JP2022158553A - Cooling device - Google Patents

Abstract

To provide a cooling device that facilitates the cooling property of a heating element.SOLUTION: A cooling device 10 includes: a cooling system 20 (first cooling system) that has a heat radiating member 21 (first heat radiating member) fixed to an upper surface 2a (first surface) of a power card 1 (heating element) via an insulating member 40, and cools the power card 1 by heat exchange between the heat radiating member 21 and a cooling water 25; and a cooling system 30 (second cooling system) that has a heat radiating member 31 (second heat radiating member) fixed to a lower surface 2b (second surface) on the opposite side to the upper surface 2a in the power card 1, and cools the power card 1 by heat exchange between the heat radiating member 31 and a lubricating oil 35 (cooling liquid) having insulation property.SELECTED DRAWING: Figure 1

Description

The present invention relates to cooling devices.

Conventionally, there has been known a cooling device having a heat radiation member fixed to the lower surface of a power card of a PCU as a heating element, and equipped with a water cooling system for cooling the power card by heat exchange between the heat radiation member and cooling water. (See Patent Document 1, for example).

JP 2019-080432 A

In the conventional cooling device described above, since only one side of the power card is cooled by the water cooling system, for example, the cooling performance on the top side of the power card is lower than the cooling performance on the bottom side of the power card. There was a fear that it would be lost.

Further, for example, when cooling both sides of the upper and lower surfaces of the power card using a water cooling system using cooling water and an oil cooling system using a cooling liquid with insulation, cooling with insulation There is a risk that the cooling performance on the liquid side will be lower than the cooling performance on the cooling water side.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object thereof is to provide a cooling device that can easily improve the cooling performance of a heating element.

In order to solve the above-described problems and achieve the object, the cooling device according to the present invention has a first heat radiating member fixed to the first surface of the heating element via an insulating member, the first heat radiating member and a first cooling system for cooling the heat generating element by heat exchange with cooling water, and a second heat radiation member fixed to a second surface of the heat generating element opposite to the first surface, and a second cooling system that cools the heating element by heat exchange between the second heat radiating member and a cooling liquid having insulating properties.

According to the present invention, for example, both sides of the heating element can be cooled by the first cooling system and the second cooling system, while the first heat radiating member is fixed to the first surface via the insulating member. , By fixing the second heat dissipation member to the second surface without an insulating member, the difference between the thermal resistance (heat transfer characteristics) on the first surface side and the heat resistance (heat transfer characteristics) on the second surface side can be made smaller. As a result, for example, the cooling performance on the second surface side (coolant side) can be suppressed from being lower than the cooling performance on the first surface side (cooling water side), and in turn the cooling performance of the heating element is improved. A more cost-effective cooling device can be provided.

FIG. 1 is an exemplary and schematic configuration diagram of a cooling device according to an embodiment. FIG. 2 is an exemplary and schematic cross-sectional view of the first cooling system of the cooling device of the embodiment. FIG. 3 is an exemplary and schematic cross-sectional view of the second cooling system of the cooling device of the embodiment.

Illustrative embodiments of the invention are disclosed below. The configurations of the embodiments shown below and the actions and effects brought about by the configurations are examples. The present invention can be realized by configurations other than those disclosed in the following embodiments. Moreover, according to the present invention, at least one of various effects (including derivative effects) obtained by the configuration can be obtained.

In this specification, ordinal numbers are used only to distinguish parts, members, regions, positions, directions, etc., and do not indicate order or priority.

[Embodiment]
FIG. 1 is a configuration diagram of a cooling device 10 according to an embodiment. As shown in FIG. 1, the cooling device 10 is, for example, a device for cooling a power card 1 of a PCU (Power Control Unit) as a heating element. , and a cooling system 30 for cooling the lower surface 2 b side of the power card 1 .

The upper surface 2a is an example of a first surface, and the cooling system 20 is an example of a first cooling system. Also, the lower surface 2b is an example of a second surface opposite to the first surface, and the cooling system 30 is an example of a second cooling system.

The cooling device 10 is also called, for example, a metal cooling device 10, a cooling device 10 for the power card 1, or the like. The two cooling systems 20 and 30 are also called a cooler, a cooling mechanism, a heat dissipation mechanism, or the like.

