JP6738193B2 - Heat transfer structure, insulating laminated material, insulating circuit board and power module base - Google Patents

Description

The present invention relates to a heat transfer structure, an insulating laminated material, an insulating circuit board, and a power module base. More specifically, for example, a power module such as a power converter is configured and a power module semiconductor element such as an IGBT is mounted. The present invention relates to an insulating laminated material used for an insulated circuit board, an insulating circuit board made of the insulating laminated material, and a power module base used for cooling a power module semiconductor element mounted on the insulating circuit board.

In this specification and claims, the top and bottom of FIGS. 1, 3 and 4 are referred to as the top and bottom.

For example, in a power module used as a power conversion device mounted on a vehicle such as an electric vehicle, a hybrid vehicle, and an electric train, heat generated from a semiconductor element such as an IGBT is efficiently dissipated, and the temperature of the semiconductor element for a power module is reduced. Must be kept below a predetermined temperature.

Conventionally, as a power module for a power converter, a power module base including an aluminum cooler and an insulating circuit board brazed to the cooler, and a power module semiconductor mounted on the insulating circuit board of the power module base. A power module base made up of elements, a ceramic insulating plate, a plate-shaped aluminum first heat conducting member (circuit board) brazed to one surface of the insulating plate, and another surface of the insulating plate An insulating circuit board (insulating laminated material) made of a plate-shaped aluminum second heat conducting member (heat transfer plate), and a surface of the second heat conducting plate of the insulating circuit board opposite to the surface brazed to the insulating plate And a surface of the circuit board of the insulating circuit board opposite to the surface brazed to the insulating plate is a wiring surface having a semiconductor element mounting portion. There is known a power module in which a semiconductor element for a power module is mounted on the semiconductor element mounting part (see Patent Document 1).

In the power module described in Patent Document 1, the heat generated from the semiconductor element for a power module is transmitted to the cooler via the circuit board, the insulating plate and the heat transfer plate, and is radiated.

By the way, recently, as a semiconductor element for a power module, one having high heat resistance has been developed and miniaturized, but the output current tends to increase with the increase in efficiency of the vehicle described above. , Heat sources are becoming more concentrated.

However, when the heat source is concentrated, in the power module described in Patent Document 1, the insulating plate, the first heat conducting member, and the second heat conducting member are transferred while the heat generated from the power module semiconductor element is transmitted to the cooler. It becomes difficult to diffuse in the surface directions of the upper and lower surfaces of the above, and the cooling range of the cooler that can be effectively used becomes small, and the heat radiation efficiency may decrease.

Therefore, a graphite sheet and an aluminum sheet covering both main surfaces and side surfaces of the graphite sheet are used as the first heat conducting member and the second heat conducting member of the insulated circuit board used in the power module described in Patent Document 1. It is conceivable to use the following graphite composite material (see Patent Document 2). According to the power module in which the graphite composite material described in Patent Document 2 is used for the first heat conducting member and the second heat conducting member, the heat generated from the semiconductor element for the power module is generated by the first heat conducting member and the second heat conducting member. In the heat conducting member, the graphite sheet spreads in the main surface direction and is transmitted to the cooler.

However, in the graphite composite material described in Patent Document 2, a gap is easily generated between both main surfaces of the graphite sheet and the metal sheet covering the both main surfaces, and the heat conductivity in the thickness direction of the graphite composite material is insufficient. The heat dissipation performance of the heat generated from the power module semiconductor element may deteriorate.

JP 2006-294699 A JP, 2005-210035, A

An object of the present invention is to solve the above problems and to improve the heat radiation performance of heat generated from a semiconductor element for a power module when used for the first heat conduction member and the second heat conduction member of the insulated circuit board of the power module base. It is intended to provide a heat transfer structure capable of suppressing a decrease, an insulating laminated material using the heat transfer structure, an insulating circuit board, and a power module base.

The present invention has the following aspects in order to achieve the above object.

1) a hollow metal casing having an upper wall, a lower wall and a surrounding wall, and a heat transfer material made of graphite contained in the casing, and between the upper and lower walls of the casing, A heat transfer structure in which a plurality of metal connecting members having longitudinal directions oriented vertically and penetrating a heat transfer material are arranged, and an upper wall and a lower wall of a casing and an upper end and a lower end of the connecting member are fixed, respectively. ..

