CN108807310A - A kind of electronic device and radiating subassembly - Google Patents
A kind of electronic device and radiating subassembly Download PDFInfo
- Publication number
- CN108807310A CN108807310A CN201810596680.6A CN201810596680A CN108807310A CN 108807310 A CN108807310 A CN 108807310A CN 201810596680 A CN201810596680 A CN 201810596680A CN 108807310 A CN108807310 A CN 108807310A
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- heat
- heat pipe
- electronic device
- source chip
- frame
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Signal Processing (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
This application provides a kind of electronic device and radiating subassemblies.The electronic device includes circuit board, heat source chip, shielding case, heat-dissipating frame and heat pipe, heat source chip welds on circuit boards to be electrically connected with circuit board, shielding case is located on heat source chip, heat-dissipating frame is provided with buckle, heat pipe is arranged in buckle to be assemblied on heat-dissipating frame, and the position of the evaporating area of heat pipe corresponds to shielding case to absorb the heat of heat source chip.The radiating efficiency of the application heat source chip is significantly improved.
Description
Technical field
This application involves the technical field of heat dissipation of electronic device, more particularly to a kind of electronic device and a kind of heat dissipation group
Part.
Background technology
As smart mobile phone is universal, for smart mobile phone during long-time use, user can be clearly felt that the hair of mobile phone
Heat, by detection, when operating handset, wherein mobile phone CPU fevers to be main the reason is that.Mobile phone CPU is a highly integrated SOC
Chip, its inside are not merely integrated with CPU central dies and GPU graph processing chips, and also bluetooth, GPS, radio frequency etc. is a series of
Key chip module, is the highest chip of integrated level in smart mobile phone chips, and module can all radiate largely in working at high speed
Heat.It is directed to the heat dissipation problem of mobile phone at present, there are many solutions, but heat dissipation effect is all undesirable.
Apply for content
This application provides a kind of electronic device, which includes circuit board, heat source chip, shielding case, heat sink
Frame and heat pipe, heat source chip weld on circuit boards to be electrically connected with circuit board, and shielding case is located on heat source chip, heat dissipation
Frame is provided with buckle, and heat pipe is arranged in buckle to be assemblied on heat-dissipating frame, and the position of the evaporating area of heat pipe corresponds to screen
Cover is covered to absorb the heat of heat source chip.
This application provides a kind of radiating subassembly, which includes heat-dissipating frame and heat pipe, and heat-dissipating frame is provided with
Buckle, heat pipe are arranged in buckle to be assemblied on heat-dissipating frame, and heat pipe is used to absorb the heat of heat source chip.
The electronic device of the application includes circuit board, heat source chip, shielding case, heat-dissipating frame and heat pipe, heat source chip with
Circuit board is electrically connected, and a large amount of heat is generated in working condition, heat pipe is arranged in the buckle on heat-dissipating frame, heat pipe
The position of evaporating area corresponds to shielding case to absorb the heat of heat source chip, and heat pipe transfers heat to the heat sink of electronic device
At the position of frame.Because heat pipe is to be arranged on heat-dissipating frame to form a complete component with heat-dissipating frame in advance, dissipate
Heat pipe also complete therewith by assembly when hot frame assembly is completed, in addition, heat pipe can be using heat-dissipating frame as carrier to heat source chip
It radiates, to improve the efficiency of assembling of heat pipe and the radiating efficiency of electronic device.
Description of the drawings
In order to more clearly explain the technical solutions in the embodiments of the present application, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, the accompanying drawings in the following description is only some embodiments of the present application, for
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing.
Fig. 1 is the structural schematic diagram of an embodiment of electronic device provided by the present application；
Fig. 2 is the structural schematic diagram of another embodiment of electronic device provided by the present application；
Fig. 3 is the structural schematic diagram of another embodiment of electronic device provided by the present application；
Fig. 4 is the structural schematic diagram of another embodiment of electronic device provided by the present application；
Fig. 5 is the structural schematic diagram of another embodiment of electronic device provided by the present application；
Fig. 6 is the structural schematic diagram of another embodiment of electronic device provided by the present application；
Fig. 7 is the structural schematic diagram of another embodiment of electronic device provided by the present application；
Fig. 8 is the structural schematic diagram of another embodiment of electronic device provided by the present application；
Fig. 9 is the structural schematic diagram of another embodiment of electronic device provided by the present application；
Figure 10 is the structural schematic diagram of another embodiment of electronic device provided by the present application；
Figure 11 is the structural schematic diagram of another embodiment of electronic device provided by the present application；
Figure 12 is the structural schematic diagram of another embodiment of electronic device provided by the present application；
Figure 13 is the structural schematic diagram of another embodiment of electronic device provided by the present application；
Figure 14 is the structural schematic diagram of another embodiment of electronic device provided by the present application；
Figure 15 is the structural schematic diagram of another embodiment of electronic device provided by the present application.
Specific implementation mode
Below in conjunction with the attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application carries out clear, complete
Site preparation describes.It is understood that specific embodiment described herein is only used for explaining the application, rather than the limit to the application
It is fixed.It also should be noted that illustrating only for ease of description, in attached drawing and the relevant part of the application and not all knot
Structure.Based on the embodiment in the application, those of ordinary skill in the art are obtained without creative efforts
All other embodiment, shall fall in the protection scope of this application.
The electronic device that the embodiment of the present application is provided, including smart mobile phone, tablet computer, intelligent wearable device, number
The electronic equipments such as audio/video player, electronic reader, handheld game machine and vehicle electronic device.
Term " first " in the application, " second " are used for description purposes only, and are not understood to indicate or imply opposite
Importance or the quantity for implicitly indicating indicated technical characteristic.Define " first " as a result, the feature of " second " can be bright
Show or implicitly include at least one this feature.In the description of the present application, the meaning of " plurality " is at least two, such as two
It is a, three etc., unless otherwise specifically defined.The directional instruction of institute in the embodiment of the present application (such as upper and lower, left,
It is right, forward and backward ...) be only used for explaining relative position relation under a certain particular pose (as shown in the picture) between each component,
Motion conditions etc., if the particular pose changes, directionality instruction also correspondingly changes correspondingly.In addition, term
" comprising " and " having " and their any deformations, it is intended that cover and non-exclusive include.Such as contain series of steps
Or process, method, system, product or the equipment of component, the step of being not limited to list or component, but optionally also wrap
The step of not listing or component are included, or further includes optionally for the intrinsic other steps of these processes, method, product or equipment
Rapid or component.
