 22, the protruding portions 6 are formed in all the divided refrigerant flow paths 323. Further, as shown in FIG. 24, the protruding portions 6 have the same shape as the rectangular wave shape of the straight fins 5 and are formed so as to alternately protrude toward the first flow path 321 side or the second flow path 322 side.
Others are the same as Example 1, and have the same effect.

( Comparative Example 5 )
In this example, as shown in FIGS. 25 to 31, the straight fin 5 is provided with inclined ribs 53 formed so as to protrude toward the plurality of divided refrigerant flow paths 323, and the positions and number of the inclined ribs 53 are arranged. It is the example which changed variously variously. In this example, the inclined rib 53 constitutes the refrigerant moving means in the present invention.
Incidentally, FIGS. 25 31 are views at the same position as 13 in Comparative Example 2. Other configurations are basically the same as those in Comparative Example 2 .

  In the example of FIG. 25, a plurality (six) of the inclined ribs 53 are formed along the refrigerant flow direction Y. The plurality of inclined ribs 53 formed in the refrigerant flow direction Y forms a plurality (three) of inclined rib groups 53Y including the inclined ribs 53 having the same inclination direction. The inclined ribs 53 in the inclined rib group 53Y adjacent to the refrigerant flow direction Y are opposite in inclination direction.

  In the example of FIGS. 26 and 27, a plurality (eight) of the inclined ribs 53 are formed along the refrigerant flow direction Y, and a plurality (two or three) are formed also in the cooling surface vertical direction X. Has been. The inclined ribs 53 adjacent to each other in the refrigerant distribution direction Y have opposite inclination directions. The inclined ribs 53 adjacent in the cooling surface vertical direction X are opposite in inclination direction.

  28 and 29, a plurality (eight) of the inclined ribs 53 are formed along the refrigerant flow direction Y, and a plurality (two or three) are formed also in the cooling surface vertical direction X. Has been. The plurality of inclined ribs 53 formed in the refrigerant flow direction Y forms a plurality (four) of inclined rib groups 53Y including the inclined ribs 53 having the same inclination direction. The inclined ribs 53 in the inclined rib group 53Y adjacent to the refrigerant flow direction Y are opposite in inclination direction. The inclined ribs 53 adjacent in the cooling surface vertical direction X are opposite in inclination direction.

  In the example of FIG. 30, a plurality (eight) of the inclined ribs 53 are formed along the refrigerant flow direction Y, and a plurality (four) of the inclined ribs 53 are also formed in the cooling surface vertical direction X. The plurality of inclined ribs 53 formed in the cooling surface vertical direction X form a plurality (two) of inclined rib groups 53X including the inclined ribs 53 having the same inclination direction. The inclined ribs 53 adjacent to each other in the refrigerant distribution direction Y have opposite inclination directions. The inclined ribs 53 in the inclined rib group 35X adjacent to the cooling surface vertical direction X are opposite in inclination direction.

  In the example of FIG. 31, a plurality (eight) of inclined ribs 53 are formed along the refrigerant flow direction Y, and a plurality (four) of the inclined ribs 53 are also formed in the cooling surface vertical direction X. The plurality of inclined ribs 53 formed in the refrigerant flow direction Y forms a plurality (four) of inclined rib groups 53Y including the inclined ribs 53 having the same inclination direction. The plurality of inclined ribs 53 formed in the cooling surface vertical direction X form a plurality (two) of inclined rib groups 53X including the inclined ribs 53 having the same inclination direction. The inclined ribs 53 in the inclined rib group 53Y adjacent to the refrigerant flow direction Y are opposite in inclination direction. The inclined ribs 53 in the inclined rib group 53X adjacent in the cooling surface vertical direction X are opposite in inclination direction.

In any case, since the inclined ribs 53 are arranged, a pressure difference is generated in the cooling surface vertical direction X in the cooling medium flowing through each divided refrigerant flow path 323, and the cooling surface vertical direction X is increased. A flow with a velocity vector occurs. Thereby, formation of the temperature distribution in the refrigerant flow path 32 can be suppressed.
Further, the cooling medium flowing through each divided refrigerant channel 323 flows in the refrigerant distribution direction Y while moving in the cooling surface vertical direction X while being swung by the inclined ribs 53. Therefore, the cooling medium can be smoothly moved in the cooling surface vertical direction X.
In addition, the same effects as those of the first embodiment are obtained.

( Comparative Example 6 )
In this example, as shown in FIGS. 32 and 33, the straight fin 5 is provided with the inclined ribs 53 and the orthogonal ribs 55 formed so as to protrude toward the plurality of divided refrigerant flow paths 323. Here, the orthogonal rib 55 is formed in a direction orthogonal to the refrigerant flow direction Y and the cooling surface 33. In this example, the inclined rib 53 and the orthogonal rib 55 constitute the refrigerant moving means in the present invention.
Incidentally, FIG. 32, FIG. 33 is a diagram in the same position as 13 in Comparative Example 2. Other configurations are basically the same as those in Comparative Example 2 .

