CN108770294A - A kind of radiating subassembly and electronic device - Google Patents
A kind of radiating subassembly and electronic device Download PDFInfo
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- CN108770294A CN108770294A CN201810597783.4A CN201810597783A CN108770294A CN 108770294 A CN108770294 A CN 108770294A CN 201810597783 A CN201810597783 A CN 201810597783A CN 108770294 A CN108770294 A CN 108770294A
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- heat
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- circuit board
- sim card
- card holder
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
This application discloses a kind of radiating subassembly and electronic device, which includes：Center；Circuit board is set on center；Heat source chip, is set on circuit board, and between circuit board and center；SIM card holder is set on circuit board；Heat pipe is set on center, including evaporator section and condensation segment, wherein evaporator section connects heat source chip, and condensation segment connects SIM card holder, the heat of heat source chip is conducted to SIM card holder.By the above-mentioned means, the damage of component caused by electronic device hot-spot can be avoided, spread out additionally by by heat, is conducive to the gripping feel for improving electronic device, improves user experience.
Description
Technical field
This application involves technical field of mobile terminals, more particularly to a kind of radiating subassembly and electronic device.
Background technology
The inside of electronic device generally comprises a control chip (i.e. core processor), with the diversification of its function, intelligence
Energyization, the requirement to chip are also very high.The dominant frequency of present chip is generally that 1GHz, 2GHz are even higher, and double-core, four cores are
Chip to eight cores is very universal.
The development of chip not only brings the problem of power consumption, but also due to the lightening heat for resulting in chip of electronic device
Amount is sealed in inside electronics so that electronics temperature rise.
Invention content
The application use a technical solution be：A kind of radiating subassembly is provided, which includes：Center；Circuit
Plate is set on center；Heat source chip, is set on circuit board, and between circuit board and center；SIM card holder is set to
On circuit board；Heat pipe is set on center, including evaporator section and condensation segment, wherein evaporator section connects heat source chip, condensation segment
SIM card holder is connected, the heat of heat source chip is conducted to SIM card holder.
The application use another technical solution be：A kind of electronic device is provided, which includes center, setting
In center one side front housing and be set to the rear shell of center another side；Wherein, electronic device further includes：Circuit board, if
It is placed on center；Heat source chip, is set on circuit board, and between circuit board and center；SIM card holder is set to circuit
On plate；Heat pipe is set on center, including evaporator section and condensation segment, wherein evaporator section connects heat source chip, condensation segment connection
SIM card holder conducts the heat of heat source chip to SIM card holder.
The case where being different from the prior art, radiating subassembly provided by the present application include：Center；Circuit board is set to center
On；Heat source chip, is set on circuit board, and between circuit board and center；SIM card holder is set on circuit board；Heat
Pipe, is set on center, including evaporator section and condensation segment, wherein and evaporator section connects heat source chip, and condensation segment connects SIM card holder,
Conducting the heat of heat source chip to SIM card holder.By the above-mentioned means, using the good heat conductivility of heat pipe, will fever compared with
The problem of conducting to the position of the lower SIM card holder of temperature for the heat of serious chip, avoid electronic device hot-spot,
The damage for preventing component caused by hot-spot, spreads out additionally by by heat, is conducive to improve holding for electronic device
Feel is held, user experience is improved.
Description of the drawings
In order to more clearly explain the technical solutions in the embodiments of the present application, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, the accompanying drawings in the following description is only some embodiments of the present application, for
For those of ordinary skill in the art, without creative efforts, other are can also be obtained according to these attached drawings
Attached drawing.Wherein：
Fig. 1 is the structural schematic diagram of radiating subassembly first embodiment provided by the present application；
Fig. 2 is the structural schematic diagram of radiating subassembly second embodiment provided by the present application；
Fig. 3 is the structural schematic diagram of radiating subassembly 3rd embodiment provided by the present application；
Fig. 4 is the structural schematic diagram of radiating subassembly fourth embodiment provided by the present application；
Fig. 5 is the structural schematic diagram of the 5th embodiment of radiating subassembly provided by the present application；
Fig. 6 is the structural schematic diagram of radiating subassembly sixth embodiment provided by the present application；
Fig. 7 is the structural schematic diagram of the 7th embodiment of radiating subassembly provided by the present application；
Fig. 8 is the structural schematic diagram of one embodiment of electronic device provided by the present application.
