CN108776531A - A kind of electronic device and a kind of radiating subassembly - Google Patents

Abstract

The application provides an electronic device and a heat dissipation component. The electronic device includes a circuit board, a heat source chip, a shielding cover, a heat dissipation frame and a heat pipe. The heat source chip is welded on the circuit board to be electrically connected with the circuit board. The position of the evaporation area corresponds to the shield to absorb the heat of the chip from the heat source. The heat dissipation efficiency of the heat source chip of the present application is significantly improved.

Description

An electronic device and a heat dissipation component

technical field

The present application relates to the technical field of heat dissipation of electronic devices, in particular to an electronic device and a heat dissipation component.

Background technique

With the popularization of smart phones, users will obviously feel the heat of the mobile phone during the long-term use of the smart phone. After testing, when the mobile phone is working, the main reason is that the CPU of the mobile phone heats up. The mobile phone CPU is a highly integrated SOC chip. It not only integrates the CPU central chip and GPU graphics processing chip, but also a series of key chip modules such as Bluetooth, GPS, and radio frequency. It is the most integrated chip among smartphone chips. Modules dissipate a lot of heat when they operate at high speeds. At present, there are multiple solutions for the heat dissipation problem of mobile phones, but the heat dissipation effect is not satisfactory.

application content

The application provides an electronic device, the electronic device includes a circuit board, a heat source chip, a shielding cover, a heat dissipation frame and a heat pipe, the heat source chip is welded on the circuit board to be electrically connected with the circuit board, and the shielding cover is arranged on the heat source chip , the heat pipe is assembled in the heat dissipation frame, and the position of the evaporation area of the heat pipe corresponds to the shield to absorb the heat of the heat source chip.

The present application provides a heat dissipation assembly, which includes a heat dissipation frame and a heat pipe, the heat pipe is mounted in the heat dissipation frame, and the heat pipe is used to absorb heat from a heat source chip.

The electronic device of the present application includes a circuit board, a heat source chip, a shield, a heat dissipation frame, and a heat pipe. The heat source chip is electrically connected to the circuit board, and generates a large amount of heat in the working state. The position corresponds to the shielding cover to absorb the heat of the heat source chip, and the heat pipe transfers the heat to the position of the heat dissipation frame of the electronic device. Because the heat pipe is pre-assembled in the heat dissipation frame and forms a complete assembly with the heat dissipation frame, the heat pipe is also assembled when the heat dissipation frame is assembled. In addition, the heat pipe can use the heat dissipation frame as a carrier to dissipate heat from the heat source chip, thereby improving the performance of the heat pipe. Assembly efficiency and heat dissipation efficiency of electronic devices.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings that need to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, other drawings can also be obtained based on these drawings without creative effort.

FIG. 1 is a schematic structural diagram of an embodiment of an electronic device provided by the present application;

FIG. 2 is a schematic structural diagram of another embodiment of the electronic device provided by the present application;

FIG. 3 is a schematic structural diagram of another embodiment of the electronic device provided by the present application;

FIG. 4 is a schematic structural diagram of another embodiment of the electronic device provided by the present application;

FIG. 5 is a schematic structural diagram of another embodiment of the electronic device provided by the present application;

FIG. 6 is a schematic structural diagram of another embodiment of the electronic device provided by the present application;

Fig. 7 is a schematic structural diagram of another embodiment of the electronic device provided by the present application;

Fig. 8 is a schematic structural diagram of another embodiment of the electronic device provided by the present application;

FIG. 9 is a schematic structural diagram of another embodiment of the electronic device provided by the present application;

FIG. 10 is a schematic structural diagram of another embodiment of the electronic device provided by the present application;

Fig. 11 is a schematic structural diagram of another embodiment of the electronic device provided by the present application;

Fig. 12 is a schematic structural diagram of another embodiment of the electronic device provided by the present application;

Fig. 13 is a schematic structural diagram of another embodiment of the electronic device provided by the present application;

Fig. 14 is a schematic structural diagram of another embodiment of the electronic device provided by the present application;

FIG. 15 is a schematic structural diagram of another embodiment of the electronic device provided by the present application.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. It should be understood that the specific embodiments described here are only used to explain the present application, but not to limit the present application. In addition, it should be noted that, for the convenience of description, only some structures related to the present application are shown in the drawings but not all structures. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.

The electronic devices provided in the embodiments of the present application include electronic devices such as smart phones, tablet computers, smart wearable devices, digital audio and video players, e-readers, handheld game consoles, and vehicle-mounted electronic devices.

The terms "first" and "second" in this application are only used for descriptive purposes, and should not be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of these features. In the description of the present application, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined. All directional indications (such as up, down, left, right, front, back...) in the embodiments of the present application are only used to explain the relative positional relationship between the various components in a certain posture (as shown in the drawings) , sports conditions, etc., if the specific posture changes, the directional indication also changes accordingly. Furthermore, the terms "include" and "have", as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or components is not limited to the listed steps or components, but optionally also includes unlisted steps or components, or optionally also includes Other steps or components inherent to the process, method, product or apparatus are included.

Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The occurrences of this phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is understood explicitly and implicitly by those skilled in the art that the embodiments described herein can be combined with other embodiments.

Please refer to FIG. 1 . FIG. 1 is a schematic structural diagram of an embodiment of an electronic device provided by the present application.

In this embodiment, the electronic device includes a heat dissipation frame 10 , a circuit board 20 , a heat source chip 30 , a shield 40 and a heat pipe 50 .