2) The heat transfer material is composed of a single graphite sheet arranged with the thickness direction oriented vertically, and the heat transfer material made of the graphite sheet is provided with a plurality of through holes oriented in the vertical direction. The heat transfer structure according to 1) above, wherein the communication member is passed through, and the outer peripheral surface of the communication member is in contact with the inner peripheral surface of the through hole.

3) The heat transfer material is composed of a laminated body in which a plurality of graphite sheets arranged with the thickness direction oriented in the vertical direction are stacked in the vertical direction, and the heat transfer material composed of the laminated body penetrates in the vertical direction. The heat transfer structure according to 1), wherein a plurality of holes are formed, a communication member is passed through the through hole, and an outer peripheral surface of the communication member is in contact with an inner peripheral surface of the through hole.

4) The heat transfer structure according to 3) above, wherein the graphite sheet has a thickness of 0.125 mm or more.

5) The heat transfer material is composed of a combination of graphite powder, a plurality of through holes oriented in the vertical direction are formed in the heat transfer material formed of the combination, and a communication member is passed through the through hole, The heat transfer structure according to 1), wherein the outer peripheral surface of the communication member is in contact with the inner peripheral surface.

6) The heat transfer material is formed of a single graphite sheet in a corrugated shape, and includes a plurality of vertical wall portions parallel to each other and a connecting portion that vertically connects the adjacent vertical wall portions, and the corrugated heat transfer material is formed. The heat transfer structure according to the above 1), wherein a plurality of through-holes oriented in the vertical direction are formed in the material, the communication member is passed through the through-hole, and the outer peripheral surface of the communication member is in contact with the inner peripheral surface of the through-hole.

7) An insulating plate, a plate-shaped first heat conducting member joined to one surface of the insulating plate and having a surface opposite to the insulating plate as a heating element mounting surface, and joined to the other surface of the insulating plate The heat generated from the heating element, which is made of a plate-shaped second heat conduction member and is attached to the heating element attachment surface of the first heat conduction member, is transmitted to the second heat conduction member via the first heat conduction member and the insulating plate. It is an insulating laminated material that is made like
An insulating laminated material in which the first heat conducting member and the second heat conducting member are the heat transfer structures according to any one of 1) to 6) above.

8) An insulated circuit board in which the heating element mounting surface of the first heat conductive member of the insulating laminated material described in 7) above is a wiring surface having a semiconductor element mounting portion on which a semiconductor element serving as a heating element is mounted.

9) A power module base in which a surface of the second heat conductive member of the above-mentioned insulated circuit board opposite to a surface thereof joined to the insulating plate is joined to the cooler.

According to the heat transfer structure of the above 1) ~ 6), it is provided with a hollow metal casing having an upper wall, a lower wall and a surrounding wall, and a heat transfer material made of graphite placed in the casing. , A plurality of metallic connecting members having longitudinal directions oriented vertically and penetrating a heat transfer material are arranged between the upper wall and the lower wall of the casing, and the upper and lower walls of the casing and the upper end of the connecting member. Since the lower end and the lower end are fixed, the action of the connecting member suppresses the generation of a gap between the upper wall and the lower wall of the casing and the upper surface and the lower surface of the heat transfer material. Therefore, when the heat transfer structure is used for the first heat conduction member and the second heat conduction member of the insulated circuit board of the power module base, reduction in heat radiation performance of heat generated from the power module semiconductor element is suppressed. It becomes possible to do.

In addition, thermal distortion occurs when brazing the upper wall and the lower wall of the casing with a material having a different linear expansion coefficient from the material forming the upper wall and the lower wall such as the semiconductor element for a power module and the insulating plate. Even if it does, a gap is suppressed from being generated between the upper wall and the lower wall of the casing and the upper surface and the lower surface of the heat transfer material.

According to the heat transfer structure of the above 2) and 3), when the heating element is attached to the outer surface of either one of the upper wall and the lower wall of the casing, the heat generated from the heating element is The heat is transferred to the heat transfer material through the one wall, spreads in the plane directions of the upper and lower surfaces of the heat transfer material, transferred to the connecting member, and also transferred to the other wall of the casing through the connecting member. Further, the heat generated from the heating element is transmitted to the connecting member via the one wall of the casing and is transmitted to the other wall of the casing through the connecting member. Therefore, the heat transfer between the upper wall and the lower wall of the casing is improved, and when the heat transfer structure is used for the first heat conductive member and the second heat conductive member of the insulated circuit board of the power module base, Thus, it becomes possible to suppress the deterioration of the heat radiation performance of the heat generated from the power module semiconductor element. Moreover, even when the heat source is concentrated as in the case where a miniaturized power module semiconductor element is used, heat diffuses in the surface direction of the heat transfer material before it reaches the cooler. The cooling range of the cooler that can be effectively used is increased, and the heat radiation efficiency is improved. Further, the heat transfer material can be easily handled when manufacturing the heat transfer structure.

