TW201144737A - Heat sink - Google Patents

Heat sink Download PDF

Info

Publication number
TW201144737A
TW201144737A TW100106203A TW100106203A TW201144737A TW 201144737 A TW201144737 A TW 201144737A TW 100106203 A TW100106203 A TW 100106203A TW 100106203 A TW100106203 A TW 100106203A TW 201144737 A TW201144737 A TW 201144737A
Authority
TW
Taiwan
Prior art keywords
heat
heat transfer
pipes
heat sink
plate
Prior art date
Application number
TW100106203A
Other languages
Chinese (zh)
Other versions
TWI458927B (en
Inventor
Shinichi Ito
Kenya Kawabata
Shinichi Furumoto
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of TW201144737A publication Critical patent/TW201144737A/en
Application granted granted Critical
Publication of TWI458927B publication Critical patent/TWI458927B/en

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Disclosed is a light-weight, low-cost and high-performance heat sink requiring less machining and capable of better heat dissipation performance. The disclosed heat sink is provided with a first heat exchange plate thermally connected on a first surface to a heat generating component and thermally connected to first heat-dissipating thin-plate fins, a second heat exchanger plate thermally connected on a first surface to second heat-dissipating thin-plate fins, a heat pipe thermally connecting a second surface of the first heat exchanger plate and a second surface of the second heat exchanger plate, and a heat exchanger block arranged so as to thermally connect to the side surface and top surface of the heat pipe and so as to hold the heat pipe from either side between said block and the second heat exchange plate.

