CN101312634A

CN101312634A - Heat radiating device

Info

Publication number: CN101312634A
Application number: CNA2007100746021A
Authority: CN
Inventors: 刘鹏
Original assignee: Hong Jun Precision Industry Co ltd; Fuzhun Precision Industry Shenzhen Co Ltd
Current assignee: Hong Jun Precision Industry Co ltd; Fuzhun Precision Industry Shenzhen Co Ltd
Priority date: 2007-05-25
Filing date: 2007-05-25
Publication date: 2008-11-26

Abstract

A heat dissipating device can dissipate the heat of electronic devices, which comprises a baseboard, a plurality of radiating finds above the baseboard and a heat pipe connecting the baseboard and the radiating fins, wherein the heat pipe comprises two connected evaporating sections and two condensation sections formed by bending the two evaporating sections at same side and combined with the radiating fins. The bent parts of the two evaporating sections and the two condensation sections are respectively provided with two arc thermal insulation sections, and the two evaporating sections are combined at the bottom of the baseboard. Compared with the prior art, the heat pipe is integrally shaped with the heat dissipating device, having the function as two heat pipes and having few sealing numbers, thereby reducing the cost of the heat dissipating device. The heat pipe is combined with the bottom of the baseboard to directly contact an electronic device, thereby effectively transmitting heat to the radiating fins.

Description

Heat abstractor

Technical field

The present invention relates to a kind of heat abstractor, be meant a kind of heat abstractor especially cooling electronic component.

Background technology

Electronic component such as central processing unit etc. produce a large amount of heat in running, for guaranteeing the normal operation of electronic component, the heat of its generation need distribute in time.Usually, install a heat abstractor additional on this electronic component.

Heat abstractor commonly used comprises a metal base plate and the some radiating fins that extend from this base plate.This base plate adheres on heat-generating electronic elements and absorbs the heat of its generation, and then heat transferred is dispersed into surrounding space to fin.Yet along with the development of electronic industry, the running frequency and the function of electronic component promote day by day, and its caloric value also increases thereupon.Above-mentioned radiator need add some heat pipes to promote its heat dispersion.As the heat abstractor that Chinese patent is disclosed for No. 200420003051.1, it comprises a pedestal, somely is arranged at the radiating fin of pedestal top and connects radiating fin and pedestal and two heat pipes that are arranged in parallel.Because this heat abstractor need be equipped with two heat pipes and could more evenly transfer to fin to heat from pedestal at high speed, heat pipe quantity is more, causes its manufacturing cost higher, is unfavorable for that the dealer promotes.

Summary of the invention

In view of this, be necessary to provide a kind of radiating efficiency higher and lower-cost heat abstractor.

A kind of heat abstractor, be used for cooling electronic component, it comprises a substrate, the some radiating fin of substrate top and heat pipes that connects substrate and radiating fin of being arranged at, described heat pipe comprises two evaporation sections that interconnect and by two evaporation sections homonymy back bending and two condensation segments that go out and combine with radiating fin respectively, the back bending part of described heat pipe two evaporation sections and two condensation segments forms the adiabatic section of two arcs respectively, and described two evaporation sections are incorporated into substrate bottom surface.

Compared with prior art, the heat pipe of heat abstractor of the present invention is one-body molded, and its effect is equivalent to two heat pipes, but its seal the number less, thereby make the heat abstractor cost lower; And heat pipe is incorporated into substrate bottom surface, can directly contact with electronic devices and components, thereby more high efficiency with heat delivered to radiating fin.

The invention will be further described in conjunction with the embodiments with reference to the accompanying drawings.

Description of drawings

Fig. 1 is the three-dimensional exploded view of heat abstractor of the present invention.

Fig. 2 is the three-dimensional assembly diagram of pedestal and heat pipe among Fig. 1.

Fig. 3 is the three-dimensional assembly diagram of Fig. 1.

Embodiment

See also Fig. 1 and Fig. 3, heat abstractor of the present invention is used for electronic devices and components (figure does not show) heat radiation on the circuit board (figure does not show), and it comprises a pedestal 10, the some radiating fin 20 of pedestal 10 tops and heat pipes 30 that connects pedestal 10 and radiating fin 20 of being arranged at.

