JP6544586B2 - Cooling system - Google Patents

Description

  The present invention relates to a cooling device provided with a cooling pipe which is disposed so that a heating element is in contact with an outer peripheral surface and which cools the heating element when a refrigerant flows.

  Conventionally, a laminated type cooling device disclosed in, for example, Patent Document 1 shown below as a cooling device provided with a cooling pipe that is disposed so that the heating element contacts the outer peripheral surface and cools the heating element when the refrigerant flows There is.

  The stacked cooling system includes a plurality of cooling pipes. The cooling pipe is a member which is disposed so that the electronic component is in contact with the outer peripheral surface, and cools the electronic component when the refrigerant flows, and is a member having a rectangular cross section. The cooling pipe includes first and second pipe walls, first and second side walls, first to fourth flow paths, and first and second refrigerant switching portions.

  The first and second pipe walls are rectangular portions opposed in the thickness direction of the cooling pipe. The first and second side wall portions are rectangular portions opposed in the width direction of the cooling pipe.

  The first to fourth channels are channels whose cross sections through which the refrigerant flows are rectangular. The first to fourth flow paths are provided in this order in the thickness direction of the cooling pipe from one end to the other end of the cooling pipe. The first refrigerant switching unit causes the refrigerant flowing through the first flow passage to flow into the second flow passage at the central portion in the longitudinal direction of the cooling pipe, and causes the refrigerant flowing through the second flow passage to be the first flow passage It is a site to flow into the The second refrigerant switching unit causes the refrigerant flowing through the third flow path to flow into the fourth flow path at the central portion in the longitudinal direction of the cooling pipe, and causes the refrigerant flowing through the fourth flow path to form the third flow path It is a site to flow into the

  The first pipe wall includes a first upstream cooling surface and a first downstream cooling surface. The first upstream cooling surface is a portion on the upstream side of the first refrigerant switching unit. The first downstream cooling surface is a portion on the downstream side of the first refrigerant switching unit. The second pipe wall includes a second upstream cooling surface and a second downstream cooling surface. The second upstream cooling surface is a portion on the upstream side of the second refrigerant switching unit. The second downstream side cooling surface is a portion downstream of the second refrigerant switching unit.

  The electronic component is disposed to be in contact with the first upstream cooling surface, the first downstream cooling surface, the second upstream cooling surface, and the second downstream cooling surface.

  The electronic component disposed on the first upstream cooling surface is cooled by the refrigerant flowing through the upstream first flow passage. The electronic component disposed on the first downstream side cooling surface is cooled by the refrigerant flowing from the upstream second flow passage into the downstream first flow passage via the first refrigerant switching unit. The electronic component disposed on the second upstream side cooling surface is cooled by the refrigerant flowing through the fourth upstream flow passage. The electronic component disposed on the second downstream side cooling surface is cooled by the refrigerant flowing from the upstream third flow passage to the downstream fourth flow passage via the second refrigerant switching unit. Thus, the electronic components disposed on the first and second downstream side cooling surfaces can be cooled by the low temperature refrigerant.

JP, 2010-177484, A

  In the cooling device described above, the cooling pipe includes the first to fourth flow paths and the first and second refrigerant switching portions. The first to fourth flow paths are provided side by side in the thickness direction of the cooling pipe from one end to the other end of the cooling pipe. The first and second refrigerant switching units are provided at the central portion in the longitudinal direction of the cooling pipe.

  The first and second flow paths are the same as the third and fourth flow paths, and the first refrigerant switching portion is the same as the second refrigerant switching portion. When it is going to cool electronic parts arranged on the upstream side and downstream side of one tube wall, two flow paths must be provided side by side in the thickness direction of the cooling tube from one end to the other end of the cooling tube You must. Therefore, the dimension in the thickness direction of the cooling pipe can not be reduced.

  The present invention has been made in view of such circumstances, and it is an object of the present invention to provide a cooling device capable of partially reducing the dimension in the thickness direction of the cooling pipe while securing the cooling effect. .