Description

201144737 六、發明說明: 【發明所屬之技術領域】 本發明係關於使用在電子機器內的被冷卻零件,例如 CPU、MPU等發熱零件的冷卻的散熱器。 【先前技術】 近年來,以個人電腦爲代表,各種電氣電子機器的高 性能化、小型化明顯進步。但是筆記型個人電腦、膝上型 或桌上型個人電腦所裝載的CPU、MPU等的高性能化係伴 隨此而造成發熱量的增大。另一方面,電氣電子機器的小 型化更加被要求,電氣電子機器內的省空間化的要求亦逐 漸提高。 高性能化的CPU、MPU等發熱零件的冷卻經常成爲重 要的技術課題而佔有較大的比重。此外,在電腦以外的電 氣電子機器中亦同樣地,高性能化的發熱零件/發熱元件 的冷卻係在電氣電子機器內的省空間化的要求之中,成爲 重要的課題而佔有較大的比重。 以將電氣電子機器所裝載的電子零件加以冷卻的方法 而言’已知有藉由在被冷卻零件安裝冷卻體,而將該被冷 卻零件直接冷卻的方法等。以安裝在如上所示之被冷卻零 件的冷卻體而言’大部分使用例如銅材或鋁材等傳熱性佳 的材料的板材,亦即基底板及在其其中一方的面接合薄板 材的散熱片(fin)的散熱器。 在屬於接收來自被冷卻零件的熱的受熱部的基底板設 -5- 201144737 置薄板散熱片,來散發被冷卻零件的熱的上述方法係一般 作爲電氣機器的散熱器來加以使用。以往,在由基底板及 設在其上的散熱片所構成的散熱器(heat sink)係使用一 體形成有基底板及散熱片的鋁的押出材等,但是爲了散熱 性能的高性能化而使用銅。 銅雖然熱傳導性佳,但是在基底板較大時或熱源靠近 基底板的端部時,熱的傳佈效應(熱傳至基底板全體)並 不充分,而在基底板設置熱導管或蒸汽腔室(Vapor Chamber ),提高熱傳至基底板全體的傳佈效應,以使散 熱性能提升。 蒸汽腔室的成本高,若安裝螺絲用的深孔加工等從一 開始即未加入在設計中時,即無法對應,會有欠缺設計彈 性的問題。此外,針對將熱導管埋入在銅的區塊的形狀, 亦必須對埋入熱導管的溝槽部分進行切削等機械加工,而 會有成本變高的問題。爲了解決該等問題點,採用以第1 板材及第2板材等2枚板材來包夾熱導管的構造。藉由該構 造,並不需要用以固定熱導管的切削等機械加工,而可達 成製造成本的降低,此外,由於在熱導管周圍形成有空間 ,因此基底部的重量會變輕,整體而言可達成輕量化。 在使熱移動至所希望位置的熱導管內部係設有成爲作 動流體流路的空間,被收容在該空間的作動流體藉由蒸發 、凝結等相變化或移動,來進行熱的移動。亦即,在熱導 管的吸熱側,因在構成熱導管的容器的材質中作熱傳導所 傳來的被冷卻零件所發出的熱,作動流體會蒸發,該蒸氣 6 · 201144737 會移動至熱導管的散熱側。在散熱側,作動流體的蒸氣係 被冷卻而再次恢復成液相狀態。如上所示恢復成液相狀態 的作動流體係再次移動(還流)至吸熱側。藉由如上所示 之作動流體的相變化或移動來進行熱的移動。 〔先前技術文獻〕 〔專利文獻〕 〔專利文獻1〕日本特開2009-198173號公報 〔專利文獻2〕日本特開平1 0- 1 07 1 92號公報 【發明內容】 (發明所欲解決之課題) 在以第1板材及第2板材等2枚板材包夾熱導管的構造 中,熱導管的端部係僅朝板材的寬幅或長邊方向之中的一 方向擴展,但是與被冷卻零件接觸的複數熱導管部分係爲 了有效地從被冷卻零件移動熱,而集中配置在中央部,因 此在熱導管的側面部分形成空間,與空間部相對應的位置 的散熱片未充分傳熱,會有散熱不充分的問題點。 此外,爲了將熱傳至熱導管的側面的空間部分,若爲 以金屬塊埋入散熱器全體的方式,如前所述對埋入熱導管 的溝槽部分進行切削等機械加工變得較爲複雜,而會有成 本變高的問題。 因此,本發明之目的在提供一種機械加工少、輕量且 低成本、可提升散熱性能的高性能的散熱器。 201144737 (解決課題之手段) 發明人係爲解決習知技術的問題點而不斷精心硏究。 結果’判明出熱導管的端部擴展的方向係藉由熱導管與第 1板材而擴展熱,熱導管的側面部分係使熱傳導性佳的金 屬塊作熱連接’藉此無須在散熱器全面使用金屬塊,即可 有效地將熱擴展至熱導管端部方向及側面方向。 本發明之散熱器之第1態樣係一種散k器,其特徵爲 :具備有:第1傳熱板材,其係在其中一方的面與發熱零 件作熱連接,熱連接有由薄板散熱片所構成的第1散熱片 部;第2傳熱板材,其係在其中一方的面熱連接有由薄板 散熱片所構成的第2散熱片部;熱導管,其係在前述第1傳 熱板材的另一方的面與前述第2傳熱板材的另一方的面之 間作熱連接;及傳熱塊,其係與前述熱導管的側面及上面 作熱連接,以在與前述第2傳熱板材之間包夾前述熱導管 的方式予以熱連接配置》 本發明之散熱器之第2態樣中,前述熱導管係至少一 部分具備有彎曲部,且並列配置的複數熱導管,前述傳熱 塊係與位於前述並列配置的複數熱導管的兩端部的位置的 熱導管的側面及複數熱導管的上面作熱連接予以配置。 本發明之散熱器之第3態樣中,前述第1散熱片部係由 與前述第1傳熱板材的表面呈垂直配置的平行的複數薄板 散熱片所構成,在前述第1傳熱板材的長邊方向的其中一 方端部,沿著前述第1傳熱板材的寬幅方向以預定間隔而 設。 -8 - 201144737 本發明之散熱器之第4態樣中,前述第2散熱片部係由 與前述第2傳熱板材的表面呈垂直配置的平行的複數薄板 散熱片所構成,沿著前述第2傳熱板材的長邊方向遍及大 槪全面而設。 本發明之散熱器之第5態樣中,前述複數熱導管係由 扁平形狀的熱導管所構成,至少在中央部相互接觸且平行 配置,前述複數熱導管的一部分熱導管的前述彎曲部係沿 著配置有前述第2散熱片部的前述第2傳熱板材的前述端部 予以配置。 本發明之散熱器之第6態樣中,前述複數熱導管係由 扁平形狀的熱導管所構成,未相互接觸而熱導管彼此隔著 間隔予以平行配置,前述複數熱導管的一部分熱導管的前 述彎曲部係沿著配置有前述第2散熱片部的前述第2傳熱板 材的前述端部予以配置。 本發明之散熱器之第7態樣中,前述複數熱導管係將 沿著前述第2傳熱板材的長邊方向被配置在中央的直線狀 熱導管爲中心而配置成對稱或非對稱。 本發明之散熱器之第8態樣中,具備有固定構件,其 係在藉由前述第1傳熱板材及前述第2傳熱板材包夾有前述 熱導管的狀態下,固定在散熱器周圍部。 (發明之效果) 藉由本發明之散熱器,採用以第1板材及第2板材等2 枚板材來包夾熱導管的構造,將至少1個熱導管朝長邊方 -9 * 201144737 向擴展、或將複數熱導管的端部朝板材的長邊方向及寬幅 方向擴展配置,並且與被冷卻零件相接觸的複數熱導管的 部分係集中在中央部,在形成於熱導管的側面部分的空間 分別配置熱傳導性佳的區塊,因此熱亦充分傳至與空間部 相對應的位置的散熱片,可使散熱性能提升。 【實施方式】 一面參照圖示,一面說明本發明之散熱器。 本發明之散熱器之一態樣係具備有:第1傳熱板材, 其係在其中一方的面與發熱零件作熱連接,熱連接有由薄 板散熱片所構成的第1散熱片部:第2傳熱板材,其係在其 中一方的面熱連接有由薄板散熱片所構成的第2散熱片部 ;熱導管,其係在前述第1傳熱板材的另一方的面與前述 第2傳熱板材的另一方的面之間作熱連接;及傳熱塊,其 係與前述熱導管的側面及上面作熱連接,以在與前述第2 傳熱板材之間包夾前述熱導管的方式予以熱連接配置。 第1圖係用以說明本發明之散熱器之一態樣的斜視圖 。第2圖係顯示本發明之散熱器之第1態樣之背面的圖。如 第1圖及第2圖所不’在第1圖所示之散熱器中,係在背面 側’ 2個第1傳熱板材2 -1、2 - 2及在其之間熱連接有傳熱塊6 的狀態下予以配設。傳熱塊6係具備有:傳熱性佳之位於2 個側端部的兩端區塊部6-1、6-2、及將兩端區塊部相連接 的受熱部10’該等係一體形成。傳熱塊6的兩端區塊部6-1 ' 6-2係具有厚度的區塊’將該等相連接的受熱部1〇係形 -10- 201144737 成爲比兩端區塊部爲更薄的板狀。亦可在傳熱塊6的受熱 部10的位置設置較薄的板狀連結部,而在其上熱接合受熱 部10。在受熱部10連接有作爲熱源的發熱零件20(參照第 5圖)。 如第1圖所示,在散熱器1的上面側,係以與第1傳熱 板材2-1、2-1、傳熱塊6相對向的方式設有第2傳熱板材3。 在第2傳熱板材3與第1傳熱板材2-1' 2-2及傳熱塊6之間, 如第2圖中虛線所示,在夾持複數熱導管7-1〜7-5而作熱連 接的狀態下予以配設。 複數熱導管7-1〜7-5之上下的面係與第1傳熱構件2-1 、2-2及受熱部10相接觸而作熱連接。此外,傳熱塊6的兩 端區塊部6-1、6-2係具有厚度的區塊形狀,兩端區塊部6-1 、6-2的熱導管側的側面係分別與最爲外側的熱導管7-5、 7-1的側面相接觸而作熱連接。 在第1傳熱板材2-1之未與熱導管相接的面(在第1圖 中爲下側)的其中一方端部,由以預定間距(散熱片間距 )所配置之複數薄板散熱片所構成的第1散熱片部5,係在 與第1傳熱板材2-1作熱連接的狀態下予以接合。此外,在 第2傳熱板材3之未與熱導管相接的面表面(在第1圖中爲 上側),係大槪遍及全體,由以預定散熱片間距所配置之 複數薄板散熱片所構成的第2散熱片部4係在與第2傳熱板 材3作熱連接的狀態下予以接合。 與第1傳熱構件2-1相接合的第1散熱片部5、及與第2 傳熱板構件3相接合的第2散熱片部4亦可不一定如押出材 -11 - 201144737 般呈一體成形者,可藉由以所希望的散熱片間距接合在複 數薄板散熱片傳熱板材的表面,來形成散熱片部。 如上所述,在第1傳熱板材2-1、2-2及傳熱塊6的受熱 部10與第2傳熱板材3之間,係以三明治狀包夾複數熱導管 7 -1〜7 - 5而作熱連接。在第2圖所示態樣中,係並列配置有 5支熱導管。熱導管的形狀較佳爲加大第1傳熱板材2-1、2-2及傳熱塊6與第2傳熱板材3的接觸面積,在第2圖之態樣 中係以扁平形狀爲佳。複數熱導管7-1〜7-5係在被夾在第2 傳熱板材3的長邊方向的中央部與傳熱塊6的位置中,在彼 此側面相接觸的狀態下無間隙地予以配置。 此外,複數熱導管7-1〜7-5係除了配置在中央的1支熱 導管7-3以外,其係在第1散熱片部5側,朝向第1及第2傳 熱板材的寬幅方向擴展而配置。尤其,一部分的熱導管7-2 ' 7-4的端部係以直角彎曲而沿著第1散熱片部朝寬幅方 向延伸的方式予以配置。其他一部分的熱導管7-1、7-5的 端部係以分別朝向第2傳熱板材的寬幅方向擴展的方式予 以配置,藉由朝傳熱板材的寬幅方向傳熱,構成爲對被接 合在第2傳熱板材3上的薄板散熱片的全體傳熱。 複數熱導管7-1〜7-5係在傳熱塊6以外的位置,將上下 在被夾在第1傳熱板材2-1、2-2與第2傳熱板材3的狀態下作 熱連接。此外,複數熱導管7-1〜7-5係在傳熱塊6的位置, 在複數熱導管7-1〜7-5朝寬幅方向的中央部分相互接觸的 狀態下無間隙地予以配置,上下在被夾在第2傳熱板材3與 受熱部1〇的狀態下作熱連接,被配置在外側的熱導管7-1 -12- 201144737 、7-5的側面係分別與傳熱塊6的兩端區塊部6-2、6-1相接 /ran 觸。 傳熱塊6的受熱部10之未與熱導管7-1〜7-5相接觸的面 係形成與熱源相連接的受熱面,將在受熱面所吸收的熱傳 達至熱導管7-1〜7-5。藉由構成爲如上所示,在受熱部10 的受熱面所吸收的熱可透過傳熱塊6而從複數熱導管的下 面與側面傳達,因此可更加有效率地將熱傳達至熱導管。 其中,熱導管係如上所述,以在使側面彼此相接觸的 狀態下作配置爲佳,但是亦可彼此不相接觸而隔著間隔平 行配置熱導管彼此。即使在熱導管不相互接觸的狀態下, 亦透過受熱部10而傳熱至各自的熱導管。 在第2圖所示態樣中,傳熱塊6的兩端區塊部6-1、6-2 係以接觸並列配置的複數熱導管的兩外側的熱導管7-1、7-5的中央部的直線狀部分的側面的方式予以配置》兩端區 塊部6-1、6-2係藉由受熱部10而相連結,受熱部10係以與 熱導管的中央部的上面熱連接的方式予以配置。亦即,如 上所述,複數熱導管7-1〜7-5係在傳熱塊6以外的部分被夾 在第1傳熱板材2-1、2-2及第2傳熱板材3,在傳熱塊6的部 分係將上下左右夾在傳熱塊6與第2傳熱板材3。 兩端區塊部6-1、6-2的上面係藉由焊料等而與第2傳熱 板材3相接合。藉此,可將來自受熱部10的熱更有效率地 傳達至第2傳熱板材3。其中,兩端區塊部6-1、6-2與第2傳 熱板材3爲有別於第1傳熱板材2 · 1、2 - 2的其他構件,第1傳 熱板材2-1、2-2與第2傳熱板3係以在接觸部分(例如後述 -13- 201144737 的四角落的固定部8等)中藉由焊料接合等加以固定爲佳 。此外,第1傳熱板材2-1、2-2與傳熱塊6亦以在接觸部分 中以焊料接合等加以固定爲宜。 由發熱零件(熱源)被傳達至受熱部10的熱係從受熱 部10的背面被傳達至複數熱導管,並且朝橫向擴展而傳至 兩端區塊部6-1、6-2。 亦即,從發熱零件傳至受熱部的熱係被傳達至在受 熱部10的受熱面的相反側直接接觸的複數熱導管7-1、7-2 、7-3、7_4、7-5,另外受熱部10的熱係傳至兩端區塊部6-1、6-2,亦傳達至熱導管7-1、7-5的側面。此外,兩端區 塊部6-1、6-2及熱導管係與第2傳熱板材3作熱連接,因此 藉由受熱部10所受到的熱係透過該等而傳達至第2傳熱板 材3大槪全部區域。結果,熱係被傳熱至由與第2傳熱板材 3的上面的大槪全體相接合之複數薄板散熱片所構成的第2 散熱片部4,從散熱片散熱至散熱器的外部。 第3圖係本發明之散熱器之一態樣的上面圖。如第3圖 所示,除了固定第1傳熱板材2-1、2-2及第2傳熱板材3的四 角落的固定部8以外,以預定的散熱片間距並列配置的複 數薄板散熱片被接合在第2傳熱板材3的其中一方的面(圖 示上面)的大槪全體。 在第2散熱片部4的一端側設有第1蓋件9-1,在散熱器 1〇的中央部的兩側部設有第2蓋件9-2。第1及第2蓋件9-1、 9-2係被使用作爲安裝本發明之散熱器時的蓋件,以具緩 衝性者爲佳,可使用多孔質狀的樹脂,例如海綿狀者。 -14- 201144737 第4圖係本發明之散熱器之—態樣的正面圖。如第4圖 所示,在第1傳熱板材2-1之與熱導管相接的面的相反面( 在第4圖中爲下側)的一方端部係熱連接配置有由薄板散 熱片所構成的第1散熱片部5。第1散熱片部的複數薄板散 熱片係沿著第1傳熱板材2 -1 ' 2 - 2的長邊方向予以配置。 遍及第2傳熱板材3之與熱導管相接的面的相反面(在 第4圖中爲上側)的大槪全體,熱連接配置有由薄板散熱 片所構成的第2散熱片部4。第2散熱片部4的複數薄板散熱 片亦沿著第2傳熱板材3的長邊方向予以配置。 第1散熱片部5及第2散熱片部4係分別在第1傳熱板材 2-1、2-2及第2傳熱板材3上以所希望的散熱片間距予以形 成。在第1傳熱板材2-1、2-2與第2傳熱板材3之間,係以三 明治狀包夾並列的複數熱導管7-1〜7-5而作熱連接。 在第2傳熱板材3的長邊方向的中央部附近,係在複數 熱導管7-1〜7-5相互接觸的狀態下無間隙地予以配置。複 數熱導管的中央部係與傳熱性佳的傳熱塊6作熱連接。傳 熱塊6係一體形成有中央部的受熱部10、及傳熱性佳的金 屬製兩側部區塊部6-1、6-2。從發熱零件(熱源)傳至屬 於受熱面之傳熱塊6的受熱部10的熱係傳至複數熱導管7-1 、7-2、7-3、7-4、7-5、及兩側部區塊部6-1、6-2,藉由 複數熱導管7-1〜7-5及兩端區塊部6-1、6-2而傳達至第2傳 熱板材3的縱橫方向的大槪全部區域。 第5圖係第1圖所示散熱器的側面圖。在第1傳熱板材 2-1、2-2之與熱導管未相接的面(在第5圖中爲下側)的一 -15- 201144737 方端部係熱連接配置有由薄板散熱片所構成的第1散熱片 部5。在第1傳熱板材2-1、2-2之間係熱連接配置有傳熱塊6 。第2傳熱板材3之與熱導管未相接之側的表面(在第5圖 中爲上側)係遍及大槪全體而熱連接配置有由薄板散熱片 所構成的第2散熱片部4。 第6圖至第1 0圖係用以說明本發明之散熱器之其他態 樣的圖。第6圖係斜視圖。第7圖係顯示背面的圖。第8圖 係上面圖。第9圖係正面圖。第1 〇圖係側面圖。其詳細內 容係除了覆蓋散熱片的一部分的蓋件9-1、9-2以外,與參 照第1圖至第5圖加以說明者的內容相同。 第1傳熱板材2-1、2-2及第2傳熱板材3係在與第1散熱 片部5及第2散熱片部4分別作熱連接的狀態下,在保持以 三明治狀包夾並列配置的複數熱導管7-1〜7-5的情形下藉 由固定部8予以固定。複數熱導管係在中央部中與傳熱性 佳的金屬製傳熱塊6作熱連接的狀態下予以配置。傳熱塊6 係與前述同樣地,使形成在兩側部之傳熱性佳的金屬製的 兩端區塊部6-1、6-2與受熱部10—體形成。 藉由由與兩外側的2支熱導管7-1、7-5的中央部的直線 狀的側面部分及複數熱導管7-1〜7-5的中央部的上面相接 觸予以配置的區塊部6-1、6-2、受熱部10所構成的傳熱塊6 ,發熱零件的熱朝橫向擴展傳達。結果,熱遍及散熱器全 體而擴散,通過散熱片而對散熱器外散熱。 第11圖係說明將本發明之散熱器之薄板散熱片接合在 傳熱板材(2-1、2-2、或3 )的形狀的剖面圖。薄板散熱片 -16- 201144737 係可採用各種形狀,俾以符合散熱器的配置場所、可配置 的空間等條件。此外,可自由組合各種形狀的薄板散熱片 〇 在第1 1圖(a )所示態樣中,將由底面、垂直面、上 面所構成之剖面3字形狀的薄板散熱片朝橫向並列配置而 形成散熱片部4。在該態樣中,複數底面並列配置而形成 平坦的受熱面,在平坦的受熱面熱連接有第1傳熱板材2-1 、2-2或第2傳熱板材3。同時並列配置有複數散熱片的上 面亦形成平坦的面。以薄板散熱片的連接方法而言,係可 採用例如焊料連接、焊接等其他各種周知技術(其他例中 亦同)。 在第11圖(b)所示態樣中,將由底面及垂直面所構 成之剖面L字形的薄板散熱片朝橫向並列配置而形成散熱 片部4。在該態樣中,亦並列配置複數底面而形成平坦的 受熱面,散熱片部4係上面側予以開放。 在第1 1圖(c )所示態樣中,適當組合上述由底面、 垂直面、上面所構成之剖面3字形狀的薄板散熱片、及由 底面及垂直面所構成的剖面L字形的薄板散熱片,而形成 散熱片部4。組合並不限於所圖示的態樣,亦可在兩端部 側配置參照第1 1圖(c )所說明的散熱片部4,在中央部組 合參照第1 1圖(a )所說明的散熱片部等其他隨意組合。 上述第1 1圖(a )〜(c )所示態樣之薄板散熱片係以 焊料、焊接等而使底面被接合固定在第1傳熱板2或第2傳 熱板3。其中,在第1傳熱板材2-1、2-2及第2傳熱板材3的 -17- 201144737 兩面± ’可分別將第丨〗圖(a)至(c)所示態樣的薄板散 ’包含相同的薄板散熱片及不同的薄板散熱片而適當 組合。