Specific implementation mode
Below in conjunction with the attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application carries out clear, complete
Site preparation describes.It is understood that specific embodiment described herein is only used for explaining the application, rather than the limit to the application
It is fixed.It also should be noted that illustrating only for ease of description, in attached drawing and the relevant part of the application and not all knot
Structure.Based on the embodiment in the application, those of ordinary skill in the art are obtained without creative efforts
Every other embodiment, shall fall in the protection scope of this application.
Term " first ", " second " in the application etc. be for distinguishing different objects, rather than it is specific suitable for describing
Sequence.In addition, term " comprising " and " having " and their any deformations, it is intended that cover and non-exclusive include.Such as comprising
The step of process of series of steps or unit, method, system, product or equipment are not limited to list or unit, and
It further includes the steps that optionally not listing or unit to be, or further includes optionally for these processes, method, product or equipment
Intrinsic other steps or unit.
Referenced herein " embodiment " is it is meant that a particular feature, structure, or characteristic described can wrap in conjunction with the embodiments
It is contained at least one embodiment of the application.Each position in the description occur the phrase might not each mean it is identical
Embodiment, nor the independent or alternative embodiment with other embodiments mutual exclusion.Those skilled in the art explicitly and
Implicitly understand, embodiment described herein can be combined with other embodiments.
Refering to fig. 1, Fig. 1 is the structural schematic diagram of radiating subassembly first embodiment provided by the present application, wherein left in Fig. 1
Side is front view, and right side is side sectional view, which includes center 10, circuit board 20, heat source chip 30, SIM card holder
40 and heat pipe 50.
Wherein, center 10 is a kind of housing unit of electronic device comprising two opposite sides, wherein on leading flank
Display screen component is set, the components such as circuit board, battery are set on trailing flank, are then connect with front housing in leading flank, trailing flank
It connect to form electronic device body with rear shell.General center 10 makes for metal alloy compositions, for example, steel plate, magnesium alloy etc..
In the present embodiment, center 10 includes opposite first area and second area, it is possible to understand that, first area and
Second area is respectively positioned on the trailing flank of center 10, wherein for circuit board 20 to be arranged, second area is then in Fig. 1 for first area
White space, can be used for that battery etc. is arranged, be not required here.
Circuit board 20 is set to first area (i.e. the upper subregion of center 10)；Heat source chip 30 is set to circuit board 20
On, and between circuit board 20 and center 10.It should be understood that a large amount of component can be set on circuit board 20, wherein
May include multiple chips, camera assembly, sensory package, communication component etc., these components are generally located on circuit board 20
On one side far from center 10, the heat source chip 30 (i.e. core processor) in multiple chips is generally located on circuit board 20 and leans on
The side of nearly center 10.SIM card holder 40 is set to circuit board 20.It should be understood that SIM card holder 40 is generally metal deck, SIM
Deck 40 generally comprises SIM card and houses frame and SIM card pop-up frame, and SIM card pop-up frame is transportable to be held with the SIM card
Frame connection is set, when in use, SIM card is placed on SIM pop-up frames, then by SIM pop-up boxes by way of sliding into
Frame houses frame secure bond with SIM.It should be understood that in the present embodiment, SIM card holder 40 here can also be singly to refer to
SIM card houses frame.
Optionally, in one embodiment, SIM card holder 40 is set to one side of the circuit board 20 close to the center 10,
In another embodiment, a void region can also be opened up on circuit board 20, and SIM card holder 40 is fixed on the void region
In, no matter that is, from the point of view of the both sides side of circuit board 20, SIM card holder 40 is exposed.
