CN101146427A

CN101146427A - Heat pipe radiator

Info

Publication number: CN101146427A
Application number: CNA2006100626792A
Authority: CN
Inventors: 陈永东; 余光; 陈俊吉
Original assignee: Hong Jun Precision Industry Co ltd; Fuzhun Precision Industry Shenzhen Co Ltd
Current assignee: Hong Jun Precision Industry Co ltd; Fuzhun Precision Industry Shenzhen Co Ltd
Priority date: 2006-09-15
Filing date: 2006-09-15
Publication date: 2008-03-19

Abstract

A heat tube heat dissipating device includes a heat guiding plate, a heat dissipater arranged on the heat guide plate, and a heat tube connecting the heat guide plate and the heat dissipater. The heat dissipater is composed of a plurality of heat dissipating fins arranged vertically and side by side on the heat guide plate. Each heat dissipating fin has a first body part and a second body part integrated with the first body part, and the second body part is higher than the first body part. The heat tube heat dissipating device transport heat of the heat guide plate to the heat dissipating fins directly and rapidly, thereby greatly accelerating heat transfer from the high temperature zone of the heat guide plate to the heat dissipating fins and improving heat dissipating efficiency of the heat tube heat dissipating device.

Description

Heat-pipe radiating apparatus

Technical field

The present invention relates to a kind of heat-pipe radiating apparatus, be meant a kind of heat-pipe radiating apparatus that electronic component is dispelled the heat especially.

Background technology

Along with the constantly development of electronic information industry, electronic component (particularly central processing unit) running frequency and speed are in continuous lifting.But the heat that high-frequency high-speed will make electronic component produce increases thereupon, makes its temperature constantly raise, and the performance when the electronic component operation in serious threat for guaranteeing the normal operation of electronic component energy, must in time be discharged a large amount of heats that electronic component produced.

For this reason, the normally used heat abstractor of industry generally comprises a base and the some radiating fins that are located on the base, and this base end face is level and smooth entity metal, distributes in the heat absorption of central processing unit surface and around reaching radiating fin for being sticked.And along with the central processing unit volume is more and more littler, its heating is also more concentrated, and because of being confined to the heat transfer property of metal, the heat of base center can not expand to the entire heat dissipation device fast, especially on the radiating fin away from base part far away, heat abstractor can't obtain to break through shape and promote.And heat pipe obtains in the heat radiation field to use in a large number widely because of its preferable heat-conductive characteristic in recent years, and heat pipe becomes the preferred assembly of high-end radiator.

Summary of the invention

The present invention aims to provide the high heat-pipe radiating apparatus of a kind of radiating efficiency.

A kind of heat-pipe radiating apparatus, comprise that a heat-conducting plate, places the radiator on this heat-conducting plate and connects the heat pipe of this heat-conducting plate and radiator, described radiator is made up of some radiating fins that are arranged side by side on the described heat-conducting plate that stand on, described each radiating fin have first body and with second body of the first body one, second body is higher than first body.

Above-mentioned heat-pipe radiating apparatus directly promptly is passed on the radiating fin by the heat of heat pipe with heat-conducting plate, has accelerated heat greatly by the transfer of heat conduction plate hight hot-zone to radiating fin, has improved the radiating efficiency of heat-pipe radiating apparatus.

With reference to the accompanying drawings, the invention will be further described in conjunction with specific embodiments.

Description of drawings

Fig. 1 is the three-dimensional exploded view of heat-pipe radiating apparatus of the present invention and circuit board.

Fig. 2 is the three-dimensional combination figure of Fig. 1.

Embodiment

See also Fig. 1 and Fig. 2, be a heat-pipe radiating apparatus of the embodiment of the invention.Shown in heat-pipe radiating apparatus be installed on the circuit board 90, in order to a heat-generating electronic elements 92 heat radiation, this electronic component 92 is fixed on the circuit board 90 by a socket connector 95.This heat-pipe radiating apparatus mainly comprises heat radiation module 10 and two fasteners 50, and wherein said heat radiation module 10 comprises that a heat-conducting plate 40, places radiator 30 and two on the heat-conducting plate 40 to connect the heat pipe 20 of radiators 30 and heat-conducting plate 40.

Described heat-conducting plate 40 is rectangular tabular, the groove that is parallel to each other 426 of two cross section semicirculars in shape is along top 42 horizontal expansions of heat-conducting plate 40, respectively be provided with a screwed hole 422 on four jiaos of these heat-conducting plate 40 tops 42, these heat-conducting plate 40 bottoms have a rectangular boss 45 to contact with electronic component 92, in order to absorb the heat that this electronic component 92 produces.