例如可在第1傳熱板材2_丨的下側的面安裝第丨丨圖( a)所示的薄板散熱片,在第2傳熱板材3的上側的面安裝 第11圖(b)所示的薄板散熱片。 %上所述,藉由本發明之散熱器,可提供一種機械加 I少 '輕S且低成本、可提升散熱性能的高性能的散熱器 【圖式簡單說明】 第1圖係用以說明本發明之散熱器之一態樣的斜視圖 〇 第2圖係顯示本發明之散熱器之一態樣之背面的圖。 第3圖係本發明之散熱器之一態樣的上面圖。 第4圖係本發明之散熱器之一態樣的正面圖。 第5圖係本發明之散熱器之一態樣的側面圖。 第6圖係用以說明本發明之散熱器之其他一態樣的斜 視圖。 第7圖係顯示本發明之散熱器之其他一態樣之背面的 圖。 第8圖係本發明之散熱器之其他一態樣的上面圖。 第9圖係本發明之散熱器之其他一態樣的正面圖。 第1 0圖係本發明之散熱器之其他一態樣的側面圖。 第1 1圖係用以說明本發明之散熱器之薄板散熱片之形 -18 - 201144737 狀的剖面圖。 【主要元件符號說明】 1 :散熱器 2-1、2-2 :第1傳熱板材 3 :第2傳熱板材 4 :第2散熱片部 5 :第1散熱片部 6 :傳熱塊 6 -1、6 - 2 .兩ΐί而區塊 7-1〜7-5 :熱導管 8 :固定部 9 -1、9 - 2 :蓋件 1 〇 :受熱部 2 0 :發熱零件 -19-201144737 VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a cooled heat sink using a cooled component such as a CPU, an MPU or the like in an electronic device. [Prior Art] In recent years, with the realization of personal computers, the high performance and miniaturization of various electric and electronic devices have progressed remarkably. However, high-performance systems such as CPUs and MPUs that are loaded on notebook PCs, laptops, or desktop PCs increase the amount of heat generated. On the other hand, miniaturization of electrical and electronic equipment is required, and the demand for space saving in electrical and electronic equipment is gradually increasing. The cooling of heat-generating components such as high-performance CPUs and MPUs is often an important technical issue and accounts for a large proportion. In addition, in the electric and electronic devices other than the computer, the cooling of the high-performance heat-generating components and the heat-generating components is an important issue in the space-saving requirements of the electric and electronic devices, and it has a large proportion. . In the method of cooling an electronic component mounted on an electric and electronic device, a method of directly cooling the cooled component by mounting a cooling body on the member to be cooled is known. In the case of a heat sink mounted on the cooled component as shown above, a sheet material which is mostly made of a material having good heat conductivity such as copper or aluminum, that is, a base plate and a surface thereof are joined to the thin plate. Heat sink (fin) heat sink. The above-described method of disposing the heat of the cooled component in the base plate of the heat receiving portion that receives the heat from the cooled component is generally used as a heat sink for the electrical device. Conventionally, an aluminum extrusion material in which a base plate and a heat sink are integrally formed is used as a heat sink formed of a base plate and a heat sink provided thereon, but is used for high performance of heat dissipation performance. copper. Although copper has good thermal conductivity, when the base plate is large or the heat source is close to the end of the base plate, the heat spreading effect (heat transfer to the entire base plate) is not sufficient, and the heat pipe or steam chamber is disposed on the base plate. (Vapor Chamber), which improves the spread of heat transfer to the entire substrate to improve heat dissipation. The cost of the steam chamber is high. If the deep hole machining for mounting screws is not added to the design from the beginning, it cannot be matched, and there is a problem of lack of design flexibility. Further, in the shape of the block in which the heat pipe is buried in the copper, it is necessary to perform machining such as cutting in the groove portion of the heat pipe, and there is a problem that the cost becomes high. In order to solve such problems, a structure in which a heat pipe is sandwiched between two sheets of a first plate material and a second plate material is used. With this configuration, it is not necessary to perform machining such as cutting for fixing the heat pipe, and the manufacturing cost can be reduced. Further, since a space is formed around the heat pipe, the weight of the base portion becomes light, as a whole. Lightweight can be achieved. A space serving as an active fluid flow path is provided inside the heat pipe for moving the heat to a desired position, and the actuating fluid accommodated in the space is thermally moved by phase change or movement such as evaporation or condensation. That is, on the heat absorbing side of the heat pipe, the heat generated by the cooled part due to heat conduction in the material of the container constituting the heat pipe evaporates, and the vapor 6 · 201144737 moves to the heat pipe Heat side. On the heat dissipating side, the vapor of the actuating fluid is cooled and returned to the liquid phase again. The actuating flow system restored to the liquid phase as described above is again moved (also flowed) to the heat absorbing side. The movement of heat is performed by the phase change or movement of the actuating fluid as indicated above. [Patent Document] [Patent Document 1] Japanese Laid-Open Patent Publication No. 2009-198173 (Patent Document 2) Japanese Laid-Open Patent Publication No. Hei No. Hei. In the structure in which the heat pipe is sandwiched between two sheets of the first plate material and the second plate material, the end portion of the heat pipe extends only in one of the width or the longitudinal direction of the sheet material, but the part to be cooled is cooled. The plurality of heat pipe portions that are in contact are arranged in the center portion in order to efficiently move heat from the cooled parts, so that a space is formed in the side portion of the heat pipe, and the heat sink at a position corresponding to the space portion is not sufficiently heat-conducted. There are problems with insufficient heat dissipation. Further, in order to transfer heat to the space portion of the side surface of the heat pipe, if the metal block is buried in the entire heat sink, machining such as cutting the groove portion of the heat pipe is performed as described above. Complex, and there will be problems with higher costs. Accordingly, it is an object of the present invention to provide a high performance heat sink which is less machined, lightweight, and low in cost and which can improve heat dissipation performance. 201144737 (Means for Solving the Problem) The inventors have been carefully researching and solving the problems of the prior art. As a result, it was found that the direction in which the end of the heat pipe was expanded was extended by the heat pipe and the first plate, and the side portion of the heat pipe was thermally connected to the metal block having good heat conductivity, thereby eliminating the need for full use of the heat sink. The metal block can effectively spread the heat to the end direction and the side direction of the heat pipe. A first aspect of the heat sink according to the present invention is characterized in that: the first heat transfer plate is provided with one surface on which one of the heat-generating components is thermally connected, and the heat-dissipating fin is thermally connected. a first heat sink portion; the second heat transfer sheet is thermally connected to a second heat sink portion formed of a thin plate fin; and a heat pipe is attached to the first heat transfer sheet The other surface is thermally connected to the other surface of the second heat transfer plate; and the heat transfer block is thermally connected to the side surface and the upper surface of the heat pipe for the second heat transfer In a second aspect of the heat sink according to the present invention, in the second aspect of the heat sink of the present invention, the heat pipe is provided with at least a part of a heat pipe having a bent portion and arranged in parallel, and the heat transfer block It is disposed in thermal connection with the side surface of the heat pipe at the position of both ends of the plurality