九、發明說明： 【發明所屬之技術領域】 本發明涉及-種熱管散熱㈣m 疋器件之熱管散熱裝置。 裡令部-电子 【先前技術】 件太Γ!器件運行時產生大量熱量，使系統及電子元哭 量快速散發出去在其表面安裝—散熱裝置以將其熱IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a heat pipe heat dissipation device for a heat pipe heat dissipation (four) m 疋 device. Liling-Electronic [Prior Art] Pieces are too embarrassing! The device generates a lot of heat when it is running, so that the system and the electronic element cry out quickly to install on its surface-heat sink to heat it.
=散熱裝置包括與電子元器件相接觸之—底板 :於：板上之複數散熱鰭片。底板用來吸收電…件產 之…1，再通過散熱鰭片把熱量散發到空氣中 ::件體積越來越小、發熱量更加集中，局限 J ==，底板中心處之熱量往往過於集中，無ί 破性提高。…^上散熱’影響散熱效果，難以獲得突 熱傳=大:=多Τ管用於散熱裝置中。熱管 一—午大大回於如銅、鋁等純金屬，且傳熱不定向、有= The heat sink includes a contact with the electronic component - the bottom plate: on the board: a plurality of heat sink fins. The bottom plate is used to absorb electricity...1, and then dissipate heat into the air through the fins: the volume of the piece is getting smaller and smaller, the heat is more concentrated, and the limit is J ==, the heat at the center of the bottom plate is often too concentrated. , no ί increased the damage. ...^heating on the heat effect, it is difficult to obtain heat transfer = large: = multi-tube is used in the heat sink. The heat pipe is mainly returned to pure metals such as copper and aluminum, and the heat transfer is not oriented.
At疋長度，可以將熱量傳遞至較遠距離，因此，對散熱性 月匕有明顯之提昇作用。 … 【發明内容】 本么明熱官散熱裝置一實施例包括一底板及設於底板 1332142 上之複數散熱片.，該底板—表㈣ 三第二熱管分別彎折並嵌設於上述底板溝槽内，4第献一熱管及 呈S形且包括三傳熱段，分別為：：弟-？管大致 段兩端分別反向回彎而延伸出 ·：又及自第-傳熱 熱管大致呈U形且包括一第—傳C，每-第二 弓折延伸之一第二傳熱段，二第二钕 得…奴末糕 其中第-熱管之第一傳熱段及二朝向相反， 二傳熱段均位於相對遠離底:;:處熱段:_二=之熱，第 =熱段位於-第二熱管之二傳熱段之間，第：：=二 第-傳熱段位於另-第二熱管之 之第-傳熱段位於n管之Β間’弟一熱管 管之二第二傳熱段分別位;段:間广熱 侧。 ”，、s之一第一傳熱段内 與習知技術相t匕，該#管散熱裝置第管 熱段兩端相反回彎形成之二第二傳熱段’可將其第一傳執 段吸收之熱量向底板兩侧傳導’而第二熱管之二傳熱段進 一步將第-熱管傳導之熱量均勻擴散到底板上再通過散 熱韓片向周圍空氣中散熱，使散熱裝置整體之 提高。 j 【實施方式】 請參閱第-圖及第二圖，係本發明熱管散熱裝置之第 -實施例。該熱管散熱裝置包括—底板1G、設置於底板ι〇 9 1332142 士之散熱片組20及埋設於底板1〇與散熱片組扣之 第一熱管36及二第二熱管32。 該底板1G採用銅、銘等導熱性能良好之材料 盆 ^呈矩形。底板Π)底部用於與發熱電子㈣（圖未示/)、 接觸，以吸收熱S，其上表面開設有分別與第— 管36、32相配合之第一溝槽14及二第二溝槽η，第:溝 槽^大致呈S形、二第二溝槽12大致呈〇形且開口方向 相反。該第-溝槽14兩端分別與二第二溝槽心端交錯 設置。底板ίο兩邊相對邊緣處對稱開設有二固定孔π。曰 第二熱管32彎折而呈U形且橫戴面呈扁平狀并置於底 板1〇之第二溝槽12中，其包括兩平行且間隔之第一傳： 段322及第二傳熱段324以及連接二者之連接段。其中第、 -傳熱段322位於底板中部，為其蒸發段；第二傳献段似 位於相對遠離中部處，為其冷凝段m管·，32間隔 开排容置於底板H)之第二溝槽12中且其㈣開口方向相 反。 第-熱管36經彎折而呈s形且橫截面亦呈扁平狀并置 於底板ίο之第-溝槽14中。第一熱管36位於前述二第二 熱管32之間’包括平行且間隔之一第一傳熱段如及由第 -傳熱段兩端反向回彎而成之二第二傳熱段遍。其中，第 -傳熱段362位於底板中部，作為蒸發段且位於二第二敎 管32之第-傳熱段322之間，二第二傳熱段⑽位於相對 遠離中4處’作為冷凝段且分別位於第二熱管^之第一傳 熱段322與第二傳熱段324之間。第—、第二熱管Μ、％The At疋 length can transfer heat to a long distance, so there is a significant improvement in the heat dissipation. [Explanation] An embodiment of the present invention includes a bottom plate and a plurality of heat sinks disposed on the bottom plate 1332142. The bottom plate-table (four) three second heat pipes are respectively bent and embedded in the bottom plate groove Inside, 4 is a heat pipe and is S-shaped and includes three heat transfer sections, respectively:: brother-? The two ends of the pipe are respectively bent back and extended respectively: and the first heat transfer heat pipe is substantially U-shaped and includes a first pass C, and each second stretch extends one of the second heat transfer segments. Second, the second 钕...the first end of the first heat transfer section and the second direction of the first heat pipe, the two heat transfer sections are located relatively far from the bottom:;: hot section: _ two = heat, the first = hot section Located between the two heat transfer sections of the second heat pipe, the::=two-heat transfer section is located at the first heat transfer section of the second heat pipe, and the second heat transfer section is located between the n-tubes The two heat transfer sections are respectively located; the section: the wide heat side. In the first heat transfer section of one of the "s," and the conventional technique, the second heat transfer section of the heat pipe of the heat pipe is oppositely formed at the opposite ends of the heat pipe. The heat absorbed by the segment is conducted to both sides of