According to the heat transfer structure of 3) above, the thickness of the heat transfer material can be arbitrarily changed to optimize the heat conductivity in the surface directions of the upper and lower surfaces of the heat transfer material.

According to the heat transfer structure of 4) above, the heat transfer material has excellent heat conductivity in the surface directions of the upper and lower surfaces.

According to the heat transfer structure of 5) above, the heat transfer material can be inexpensive.

According to the heat transfer structure of 6) above, when the heating element is attached to the outer surface of either one of the upper wall and the lower wall of the casing, the heat generated from the heating element is The heat is transferred to the heat transfer material through the wall, passes through the vertical wall portion of the heat transfer material in the height direction, and is transferred to the other wall of the casing. Further, the heat generated from the heating element is transmitted to the heat transfer material through the one wall of the casing, is transmitted to the connecting member along the longitudinal direction of the vertical wall portion of the heat transfer material, and is also transmitted through the connecting member to the casing. Is transmitted to the other wall of. Further, the heat generated from the heating element is transmitted to the connecting member via the one wall of the casing and is transmitted to the other wall of the casing through the connecting member. Therefore, the heat transfer property between the upper wall and the lower wall of the casing is improved, and when the heat transfer structure is used for the circuit board and the heat transfer board of the insulating circuit board of the power module base, the semiconductor for power module is used. It is possible to suppress deterioration of heat dissipation performance of heat generated from the element.

According to the power module in which the insulating circuit board made of the insulating laminated material described in 7) above is used for the power module base, it is possible to suppress deterioration of the heat radiation performance of the heat generated from the power module semiconductor element.

According to the power module using the insulated circuit board of the above 8) as the power module base, it is possible to suppress deterioration of the heat radiation performance of the heat generated from the power module semiconductor element.

According to the power module using the power module base of the above 9), it is possible to suppress deterioration in heat dissipation performance of heat generated from the power module semiconductor element.

It is a partial expanded vertical sectional view showing an embodiment of a heat transfer structure by this invention. FIG. 2 is an exploded perspective view showing the heat transfer structure of FIG. 1. FIG. 3 is a vertical cross-sectional view showing a power module configured by mounting a power module semiconductor element on a power module base using the insulated circuit board having the heat transfer structure of FIG. 1. FIG. 6 is a partially enlarged vertical sectional view showing another embodiment of the heat transfer structure according to the present invention. It is a perspective view which shows the heat transfer material of the heat transfer structure of FIG. It is an enlarged view corresponding to a part of FIG. 4 which shows the modification of the heat transfer material used for the heat transfer structure of FIG.

Embodiments of the present invention will be described below with reference to the drawings.

In the following description, the left and right of FIG. 1 will be referred to as the left and right.

Further, in the following description, the term “aluminum” includes an aluminum alloy in addition to pure aluminum.

Throughout the drawings, the same parts and the same parts will be denoted by the same reference symbols, without redundant description.

1 and 2 show a heat transfer structure according to the present invention, and FIG. 3 shows a power module semiconductor element mounted on a power module base using an insulating circuit board having the heat transfer structure of FIGS. The power module comprised by this is shown.

1 and 2, the heat transfer structure (1) comprises a hollow aluminum casing (2) having an upper wall (2a), a lower wall (2b) and a surrounding wall (2c), and a casing (2). And a heat transfer material (3) made of graphite contained therein.

The casing (2) has an aluminum upper component (4) having a recess (4a) opening downward and constituting the upper wall (2a) and the surrounding wall (2c), and a flat aluminum lower component. The upper component of the lower component (5) is joined to the lower end surface of the upper component (4) to be the surrounding wall (2c) by a brazing material. Hereinafter, joining with a brazing material will be referred to as brazing.