  The present invention made in order to solve the above-mentioned problems is a cooling device provided with at least one cooling pipe which is disposed so that a heat generating body is in contact with an outer peripheral surface and cools the heat generating body by flowing a refrigerant. The cooling pipe includes an upstream first flow path formed on the upstream side, an upstream second flow path formed side by side in the width direction of the cooling pipe with respect to the upstream first flow path, and an upstream side first flow path. A downstream first flow channel formed a predetermined distance on the downstream side of the flow channel, a downstream second flow channel formed a predetermined distance on the downstream side of the upstream second flow channel, and an upstream side A third flow path connecting the first flow path to the downstream second flow path, and a fourth flow path connecting the upstream second flow path to the downstream first flow path; And the fourth flow path, one flow path is formed on the downstream side of the upstream first flow path and the upstream second flow path, and the other flow path is the cooling pipe with respect to one flow path. Are formed side by side and constitute a projecting portion projecting in the thickness direction of the cooling pipe, and the first heat generating member is arranged to be in contact with the outer peripheral surface of the cooling pipe adjacent to the upstream first flow passage The second heat generating body is disposed to be in contact with the outer peripheral surface of the cooling pipe adjacent to the downstream first flow path.

  According to this configuration, the first heat generating body is disposed on the outer peripheral surface of the cooling pipe adjacent to the upstream first flow passage. The second heat generating body is disposed on the outer peripheral surface of the cooling pipe adjacent to the downstream first flow path. The first heat generating body is cooled by the refrigerant flowing in the upstream first flow path. The refrigerant used for cooling the first heat generating body and whose temperature has risen flows into the downstream second flow passage via the third flow passage. The refrigerant flowing in the upstream second flow passage which is not used for cooling the first heat generating body and whose temperature has not risen flows into the downstream first flow passage via the fourth flow passage. The second heat generating body is cooled by the refrigerant whose temperature has not risen and which has flowed into the downstream first flow channel from the upstream second flow channel via the fourth flow channel. Therefore, the second heating element can be cooled by the refrigerant whose temperature has not risen. Therefore, both the first and second heating elements can be reliably cooled. Moreover, while the third flow path and the fourth flow path are formed on the downstream side of the upstream first flow path and the upstream second flow path, one flow path is formed in one flow path. On the other hand, it is formed side by side in the thickness direction of the cooling pipe, and constitutes a projecting portion which protrudes in the thickness direction of the cooling pipe. Therefore, the dimension in the thickness direction of the cooling pipe can be partially reduced. Therefore, the dimension in the thickness direction of the cooling pipe can be partially reduced while securing the cooling effect.

It is a perspective view of a cooling device in a 1st embodiment. It is a front view of a cooling device shown in Drawing 1 seen from the upper stream side. It is a side view of the cooling device shown in FIG. It is 4-4 arrow sectional drawing in FIG. It is 5-5 arrow sectional drawing in FIG. It is 6-6 arrow sectional drawing in FIG. It is explanatory drawing corresponding to FIG. 4 for demonstrating the subsequent flow of the refrigerant | coolant which flows through an upstream side 1st flow path. It is explanatory drawing corresponding to FIG. 5 for demonstrating the subsequent flow of the refrigerant | coolant which flows through an upstream side 1st flow path. It is explanatory drawing corresponding to FIG. 4 for demonstrating the subsequent flow of the refrigerant | coolant which flows through an upstream 2nd flow path. It is explanatory drawing corresponding to FIG. 6 for demonstrating the subsequent flow of the refrigerant | coolant which flows through an upstream 2nd flow path. It is a front view of the cooling device seen from the upper stream side of the 1st modification to a 1st embodiment. It is a side view of the cooling device shown in FIG. It is sectional drawing corresponding to FIG. 4 of the 2nd modification with respect to 1st Embodiment. It is 14-14 arrow sectional drawing in FIG. It is 15-15 arrow sectional drawing in FIG. It is sectional drawing corresponding to FIG. 4 in 2nd Embodiment. It is 17-17 arrow sectional drawing in FIG. FIG. 18 is a cross-sectional view taken along line 18-18 in FIG. It is a front view of a cooling device seen from the upper stream side in a 3rd embodiment. It is a side view of the cooling device shown in FIG. It is a front view of the cooling device seen from the upper stream side in a 4th embodiment. It is a side view of the cooling device shown in FIG. It is a front view of the cooling device seen from the upper stream side of the modification to a 4th embodiment. It is a side view of the cooling device shown in FIG. FIG. 6 is a sectional view corresponding to FIG. 5 of a variant for all embodiments. FIG. 5 is a sectional view corresponding to FIG. 4 of a variant for all embodiments.