The power card 1 has, for example, a case 2, a plurality of elements 3, a lead frame 4, and the like. The case 2 extends in the longitudinal direction of the power card 1 (horizontal direction in FIG. 1) and accommodates the plurality of elements 3 and part of the lead frame 4 .

In this embodiment, for example, three elements 3 are arranged at intervals in the longitudinal direction of the power card 1 . The number of elements 3 is not limited to three, and may be one, two, or four or more. The element 3 is also called a power element or the like.

The lead frame 4 is electrically connected to each of the plurality of elements 3 and is pulled out from both ends of the power card 1 in the longitudinal direction. In addition, the surroundings of the element 3 and the lead frame 4 inside the case 2 may be filled with a sealing material, a molding material, or the like.

FIG. 2 is a cross-sectional view of the cooling system 20 of the cooling device 10. As shown in FIG. As shown in FIG. 2, the cooling system 20 has, for example, a heat radiating member 21, cooling water 25 (see FIG. 1) that exchanges heat with the heat radiating member 21, an insulating member 40, and the like. The cooling system 20 is also called a water cooling system or the like.

The heat dissipation member 21 has, for example, a plurality of fins 22 arranged in the width direction of the power card 1 (horizontal direction in FIG. 2) and a base portion 23 connecting the plurality of fins 22 . The heat dissipation member 21 is an example of a first heat dissipation member.

The base portion 23 is formed in a rectangular plate shape extending along the upper surface 2a of the power card 1 (case 2). The base portion 23 is fixed to the upper surface 2 a of the power card 1 via an insulating member 40 .

That is, the base portion 23 is thermally connected to the upper surface 2a of the power card 1 through the insulating member 40. As shown in FIG. The upper surface 2a is composed of, for example, a heat diffusion plate or the like that constitutes a part of the case 2, and is thermally connected to the element 3 via a thermally conductive member such as adhesive or grease having thermal conductivity. ing.

The insulating member 40 has, for example, an insulating sheet 41, greases 42 and 43, and the like. The grease 42 is provided between the insulating sheet 41 and the heat radiating member 21, and the grease 43 is provided between the insulating sheet 41 and the upper surface 2a. In this embodiment, such an insulating member 40 ensures insulation between the heat dissipation member 21 and the power card 1 (element 3).

The plurality of fins 22 each protrude upward from the base portion 23 and extend along the longitudinal direction of the power card 1 (horizontal direction in FIG. 1). In this embodiment, for example, the passages of the cooling system 20 through which the cooling water 25 (see FIG. 1) flows are configured by the gaps between the plurality of fins 22 .

The cooling water 25 is configured to flow in one direction in the longitudinal direction of the power card 1, for example, from the right side to the left side in FIG. It should be noted that the cooling system 20 is not limited to this example, and for example, in addition to the heat radiating member 21, the cooling system 20 may have a member (such as a tube) that forms a passage through which the cooling water 25 flows.

FIG. 3 is a cross-sectional view of the cooling system 30 of the cooling device 10. As shown in FIG. As shown in FIG. 3, the cooling system 30 includes, for example, a heat radiating member 31 and lubricating oil 35 (see FIG. 1) for motors and gears having insulating properties that exchange heat with the heat radiating member 31. ing. Lubricating oil 35 is an example of a coolant. The cooling system 30 is also called an oil cooling system or the like.

The heat dissipation member 31 has, for example, a plurality of fins 32 arranged in the width direction of the power card 1 (horizontal direction in FIG. 3) and a base portion 33 connecting the plurality of fins 32 . The heat dissipation member 31 is an example of a second heat dissipation member.

The base portion 33 is formed in a rectangular plate shape extending along the lower surface 2b of the power card 1 (case 2). The base portion 33 is fixed to the lower surface 2b of the power card 1 via a joint portion 50 such as an adhesive or a welded portion.

That is, the base portion 33 is thermally connected to the lower surface 2b of the power card 1 without the insulating member 40 mentioned above. The lower surface 2b is composed of, for example, a heat diffusion plate or the like that constitutes a part of the case 2, and is thermally connected to the element 3 via a thermally conductive member such as an adhesive or grease having thermal conductivity. ing.