Heat pipe 50 includes evaporator section 50a and condensation segment 50b, wherein evaporator section 50a connection heat sources chip 30, condensation segment 50b
SIM card holder 40 is connected, the heat of heat source chip 30 is conducted to SIM card holder 40.It should be understood that evaporator section 50a is located at heat
Between source chip 30 and center 10, the stepped construction formed includes center 10, heat pipe 50, heat source chip 30 and circuit board successively
Between SIM card holder 40 and center, the stepped construction formed includes center 10, heat pipe 50, SIM successively by 20, condensation segment 50b
Deck 40.
Heat pipe is a kind of novel heat-conducting medium, and thousands of times are improved than the copper capacity of heat transmission.Heat pipe inner wall is lined with porous material
Material, is absorbent cores, filled with alcohol or other liquid easily vaporized in absorbent cores.When one end of heat pipe is heated, this one end (evaporation
Section) liquid in absorbent cores vaporizes because of heat absorption, and steam goes to the other end by heated one end along pipe from the air duct among heat pipe
(condensation segment), for the other end due to not being heated, temperature is low, and steam just liquefies in this one end heat release, and the liquid of condensation is by heat pipe wall
Included capillary structure absorbent cores absorption, has been returned to heated one end, has so moved in circles, in heat pipe through capillary action
Liquid is constantly vaporized and is liquefied, and heat is passed to the other end from one end.
Optionally, in one embodiment, heat pipe 50 is flat, and the thickness of heat pipe is 0.3mm to 1mm.It should be understood that
The length of heat pipe 50 evaporator section 50a and condensation segment 50b can be arranged according to demand, and the length of the two can be different.
For example, due to being separate between heat source chip 30 and SIM card holder 40, and heat source chip 30 is smaller and SIM card holder 40 is larger, institute
The length of condensation segment 50b can be less than with the length of evaporator section 50a.
In this embodiment, heat pipe 50 is to attach to connect with center 10, can specifically pass through the good glue of heat conductivility
Pasted, for the sides evaporator section 50a, one side and the center 10 of heat pipe 50 attach, another side then with heat source chip 30
It attaches.
The case where being different from the prior art, radiating subassembly provided in this embodiment include：Center；Circuit board, in being set to
On frame；Heat source chip, is set on circuit board, and between circuit board and center；SIM card holder is set on circuit board；Heat
Pipe, is set on center, including evaporator section and condensation segment, wherein and evaporator section connects heat source chip, and condensation segment connects SIM card holder,
Conducting the heat of heat source chip to SIM card holder.By the above-mentioned means, using the good heat conductivility of heat pipe, will fever compared with
The problem of conducting to the position of the lower SIM card holder of temperature for the heat of serious chip, avoid electronic device hot-spot,
The damage for preventing component caused by hot-spot, spreads out additionally by by heat, is conducive to improve holding for electronic device
Feel is held, user experience is improved.
Referring to Fig.2, Fig. 2 is the structural schematic diagram of radiating subassembly second embodiment provided by the present application, in combination with Fig. 1,
The radiating subassembly includes center 10, circuit board 20, heat source chip 30, SIM card holder 40 and heat pipe 50.
Wherein, circuit board 20 is set on center 10；Heat source chip 30 is set on circuit board 20, and is located at circuit board 20
Between center 10；SIM card holder 40 is set on circuit board 20；Heat pipe 50 is set on center 10, including evaporator section 50a and cold
Solidifying section 50b, wherein evaporator section 50a connection heat sources chip 30, condensation segment 50b connections SIM card holder 40, by heat source chip 30
Heat is conducted to SIM card holder 40.
It is optionally, specific that heat source chip 30 includes chip body 31 and shielding case 32 as shown in Fig. 2, in the present embodiment,
Wherein, chip body 31 is set on circuit board, specifically can be by welding formed on circuit board 20；Shielding case
32 are set on circuit board 20, and a shielding space is collectively formed with circuit board 20, and chip body 31 is arranged in shielding space；
Wherein, the one side of evaporator section 50a is contacted with shielding case 32, and the another side of evaporator section 50a is contacted with center 10.