  Next, the present invention will be described in more detail by way of embodiments.

First Embodiment
First, the configuration of the cooling device according to the first embodiment will be described with reference to FIGS. 1 to 6.

  The cooling device 1 shown in FIGS. 1 to 3 is a device for cooling the heating elements H10 and H11. Here, the heating elements H10 and H11 are rectangular plate-like switching elements that generate heat when current flows. The cooling device 1 includes a cooling pipe 10.

  The cooling pipe 10 is a member which is disposed such that the heat generating members H10 and H11 are in contact with the outer peripheral surface and which cools the heat generating members H10 and H11 when the refrigerant flows. As shown in FIGS. 4 to 6, the cooling pipe 10 includes the upstream first flow passage 100, the upstream second flow passages 101 and 102, the downstream first flow passage 103, and the downstream second flow passage. A third flow path 106 and a fourth flow path 107 are provided. The cooling pipe 10 divides each flow path.

  The upstream first flow passage 100 is a flow passage formed on the upstream side of the flow of the refrigerant, through which the refrigerant flows. Specifically, the cross section is a channel having a rectangular shape.

  The upstream second flow paths 101 and 102 are flow paths that are formed along the width direction of the cooling pipe 10 with respect to the upstream first flow path 100 and through which the refrigerant flows. Specifically, the cross sections formed on both sides of the upstream first flow channel 100 are rectangular flow channels. The upstream second flow passages 101 and 102 have the same flow passage cross-sectional shape and flow passage cross-sectional area as the upstream first flow passage 100.

  The downstream first flow path 103 is a flow path formed by a predetermined distance on the downstream side in the longitudinal direction of the cooling pipe 10 of the upstream first flow path 100, through which the refrigerant flows. Specifically, the cross section is the same flow channel as the upstream first flow channel 100. The downstream first flow passage 103 has the same flow passage cross-sectional shape and flow passage cross-sectional area as the upstream first flow passage 100.

  The downstream second flow paths 104 and 105 are flow paths through which the refrigerant flows, which are formed on the downstream side of the cooling pipe 10 in the longitudinal direction of the upstream second flow paths 101 and 102 at a predetermined distance. Specifically, the cross section is the same flow channel as the upstream second flow channels 101 and 102. The downstream second flow channels 104 and 105 have the same flow channel cross-sectional shape and flow channel cross-sectional area as the upstream second flow channels 101 and 102.

  The third flow path 106 is a flow path connecting the upstream first flow path 100 to the downstream second flow paths 104 and 105. The fourth flow path 107 is a flow path connecting the upstream second flow paths 101 and 102 to the downstream first flow path 103. The fourth flow path 107 is a central portion in the longitudinal direction of the cooling pipe 10 and is formed on the downstream side of the cooling pipe 10 in the upstream first flow path 100 and the upstream second flow path 101, 102 in the longitudinal direction There is. The third flow path 106 is formed side by side in the thickness direction of the cooling pipe 10 with respect to the fourth flow path 107. The third flow passage 106 constitutes a protruding portion 108 which protrudes in the thickness direction of the cooling pipe 10.

  The heating element H10, which is the first heating element, is disposed to be in contact with the outer peripheral surface of the cooling pipe 10 adjacent to the upstream first flow passage 100. Specifically, it is arranged to be in contact with the outer peripheral surface on the opposite side of the protrusion.

