200829148 九、發明說明： 【發明所屬之技術領域】 尤其是一種帶有熱管之 本發明涉及一種散熱器組合 散熱器組合。 【先前技術】 ，著大型積體電路技術的不斷進步，電子產業得到快 ^長足的發展，電腦中央處理器及晶片等電子元件的隹 2越來越高’運行速度越來越快，因此，伴隨其產生: :里也隨之增加，如果這些熱量不及時散發出去，將導致 、=兀件:部溫度迅速升高’從而影響其運行的穩定性和 速又，目别電腦内部的發熱問題的影響日益突出 速處理器推出的障礙。 一回 新型晶片及處理器不斷推出，發熱量越來越高， 要，；身的散熱已遠遠無法滿足實際應用的需 〃在電子疋件表面加裝一散熱器來辅助， 速的發展:的不斷“，放熱H相關技術也得到了快 較早的散熱器是直接利用金屬進行熱傳導，傳導效率 屬乂：導：：業界推出一種新的散熱器’其不再單純利用金 v政…，而是主要利用液體在兩相變化時溫声保 變而：吸收或放出大量熱的物理現象來實現熱量：傳遞， 如熱官。由於熱管的熱傳導性能較佳，因此倍受業界青昧。 200829148 目前業界運用熱管的散熱器層出不窮，最常見的是熱 一管連接散熱器的上下二基座，例如美國專利第5,699,853號 …及中國專利第03203858.5號；還有熱管貫穿散熱鰭片的， 例如美國專利第5,412,535號、第6,234,210號及中國專利 第 200320128888.4 號等等。 【發明内容】 本發明提供一種能夠有效利用熱管的高效熱傳導特性 的散熱裝置。 ® —種散熱器組合，包括一基座、形成於基座上之一散 熱體及連結基座與散熱體之熱管，所述散熱體包括一位於 基座上方且平行於基座之芯體及形成於芯體外圍呈放射狀 之散熱鰭片。 本發明散熱器組合具有平行於基座之芯體及形成於芯 體外圍呈放射狀之散熱鰭片，所述熱管連接基座及芯體使 熱量快速傳導至所述散熱體上進而將熱量散發。 • 另外，本發明之散熱器組合進一步包括一具有二相對 開口端之殼體，該殼體形成於所述基座上且罩設所述散熱 體，進而起到增大風壓的作用使散熱器組合的散熱更加集 中〇 【實施方式】 請同時參閱圖1至圖2,本發明散熱器組合用以裝設在電 路板上（圖位示）之中央處理器等發熱電子元件（圖未示）表 面以輔助散熱。該散熱器組合包括一散熱器10及組裝於散 200829148 熱器10上之熱管20。 一 該散熱器10為一體成型的鋁擠式散熱器，其具有一平板 …狀基座12。一凸塊120形成於基座12之底面中央位置處，該 凸塊120上形成有縱向平行設置之三凹槽1202，用以收容相 應之熱管20。四凸耳122自基座12之四角落水平向外延伸， 以供四扣具（圖位示）穿設進而將該散熱器10固定於電路板 上。一對擋板14自基座10上表面靠近凸耳122之位置處垂直 向上延伸設置。該擋板14沿與凹槽1202平行的方向延伸。 善一弧形的蓋板16向上拱起且連接二擋板14之中央部分，由 此該蓋板16及連接蓋板16兩端之下部擋板14共同構成截面 呈C形之殼體（圖未標）。請同時參閱圖4,該蓋板16之頂端與 擋板14之頂端齊平。三散熱體11、13、15形成於基座12上， 且收容於由該殼體及基座12圍成的收容空間124内，該收容 空間124具有二相對之開口端。 同時請參閱圖3,每一散熱體11、13、15包括一自基座 _ 12 了員面向上延伸之導熱板110、130、150，一圓柱狀芯體 ’ 112、132、152形成於導熱板110、130、150頂部，以及圍 繞芯體112、132、152呈放射狀設置之散熱鰭片組114、134、 154。每一導熱板 11〇、130、150、芯體112、132、152及散 熱鰭片組114、134、154均自收容空間124之一開口端延伸 至另一相對開口端。導熱板110垂直位於基座12之中央部 分，另外二導熱板130、150則傾斜並對稱位於導熱板110之 兩側從而使導熱板110與導熱板130、150分別形成一銳角， 導熱板130、150頂端到基座12頂面之垂直距離相同且小於 8 200829148 導熱板110頂端到基座12頂面之垂直距離。每一芯體112、 “ 132、152均有一平行於凹槽1202延伸方向的轴線，每一芯 …體112、132、152中央設有一貫穿孔1120、1320、1520以供 熱管20穿設。每一散熱鰭片組114、134、154沿同一時針方 向彎曲延伸，散熱鰭片組134、154對稱位於散熱體11之導 熱板110兩侧，散熱鰭片組134的所有散熱鰭片沿順時針方 向彎曲延伸，散熱鰭片組154的所有散熱鰭片則沿逆時針方 向彎曲延伸。散熱體11之散熱鰭片組114位於散熱體13、15 春之散熱鰭片組134、154上方，且散熱鰭片組114下方部分被 切掉以防止該散熱鰭片組114與散熱體13、15之散熱鰭片組 134、154發生干涉。每一散熱鰭片組114、134、154的外圍 表面大致在同一圓柱面上。同時請參閱圖4，為該散熱器10 的主視圖，散熱體11、13、15之芯體112、132、152及相應 之散熱鰭片組114、134、154形成一太陽花構造。 請再次參閱圖2，所述熱管20包括一第一熱管21及一對 _第二熱管22,該對第二熱管22傾斜並對稱位於第一熱管21 兩侧。第一及第二熱管21、22均具有一 U形構造且包括一吸 熱段210、220及連接吸熱段210、220之一放熱段212、222。 所述吸熱段210、220收容於基座12之凸塊120底部之凹槽 1202内，所述放熱段212、222平行於所述吸熱段210、220 且插設於散熱體11、13、15之芯體112、132、152之貫穿孔 1120、1320、1520中。所述吸熱段210、220呈扁平狀，其 底面與凸塊120之底面齊平以直接接觸發熱電子元件，使熱 量通過放熱段212、222快速傳遞至散熱體11、13、15。由 9 200829148 於第一熱管21之放熱段212對應於散熱體11之芯體U2之貫 一穿孔1120，所以第一熱管21之放熱段212到散熱器10底部之 • ▲距離較第二熱管22之放熱段222到散熱器10底部之距離長。 可以選擇地，本發明之散熱器10亦可以不採用鋁擠一體 成型，而是通過將散熱體11、13、15分別焊接至基座12上 形成。 本發明之散熱器組合在使用時，散熱器基座12底部之凸 塊120及熱管20之吸熱段210、220同時吸收發熱電子元件産 >生的熱量，基座10之凸塊120將其吸收的熱量傳遞至散熱體 11、13、15之導熱板110、130、150進而由導熱板110、130、 150傳遞至散熱鰭片組114、134、154 ;同時熱管20之吸熱 段210、220將其吸收的熱量經由放熱段212、222直接傳遞 至散熱體11、13、15之芯體112、132、152進而由芯體112、 132、152傳遞至散熱鰭片組114、134、154 ;由此熱量同時 分兩路快速地傳遞至散熱鰭片組114、134、154從而將熱量 _散發出去。同時系統風扇（圖未示）産生的氣流吹向所述散熱 鰭片組114、134、154以提高散熱效率；另外，散熱器1〇之 殼體可避免氣流分散於整個電腦殼體内（圖未示），進而起到 增大風壓的作用使散熱器組合的散熱集中。 由此，本發明之散熱器組合使用三散熱體收容於具有 增大風壓作用的殼體内，再充分利用熱管傳熱性能好的特 點將熱量快速傳導至所述三散熱體上進而將熱量散發。 综上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟，以上該者僅為本發明之較佳實施例，舉凡熟 200829148 悉本案技藝之人士，在爱依本發明精神所作之等效修飾或 一變化，皆應涵蓋於以下之申請專利範圍内。 “【圖式簡單說明】 圖1係本發明散熱器組合之立體組合圖。 圖2係圖1之立體分解圖。 圖3係圖1中散熱器組合中散熱器另一視角之立體圖。 圖4係圖1中散熱器組合中散熱器之主視圖。 