200915051 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種散埶妒 件散熱之散熱裝置。·、、 尤，、涉及—種用於電子天 【先前技術】 諸如電腦中央處理器、北橋 運行時會產生大量之熱量，竽等埶旦‘I力羊屯子凡件在 發，將直接導致溫产驟Γ上^ 能被有效地散 正常運行。為此，需要：力气：：重影響到電子元件之 件進行散熱。❿要添加一散熱裝置來對該等電子元器 】知散熱裝置通常包括一底座、複數設置 之，-、曰片，以及熱連接底座與鰭片之複數熱管 結 ;平行：置’每相鄰兩鰭片之間形成供氣流通過：： 複數凹槽。每一鰭片上亦開設複數之通：， …k孔聯合形成供熱管通過之通道。每―熱管呈“〔，， 形’包括-水平之蒸發段、一水平之冷凝段和一 =與冷凝段之豎直之絕熱段。該蒸發段容置在底座之凹、槽 “而2段則從_片之側面插人各，鰭片之通孔形成㈣ 一内”黃向穿插通過鰭片間之氣流流道。由於受埶 官形狀之限制，處於最外側之鰭片很難與熱管鄰近絕埶： 之^疑段部分有效地熱連接，熱阻較大，因此_片利用^ 尚’5V響整個散熱裝置之散熱效率。另外，熱管之冷凝 丰又=向插入鰭片間之氣流流道，阻擋氣流流通之路徑，降 低乳流之流通速度，使氣流不能達到應有之冷卻鰭片之效 200915051 果，因而降低整個散熱裝置之散熱性能。 【發明内容】 有鑒於此，有必要提供—絲曰+t 妒置。 ，、種具有較佳散熱性能之散熱 一種散熱裝置，用於對带工-灿…* 一為、^ 對甩子兀件散熱，包括一底座、 一熱導板、置於底座與埶導柘 ^ 也 …、¥板之間之鰭片組及連接該底座 與熱導板之一第一熱管，該键 Λ，·，、曰片組包括禝數互相平行設置 之放熱縛片’母相鄰兩散埶鍵 _ _ ^ …‘1月間形成供氣流通過之流 迢’該弟一熱管包括蒸發段、 1 i；1_ + 令/旋'^又及連接該蒸發段與冷 ^又之中㈣’該蒸發段與底錢接，該冷凝段與熱導板 道延伸方向平行。延伸方向與該散熱鰭片間之流 與習知技術相比，由於該散献 連接，熱導板再與鰭片址均勺連接裝^之熱官與熱導板 e, ^ ^ ^ A 勺句連接，可避免熱管與鰭片組 間之連接不良現象，且埶管 、Ά a ^ 間丰又置於鰭片組之一端， 避免熱管之任何部分插入通過鰭片組内之氣流济、首， 部氣流能快速通過流道，能及時册、L/;IL、 吏令 提合埒献驻罢, 此及日守贡走鰭片組之熱量，從而 捉问放熱裝置之散熱效率。 【實施方式】 圖1與圖2所示為本發明散熱裝置之—較 該散熱裝置詩安裝在電腦等電子裝置/ 上’以用來對電路板上之發巧子 ^ (圖未示） 卢饰时门& X…电卞70件（圖未示）如中麥 2^、二1卡晶片等散熱。該散熱裳置包括一底座 …導板40、-置於底座2G與熱導板4〇間之趙片組 200915051 30及三根連接底座20與熱導板4〇之熱管5〇a、5仙、刈c。 底座20由高導熱性能之材料如銅或者料製成。底座 20大致呈長方塊狀，在其四個角上分別開設有一個通孔 24。該等通孔24用以供螺釘（圖未示）穿過從而將底座如 固鎖在電路板上。發熱電子元件貼設在底座2g之底面上， 其散發之熱量由底座20吸收。底座2〇之項面上開設有三 :互相平行之凹槽22，該等凹槽22相隔較近，且沿縱向貫 穿底座20之整個頂面。 、"一=片、組30設置在底座2〇上。錯片，组3〇包括複數互相 平仃设置之散熱鰭片31，散熱鰭片31沿鰭片組30之前後 =向延伸’每兩相鄰之散熱鰭片31之間形成供氣流通過之 ▲道32°氣流沿圖！中箭頭所示之方向從散熱裝置之一端 、C 32到達散熱裝置之另—端，從而帶走鰭片組％ 之熱量。位於鰭片組3〇 +間部分之散熱縛片Μ比位於籍 片組3〇兩外側之少數幾個散熱鳍片3U豆，從而韓片組30 立：鸲之幵/狀形成為階梯狀。其中鰭片組％之一端之中間 邛刀形成一容置空間34 ,該容置空間34在鰭片組30之橫 2比較狹長’使底座20之對應該端之兩通孔24暴露在 士 卜彳之而為螺釘通過通孔24提供操作空間。 5 '…& 50a' 5〇b、50c之部分也容置在該容置空間34内。 韓片*且s , 、 另—‘對應底座20之另外兩個通孔24之位置 :形成兩個容置空間36,同上述容置空間％，該兩個容置 工間36亦為螺釘通過通孔以提供操作空間。 ‘’、、導板40设蓋在鰭片組3〇上，且與鰭片組之頂面 200915051 形狀相同，因此剛好將鰭片組30之頂面完全覆蓋。與鰭片 組30上之容置空間34相對應，熱導板40之一端形成一個 缺口 44 ;而與鰭片組30上之容置空間36相對應，熱導板 40之另一端形成兩個缺口 46 ;該等缺口 44、46之形狀與 對應之容置空間34、36之橫截面之形狀相同。熱導板40 之底面沿從一端向另一端之方向形成三個凹槽42，三個凹 槽42互相平行，且貫穿熱導板40之整個底面。位於兩侧 之兩個凹槽42將熱導板40—端之缺口 44與另一端之兩個 缺口 46相連通。另外一個凹槽42位於熱導板40之中間、 兩側之兩個凹槽42之間，且該中間之凹槽42之長度比兩 侧之兩個凹槽42之長度要大。與底座20 —樣，熱導板40 亦由如銅、銘等高熱導材料製成。 三根熱管50a、50b、50c具有相同之形狀與功能。每 根熱管50a、50b、50c都大致呈U形，且都包括平直之蒸 發段52a、52b、52c，與蒸發段52a、52b、52c平行之冷凝 段56a、56b、56c以及垂直連接蒸發段52a、52b、52c和冷 凝段 56a、56b、56c 之中間段 54a、54b ' 54c。熱管 50a、 50c對稱地傾斜置於熱管50b之兩側，且蒸發段52a、52b、 52c緊密排列在一起，冷凝段56a、56b、56c互相平行但之 間間距較大，且冷凝段56b之長度比冷凝段56a、56c之長 度大。蒸發段52a、52b、52c容置在底座20之三個凹槽22 内。中間段54a、54b、54c置於鰭片組30之一端，更確切 地，係置於鰭片組30之容置空間34内。冷凝段56a、56b、 56c容置在熱導板40之三個凹槽42内。 8 200915051 組裝時，先將熱管50a、50b、50c之蒸發段52a、52b、 52c置於底板20之凹槽22内，再將鰭片組30置於底板20 上。鰭片組30之底面與底板20之頂面以焊接之方式連接 在一起。熱管50a、50b、50c之蒸發段52a、52b、52c夾置 在底座20和鰭片組30之間，因而蒸發段52a、52b、52c 分別與鰭片組30和底板20連接。熱管50a、50b、50c之 中間段54a、54b、54c置於鰭片組30之容置空間34内。 熱管50a、50b、50c之冷凝段56a、56b、56c與鰭片組30 之頂面連接。熱管50a、50b、50c之蒸發段52a、52b、52c 和冷凝段56a、56b、56c之延伸方向與鰭片組30之散熱鰭 片31之間之流道32互相平行。最後將熱導板40蓋在鰭片 組30上，且將熱導板40之底面與鰭片組30之頂面焊接在 一起。熱管50a、50b、50c之冷凝段56a、56b、56c容置在 熱導板40之凹槽42内，且夾置在熱導板40與鰭片組30 之間。至此，該散熱裝置組裝完畢。組裝後之散熱裝置其 熱管50a、50b、50c之中間段54a、54b、54c置於鰭片組 30 —端之容置空間34内，蒸發段52a、52b、52c置於鰭片 組30之底面底座20之凹槽22内，冷凝段56a、56b、56c 置於鰭片組30之頂面熱導板40之凹槽42内，亦即熱管 50a、50b、50c沿著從鰭片組30之底面到其一端，再到其 頂面之方向在鰭片組30之外圍環繞半圈。 該散熱裝置工作時，發熱電子元件產生之熱量由底座 20吸收。底座20吸收之部分熱量直接傳遞到鰭片組30， 然後通過強制氣流吹拂鰭片組30使熱量散發到外界環境 9 200915051 中。