CN100561399C - Heating radiator - Google Patents

Heating radiator Download PDF

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Publication number
CN100561399C
CN100561399C CNB2005101014996A CN200510101499A CN100561399C CN 100561399 C CN100561399 C CN 100561399C CN B2005101014996 A CNB2005101014996 A CN B2005101014996A CN 200510101499 A CN200510101499 A CN 200510101499A CN 100561399 C CN100561399 C CN 100561399C
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CN
China
Prior art keywords
heat
pedestal
conducting piece
radiating fin
heating radiator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2005101014996A
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Chinese (zh)
Other versions
CN1967437A (en
Inventor
陈俊吉
翁世勋
余光
周大远
刘金标
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuzhun Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Fuzhun Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuzhun Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Fuzhun Precision Industry Shenzhen Co Ltd
Priority to CNB2005101014996A priority Critical patent/CN100561399C/en
Publication of CN1967437A publication Critical patent/CN1967437A/en
Application granted granted Critical
Publication of CN100561399C publication Critical patent/CN100561399C/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A kind of heating radiator, comprise one in order to thermal source substrate contacted and most by upwardly extending first radiating fin of this pedestal, one heat-conducting piece is connected with the conduction of this heat susceptor and first radiating fin is respectively in this heat conduction biography part both sides, most second radiating fins are extended perpendicular to the first radiating fin direction by this edge, heat-conducting piece two opposite two sides, a heat pipe connects said base and thereby heat-conducting piece reaches heat-conducting piece with heat by pedestal, the present invention is owing to be provided with the radiating fin of two groups of vertical direction, thereby can less fin size obtain overall bigger area of dissipation and improve single radiating fin utilization ratio, and then heat dispersion is promoted.