The plurality of fins 32 each protrude downward from the base portion 33 and extend along the longitudinal direction of the power card 1 (horizontal direction in FIG. 1). In this embodiment, for example, the passages of the cooling system 30 through which the lubricating oil 35 (see FIG. 1) flows are configured by the gaps between the plurality of fins 32 .

The lubricating oil 35 is configured to flow in one direction in the longitudinal direction of the power card 1, for example, from the left side to the right side in FIG. In addition, the cooling system 30 is not limited to this example, and for example, in addition to the heat radiating member 31, the cooling system 30 may have a member (such as a tube) that forms a passage through which the lubricating oil 35 flows.

With the above-described configuration, in this embodiment, the structural thermal resistance between the heat dissipation member 31 and the power card 1 (element 3) is reduced by the structural thermal resistance between the heat dissipation member 21 and the power card 1 (element 3). less than thermal resistance. On the other hand, the lubricating oil 35 itself has poorer heat transfer characteristics than the cooling water 25 . Therefore, the difference between the total thermal resistance on the upper surface 2a side and the total thermal resistance on the lower surface 2b side becomes small, and the unevenness of heat removal from both sides of the power card 1 can be reduced.

As described above, in the present embodiment, the cooling device 10 includes the heat radiating member 21 (first heat radiating member) fixed to the upper surface 2a (first surface) of the power card 1 (heating element) via the insulating member 40. a cooling system 20 (first cooling system) for cooling the power card 1 by heat exchange between the heat radiating member 21 and cooling water 25; A cooling system 30 (second cooling system).

According to such a configuration, for example, both sides of the power card 1 can be cooled by the cooling system 20 and the cooling system 30, while the heat radiating member 21 is fixed to the upper surface 2a via the insulating member 40. By fixing the heat radiating member 31 to the lower surface 2b without interposing the insulating member 40, the difference between the thermal resistance (heat transfer characteristics) on the upper surface 2a side and the lower surface 2b side can be reduced. . As a result, for example, the cooling performance of the lower surface 2b side (lubricating oil 35 side) can be suppressed from being lower than the cooling performance of the upper surface 2a side (cooling water 25 side). It is possible to provide the cooling device 10 in which the is more likely to increase.

In this embodiment, the cooling water 25 and the insulating lubricating oil 35 (cooling liquid) are configured to flow in opposite directions in the longitudinal direction of the power card 1 (horizontal direction in FIG. 1). ing.

According to such a configuration, for example, among the plurality of elements 3 arranged in the longitudinal direction of the power card 1, the cooling performance of the element 3 located downstream of the cooling water 25 (the left end in FIG. 1) is the same as that of the cooling water. To provide a cooling device 10 capable of suppressing deterioration in cooling performance compared to that of an element 3 positioned upstream of a power card 25 (right end part in FIG. 1), and further facilitating further enhancement of cooling performance of a power card 1. can be done.

Although the embodiment of the present invention has been illustrated above, the above embodiment is an example and is not intended to limit the scope of the invention. The above embodiments can be implemented in various other forms, and various omissions, replacements, combinations, and modifications can be made without departing from the scope of the invention. In addition, specifications such as each configuration and shape (structure, type, direction, format, size, length, width, thickness, height, number, arrangement, position, material, etc.) may be changed as appropriate. can be implemented.

1 … Power card (heating element)
2a... Upper surface (first surface)
2b... Lower surface (second surface)
10... Cooling device 20... Cooling system (first cooling system)
21... Heat radiating member (first heat radiating member)
25... Cooling water 30... Cooling system (second cooling system)
31... Heat radiating member (second heat radiating member)
35 Lubricating oil (cooling liquid)
40... Insulating member

Claims (1)

a first cooling system having a first heat radiating member fixed to a first surface of a heat generating element via an insulating member, and cooling the heat generating element by heat exchange between the first heat radiating member and cooling water;
A second heat radiating member is fixed to a second surface of the heat generating element opposite to the first surface, and heat exchange between the second heat radiating member and an insulating cooling liquid heats the heat generating element. a second cooling system for cooling;
A cooling device with

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