Between the upper wall (2a) and the lower wall (2b) of the casing (2), a connecting member (6) made of aluminum and having a circular cross section with the longitudinal direction oriented vertically and penetrating the heat transfer material (3). Are provided in a staggered arrangement, and the upper wall (2a) and the lower wall (2b) of the casing (2) and the upper end and the lower end of the connecting member (6) are fixed to each other. In this embodiment, the connecting member (6) is integrally formed on the lower surface of the upper wall (2a) of the upper component (4) of the casing (2), and the lower end surface of the connecting member (6) is formed. Are metallically bonded to the upper surface of the lower component (5) by brazing, diffusion bonding, or the like. However, the connecting member (6) is integrally formed on the upper surface of the lower component (5) of the casing (2), and the upper end surface of the connecting member (6) is the upper wall (2a) of the upper component (4). It may be metallically joined to the lower surface of the part to be formed, or the connecting member (6) is formed separately from the upper and lower constituent members (4) and (5) of the casing (2), and the connecting member (6) is formed. Even if the upper end surface of the above is metallically joined to the lower surface of the upper wall (2a) of the upper constituent member (4) and the lower end surface is metallically joined to the upper surface of the lower constituent member (5). Good.

In the heat transfer material (3), a plurality of through holes (7) oriented in the up-down direction are formed in a zigzag arrangement, the communication member (6) is passed through the through holes (7), and the through holes (7) The outer peripheral surface of the communication member (6) is in contact with the inner peripheral surface of the.

As the heat transfer material (3), one consisting of one graphite sheet arranged with the thickness direction facing up and down, or a plurality of graphite sheets arranged with the thickness direction facing up and down The thing which consists of a laminated body laminated|stacked is used. It is preferable to use a graphite sheet having a thickness of 0.125 mm or more as the graphite sheet forming the laminate. As the heat transfer material (3), a material made of a combination of graphite powder may be used.

The heat transfer structure (1) described above is used, for example, in the power module shown in FIG.

In FIG. 3, the power module (10) comprises a power module base (11) and a power module semiconductor element (12) mounted on the power module base (11).

The power module base (11) is brazed to the upper surface of the rectangular ceramic insulating plate (14) and insulating plate (14), and the upper surface opposite to the insulating plate (14) serves as the heating element mounting surface. An insulating circuit board (13) comprising a flat plate-shaped first heat conducting member (15) and a flat plate-shaped second heat conducting member (16) brazed to the lower surface of the insulating plate (14), and an insulating circuit board An aluminum cooler (17) brazed to the lower surface of the second heat conducting member (16) of (13), wherein the first heat conducting member (15) and the second heat conducting member (16) are Each consists of the heat transfer structure (1) described above. The heating element mounting surface of the first heat conducting member (15) has a semiconductor element mounting portion (15a) on which the semiconductor element (12) for power module is mounted.

The insulating plate (14) of the insulating circuit board (13) may be made of any ceramic as long as it satisfies the required insulating properties, thermal conductivity and mechanical strength. For example, AlN, It is formed of Al ₂ O ₃ , Si ₃ N _4, or the like. The outer peripheral edge portion of the insulating plate (14) is located outside the outer peripheral edge portions of the first heat conducting member (15) and the second heat conducting member (16).

The cooler (17) includes a hollow cooler body (18) including a top wall (18a), a bottom wall (18b) and a peripheral wall (18c), and a plurality of coolers integrally formed on the lower surface of the top wall (18a). The aluminum heat radiation fin (19).

The cooler body (18) is composed of a flat plate-shaped aluminum upper constituent member (21) constituting the top wall (18a) and a box-shaped aluminum upper opening constituting the bottom wall (18b) and the peripheral wall (18c). An outer flange formed integrally with the lower edge of the lower component (22), which is composed of the lower component (22), and the peripheral edge of the lower surface of the upper component (21) is the peripheral wall (18c) of the lower component (22). 22a) It is brazed to the upper surface.

The radiating fins (19) are integrally formed on the lower surface of the upper component (21) so as to project downward, extend in the front-back direction of the paper surface of FIG. 3, and have their lower ends in the cooler body of the lower component (22). It is brazed to the part that will be the bottom wall (18b) of (18), between adjacent heat dissipation fins (19), and between the heat dissipation fins (19) at both left and right ends and both left and right side wall parts of the peripheral wall (18b). Is the cooling liquid flow path (23). Then, the cooling liquid flows in the cooling liquid flow path (23) of the cooler (17) in the front-back direction of the paper surface of FIG.

The power module semiconductor element (12) is soldered on the heating element mounting surface of the first heat conducting member (15) of the insulating circuit board (13), and is thereby mounted on the power module base (11). ing. The heat generated from the power module semiconductor element (12) is transferred to the cooler (17) via the first heat conducting member (15), the insulating plate (14) and the second heat conducting member (16), and the cooling liquid is generated. The cooling fluid flowing in the flow path (23) is radiated to the heat.