  The heating element H11, which is a second heating element, is disposed in contact with the outer peripheral surface of the cooling pipe 10 adjacent to the downstream first flow path 103. Specifically, it is arranged to be in contact with the outer peripheral surface on the opposite side of the protrusion.

  Next, the operation of the cooling device according to the first embodiment will be described with reference to FIGS. 1, 3, 4, and 7 to 10.

  The heating elements H10 and H11 which are switching elements shown in FIGS. 1 and 3 generate heat when current flows. A refrigerant flows in from the upstream side of the cooling pipe 10 in order to cool the heating elements H10 and H11.

  As shown in FIG. 4, the heating element H <b> 10 is disposed on the outer circumferential surface of the cooling pipe 10 adjacent to the upstream first flow passage 100. The heat generating body H11 is disposed on the outer peripheral surface of the cooling pipe 10 adjacent to the downstream first flow path 103.

  As shown in FIGS. 7 and 8, the heating element H <b> 10 is cooled by the refrigerant flowing in the upstream first flow passage 100. The refrigerant used for cooling the heating element H10 and whose temperature has risen flows into the downstream second flow paths 104 and 105 via the third flow path 106.

  As shown in FIGS. 9 and 10, the refrigerant flowing through the upstream second flow passages 101 and 102 which is not used for cooling the heating element H10 and whose temperature has not risen is downstream via the fourth flow passage 107. It flows into the side first flow path 103. The heating element H11 is cooled by the refrigerant whose temperature has not risen and which has flowed into the downstream first flow path 103 from the upstream second flow paths 101 and 102 via the fourth flow path 107. Therefore, the heating element H11 can be cooled by the refrigerant whose temperature has not risen. Therefore, both of the two heating elements H10 and H11 can be reliably cooled.

  Next, the effect of the cooling device of the first embodiment will be described.

  According to the first embodiment, the heating element H <b> 10 is disposed on the outer peripheral surface of the cooling pipe 10 adjacent to the upstream first flow passage 100. The heat generating body H11 is disposed on the outer peripheral surface of the cooling pipe 10 adjacent to the downstream first flow path 103. The heating element H10 is cooled by the refrigerant flowing in the upstream first flow passage 100. The heating element H11 is cooled by the refrigerant whose temperature has not risen and which has flowed into the downstream first flow path 103 from the upstream second flow paths 101 and 102 via the fourth flow path 107. Therefore, the heating element H11 can be cooled by the refrigerant whose temperature has not risen. As a result, both of the two heating elements H10 and H11 can be reliably cooled. In addition, the fourth flow path 107 is formed on the downstream side in the longitudinal direction of the cooling pipe 10 of the upstream first flow path 100 and the upstream second flow paths 101 and 102. The third flow path 106 is formed side by side in the thickness direction of the cooling pipe 10 with respect to the fourth flow path 107, and constitutes a protruding portion 108 which protrudes in the thickness direction of the cooling pipe 10. Therefore, the dimension of the cooling pipe 10 in the thickness direction can be partially reduced. Therefore, the dimension in the thickness direction of the cooling pipe 10 can be partially reduced while securing the cooling effect.

  According to the first embodiment, the fourth flow path 107 is formed on the downstream side in the longitudinal direction of the cooling pipe 10 of the upstream first flow path 100 and the upstream second flow paths 101 and 102. Therefore, the length of the path from the upstream second flow path to the downstream first flow path can be shortened. Therefore, the resistance can be suppressed, and the refrigerant can smoothly flow from the upstream second flow paths 101 and 102 to the downstream first flow path 103. Thereby, the heat generating body H11 can be cooled more reliably.

  According to the first embodiment, the upstream second flow paths 101 and 102 are formed on both sides in the width direction of the cooling pipe 10 of the upstream first flow path 100. The downstream second flow paths 104 and 105 are formed on both sides in the width direction of the cooling pipe 10 of the downstream first flow path 103. Therefore, heat is not directly transmitted to the refrigerant flowing in the upstream first flow passage and the downstream first flow passage 103 from the outside on both side surfaces of the cooling pipe 10. Therefore, it is possible to suppress the deterioration of the cooling performance accompanying the heat conduction from the outside on the both side surfaces of the cooling pipe 10.