底座20吸收之另一部分熱量則由熱管50a、50b、50c \之蒸發段52a、52b、52c吸收並通過中間段54a、54b、54c r 向上傳遞到冷凝段56a、56b、56c。因為冷凝段56a、56b、 56c與熱導板40及鰭片組30連接，冷凝段56a、56b、56c 之熱量可快速地傳遞到熱導板40及鰭片組30,然後進一步 散發到外界環境中。熱導板40起到均熱之作用，吸收冷凝 段56a、56b、56c之熱量後，由於熱導板40面積較大，與 整個鰭片組30之頂面接觸，從而可快速而且均勻地將熱量 傳遞至鰭片組30，從而解決熱管50a、50b、50c之冷凝段 56a、56b、56c與鰭片組30接觸面積較小之問題，同時還 能解決熱管50a、50b、50c與鰭片組30之接觸不良之問題， 從而提升散熱裝置之散熱效率。由於熱管50a、50b、50c 之任何部位都沒有穿插在鰭片組30内，氣流通過鰭片組30 之流道32時不會遇到任何阻礙，可快速通過流道32，帶走 鰭片組30内之熱量，從而氣流對鰭片組30之散熱功效大 大提高。另外，熱管50a、50b、50c之中間段54a、54b、 54c置於鰭片組30之容置空間34内，並與鰭片組30之兩 侧較長之散熱鰭片31之一端平齊，因而熱管50a、50b、50c 沒有凸伸到鰭片組30之外，達到減小整個散熱裝置之體積 之功效。 如圖3所示為本發明散熱裝置之第二實施例。與上述 實施例相比，該散熱裝置還包括置於熱導板40之上之另一 鰭片組60。該鰭片組60之底面之形狀與熱導板40之頂面 相同。該鰭片組60也包括複數互相平行設置之散熱鰭片 10 200915051 61 ’且該.鰭片組60之結構與形狀與韓片組3〇大致 因而在此不再贅述。H片組6G之底面與熱導板4〇音， 通過焊接之方式連接在—起。熱管5〇a、通、5^之A每 段56a、56b、56c所帶來之熱量不但可以向下傳遞到= 組30進行散熱，還可以通過熱導板4〇向上傳遞到轉= 60,然後散發到外界環境中。該種雙向傳熱以及因該: Ϊ 置而增讀熱面狀模式可大讀高散熱ΐ 本實施例中m 6Q與熱導板4G為分開設 ==式連接在—起，可以理解地，該鰭片心 =導板40-體成型’亦即散熱鰭片“從熱導板 頂面向上一體延伸而成。 < ^上^’本發明符合發明專利.要件，綠法提 利申4。惟，以上所述者僅為 熟悉本案技藝之人士，m 實知例’舉凡 tb如 犮依本發明精神所作之等效修飾 ，化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖i為本發明散熱裂置第一實施例之組裝示意圖。 圖2為圖1所示散熱裝置之分解圖。 =3為本發明散熱裝置第二實施例之組裝示意圖。 底座 通孔 散熱鰭片 L主要元件符號說明】 20 24 31 凹槽 22、42 61 轉片組 30、60 流道 32 11 200915051 容置空間 34、36 熱導板 40 缺口 44、46 執管 50a 、 50b 、 50c 蒸發段 52a、52b、 52c 中間段 54a ' 54b、 54c 冷凝段 56a > 56b > 56c 12200915051 IX. Description of the Invention: [Technical Field] The present invention relates to a heat sink for heat dissipation of a heat sink. ·,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, The production of the sputum can be effectively dispersed. To do this, you need to: Force:: Re-influence the components of the electronic components for heat dissipation.添加A heat sink is added to the electronic components. The heat sink generally includes a base, a plurality of sets, a cymbal, and a plurality of heat pipe junctions that thermally connect the base to the fins; parallel: each adjacent An air flow is formed between the two fins:: a plurality of grooves. A plurality of passes are also provided on each of the fins: the ...k holes jointly form a passage through which the heat pipes pass. Each "heat pipe" is "[,, the shape includes: the horizontal evaporation section, the horizontal condensation section, and the vertical insulation section of the = condensation section. The evaporation section is accommodated in the concave and groove of the base" and the two sections Then inserting from the side of the _ piece, the through hole of the fin forms (4) one inside. The yellow direction is inserted through the air flow path between the fins. Due to the shape of the eunuch, the fin on the outermost side is difficult to be associated with the heat pipe. Neighboring: The suspected section is effectively thermally connected, and the thermal resistance is large. Therefore, the _chip uses ^5V to dampen the heat dissipation efficiency of the entire heat sink. In addition, the condensation of the heat pipe is equal to the airflow between the inserted fins. The road blocks the flow path of the airflow, reduces the flow velocity of the milk flow, and prevents the airflow from reaching the effect of the cooling fins that should be present, thereby reducing the heat dissipation performance of the entire heat sink. [Invention] In view of this, it is necessary to provide —Silk +t 。 