  In the example of FIG. 32, a plurality (four) of inclined ribs 53 are formed along the refrigerant flow direction Y. The inclined ribs adjacent to each other in the refrigerant flow direction Y have opposite inclination directions. A plurality (three) of orthogonal ribs 55 are formed between the inclined ribs 53.

  In the example of FIG. 33, a plurality (four) of inclined ribs 53 are formed along the refrigerant flow direction Y, and a plurality (two) of the inclined ribs 53 are also formed in the cooling surface vertical direction X. The inclined ribs 53 adjacent to each other in the refrigerant distribution direction Y have opposite inclination directions. The inclined ribs 53 adjacent in the cooling surface vertical direction X are opposite in inclination direction. Further, a plurality (five) of orthogonal ribs 55 are formed between the inclined ribs 53.

In the case of this example, the cooling medium flowing through each divided refrigerant channel 323 moves in the cooling surface vertical direction X by the inclined rib 53 and the orthogonal rib 55. Therefore, it is possible to effectively suppress the formation of the temperature distribution in the cooling surface vertical direction X in the refrigerant flow path 32.
Further, the cooling medium flowing through each divided refrigerant channel 323 flows in the refrigerant distribution direction Y while moving in the cooling surface vertical direction X while being swung by the inclined ribs 53 and the orthogonal ribs 55. Therefore, the cooling medium can be smoothly moved in the cooling surface vertical direction X.
In addition, the same effects as those of the first embodiment are obtained.

( Comparative Example 7 )
In this example, as shown in FIG. 34, the straight fin 5 is provided with only the orthogonal rib 55 formed so as to protrude toward the plurality of divided refrigerant flow paths 323. Here, the orthogonal rib 55 is formed in a direction orthogonal to the refrigerant flow direction Y and the cooling surface 33. In this example, the orthogonal rib 55 constitutes the refrigerant moving means in the present invention.
Incidentally, FIG. 34 is a diagram in the same position as 13 in Comparative Example 2. Other configurations are basically the same as those in Comparative Example 2 .

  In the example of FIG. 34, a plurality (eight) of the orthogonal ribs 55 are formed along the refrigerant flow direction Y. And the orthogonal rib 55 formed in the one outer shell plate 35 side and the orthogonal rib 55 formed in the other outer shell plate 35 side are arrange | positioned alternately.

In the case of this example, since the orthogonal rib 55 is provided, in the cooling medium flowing through each divided refrigerant flow path 323, a pressure difference is generated in the cooling surface vertical direction X, and the speed is increased in the cooling surface vertical direction X. A flow with vectors occurs. Thereby, in the refrigerant flow path 32, it can suppress effectively that the temperature distribution of the cooling surface perpendicular | vertical direction X is formed.
In addition, the cooling medium flowing through each divided refrigerant flow path 323 flows in the refrigerant distribution direction Y while moving in the cooling surface vertical direction X while being swung by the orthogonal ribs 55. Therefore, the cooling medium can be smoothly moved in the cooling surface vertical direction X.
In addition, the same effects as those of the first embodiment are obtained.