  In the first embodiment, the heating elements H10 and H11 are disposed on the side opposite to the projecting portion of the cooling pipe 10. However, the present invention is not limited to this. As shown in FIG.11 and FIG.12, the heat generating body H12 and H13 may be arrange | positioned so that the outer peripheral surface by the side of the protrusion part of the cooling pipe 10 may be contacted. Thus, in the cooling device 1 in which the heating elements H12 and H13 are disposed, the dimension in the thickness direction of the cooling pipe 10 can be reduced by the amount of the heating elements H12 and H13.

  In the first embodiment, the fourth flow path 107 is formed on the downstream side in the longitudinal direction of the cooling pipe 10 of the upstream first flow path 100 and the upstream second flow paths 101 and 102, and the third flow path 106 is formed. Although the example which is formed along with the thickness direction of the cooling pipe 10 with respect to the 4th flow path 107 and has constituted the projection part 108 is given, it is not restricted to this. As shown in FIGS. 13 to 15, the third flow passage 106 is formed on the downstream side of the cooling pipe 10 in the longitudinal direction of the upstream first flow passage 100 and the upstream second flow passage 101, 102, and The flow path 107 may be formed side by side in the thickness direction of the cooling pipe 10 with respect to the third flow path 106 and may constitute the protrusion 108. One of the third flow path 106 and the fourth flow path 107 is formed on the downstream side in the longitudinal direction of the cooling pipe 10 of the upstream first flow path 100 and the upstream second flow path 101, 102. The other flow path may be formed side by side in the thickness direction of the cooling pipe 10 with respect to one flow path, and may constitute the projecting portion 108 which protrudes in the thickness direction of the cooling pipe 10. Thus, the dimension in the thickness direction of the cooling pipe 10 can be partially reduced. Therefore, the dimension in the thickness direction of the cooling pipe 10 can be partially reduced while securing the cooling effect.

Second Embodiment
Next, a cooling device according to a second embodiment will be described. The cooling device of the second embodiment is obtained by changing the cross-sectional area of the downstream first flow passage and the downstream second flow passage with respect to the cooling device of the first embodiment.

  First, the configuration of the cooling device according to the second embodiment will be described with reference to FIGS. 16 to 18.

  As shown in FIGS. 16 to 18, the cooling device 2 includes a cooling pipe 20. The cooling pipe 20 includes an upstream first flow passage 200, an upstream second flow passage 201, 202, a downstream first flow passage 203, a downstream second flow passage 204, 205, and a third flow passage 206. And a fourth flow passage 207.

  The upstream first flow passage 200 and the upstream second flow passages 201 and 202 are the same as the upstream first flow passage 100 and the upstream second flow passages 101 and 102 in the first embodiment.

  The downstream first flow path 203 is a flow path corresponding to the downstream first flow path 103 in the first embodiment. Unlike the downstream first flow passage 103 of the first embodiment, the flow passage cross-sectional area of the downstream first flow passage 203 is set to be larger than the flow passage cross-sectional area of the upstream first flow passage 200. .

  The downstream second flow channels 204 and 205 are flow channels corresponding to the downstream second flow channels 104 and 105 in the first embodiment. Unlike the downstream second flow channels 104 and 105 of the first embodiment, the flow channel cross-sectional area of the downstream second flow channels 204 and 205 is smaller than the flow channel cross-sectional area of the upstream second flow channels 201 and 202. Is set as.

  The third flow passage 206 is a flow passage corresponding to the third flow passage 106 of the first embodiment. The third flow passage 206 constitutes a protruding portion 208 which protrudes in the thickness direction of the cooling pipe 20. The third flow path 206 is set such that the opening of the connection portion with the downstream first flow path 203 is larger than the third flow path 106 of the first embodiment.