The heat source chip 30 is welded on the circuit board 20 to be electrically connected with the circuit board 20. The heat source chip 30 includes CPU, GPU, radio frequency chip, GPS chip, etc., and these chips will generate a large amount of heat when they are in operation. When the temperature rises above 50 degrees Celsius, it will affect its working efficiency and service life.

The shielding cover 40 is set on the heat source chip 30, and the shielding cover 40 is made of metal, which can play an electrostatic shielding effect on the heat source chip 30, thereby preventing the outside world from causing electrostatic interference to the heat source chip 30 or the heat source chip 30 to the outside world. The shielding cover 40 can be made of nickel nickel, which has good thermal conductivity.

The working principle of the heat pipe 50 is to use the phase change process of the medium evaporating and absorbing heat in the evaporating zone and then condensing and dissipating heat in the condensing zone, so that heat can be quickly transferred from a high temperature position to a low temperature position.

The heat dissipation frame 10 may be a middle frame or a rear case, and FIG. 1 shows the case where the heat dissipation frame 10 is a middle frame. The heat pipe 50 can be assembled in the heat dissipation frame 10. The position of the evaporation area of the heat pipe 50 corresponds to the shield cover 40 to absorb the heat of the heat source chip 30. The heat dissipation area of the middle frame or the rear shell is large and has sufficient contact with the air to quickly dissipate the The heat in the condensation area of the heat pipe 50 is diffused, thereby preventing the local temperature of the heat source chip 30 from being too high.

Among them, the middle frame is a housing assembly of an electronic device, which includes two opposite sides, wherein a display screen assembly is arranged on the front side, and components such as a circuit board and a battery are arranged on the rear side, and then the front side is connected to the front shell , the rear side is connected with the rear shell to form the main body of the electronic device. Generally, the middle frame is made of metal alloy material, for example, steel plate, magnesium-aluminum alloy, and the like.

Different from the situation in the prior art, the electronic device of this embodiment includes a circuit board, a heat source chip, a shield cover, a heat dissipation frame and a heat pipe. In the heat dissipation frame, the position of the evaporation area of the heat pipe corresponds to the shield to absorb the heat of the heat source chip, and the heat pipe transfers the heat to the position of the heat dissipation frame of the electronic device. Because the heat pipe is pre-assembled in the heat dissipation frame and forms a complete assembly with the heat dissipation frame, the heat pipe is also assembled when the heat dissipation frame is assembled. In addition, the heat pipe can use the heat dissipation frame as a carrier to dissipate heat from the heat source chip, thereby improving the performance of the heat pipe. Assembly efficiency and heat dissipation efficiency of electronic devices.

Please refer to FIG. 2 . FIG. 2 is a schematic structural diagram of another embodiment of the electronic device provided by the present application.

The heat dissipation frame 10 is provided with a slot 11 at a position corresponding to the heat source chip 30. The evaporation area of the heat pipe 50 is exposed to the air through the slot 11. The heat of the heat source chip 30 is first conducted to the shield 40 and then to the evaporation of the heat pipe 50. area, between the heat source chip 30 and the shielding cover 40, heat dissipation silica gel or heat dissipation silicone grease is sandwiched, and the slot 11 is filled with heat dissipation silica gel or heat dissipation silicone grease, thereby increasing the heat source chip 30 and the shielding cover 40, the shielding cover 40 and the heat pipe. 50, thereby improving the heat transfer efficiency between the heat source chip 30, the shield cover 40, and the evaporation area of the heat pipe 50.

The common name of the above heat dissipation silicone grease is also called heat dissipation paste. It is a paste made of special silicone oil as base oil, new metal oxide as filler, and a variety of functional additives. The color is different due to different materials. have a different appearance. It has good thermal conductivity, temperature resistance, and insulation properties. It is an ideal dielectric material for heat-resistant devices, and its performance is stable. It will not produce corrosive gas during use and will not affect the metal it contacts. High-purity filler and silicone are the guarantee of smooth, uniform and high-temperature insulation of the product. Applied on the assembly surface of power devices and radiators, it can help eliminate the air gap on the contact surface, increase heat flow, reduce thermal resistance, reduce the operating temperature of power devices, improve reliability and extend service life.

Please refer to FIG. 3 . FIG. 3 is a schematic structural diagram of another embodiment of the electronic device provided by the present application.

The heat pipe 50 includes a first heat pipe 51 and a second heat pipe 52. The position of the evaporation area of the first heat pipe 51 corresponds to the shield 40, so as to absorb the heat from the heat source chip 30 on the shield 40. The number of the first heat pipe 51 can be 1 , 2, 3, 4, 5, etc., the number of the first heat pipe 51 shown in FIG. 3 is one. The second heat pipe 52 is connected with the condensation area of the first heat pipe 51, to absorb the heat of the first heat pipe 51 and diffuse the heat of the first heat pipe 51 to other positions of the electronic device, such as the SIM card accommodating frame, the SIM card accommodating The frame is made of a metal structure with excellent thermal conductivity, and the SIM card accommodating frame is used to place the SIM card of the electronic device, and the heat generated by the frame is less than that generated by the heat source chip 30 when it is in operation.

Optionally, the SIM card accommodating frame is provided with a temperature controller 12, and the temperature controller 12 is used for monitoring the temperature of the SIM card accommodating frame. When the value of the temperature controller 12 exceeds a certain threshold (the threshold can be any temperature within the range of 38 degrees Celsius to 50 degrees Celsius, and the user can set it according to his own needs), the SIM card accommodating frame will automatically eject the SIM card to disconnect the battery. Opening the communication connection of the electronic device forces the running applications in the electronic device to suspend, so that the workload of the heat source chip 30 is correspondingly reduced, thereby reducing the generation of heat in the heat source chip 30 . After the SIM card is ejected, some heat can also be brought out. At this time, the electronic device directly communicates with the outside air through the SIM card opening of the SIM card accommodating frame, so as to accelerate the heat diffusion to the outside of the electronic device.