FIG. 3 is an explanatory diagram of a semiconductor cooling structure in the first embodiment. FIG. 3 is a cross-sectional view of the cooling pipe in a plane orthogonal to the refrigerant flow direction Y in the first embodiment. (A) AA arrow sectional view of FIG. 1, (B) BB arrow sectional view of FIG. 1, (C) CC arrow sectional view of FIG. FIG. 3 is an explanatory diagram of a power conversion device using a semiconductor cooling structure in the first embodiment. FIG. 3 is an explanatory diagram of the flow of the cooling medium flowing in the cooling pipe in which the semiconductor module is closely disposed on one surface in the first embodiment. Explanatory drawing of the flow of the cooling medium which flows into the cooling pipe in which the semiconductor module from which the emitted-heat amount differs in both surfaces in Example 1 was arrange | positioned closely. In Example 2, (A) AA cross-sectional equivalent view of FIG. 1, (B) B-B cross-sectional equivalent view of FIG. 1, (C) CC cross-sectional view of FIG. Equivalent figure. Explanatory drawing of the semiconductor cooling structure in the comparative example 1. FIG. Sectional drawing of the cooling pipe in the plane orthogonal to the refrigerant | coolant distribution direction Y in the comparative example 1. FIG. In Comparative Example 1, D-D sectional view taken along line corresponding partial sectional view of FIG. The perspective view of the straight fin which provided the inclination rib in the comparative example 2. FIG. In Comparative Example 2, E-E sectional view taken along line equivalent diagram of Figure 11. (A) Explanatory drawing equivalent to the FF line | wire arrow cross section of FIG. 12 in the comparative example 2 , (B) Explanatory drawing equivalent to the GG line arrow cross section of FIG. Explanatory drawing of the inclination rib in the comparative example 2. FIG. In Comparative Example 2, H-H cross-sectional view taken along line of FIG. 14. Explanatory drawing of the semiconductor cooling structure in the comparative example 3. FIG. Explanatory drawing of the taper rib in the comparative example 3. FIG. In Comparative Example 3, (A) I-I sectional view taken along line of FIG. 17, (B) J-J cross-sectional view taken along line of FIG. 17. Explanatory drawing of the semiconductor cooling structure in the comparative example 4. FIG. Sectional drawing of the cooling pipe in the plane orthogonal to the refrigerant | coolant distribution direction Y in the comparative example 4. FIG. In Comparative Example 4, K-K cross-sectional view taken along line corresponding partial sectional view of FIG. 19. Explanatory drawing of the semiconductor cooling structure in another example of the comparative example 4. FIG. Sectional drawing of the cooling pipe in the plane orthogonal to the refrigerant | coolant distribution direction Y in the other example of the comparative example 4. FIG. FIG. 23 is a partial cross-sectional view corresponding to a cross section taken along line LL in FIG. 22 in another example of Comparative Example 4 ; Explanatory drawing which shows the arrangement | positioning position of the inclination rib provided in the straight fin in the comparative example 5. FIG. Explanatory drawing which shows the arrangement | positioning position of the inclination rib provided in the straight fin in the comparative example 5. FIG. Explanatory drawing which shows the arrangement | positioning position of the inclination rib provided in the straight fin in the comparative example 5. FIG. Explanatory drawing which shows the arrangement | positioning position of the inclination rib provided in the straight fin in the comparative example 5. FIG. Explanatory drawing which shows the arrangement | positioning position of the inclination rib provided in the straight fin in the comparative example 5. FIG. Explanatory drawing which shows the arrangement | positioning position of the inclination rib provided in the straight fin in the comparative example 5. FIG. Explanatory drawing which shows the arrangement | positioning position of the inclination rib provided in the straight fin in the comparative example 5. FIG. Explanatory drawing which shows the arrangement | positioning position of the inclination rib and orthogonal rib which were provided in the straight fin in the comparative example 6. FIG. Explanatory drawing which shows the arrangement | positioning position of the inclination rib and orthogonal rib which were provided in the straight fin in the comparative example 6. FIG. Explanatory drawing which shows the arrangement | positioning position of the orthogonal rib provided in the straight fin in the comparative example 7. FIG. Explanatory drawing which shows the effect in the case of providing the inclination rib in this invention. Explanatory drawing which shows the effect in the case of providing the protrusion part in this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Semiconductor cooling structure 2 Semiconductor module 21 Semiconductor element 3 Cooling pipe 311 Refrigerant inlet 312 Refrigerant outlet 32 Refrigerant flow path 4 Inclined fin 5 Straight fin 53 Inclined rib 6 Protruding part X Cooling surface perpendicular direction Y Refrigerant flow direction Z Cooling surface width direction

Claims (1)

In a semiconductor cooling structure having a semiconductor module containing a semiconductor element, and a cooling pipe arranged in close contact with the semiconductor module,
The cooling pipe has a refrigerant inlet for introducing a cooling medium and a refrigerant outlet for discharging the cooling medium, and has a refrigerant flow path for circulating the cooling medium from the refrigerant inlet toward the refrigerant outlet. And
The said refrigerant passage, Ri Na provided refrigerant moving means for moving the cooling medium to have a velocity vector perpendicular to the cooling surface perpendicular to the cooling surface in close contact with the semiconductor module,
The cooling pipe has an intermediate plate that partitions the refrigerant flow path in a direction perpendicular to the cooling surface, and the cooling medium flows alternately through the first flow path and the second flow path partitioned by the intermediate plate. Has been
The intermediate plate communicates the first flow path and the second flow path at both ends in the cooling surface width direction orthogonal to the refrigerant flow direction from the refrigerant inlet to the refrigerant outlet and parallel to the cooling surface. Having a communication part,
The first flow path and the second flow path are each provided with inclined fins formed obliquely with respect to the refrigerant flow direction and the cooling surface width direction,
The inclined fins in the first flow path and the inclined fins in the second flow path are opposite in inclination direction,
The inclined fin is formed between the pair of communicating portions in the intermediate plate,
The semiconductor module opposes the inclined fin and opposes a cooling medium that moves obliquely between the pair of communicating portions along the inclined fin with respect to the refrigerant flow direction and the cooling surface width direction. A semiconductor cooling structure characterized by being arranged to do so .

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