Described pedestal 10 comprises an absorber plate 12 and a substrate 14 that contacts with absorber plate 12, and it is made by thermal conductance good metal material.This absorber plate 12 comprises a body 120, and this body 120 is fallen two isoceles triangle shapes zone by vertical cut respectively by adjacent two jiaos of places of a square block and forms, and then forms a minor face on absorber plate 12.The upper surface of this body 120 offers three grooves 122 that are parallel to minor face equably, is used for cooperating to embed heat pipe 30 corresponding parts with substrate 14; These body 120 lower surfaces contact with electronic devices and components to absorb the heat of its generation.Described substrate 14 is arranged at absorber plate 12 tops and contacts with radiating fin 20, and it comprises a rectangular body 140.These rectangular body 140 areas transfer to each radiating fin 20 greater than absorber plate 12 bodies 120 areas equably with the heat that absorber plate 12 is absorbed.The lower surface of this rectangular body 140 contacts with absorber plate 12 bodies 120 upper surfaces, it offers three grooves 142 corresponding with absorber plate 12 3 grooves 122 and that be parallel to each other, after cooperatively interacting, the groove 122 of these grooves 142 and absorber plate 12 forms three cylindrical spaces, so that heat pipe 30 corresponding parts are contained in wherein fully.140 4 jiaos of this rectangular body locate respectively that level extends outward four buckle ears 144, all offer a through hole 146 on each buckle ear 144, wear and substrate 14 is fixed on the circuit board for screw rod spare 40.

Described radiating fin 20 is arranged at pedestal 10 tops.Each radiating fin 20 is roughly rectangle, and two opposite side vertically bend out two flangings 202 respectively in the same way about it, and some upper and lower flangings 202 connect to form the upper and lower surface of radiating fin 20 respectively by welding.This lower surface and substrate 14 upper surface thermo-contacts are to transfer to radiating fin 20 with the part heat by substrate 14.Each radiating fin 20 is offered three manholes 204 near the upper surface place, and this three through hole 204 is arranged on the same straight line equably.The inner edge of each through hole 204 extends an annular with the vertical in the same way bending of flanging 202 and combines limit 206, some should annular in conjunction with the interconnecting of limit 206 correspondences, together form three cylindrical channels, heating tube 30 appropriate sections wear.

Described heat pipe 30 comprises first heat pipe 32 and second heat pipe 34 that connects pedestal 10 and radiating fin 20.Described first heat pipe 32 is one-body molded, it comprises bent back portion branch formation two adiabatic sections 324 that are parallel to each other and are in the evaporation section 320 in the same horizontal plane and gone out and be parallel to each other to two condensation segments, 322, two evaporation sections 320 and two condensation segments 322 of evaporation section 320 by the 320 homonymy back bending of two evaporation sections.Described evaporation section 320 and condensation segment 322 cross sections equate.Described condensation segment 322 is in another horizontal plane parallel with evaporation section 320 horizontal planes of living in, and this another horizontal plane is parallel to substrate 14.320 linkage sections 326 by an arc of two evaporation sections are connected, and form one " U " shape structure jointly.Two adiabatic sections 324 of this first heat pipe 32 are arc, and the spacing of two condensation segments 322 is greater than the spacing of two evaporation sections 320, with further with heat delivered to radiating fin 20 both sides, make radiating fin 20 distribute heat more equably.Because two evaporation sections 320 of this first heat pipe 32 all absorb heat, there is not heat exchange in the two, so this linkage section 326 only plays an interconnect function, and can not transmit heat.Thus, these heat pipe 32 roles are actual to be equivalent to two independent heat pipes (figure does not show), but because it is one-body molded, and it seals few one of number with respect to two independent heat pipes, so its cost is more cheaper than two independent heat pipes.

Described second heat pipe 34 also is formed in one, and it comprises an evaporation section 340 and a condensation segment 342 that is gone out by evaporation section 340 back bending, and the bent back portion of condensation segment 342 and evaporation section 340 divides formation one arc adiabatic section 344.The condensation segment 322 with above-mentioned first heat pipe 32 is identical with evaporation section 320 cross sections respectively with evaporation section 340 for the condensation segment 342 of this second heat pipe 34, and its condensation segment 342, evaporation section 340, adiabatic section 344 correspondence respectively make first heat pipe 32 about these second heat pipe, 34 left-right symmetric between two condensation segments 322 of first heat pipe 32, between two evaporation sections 320, between two adiabatic sections 324.The condensation segment 342 of this second heat pipe 34 is parallel to the condensation segment 322 of first heat pipe 32 and is in same horizontal plane with it, the evaporation section 340 of second heat pipe 34 is parallel to first and states the evaporation section 320 of heat pipe 32 and be in same horizontal plane with it, construct thereby make this second heat pipe 34 form one " U " shape perpendicular to substrate 14 on 344 planes of living in, adiabatic section of second heat pipe 34.See also Fig. 2, the evaporation section 320,340 of first heat pipe 32 and second heat pipe 34 is contained in respectively in the cylindrical space that substrate 14 grooves 142 and absorber plate 12 grooves 122 one common peripheral are set as accordingly, the condensation segment 322,342 of first heat pipe 32 and second heat pipe 34 combines with radiating fin 20 respectively, and the adiabatic section 324,344 that makes first heat pipe 32 and second heat pipe 34 is positioned at the same side of substrate 14, and connecting portion 326 levels of first heat pipe 32 protrude from substrate 14 and are positioned at the relative opposite side of substrate 14.

