CN108646891A - A kind of radiating subassembly and electronic device - Google Patents
A kind of radiating subassembly and electronic device Download PDFInfo
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- CN108646891A CN108646891A CN201810597237.0A CN201810597237A CN108646891A CN 108646891 A CN108646891 A CN 108646891A CN 201810597237 A CN201810597237 A CN 201810597237A CN 108646891 A CN108646891 A CN 108646891A
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- Prior art keywords
- heat
- battery
- area
- circuit board
- center
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
Abstract
This application discloses a kind of radiating subassembly and electronic device, which includes：Center, including opposite first area and second area, wherein first area forms battery and accommodates storehouse, is used for set battery；Circuit board is set to second area；Heat source chip, is set on circuit board, and between circuit board and center；Heat pipe, including evaporator section and condensation segment, wherein evaporator section connects heat source chip, and condensation segment connects battery and accommodates storehouse, and the heat of heat source chip is conducted to battery and accommodates storehouse.By the above-mentioned means, the damage of component caused by electronic device hot-spot can be avoided, spread out additionally by by heat, is conducive to the gripping feel for improving electronic device, improves user experience.
Description
Technical field
This application involves technical field of mobile terminals, more particularly to a kind of radiating subassembly and electronic device.
Background technology
The inside of electronic device generally comprises a control chip (i.e. core processor), with the diversification of its function, intelligence
Energyization, the requirement to chip are also very high.The dominant frequency of present chip is generally that 1GHz, 2GHz are even higher, and double-core, four cores are
Chip to eight cores is very universal.
The development of chip not only brings the problem of power consumption, but also due to the lightening heat for resulting in chip of electronic device
Amount is sealed in inside electronics so that electronics temperature rise.
Invention content
The application use a technical solution be：A kind of radiating subassembly is provided, which includes：Center, including
Opposite first area and second area, wherein first area forms battery and accommodates storehouse, is used for set battery；Circuit board, setting
In second area；Heat source chip, is set on circuit board, and between circuit board and center；Heat pipe, including evaporator section and cold
Solidifying section, wherein evaporator section connects heat source chip, and condensation segment connects battery and accommodates storehouse, the heat of heat source chip is conducted to electricity
Pool capacity Na Cang.
The application use another technical solution be：A kind of electronic device is provided, which includes center, setting
In center one side front housing and be set to the rear shell of center another side；Wherein, center include opposite first area and
Second area, first area form battery close to the side of rear shell and accommodate storehouse, are used for set battery；Wherein, electronic device also wraps
It includes：Circuit board is set to side of the second area close to rear shell；Heat source chip, is set on circuit board, and positioned at circuit board and
Between center；Heat pipe, including evaporator section and condensation segment, wherein evaporator section connects heat source chip, and condensation segment connects battery and accommodates
The heat of heat source chip is conducted to battery and accommodates storehouse by storehouse.
The case where being different from the prior art, radiating subassembly provided by the present application include：Center, including opposite first area
And second area, wherein first area forms battery and accommodates storehouse, is used for set battery；Circuit board is set to second area；Heat
Source chip is set on circuit board, and between circuit board and center；Heat pipe, including evaporator section and condensation segment, wherein steam
It sends out section and connects heat source chip, condensation segment connects battery and accommodates storehouse, and the heat of heat source chip is conducted to battery and accommodates storehouse.Pass through
Aforesaid way is conducted the heat for the more serious chip that generates heat to the lower electricity of temperature using the good heat conductivility of heat pipe
The position of Chi Cang, prevents the damage of component caused by hot-spot, in addition leads at the problem of avoiding electronic device hot-spot
It crosses and heat spreads out, be conducive to the gripping feel for improving electronic device, improve user experience.
Description of the drawings
In order to more clearly explain the technical solutions in the embodiments of the present application, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, the accompanying drawings in the following description is only some embodiments of the present application, for
For those of ordinary skill in the art, without creative efforts, other are can also be obtained according to these attached drawings
Attached drawing.Wherein：
Fig. 1 is the structural schematic diagram of radiating subassembly first embodiment provided by the present application；
Fig. 2 is the end position schematic diagram of heat pipe in Fig. 1；
Fig. 3 is the structural schematic diagram of radiating subassembly second embodiment provided by the present application；
Fig. 4 is the structural schematic diagram of radiating subassembly 3rd embodiment provided by the present application；
Fig. 5 is the structural schematic diagram of radiating subassembly fourth embodiment provided by the present application；
Fig. 6 is the structural schematic diagram of the 5th embodiment of radiating subassembly provided by the present application；
Fig. 7 is the structural schematic diagram of radiating subassembly sixth embodiment provided by the present application；
Fig. 8 is the structural schematic diagram of the 7th embodiment of radiating subassembly provided by the present application；
Fig. 9 is the structural schematic diagram of one embodiment of electronic device provided by the present application.