The power module base (11) is manufactured, for example, by the following method.

That is, the upper component (21) and the lower component (22) of the cooler (17) are combined, and the second heat conducting member (16), the insulating plate (14) and the upper component (21) are combined. The first heat conduction member (15) is arranged in this order. Between the upper component (21) and the second heat conducting member (16), between the second heat conducting member (16) and the insulating plate (14), and between the insulating plate (14) and the first heat conducting member (15). ) And an aluminum brazing material layer (not shown).

Then, the upper component (21), the lower component (22), the first heat conducting member (15), the insulating plate (14), and the second heat conducting member (16) are pressed by an appropriate jig. After temporarily fixing it in a vacuum furnace, it is placed in a heating furnace and heated to an appropriate temperature for an appropriate time, and the upper component (21) and the lower component (22) are brazed to cooler. (17) is manufactured, and the insulating circuit board (13) is manufactured by brazing the insulating plate (14) with the first heat conducting member (15) and the second heat conducting member (16). At the same time, the second heat conducting member (16) of the insulated circuit board (13) and the cooler (17) are brazed. Thus, the power module base (11) is manufactured.

In addition, the lower end surface and the connection of the portion which becomes the surrounding wall (2c) of the upper component (4) in the heat transfer structure (1) used as the first heat conductive member (15) and the second heat conductive member (16). The lower end surface of the member (6) and the lower component (5) may be brazed at the same time as the manufacturing of the power module base (11).

In the power module (10) described above, the heat generated from the semiconductor element (12) for power module passes through the upper wall (2a) of the casing (2) of the first heat conducting member (15) and the heat transfer material (3). To the lower wall (2b) through the connecting member (6) while being spread to the upper and lower surfaces of the heat transfer material (3) and transmitted to the connecting member (6). At the same time, the heat generated from the power module semiconductor element (12) is transferred to the connecting member (6) through the upper wall (2a) of the casing (2) of the first heat conducting member (15), and at the same time, the connecting member (6). Proceed through (6) to the lower wall (2b).

The heat transferred to the lower wall (2b) of the casing (2) of the first heat conducting member (15) is the insulating plate (14) and the upper wall (2a) of the casing (2) of the second heat conducting member (16). To the heat transfer material (3), spreads in the upper and lower surface directions of the heat transfer material (3) to the connecting member (6), and also to the lower wall (2b) through the connecting member (6). .. At the same time, the heat transferred to the lower wall (2b) of the casing (2) of the first heat conduction member (15) is above the insulating plate (14) and the casing (2) of the second heat conduction member (16). It is transmitted to the connecting member (6) through the wall (2a) and is transmitted to the lower wall (2b) through the connecting member (6). The heat transmitted to the lower wall (2b) of the casing (2) of the second heat conduction member (15) passes through the top wall (18a) of the cooler body (18) of the cooler (17) and the heat radiation fins (19). It is transmitted to the cooling liquid flowing in the cooling liquid flow path (23), and is directly transmitted to the cooling liquid flowing in the cooling liquid flow path (23) via the top wall (18a). In this way, the heat generated from the power module semiconductor element (12) is efficiently radiated.

4 and 5 show another embodiment of the heat transfer structure according to the present invention.

In FIGS. 4 and 5, the heat transfer material (31) made of graphite placed in the casing (2) of the heat transfer structure (30) is a corrugated sheet made of one graphite sheet. A plurality of vertical wall portions (31a) that are parallel to each other with their longitudinal directions facing the front and back of FIG. 4, and a connecting portion (31b) that vertically connects the adjacent vertical wall portions (31a). ) And.

In the heat transfer material (31), a plurality of through holes (32) oriented in the up-down direction are formed in a zigzag arrangement, the communication member (6) is passed through the through holes (32), and the through holes (32) Part of the outer peripheral surface of the communication member (6) is in contact with part of the inner peripheral surface of the.

Other configurations are the same as the heat transfer structure (1).