The heat pipe 50 is composed of a copper shell, a liquid-absorbing core and an end cap. The inside of the copper tube shell is pumped into a negative pressure state and filled with an appropriate liquid, which has a low boiling point and is easy to volatilize. The inner wall of the shell has a liquid-absorbing core, which is made of capillary porous material. One end of the heat pipe 50 is an evaporation area, and the opposite end is a condensation area. When one end of the heat pipe 50 is heated, the liquid in the heat pipe 50 vaporizes rapidly, and the vapor flows to the other end under the power of thermal diffusion, and condenses at the cold end to release heat. , the liquid flows back to the evaporation area along the porous material by capillary action, and the cycle continues until the temperatures at both ends of the heat pipe 50 are equal.

The copper shell of the heat pipe 50 has the best thermal conductivity when it is not bent, because the liquid-absorbing core is in the most complete state at this time, and the capillary porous structure of the liquid-absorbing core is not damaged due to bending.

The cooperation between the first heat pipe 51 and the second heat pipe 52 can extend the heat pipe 50 to any heat dissipation frame 10 of the electronic device with good heat dissipation effect under the premise of avoiding excessive bending of the heat pipe 50. The first heat pipe 51 absorbs the heat source chip 30 The second heat pipe 52 absorbs the heat of the first heat pipe 51 and spreads the heat of the first heat pipe 51 to other lower temperature heat dissipation frames 10 of the electronic device, thereby greatly improving the heat transfer of the heat source chip 30 to other Efficiency at cooler locations. Optionally, both the first heat pipe 51 and the second heat pipe 52 are non-bending structures.

The condensation area of the first heat pipe 51 is provided with at least one matching groove 511, and the evaporation area of the second heat pipe 52 is provided with a corresponding number of protrusions, and the protrusions are inserted into the matching groove 511 to connect the first heat pipe 51 and the second heat pipe 52. together; or the condensation area of the first heat pipe 51 is provided with at least one protrusion, and the evaporation area of the second heat pipe 52 is provided with a corresponding number of matching grooves 511, and the protrusions are inserted into the matching grooves 511 so that the first heat pipe 51 and The second heat pipes 52 are connected together. It should be noted that the end of the first heat pipe 51 and the end of the second heat pipe 52 can be used as a convex part.

Heat dissipation silica gel or heat dissipation silicone grease is filled in the fitting groove 511 to increase the thermal conductivity of the first heat pipe 51 and the second heat pipe 52 . FIG. 3 shows that the condensation area of the first heat pipe 51 is provided with at least one matching groove 511 , and the protrusion of the evaporation area of the second heat pipe 52 is inserted into the matching groove 511 .

Optionally, the electronic device further includes a third heat pipe 53 connected to the condensation area of the second heat pipe 52 . The third heat pipe 53 can connect multiple second heat pipes 52 together, heat circulates among the first heat pipe 51 , the second heat pipe 52 , and the third heat pipe 53 , the heat spreads more evenly, and local overheating does not occur. Especially when the heat dissipation frame 10 is a rear case, the uneven heat of the rear case will cause a decline in the user's touch experience.

In addition, the third heat pipe 53 connects multiple second heat pipes 52 together, and the third heat pipe 53 forms a network heat dissipation structure together with the first heat pipe 51 and the second heat pipe 52. The first heat pipe 51, the second heat pipe 52 and the third heat pipe Laying the heat pipe 53 into the heat dissipation frame 10 greatly enhances the overall strength of the heat dissipation frame 10 . Optionally, the first heat pipe 51 , the second heat pipe 52 and the third heat pipe 53 are all non-bending structures.

Please refer to FIG. 4 . FIG. 4 is a schematic structural diagram of another embodiment of the electronic device provided by the present application.

The electronic device further includes a battery 60 electrically connected to the circuit board 20 .

The heat dissipation frame 10 can be a middle frame. The middle frame includes a bottom plate 13 and a side plate 18. The side plate 18 is arranged around the bottom plate 13 to form an accommodating groove 14 with the bottom plate 13. The circuit board 20 and the battery 60 are accommodated in the accommodating groove 14 and Connected with the middle frame, the heat source chip 30 is arranged between the circuit board 20 and the bottom plate 13 , and the heat pipe 50 is assembled in the bottom plate 13 and/or the side plate 18 . Optionally, the electronic device further includes heat insulation foam 70 , and the heat insulation foam 70 is disposed on the side of the battery 60 facing the heat pipe 50 to prevent heat from the heat pipe 50 from being conducted to the battery 60 .

The middle frame also includes a partition plate 15, which is arranged on the bottom plate 13 to divide the accommodating groove 14 into a first accommodating groove 141 and a second accommodating groove 142, and the circuit board 20 is accommodated in the first accommodating groove 142. In the slot 141 , the battery 60 is accommodated in the second accommodation slot 142 . Optionally, the bottom plate 13 of the first accommodating groove 141 is provided with a through hole, and the shielding case 40 , the heat source chip 30 , etc. are sunk into the through hole, so as to reduce the thickness of the electronic device vertically to the circuit board 20 .

The heat dissipation frame 10 can also be a rear shell, and the heat pipe 50 is assembled in the rear shell. The material of the back shell can be metal or ceramics, or the material of the back shell can be plastic, and the heat pipe 50 is laid in the back shell to increase the overall strength of the back shell.