Again as shown in Figure 1 to Figure 3, when assembling this heat abstractor, at first two evaporation sections 320 with first heat pipe 32 embed two grooves 122 that are positioned at absorber plate 12 both sides respectively, make two condensation segments 322 of first heat pipe 32 be arranged at absorber plate 12 tops abreast; Evaporation section 340 with second heat pipe 34 embeds in the groove 122 at absorber plates 12 middle parts then, and the condensation segment 342 that makes second heat pipe 34 is also parallel with absorber plate 12 and between two condensation segments 322 of first heat pipe 32; Subsequently, substrate 14 is attached at absorber plate 12 tops, wherein, the groove 142 of substrate 14 cooperates with the groove 122 of absorber plate 12 and embeds the evaporation section 320,340 of first and

second heat pipes

32,34 respectively, thereby first and

second heat pipes

32,34 are located between substrate 14 and the absorber plate 12.At last, the condensation segment 322,342 of first and

second heat pipes

32,34 is arranged in the cylindrical channel of radiating fin 20 accordingly, the lower surface of radiating fin 20 and substrate 14 upper surfaces are in contact with one another.Thus, this heat abstractor has been finished assembling process.

In sum, first heat pipe 32 of heat abstractor of the present invention is one-body molded, can play the effect of two heat pipes, thereby makes the heat abstractor cost lower.And the spacing of two condensation segments 322 of first heat pipe 32 is greater than the spacing of two evaporation sections 320, and heat can transfer to radiating fin 20 both sides by pedestal, and radiating fin 20 is heated evenly, thereby radiating fin 20 can be dispelled the heat to greatest extent.Again, folder is established one second heat pipe 34 between first heat pipe 32, make heat more at a high speed transfer to radiating fin 20.Thus, than prior art, the radiating efficiency of this heat abstractor and manufacturing cost are all optimized to some extent.

Claims

1. heat abstractor, be used for cooling electronic component, it comprises a substrate, the some radiating fin of substrate top and heat pipes that connects substrate and radiating fin of being arranged at, it is characterized in that: described heat pipe comprises two evaporation sections that interconnect and by two evaporation sections homonymy back bending and two condensation segments that go out and combine with radiating fin respectively, the back bending part of described heat pipe two evaporation sections and two condensation segments forms the adiabatic section of two arcs respectively, and described two evaporation sections are incorporated into substrate bottom surface.

2. heat abstractor as claimed in claim 1 is characterized in that: described heat abstractor comprises that also one is attached at the absorber plate of substrate bottom surface, and two evaporation sections of described heat pipe are located between absorber plate and the substrate.

3. heat abstractor as claimed in claim 2 is characterized in that: two evaporation sections of described heat pipe are parallel to each other and are in same horizontal plane.

4. heat abstractor as claimed in claim 3 is characterized in that: connect common one " U " shape structure that forms of described linkage section and two evaporation sections between two evaporation sections of described heat pipe by a linkage section.

5. heat abstractor as claimed in claim 4 is characterized in that: two condensation segments of described heat pipe are parallel to each other to above-mentioned evaporation section and are on another horizontal plane parallel with two evaporation sections horizontal plane of living in, and this another horizontal plane is parallel to substrate.

6. heat abstractor as claimed in claim 5 is characterized in that: the spacing of described heat pipe two evaporation sections is less than the spacing of two condensation segments.

7. heat abstractor as claimed in claim 5, it is characterized in that: described heat abstractor also comprises another heat pipe, described another heat pipe has one and is located in evaporation section between substrate and absorber plate, and goes out and be incorporated into the condensation segment of radiating fin by the evaporation section back bending, and the bent back portion of evaporation section and condensation segment is divided the adiabatic section that forms an arc.

8. heat abstractor as claimed in claim 7 is characterized in that: the evaporation section of described another heat pipe, condensation segment, adiabatic section are corresponding to respectively between two evaporation sections of above-mentioned heat pipe, between two condensation segments, between two adiabatic sections.

9. heat abstractor as claimed in claim 8, it is characterized in that: the condensation segment of above-mentioned heat pipe and another heat pipe is positioned at the substrate top and combines with radiating fin, the adiabatic section of above-mentioned heat pipe and another heat pipe is positioned at a side of substrate, and the linkage section of above-mentioned heat pipe is positioned at the relative opposite side of substrate.

10. heat abstractor as claimed in claim 8, it is characterized in that: described another heat pipe is " U " shape, its evaporation section be parallel to above-mentioned heat pipe evaporation section and with the evaporating section of above-mentioned heat pipe in same horizontal plane, the condensation segment of another heat pipe is parallel to the condensation segment of above-mentioned heat pipe and is in same horizontal plane with the condensation segment of above-mentioned heat pipe, the adiabatic section of another heat pipe is curved, and its plane of living in is perpendicular to substrate.

11. heat abstractor as claimed in claim 10 is characterized in that: the evaporation section of described heat pipe and another heat pipe is identical with the condensation segment cross section, and described heat pipe is about another heat pipe left-right symmetric.