Referenced herein " embodiment " is it is meant that a particular feature, structure, or characteristic described can wrap in conjunction with the embodiments
It is contained at least one embodiment of the application.Each position in the description occur the phrase might not each mean it is identical
Embodiment, nor the independent or alternative embodiment with other embodiments mutual exclusion.Those skilled in the art explicitly and
Implicitly understand, embodiment described herein can be combined with other embodiments.
Referring to Fig. 1, Fig. 1 is the structural schematic diagram of an embodiment of electronic device provided by the present application.
In the present embodiment, electronic device includes heat-dissipating frame 10, circuit board 20, heat source chip 30, shielding case 40 and heat
Pipe 50.
Heat source chip 30 be welded on circuit board 20 with circuit board 20 be electrically connected, heat source chip 30 include CUP, GPU,
Radio frequency chip, GPS chip etc., these chips will produce a large amount of heat, the temperature near heat source chip 30 in working condition
Degree can influence its working efficiency and service life when rising to 50 degrees Celsius or more.
Shielding case 40 is located on heat source chip 30, and shielding case 40 is metal material, can be played to heat source chip 30 quiet
The effect of electrical shielding, to prevent outer bound pair heat source chip 30 or heat source chip 30 from causing electrostatic interference to the external world.Shielding case
40 can use foreign white copper material to make, and foreign white copper has good thermal conductivity.
The operation principle of heat pipe 50 is the phase transformation radiated in condensing zone condensation after the evaporation endothermic of evaporating area using medium
Journey, to make heat quickly be conducted from the high position of temperature to temperature lower position.
The case where heat-dissipating frame 10 can be center or rear shell, and the shown heat-dissipating frames 10 of Fig. 1 are center.Heat pipe
50 can be assemblied in heat-dissipating frame 10, and the position of the evaporating area of heat pipe 50 corresponds to shielding case 40 to absorb heat source chip 30
The heat dissipation area of heat, center or rear shell is big and has sufficient contact can be promptly by the heat of 50 condensing zone of heat pipe with air
Amount is spread apart, to prevent 30 local temperature of heat source chip excessively high.
Wherein, center is a kind of housing unit of electronic device comprising two opposite sides are wherein set on leading flank
Display screen component is set, the components such as circuit board, battery are set on trailing flank, then leading flank is connect with front housing, and trailing flank is with after
Shell connects to form electronic device body.General center makes for metal alloy compositions, for example, steel plate, magnesium alloy etc..
The electronic device of the case where being different from the prior art, the present embodiment includes circuit board, heat source chip, shielding case, dissipates
Hot frame and heat pipe, heat source chip are electrically connected with circuit board, a large amount of heat are generated in working condition, heat pipe is assemblied in scattered
In hot frame, the position of the evaporating area of heat pipe corresponds to shielding case to absorb the heat of heat source chip, and heat pipe transfers heat to
At the position of the heat-dissipating frame of electronic device.Because heat pipe be pre-assembled in heat-dissipating frame and heat-dissipating frame formed one it is complete
Whole component, thus heat-dissipating frame assembly complete when heat pipe also therewith assembly complete, in addition, heat pipe can using heat-dissipating frame as
Carrier radiates to heat source chip, to improve the efficiency of assembling of heat pipe and the radiating efficiency of electronic device.
Referring to Fig. 2, Fig. 2 is the structural schematic diagram of another embodiment of electronic device provided by the present application.
Heat-dissipating frame 10 offers fluting 11 at the position corresponding to heat source chip 30, and the evaporating area of heat pipe 50 is by opening
Slot 11 is exposed in air, then the heat of heat source chip 30, which is first conducted to shielding case 40, to be conducted to the evaporating area of heat pipe 50, heat
Be folded between source chip 30 and shielding case 40 thermal grease either heat dissipating silicone grease fluting 11 in filled with thermal grease or dissipate
Hot silicone grease to increase the thermal conductivity between heat source chip 30 and shielding case 40, shielding case 40 and heat pipe 50, and then improves heat
Measure heat source chip 30, shielding case 40, heat pipe 50 evaporating area between transmission efficiency.
Above-mentioned heat dissipating silicone grease popular name is called thermal grease, is to make base oil with extraordinary silicone oil, novel metal oxide is filled out
Material, is equipped with multiple functions additive, the paste being process through specific technique, and color has different because of material difference
Appearance.It, with good heat conduction, heatproof, insulation performance, is the ideal dielectric material of heat-resisting device, and performance is stablized,
It not will produce etchant gas in use, the metal contacted will not be had an impact.The filler and organosilicon of high-purity are productions
Product are smooth, uniformly and the guarantee of high-temperature insulation.It is applied to power device and radiator fitting surface, helps the air for eliminating contact surface
Gap increases type of thermal communication, reduces thermal resistance, reduces the operating temperature of power device, improves reliability and prolongs the service life.
Referring to Fig. 3, Fig. 3 is the structural schematic diagram of another embodiment of electronic device provided by the present application.
Heat pipe 50 includes the first heat pipe 51 and the second heat pipe 52, and the position of the evaporating area of the first heat pipe 51 corresponds to shielding case
40, to absorb the heat of self-heating source chip 30 on shielding case 40, the quantity of the first heat pipe 51 can be 1,2,3,4,5 etc.,
The quantity of first heat pipe 51 shown in Fig. 3 is one.Second heat pipe 52 is connect with the condensing zone of the first heat pipe 51, to absorb the first heat
The heat of pipe 51 and by the heat diffusion to the other positions of electronic device of the first heat pipe 51, such as SIM card houses frame,
It is the SIM that metal material structure, excellent heat conductivity, and SIM card house that frame is used for placing electronic device that SIM card, which houses frame,
Card, generated heat is few relative to heat caused by heat source chip 30 when working condition.
