CN100517660C

CN100517660C - Heat abstractor

Info

Publication number: CN100517660C
Application number: CNB2005101014981A
Authority: CN
Inventors: 吴宜强
Original assignee: Fuzhun Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Fuzhun Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 2005-11-14
Filing date: 2005-11-14
Publication date: 2009-07-22
Anticipated expiration: 2025-11-14
Also published as: CN1967818A

Abstract

The invention relates to a heat emitter, which comprises base contacted with thermal source, one heat emitting element with two crossed connected heat emitting plates, at least one heat tube connecting the base and heat emitting element, the first heat emitter and the second emitter combined with heat emitting element to clamp heat tube inner, wherein the energy absorbed by base via heat tube is transmitted to the heat emitting element and two heat emitters to be radiated. The invention has stable structure and quick heat radiation, to reduce vibration and noise, with improve efficiency.

Description

Heat abstractor

[technical field]

The present invention relates to a kind of heat abstractor, particularly relate to a kind of heat abstractor of electronic component.

[background technology]

The sustained and rapid development of integrated circuit technique makes and comprises that the electronic component speed of service of central processing unit is more and more faster, certainly the heat that thereupon produces is also more and more, the accumulation of heat will cause the rising of electronic component temperature, and cause fluctuation of service thus even cause the damage of electronic component.Therefore must adopt an effective measure it is dispelled the heat to keep its normal operation.

The radiator of various structures also so constantly is devised, and along with the continuous upgrading of caloric value, the radiator that dispels the heat by the metal fever conduction pattern can not satisfy the radiating requirements of the electronic component of golf calorific value merely.In recent years, capacity of heat transmission is obtaining application widely to heat pipe aspect the heat radiation because of it has efficiently fast, uses the radiator of heat pipe also so constantly to occur with new construction.

A kind of typical heat-pipe radiator as shown in Figure 1, this radiator have one in order to electronic component substrate contacted 100, heat pipe 200 middle parts of two upright U-shapeds link to each other with pedestal 100, several dissipation fins 300 is located on the heat pipe 200, this radiator absorbs heats by pedestal 100, apace heat is conducted to radiating fin 300 and then outwards distributes by heat pipe 200.

For making radiator have bigger area of dissipation as much as possible to quicken heat radiation, usually fin all has bigger size, and heat pipe has less diameter usually, contact area depends on the diameter of heat pipe between the two, though therefore radiating fin can dispel the heat fast, but the heat of heat pipe can not be delivered to radiating fin fast, cause the interior heat distribution of entire heat dissipation device seriously uneven, the integral heat sink performance can't obtain breakthrough raising, on the other hand, each bigger radiating fin can only be supported at the point that contacts with heat pipe, separate between each fin, when a fan is installed on it in order to the reinforcement heat radiation, vibrations and noise will be inevitable, part vibrations will be transferred to pedestal to be influenced it and contacts uniformly with the firm of electronic component, and these vibrations are simultaneously passed to electronic component even influenced its normally stable operation.And the influence of above-mentioned vibrations and noise is more obvious when altogether shake takes place.

[summary of the invention]

In view of this, be necessary to provide a kind of good heat dissipation effect and the firm radiator of structure.

A kind of heat abstractor comprises a pedestal, and a radiator and connects the heat pipe of pedestal and radiator, and this radiator comprises two groups of mutual cross-coupled heating panels, forms the passage of most air-flows between these heating panels.

Compared with prior art, two of radiator groups of mutual interconnections of heating panel in this heat abstractor, structure is firm and help realizing the uniform fast of heat, therefore in the influence that reduces vibrations and noise, also heat pipe can be distributed fast from the heat that pedestal passes to radiator, improve heat dispersion.

With reference to the accompanying drawings, the invention will be further described in conjunction with specific embodiments.

[description of drawings]

Fig. 1 is the three-dimensional exploded view of a typical heat sink in the prior art.

Fig. 2 is the stereogram of heat abstractor preferred embodiment of the present invention.

Fig. 3 is the front view of Fig. 2.

Fig. 4 is the three-dimensional exploded view of Fig. 2.

[embodiment]

Heat abstractor of the present invention is in order to central processing unit, integrated circuit (IC) chip heat-generating electronic elements such as (figure do not show) are dispelled the heat.

See also Fig. 2 and Fig. 4, show the preferred embodiment of heat abstractor of the present invention.This heat abstractor comprises a pedestal 10 and a radiator 20 that absorbs heat in order to contact with electronic component, reaches radiator 20 and distributes thereby three heat pipes that are bent into U-shaped 50 connect heat that pedestals 10 and radiator 20 absorb pedestal 10.One first radiator 30 and one second radiator 40 combine with radiator 20 respectively and heat pipe 50 parts are inserted and put therebetween.

This pedestal 10 is made of such as copper with the preferable metal material of heat conductivility usually, its roughly rectangular tabular, have a bottom surface that can contact (figure does not show) and an end face 12 with electronic component, be formed with three parallel grooves 13 on this end face, this each level of pedestal 10 4 corners is outward extended with fixing feet 14, offer installing hole (not label) on the fixing feet 14, the rod member 60 that has a spring is placed through in the installing hole of fixing feet 14 in order to this heat abstractor is fixed on the circuit board of electronic component place and contacts with electronic component.

Above-mentioned each heat pipe 50 comprises an evaporation part 52, this evaporation part 52 places a wherein corresponding groove 13 of said base 10, two parallel condensation parts 54 are vertically bent in the same way by 52 two ends, evaporation part extends, and the direction away from pedestal 10 is stretched in this two condensation part 54 perpendicular to pedestal 10.