  The fourth flow passage 207 is a flow passage corresponding to the fourth flow passage 107 of the first embodiment. The fourth flow path 207 is set such that the opening of the connecting portion with the downstream second flow paths 204 and 205 is smaller than the fourth flow path 107 of the first embodiment.

  The cooling operation of the heat generating body is the same as the cooling device of the first embodiment, and therefore the description thereof is omitted. Next, the effect of the cooling device of the second embodiment will be described.

  According to the second embodiment, the flow passage cross-sectional area of the downstream first flow passage 203 is set to be larger than the flow passage cross-sectional area of the upstream first flow passage 200. Therefore, a large amount of refrigerant can be supplied to the downstream first flow path 203. Therefore, it is possible to reliably cool the downstream heating element H21 which is less likely to be cooled than the heating element H20 disposed on the upstream side.

Third Embodiment
Next, a cooling device of a third embodiment will be described. The cooling device according to the third embodiment includes two cooling pipes, while the cooling device according to the first embodiment includes one cooling pipe and cools two heating elements, and four heating elements It is intended to cool.

  First, the configuration of the cooling device according to the third embodiment will be described with reference to FIGS. 19 and 20. FIG.

  The cooling device 3 shown in FIGS. 19 and 20 is a device for cooling the heating elements H30 to H33. Here, the heating elements H30 to H33 are the same switching elements as the heating elements H10 and H11 of the first embodiment. The cooling device 3 includes cooling pipes 30 and 31.

  The cooling pipes 30, 31 are members corresponding to the cooling pipe 10 of the first embodiment. The cooling pipe 30 has a protrusion 308 formed on the downstream side of the central portion in the longitudinal direction of the cooling pipe 30. A projecting portion 318 is formed on the cooling pipe 31 on the upstream side of the central portion in the longitudinal direction of the cooling pipe 31. The cooling pipes 30, 31 have the same configuration as the cooling pipe 10 of the first embodiment except for the positions where the protrusions 308, 318 are formed. The cooling pipes 30 and 31 are disposed such that the projecting parts 308 and 318 are opposed to and adjacent to the cooling pipes 30 and 31 in the longitudinal direction with the surfaces on which the projecting parts 308 and 318 are formed facing each other.

  The heating elements H30 and H31 are arranged to be in contact with the outer peripheral surface of the cooling pipe 30 on the side opposite to the projecting portion, similarly to the heating elements H10 and H11 of the first embodiment. The heating elements H32 and H33 are arranged to be in contact with the outer peripheral surface of the cooling pipe 31 on the side opposite to the projecting portion, similarly to the heating elements H10 and H11 of the first embodiment.

  The four heating elements are cooled by two cooling pipes, but the cooling operation of the heating elements disposed in the cooling pipes is the same as the cooling device of the first embodiment, and therefore the description thereof is omitted. Next, the effect of the cooling device of the third embodiment will be described.

  According to the third embodiment, the cooling device 3 has two cooling pipes 30 and 31. The cooling pipes 30, 31 are arranged such that the protrusions 308, 318 face in the longitudinal direction of the cooling pipes 30, 31. That is, in a state in which the surfaces on which the protrusions 308 and 318 are formed are opposed to each other, the protrusions 308 and the protrusions 318 are disposed so as not to face each other in the thickness direction of the cooling pipes 30 and 31. Therefore, in the cooling device 3 having the two cooling pipes 30, 31, the dimension in the thickness direction of the cooling pipes 30, 31 can be reduced.

  In the third embodiment, the protrusions 308 and 318 are disposed to face each other in the longitudinal direction of the cooling pipes 30 and 31, but the present invention is not limited to this. The protrusions 308 and 318 may be disposed to face each other at a predetermined distance in the longitudinal direction of the cooling pipes 30 and 31.

Fourth Embodiment
Next, a cooling device according to a fourth embodiment will be described. The cooling device according to the fourth embodiment includes two cooling pipes, whereas the cooling device according to the third embodiment includes two cooling pipes and cools four heating elements, and two heating elements It is intended to cool.