Wherein, shielding case 32 is usually that metal material makes, and thickness is generally 0.2-0.3mm.
It is the structural schematic diagram of radiating subassembly 3rd embodiment provided by the present application, the radiating subassembly packet refering to Fig. 3, Fig. 3
Include center 10, circuit board 20, heat source chip 30 and heat pipe 50.
Wherein, circuit board 20 is set on center 10；Heat source chip 30 is set on circuit board 20, and is located at circuit board 20
Between center 10；SIM card holder 40 is set on circuit board 20；Heat pipe 50 is set on center 10, including evaporator section 50a and cold
Solidifying section 50b, wherein evaporator section 50a connection heat sources chip 30, condensation segment 50b connections SIM card holder 40, by heat source chip 30
Heat is conducted to SIM card holder 40.
Optionally, in the present embodiment, heat source chip 30 includes chip body 31 and shielding case 32, wherein chip body
31 are set on circuit board, specifically can by welding be formed on circuit board 20；Shielding case 32 is set to circuit
On plate 20, and a shielding space is collectively formed with circuit board 20, chip body 31 is arranged in shielding space；Wherein, evaporator section
The one side of 50a is contacted with shielding case 32, and the another side of evaporator section 50a is contacted with center 10.
Optionally, in the present embodiment, it is additionally provided with the first silicone grease layer 61 between shielding case 32 and chip body 31, shields
It is additionally provided with the second silicone grease layer 62 between cover 32 and heat pipe 50.
Above-mentioned silicone grease layer is heat-conducting silicone grease, and popular name is called thermal grease, is to do base oil, novel metal oxygen with extraordinary silicone oil
Compound does filler, is equipped with multiple functions additive, the paste being process through specific technique, and color has because of material difference
There is different appearances.It is the ideal dielectric material of heat-resisting device with good heat conduction, heatproof, insulation performance, and performance
Stablize, not will produce etchant gas in use, the metal contacted will not be had an impact.The filler of high-purity and organic
Silicon be product it is smooth, uniformly and high-temperature insulation guarantee.It is applied to power device and radiator fitting surface, contact surface is eliminated in help
The air gap increase type of thermal communication, reduce thermal resistance, reduce the operating temperature of power device, improve reliability and extend and use the longevity
Life.
Optionally, in the present embodiment, it is additionally provided with the first heat-conducting piece 71 between the second silicone grease layer 62 and heat pipe 50, first
Heat-conducting piece 71 is graphite or copper foil.
In the present embodiment, by increasing heat-conducting silicone grease and graphite/copper foil, the heat of chip body 31 can be made rapid
It is transferred on the evaporator section 50a of heat pipe 50, so that heat pipe 50 can further transmit heat.
In above two embodiment, the micropore of array distribution, optionally, the hole of micropore can be opened up on shielding case 32
Diameter size be less than 32 inner shield domain of shielding case radiofrequency signal wavelength 1/50, with the thickness of shielding case 32 be 0.2~
For 0.3mm, the spacing of micropore is greater than or equal to the 1/4 of the pore size of the micropore, and less than or equal to the aperture of the micropore
The 1/2 of size, the quantity of the micropore is determined by corresponding 32 region of shielding case in 31 surface of chip body, i.e., in chip body
Within the greatest measure that corresponding 32 region of shielding case in 31 surfaces can allow, micropore quantity can also be limited in 1/2 wavelength half
In diameter border circular areas, but it must be ensured that the greatest measure that corresponding 32 region of shielding case in 31 surface of chip body can allow with
It is interior.Wherein, it is the bigger the better from shield effectiveness angle micropore spacing, but considers to ensure the heat conduction of the heat-conducting silicone grease in microwell array region
Performance needs spacing to be limited in equal to or slightly less than pore radius range, and the specific spacing for limiting micropore is greater than or equal to should
The 1/4 of the pore size of micropore, and 1/2 of the pore size less than or equal to the micropore, to ensure that total shield effectiveness is more than
30dB/1GHz。
Optionally, heat-conducting silicone grease can be pre-machined in the microwell array both sides of shielding case, and gap is not generated at micropore,
The heat-conducting silicone grease has 30% to 70% compressibility, and overall thickness is between 0.5mm-1mm.