of heat pipes arranged in parallel and the upper surface of the plurality of heat pipes. In a third aspect of the heat sink according to the present invention, the first fin portion is formed of a plurality of parallel thin plate fins disposed perpendicular to a surface of the first heat transfer sheet, and is formed on the first heat transfer sheet. One of the end portions in the longitudinal direction is provided at a predetermined interval along the width direction of the first heat transfer sheet. -8 - 201144737 In a fourth aspect of the heat sink according to the present invention, the second fin portion is formed by a plurality of parallel thin plate fins disposed perpendicular to a surface of the second heat transfer sheet, along the first 2 The long-side direction of the heat transfer plate is comprehensively designed throughout the entire area. In a fifth aspect of the heat sink of the present invention, the plurality of heat pipes are formed by flat heat pipes, and at least the central portions are in contact with each other and arranged in parallel, and the bending portion of a part of the heat pipes of the plurality of heat pipes is along The end portion of the second heat transfer sheet on which the second fin portion is disposed is disposed. In a sixth aspect of the heat sink according to the present invention, the plurality of heat pipes are formed by flat heat pipes, and the heat pipes are arranged in parallel with each other without being in contact with each other, and the heat pipes of the plurality of heat pipes are a part of the heat pipes. The bent portion is disposed along the end portion of the second heat transfer sheet on which the second fin portion is disposed. In the seventh aspect of the heat sink according to the present invention, the plurality of heat pipes are arranged symmetrically or asymmetrically centered on the linear heat pipe disposed at the center along the longitudinal direction of the second heat transfer sheet. An eighth aspect of the heat sink according to the present invention includes a fixing member that is fixed around the heat sink in a state in which the heat transfer pipe is sandwiched between the first heat transfer plate and the second heat transfer plate. unit. (Effect of the Invention) The heat sink according to the present invention has a structure in which a heat pipe is sandwiched between two sheets of a first plate member and a second plate member, and at least one heat pipe is extended toward the long side -9 * 201144737. Or expanding the ends of the plurality of heat pipes toward the longitudinal direction and the wide direction of the sheet, and the portions of the plurality of heat pipes that are in contact with the cooled parts are concentrated at the center portion, and are formed in the space of the side portion of the heat pipe. The blocks having good thermal conductivity are respectively disposed, so that the heat is sufficiently transmitted to the heat sink at a position corresponding to the space portion, so that the heat dissipation performance can be improved. [Embodiment] A heat sink of the present invention will be described with reference to the drawings. In one aspect of the heat sink of the present invention, the first heat transfer plate is provided, and one of the surfaces is thermally connected to the heat generating component, and the first heat sink portion composed of the thin plate heat sink is thermally connected: a heat transfer plate in which one of the surfaces is thermally connected to a second fin portion composed of a thin plate fin; and a heat pipe is provided on the other surface of the first heat transfer plate and the second pass a thermal connection between the other faces of the hot plates; and a heat transfer block thermally coupled to the sides and the surface of the heat pipe to sandwich the heat pipe between the second heat transfer plate and the second heat transfer plate Hot connection configuration. Fig. 1 is a perspective view for explaining one aspect of the heat sink of the present invention. Fig. 2 is a view showing the back surface of the first aspect of the heat sink of the present invention. As shown in Fig. 1 and Fig. 2, in the heat sink shown in Fig. 1, the two first heat transfer sheets 2 -1, 2 - 2 are thermally connected to each other on the back side. The heat block 6 is disposed in the state. The heat transfer block 6 is provided with two end block portions 6-1 and 6-2 located at the two side end portions and a heat receiving portion 10' that connects the both end block portions. form. The both end block portions 6-1 ' 6-2 of the heat transfer block 6 are blocks having a thickness 'the heat-receiving portion 1 - 201144737 which is connected to the heat transfer block 6 is thinner than the block portions at both ends Plate shape. Further, a thin plate-like connecting portion may be provided at the position of the heat receiving portion 10 of the heat transfer block 6, and the heat receiving portion 10 may be thermally bonded thereto. A heat generating component 20 as a heat source is connected to the heat receiving portion 10 (see Fig. 5). As shown in Fig. 1, the second heat transfer plate member 3 is provided on the upper surface side of the heat sink 1 so as to face the first heat transfer sheets 2-1 and 2-1 and the heat transfer block 6. Between the second heat transfer plate 3 and the first heat transfer plate 2-1' 2-2 and the heat transfer block 6, as shown by the broken line in Fig. 2, the plurality of heat pipes 7-1 to 7-5 are sandwiched. It is configured in a state of being thermally connected. The surface above and below the plurality of heat pipes 7-1 to 7-5 is in thermal contact with the first heat transfer members 2-1 and 2-2 and the heat receiving portion 10. Further, the both end block portions 6-1 and 6-2 of the heat transfer block 6 have a block shape having a thickness, and the side faces of the heat pipe sides of the both end block portions 6-1 and 6-2 are respectively the most The sides of the outer heat pipes 7-5, 7-1 are in contact with each other for thermal connection. One of the end portions of the first heat transfer plate 2-1 that is not in contact with the heat pipe (the lower side in FIG. 1) is composed of a plurality of thin plate fins arranged at a predetermined pitch (heat sink pitch) The first fin portion 5 is formed to be joined in a state of being thermally connected to the first heat transfer plate member 2-1. Further, the surface of the second heat transfer plate 3 that is not in contact with the heat pipe (the upper side in Fig. 1) is formed over the entire surface, and is composed of a plurality of thin plate fins arranged at a predetermined fin pitch. The second fin portion 4 is joined in a state of being thermally connected to the second heat transfer plate member 3. The first fin portion 5 joined to the first heat transfer member 2-1 and the second fin portion 4 joined to the second heat transfer plate member 3 may not necessarily be integrated as the extruded material -11 - 201144737 The shaper can form the fin portion by bonding the surface of the plurality of thin plate fin heat transfer sheets at a desired fin pitch. As described above, between the heat transfer portions 10 of the first heat transfer sheets 2-1 and 2-2 and the heat transfer block 6 and the second heat transfer plate 3, the plurality of heat pipes 7-1 to 7 are sandwiched. - 5 for a hot connection. In the aspect shown in Fig. 2, five heat pipes are arranged in parallel. The shape of the heat pipe is preferably such that the contact areas of the first heat transfer plates 2-1 and 2-2 and the heat transfer block 6 and the second heat transfer plate 3 are increased, and in the aspect of Fig. 2, the flat shape is good. The plurality of heat pipes 7-1 to 7-5 are disposed in a position