The bending that all takes the shape of the letter U of described each heat pipe 20, the heat release section 24 that it comprises an endotherm section 22 and is parallel to this endotherm section 22, wherein two endotherm sections, 22 correspondences of this two heat pipe 20 place the groove 426 of this heat-conducting plate 40.

Described radiator 30 is arranged by some radiating fin 32 parallel interval and is formed, each radiating fin 32 L-shaped setting and perpendicular to described heat-conducting plate 40.Described radiating fin 32 mutual buckle combinations, comprise one first body 325 and second body 326 perpendicular to this first body 325, wherein the height of second body 326 is higher than the height of first body 325, and second body, 326 relative first bodies 325 are away from electronic component 92, first body 325, second body 326 are all rectangular, each radiating fin 32 stacked arrangement, thus a ladder drop formed at radiator 30 tops.First body, 325 bottoms of each radiating fin 32 are formed with two recesses, thereby the recess of each radiating fin 32 and ranks form groove 36, and the groove 426 corresponding formation of this two groove 36 and heat-conducting plate 40 are with the passage of the endotherm section 22 of accommodating above-mentioned heat pipe 20; Second body 326 of each radiating fin 32 is provided with the rounded through hole 34 in cross section of two horizontal expansions, the heat release section 24 of this two through hole 34 in order to accommodate above-mentioned heat pipe 20.Each radiating fin 32 bottom is equipped with flanging 33, makes entire radiator 30 bottoms and heat-conducting plate 40 tops 42 for face contacts, and has improved the heat transference efficiency between radiator 30 and the heat-conducting plate 40.Above-mentioned radiator 30, heat pipe 20 and heat-conducting plate 40 are by welding or splicing and combination.

Described two fasteners 50 comprise two stripe board 52 and four securing members 56, each stripe board 52 middle part is provided with two through holes 522, these through holes 522 are corresponding with the screwed hole 422 of above-mentioned heat-conducting plate 40, and four screws 57 pass these through holes 522, screwed hole 422 so that stripe board 52 and heat-conducting plate 40 are coupled together.It is corresponding that each stripe board 52 two ends is provided with four-way hole 96 set on two through holes (figure mark) and the circuit board 90 in addition, through hole and through hole 96 that described four securing members 56 pass stripe board 52 are mounted on the circuit board 90 with the module 10 that will dispel the heat, and make heat radiation module 10 closely post on this electronic component 92.

During work, the heat that electronic component 92 produces at first is passed on the heat-conducting plate 40; A part of heat on this heat-conducting plate 40 directly reaches first body 325 of each radiating fin 32 in the radiator 30, diffuses to second body 326 away from electronic component 92 from first body 325 again; Another part heat directly is passed to second body 326 of each radiating fin 32 by heat pipe 20.

By the L shaped structure of each radiating fin 32, the heat that electronic component 92 is reached heat-conducting plate 40 is passed to second body 326 away from each radiating fin 32 of heat-conducting plate 40 rapidly, and the even heat distribution of whole heat-pipe radiating apparatus has improved radiating efficiency.

Claims

1. heat-pipe radiating apparatus, comprise that a heat-conducting plate, places the radiator on this heat-conducting plate and connects the heat pipe of this heat-conducting plate and radiator, it is characterized in that: described radiator is made up of some radiating fins that are arranged side by side on the described heat-conducting plate that stand on, described each radiating fin have first body and with second body of the first body one, second body is higher than first body.

2. heat-pipe radiating apparatus as claimed in claim 1 is characterized in that: described heat pipe comprises an endotherm section and a heat release section, and this endotherm section is arranged between first body and heat-conducting plate of described radiator, and heat release section is arranged in second body of radiating fin.

3. heat-pipe radiating apparatus as claimed in claim 2 is characterized in that: described first body is connected on the heat-conducting plate, and described second body is away from heat-conducting plate.

4. heat-pipe radiating apparatus as claimed in claim 1 or 2 is characterized in that: the L-shaped and mutual buckle combination of described radiating fin.

5. heat-pipe radiating apparatus as claimed in claim 1 or 2 is characterized in that: described radiator, heat pipe and heat-conducting plate are by welding or splicing and combination.

6. heat-pipe radiating apparatus as claimed in claim 1 or 2, it is characterized in that: comprise also being fixed on the heat-conducting plate that described two fasteners comprise lock two stripe board of heat-conducting plate and four securing members that are arranged in each end of stripe board respectively in order to this heat-pipe radiating apparatus is fixedly installed in two fasteners on the circuit board.

7. heat-pipe radiating apparatus as claimed in claim 1 or 2 is characterized in that: described first body, second body are all rectangular, each radiating fin stacked arrangement, thus form a ladder drop at the radiator top.