As optional embodiment, the shape of micropore includes at least one of：Circle, triangle, rectangle, diamond shape,
Other can realize the embodiment of same effect within the protection domain of the embodiment of the present application.
It is the structural schematic diagram of radiating subassembly fourth embodiment provided by the present application, the radiating subassembly packet refering to Fig. 4, Fig. 4
Include center 10, circuit board 20, heat source chip 30, SIM card holder and heat pipe 50.
Wherein, circuit board 20 is set on center 10；Heat source chip 30 is set on circuit board 20, and is located at circuit board 20
Between center 10；SIM card holder 40 is set on circuit board 20；Heat pipe 50 is set on center 10, including evaporator section 50a and cold
Solidifying section 50b, wherein evaporator section 50a connection heat sources chip 30, condensation segment 50b connections SIM card holder 40, by heat source chip 30
Heat is conducted to SIM card holder 40.
In the present embodiment, the second heat-conducting piece 72, the second heat-conducting piece are additionally provided between condensation segment 50b and SIM card holder 40
72 be graphite or copper foil.
It is the structural schematic diagram of the 5th embodiment of radiating subassembly provided by the present application, the radiating subassembly packet refering to Fig. 5, Fig. 5
Include center 10, circuit board 20, heat source chip 30, SIM card holder and heat pipe 50.
Wherein, circuit board 20 is set on center 10；Heat source chip 30 is set on circuit board 20, and is located at circuit board 20
Between center 10；SIM card holder 40 is set on circuit board 20；Heat pipe 50 is set on center 10, including evaporator section 50a and cold
Solidifying section 50b, wherein evaporator section 50a connection heat sources chip 30, condensation segment 50b connections SIM card holder 40, by heat source chip 30
Heat is conducted to SIM card holder 40.
In the present embodiment, be arranged on center 10 it is fluted, for housing heat pipe 50.It should be understood that the length of groove,
Width and depth are corresponding with the length of heat pipe 50, width and thickness respectively, so that heat pipe 50 can be just positioned in groove.Tool
Body can be fixed by the materials such as heat conduction colloid opposite heat tube 50, and corresponding snap-in structure can also be arranged on groove to heat
Pipe 50 is fixed.
It is the structural schematic diagram of radiating subassembly sixth embodiment provided by the present application, the radiating subassembly packet refering to Fig. 6, Fig. 6
Include center (not shown), circuit board 20, heat source chip 30 and heat pipe 50.
Wherein, circuit board 20 is set on center 10；Heat source chip 30 is set on circuit board 20, and is located at circuit board 20
Between center 10；SIM card holder 40 is set on circuit board 20；Heat pipe 50 is set on center 10, including evaporator section 50a and cold
Solidifying section 50b, wherein evaporator section 50a connection heat sources chip 30, condensation segment 50b connections SIM card holder 40, by heat source chip 30
Heat is conducted to SIM card holder 40.
Evaporator section 50a include at least multiple sub- evaporator sections being sequentially connected, wherein the sub- evaporator section of head end or end with it is cold
Solidifying section 50b connections, the extending direction difference of each two adjacent sub- evaporator section is to form bending structure, so that multiple sub- evaporator sections
It is uniformly distributed in 30 on heat source chip.Optionally, the extending direction of each two adjacent sub- evaporator section is mutually perpendicular to, multiple sub- steamings
Hair section forms the surface that a rectangular uniform is distributed in heat source chip 30.