Specific implementation mode
Below in conjunction with the attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application carries out clear, complete
Site preparation describes.It is understood that specific embodiment described herein is only used for explaining the application, rather than the limit to the application
It is fixed.It also should be noted that illustrating only for ease of description, in attached drawing and the relevant part of the application and not all knot
Structure.Based on the embodiment in the application, those of ordinary skill in the art are obtained without creative efforts
Every other embodiment, shall fall in the protection scope of this application.
Term " first ", " second " in the application etc. be for distinguishing different objects, rather than it is specific suitable for describing
Sequence.In addition, term " comprising " and " having " and their any deformations, it is intended that cover and non-exclusive include.Such as comprising
The step of process of series of steps or unit, method, system, product or equipment are not limited to list or unit, and
It further includes the steps that optionally not listing or unit to be, or further includes optionally for these processes, method, product or equipment
Intrinsic other steps or unit.
Referenced herein " embodiment " is it is meant that a particular feature, structure, or characteristic described can wrap in conjunction with the embodiments
It is contained at least one embodiment of the application.Each position in the description occur the phrase might not each mean it is identical
Embodiment, nor the independent or alternative embodiment with other embodiments mutual exclusion.Those skilled in the art explicitly and
Implicitly understand, embodiment described herein can be combined with other embodiments.
Refering to fig. 1, Fig. 1 is the structural schematic diagram of radiating subassembly first embodiment provided by the present application, wherein left in Fig. 1
Side is front view, and right side is side sectional view, which includes center 10, circuit board 20, heat source chip 30 and heat pipe
40。
Wherein, center 10 is a kind of housing unit of electronic device comprising two opposite sides, wherein on leading flank
Display screen component is set, the components such as circuit board, battery are set on trailing flank, are then connect with front housing in leading flank, trailing flank
It connect to form electronic device body with rear shell.General center 10 makes for metal alloy compositions, for example, steel plate, magnesium alloy etc..
In the present embodiment, center 10 includes opposite first area 10a and second area 10b, it is possible to understand that, first
Region 10a and second area 10b is respectively positioned on the trailing flank of center 10, wherein first area 10a forms battery and accommodates storehouse 101, uses
In set battery.In general, the area of first area 10a is more than the area of second area 10b, battery, which accommodates storehouse 101, to be
A recessed portion being arranged on center 10 can also be that multiple fixed pillars on center 10 enclose and set the region to be formed and use
With set battery.
Circuit board 20 is set to second area 10b；Heat source chip 30 is set on circuit board 20, and is located at 20 He of circuit board
Between center 10.It should be understood that a large amount of component can be arranged on circuit board 20, wherein may include multiple chips, taking the photograph
As component, sensory package, SIM card component, communication component etc., these components are generally located on circuit board 20 far from center 10
One side on, the heat source chip 30 (i.e. core processor) in multiple chips is generally located on circuit board 20 close to center 10
Side.
Heat pipe 40 includes evaporator section 40a and condensation segment 40b, wherein evaporator section 40a connection heat sources chip 30, condensation segment 40b
It connects battery and accommodates storehouse 101, the heat of heat source chip 30 is conducted to battery and accommodates storehouse 101.It should be understood that evaporator section
For 40a between heat source chip 30 and center 10, the stepped construction formed includes center 10, heat pipe 40, heat source chip successively
30 and circuit board 20.
Heat pipe is a kind of novel heat-conducting medium, and thousands of times are improved than the copper capacity of heat transmission.Heat pipe inner wall is lined with porous material
Material, is absorbent cores, filled with alcohol or other liquid easily vaporized in absorbent cores.When one end of heat pipe is heated, this one end (evaporation
Section) liquid in absorbent cores vaporizes because of heat absorption, and steam goes to the other end by heated one end along pipe from the air duct among heat pipe
(condensation segment), for the other end due to not being heated, temperature is low, and steam just liquefies in this one end heat release, and the liquid of condensation is by heat pipe wall
Included capillary structure absorbent cores absorption, has been returned to heated one end, has so moved in circles, in heat pipe through capillary action
Liquid is constantly vaporized and is liquefied, and heat is passed to the other end from one end.