sandwiched between the center portion in the longitudinal direction of the second heat transfer sheet 3 and the heat transfer block 6 without any gap in a state in which they are in contact with each other. . Further, the plurality of heat pipes 7-1 to 7-5 are disposed on the side of the first fin portion 5 in addition to one heat pipe 7-3 disposed at the center, and are oriented toward the width of the first and second heat transfer sheets. The direction is extended and configured. In particular, the ends of a part of the heat pipes 7-2' to 7-4 are bent at right angles and are arranged to extend in the width direction along the first fin portions. The other ends of the heat pipes 7-1 and 7-5 are disposed so as to extend toward the width direction of the second heat transfer sheet, and are configured to be heat-transferred in the width direction of the heat transfer sheet. The entire heat transfer of the thin plate fins joined to the second heat transfer plate 3 is performed. The plurality of heat pipes 7-1 to 7-5 are placed at positions other than the heat transfer block 6 and are heated up and down in the state of being sandwiched between the first heat transfer sheets 2-1 and 2-2 and the second heat transfer plate 3. connection. Further, the plurality of heat pipes 7-1 to 7-5 are disposed at the position of the heat transfer block 6, and are disposed without a gap in a state where the plurality of heat pipes 7-1 to 7-5 are in contact with each other in the central portion in the width direction. The upper and lower sides are thermally connected to each other while being sandwiched between the second heat transfer plate 3 and the heat receiving portion 1B, and the side faces of the heat pipes 7-1-12-201144737 and 7-5 disposed outside are respectively associated with the heat transfer block 6 The two end block sections 6-2 and 6-1 are connected to each other/ran. The surface of the heat receiving portion 10 of the heat transfer block 10 that is not in contact with the heat pipes 7-1 to 7-5 forms a heat receiving surface that is connected to the heat source, and the heat absorbed by the heat receiving surface is transmitted to the heat pipe 7-1. 7-5. By arranging as described above, the heat absorbed by the heat receiving surface of the heat receiving portion 10 can be transmitted from the lower surface and the side surface of the plurality of heat pipes through the heat transfer block 6, so that heat can be more efficiently transmitted to the heat pipe. Here, the heat pipes are preferably disposed in such a manner that the side faces are in contact with each other as described above, but the heat pipes may be disposed in parallel with each other without being in contact with each other. Even in a state where the heat pipes are not in contact with each other, heat is transmitted to the respective heat pipes through the heat receiving portion 10. In the aspect shown in Fig. 2, the both end block portions 6-1, 6-2 of the heat transfer block 6 are in contact with the heat pipes 7-1, 7-5 on both outer sides of the plurality of heat pipes arranged side by side. The side portions of the linear portion of the central portion are arranged. The both end block portions 6-1 and 6-2 are connected by the heat receiving portion 10, and the heat receiving portion 10 is thermally connected to the upper surface of the central portion of the heat pipe. The way to configure it. That is, as described above, the plurality of heat pipes 7-1 to 7-5 are sandwiched between the heat transfer blocks 6 and the first heat transfer plates 2-1 and 2-2 and the second heat transfer plate 3, The heat transfer block 6 is sandwiched between the heat transfer block 6 and the second heat transfer plate 3 in the upper, lower, left, and right directions. The upper surfaces of the both end block portions 6-1 and 6-2 are joined to the second heat transfer sheet material 3 by solder or the like. Thereby, the heat from the heat receiving portion 10 can be more efficiently transmitted to the second heat transfer sheet 3. The both end block portions 6-1 and 6-2 and the second heat transfer plate member 3 are other members different from the first heat transfer plates 2·1 and 2-2, and the first heat transfer plate 2-1, 2-2 and the second heat transfer plate 3 are preferably fixed by solder joint or the like in a contact portion (for example, a fixing portion 8 at four corners of -13 to 201144737 to be described later). Further, it is preferable that the first heat transfer sheets 2-1 and 2-2 and the heat transfer block 6 are fixed by solder joint or the like in the contact portion. The heat transmitted from the heat generating component (heat source) to the heat receiving portion 10 is transmitted from the back surface of the heat receiving portion 10 to the plurality of heat pipes, and is expanded in the lateral direction to the both end block portions 6-1 and 6-2. That is, the heat system transmitted from the heat generating component to the heat receiving portion is transmitted to the plurality of heat pipes 7-1, 7-2, 7-3, 7_4, and 7-5 directly contacting the opposite side of the heat receiving surface of the heat receiving portion 10. Further, the heat of the heat receiving portion 10 is transmitted to the both end block portions 6-1 and 6-2, and is also transmitted to the side faces of the heat pipes 7-1 and 7-5. Further, since the both end block portions 6-1 and 6-2 and the heat pipe system are thermally connected to the second heat transfer plate member 3, the heat received by the heat receiving portion 10 is transmitted to the second heat transfer. Plate 3 is large in all areas. As a result, the heat is transferred to the second fin portion 4 composed of a plurality of thin plate fins joined to the entire upper surface of the second heat transfer sheet 3, and is radiated from the fins to the outside of the heat sink. Figure 3 is a top view of one aspect of the heat sink of the present invention. As shown in Fig. 3, in addition to the fixing portions 8 for fixing the four corners of the first heat transfer sheets 2-1 and 2-2 and the second heat transfer sheet 3, a plurality of thin plate fins arranged in parallel at a predetermined fin pitch are arranged. The entire surface of the surface (shown on the upper surface) of one of the second heat transfer sheets 3 is joined. The first cover member 9-1 is provided on one end side of the second heat sink portion 4, and the second cover member 9-2 is provided on both side portions of the center portion of the heat sink 1?. The first and second lid members 9-1 and 9-2 are used as a lid member for attaching the heat sink of the present invention, and those having a cushioning property are preferable, and a porous resin such as a sponge may be used. -14- 201144737 Fig. 4 is a front view of the heat sink of the present invention. As shown in Fig. 4, a thin plate fin is thermally connected to one end portion of the first heat transfer plate 2-1 opposite to the surface in contact with the heat pipe (the lower side in Fig. 4). The first fin portion 5 is configured. The plurality of thin plate heat radiating fins of the first fin portion are arranged along the longitudinal direction of the first heat transfer sheet 2 -1 ' 2 - 2 . The second fin portion 4 composed of the thin plate fins is thermally connected to the entire outer surface of the second heat transfer plate 3 opposite to the surface in contact with the heat pipe (upper side in Fig. 4). The plurality of thin plate fins of the second fin portion 4 are also arranged along the longitudinal direction of the second heat transfer sheet 3. The first fin portion 5 and the second fin portion 4 are formed on the first heat transfer sheets 2-1 and 2-2 and the second heat transfer sheet 3 at a desired fin pitch. Between the first heat transfer sheets 2-1 and 2-2 and the