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , placed on the base and 埶 guide 柘 ^ also... a fin group between the plates and a first heat pipe connecting the base and the heat guiding plate, the key Λ, ·, 曰 组 禝 禝 禝 禝 ' ' ' ' ' ' ' ' ' ' ' _ _ ^ ... 'The formation of a flow through the airflow through the month of 'the brother's heat pipe including the evaporation section, 1 i; 1_ + order / rotation '^ and connect the evaporation section and the cold ^ and (4) 'the evaporation section Connected with the bottom money, the condensation section is parallel to the direction in which the heat guide track extends. The flow between the extension direction and the heat dissipation fin is compared with the conventional technique, and the heat guide plate is again spaced from the fin site due to the loose connection. The heat officer of the connection device is connected with the heat guide plate e, ^ ^ ^ A, to avoid the connection between the heat pipe and the fin group, and the manifold and the Ά a ^ are placed at one end of the fin group. , to avoid any part of the heat pipe inserted into the airflow through the fin group, the first, the part of the airflow can quickly pass through the flow channel, can be timely, L /; IL, 提 提 提 提 , , , , , , , The heat of the fin group is used to capture the heat dissipation efficiency of the heat release device. [Embodiment] FIG. 1 and FIG. 2 show the heat dissipation device of the present invention. Compared with the heat sink, the poem is installed on the computer or other electronic device's for use on the circuit board. (not shown) Lujiao door & X...Electric 70 pieces (not shown) The heat dissipation device includes a base, a guide plate 40, a Zhao film group 200915051 30 placed between the base 2G and the heat guide plate 4, and three connection bases 20 and a heat guide plate. 4〇The heat pipe 5〇a, 5xian, 刈c. The base 20 is made of a material with high thermal conductivity such as copper or material. The base 20 is substantially long square, and has a through hole at each of its four corners. 24. The through holes 24 are for passing through screws (not shown) to lock the base such as the circuit board. The heat-generating electronic components are attached to the bottom surface of the base 2g, and the heat radiated by the base 20 is absorbed by the base 20. On the surface of the base 2, three grooves are formed which are parallel to each other, and the grooves 22 are closely spaced apart and penetrate the entire top surface of the base 20 in the longitudinal direction. , " one = piece, group 30 is set on the base 2 。. The chip 3 includes a plurality of heat-dissipating fins 31 arranged in a mutually flat manner. The heat-dissipating fins 31 are formed along the fin-group 30 before and after the extension of the heat-absorbing fins 31. Road 32 ° airflow along the map! The direction indicated by the middle arrow passes from one end of the heat sink, C 32 to the other end of the heat sink, thereby taking away the heat of the fin set %. The heat-dissipating fins located in the 3〇+ portion of the fin group are smaller than the few heat-dissipating fins 3U beans located on the outer side of the sheet group 3, so that the Korean sheet group 30 stands: the 幵/幵 shape is formed in a step shape. The intermediate boring tool at one end of the fin group % forms an accommodating space 34, and the accommodating space 34 is relatively narrow in the horizontal direction 2 of the fin group 30. The two through holes 24 at the corresponding ends of the base 20 are exposed to the stalk The screw provides an operating space through the through hole 24. Parts of 5 '...