Optionally, the erection of SIM card accommodating box is equipped with temperature controller 12, and temperature controller 12 is accommodating for monitoring SIM card
The temperature of frame.When the numerical value of temperature controller 12 is more than that (threshold value can be 38 degrees Celsius to 50 degree Celsius ranges to certain threshold value
Interior any temperature, user go to set according to the needs of itself) when, SIM card houses frame and automatically pops up SIM card, to disconnect
The communication connection of electronic device forces the application pause being currently running in electronic device, to the live load of heat source chip 30
Also it is reduced accordingly, and then reduces the generation of heat in heat source chip 30.A part of heat can also be taken after SIM card pop-up out of
Amount is accelerated heat and is expanded at this point, the SIM card trepanning that electronic device houses frame by SIM card is contacted with outside air directly connection
It is dissipated to the outside of electronic device.
Heat pipe 50 is made of copper shell, liquid-sucking core and end cap.It is to be pumped into negative pressure state inside copper shell, is filled with suitable
When liquid, this boiling point of liquid is low, readily volatilized.The inner wall of shell has liquid-sucking core, is made of capillary-porous material.Heat pipe
50 one end is evaporating area, and opposite one end is condensing zone, when one end of heat pipe 50 is heated, the rapid vapour of liquid in heat pipe 50
Change, steam flows to other end under the power of thermal diffusion, and releases heat in cold end condensation, and liquid is leaned on along porous material again
Capillarity flows back to evaporating area, and so cycle is more than, until 50 both ends temperature of heat pipe is equal.
Thermal conductivity of the copper shell of heat pipe 50 in non-bending state is best, because liquid-sucking core is most complete shape at this time
State, the capillary-porous structure of liquid-sucking core because of bending without destroying.
First heat pipe 51 and the mutual cooperation of the second heat pipe 52 can make heat under the premise of avoiding flexing heat-pipe 50 too much
Pipe 50 extends at the heat-dissipating frame 10 of any good heat dissipation effect of electronic device, and the first heat pipe 51 absorbs the heat of heat source chip 30
Amount, the second heat pipe 52 absorb the heat of the first heat pipe 51 and by other temperature of the heat diffusion of the first heat pipe 51 to electronic device
At lower heat-dissipating frame 10, to substantially increase at the heat transfer at heat source chip 30 to the lower position of other temperature
Efficiency.Optionally, the first heat pipe 51 and the second heat pipe 52 are non-bending structure.
The condensing zone of first heat pipe 51 is provided at least one mating groove 511, and the evaporating area of the second heat pipe 52 is provided with pair
The protrusion of quantity, protrusion is answered to be inserted in mating groove 511 so that the first heat pipe 51 and the second heat pipe 52 link together；Or first
The condensing zone of heat pipe 51 is provided at least one protrusion, and the evaporating area of the second heat pipe 52 is provided with corresponding number of mating groove
511, protrusion is inserted in mating groove 511 so that the first heat pipe 51 and the second heat pipe 52 link together.It is worth noting that first
The end of heat pipe 51 and the end of the second heat pipe 52 can be that a protrusion uses.
It is filled out in mating groove 511 and sets thermal grease or heat dissipating silicone grease, to increase leading for the first heat pipe 51 and the second heat pipe 52
It is hot.Fig. 3 shows that the condensing zone of the first heat pipe 51 is provided at least one mating groove 511, the evaporation of the second heat pipe 52
The protrusion in area is inserted to the situation in mating groove 511.
Optionally, electronic device further includes third heat pipe 53, and third heat pipe 53 is connect with the condensing zone of the second heat pipe 52.The
Multiple second heat pipes 52 can be connected together by three heat pipes 53, and heat is in the first heat pipe 51, the second heat pipe 52, third heat pipe 53
Middle circulation, heat diffusion more uniformly, the phenomenon that being not in hot-spot.When especially heat-dissipating frame 10 is rear shell, after
The uneven decline that user can be caused to touch experience of shell heat.
In addition, multiple second heat pipes 52 are connected together by third heat pipe 53, third heat pipe 53 and the first heat pipe 51, second
Heat pipe 52 collectively constitutes netted radiator structure, and the first heat pipe 51, the second heat pipe 52 are laid with third heat pipe 53 to heat-dissipating frame 10
In greatly strengthen the integral strength of heat-dissipating frame 10.Optionally, the first heat pipe 51, the second heat pipe 52 and third heat pipe 53 are
Non- bending structure.
Referring to Fig. 4, Fig. 4 is the structural schematic diagram of another embodiment of electronic device provided by the present application.
Electronic device further includes battery 60, and battery 60 is electrically connected with circuit board 20.
Heat-dissipating frame 10 can be center, and center includes bottom plate 13 and side plate 18, side plate 18 around bottom plate 13 be arranged with
Bottom plate 13 forms storage tank 14, and circuit board 20, battery 60 are accommodated in storage tank 14 and are connect with center, and heat source chip 30 is arranged
Between circuit board 20 and bottom plate 13, heat pipe 50 is assemblied in bottom plate 13 and/or side plate 18.Optionally, electronic device also wraps
Include heat-insulated foam 70, heat-insulated foam 70 is arranged in battery 60 towards on the side of heat pipe 50, to prevent the heat of heat pipe 50 from passing
It is directed on battery 60.
Center further includes demarcation strip 15, and demarcation strip 15 is arranged on base 13 storage tank 14 is divided into the first storage tank
141 and second storage tank 142, circuit board 20 be accommodated in the first storage tank 141, battery 60 is accommodated in the second storage tank 142.
Optionally, the bottom plate 13 of the first storage tank 141 offers through-hole, and shielding case 40, heat source chip 30 etc. are sunk down into through-hole, to subtract
Thickness of the small electronic device on 20 direction of perpendicular circuit board.
Heat-dissipating frame 10 or rear shell, heat pipe 50 are assemblied in rear shell.The material of rear shell can be metal or pottery
The material of porcelain, rear shell may be plastic cement, and heat pipe 50 is laid on the integral strength for increasing rear shell in rear shell.