Optionally, in one embodiment, heat pipe 40 is flat, and the thickness of heat pipe is 0.3mm to 1mm.It should be understood that
The length of heat pipe 40 evaporator section 40a and condensation segment 40b can be arranged according to demand, and the length of the two can be different.
For example, be separate since heat source chip 30 and battery accommodate between storehouse 101, and heat source chip 30 is smaller and battery accommodates storehouse
101 is larger, so the length of evaporator section 40a can be less than the length of condensation segment 40b.
Optionally, as shown in Fig. 2, Fig. 2 is the end position schematic diagram of heat pipe in Fig. 1, due to the fever of heat source chip 30
It more concentrates, the end of evaporator section 40a can be attached at the middle section of heat source chip 30, in addition, since inside battery is close
20 side of the circuit board is provided with charging circuit, generates heat when battery is charged more serious, so the end of condensation segment 40b
Portion is attached at battery and accommodates side of the storehouse 101 far from circuit board 20.
In this embodiment, heat pipe 40 is to attach to connect with center 10, can specifically pass through the good glue of heat conductivility
Pasted, for the sides evaporator section 40a, one side and the center 10 of heat pipe 40 attach, another side then with heat source chip 30
It attaches.
The case where being different from the prior art, radiating subassembly provided in this embodiment include：Center, including the firstth opposite area
Domain and second area, wherein first area forms battery and accommodates storehouse, is used for set battery；Circuit board is set to second area；
Heat source chip, is set on circuit board, and between circuit board and center；Heat pipe, including evaporator section and condensation segment, wherein
Evaporator section connects heat source chip, and condensation segment connects battery and accommodates storehouse, and the heat of heat source chip is conducted to battery and accommodates storehouse.It is logical
Aforesaid way is crossed, using the good heat conductivility of heat pipe, the heat for the more serious chip that generates heat is conducted lower to temperature
The position of battery compartment, prevents the damage of component caused by hot-spot, in addition at the problem of avoiding electronic device hot-spot
By the way that heat spreads out, is conducive to the gripping feel for improving electronic device, improves user experience.
It is the structural schematic diagram of radiating subassembly second embodiment provided by the present application refering to Fig. 3, Fig. 3, Fig. 3 is side, sectional
Figure, which includes center 10, circuit board 20, heat source chip 30 and heat pipe 40.
Wherein, center 10 includes opposite first area 10a and second area 10b, and first area 10a forms battery and accommodates
Storehouse 101 is used for set battery.Circuit board 20 is set to second area 10b；Heat source chip 30 is set on circuit board 20, and position
Between circuit board 20 and center 10.Heat pipe 40 includes evaporator section 40a and condensation segment 40b, wherein evaporator section 40a connection heat sources
Chip 30, condensation segment 40b connection batteries accommodate storehouse 101, and the heat of heat source chip 30 is conducted to battery and accommodates storehouse 101.
Optionally, in the present embodiment, heat source chip 30 includes chip body 31 and shielding case 32, wherein chip body
31 are set on circuit board, specifically can by welding be formed on circuit board 20；Shielding case 32 is set to circuit
On plate 20, and a shielding space is collectively formed with circuit board 20, chip body 31 is arranged in shielding space；Wherein, evaporator section
The one side of 40a is contacted with shielding case 32, and the another side of evaporator section 40a is contacted with center 10.
Wherein, shielding case 32 is usually that metal material makes, and thickness is generally 0.2-0.3mm.
It is the structural schematic diagram of radiating subassembly 3rd embodiment provided by the present application, the radiating subassembly packet refering to Fig. 4, Fig. 4
Include center 10, circuit board 20, heat source chip 30 and heat pipe 40.
Wherein, center 10 includes opposite first area 10a and second area 10b, and first area 10a forms battery and accommodates
Storehouse 101 is used for set battery.Circuit board 20 is set to second area 10b；Heat source chip 30 is set on circuit board 20, and position
Between circuit board 20 and center 10.Heat pipe 40 includes evaporator section 40a and condensation segment 40b, wherein evaporator section 40a connection heat sources
Chip 30, condensation segment 40b connection batteries accommodate storehouse 101, and the heat of heat source chip 30 is conducted to battery and accommodates storehouse 101.