Description

Heating radiator
[technical field]
The present invention relates to a kind of heat abstractor, particularly relate to a kind of heating radiator that is used on the electronic component.
[background technology]
Heating radiator has become a requisite configuration of the electronic component of golf calorific values such as central processing unit, and along with the sustained and rapid development of integrated circuit technique, the function of electronic component from strength to strength, performance also constantly promotes, correspondingly the heat of its generation is also more and more.And one efficiently heating radiator be very important to the normal operation that guarantees electronic component, in order timely and effectively electronic component to be dispelled the heat, the heating radiator of various structures also so constantly is devised.
A kind of typical aluminium extruded type heating radiator generally includes a dull and stereotyped pedestal, and this base bottom surface is in order to contact heat absorption with electronic component, and the end face one vertically extends several dissipation fins, and this heating radiator absorbs heat by pedestal and passes to radiating fin and outwards distribute.For improving the heat-sinking capability of this heating radiator, simple principle is to increase area of dissipation, the most direct way is exactly the size that increases radiating fin, but because the restriction that aluminium extruded is made, just very easily distortion or fracture of fin when the depth-width ratio of fin surpasses certain proportion (normally 13: 1), therefore increasing the fin area just needs to increase accordingly simultaneously fin pitch, makes that therefore the radiating fin quantity under the equal volume reduces, and overall area of dissipation does not significantly increase.On the other hand, excessive size can cause the utilization factor of fin to reduce, especially fully outwards dispel the heat less inadequately because of being heated away from the fin marginal portion of pedestal, therefore the heating radiator of large volume has taken inside computer system more space resource, but heat dispersion does not obtain the lifting of respective degrees.
[summary of the invention]
In view of this, be necessary to provide a kind of heating radiator that can small size obtains preferable heat dispersion.
A kind of heating radiator comprises a pedestal and most by upwardly extending first radiating fin of this pedestal, one heat-conducting piece is located on the pedestal and first radiating fin is respectively in this heat-conducting piece both sides, most second radiating fins by the relative two sides of this heat-conducting piece along extending perpendicular to the direction of first radiating fin.
In addition, thus a heat pipe connects said base and heat-conducting piece reaches heat-conducting piece with heat fast by pedestal.
Compared with prior art, this heating radiator is established fin that at least two groups vertically extend and has been changed to increasing area of dissipation and make fin increase the problem that heat dispersion that size causes can not respective degrees ground promotes to single direction.The entire heat dissipation device is outwards dispelled the heat by the fin of two groups of different trends, and overall heat dispersion is promoted.
Heat pipe will be reached heat-conducting piece apace and then reach second radiating fin by the heat that pedestal absorbs, accelerated the transmission speed of heat in heating radiator, so radiating rate is accelerated.
With reference to the accompanying drawings, the invention will be further described in conjunction with specific embodiments.
[description of drawings]
Fig. 1 is the stereographic map of heating radiator preferred embodiment of the present invention.
Fig. 2 is the front elevation of Fig. 1.
Fig. 3 is the three-dimensional exploded view of Fig. 1.
[embodiment]
Heating radiator of the present invention is in order to central processing unit, integrated circuit (IC) chip heat-generating electronic elements such as (figure do not show) are dispelled the heat.
Seeing also Fig. 1 and Fig. 2, is the preferred embodiment of heating radiator of the present invention.This heating radiator comprises a pedestal 10 that absorbs heat in order to contact with electronic component, most first parallel radiating fins 15 are extended by these pedestal 10 upper surfaces, one heat-conducting piece, 20 vertical fixing are on this pedestal 10, most second radiating fins 25 are extended by heat-conducting piece 20, and a C shape heat pipe 30 connects pedestal 10 and heat-conducting piece 20.
See also Fig. 3, these pedestal 10 rectangular tabulars, have a bottom surface and an end face, this bottom surface forms a teat 12 in order to the heat absorption of contact electronic component, the end face middle part is formed with a groove 11,10 4 jiaos of levels of this pedestal are outward extended with four ears 16, can pass heating radiator is fixed on the circuit board (circuit board) for the screw element 40 that is arranged with spring.Above-mentioned first radiating fin 15 is vertically extended by pedestal 10 end faces, forms most first gas channels therebetween.Thereby heat-conducting piece 20 vertical fixing are respectively in this heat-conducting piece 20 both sides in above-mentioned first radiating fin 15 in pedestal 10 end faces middle part, the groove 11 of corresponding pedestal 10 end faces in these heat-conducting piece 20 bottoms also is provided with corresponding groove 21, and the groove 11,21 of this two correspondence is formed a tubular conduit.This heat-conducting piece 20 is parallel with first radiating fin 15 and than first radiating fin, 15 height, second fin 25 is oppositely extended by heat-conducting piece 20 two sides levels above first radiating fin 15, this second fin 25 is parallel to pedestal 10 and perpendicular to first radiating fin 15, has also formed most second gas channels therebetween.
This heat pipe 30 comprises an evaporation part 31, and it is contained in the passage between above-mentioned heat-conducting piece 20 and the pedestal 10 and contacts with the two heat conductivity; One is parallel to the condensation part 33 of evaporation part 31, and it is placed through in the groove 22 on heat-conducting piece 20 tops; One heat transfer part 32 connects evaporation part 31 and condensation part 33.
This heat sink applications is when heat-generating electronic elements, the teat 12 contact electronic components of pedestal 10 bottom surfaces absorb heat, part heat directly outwards distributes to being uploaded to first radiating fin 15, all the other heats are then up along heat-conducting piece 20,30 of heat pipes make heat directly reach heat-conducting piece 20 tops, heat, is outwards distributed to 25 conduction of second radiating fin by heat-conducting piece 20 again.
The pedestal 10 of this heating radiator can be one-body molded by the aluminium extruded processing mode with heat-conducting piece 20 and first, second fin 15,25, and heat pipe 30 is by welding manner combination with it.
In an embodiment of the present invention, because first, second radiating fin 15,25 vertically extends to different directions, needn't make single fin be disabled the increase of rate ground for increasing area, the utilization factor of fin each several part improves, and can obtain overall area of dissipation greatly by single reduced size fin.Because making, this structure do not need single fin that excessive size is arranged for promoting heat dispersion, if so adopt the aluminium extruded moulding, can overcome the restriction on making, compare, all have a distinct increment on the manufacturing feature and on the heat dispersion with aluminium extruded type heating radiator with volume.