It includes heat-dissipating frame 10 and heat pipe 50 that the application, which also protects a kind of radiating subassembly, radiating subassembly, and heat-dissipating frame 10 can
To be center or rear shell, heat pipe 50 is assemblied in heat-dissipating frame 10, and center or rear shell are when assembling is assembled into electronic device
Position where the evaporating area of heat pipe 50 corresponds to heat source chip 30, and heat pipe 50 absorbs the heat of heat source chip 30.Specific works are former
Reason and malformation look at the description of above-described embodiment.
Referring to Fig. 5, Fig. 5 is the structural schematic diagram of another embodiment of electronic device provided by the present application.
In the present embodiment, electronic device includes heat-dissipating frame 10, circuit board 20, heat source chip 30, shielding case 40 and heat
Pipe 50.Heat source chip 30 is welded on circuit board 20 to be electrically connected with circuit board 20.Shielding case 40 is located at heat source chip 30
On.
Heat-dissipating frame 10 can be that center, rear shell or SIM card house frame, and the shown heat-dissipating frames of Fig. 5 10 are
The case where center.Heat-dissipating frame 10 is provided with buckle 16, and heat pipe 50 can be arranged in buckle 16 to be assemblied in heat-dissipating frame 10
On, the position of the evaporating area of heat pipe 50 corresponds to shielding case 40 to absorb the heat of heat source chip 30, and center or rear shell dissipate
Hot area is big and has with air and adequately contacts and can promptly open the heat diffusion of 50 condensing zone of heat pipe, to prevent heat source
30 local temperature of chip is excessively high.
Buckle 16 can be an integral molding structure with heat-dissipating frame 10, and buckle 16 includes main part 161 and clamping portion 162,
Main part 161 is connect with heat-dissipating frame 10, and clamping portion 162 is extended perpendicular to main part 161, and heat pipe 50 is connected to main part
161, clamping portion 162 and heat-dissipating frame 10 enclose in the space set.Buckle 16 can also be an individual component assembly in heat sink
On frame 10.Between heat pipe 50 and shielding case 40, between shielding case 40 and heat source chip 30 be arranged thermal grease, heat dissipating silicone grease or
Copper foil is to increase heat transfer efficiency.
The electronic device of the case where being different from the prior art, the present embodiment includes circuit board, heat source chip, shielding case, dissipates
Hot frame and heat pipe, heat source chip are electrically connected with circuit board, a large amount of heat are generated in working condition, heat pipe is arranged in scattered
In buckle on hot frame, the position of the evaporating area of heat pipe corresponds to shielding case to absorb the heat of heat source chip, and heat pipe will be warm
At the position for measuring the heat-dissipating frame for being transferred to electronic device.Because heat pipe is to be arranged in advance on heat-dissipating frame and heat-dissipating frame shape
At a complete component, so heat pipe also complete therewith by assembly when heat-dissipating frame assembly is completed, in addition, heat pipe can be with heat dissipation
Frame radiates to heat source chip as carrier, to improve the efficiency of assembling of heat pipe and the radiating efficiency of electronic device.
Referring to Fig. 6, Fig. 6 is the structural schematic diagram of another embodiment of electronic device provided by the present application.
Heat pipe 50 includes the first heat pipe 51 and the second heat pipe 52, and the position of the evaporating area of the first heat pipe 51 corresponds to shielding case
40, to absorb the heat of self-heating source chip 30 on shielding case 40, the quantity of the first heat pipe 51 can be 1,2,3,4,5 etc.,
The quantity of first heat pipe 51 shown in Fig. 6 is one.Second heat pipe 52 is connect with the condensing zone of the first heat pipe 51, to absorb the first heat
The heat of pipe 51 and by other heat-dissipating frames of the heat diffusion of the first heat pipe 51 to electronic device, such as SIM card accommodating box
Frame.
Optionally, the erection of SIM card accommodating box is equipped with temperature controller 12, and temperature controller 12 is accommodating for monitoring SIM card
The temperature of frame.When the temperature that SIM card houses frame is more than certain threshold value, threshold value can be 38 degrees Celsius to 50 degrees Celsius models
Interior any temperature is enclosed, SIM card houses frame and automatically pops up SIM card.SIM card houses the specific of frame and temperature controller 12
Operation principle and actual effect please refer to the explanation of above-described embodiment, do not repeat one by one herein.
Optionally, electronic device further includes third heat pipe 53, and third heat pipe 53 is connect with the condensing zone of the second heat pipe 52.The
Multiple second heat pipes 52 can be connected together by three heat pipes 53, and heat is in the first heat pipe 51, the second heat pipe 52, third heat pipe 53
Middle circulation, heat diffusion more uniformly, the phenomenon that being not in hot-spot.When especially heat-dissipating frame 10 is rear shell, after
The uneven decline that user can be caused to touch experience of shell heat.
In addition, multiple second heat pipes 52 are connected together by third heat pipe 53, third heat pipe 53 and the first heat pipe 51, second
Heat pipe 52 collectively constitutes netted radiator structure, and the first heat pipe 51, the second heat pipe 52 are laid with third heat pipe 53 in a manner of clamping
The integral strength of heat-dissipating frame 10 is greatly strengthened on to heat-dissipating frame 10.
Referring to Fig. 7, Fig. 7 is the structural schematic diagram of another embodiment of electronic device provided by the present application.
Heat-dissipating frame 10 can be center, and center includes bottom plate 13 and side plate 18, side plate 18 around bottom plate 13 be arranged with
Bottom plate 13 forms storage tank 14, and circuit board 20, battery 60 are accommodated in storage tank 14 and are connect with center, and heat source chip 30 is arranged
Between circuit board 20 and bottom plate 13, heat pipe 50 is fastened on so on bottom plate 13 and/or side plate 18.Optionally, electronic device
Further include heat-insulated foam 70, heat-insulated foam 70 is arranged in battery 60 towards on the side of heat pipe 50, to prevent the heat of heat pipe 50
In amount conduction to battery 60.