  First, the configuration of the cooling device according to the fourth embodiment will be described with reference to FIGS. 21 and 22. FIG.

  As shown in FIGS. 21 and 22, the cooling device 4 is a device for cooling the heating elements H40 and H41. Here, the heating elements H40 and H41 are the same switching elements as the heating elements H30 and H31 of the third embodiment. The cooling device 4 includes cooling pipes 40 and 41 and heat conducting members 42 and 43.

  The cooling pipes 40 and 41 are the same members as the cooling pipes 30 and 31 of the third embodiment, and are arranged in the same manner as the cooling pipes 30 and 31.

  The heat transfer members 42 and 43 are rectangular columnar members made of a heat conductive material for transferring the heat of the heat generating members H 40 and H 41 to the cooling pipe 40.

  The heating elements H40 and H41 are disposed so as to be in contact with the outer peripheral surface on the projecting portion side of the cooling pipe 40 and to be in contact with the outer peripheral surface on the projecting portion side of the cooling pipe 41 via the heat conducting members 42 and 43 .

  Next, the operation of the cooling device of the fourth embodiment will be described.

  The heating elements H40 and H41 are cooled by the refrigerant flowing through the cooling pipe 40. Further, since the cooling pipe 41 is disposed so as to be in contact with the heat conduction members 42 and 43, the cooling pipe 41 is also cooled by the refrigerant flowing through the cooling pipe 41. Therefore, both of the two heating elements H40 and H41 can be cooled more reliably.

  Next, the effect of the cooling device of the fourth embodiment will be described.

  According to the fourth embodiment, the heat generating members H40 and H41 contact the outer peripheral surface of the cooling pipe 40 on the projecting portion side, and the heat conducting members 42 and 43 on the outer peripheral surface of the cooling pipe 41 on the projecting portion side It is arranged to be in contact. Therefore, the heating elements H40 and H41 are cooled by the refrigerant flowing through the cooling pipe 40 and also cooled by the refrigerant flowing through the cooling pipe 41. Therefore, both of the two heating elements H40 and H41 can be cooled more reliably. Moreover, the heating elements H40 and H41 are disposed on the side of the projecting portion of the cooling pipe 40. Therefore, in the cooling device 4 having the two cooling pipes 40 and 41, the dimension in the thickness direction of the cooling pipes 40 and 41 can be reduced by the size of the heating elements H40 and H41.

  In the fourth embodiment, an example in which the heating elements H40 and H41 are in contact with the protruding portion side of the cooling pipe 41 via the heat conducting members 42 and 43 is described, but the present invention is not limited thereto. As shown in FIGS. 23 and 24, if the heating elements H42 and H43 have a columnar shape and come into contact with the projecting portion side of the cooling pipe 41 without interposing the heat conducting member, the heating elements H42 and H43 are cooled 41 may be in direct contact.

  Further, the first embodiment, the second embodiment using the same cooling pipe as the first embodiment except for the cross-sectional area of the flow path, and the same as the first embodiment except the position where the protrusion is formed In the third and fourth embodiments using the cooling pipe of the third aspect, as shown in FIG. 8 and FIG. 9, the third flow path and the fourth flow path are formed such that the flow of the refrigerant changes almost at right angles But there is no limitation to this. As shown in FIGS. 25 and 26, the third and fourth flow paths may be formed such that the flow of the refrigerant gradually changes. The refrigerant can flow more smoothly.

  The first embodiment, the second embodiment using the same cooling pipe as the first embodiment except for the cross-sectional area of the flow path, and the same cooling as the first embodiment except the position where the protrusion is formed In the third and fourth embodiments using a pipe, an example in which the upstream second flow channel and the downstream second flow channel are formed on both sides of the upstream first flow channel and the downstream first flow channel But it is not limited to this. The upstream second flow passage and the downstream second flow passage may be formed on either one of the upstream first flow passage and the downstream first flow passage.