second heat transfer sheet 3, the plurality of heat pipes 7-1 to 7-5 which are juxtaposed in a sandwich shape are thermally connected. In the vicinity of the center portion in the longitudinal direction of the second heat transfer sheet 3, the plurality of heat pipes 7-1 to 7-5 are placed in contact with each other without a gap. The central portion of the plurality of heat pipes is thermally connected to the heat transfer block 6 having good heat transfer properties. The heat transfer block 6 is integrally formed with a heat receiving portion 10 at the center portion and two side portions 6-1 and 6-2 made of metal having good heat transfer properties. The heat from the heat generating component (heat source) to the heat receiving portion 10 of the heat transfer block 6 belonging to the heat receiving surface is transmitted to the plurality of heat pipes 7-1, 7-2, 7-3, 7-4, 7-5, and The side block portions 6-1 and 6-2 are transmitted to the longitudinal and lateral directions of the second heat transfer sheet 3 by the plurality of heat pipes 7-1 to 7-5 and the both end block portions 6-1 and 6-2. The vast area of Dalat. Fig. 5 is a side view of the heat sink shown in Fig. 1. The -15-201144737 square end portion of the first heat transfer plates 2-1 and 2-2 which are not in contact with the heat pipe (the lower side in FIG. 5) is thermally connected by a thin plate fin. The first fin portion 5 is configured. The heat transfer block 6 is thermally connected between the first heat transfer sheets 2-1 and 2-2. The surface (on the upper side in Fig. 5) of the second heat transfer plate 3 on the side not adjacent to the heat pipe is thermally connected to the second heat sink portion 4 including the thin plate fins. Figures 6 through 10 are diagrams for explaining other aspects of the heat sink of the present invention. Figure 6 is an oblique view. Figure 7 is a diagram showing the back side. Figure 8 is the above figure. Figure 9 is a front view. The first diagram is a side view. The details are the same as those described with reference to Figs. 1 to 5 except for the cover members 9-1 and 9-2 which cover a part of the heat sink. The first heat transfer sheets 2-1 and 2-2 and the second heat transfer sheet 3 are sandwiched and held in a state of being thermally connected to the first fin portion 5 and the second fin portion 4, respectively. In the case of the plurality of heat pipes 7-1 to 7-5 arranged in parallel, they are fixed by the fixing portion 8. The plurality of heat pipes are disposed in a state where they are thermally connected to the metal heat transfer block 6 having good heat conductivity in the center portion. In the same manner as described above, the heat transfer block 6 is formed by integrally forming the two end block portions 6-1 and 6-2 made of metal having good heat transfer properties on both sides. Blocks arranged by contact with the linear side surface portions of the central portions of the two outer heat pipes 7-1, 7-5 and the upper portions of the central portions of the plurality of heat pipes 7-1 to 7-5 In the heat transfer block 6 composed of the portions 6-1 and 6-2 and the heat receiving portion 10, the heat of the heat generating component is spread in the lateral direction. As a result, heat spreads throughout the heat sink and dissipates heat through the heat sink. Fig. 11 is a cross-sectional view showing the shape in which the thin plate fins of the heat sink of the present invention are joined to the heat transfer sheets (2-1, 2-2, or 3). Thin plate heat sink -16- 201144737 Available in a variety of shapes to meet the heat sink configuration and configurable space. Further, the thin plate fins of various shapes can be freely combined. In the aspect shown in Fig. 1(a), the thin plate fins having a three-dimensional cross section formed by the bottom surface, the vertical surface, and the upper surface are arranged side by side in the lateral direction. Heat sink portion 4. In this aspect, the plurality of bottom surfaces are arranged side by side to form a flat heat receiving surface, and the first heat transfer sheets 2-1 and 2-2 or the second heat transfer sheet 3 are thermally connected to the flat heat receiving surface. At the same time, the upper surface of the plurality of fins arranged side by side also forms a flat surface. In the connection method of the thin plate fins, other various known techniques such as solder connection and soldering can be employed (the same applies to other examples). In the aspect shown in Fig. 11(b), the thin plate fins having the L-shaped cross section formed by the bottom surface and the vertical surface are arranged side by side in the lateral direction to form the fin portion 4. In this aspect, a plurality of bottom surfaces are also arranged in parallel to form a flat heating surface, and the fin portion 4 is opened on the upper surface side. In the aspect shown in Fig. 1(c), the thin plate fins having a three-dimensional cross section formed by the bottom surface, the vertical surface, and the upper surface, and the L-shaped thin plate composed of the bottom surface and the vertical surface are appropriately combined. The fins are formed to form the fin portion 4. The combination is not limited to the illustrated embodiment, and the fin portion 4 described with reference to Fig. 1(c) may be disposed on both end sides, and the central portion may be combined with reference to Fig. 1(a). Other random combinations such as heat sink parts. The thin plate fins of the first embodiment shown in Figs. 1(a) to (c) are joined to the first heat transfer plate 2 or the second heat transfer plate 3 by soldering, welding or the like. In the first heat transfer sheets 2-1 and 2-2 and the second heat transfer sheet 3 on both sides of -17-201144737, the sheet of the pattern shown in Figs. (a) to (c), respectively. The dispersion consists of the same thin plate heat sink and different thin plate heat sinks. For example, a thin plate fin shown in Fig. 1(a) may be attached to the lower surface of the first heat transfer sheet 2_丨, and the upper surface of the second heat transfer sheet 3 may be attached to Fig. 11(b). The thin plate heat sink shown. According to the heat sink of the present invention, a high-performance heat sink with low mechanical weight and low cost and improved heat dissipation performance can be provided. [Simple description of the drawing] FIG. 1 is for explaining the present An oblique view of one aspect of the heat sink of the invention. Fig. 2 is a view showing the back side of one aspect of the heat sink of the present invention. Figure 3 is a top view of one aspect of the heat sink of the present invention. Figure 4 is a front elevational view of one aspect of the heat sink of the present invention. Figure 5 is a side elevational view of one aspect of the heat sink of the present invention. Figure 6 is a perspective view for explaining another aspect of the heat sink of the present invention. Fig. 7 is a view showing the back side of another aspect of the heat sink of the present invention. Figure 8 is a top view of another aspect of the heat sink of the present invention. Figure 9 is a front elevational view of another aspect of the heat sink of the present invention. Figure 10 is a side elevational view of another aspect of the heat sink of the present invention. Fig. 1 is a cross-sectional view showing the shape of a thin plate fin of the heat sink of the present invention -18 - 201144737. [Description of main component symbols] 1 : Heat sinks 2-1 and 2-2 : First heat transfer plate 3 : Second heat transfer plate 4 : Second heat sink portion 5 : First heat sink portion 6 : Heat transfer block 6 -1, 6 - 2 . Two ΐ ί and blocks 7-1 to 7-5 : Heat pipe 8 : Fixing parts 9 -1, 9 - 2 : Cover 1 〇: Heated part 2 0 : Heated part -19-