Optionally, in the present embodiment, heat source chip 30 includes chip body 31 and shielding case 32, wherein chip body
31 are set on circuit board, specifically can by welding be formed on circuit board 20；Shielding case 32 is set to circuit
On plate 20, and a shielding space is collectively formed with circuit board 20, chip body 31 is arranged in shielding space；Wherein, evaporator section
The one side of 40a is contacted with shielding case 32, and the another side of evaporator section 40a is contacted with center 10.
Optionally, in the present embodiment, it is additionally provided with the first silicone grease layer 51 between shielding case 32 and chip body 31, shields
It is additionally provided with the second silicone grease layer 52 between cover 32 and heat pipe 40.
Above-mentioned silicone grease layer is heat-conducting silicone grease, and popular name is called thermal grease, is to do base oil, novel metal oxygen with extraordinary silicone oil
Compound does filler, is equipped with multiple functions additive, the paste being process through specific technique, and color has because of material difference
There is different appearances.It is the ideal dielectric material of heat-resisting device with good heat conduction, heatproof, insulation performance, and performance
Stablize, not will produce etchant gas in use, the metal contacted will not be had an impact.The filler of high-purity and organic
Silicon be product it is smooth, uniformly and high-temperature insulation guarantee.It is applied to power device and radiator fitting surface, contact surface is eliminated in help
The air gap increase type of thermal communication, reduce thermal resistance, reduce the operating temperature of power device, improve reliability and extend and use the longevity
Life.
Optionally, in the present embodiment, it is additionally provided with the first heat-conducting piece 61 between the second silicone grease layer 62 and heat pipe 40, first
Heat-conducting piece 61 is graphite or copper foil.
In the present embodiment, by increasing heat-conducting silicone grease and graphite/copper foil, the heat of chip body 31 can be made rapid
It is transferred on heat pipe 40, so that heat pipe 40 can further transmit heat.
In above two embodiment, the micropore of array distribution, optionally, the hole of micropore can be opened up on shielding case 32
Diameter size be less than 32 inner shield domain of shielding case radiofrequency signal wavelength 1/50, with the thickness of shielding case 32 be 0.2~
For 0.3mm, the spacing of micropore is greater than or equal to the 1/4 of the pore size of the micropore, and less than or equal to the aperture of the micropore
The 1/2 of size, the quantity of the micropore is determined by corresponding 32 region of shielding case in 31 surface of chip body, i.e., in chip body
Within the greatest measure that corresponding 32 region of shielding case in 31 surfaces can allow, micropore quantity can also be limited in 1/2 wavelength half
In diameter border circular areas, but it must be ensured that the greatest measure that corresponding 32 region of shielding case in 31 surface of chip body can allow with
It is interior.Wherein, it is the bigger the better from shield effectiveness angle micropore spacing, but considers to ensure the heat conduction of the heat-conducting silicone grease in microwell array region
Performance needs spacing to be limited in equal to or slightly less than pore radius range, and the specific spacing for limiting micropore is greater than or equal to should
The 1/4 of the pore size of micropore, and 1/2 of the pore size less than or equal to the micropore, to ensure that total shield effectiveness is more than
30dB/1GHz。
Optionally, heat-conducting silicone grease can be pre-machined in the microwell array both sides of shielding case, and gap is not generated at micropore,
The heat-conducting silicone grease has 30% to 70% compressibility, and overall thickness is between 0.5mm-1mm.
As optional embodiment, the shape of micropore includes at least one of：Circle, triangle, rectangle, diamond shape,
Other can realize the embodiment of same effect within the protection domain of the embodiment of the present application.
It is the structural schematic diagram of radiating subassembly fourth embodiment provided by the present application, the radiating subassembly packet refering to Fig. 5, Fig. 5
Include center 10, circuit board 20, heat source chip 30 and heat pipe 40.
Wherein, center 10 includes opposite first area 10a and second area 10b, and first area 10a forms battery and accommodates
Storehouse 101 is used for set battery.Circuit board 20 is set to second area 10b；Heat source chip 30 is set on circuit board 20, and position
Between circuit board 20 and center 10.Heat pipe 40 includes evaporator section 40a and condensation segment 40b, wherein evaporator section 40a connection heat sources
Chip 30, condensation segment 40b connection batteries accommodate storehouse 101, and the heat of heat source chip 30 is conducted to battery and accommodates storehouse 101.