The present application also protects a heat dissipation assembly. The heat dissipation assembly includes a heat dissipation frame 10 and a heat pipe 50. The heat dissipation frame 10 can be a middle frame or a rear case. The heat pipe 50 is assembled in the heat dissipation frame 10. The middle frame or the rear case is assembled into an electronic device. When the evaporation area of the heat pipe 50 is located corresponding to the heat source chip 30 , the heat pipe 50 absorbs the heat of the heat source chip 30 . Please refer to the description of the above-mentioned embodiment for the specific working principle and structural deformation.

Please refer to FIG. 5 . FIG. 5 is a schematic structural diagram of another embodiment of the electronic device provided by the present application.

In this embodiment, the electronic device includes a heat dissipation frame 10 , a circuit board 20 , a heat source chip 30 , a shield 40 and a heat pipe 50 . The heat source chip 30 is welded on the circuit board 20 to be electrically connected with the circuit board 20 . The shielding case 40 is disposed on the heat source chip 30 .

The heat dissipation frame 10 can be a middle frame, a rear case or a SIM card accommodating frame. FIG. 5 shows the case where the heat dissipation frame 10 is a middle frame. The heat dissipation frame 10 is provided with buckles 16, and the heat pipe 50 can be clamped in the buckle 16 to be assembled on the heat dissipation frame 10. The position of the evaporation area of the heat pipe 50 corresponds to the shield 40 to absorb the heat of the heat source chip 30. The middle frame or The large heat dissipation area of the back shell and sufficient contact with the air can quickly spread the heat in the condensation area of the heat pipe 50 , thereby preventing the local temperature of the heat source chip 30 from being too high.

The buckle 16 and the heat dissipation frame 10 can be integrally formed. The buckle 16 includes a main body 161 and a clamping part 162. The main body 161 is connected to the heat dissipation frame 10. The clamping part 162 is extended perpendicular to the main body 161. The heat pipe 50 is locked It is connected to the space surrounded by the main body part 161 , the clamping part 162 and the heat dissipation frame 10 . The buckle 16 can also be a separate part assembled on the heat dissipation frame 10 . Between the heat pipe 50 and the shield 40 , between the shield 40 and the heat source chip 30 , dissipate heat dissipation silica gel, heat dissipation silicon grease or copper foil to increase heat transfer efficiency.

Different from the situation in the prior art, the electronic device of this embodiment includes a circuit board, a heat source chip, a shield, a heat dissipation frame, and a heat pipe. In the buckle on the heat dissipation frame, the position of the evaporation area of the heat pipe corresponds to the shield to absorb the heat of the heat source chip, and the heat pipe transfers the heat to the position of the heat dissipation frame of the electronic device. Because the heat pipe is pre-installed on the heat dissipation frame and forms a complete assembly with the heat dissipation frame, the heat pipe is also assembled when the heat dissipation frame is assembled. In addition, the heat pipe can use the heat dissipation frame as a carrier to dissipate heat from the heat source chip, thereby improving Assembly efficiency of heat pipes and heat dissipation efficiency of electronic devices.

Please refer to FIG. 6 . FIG. 6 is a schematic structural diagram of another embodiment of the electronic device provided by the present application.

The heat pipe 50 includes a first heat pipe 51 and a second heat pipe 52. The position of the evaporation area of the first heat pipe 51 corresponds to the shield 40, so as to absorb the heat from the heat source chip 30 on the shield 40. The number of the first heat pipe 51 can be 1 , 2, 3, 4, 5, etc., the number of the first heat pipe 51 shown in FIG. 6 is one. The second heat pipe 52 is connected to the condensation area of the first heat pipe 51 to absorb the heat of the first heat pipe 51 and spread the heat of the first heat pipe 51 to other cooling frames of the electronic device, such as the SIM card accommodating frame.

Optionally, the SIM card accommodating frame is provided with a temperature controller 12, and the temperature controller 12 is used for monitoring the temperature of the SIM card accommodating frame. When the temperature of the SIM card accommodating frame exceeds a certain threshold, the threshold may be any temperature within the range of 38 degrees Celsius to 50 degrees Celsius, and the SIM card containing frame automatically ejects the SIM card. For the specific working principles and actual effects of the SIM card accommodating frame and the temperature controller 12, please refer to the explanations of the above-mentioned embodiments, and details will not be repeated here.

Optionally, the electronic device further includes a third heat pipe 53 connected to the condensation area of the second heat pipe 52 . The third heat pipe 53 can connect multiple second heat pipes 52 together, heat circulates among the first heat pipe 51 , the second heat pipe 52 , and the third heat pipe 53 , the heat spreads more evenly, and local overheating does not occur. Especially when the heat dissipation frame 10 is a rear case, the uneven heat of the rear case will cause a decline in the user's touch experience.

In addition, the third heat pipe 53 connects multiple second heat pipes 52 together, and the third heat pipe 53 forms a network heat dissipation structure together with the first heat pipe 51 and the second heat pipe 52. The first heat pipe 51, the second heat pipe 52 and the third heat pipe The heat pipe 53 is laid on the heat dissipation frame 10 in a clamping manner, which greatly enhances the overall strength of the heat dissipation frame 10 .

Please refer to FIG. 7 . FIG. 7 is a schematic structural diagram of another embodiment of the electronic device provided by the present application.

The heat dissipation frame 10 can be a middle frame. The middle frame includes a bottom plate 13 and a side plate 18. The side plate 18 is arranged around the bottom plate 13 to form an accommodating groove 14 with the bottom plate 13. The circuit board 20 and the battery 60 are accommodated in the accommodating groove 14 and Connected to the middle frame, the heat source chip 30 is disposed between the circuit board 20 and the bottom plate 13 , and the heat pipe 50 is clamped on all the bottom plate 13 and/or the side plate 18 . Optionally, the electronic device further includes heat insulation foam 70 , and the heat insulation foam 70 is disposed on the side of the battery 60 facing the heat pipe 50 to prevent heat from the heat pipe 50 from being conducted to the battery 60 .