Claims (1)

201144737 七、申請專利範圍: 種散熱器,其特徵爲:具備有: 胃1傳熱板材,其係在其中一方的面與發熱零件作熱 連接’熱連接有由薄板散熱片所構成的第1散熱片部; 第2傳熱板材,其係在其中一方的面熱連接有由薄板 散熱片所構成的第2散熱片部; 熱導管,其係在前述第丨傳熱板材的另一方的面與前 述第2傳熱板材的另一方的面之間作熱連接;及 傳熱塊,其係與前述熱導管的側面及上面作熱連接, 以在與前述第2傳熱板材之間包夾前述熱導管的方式予以 熱連接配置。 2. 如申請專利範圍第1項之散熱器,其中,前述熱導 管係至少一部分具備有彎曲部,且並列配置的複數熱導管 ’前述傳熱塊係與位於前述並列配置的複數熱導管的兩端 部的位置的熱導管的側面及複數熱導管的上面作熱連接予 以配置。 3. 如申請專利範圍第1項或第2項之散熱器,其中,前 述第1散熱片部係由與前述第1傳熱板材的表面呈垂直配置 的平行的複數薄板散熱片所構成,在前述第1傳熱板材的 長邊方向的其中一方端部或全面,沿著前述第1傳熱板材 的寬幅方向以預定間隔而設。 4. 如申請專利範圍第1項或第2項之散熱器,其中,前 述第2散熱片部係由與前述第2傳熱板材的表面呈垂直配置 的平行的複數薄板散熱片所構成,沿著前述第2傳熱板材 -20- 201144737 的長邊方向遍及大槪全面而設。 5. 如申請專利範圍第1項至第4項中任一項之散熱器, 其中,前述複數熱導管係由扁平形狀的熱導管所構成,至 少在中央部相互接觸且平行配置,前述複數熱導管的一部 分熱導管的前述彎曲部係沿著配置有前述第2散熱片部的 前述第2傳熱板材的前述端部予以配置。 6. 如申請專利範圍第1項至第4項中任一項之散熱器, 其中,前述複數熱導管係由扁平形狀的熱導管所構成,未 相互接觸而熱導管彼此隔著間隔予以平行配置,前述複數 熱導管的一部分熱導管的前述彎曲部係沿著配置有前述第 2散熱片部的前述第2傳熱板材的前述端部予以配置。 7. 如申請專利範圍第1項至第6項中任一項之散熱器, 其中,前述複數熱導管係將沿著前述第2傳熱板材的長邊 方向被配置在中央的直線狀熱導管爲中心而配置成對稱或 非對稱。 8. 如申請專利範圍第1項至第7項中任一項之散熱器, 其中,具備有固定構件,其係在藉由前述第1傳熱板材及 前述第2傳熱板材包夾有前述熱導管的狀態下,固定在散 熱器周圍部》 -21 -201144737 VII. Patent application scope: A kind of radiator, which is characterized by: having: a heat transfer plate of stomach 1 which is thermally connected to a heat-generating part on one of the faces. 'The first connection is made up of a thin plate heat sink. a heat sink portion; a second heat transfer sheet on which one of the surfaces is thermally connected to a second fin portion composed of a thin plate fin; and a heat pipe attached to the other surface of the second heat transfer sheet Thermally connecting with the other surface of the second heat transfer plate; and a heat transfer block thermally connected to the side surface and the upper surface of the heat pipe to sandwich the second heat transfer plate The manner of the aforementioned heat pipe is thermally connected. 2. The heat sink according to claim 1, wherein the heat pipe is provided with at least a part of a plurality of heat pipes of the plurality of heat pipes arranged in parallel, and the heat transfer block and the plurality of heat pipes located in the parallel arrangement The side of the heat pipe at the end position and the upper surface of the plurality of heat pipes are thermally connected. 3. The heat sink according to claim 1 or 2, wherein the first fin portion is formed by a plurality of parallel thin plate fins disposed perpendicular to a surface of the first heat transfer sheet; One of the end portions or the entire length of the first heat transfer sheet in the longitudinal direction is provided at a predetermined interval along the width direction of the first heat transfer sheet. 4. The heat sink according to claim 1 or 2, wherein the second fin portion is formed by a plurality of parallel thin plate fins disposed perpendicular to a surface of the second heat transfer sheet. The long-side direction of the second heat transfer plate -20- 201144737 is comprehensive throughout the day. 5. The heat sink according to any one of claims 1 to 4, wherein the plurality of heat pipes are composed of flat-shaped heat pipes, at least in a central portion in contact with each other and arranged in parallel, the plurality of heats The bent portion of a part of the heat pipe of the duct is disposed along the end portion of the second heat transfer sheet on which the second fin portion is disposed. 6. The heat sink according to any one of claims 1 to 4, wherein the plurality of heat pipes are formed by flat heat pipes, which are not in contact with each other and the heat pipes are arranged in parallel with each other at intervals The bent portion of a part of the heat pipes of the plurality of heat pipes is disposed along the end portion of the second heat transfer sheet on which the second fin portion is disposed. 7. The heat sink according to any one of claims 1 to 6, wherein the plurality of heat pipes are linear heat pipes disposed at a center along a longitudinal direction of the second heat transfer plate. Configured symmetrically or asymmetrically for the center. 8. The heat sink according to any one of claims 1 to 7, wherein the heat sink is provided with a fixing member that is sandwiched between the first heat transfer plate and the second heat transfer plate In the state of the heat pipe, fixed around the radiator section - 21 -
TW100106203A 2010-02-26 2011-02-24 Heat sink TWI458927B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010041467 2010-02-26