In the present embodiment, be arranged on center 10 it is fluted, for housing heat pipe 40.It should be understood that the length of groove,
Width and depth are corresponding with the length of heat pipe 40, width and thickness respectively, so that heat pipe 40 can be just positioned in groove.Tool
Body can be fixed by the materials such as heat conduction colloid opposite heat tube 40, and corresponding snap-in structure can also be arranged on groove to heat
Pipe 40 is fixed.
Optionally, the fixed column 11 of multiple protrusions is additionally provided on center 10, multiple fixed columns 11 can be with center 10
It is integrally formed, and formed and accommodate storehouse 101 for the battery of set battery.In the present embodiment, battery accommodates the bottom in storehouse 101
It is additionally provided with the second heat-conducting piece 62, the second heat-conducting piece 62 is graphite or copper foil, for completely cutting off battery and heat pipe 10.
It is the structural schematic diagram of the 5th embodiment of radiating subassembly provided by the present application, the radiating subassembly packet refering to Fig. 6, Fig. 6
Include center 10, circuit board 20, heat source chip 30 and heat pipe 40.
Wherein, center 10 includes opposite first area 10a and second area 10b, and first area 10a forms battery and accommodates
Storehouse 101 is used for set battery.Circuit board 20 is set to second area 10b；Heat source chip 30 is set on circuit board 20, and position
Between circuit board 20 and center 10.Heat pipe 40 includes evaporator section 40a and condensation segment 40b, wherein evaporator section 40a connection heat sources
Chip 30, condensation segment 40b connection batteries accommodate storehouse 101, and the heat of heat source chip 30 is conducted to battery and accommodates storehouse 101.
Wherein, it is the groove formation on center 10, including bottom and side that the battery in the present embodiment, which accommodates storehouse 101,
Wall.
The bottom that the battery of first area 10a accommodates storehouse 101 is provided with the first groove (not indicating), the condensation segment of heat pipe 40
It is set in the first groove；The position that second area 10b corresponds to heat source chip is provided with the second groove (not indicating), heat pipe 40
Evaporator section is set in the second groove.
Optionally, battery accommodates storehouse 101 and is additionally provided with the first groove of connection and second recessed on the side wall of second area
The third groove (not indicating) of slot, heat pipe 40 form the first bending part in the junction of the first groove and third groove, and heat pipe exists
The junction of third groove and the second groove forms the second bending part.
Same as the previously described embodiments, condensation section surface and the battery of heat pipe 40 accommodate 101 orlop portions and are additionally provided with second
Heat-conducting piece 62, the second heat-conducting piece 62 are graphite or copper foil.
It is the structural schematic diagram of radiating subassembly sixth embodiment provided by the present application, the radiating subassembly packet refering to Fig. 7, Fig. 7
Include center 10, circuit board 20, heat source chip 30 and heat pipe 40.
Wherein, center 10 includes opposite first area 10a and second area 10b, and first area 10a forms battery and accommodates
Storehouse 101 is used for set battery.Circuit board 20 is set to second area 10b；Heat source chip 30 is set on circuit board 20, and position
Between circuit board 20 and center 10.Heat pipe 40 includes evaporator section 40a and condensation segment 40b, wherein evaporator section 40a connection heat sources
Chip 30, condensation segment 40b connection batteries accommodate storehouse 101, and the heat of heat source chip 30 is conducted to battery and accommodates storehouse 101.
Evaporator section 40a include at least multiple sub- evaporator sections being sequentially connected, wherein the sub- evaporator section of head end or end with it is cold
Solidifying section 40b connections, the extending direction difference of each two adjacent sub- evaporator section is to form bending structure, so that multiple sub- evaporator sections
It is uniformly distributed in 30 on heat source chip.Optionally, the extending direction of each two adjacent sub- evaporator section is mutually perpendicular to, multiple sub- steamings
Hair section forms the surface that a rectangular uniform is distributed in heat source chip 30.