Condensation segment 50b includes at least multiple sub- condensation segments being sequentially connected, the wherein sub- condensation segment of head end or end and steaming
Section 50a connections are sent out, the extending direction difference of each two adjacent sub- condensation segment is to form bending structure, so that multiple sub- condensation segments
It is uniformly distributed in SIM card holder 40.Optionally, the extending direction of each two adjacent sub- condensation segment is mutually perpendicular to, and multiple sons are cold
Solidifying section forms the bottom that a rectangular uniform is distributed in SIM card holder 40.
It is the structural schematic diagram of the 7th embodiment of radiating subassembly provided by the present application referring again to Fig. 7, Fig. 7, is different from above-mentioned
Sixth embodiment, in the present embodiment, evaporator section 50a are arcuate structure, and one end of arcuate structure is connect with condensation segment 50b, arc
Shape structure is uniformly distributed on heat source chip 30.Condensation segment 50b is arcuate structure, and one end and the evaporator section 50a of arcuate structure connect
It connects, arcuate structure is uniformly distributed in SIM card holder 40.
In the embodiment of above-mentioned Fig. 7 and Fig. 8, heat pipe 50 is distributed in a manner of bending (complications), increases heat pipe 50
The contact area of evaporator section 50a and heat source chip 30, and increase the contact of the condensation segment 50b and SIM card holder 40 of heat pipe 50
Area, can preferably absorb heat and heat release in this way, accelerate radiating rate.
It should be understood that in the above-described embodiment, if the shape of heat pipe 50 is irregular, foring bending or curved
Bent shape, then the groove of the center 10 for housing heat pipe 50 should also be as being set as shape corresponding with heat pipe shape.
Above-mentioned Fig. 6 and Fig. 7 illustrate only the part-structure of the radiator, and center is not shown.
It is the structural schematic diagram of one embodiment of electronic device provided by the present application refering to Fig. 8, Fig. 8, which includes
Center 10, the front housing 81 for being set to center one side and the rear shell 82 for being set to center another side.
Wherein, fluted (not indicating) is arranged close to the side of rear shell 82 in center 10, for housing heat pipe 50 in groove,
In, circuit board 20 is set on center 10；Heat source chip 30 is set on circuit board 20, and positioned at circuit board 20 and center 10 it
Between；SIM card holder 40 is set on circuit board 20；Heat pipe 50 is set on center 10, including evaporator section 50a and condensation segment 50b,
In, evaporator section 50a connection heat sources chip 30, condensation segment 50b connections SIM card holder 40, by the heat of heat source chip 30 conduct to
SIM card holder 40.
The evaporator section of heat pipe 50 includes the first heat-conducting piece 71, thermal grease layer, shielding case successively close to the side of rear shell 82
32, thermal grease layer, chip body 31 and circuit board 20.The condensation segment of heat pipe 50 includes the successively close to the side of rear shell 82
Two heat-conducting pieces 72 and SIM card holder 40；Wherein, shielding case 32 forms a shielding space with circuit board 20, and chip body 31 is located at
Inside the shielding space.
In addition, further including display screen component 90, center 10 is set to close to the side of front housing 81.Center 10 and display screen group
Third heat-conducting piece 73 is additionally provided between part 90, third heat-conducting piece 73 is graphite or copper foil.
Wherein, front housing 81 is generally transparent glass cover-plate, and rear shell 82 is generally the shell of metal or plastic production.
Optionally, can also include a case ring between center 10 and front housing 81 or between center 10 and rear shell 82.
It, specifically can be with it should be understood that the embodiment of aforementioned radiating subassembly can be applied to the electronic device in this implementation
It is mobile phone, tablet computer etc., specific structure is similar with implementation principle, and which is not described herein again.
The heat for the chip that electronic device inner heat is more concentrated is passed through heat by electronic device through this embodiment
Pipe is conducted to the lower SIM card holder region of temperature, the problem of avoiding electronic device hot-spot, caused by preventing hot-spot
The damage of component, spreads out additionally by by heat, is conducive to the gripping feel for improving electronic device, improves user's body
It tests.