The difference between this embodiment and the above embodiments is that the heat pipe 50 is clamped on the bottom plate 13 of the middle frame to divide the accommodating groove 14 into a first accommodating groove 141 and a second accommodating groove 142, and the circuit board 20 accommodates In the first accommodating slot 141 , the battery 60 is accommodated in the second accommodating slot 142 . Therefore, the baffle plate for separating the accommodating groove 14 on the bottom plate 13 is omitted, and the space position of the baffle plate is reserved for the heat pipe, thereby improving the space utilization rate of the electronic device.

The heat pipe 50 can be connected to the shielding cover 40 in a bent form, and can also be clamped on the bottom plate 13 of the middle frame to divide the accommodating slot 14 into a first accommodating slot 141 and a second accommodating slot 142 . The heat pipe 50 can also be split into a first heat pipe 51 and a second heat pipe 52 to realize the above technical solution.

The heat dissipation frame 10 can also be a rear shell, and the heat pipe 50 is clamped in the rear shell. The material of the back shell can be metal or ceramics, or the material of the back shell can be plastic, and the heat pipe 50 is stuck in the back shell to increase the overall strength of the back shell.

The present application also protects a heat dissipation assembly. The heat dissipation assembly includes a heat dissipation frame 10 and a heat pipe 50. The heat dissipation frame 10 can be a middle frame or a rear shell. On the heat dissipation frame 10 , the position where the evaporation area of the heat pipe 50 is located corresponds to the heat source chip 30 when the middle frame or the rear case is assembled into an electronic device, and the heat pipe 50 absorbs heat from the heat source chip 30 . Please refer to the description of the above-mentioned embodiment for the specific working principle and structural deformation.

Please refer to FIG. 8 . FIG. 8 is a schematic structural diagram of another embodiment of the electronic device provided by the present application.

In this embodiment, the electronic device includes a heat dissipation frame 10 , a circuit board 20 , a heat source chip 30 , a shield 40 and a heat pipe 50 . The heat source chip 30 is welded on the circuit board 20 to be electrically connected with the circuit board 20 . The shielding case 40 is disposed on the heat source chip 30 .

The circuit board 20 is provided with buckles 16, and the heat pipe 50 can be buckled in the buckle 16 to be assembled on the circuit board 20. The heat pipe 50 is used to absorb the heat of the heat source chip 30, and the heat dissipation frame 10 is connected to the heat pipe 50 to absorb heat from the heat pipe 50. heat.

The electronic device includes a SIM card accommodating frame, a middle frame frame, a middle frame bottom plate, a back shell, and other electronic devices that generate less heat than the heat source chip 30 and have a large heat dissipation area. The heat dissipation frame 10 can be a SIM card accommodating frame, One, two, three or four of the middle frame frame, the middle frame bottom plate, and the rear shell. The large heat dissipation area of the heat dissipation frame 10 and sufficient contact with the air can quickly spread the heat in the condensation area of the heat pipe 50 , thereby preventing the local temperature of the heat source chip 30 from being too high.

The buckle 16 and the circuit board 20 can be integrally formed. The buckle 16 includes a main body 161 and a snap-in portion 162. The main body 161 is connected to the circuit board 20. The snap-in portion 162 extends perpendicularly to the main body 161. The heat pipe 50 snaps into place. It is connected to the space surrounded by the main body part 161 , the clamping part 162 and the heat dissipation frame 10 . The circuit board 20 is provided with a perforation hole 163 at a position corresponding to the clamping portion 162 , which facilitates integral molding of the clamping portion 162 of the buckle 16 and the cooling frame. The buckle 16 can also be a separate part assembled on the circuit board 20 .

Different from the situation in the prior art, the electronic device of this embodiment includes a circuit board, a heat source chip, a shield, a heat dissipation frame, and a heat pipe. In the buckle on the circuit board, the evaporation area of the heat pipe is used to absorb the heat of the heat source chip, and the heat pipe transfers the heat to the position of the heat dissipation frame of the electronic device. Because the heat pipe is pre-installed on the circuit board and the circuit board forms a complete assembly, the heat pipe is also assembled when the circuit board is assembled. In addition, the heat pipe can use the circuit board as a carrier to dissipate heat from the heat source chip, thereby improving Assembly efficiency of heat pipes and heat dissipation efficiency of electronic devices.

Please refer to FIG. 9 . FIG. 9 is a schematic structural diagram of another embodiment of the electronic device provided by the present application.

The electronic device also includes heat-dissipating silica gel or copper foil 80, and the shielding cover 40 is provided with a via hole 41 along the direction of the plane of the circuit board 20. connected to absorb the heat of the heat source chip 30.

Specifically, the heat dissipation silica gel or copper foil 80 includes a heat absorbing portion 81 and a first heat conducting portion 82, the heat absorbing portion 81 is connected to the top of the heat source chip 30, and the first heat conducting portion 82 is connected to the heat absorbing portion 81 and connected to the heat source chip 30. The side extends to be connected with the heat pipe 50 . The heat of the heat source chip 30 is transferred to the heat pipe 50 sequentially through the heat absorbing part 81 and the first heat conducting part 82 , and then transferred to the heat dissipation frame 10 through the heat pipe 50 .

Optionally, the heat dissipation silica gel or copper foil 80 further includes a second heat conduction portion 83, the second heat conduction portion 83 is connected to the first heat conduction portion 82 and sleeved on the heat pipe 50, so as to increase the heat dissipation silica gel or copper foil 80 and the heat pipe 50. connection area.