Difference lies in heat pipe 50 is fastened on the bottom plate 13 of center, by storage tank for the present embodiment and above-described embodiment
14 are divided into the first storage tank 141 and the second storage tank 142, circuit board 20 to be accommodated in the first storage tank 141, and battery 60 is accommodating
In the second storage tank 142.The baffle for separating storage tank 14 is set in bottom plate 13 to save, by the spatial position of baffle
Heat pipe is left for, to improve the space utilization rate of electronic device.
Heat pipe 50 can both have been realized in the form of bending and connect with shielding case 40, be also fastened on the bottom plate 13 of center to incite somebody to action
Storage tank 14 is divided into the first storage tank 141 and the second storage tank 142.Heat pipe 50 can also split into the first heat pipe 51, second
The form that heat pipe 52 splices realizes above-mentioned technical proposal.
Heat-dissipating frame 10 or rear shell, heat pipe 50 are fastened in rear shell.The material of rear shell can be metal or pottery
The material of porcelain, rear shell may be plastic cement, increase the integral strength of rear shell in the rear shell that heat pipe 50 is stuck in.
It includes heat-dissipating frame 10 and heat pipe 50 that the application, which also protects a kind of radiating subassembly, radiating subassembly, and heat-dissipating frame 10 can
To be center or rear shell, heat-dissipating frame 10 is provided with buckle 16, and heat pipe 50 is arranged in buckle 16 to be assemblied in heat-dissipating frame
On 10, the position of center or rear shell when being assembled into electronic device where the evaporating area of heat pipe 50 corresponds to heat source chip
30, heat pipe 50 absorbs the heat of heat source chip 30.Concrete operating principle and malformation look at the description of above-described embodiment.
Referring to Fig. 8, Fig. 8 is the structural schematic diagram of another embodiment of electronic device provided by the present application.
In the present embodiment, electronic device includes heat-dissipating frame 10, circuit board 20, heat source chip 30, shielding case 40 and heat
Pipe 50.Heat source chip 30 is welded on circuit board 20 to be electrically connected with circuit board 20.Shielding case 40 is located at heat source chip 30
On.
Circuit board 20 is provided with buckle 16, and heat pipe 50 can be arranged in buckle 16 to be assemblied on circuit board 20, heat pipe
50 heat for absorbing heat source chip 30, heat-dissipating frame 10 are connect with heat pipe 50 to absorb the heat of heat pipe 50.
Electronic device includes that SIM card houses calorific value in the electronic devices such as frame, center frame, middle frame bottom plate, rear shell
Less and the big component of heat dissipation area relative to heat source chip 30, heat-dissipating frame 10 can be SIM card house frame, center frame,
One of middle frame bottom plate, rear shell, two, three or four.The heat dissipation area of heat-dissipating frame 10 is big and has adequately with air
Contact can promptly open the heat diffusion of 50 condensing zone of heat pipe, to prevent 30 local temperature of heat source chip excessively high.
Buckle 16 can be an integral molding structure with circuit board 20, and buckle 16 includes main part 161 and clamping portion 162, master
Body portion 161 is connect with circuit board 20, clamping portion 162 perpendicular to main part 161 be extended, heat pipe 50 be connected to main part 161,
Clamping portion 162 and heat-dissipating frame 10 enclose in the space set.Circuit board 20 is provided with brokenly at the position corresponding to clamping portion 162 and wears
Hole 163, the clamping portion 162 and heat sink for being conducive to buckle 16 are integrally formed making.Buckle 16 can also be an individual part
It is assemblied on circuit board 20.
The electronic device of the case where being different from the prior art, the present embodiment includes circuit board, heat source chip, shielding case, dissipates
Hot frame and heat pipe, heat source chip are electrically connected with circuit board, a large amount of heat are generated in working condition, heat pipe is arranged in electricity
In buckle on the plate of road, the evaporating area of heat pipe is used to absorb the heat of heat source chip, and heat pipe transfers heat to electronic device
At the position of heat-dissipating frame.Because heat pipe is to be arranged on circuit board to form a complete component with circuit board in advance,
Circuit board assembly complete when heat pipe also therewith assembly complete, in addition, heat pipe can using circuit board as carrier to heat source chip into
Row heat dissipation, to improve the efficiency of assembling of heat pipe and the radiating efficiency of electronic device.
Referring to Fig. 9, Fig. 9 is the structural schematic diagram of another embodiment of electronic device provided by the present application.
Electronic device further includes thermal grease or copper foil 80, and shielding case 40 is along the direction where the plane of circuit board 20
Via 41 is offered, heat pipe 50 passes through the via 41 and is connect with heat source chip 30 by thermal grease or copper foil 80, with
Absorb the heat of heat source chip 30.
Specifically, thermal grease or copper foil 80 include endothermic section 81 and the first heat-conducting part 82, endothermic section 81 and heat source core
The top of piece 30 connects, and the first heat-conducting part 82 is connect with endothermic section 81 and the side of heat source chip 30 extends to connect with heat pipe 50
It connects.The heat of heat source chip 30 passes sequentially through endothermic section 81, the first heat-conducting part 82 is transferred on heat pipe 50, then is transmitted through heat pipe 50
To heat-dissipating frame 10.
Optionally, thermal grease or copper foil 80 further include the second heat-conducting part 83, the second heat-conducting part 83 and the first heat-conducting part
82 connect and are set on heat pipe 50, to increase the connection area of thermal grease or copper foil 80 and heat pipe 50.
Referring to Fig. 10, Figure 10 is the structural schematic diagram of another embodiment of electronic device provided by the present application.
Heat pipe 50 may include the first heat pipe 51 and the second heat pipe 52, and the first heat pipe 51 is arranged in buckle 16 to be assemblied in
The heat of heat source chip 30 is absorbed on circuit board 20.Second heat pipe 52 respectively with the condensing zone of the first heat pipe 51, heat-dissipating frame 10
Connection, to absorb the heat of the first heat pipe 51, to which electronic device can be under the premise of the first heat pipe of bending 51 few as possible
At the heat-dissipating frame 10 of the heat diffusion of the first heat pipe 51 to electronic device, such as SIM card houses frame.