& 50a' 5〇b, 50c are also accommodated in the accommodating space 34. The position of the other two through holes 24 corresponding to the base 20: two accommodating spaces 36 are formed, which are the same as the above-mentioned accommodating space %, and the two accommodating spaces 36 are also passed by screws. Through holes to provide an operating space. ‘’, the guide plate 40 is disposed on the fin set 3〇 and has the same shape as the top surface of the fin set 200915051, so that the top surface of the fin set 30 is completely covered. Corresponding to the accommodating space 34 on the fin group 30, one end of the heat guiding plate 40 forms a notch 44; and corresponding to the accommodating space 36 on the fin group 30, the other end of the heat guiding plate 40 forms two The notches 46; the shapes of the notches 44, 46 are the same as the cross-section of the corresponding accommodating spaces 34, 36. The bottom surface of the heat guiding plate 40 is formed with three grooves 42 in the direction from one end to the other end, and the three grooves 42 are parallel to each other and penetrate the entire bottom surface of the heat guiding plate 40. Two recesses 42 on either side communicate the notch 44 at the end of the heat guide 40 with the two notches 46 at the other end. Another recess 42 is located between the two recesses 42 on the sides of the heat guide plate 40, and the length of the intermediate recess 42 is greater than the length of the two recesses 42 on both sides. Like the base 20, the heat guide plate 40 is also made of a highly thermally conductive material such as copper or ingot. The three heat pipes 50a, 50b, 50c have the same shape and function. Each of the heat pipes 50a, 50b, 50c is generally U-shaped and includes straight evaporation sections 52a, 52b, 52c, condensation sections 56a, 56b, 56c parallel to the evaporation sections 52a, 52b, 52c and vertical connection evaporation sections. Intermediate sections 54a, 54b' 54c of 52a, 52b, 52c and condensing sections 56a, 56b, 56c. The heat pipes 50a, 50c are symmetrically placed obliquely on both sides of the heat pipe 50b, and the evaporation sections 52a, 52b, 52c are closely arranged together, the condensation sections 56a, 56b, 56c are parallel to each other but with a large spacing therebetween, and the length of the condensation section 56b It is larger than the length of the condensation sections 56a, 56c. The evaporation sections 52a, 52b, 52c are received in the three recesses 22 of the base 20. The intermediate sections 54a, 54b, 54c are placed at one end of the fin set 30, and more specifically, within the receiving space 34 of the fin set 30. The condensation sections 56a, 56b, 56c are received within the three recesses 42 of the heat guide plate 40. 