Please refer to FIG. 10 . FIG. 10 is a schematic structural diagram of another embodiment of the electronic device provided by the present application.

The heat pipe 50 may include a first heat pipe 51 and a second heat pipe 52 , and the first heat pipe 51 is locked in the buckle 16 to be assembled on the circuit board 20 to absorb the heat of the heat source chip 30 . The second heat pipe 52 is respectively connected to the condensation area of the first heat pipe 51 and the heat dissipation frame 10 to absorb the heat of the first heat pipe 51, so that the electronic device can bend the first heat pipe 51 as little as possible. The heat dissipates to the heat dissipation frame 10 of the electronic device, such as the SIM card accommodating frame.

Optionally, the SIM card accommodating frame is provided with a temperature controller 12, and the temperature controller 12 is used for monitoring the temperature of the SIM card accommodating frame. When the temperature of the SIM card accommodating frame exceeds a certain threshold, the threshold may be any temperature within the range of 38 degrees Celsius to 50 degrees Celsius, and the SIM card containing frame automatically ejects the SIM card. For the specific working principles and actual effects of the SIM card accommodating frame and the temperature controller 12, please refer to the explanations of the above-mentioned embodiments, and details will not be repeated here.

The second heat pipe 52 can be assembled on the heat dissipation frame 10. When the heat dissipation frame 10 is assembled into an electronic device, the second heat pipe 52 is directly connected to the first heat pipe 51 snapped on the circuit board 20, thereby facilitating the installation of the second heat pipe 52. assembly.

Optionally, the condensation area of the first heat pipe 51 is provided with a matching groove 511, and the evaporation area of the second heat pipe 52 is provided with a convex portion, and the convex portion is inserted into the matching groove 511; or the evaporation area of the second heat pipe 52 is provided with a matching groove 511 , the condensation area of the first heat pipe 51 is provided with a corresponding protrusion, and the protrusion is inserted into the matching groove 511 . It can be understood that the condensation area and the evaporation area of the heat pipe 50 respectively include the corresponding surrounding walls of the heat pipe and the end portions of the heat pipe.

Optionally, the electronic device further includes a third heat pipe 53 connected to the condensation area of the second heat pipe 52 . The third heat pipe 53 can connect multiple second heat pipes 52 together, heat circulates among the first heat pipe 51 , the second heat pipe 52 , and the third heat pipe 53 , the heat spreads more evenly, and local overheating does not occur. Especially when the heat dissipation frame 10 is a rear case, the uneven heat of the rear case will cause a decline in the user's touch experience.

In addition, the third heat pipe 53 connects the plurality of second heat pipes 52 together, and the third heat pipe 53, the first heat pipe 51 and the second heat pipe 52 together form a network heat dissipation structure and assemble it in the electronic device, thereby enhancing the heat dissipation of the heat dissipation frame 10. overall strength. Optionally, the contact between the first heat pipe 51 and the second heat pipe 52, the second heat pipe 52 and the third heat pipe 53 can be sleeved with a sleeve 90, and the heat dissipation silicon grease is coated in the sleeve 90, so that the heat can flow through the sleeve. The heat is transmitted through the tube 90 to avoid the uncontrolled spread of heat to other parts of the electronic device, such as the camera. When the camera works, it generates a lot of heat, and its high temperature will affect its normal operation.

Optionally, the first heat pipe 51, the second heat pipe 52 and the third heat pipe 53 are flat, and the thickness of the first heat pipe 51, the second heat pipe 52 and the third heat pipe 53 is 0.3 mm to 1 mm, for example, 0.3 mm, 0.4 mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm.

Please refer to FIG. 11 . FIG. 11 is a schematic structural diagram of another embodiment of the electronic device provided by the present application.

The difference between this embodiment and the above-mentioned embodiments is that the heat pipe 50 is outside the shield 40, the heat dissipation silica gel is pressed between the heat source chip 30 and the shield 40, and the copper foil 80 includes a heat absorbing part 81, a first heat conducting part 82 and The second heat conducting part 83, the heat absorbing part 81 is attached to the side of the shielding cover 40 away from the heat dissipation silica gel, the first heat conducting part 82 is connected to the heat absorbing part 81 and extends to the side of the shielding cover 40, the second heat conducting part 83 and the side of the shielding cover 40 The first heat conducting portion 82 is connected and sleeved on the heat pipe 50 .

The present application also protects a circuit board assembly, the circuit board assembly includes a circuit board 20, a heat source chip 30, a shield 40 and a heat pipe 50, the heat source chip 30 is welded on the circuit board 20 to be electrically connected with the circuit board 20, and the shield 40 The cover is set on the heat source chip 30 , the circuit board 20 is provided with buckles 16 , and the heat pipe 50 is locked in the buckles 16 to be assembled on the circuit board 20 , and the heat pipe 50 absorbs the heat of the heat source chip 30 . Please refer to the description of the above-mentioned embodiment for the specific working principle and structural deformation.

Please refer to FIG. 12 . FIG. 12 is a schematic structural diagram of another embodiment of the electronic device provided by the present application.

The electronic device of this embodiment includes a circuit board 20, a heat source chip 30, and a first heat pipe 51. The heat source chip 30 is welded on the circuit board 20 to be electrically connected to the circuit board 20. The difference between this embodiment and the above embodiments is that the first A heat pipe 51 is assembled in the circuit board 20 , and the position of the evaporation area of the first heat pipe 51 corresponds to the heat source chip 30 to absorb the heat of the heat source chip 30 .