Optionally, the erection of SIM card accommodating box is equipped with temperature controller 12, and temperature controller 12 is accommodating for monitoring SIM card
The temperature of frame.When the temperature that SIM card houses frame is more than certain threshold value, threshold value can be 38 degrees Celsius to 50 degrees Celsius models
Interior any temperature is enclosed, SIM card houses frame and automatically pops up SIM card.SIM card houses the specific of frame and temperature controller 12
Operation principle and actual effect please refer to the explanation of above-described embodiment, do not repeat one by one herein.
Second heat pipe 52 can be assemblied on heat-dissipating frame 10, when heat-dissipating frame 10 is assembled into electronic device, the second heat
Pipe 52 is directly docked on the first heat pipe 51 being connected on circuit board 20, to facilitate the assembly of the second heat pipe 52.
Optionally, the condensing zone of the first heat pipe 51 is provided with mating groove 511, and the evaporating area of the second heat pipe 52 is provided with convex
Portion, protrusion are inserted in mating groove 511；Or second the evaporating area of heat pipe 52 be provided with mating groove 511, the condensation of the first heat pipe 51
Area is provided with corresponding protrusion, and protrusion is inserted in mating groove 511.It is to be appreciated that the condensing zone of heat pipe 50 and evaporation are distinguished
The extreme ends of respective correspondingly heat pipe peripheral wall and heat pipe are not included.
Optionally, electronic device further includes third heat pipe 53, and third heat pipe 53 is connect with the condensing zone of the second heat pipe 52.The
Multiple second heat pipes 52 can be connected together by three heat pipes 53, and heat is in the first heat pipe 51, the second heat pipe 52, third heat pipe 53
Middle circulation, heat diffusion more uniformly, the phenomenon that being not in hot-spot.When especially heat-dissipating frame 10 is rear shell, after
The uneven decline that user can be caused to touch experience of shell heat.
In addition, multiple second heat pipes 52 are connected together by third heat pipe 53, third heat pipe 53 and the first heat pipe 51, second
Heat pipe 52 collectively constitutes netted radiator structure and is assemblied in electronic device, to enhance the integral strength of heat-dissipating frame 10.It can
Contact position between selection of land, the first heat pipe 51 and the second heat pipe 52, the second heat pipe 52 and third heat pipe 53 can be arranged casing 90,
It is coated with heat dissipating silicone grease in casing 90, to make heat be transmitted in casing 90, heat is avoided uncontrollably to diffuse to electronics dress
Other positions in setting, such as camera, calorific value is big when camera works, and temperature is excessively high to influence its normal work.
Optionally, the first heat pipe 51, the second heat pipe 52 and third heat pipe 53 are flat, the first heat pipe 51, the second heat pipe
52 and third heat pipe 53 thickness be 0.3mm to 1mm, for example, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm,
0.9mm、1mm。
Please refer to Fig.1 the structural schematic diagram that 1, Figure 11 is another embodiment of electronic device provided by the present application.
Difference lies in heat pipe 50 is pressed together in the outside of shielding case 40, thermal grease for the present embodiment and above-described embodiment
Between heat source chip 30 and shielding case 40, copper foil 80 includes endothermic section 81, the first heat-conducting part 82 and the second heat-conducting part 83, endothermic section
81 fit in side of the shielding case 40 far from thermal grease, and the first heat-conducting part 82 connect with endothermic section 81 and to the side of shielding case 40
Portion extends, and the second heat-conducting part 83 connect with the first heat-conducting part 82 and is set on heat pipe 50.
It includes circuit board 20, heat source chip 30, shielding case 40 that the application, which also protects a kind of circuit board assemblies, circuit board assemblies,
With heat pipe 50, heat source chip 30 is welded on circuit board 20 to be electrically connected with circuit board 20, and shielding case 40 is located at heat source core
On piece 30, circuit board 20 is provided with buckle 16, and heat pipe 50 is arranged in buckle 16 to be assemblied on circuit board 20, and heat pipe 50 absorbs
The heat of heat source chip 30.Concrete operating principle and malformation look at the description of above-described embodiment.
Please refer to Fig.1 the structural schematic diagram that 2, Figure 12 is another embodiment of electronic device provided by the present application.
The electronic device of the present embodiment includes circuit board 20, heat source chip 30 and the first heat pipe 51, and heat source chip 30 welds
To be electrically connected with circuit board 20 on circuit board 20, difference lies in the first heat pipe 51 dresses for the present embodiment and above-described embodiment
Assigned in circuit board 20, the position of the evaporating area of the first heat pipe 51 corresponds to heat source chip 30 to absorb the heat of heat source chip 30
Amount.
Circuit board 20 offers the first groove 21 at the position corresponding to heat source chip 30, with exposed first heat pipe 51
Evaporating area.Thermal grease or heat dissipating silicone grease, the evaporating area of the first heat pipe 51 and heat source chip 30 are filled in first groove 21
Heat exchange is directly carried out by thermal grease or heat dissipating silicone grease.
The case where being different from the prior art, the electronic device of the present embodiment include circuit board, heat source chip and the first heat pipe,
Heat source chip is electrically connected with circuit board, a large amount of heat is generated in working condition, the first heat pipe assembled in advance is in circuit board
In, the position of the evaporating area of the first heat pipe corresponds to heat source chip to absorb the heat of heat source chip, and the first heat pipe is again by heat
It is transferred in electronic device at other lower positions of temperature.Because the first heat pipe is pre-plugged in circuit board neutralizing circuit plate
A complete component is formed, so the first heat pipe also complete therewith by assembly when circuit board assembly is completed, in addition, the first heat pipe can
To be radiated using circuit board as carrier to heat source chip, to improve the efficiency of assembling and electronic device of first heat pipe
Radiating efficiency.