the bottom plate, and the heat transfer portion of the second heat pipe further diffuses the heat conducted by the first heat pipe evenly onto the bottom plate, and then dissipates heat to the surrounding air through the heat dissipating film, thereby improving the overall heat dissipation device. [Embodiment] Please refer to the first and second figures, which are the first embodiment of the heat pipe heat dissipating device of the present invention. The heat pipe heat dissipating device comprises a bottom plate 1G, a heat sink group 20 disposed on the bottom plate ι〇1 1332142 and The first heat pipe 36 and the second heat pipe 32 are embedded in the bottom plate 1〇 and the heat sink assembly buckle. The bottom plate 1G is made of a material having a good thermal conductivity such as copper or ingot, and the bottom plate is used for heating electrons (4). (not shown /), contact, to absorb heat S, the upper surface thereof is provided with a first groove 14 and two second grooves η respectively matched with the first tubes 36, 32, the first: The S-shaped and the second second grooves 12 are substantially in the shape of a dove and have opposite openings. The two ends of the groove 14 are respectively staggered with the two second groove core ends. The bottom plate ίο is symmetrically opened at two opposite sides with two fixing holes π. The second heat pipe 32 is bent and U-shaped and the transverse surface is flat and The first trench 12 is disposed in the second trench 12 of the bottom plate, and includes two parallel and spaced first passes: a segment 322 and a second heat transfer segment 324, and a connecting portion connecting the two. The first heat transfer segment 322 is located The middle part of the bottom plate is the evaporation section; the second distribution part seems to be located relatively far from the middle part, and the condensation section m tube ·, 32 is spaced apart and placed in the second groove 12 of the bottom plate H) and its (four) opening direction In contrast, the first heat pipe 36 is bent in an s shape and has a flat cross section and is placed in the first groove 14 of the bottom plate ί. The first heat pipe 36 is located between the two second heat pipes 32' including parallel and One of the first heat transfer sections is divided into two second heat transfer sections which are reversely bent back from both ends of the first heat transfer section, wherein the first heat transfer section 362 is located in the middle of the bottom plate as an evaporation section and is located Between the first heat transfer section 322 of the second manifold 32, the second heat transfer section (10) is located relatively far from the middle 4 'as a condensation section A first heat transfer section located between the second heat pipe 322 and the ^ second heat transfer section 324 first -., Second heat pipe Μ,%
1JJZ14Z 減等方法固定於第一、第二溝槽㈣内 开路於底板H)之表面與底板1G上表面大致共面。 月文熱片組20係由複數散敎η n .^ . 鋁尋導熱性能良好之材料萝成。埒 .熱片組20通過焊接等方式 襄成放 一、第-埶总κ 疋於底板10上表面并與第 上吸^:、 接觸，從㈣可直接從熱管32、36 ί=:Ζ底板10上吸收熱量，在其與底板1〇 便於安對應處設置有無散熱片之二容置部以，以 之二之第:傳熱段362兩端反向回彎形成 其32之-禮^ 另字熱里同時向底板兩側傳導，第二熱 I執”二…段似324進一步將第-熱管36傳導過來 擴敎到底板10上，再通過散熱…向周 賴’使散歸置之散祕能得到了提昇。 區別m本二Λ^’較第一實施例而言，其 中之三個熱管，分別作為。=:第=述實施例 第-熱管和第二熱管4。相靠之傳 錯: 足散熱要求之同時，減少熱管數量，降低;;錯:又置在滿 第-二其本發明之第三實施例’較第-實施例而言，二 弟—…、吕42之υ形開口方向相同，其中 其 包括作為蒸發段的第 一’、、、s 敎段424 1 ^ 和作為冷凝段的第二傳 ，…4,弟-熱官44為Μ形，包括位於底板中部之第一 傳熱段442及由第-傳熱段442兩端反向回彎形成 二傳熱段444。第一埶管44 攻之一弟 ^ + A ”、、S 44及一弟二熱管42位於底板上盥 相配1溝槽中。其中第—熱管44的一第二傳熱段糾 位於相對遠離底板中部處 ·、、、 ⑭广另弟—傳熱段444位於底板 乂: 專熱段442相反方向彎折延伸出第三傳轨 段州。相對遠離底板中部之第二傳熱段4 ^； ::作為冷凝段分別位於相應第二熱管42二傳熱段2 於底板中。J5之第二傳熱段444及一 蒸發段’位於二第二埶管42之門…得」又442作為 ，^ ^ … 間如此之設置，使底板及 :接觸面積增加’對應熱源處之傳熱面積進一步加 大，散熱效果進一步提高。 =上所述:本發明符合發明專利要件爱依法提出專 甸染Γ &卩上所述者僅為本發明之較佳實施例，舉凡 无'心案技藝之人士，在㈣本發㈣神所作之等效修都 或變化，皆應涵蓋於以下之申請專利範圍内。 ^ 【圖式簡單說明】 第-圖係本發明熱管散熱裝置第一實施例之分解圖。 第二圖係第一圖中熱管散熱裝置之組合圖。 第二圖係本發明第二實施例之分解圖。 第四圖係本發明第三實施例之分解圖。 