Claims (9)

1. heating radiator, comprise a pedestal, be extended with a plurality of first radiating fins on it, it is characterized in that: a heat-conducting piece is fixed on the pedestal and these heat-conducting piece both sides of the first radiating fin apportion, a plurality of second radiating fins are extended with the first radiating fin vertical direction by edge, heat-conducting piece two sides, described heating radiator also comprises a C shape heat pipe, it connects pedestal and heat-conducting piece, described heat pipe comprises an evaporation part that is connected with pedestal, and condensation part that with heat-conducting piece be connected and the two a conducting part parallel with the evaporation part.
2. heating radiator as claimed in claim 1 is characterized in that: described heat pipe evaporation part is folded between pedestal and the heat-conducting piece, and the condensation part is placed through on the heat-conducting piece position away from pedestal.
3. heating radiator as claimed in claim 2 is characterized in that: described heat pipe condensation part is set in the groove at heat-conducting piece top.
4. heating radiator as claimed in claim 1 is characterized in that: described first radiating fin is perpendicular to pedestal, and second radiating fin is parallel to pedestal.
5. heating radiator as claimed in claim 4 is characterized in that: described first radiating fin vertically extends from pedestal, and second radiating fin extends from heat-conducting piece two opposite lateral vertical.
6. heating radiator as claimed in claim 1 is characterized in that: it is one-body molded by aluminium extruded processing that described pedestal, heat-conducting piece, first and second radiating fin can be used as an integral body.
7. heating radiator as claimed in claim 1 is characterized in that: described heat-conducting piece combines with pedestal by welding manner.
8. heating radiator as claimed in claim 1 is characterized in that: described first radiating fin extends between the pedestal and second radiating fin.
9. heating radiator as claimed in claim 1 is characterized in that: described heat-conducting piece parallels with first radiating fin.
CNB2005101014996A 2005-11-16 2005-11-16 Heating radiator Expired - Fee Related CN100561399C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNB2005101014996A CN100561399C (en) 2005-11-16 2005-11-16 Heating radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB2005101014996A CN100561399C (en) 2005-11-16 2005-11-16 Heating radiator

Publications (2)

Publication Number Publication Date
CN1967437A CN1967437A (en) 2007-05-23
CN100561399C true CN100561399C (en) 2009-11-18

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Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2005101014996A Expired - Fee Related CN100561399C (en) 2005-11-16 2005-11-16 Heating radiator

Country Status (1)

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CN (1) CN100561399C (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101839658B (en) * 2009-03-20 2012-12-26 富准精密工业(深圳)有限公司 Heat sink
CN102006761A (en) * 2009-08-28 2011-04-06 富准精密工业(深圳)有限公司 Heat radiator
CN102724849A (en) * 2012-06-01 2012-10-10 加弘科技咨询(上海)有限公司 Heat-radiating system, heat-radiating device and heat-radiating fin base thereof
CN103517616B (en) * 2012-06-27 2017-04-19 富瑞精密组件(昆山)有限公司 Electronic device
CN205452264U (en) * 2016-01-04 2016-08-10 中兴通讯股份有限公司 Heat radiator of chip
WO2018214096A1 (en) * 2017-05-25 2018-11-29 罗伯特·博世有限公司 Cooling device
CN113556916B (en) * 2020-04-26 2023-02-28 台达电子企业管理(上海)有限公司 Data processing apparatus

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CN1967437A (en) 2007-05-23

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Granted publication date: 20091118

Termination date: 20131116