8 200915051 When assembled, the evaporation sections 52a, 52b, 52c of the heat pipes 50a, 50b, 50c are first placed in the recesses 22 of the bottom plate 20, and the fin sets 30 are placed on the bottom plate 20. The bottom surface of the fin set 30 is joined to the top surface of the bottom plate 20 by soldering. The evaporation sections 52a, 52b, 52c of the heat pipes 50a, 50b, 50c are sandwiched between the base 20 and the fin set 30, so that the evaporation sections 52a, 52b, 52c are connected to the fin set 30 and the bottom plate 20, respectively. The intermediate sections 54a, 54b, 54c of the heat pipes 50a, 50b, 50c are placed in the accommodating spaces 34 of the fin sets 30. The condensation sections 56a, 56b, 56c of the heat pipes 50a, 50b, 50c are connected to the top surface of the fin set 30. The direction in which the evaporation sections 52a, 52b, 52c and the condensation sections 56a, 56b, 56c of the heat pipes 50a, 50b, 50c extend is parallel to the flow path 32 between the heat dissipation fins 31 of the fin group 30. Finally, the heat guide plate 40 is covered on the fin set 30, and the bottom surface of the heat guide plate 40 is welded to the top surface of the fin set 30. The condensation sections 56a, 56b, 56c of the heat pipes 50a, 50b, 50c are housed in the recesses 42 of the heat guide plate 40 and sandwiched between the heat guide plates 40 and the fin sets 30. At this point, the heat sink is assembled. The assembled heat dissipating device has intermediate sections 54a, 54b, 54c of the heat pipes 50a, 50b, 50c disposed in the receiving space 34 at the end of the fin group 30, and the evaporation sections 52a, 52b, 52c are placed on the bottom surface of the fin group 30. In the recess 22 of the base 20, the condensation sections 56a, 56b, 56c are placed in the recesses 42 of the top surface heat guide 40 of the fin set 30, that is, the heat pipes 50a, 50b, 50c are along the fin set 30. The bottom surface is at one end and then a half turn around the periphery of the fin group 30 in the direction of the top surface thereof. When the heat sink is in operation, heat generated by the heat generating electronic components is absorbed by the base 20. Part of the heat absorbed by the base 20 is directly transmitted to the fin set 30, and then the heat is blown by the fin set 30 to dissipate heat to the external environment 9 200915051. The other portion of the heat absorbed by the base 20 is absorbed by the evaporation sections 52a, 52b, 52c of the heat pipes 50a, 50b, 50c and transmitted upwardly through the intermediate sections 54a, 54b, 54c r to the condensation sections 56a, 56b, 56c. Since the condensation sections 56a, 56b, 56c are connected to the heat guide 40 and the fin set 30, the heat of the condensation sections 56a, 56b, 56c can be quickly transferred to the heat guide 40 and the fin set 30, and then further radiated to the external environment. in. The heat guiding plate 40 acts as a soaking heat, and after absorbing the heat of the condensing sections 56a, 56b, 56c, since the heat guiding plate 40 has a large area, it is in contact with the top surface of the entire fin group 30, so that the heat guiding plate 40 can be quickly and uniformly The heat is transferred to the fin set 30, thereby solving the problem that