【主要元件符號說明】 散熱器 導熱板 貫穿孔 10 散熱體 11、13、15 110、130、150 芯體 112、132、152 1120、1320、1520 散熱鰭片組 114、134、154 基座 12 凹槽 1202 收容空間124 蓋板 16 第一熱管21 放熱段 212、222 凸塊 120 凸耳 122 擋板 14 教管 20 吸熱段 210 ^ 220 第二熱管 22 11200829148 IX. Description of the invention: [Technical field to which the invention pertains] In particular, the invention relates to a heat sink combined heat sink assembly. [Prior Art] With the continuous advancement of large-scale integrated circuit technology, the electronics industry has been rapidly developed, and the electronic components of computer central processing units and chips are becoming more and more high. Along with it: : There is also an increase in it. If the heat is not released in time, it will cause, = 兀: the temperature of the part rises rapidly, which affects the stability and speed of its operation, and the heat inside the computer. The impact of the increasingly prominent obstacles introduced by the speed processor. A new type of chip and processor is constantly being introduced, and the heat is getting higher and higher. It is necessary that the heat dissipation of the body is far from meeting the needs of practical applications. A heat sink is added to the surface of the electronic component to assist the development of speed: Constantly, the exothermic H-related technology has also gotten faster and earlier. The radiator is directly using metal for heat conduction, and the conduction efficiency belongs to: Guide:: The industry has introduced a new radiator' which is no longer simply using the gold v... Rather, it mainly uses the liquid to change the temperature during the two-phase change: the physical phenomenon of absorbing or releasing a large amount of heat to achieve heat: transmission, such as heat. Because the heat transfer performance of the heat pipe is better, it is well received by the industry. At present, the heat sinks of heat pipes are used in the industry. The most common ones are the upper and lower pedestals of a heat pipe connected to a heat sink, such as U.S. Patent No. 5,699,853... and Chinese Patent No. 03203858.5; and heat pipes penetrating through fins, such as the United States. Patent Nos. 5,412,535, 6,234,210, and Chinese Patent No. 200320128888.4, etc. [Invention] The present invention provides an effective A heat sink with a heat transfer characteristic of a heat pipe. The heat sink assembly includes a base, a heat sink formed on the base, and a heat pipe connecting the base and the heat sink. The heat sink includes a base. a core body parallel to the base and a heat radiating fin formed on the periphery of the core body. The heat sink assembly of the present invention has a core body parallel to the base and a heat radiating fin formed on the periphery of the core body. The heat pipe is connected to the base and the core to rapidly transfer heat to the heat sink to dissipate heat. Further, the heat sink assembly of the present invention further includes a housing having two opposite open ends, the housing being formed The heat sink is disposed on the base, and the air pressure is increased to further concentrate the heat dissipation of the heat sink assembly. [Embodiment] Please refer to FIG. 1 to FIG. 2 together for the heat sink combination of the present invention. The surface of the heat-generating electronic component (not shown), such as a central processing unit mounted on a circuit board (pictured), is used to assist heat dissipation. The heat sink assembly includes a heat sink 10 and is assembled in the heat of 200829148. The heat pipe 20 of the heat sink 20 is an integrally formed aluminum extruded heat sink having a flat plate-like base 12. A bump 120 is formed at a central position of the bottom surface of the base 12, and the bump 120 is formed. Three grooves 1202 are formed in the longitudinal direction and are arranged to receive the corresponding heat pipes 20. The four lugs 122 extend horizontally outward from the four corners of the base 12 for the four fasteners to be inserted. The heat sink 10 is fixed on the circuit board. A pair of baffles 14 extend vertically upward from a position of the upper surface of the base 10 near the lug 122. The baffle 14 extends