The foregoing is merely presently filed embodiments, are not intended to limit the scope of the claims of the application, every to utilize this
Equivalent structure or equivalent flow shift made by application specification and accompanying drawing content, it is relevant to be applied directly or indirectly in other
Technical field includes similarly in the scope of patent protection of the application.
Claims (14)
1. a kind of radiating subassembly, which is characterized in that including：
Center；
Circuit board is set on the center；
Heat source chip is set on the circuit board, and between the circuit board and the center；
SIM card holder is set on the circuit board；
Heat pipe is set on the center, including evaporator section and condensation segment, wherein and the evaporator section connects the heat source chip,
The condensation segment connects the SIM card holder, and the heat of the heat source chip is conducted to the SIM card holder.
2. radiating subassembly according to claim 1, which is characterized in that
The heat source chip includes；
Chip body is set on the circuit board；
Shielding case is set on the circuit board, and a shielding space is collectively formed with the circuit board, and the chip body is set
It sets in the shielding space；
Wherein, the one side of the evaporator section is contacted with the shielding case, and the another side of the evaporator section connects with the center
It touches.
3. radiating subassembly according to claim 2, which is characterized in that
The first silicone grease layer is additionally provided between the shielding case and the chip body, between the shielding case and the heat pipe also
It is provided with the second silicone grease layer.
4. radiating subassembly according to claim 3, which is characterized in that
The first heat-conducting piece is additionally provided between the second silicone grease layer and the heat pipe, first heat-conducting piece is graphite or copper
Foil.
5. radiating subassembly according to claim 1, which is characterized in that
The groove that the direction being provided on the center between the corresponding heat source chip and the SIM card holder extends, the heat
Pipe is set in the groove.
6. radiating subassembly according to claim 1, which is characterized in that
The second heat-conducting piece is additionally provided between the condensation segment and the SIM card holder, second heat-conducting piece is graphite or copper foil.
7. radiating subassembly according to claim 1, which is characterized in that
The evaporator section include at least multiple sub- evaporator sections being sequentially connected, wherein the sub- evaporator section of head end or end with it is described cold
Solidifying section connection, the extending direction difference of each two adjacent sub- evaporator section is to form bending structure, so that the multiple sub- evaporation
Section is uniformly distributed on the heat source chip.
8. radiating subassembly according to claim 1, which is characterized in that
The evaporator section is arcuate structure, and one end of the arcuate structure is connect with the condensation segment, and the arcuate structure is uniform
It is distributed on the heat source chip.
9. radiating subassembly according to claim 1, which is characterized in that
The condensation segment includes at least multiple sub- condensation segments being sequentially connected, the wherein sub- condensation segment of head end or end and the steaming
Section connection is sent out, the extending direction difference of each two adjacent sub- condensation segment is to form bending structure, so that the multiple sub- condensation
Section is uniformly distributed in the SIM card holder.
10. radiating subassembly according to claim 1, which is characterized in that
The condensation segment is arcuate structure, and one end of the arcuate structure is connect with the evaporator section, and the arcuate structure is uniform
It is distributed in the SIM card holder.
11. radiating subassembly according to claim 1, which is characterized in that
The heat pipe is flat, and the thickness of the heat pipe is 0.3mm to 1mm.
12. a kind of electronic device, which is characterized in that including center, be set to the front housing of the center one side and be set to
The rear shell of the center another side；
Wherein, the electronic device further includes：
Circuit board is set on the center；
Heat source chip is set on the circuit board, and between the circuit board and the center；
SIM card holder is set on the circuit board；
Heat pipe is set on the center, including evaporator section and condensation segment, wherein and the evaporator section connects the heat source chip,
The condensation segment connects the SIM card holder, and the heat of the heat source chip is conducted to the SIM card holder.
13. electronic device according to claim 12, which is characterized in that
The electronic device further includes display screen component, is set to the center close to the side of the front housing.
14. electronic device according to claim 13, which is characterized in that
Third heat-conducting piece is additionally provided between the center and the display screen component, the third heat-conducting piece is graphite or copper
Foil.
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