See also Fig. 2 to Fig. 4, this radiator 20 comprises two mutual parallel interval and the

soaking plate

22,24 vertical with pedestal 10, most and the pedestal 10 first parallel heating panels 23 are connected between two

soaking plate

22,24, two soaking plate, 22,24 lateral surfaces respectively are formed with three vertical grooves 29, and most second heating panels 25 are connected with first heating panel, 23 heavy orthogonal forks.First heating panel 23 is parallel to soaking

plate

22,24 perpendicular to soaking

plate

22,24, the

second heating panels

25, and 23,25 of these heating panels have then formed most parallel gas flow passages 27, and each gas channel 27 has a square-section and two outlets.Wherein first heating panel 23, two

soaking plate

22,24 of top and bottom form frameworks jointly, above-mentioned first,

second heating panel

23,25 is interweaved and is combined in this framework, and the

soaking plate

22,24 of this radiator 20 and first,

second heating panel

23,25 can be one-body molded by the aluminium extruded processing mode.

This first and

second radiator

30,40 has identical structure.First radiator 30 comprises a heat transfer plate 32 that can be connected with the soaking plate 22 of radiator 20, these heat transfer plate 32 1 sides and soaking plate 22 driving fits, groove 29 corresponding grooves 33 on three of formation and the soaking plate 22 on this closed surface, 29,33 of these respective grooves have formed the pipeline that extend a condensation part 54 of three heating tubes 50 within it, heat transfer plate 32 another relative outer surfaces then extend most parallel fins 35, and these fins 35 are parallel with first heating panel 23.

Second radiator 40 comprises a heat transfer plate 42 that can be connected with the soaking plate 24 of radiator 20, these heat transfer plate 42 1 sides and soaking plate 24 driving fits, groove 29 corresponding grooves 43 on three of formation and the soaking plate 24 on this closed surface, 29,43 of these respective grooves have formed the pipeline that extend a condensation part 54 of three heating tubes 50 within it, heat transfer plate 42 another relative outer surfaces then extend most parallel fins 45, and these fins 45 are parallel with first heating panel 23.

When this heat abstractor is installed on the heat-generating electronic elements, pedestal 10 contact electronic components absorb heat, heat is partly reached radiator 20 bottoms and is continued upwards conduction, most of heat is then absorbed by heat pipe 50 evaporation parts 52 and upwards transmits and reach two

soaking plate

22,24 and

second radiator

30,40 via condensation part 54 along heat pipe 50, outwards distributes then.

In this heat abstractor, because first heating panel 23 intersects mutually with second heating panel 25, each first heating panel 23 is by most second heating panels 25 location, each second heating panel 25 is too by most first heating panels 23 location, entire heat dissipation body 20 has a very firm structure, when forced draft was passed through radiator 20, noise and vibrations were effectively reduced; On the other hand, cross one another

heating panel

23,25 makes that heat can be uniform in radiator 20 apace, and its utilance improves, thereby the integral heat sink performance of heat abstractor is promoted.

In the above embodiment of the present invention, heat pipe 50 is interposed between

second radiator

30,40 and the radiator 20 but not passes radiator 20, this makes heat pipe 50 and radiator 20 and being combined in of

radiator

30,40 become easy in the manufacturing, also favourable heat pipe 50 and the even excellent contact of its formation, be beneficial to the transmission of heat, also promoted the lifting of heat dispersion accordingly from heat pipe 50 to each

heat dissipation element

20,30,40.

Claims

1. heat abstractor, comprise that a pedestal, a radiator and connect the heat pipe of pedestal and radiator, it is characterized in that: this radiator comprises two groups of mutual cross-coupled heating panels, form the passage of most air-flows between these heating panels, described radiator comprises two parallel soaking plate, and above-mentioned heating panel interweaves between this two soaking plate and is connected with it.

2. heat abstractor as claimed in claim 1 is characterized in that: each group heating panel includes the heating panel that majority is parallel to each other.

3. heat abstractor as claimed in claim 1 is characterized in that: described heating panel and soaking plate are one-body molded.

4. heat abstractor as claimed in claim 1 is characterized in that: also comprise first radiator and second radiator that are connected with radiator, radiator is connected with between this second radiator.

5. heat abstractor as claimed in claim 4 is characterized in that: described second radiator respectively comprises a heat transfer plate that contacts with the soaking plate corresponding matching, and heat pipe partly is folded between heat transfer plate and the soaking plate.

6. heat abstractor as claimed in claim 5 is characterized in that: respectively laterally extend plurality of fins on the heat transfer plate of described second radiator.

7. heat abstractor as claimed in claim 6 is characterized in that: described fin is parallel with first heating panel.

8. heat abstractor as claimed in claim 5, it is characterized in that: described heat pipe takes the shape of the letter U, comprise the condensation part that an evaporation part that is connected with pedestal and two is extended by two ends, evaporation part bendings, the condensation part is to extending away from the pedestal direction and being folded between soaking plate and the corresponding radiator.

9. heat abstractor as claimed in claim 1 is characterized in that: the mutual square crossing of described two groups of heating panels connects.

10. heat abstractor as claimed in claim 1 is characterized in that: described two soaking plate are vertical with pedestal.

11. heat abstractor as claimed in claim 10 is characterized in that: described first heating panel is connected with soaking plate is vertical, and described second heating panel is parallel to soaking plate.