The power module semiconductor element is used for the power module base (11) having the insulating circuit board (13) using the heat transfer structure (31) as the first heat conductive member (15) and the second heat conductive member (16). In the power module (10) on which (12) is mounted, the heat generated from the power module semiconductor element (12) is transferred through the upper wall (2a) of the casing (2) of the first heat conducting member (15). It is transmitted to the heat material (31), passes through the vertical wall portion (31a) of the heat transfer material (31) in the height direction, and is transmitted to the lower wall (2b) of the casing (2). Further, the heat generated from the power module semiconductor element (12) is transferred to the heat transfer material (31) through the upper wall (2a) of the casing (2) of the first heat transfer member (15), and the heat transfer material (31 It is transmitted to the connecting member (6) through the vertical wall portion (31a) of 31) in the longitudinal direction, and is also transmitted to the lower wall (2b) of the casing (2) through the connecting member (6). Furthermore, the heat generated from the power module semiconductor element (12) is transferred to the connecting member (6) through the upper wall (2a) of the casing (2) of the first heat conducting member (15), and at the same time, the connecting member (6 )) to the lower wall (2b).

The heat transferred to the lower wall (2b) of the casing (2) of the first heat conducting member (15) is the insulating plate (14) and the upper wall (2a) of the casing (2) of the second heat conducting member (16). To the heat transfer material (31) and then to the lower wall (2b) of the casing (2) through the vertical wall portion (31a) of the heat transfer material (31) in the height direction. Further, the heat generated from the power module semiconductor element (12) is transferred to the heat transfer material (31) through the upper wall (2a) of the casing (2) of the first heat transfer member (15), and the heat transfer material (31 It is transmitted to the connecting member (6) through the vertical wall portion (31a) of 31) in the longitudinal direction, and is also transmitted to the lower wall (2b) of the casing (2) through the connecting member (6). Furthermore, the heat generated from the power module semiconductor element (12) is transferred to the connecting member (6) through the upper wall (2a) of the casing (2) of the first heat conducting member (15), and at the same time, the connecting member (6 )) to the lower wall (2b). The heat transmitted to the lower wall (2b) of the casing (2) of the second heat conduction member (15) passes through the top wall (18a) of the cooler body (18) of the cooler (17) and the heat radiation fins (19). It is transmitted to the cooling liquid flowing in the cooling liquid flow path (23), and is directly transmitted to the cooling liquid flowing in the cooling liquid flow path (23) via the top wall (18a). In this way, the heat generated from the power module semiconductor element (12) is efficiently radiated.

In the heat transfer material (31) used for the heat transfer structure (30) shown in FIG. 4 and FIG. 5, as shown in FIG. (31a) The two may be in close contact with each other.

(1)(30): Heat transfer structure
(2): Casing
(2a): Upper wall
(2b): Lower wall
(2c): Surrounding wall
(3)(31): Heat transfer material
(6): Connection member
(7)(32): Through hole
(11): Power module base
(12): Semiconductor element for power module
(13): Insulated circuit board
(14): Insulation plate
(15): First heat conducting member
(15a): Semiconductor element mounting part
(16): Second heat conducting member
(17): Cooler
(31a): Vertical wall
(31b): Connection part

Claims (4)

It is provided with a hollow metal casing having an upper wall, a lower wall and a surrounding wall, and a heat transfer material made of graphite placed in the casing, and between the upper wall and the lower wall of the casing, the longitudinal direction. And a plurality of metal connecting members that pass through the heat transfer material are arranged, the upper wall and the lower wall of the casing, and the upper and lower ends of the connecting members are fixed ,
The heat transfer material is formed of a single graphite sheet in a corrugated shape, and includes a plurality of vertical wall portions that are parallel to each other and a connecting portion that vertically connects adjacent vertical wall portions. A heat transfer structure in which a plurality of through holes oriented in the up-down direction are formed, a communication member is passed through the through holes, and an outer peripheral surface of the communication member is in contact with an inner peripheral surface of the through hole. An insulating plate, a plate-shaped first heat conducting member joined to one surface of the insulating plate, and a surface opposite to the insulating plate being a heating element mounting surface, and a plate-like member joined to the other surface of the insulating plate So that heat generated from the heating element attached to the heating element mounting surface of the first thermal conduction member is transmitted to the second thermal conduction member via the first thermal conduction member and the insulating plate. Insulation laminate material that is made,
The 1st heat conduction member and the 2nd heat conduction member are insulating laminated materials which consist of a heat transfer structure according to claim 1. An insulated circuit board, wherein the heating element mounting surface of the first heat conductive member of the insulating laminated material according to claim 2 is a wiring surface having a semiconductor element mounting portion for mounting a semiconductor element to be a heating element. The power module base according to claim 3, wherein the surface of the second heat conductive member of the insulated circuit board opposite to the surface bonded to the insulating plate is bonded to the cooler.

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