in a direction parallel to the groove 1202. The cover plate 16 is upwardly arched and connected to the central portion of the two baffles 14, whereby the cover plate 16 and the lower baffle 14 at both ends of the connecting cover 16 together form a C-shaped housing (not shown). . Referring also to Figure 4, the top end of the cover 16 is flush with the top end of the baffle 14. The three heat dissipating bodies 11, 13, 15 are formed on the susceptor 12 and housed in the accommodating space 124 surrounded by the casing and the susceptor 12. The accommodating space 124 has two opposite open ends. Referring to FIG. 3, each of the heat dissipating bodies 11, 13, 15 includes a heat conducting plate 110, 130, 150 extending upward from the base 12, and a cylindrical core body '112, 132, 152 is formed in the heat conducting body. The tops of the plates 110, 130, 150, and the set of fins 114, 134, 154 radially disposed about the cores 112, 132, 152. Each of the heat conducting plates 11A, 130, 150, the cores 112, 132, 152 and the heat radiating fin sets 114, 134, 154 extend from one open end of the receiving space 124 to the other opposite open end. The heat conducting plate 110 is vertically located at a central portion of the base 12, and the other two heat conducting plates 130 and 150 are inclined and symmetrically located at two sides of the heat conducting plate 110 to form an acute angle between the heat conducting plate 110 and the heat conducting plates 130 and 150, respectively. The vertical distance of the top end of the 150 to the top surface of the base 12 is the same and less than 8 200829148 The vertical distance from the top end of the heat conducting plate 110 to the top surface of the base 12. Each of the cores 112, 132, 152 has an axis parallel to the direction in which the grooves 1202 extend, and each of the cores 112, 132, 152 has a continuous through hole 1120, 1320, 1520 for the heat pipe 20 to pass through. Each of the heat dissipation fin sets 114, 134, and 154 is bent and extended in the same clockwise direction, and the heat dissipation fin sets 134 and 154 are symmetrically located on both sides of the heat dissipation plate 110 of the heat dissipation body 11, and all the heat dissipation fins of the heat dissipation fin group 134 are clockwise. The direction of the curved extension extends, and all the heat dissipation fins of the heat dissipation fin group 154 are bent and extended in the counterclockwise direction. The heat dissipation fin group 114 of the heat dissipation body 11 is located above the heat dissipation fin group 134, 154 of the heat dissipation body 13, 15 and the heat dissipation fin The lower portion of the wafer group 114 is cut away to prevent the heat dissipation fin group 114 from interfering with the heat dissipation fin groups 134, 154 of the heat sinks 13, 15. The peripheral surfaces of each of the heat dissipation fin groups 114, 134, 154 are substantially the same. On the cylindrical surface, please refer to FIG. 4, which is a front view of the heat sink 10. The cores 112, 132, 152 of the heat sinks 11, 13, 15 and the corresponding heat dissipation fin sets 114, 134, 154 form a sun flower. Referring again to FIG. 2, the heat pipe 20 includes The first heat pipe 21 and the pair of second heat pipes 22 are inclined and symmetrically located on both sides of the first heat pipe 21. The first and second heat pipes 21, 22 each have a U-shaped configuration and include a heat absorption section. 