Condensation segment 40b includes at least multiple sub- condensation segments being sequentially connected, the wherein sub- condensation segment of head end or end and steaming
Section 40a connections are sent out, the extending direction difference of each two adjacent sub- condensation segment is to form bending structure, so that multiple sub- condensation segments
Battery is uniformly distributed in accommodate on storehouse 101.Optionally, the extending direction of each two adjacent sub- condensation segment is mutually perpendicular to, multiple
Sub- condensation segment forms a rectangular uniform and is distributed in the bottom that battery accommodates storehouse 101.
It is the structural schematic diagram of the 7th embodiment of radiating subassembly provided by the present application referring again to Fig. 8, Fig. 8, is different from above-mentioned
Sixth embodiment, in the present embodiment, evaporator section 40a are arcuate structure, and one end of arcuate structure is connect with condensation segment 40b, arc
Shape structure is uniformly distributed on heat source chip 30.Condensation segment 40b is arcuate structure, and one end and the evaporator section 40a of arcuate structure connect
It connects, arcuate structure is uniformly distributed in battery and accommodates on storehouse 101.
In the embodiment of above-mentioned Fig. 7 and Fig. 8, heat pipe 40 is distributed in a manner of bending (complications), increases heat pipe 40
The contact area of evaporator section 40a and heat source chip 30, and increase condensation segment 40b and the battery receiving storehouse 101 of heat pipe 40
Contact area, can preferably absorb heat and heat release in this way, accelerate radiating rate.
Optionally, in above-mentioned multiple embodiments, since the area that battery accommodates storehouse is more than heat source chip, battery accommodates
There is a large amount of position to can be used for radiating on storehouse, it is possible to which the shape of opposite heat tube is changed, and the width of condensation segment is made to be more than
The width of evaporator section can also accelerate the exothermal efficiency of condensation segment in this way.
It is the structural schematic diagram of one embodiment of electronic device provided by the present application refering to Fig. 9, Fig. 9, which includes
Center 10, the front housing 71 for being set to center one side and the rear shell 72 for being set to center another side；Wherein, center 10 wraps
Include opposite first area and second area.
Wherein, center 10 is fluted close to the setting of the side of rear shell 72, for housing heat pipe 40 in groove, in the firstth area
Domain, the condensation segment of heat pipe 40 include the second heat-conducting piece 62 and battery 80 successively close to the side of rear shell 72；In second area, heat
The evaporator section of pipe 40 includes the first heat-conducting piece 61, thermal grease layer, shielding case 32, heat-conducting silicone grease successively close to the side of rear shell 72
Layer, chip body 31 and circuit board 20.Wherein, shielding case 32 forms a shielding space, chip body 31 with circuit board 20
Inside the shielding space.
In addition, further including display screen component 90, center 10 is set to close to the side of front housing 71.Center 10 and display screen group
Third heat-conducting piece 63 is additionally provided between part 90, third heat-conducting piece 63 is graphite or copper foil.
Wherein, front housing 71 is generally transparent glass cover-plate, and rear shell 72 is generally the shell of metal or plastic production.
Optionally, can also include a case ring between center 10 and front housing 71 or between center 10 and rear shell 72.
It, specifically can be with it should be understood that the embodiment of aforementioned radiating subassembly can be applied to the electronic device in this implementation
It is mobile phone, tablet computer etc., specific structure is similar with implementation principle, and which is not described herein again.
The heat for the chip that electronic device inner heat is more concentrated is passed through heat by electronic device through this embodiment
Pipe is conducted to the lower battery compartment region of temperature, the problem of avoiding electronic device hot-spot, caused by preventing hot-spot
The damage of component, spreads out additionally by by heat, is conducive to the gripping feel for improving electronic device, improves user's body
It tests.
The foregoing is merely presently filed embodiments, are not intended to limit the scope of the claims of the application, every to utilize this
Equivalent structure or equivalent flow shift made by application specification and accompanying drawing content, it is relevant to be applied directly or indirectly in other
Technical field includes similarly in the scope of patent protection of the application.
Claims (16)
1. a kind of radiating subassembly, which is characterized in that including：
Center, including opposite first area and second area, wherein the first area forms battery and accommodates storehouse, for holding
Set battery；
Circuit board is set to the second area；
Heat source chip is set on the circuit board, and between the circuit board and the center；
Heat pipe, including evaporator section and condensation segment, wherein the evaporator section connects the heat source chip, and the condensation segment connects institute
It states battery and accommodates storehouse, the heat of the heat source chip is conducted to the battery and accommodates storehouse.