  In the third and fourth embodiments, although an example in which the same cooling pipe as the first embodiment is used except for the positions where the protrusions are formed is described, the present invention is not limited to this. As in the second embodiment, cooling pipes having different channel cross-sectional areas may be used.

  In the third and fourth embodiments, an example in which the cooling device is configured by two cooling pipes is given, but it is not limited thereto. The cooling device may be composed of three or more cooling pipes. When the cooling pipe is disposed, the configurations of the first to fourth embodiments may be combined and configured.

  The cooling device may be configured by combining the configurations of the first to fourth embodiments, the modification of the first embodiment, and the modification of the fourth embodiment.

  DESCRIPTION OF SYMBOLS 1 ... Cooling device, 10 ... Cooling pipe, 100 ... 1st upstream flow path, 101, 102 ... 2nd upstream flow path, 103 ... 1st downstream flow path, 104 105: downstream second flow path 106: third flow path 107: fourth flow path 108: protruding portion H10, H11: heating element

Claims (8)

The cooling device is provided with at least one cooling pipe (10, 20, 30, 31, 40, 41) which is disposed so that the heat generating body is in contact with the outer peripheral surface and cools the heat generating body when the refrigerant flows. ,
The cooling pipe is
An upstream first flow path (100, 200) formed on the upstream side;
Upstream second flow paths (101, 102, 201, 202) formed in the width direction of the cooling pipe with respect to the upstream first flow path;
A downstream first flow channel (103, 203) formed on the downstream side of the upstream first flow channel at a predetermined distance;
A downstream second flow path (104, 105, 204, 205) formed on the downstream side of the upstream second flow path at a predetermined distance;
A third flow path (106, 206) connecting the upstream first flow path to the downstream second flow path;
A fourth flow path (107, 207) connecting the upstream second flow path to the downstream first flow path;
Have
One of the third flow path and the fourth flow path is formed on the downstream side of the upstream first flow path and the upstream second flow path, and the other flow path is the one side A projection (108, 208, 308, 318, 408, 418) which is formed side by side in the thickness direction of the cooling pipe with respect to the flow path and which protrudes in the thickness direction of the cooling pipe;
The first heat generating body (H10, H20, H30, H32, H40, H42) is arranged to be in contact with the outer peripheral surface of the cooling pipe adjacent to the upstream first flow path,
The cooling device in which the second heating element (H11, H21, H31, H33, H41, H43) is disposed to be in contact with the outer peripheral surface of the cooling pipe adjacent to the downstream first flow path. Two cooling pipes (30, 31, 40, 41) are provided,
The protrusion (308, 408) of one of the cooling pipes and the protrusion (318, 418) of the other cooling pipe are arranged to face in the longitudinal direction of the cooling pipe. Cooling device as described.   The first heat generating body (H42) and the second heat generating body (H43) are in contact with the outer peripheral surface of the one cooling pipe on the protruding portion side, and the outer peripheral surface of the other cooling pipe on the protruding portion side The cooling device according to claim 2, wherein the cooling device is arranged to be in contact with. A heat conducting member (42, 43),
The first heat generating body (H40) and the second heat generating body (H41) are in contact with the outer peripheral surface of the one cooling pipe on the protruding portion side, and the outer peripheral surface of the other cooling pipe on the protruding portion side The cooling device according to claim 2, wherein the cooling device is disposed in contact with the heat conduction member via the heat conduction member.   The first heat generating body (H12, H40, H42) and the second heat generating body (H13, H41, H43) are arranged to be in contact with the outer peripheral surface of the cooling pipe on the protrusion side. Or the cooling device as described in 2.   The cooling device according to any one of claims 1 to 5, wherein a flow passage cross-sectional area of the downstream first flow passage (203) is larger than a flow passage cross-sectional area of the upstream first flow passage (200).   The cooling device according to any one of claims 1 to 6, wherein the one flow passage is the fourth flow passage. The upstream second flow path is formed on both sides of the upstream first flow path,
The cooling device according to any one of claims 1 to 7, wherein the downstream second flow passage is formed on both sides of the downstream first flow passage.

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