【主要元件符號說明】 底板 1〇 第二溝槽 12 第一溝槽 14 第一熱管 36、44 12 1332142 第二熱管 32、 42 固定孔 16 364、 324 362、 322 第二傳熱段 444、 424 第一傳熱段 442、 422 第三傳熱段448 散熱片 22 容置部 18 散熱片組 20 埶管 40 13The 1JJZ14Z subtraction method is fixed in the first and second grooves (4). The surface of the bottom plate H) is substantially coplanar with the upper surface of the bottom plate 1G. The 20 series of the monthly hot film group consists of a plurality of materials, η n .热. The hot film group 20 is formed by welding or the like to form a first, first - 埶 total κ 疋 on the upper surface of the bottom plate 10 and contact with the first suction ^:, from (4) directly from the heat pipe 32, 36 ί =: Ζ bottom plate The heat is absorbed on the 10, and the second receiving portion of the heat sink is disposed at the corresponding position of the bottom plate 1 ,, and the second portion of the heat transfer portion 362 is reversely bent to form the 32-- At the same time, the word heat is transmitted to both sides of the bottom plate, and the second heat is performed. The second heat is 36, and the first heat pipe 36 is further transferred to the bottom plate 10, and then the heat is dissipated to the Zhou Lai. The secret can be improved. The difference between the two is the same as that of the first embodiment, three of which are respectively taken as the ==: the first embodiment of the heat pipe and the second heat pipe 4. Wrong: At the same time, the heat dissipation requirement is reduced, the number of heat pipes is reduced, and the number of heat pipes is reduced;; wrong: it is placed in the second-second embodiment of the present invention, compared with the first embodiment, the second brother-... The shape of the opening is the same, wherein it includes the first ', ', s 敎 section 424 1 ^ as the evaporation section and the second pass as the condensing section, ... 4, the younger officer 44 is a dome shape, comprising a first heat transfer section 442 located in the middle of the bottom plate and a reverse bend back from the both ends of the first heat transfer section 442 to form two heat transfer sections 444. The first manifold 44 attacks one of the brothers ^ + A ” The S 44 and the first two heat pipes 42 are located on the bottom plate and are matched in the groove. The second heat transfer section of the first heat pipe 44 is located at a position relatively far from the middle of the bottom plate, and the heat transfer section 444 is located at the bottom plate 乂: the heat transfer section 442 is bent in the opposite direction to extend the third track. Duanzhou. The second heat transfer section 4 ^; at a distance from the middle of the bottom plate is located in the bottom plate of the respective second heat pipe 42 and the heat transfer section 2 respectively. The second heat transfer section 444 of J5 and an evaporation section 'is located at the gate of the second second manifold 42" and 442 as the arrangement between the ^^, so that the bottom plate and the contact area are increased 'corresponding to the heat source' The thermal area is further increased, and the heat dissipation effect is further improved. =The above: The present invention meets the requirements of the invention patents, and the above-mentioned ones are only preferred embodiments of the present invention, and those who do not have the skill of the heart, in (4) the hair (four) god Equivalent repairs or changes made shall be covered by the following patent applications. ^ [Simple Description of the Drawings] The first drawing is an exploded view of the first embodiment of the heat pipe heat dissipating device of the present invention. The second figure is a combination diagram of the heat pipe heat sink in the first figure. The second drawing is an exploded view of a second embodiment of the present invention. The fourth drawing is an exploded view of a third embodiment of the present invention. [Main component symbol description] Base plate 1 〇 second groove 12 first groove 14 first heat pipe 36, 44 12 1332142 second heat pipe 32, 42 fixing hole 16 364, 324 362, 322 second heat transfer section 444, 424 First heat transfer section 442, 422 third heat transfer section 448 heat sink 22 accommodating portion 18 heat sink group 20 manifold 40 13