the contact areas of the condensation sections 56a, 56b, 56c of the heat pipes 50a, 50b, 50c and the fin set 30 are small, and also solving the heat pipes 50a, 50b, 50c and the fin set. 30 The problem of poor contact, thereby improving the heat dissipation efficiency of the heat sink. Since no part of the heat pipes 50a, 50b, 50c is interposed in the fin group 30, the airflow passes through the flow path 32 of the fin group 30 without any hindrance, and the fin group can be quickly taken through the flow path 32. The heat within 30, so that the airflow has a greatly improved heat dissipation effect on the fin group 30. In addition, the intermediate sections 54a, 54b, and 54c of the heat pipes 50a, 50b, and 50c are disposed in the accommodating space 34 of the fin set 30, and are flush with one end of the heat radiating fins 31 of the two sides of the fin set 30. Therefore, the heat pipes 50a, 50b, 50c do not protrude beyond the fin group 30, and the effect of reducing the volume of the entire heat sink is achieved. FIG. 3 shows a second embodiment of the heat sink of the present invention. The heat sink further includes another fin set 60 disposed above the heat guide plate 40 as compared to the above embodiment. The shape of the bottom surface of the fin set 60 is the same as the top surface of the heat guide plate 40. The fin set 60 also includes a plurality of heat dissipating fins 10 200915051 61 '' disposed in parallel with each other, and the structure and shape of the fin set 60 are substantially the same as those of the Korean sheet group 3, and thus will not be described herein. The bottom surface of the H-chip group 6G and the heat guide plate 4 are squeaked, and are connected by welding. The heat generated by each section 56a, 56b, 56c of the heat pipe 5〇a, the pass, and the 5^A can be transferred not only to the group 30 for heat dissipation, but also to the turntable 60 through the heat guide plate 4〇. Then it is distributed to the outside world. In this embodiment, m 6Q and the heat guide plate 4G are connected to each other in the embodiment of the present invention, and it is understandable that The fin core=guide 40-body molding', that is, the heat dissipation fin “extends integrally from the top surface of the heat guide plate. < ^上^' The invention complies with the invention patent. The requirement, the green law Telishin 4 However, the above-mentioned ones are only those who are familiar with the art of the present invention, and the equivalent modifications and modifications made by tb in accordance with the spirit of the present invention should be included in the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is an assembled view of a heat dissipating device according to a first embodiment of the present invention. Fig. 2 is an exploded view of the heat dissipating device of Fig. 1. Fig. 3 is an assembled view of a second embodiment of the heat dissipating device of the present invention. Heat sink fin L main component symbol description] 20 24 31 groove 22, 42 61 rotor group 30, 60 runner 32 11 200915051 accommodating space 34, 36 heat guide 40 notch 44, 46 tube 50a, 50b, 50c Evaporation section 52a, 52b, 52c intermediate section 54a ' 54b, 54c condensation section 56a > 56b > 56c 12