210, 220 and one of the heat-dissipating sections 212, 222 connecting the heat-absorbing sections 210, 220. The heat-absorbing sections 210, 220 are received in the groove 1202 at the bottom of the bump 120 of the base 12, and the heat-dissipating sections 212, 222 are parallel to The heat absorption sections 210 and 220 are inserted into the through holes 1120, 1320, and 1520 of the cores 112, 132, and 152 of the heat dissipation bodies 11, 13, 15. The heat absorption sections 210 and 220 are flat, and the bottom surface thereof is The bottom surface of the bump 120 is flush to directly contact the heat-generating electronic component, so that the heat is quickly transmitted to the heat sink 11, 13 and 15 through the heat-dissipating sections 212, 222. The heat-dissipating section 212 of the first heat pipe 21 by 9 200829148 corresponds to the heat sink 11 The core U2 passes through a through hole 1120, so the distance from the heat releasing portion 212 of the first heat pipe 21 to the bottom of the heat sink 10 is longer than the distance between the heat releasing portion 222 of the second heat pipe 22 and the bottom of the heat sink 10. Alternatively, this The heat sink 10 of the invention can also be integrally formed without using aluminum extrusion, but by The heat bodies 11, 13, 15 are respectively soldered to the base 12. The heat sink assembly of the present invention, in use, the bumps 120 at the bottom of the heat sink base 12 and the heat absorption sections 210, 220 of the heat pipe 20 simultaneously absorb heat-generating electronic components. Producing > heat generated, the bumps 120 of the susceptor 10 transfer the heat absorbed by the heat transfer plates 110, 130, 150 of the heat sinks 11, 13, 15 to the heat sinks 110, 130, 150 to the heat sink fins Groups 114, 134, 154; at the same time, the heat absorption sections 210, 220 of the heat pipe 20 directly transfer the heat absorbed by the heat-dissipating sections 212, 222 to the cores 112, 132, 152 of the heat-dissipating bodies 11, 13, 15 and further by the core body 112. 132, 152 are transferred to the heat sink fin groups 114, 134, 154; thus the heat is simultaneously transferred to the heat sink fin groups 114, 134, 154 in two ways to dissipate heat. At the same time, the airflow generated by the system fan (not shown) is blown to the heat dissipation fin sets 114, 134, 154 to improve the heat dissipation efficiency; in addition, the heat sink 1 casing can prevent the airflow from being dispersed in the entire computer casing (Fig. Not shown), which further increases the wind pressure to concentrate the heat dissipation of the heat sink assembly. Therefore, the heat sink combination of the present invention uses the three heat dissipating bodies to be housed in the casing having the function of increasing the wind pressure, and fully utilizes the heat transfer performance of the heat pipe to quickly conduct heat to the three heat dissipating bodies to further heat. Distribute. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above is only a preferred embodiment of the present invention, and those skilled in the art of the present invention will be able to cover the equivalent modifications or variations of the present invention in the spirit of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a heat sink assembly of the present invention. Fig. 2 is an exploded perspective view of Fig. 1. Fig. 3 is a perspective view of another perspective view of the heat sink in the heat sink assembly of Fig. 1. Figure 1 is a front view of the heat sink in the heat sink assembly of Figure 1. [Main component symbol description] Heat sink heat conduction plate through hole 10 Heat sink 11, 13, 15 110, 130, 150 Cores 112, 132, 152 1120, 1320, 1520 Heat sink fin set 114, 134, 154 Base 12 Groove 1202 Containing space 124 Cover plate 16 First heat pipe 21 Heat release section 212, 222 Bump 120 Lug 122 Baffle 14 Teaching tube 20 Heat absorption section 210 ^ 220 Second Heat pipe 22 11