Electronic device further includes the second heat pipe 52, and circuit board 20 offers of the condensing zone for exposed first heat pipe 51
Two grooves 22, the second heat pipe 52 are connect with the condensing zone of the first heat pipe 51, to spread the heat of the first heat pipe 51, the second groove 22
In be filled with thermal grease or heat dissipating silicone grease, to increase the thermal conductivity between the first heat pipe 51 and the second heat pipe 52.
Please refer to Fig.1 the structural schematic diagram that 3, Figure 13 is another embodiment of electronic device provided by the present application.
Optionally, the first heat pipe 51 can also be assemblied in circuit board 20 and the condensing zone of the first heat pipe 51 runs through electricity simultaneously
Road plate 20 directly housed with SIM card one of frame, center frame, middle frame bottom plate, rear shell, two, three or four connect,
The heat diffusion of heat source chip 30 to be come.Certainly, the condensing zone of the first heat pipe 51 may also extend through circuit board 20 and second
Heat pipe 52 connects, the second heat pipe 52 and SIM card house one of frame, center frame, middle frame bottom plate, rear shell, two, three or
Four connections of person.
Wherein, electronic device further includes temperature controller 12, and the setting of temperature controller 12 is housed in SIM card on frame 10,
The condensing zone of first heat pipe 51 at least houses frame 10 through circuit board 20 with SIM card and connect, alternatively, the condensation of the first heat pipe 51
Area is connect through circuit board 20 with the second heat pipe 52, and the second heat pipe 52 at least houses frame 10 with SIM card and connect.Temperature controller
The temperature that frame 10 is housed for monitoring SIM card, when the numerical value of temperature controller 12 is more than certain threshold value, SIM card accommodating box
Frame 10 automatically pops up SIM card.
It includes circuit board 20, heat source chip 30 and the first heat that the application, which also protects a kind of circuit board assemblies, circuit board assemblies,
Pipe 51, heat source chip 30 are welded on circuit board 20 to be electrically connected with circuit board 20, and the first heat pipe 51 is assemblied in circuit board 20
In, the position of the evaporating area of the first heat pipe 51 corresponds to heat source chip 30 to absorb the heat of heat source chip 30.
Please refer to Fig.1 the structural schematic diagram that 4, Figure 14 is another embodiment of electronic device provided by the present application.
In the present embodiment, electronic device includes circuit board 20, heat source chip 30, shielding case 40, the first heat pipe 51 and
Two heat pipes 52.Heat source chip 30 is welded on circuit board 20 to be electrically connected with circuit board 20.Shielding case 40 is located at heat source core
On piece 30.
First heat pipe 51 is used to absorb the heat of heat source chip 30, the second heat pipe 52 respectively with the first heat pipe 51 and heat sink
Frame 10 connects, to spread the heat of the first heat pipe 51.
Heat-dissipating frame 10 can be SIM card house frame, center frame, middle frame bottom plate, one of rear shell, two, three
Or four.
Second heat pipe 52 can be assemblied on heat-dissipating frame 10, and the first heat pipe 51 is assemblied on circuit board 20, in heat sink
When frame 10 is assembled into electronic device, the second heat pipe 52 is directly docked on the first heat pipe 51, to facilitate the dress of the second heat pipe 52
Match.
The electronic device of the case where being different from the prior art, the present embodiment includes circuit board, heat source chip, shielding case,
One heat pipe and the second heat pipe, heat source chip are electrically connected with circuit board, and a large amount of heat, the first heat pipe are generated in working condition
The heat of heat source chip is absorbed, the second heat pipe is connect with the first heat pipe, and the heat of the first heat pipe is transferred to its of electronic device
At the lower position of its temperature.Because the first heat pipe and the second heat pipe can cooperate transmit heat, the first heat pipe and
Second heat pipe can cooperatively form variously-shaped in the case where lacking bending as possible, and heat is efficiently transfer to electronic device
At other lower positions of temperature.
Please refer to Fig.1 the structural schematic diagram that 5, Figure 15 is another embodiment of electronic device provided by the present application.
The electronic device of the present embodiment includes circuit board 20, heat source chip 30, heat pipe 50 and heat-dissipating frame 10, heat source chip
30 are welded on circuit board 20 to be electrically connected with circuit board 20, and heat pipe 50 is assemblied in circuit board 20, the evaporating area of heat pipe 50
Position correspond to heat source chip 30 to absorb the heat of heat source chip 30, heat-dissipating frame 10 is connect with heat pipe 50 to absorb heat pipe
50 heat.
The electronic device of the case where being different from the prior art, the present embodiment includes circuit board, heat source chip, heat pipe and heat dissipation
Frame, heat source chip are electrically connected with circuit board, a large amount of heat are generated in working condition, heat pipe assembled in advance is in circuit board
In, the position of the evaporating area of heat pipe corresponds to heat source chip to absorb the heat of heat source chip, and heat pipe transfers heat to electricity again
In sub-device at other lower heat-dissipating frames of temperature.Because heat pipe is pre-plugged forms one in circuit board neutralizing circuit plate
Complete component, so heat pipe also complete therewith by assembly when circuit board assembly is completed, in addition, heat pipe can be using circuit board as load
Body radiates to heat source chip, to improve the efficiency of assembling of heat pipe and the radiating efficiency of electronic device.
Heat-dissipating frame 10 includes that SIM card houses frame, center frame, middle frame bottom plate, rear shell etc., the present embodiment and above-mentioned reality
Applying example, difference lies in heat-dissipating frame 10 is provided with fitting groove 17, and the circuit board 20 for being equipped with heat pipe 50 is being assembled into electronics dress
Heat pipe 50 is directly fastened in fitting groove 17 when setting, to house it in frame, center frame, middle frame bottom plate, rear shell with SIM card
One, two, three or four connection connection.
Electronic device further includes temperature controller 12, and heat pipe 50 at least houses frame with SIM card through circuit board 20 and connect,
The setting of temperature controller 12 is housed in SIM card on frame, and temperature controller 12 is used to monitor the temperature that SIM card houses frame；
Wherein, when the numerical value of temperature controller 12 is more than certain threshold value, SIM card houses frame and automatically pops up SIM card.