Publications (2)

Publication Number Publication Date
TW201144737A true TW201144737A (en) 2011-12-16
TWI458927B TWI458927B (en) 2014-11-01

Family

ID=44506770

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100106203A TWI458927B (en) 2010-02-26 2011-02-24 Heat sink

Country Status (5)

Country Link
US (1) US20120247735A1 (en)
JP (1) JP5684228B2 (en)
CN (1) CN102484105A (en)
TW (1) TWI458927B (en)
WO (1) WO2011105364A1 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9157585B2 (en) 2012-03-28 2015-10-13 Milwaukee Electric Tool Corporation Area light
US9091402B2 (en) 2012-03-28 2015-07-28 Milwaukee Electric Tool Corporation Area light
WO2014088044A1 (en) * 2012-12-06 2014-06-12 古河電気工業株式会社 Heat sink
USD779694S1 (en) 2013-08-27 2017-02-21 Milwaukee Electric Tool Corporation Portable light
EP3163988B1 (en) * 2014-06-24 2019-01-09 Mitsubishi Electric Corporation Cooling device
US9851088B2 (en) 2015-02-04 2017-12-26 Milwaukee Electric Tool Corporation Light including a heat sink and LEDs coupled to the heat sink
JP5970581B1 (en) * 2015-03-30 2016-08-17 株式会社フジクラ Thermal diffusion plate for portable electronic devices
US10378739B2 (en) 2015-04-24 2019-08-13 Milwaukee Electric Tool Corporation Stand light
US10775032B2 (en) 2015-07-01 2020-09-15 Milwaukee Electric Tool Corporation Area light
CN105258539B (en) * 2015-10-09 2018-07-31 东莞汉旭五金塑胶科技有限公司 Radiator
US10323831B2 (en) 2015-11-13 2019-06-18 Milwaukee Electric Tool Corporation Utility mount light
USD816252S1 (en) 2016-05-16 2018-04-24 Milwaukee Electric Tool Corporation Light
JP6749293B2 (en) 2017-08-09 2020-09-02 ダイキン工業株式会社 Outdoor unit of refrigeration equipment
US10433461B2 (en) 2017-10-30 2019-10-01 Google Llc High-performance electronics cooling system
WO2022181343A1 (en) * 2021-02-25 2022-09-01 日本電産株式会社 Cooling device
JP7261848B1 (en) 2021-10-12 2023-04-20 レノボ・シンガポール・プライベート・リミテッド Electronics and cooling modules

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5283715A (en) * 1992-09-29 1994-02-01 International Business Machines, Inc. Integrated heat pipe and circuit board structure
JP2000124374A (en) * 1998-10-21 2000-04-28 Furukawa Electric Co Ltd:The Plate type heat pipe and cooling structure using the same
US6807058B2 (en) * 2002-11-20 2004-10-19 International Business Machines Corporation Heat sink and combinations
US20050098300A1 (en) * 2003-09-12 2005-05-12 Kenya Kawabata Heat sink with heat pipes and method for manufacturing the same
JP4495021B2 (en) * 2005-03-30 2010-06-30 古河電気工業株式会社 Heat sink for vehicle mounting
JP2007134472A (en) * 2005-11-10 2007-05-31 Shinko Electric Ind Co Ltd Heat radiating plate and semiconductor device
TW200736888A (en) * 2006-03-17 2007-10-01 Foxconn Tech Co Ltd Heat dissipating device and base thereof
US20080055855A1 (en) * 2006-09-06 2008-03-06 Vinod Kamath Heat sink for electronic components
TWM309147U (en) * 2006-11-01 2007-04-01 Shine Huan Entpr Co Heat-sink device of CPU
TWI332142B (en) * 2007-04-27 2010-10-21 Foxconn Tech Co Ltd Heat dissipation device with heat pipe
US7779897B2 (en) * 2007-07-02 2010-08-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipes
TWM325536U (en) * 2007-07-06 2008-01-11 Hon Hai Prec Ind Co Ltd Heat dissipater
US20090159252A1 (en) * 2007-12-20 2009-06-25 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink having bumps for positioning heat pipes therein
CN101528018A (en) * 2008-03-07 2009-09-09 富准精密工业(深圳)有限公司 Heat radiating device and manufacturing method thereof
TWI413889B (en) * 2008-06-06 2013-11-01 Foxconn Tech Co Ltd Heat dissipation device

Also Published As

Publication number Publication date
WO2011105364A1 (en) 2011-09-01
TWI458927B (en) 2014-11-01
JPWO2011105364A1 (en) 2013-06-20
JP5684228B2 (en) 2015-03-11
CN102484105A (en) 2012-05-30
US20120247735A1 (en) 2012-10-04

Similar Documents

Publication Publication Date Title
TW201144737A (en) Heat sink
TWI465885B (en) Heat sink
TWI619430B (en) Heat sink
JP4466644B2 (en) heatsink
US9307678B2 (en) Low thermal resistance cooler module for embedded system
US20150219400A1 (en) Heat sink
TW201024982A (en) Heat dissipation device
US10281220B1 (en) Heat sink with vapor chamber
TWI498519B (en) Heat dissipating module
JP2001223308A (en) Heat sink
JP2011091088A (en) Heat radiation structure of heating element and semiconductor device using the heat radiation structure
JP6178981B2 (en) Cooling system
JP2002151636A (en) Heat sink
JP4529703B2 (en) Heat dissipation structure and heat dissipation parts
KR20160036470A (en) Sintered flat panel heat dissipation structure comprising outer pin
JP2012169529A (en) Radiator
TWI656828B (en) Heat sink
JP4151265B2 (en) Radiator
TWI294763B (en) Heat dissipation device
TWM586460U (en) Heat dissipation apparatus
JP3192498U (en) Heat pipe fixture and cooling chimney structure
TWM249104U (en) Heat dissipating device using heat pipe
TWI327055B (en) Heat dissipation module
TWI334527B (en) Heat dissipation device
TWI391087B (en) Expansion card assembly and heat sink thereof