The circuit board 20 defines a first groove 21 at a position corresponding to the heat source chip 30 to expose the evaporation area of the first heat pipe 51 . The first groove 21 is filled with heat-dissipating silica gel or heat-dissipating silicon grease, and the evaporation area of the first heat pipe 51 and the heat source chip 30 directly exchange heat through the heat-dissipating silica gel or heat-dissipating silicon grease.

Different from the situation in the prior art, the electronic device of this embodiment includes a circuit board, a heat source chip, and a first heat pipe. The heat source chip is electrically connected to the circuit board, and generates a large amount of heat in the working state. The first heat pipe is pre-assembled on the circuit board. In the plate, the position of the evaporation area of the first heat pipe corresponds to the heat source chip to absorb the heat of the heat source chip, and then the first heat pipe transfers the heat to other lower temperature positions in the electronic device. Because the first heat pipe is pre-embedded in the circuit board and the circuit board forms a complete assembly, so the first heat pipe is also assembled when the circuit board is assembled. In addition, the first heat pipe can use the circuit board as a carrier to heat the heat source chip. heat dissipation, thereby improving the assembly efficiency of the first heat pipe and the heat dissipation efficiency of the electronic device.

The electronic device also includes a second heat pipe 52. The circuit board 20 is provided with a second groove 22 for exposing the condensation area of the first heat pipe 51. The second heat pipe 52 is connected to the condensation area of the first heat pipe 51 to diffuse The second groove 22 is filled with heat-dissipating silicone or heat-dissipating silicone grease to increase the thermal conductivity between the first heat pipe 51 and the second heat pipe 52 .

Please refer to FIG. 13 . FIG. 13 is a schematic structural diagram of another embodiment of the electronic device provided by the present application.

Optionally, the first heat pipe 51 can also be assembled in the circuit board 20, and at the same time, the condensation area of the first heat pipe 51 runs through the circuit board 20 and is directly connected to one of the SIM card accommodating frame, the middle frame frame, the middle frame bottom plate, and the rear shell. , 2, 3 or 4 are connected to spread the heat of the heat source chip 30 away. Of course, the condensation area of the first heat pipe 51 can also pass through the circuit board 20 and be connected to the second heat pipe 52, and the second heat pipe 52 is connected to one of the SIM card accommodating frame, the middle frame frame, the middle frame bottom plate, and the rear shell. ters or quaternary connections.

Wherein, the electronic device also includes a temperature controller 12, the temperature controller 12 is arranged on the SIM card accommodating frame 10, and the condensation zone of the first heat pipe 51 penetrates the circuit board 20 and is at least connected with the SIM card accommodating frame 10, or the first The condensation area of the heat pipe 51 passes through the circuit board 20 and is connected to the second heat pipe 52 , and the second heat pipe 52 is at least connected to the SIM card accommodating frame 10 . The temperature controller is used to monitor the temperature of the SIM card accommodating frame 10. When the value of the temperature controller 12 exceeds a certain threshold, the SIM card accommodating frame 10 will automatically eject the SIM card.

The present application also protects a circuit board assembly, the circuit board assembly includes a circuit board 20, a heat source chip 30 and a first heat pipe 51, the heat source chip 30 is welded on the circuit board 20 to be electrically connected with the circuit board 20, and the first heat pipe 51 is assembled In the circuit board 20 , the position of the evaporation area of the first heat pipe 51 corresponds to the heat source chip 30 to absorb the heat of the heat source chip 30 .

Please refer to FIG. 14 . FIG. 14 is a schematic structural diagram of another embodiment of the electronic device provided by the present application.

In this embodiment, the electronic device includes a circuit board 20 , a heat source chip 30 , a shield 40 , a first heat pipe 51 and a second heat pipe 52 . The heat source chip 30 is welded on the circuit board 20 to be electrically connected with the circuit board 20 . The shielding case 40 is disposed on the heat source chip 30 .

The first heat pipe 51 is used to absorb the heat of the heat source chip 30 , and the second heat pipe 52 is respectively connected to the first heat pipe 51 and the heat dissipation frame 10 to dissipate the heat of the first heat pipe 51 .

The heat dissipation frame 10 may be one, two, three or four of the SIM card accommodating frame, the frame of the middle frame, the bottom plate of the middle frame, and the rear shell.

The second heat pipe 52 can be assembled on the heat dissipation frame 10, and the first heat pipe 51 is assembled on the circuit board 20. When the heat dissipation frame 10 is assembled into an electronic device, the second heat pipe 52 is directly connected to the first heat pipe 51, thereby facilitating the second Assembly of heat pipe 52 .

Different from the situation in the prior art, the electronic device of this embodiment includes a circuit board, a heat source chip, a shield cover, a first heat pipe and a second heat pipe, and the heat source chip is electrically connected to the circuit board to generate a large amount of heat in the working state. The first heat pipe absorbs the heat of the heat source chip, and the second heat pipe is connected with the first heat pipe to transfer the heat of the first heat pipe to other lower temperature positions of the electronic device. Because the first heat pipe and the second heat pipe can cooperate with each other to transfer heat, the first heat pipe and the second heat pipe can cooperate to form various shapes with as little bending as possible, and efficiently transfer heat to other parts of the electronic device that have a lower temperature at the location.

Please refer to FIG. 15 . FIG. 15 is a schematic structural diagram of another embodiment of the electronic device provided by the present application.

The electronic device of this embodiment includes a circuit board 20, a heat source chip 30, a heat pipe 50 and a heat dissipation frame 10, the heat source chip 30 is welded on the circuit board 20 to be electrically connected with the circuit board 20, the heat pipe 50 is assembled in the circuit board 20, and the heat pipe The position of the evaporation area 50 corresponds to the heat source chip 30 to absorb the heat of the heat source chip 30 , and the heat dissipation frame 10 is connected to the heat pipe 50 to absorb the heat of the heat pipe 50 .