The application also protects a kind of circuit board assemblies, and circuit board assemblies include circuit board 20, heat source chip 30 and heat pipe 50,
Heat source chip 30 is welded on circuit board 20 to be electrically connected with circuit board 20, and heat pipe 50 is assemblied in circuit board 20, heat pipe 50
Evaporating area position correspond to heat source chip 30 to absorb the heat of heat source chip 30.
It is to be appreciated that each technical characteristic of above-described embodiment can cover mutually to form the application need it is to be protected
New solution.
The foregoing is merely presently filed embodiments, are not intended to limit the scope of the claims of the application, every to utilize this
Equivalent structure or equivalent flow shift made by application specification and accompanying drawing content is applied directly or indirectly in other relevant
Technical field includes similarly in the scope of patent protection of the application.
Claims (10)
1. a kind of electronic device, which is characterized in that including：
Circuit board；
Heat source chip is welded on the circuit board to be electrically connected with the circuit board；
Shielding case is located on the heat source chip；
Heat-dissipating frame is provided with buckle；And
Heat pipe is arranged in be assemblied on the heat-dissipating frame in the buckle, and the position of the evaporating area of the heat pipe corresponds to
The shielding case is to absorb the heat of the heat source chip.
2. electronic device according to claim 1, which is characterized in that
The buckle is an integral molding structure with the heat-dissipating frame, and the buckle includes main part and clamping portion, the main body
Portion is connect with the heat-dissipating frame, and the clamping portion is extended perpendicular to the main part, and the heat pipe is connected to the master
Body portion, the clamping portion and the heat-dissipating frame enclose in the space set.
3. electronic device according to claim 2, which is characterized in that
The heat pipe includes the first heat pipe and the second heat pipe, and the position of the evaporating area of first heat pipe corresponds to the shielding
Cover, second heat pipe is connect with the condensing zone of first heat pipe, to spread the heat of first heat pipe.
4. electronic device according to claim 3, which is characterized in that
The condensing zone of first heat pipe is provided at least one mating groove, and the evaporating area of second heat pipe is provided with corresponding
Protrusion, the protrusion is inserted in the mating groove；Or
The condensing zone of first heat pipe is provided at least one protrusion, and the evaporating area of second heat pipe is provided with corresponding
Mating groove, the protrusion are inserted in the mating groove.
5. electronic device according to claim 4, which is characterized in that
The electronic device further includes third heat pipe, and the third heat pipe is connect with the condensing zone of second heat pipe, with institute
State the first heat pipe, second heat pipe collectively constitutes netted radiator structure.
6. electronic device according to claim 1, which is characterized in that
The heat-dissipating frame is center, and the center includes bottom plate and side plate, the side plate around the bottom plate be arranged with institute
It states bottom plate and forms storage tank, the circuit board is accommodated in the storage tank and is connect with the center, and the heat source chip is set
It sets between the circuit board and the bottom plate.
7. electronic device according to claim 6, which is characterized in that
The heat pipe is fastened on the bottom plate so that the storage tank is divided into the first storage tank and the second storage tank, the electricity
Road plate is accommodated in first storage tank；
The electronic device further includes battery, and the battery containing is in second storage tank.
8. electronic device according to claim 7, which is characterized in that
The also heat-insulated foam of the electronic device, the heat-insulated foam are arranged on the side of the direction heat pipe of the battery,
To prevent the heat of the heat pipe from conducting to the battery.
9. electronic device according to claim 1, which is characterized in that
The electronic device further includes temperature controller, and the heat-dissipating frame is that SIM card houses frame, and the temperature controller is set
It sets and houses frame in the SIM card, the temperature controller is used to monitor the temperature that the SIM card houses frame；
Wherein, when the numerical value of the temperature controller is more than certain threshold value, the SIM card houses frame automatically by SIM card bullet
Go out.
10. a kind of radiating subassembly, which is characterized in that including：
Heat-dissipating frame is provided with buckle；And
Heat pipe is arranged in be assemblied on the heat-dissipating frame in the buckle, and the heat pipe is used to absorb the heat of heat source chip
Amount.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810596680.6A CN108807310B (en) | 2018-06-11 | 2018-06-11 | Electronic device and heat dissipation assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810596680.6A CN108807310B (en) | 2018-06-11 | 2018-06-11 | Electronic device and heat dissipation assembly |
Publications (2)
| Publication Number | Publication Date |
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| CN108807310A true CN108807310A (en) | 2018-11-13 |
| CN108807310B CN108807310B (en) | 2020-03-31 |
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ID=64088390
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810596680.6A Expired - Fee Related CN108807310B (en) | 2018-06-11 | 2018-06-11 | Electronic device and heat dissipation assembly |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110494018A (en) * | 2019-08-21 | 2019-11-22 | 武汉光迅科技股份有限公司 | A kind of optical module |
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| US20080043436A1 (en) * | 2006-08-21 | 2008-02-21 | Foxconn Technology Co., Ltd. | Thermal module |
| CN102421273A (en) * | 2010-09-27 | 2012-04-18 | 富瑞精密组件（昆山）有限公司 | Cooling device and electronic device using same |
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| CN107864598A (en) * | 2017-12-05 | 2018-03-30 | 匀加速科技有限公司 | Mobile phone radiator structure |
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2018
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|---|---|---|---|---|
| US20080043436A1 (en) * | 2006-08-21 | 2008-02-21 | Foxconn Technology Co., Ltd. | Thermal module |
| CN102421273A (en) * | 2010-09-27 | 2012-04-18 | 富瑞精密组件（昆山）有限公司 | Cooling device and electronic device using same |
| CN105472940A (en) * | 2014-08-20 | 2016-04-06 | 中兴通讯股份有限公司 | Terminal cooling device and mobile terminal |
| CN206850819U (en) * | 2017-04-20 | 2018-01-05 | 东莞市发斯特精密五金有限公司 | A kind of mobile phone center of perfect heat-dissipating |
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| CN110494018A (en) * | 2019-08-21 | 2019-11-22 | 武汉光迅科技股份有限公司 | A kind of optical module |
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| CN108807310B (en) | 2020-03-31 |
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