Different from the situation in the prior art, the electronic device of this embodiment includes a circuit board, a heat source chip, a heat pipe, and a heat dissipation frame. The heat source chip is electrically connected to the circuit board, and generates a large amount of heat in the working state. The heat pipe is pre-assembled on the circuit board In the heat pipe, the position of the evaporation area of the heat pipe corresponds to the heat source chip to absorb the heat of the heat source chip, and then the heat pipe transfers the heat to other cooling frames with lower temperature in the electronic device. Because the heat pipe is pre-embedded in the circuit board and forms a complete assembly with the circuit board, the heat pipe is also assembled when the circuit board is assembled. In addition, the heat pipe can use the circuit board as a carrier to dissipate heat from the heat source chip, thereby improving the performance of the heat pipe. Assembly efficiency and heat dissipation efficiency of electronic devices.

The heat dissipation frame 10 includes a SIM card accommodating frame, a middle frame frame, a middle frame bottom plate, a rear shell, etc. The difference between this embodiment and the above embodiment is that the heat dissipation frame 10 is provided with an assembly groove 17, and a circuit board 20 equipped with a heat pipe 50 When the electronic device is assembled, the heat pipe 50 is directly clamped in the assembly groove 17 to connect with one, two, three or four of the SIM card accommodating frame, the middle frame frame, the middle frame bottom plate, and the rear case.

The electronic device also includes a temperature controller 12, the heat pipe 50 runs through the circuit board 20 and is at least connected with the SIM card accommodating frame, the temperature controller 12 is arranged on the SIM card accommodating frame, and the temperature controller 12 is used for monitoring the temperature of the SIM card accommodating frame. temperature;

Wherein, when the value of the temperature controller 12 exceeds a certain threshold, the SIM card accommodating frame automatically ejects the SIM card.

The present application also protects a circuit board assembly, the circuit board assembly includes a circuit board 20, a heat source chip 30 and a heat pipe 50, the heat source chip 30 is welded on the circuit board 20 to be electrically connected with the circuit board 20, and the heat pipe 50 is assembled on the circuit board 20 Among them, the position of the evaporation area of the heat pipe 50 corresponds to the heat source chip 30 to absorb the heat of the heat source chip 30 .

It can be understood that the various technical features of the above embodiments can be applied to each other to form a technical solution that needs to be protected in this application.

The above is only the implementation of the application, and does not limit the patent scope of the application. Any equivalent structure or equivalent process conversion made by using the specification and drawings of the application, or directly or indirectly used in other related technologies fields, are all included in the scope of patent protection of this application in the same way.

Claims (10)

1. An electronic device, characterized in that, comprising: circuit board; a heat source chip welded on the circuit board to be electrically connected to the circuit board; a shielding cover, set on the heat source chip; cooling frame; and The heat pipe is assembled in the heat dissipation frame, and the position of the evaporation area of the heat pipe corresponds to the shield to absorb the heat of the heat source chip. 2. The electronic device according to claim 1, wherein: The heat dissipation frame is provided with a slot corresponding to the position of the heat source chip to expose the evaporation area of the heat pipe, and the slot is filled with heat dissipation silica gel or heat dissipation silicone grease to increase the contact between the heat pipe and the heat dissipation Thermal conductivity between shields. 3. The electronic device according to claim 2, wherein: The heat pipe includes a first heat pipe and a second heat pipe, the position of the evaporation area of the first heat pipe corresponds to the shield, and the second heat pipe is connected with the condensation area of the first heat pipe to diffuse the first heat pipe. The heat of a heat pipe. 4. The electronic device according to claim 3, wherein: The condensation area of the first heat pipe is provided with at least one matching groove, and the evaporation area of the second heat pipe is provided with a corresponding protrusion, and the protrusion is inserted into the matching groove; or The condensation area of the first heat pipe is provided with at least one protrusion, the evaporation area of the second heat pipe is provided with a corresponding matching groove, and the protrusion is inserted into the matching groove. 5. The electronic device according to claim 4, wherein: The electronic device further includes a third heat pipe connected to the condensation area of the second heat pipe to form a mesh heat dissipation structure together with the first heat pipe and the second heat pipe. 6. The electronic device according to claim 1, wherein: The heat dissipation frame is a middle frame, and the middle frame includes a bottom plate and a side plate, and the side plate is arranged around the bottom plate to form an accommodating groove with the bottom plate, and the circuit board is accommodated in the accommodating groove And connected with the middle frame, the heat pipe is assembled in the bottom plate and/or the side plate. 7. The electronic device according to claim 6, wherein: The middle frame also includes a partition plate, which is arranged on the bottom plate to divide the accommodating slot into a first accommodating slot and a second accommodating slot, and the circuit board is accommodated in the in the first storage tank; The electronic device further includes a battery, and the battery is accommodated in the second accommodation slot. 8. The electronic device according to claim 7, wherein: The electronic device further includes heat insulation foam, and the heat insulation foam is arranged on the side of the battery facing the heat pipe, so as to prevent the heat of the heat pipe from being conducted to the battery. 9. The electronic device according to claim 1, wherein: The heat dissipation frame is a rear shell, the heat pipe is assembled in the rear shell, and the material of the rear shell is metal or ceramics. 10. A cooling assembly, characterized in that it comprises: cooling frame; and The heat pipe is assembled in the heat dissipation frame, and the heat pipe is used for absorbing the heat of the heat source chip.