2. radiating subassembly according to claim 1, which is characterized in that
The heat source chip includes；
Chip body is set on the circuit board；
Shielding case is set on the circuit board, and a shielding space is collectively formed with the circuit board, and the chip body is set
It sets in the shielding space；
Wherein, the one side of the evaporator section is contacted with the shielding case, and the another side of the evaporator section connects with the center
It touches.
3. radiating subassembly according to claim 2, which is characterized in that
The first silicone grease layer is additionally provided between the shielding case and the chip body, between the shielding case and the heat pipe also
It is provided with the second silicone grease layer.
4. radiating subassembly according to claim 3, which is characterized in that
The first heat-conducting piece is additionally provided between the second silicone grease layer and the heat pipe, first heat-conducting piece is graphite or copper
Foil.
5. radiating subassembly according to claim 1, which is characterized in that
The bottom that the battery of the first area accommodates storehouse is provided with the first groove, and the condensation segment of the heat pipe is set to institute
It states in the first groove；
The position that the second area corresponds to the heat source chip is provided with the second groove, and the evaporator section of the heat pipe is set to institute
It states in the second groove.
6. radiating subassembly according to claim 5, which is characterized in that
The battery accommodates storehouse and is additionally provided with connection first groove and described second on the side wall of the second area
The third groove of groove, the heat pipe form the first bending part, institute in the junction of first groove and the third groove
It states heat pipe and forms the second bending part in the junction of the third groove and second groove.
7. radiating subassembly according to claim 5, which is characterized in that
The condensation section surface accommodates orlop portion with the battery and is additionally provided with the second heat-conducting piece, and second heat-conducting piece is graphite
Or copper foil.
8. radiating subassembly according to claim 1, which is characterized in that
The evaporator section include at least multiple sub- evaporator sections being sequentially connected, wherein the sub- evaporator section of head end or end with it is described cold
Solidifying section connection, the extending direction difference of each two adjacent sub- evaporator section is to form bending structure, so that the multiple sub- evaporation
Section is uniformly distributed on the heat source chip.
9. radiating subassembly according to claim 1, which is characterized in that
The evaporator section is arcuate structure, and one end of the arcuate structure is connect with the condensation segment, and the arcuate structure is uniform
It is distributed on the heat source chip.
10. radiating subassembly according to claim 1, which is characterized in that
The condensation segment includes at least multiple sub- condensation segments being sequentially connected, the wherein sub- condensation segment of head end or end and the steaming
Section connection is sent out, the extending direction difference of each two adjacent sub- condensation segment is to form bending structure, so that the multiple sub- condensation
Section is uniformly distributed in the battery and accommodates on storehouse.
11. radiating subassembly according to claim 1, which is characterized in that
The condensation segment is arcuate structure, and one end of the arcuate structure is connect with the evaporator section, and the arcuate structure is uniform
The battery is distributed in accommodate on storehouse.
12. radiating subassembly according to claim 1, which is characterized in that
The width of the condensation segment of the heat pipe is more than the width of the evaporator section.
13. radiating subassembly according to claim 1, which is characterized in that
The heat pipe is flat, and the thickness of the heat pipe is 0.3mm to 1mm.
14. a kind of electronic device, which is characterized in that including center, be set to the front housing of the center one side and be set to
The rear shell of the center another side；Wherein, the center includes opposite first area and second area, the first area
Battery is formed close to the side of the rear shell and accommodates storehouse, is used for set battery；
Wherein, the electronic device further includes：
Circuit board is set to the second area close to the side of the rear shell；
Heat source chip is set on the circuit board, and between the circuit board and the center；
Heat pipe, including evaporator section and condensation segment, wherein the evaporator section connects the heat source chip, and the condensation segment connects institute
It states battery and accommodates storehouse, the heat of the heat source chip is conducted to the battery and accommodates storehouse.
15. electronic device according to claim 14, which is characterized in that
The electronic device further includes display screen component, is set to the center close to the side of the front housing.
16. electronic device according to claim 15, which is characterized in that
Third heat-conducting piece is additionally provided between the center and the display screen component, the third heat-conducting piece is graphite or copper
Foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810597237.0A CN108646891A (en) | 2018-06-11 | 2018-06-11 | A kind of radiating subassembly and electronic device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810597237.0A CN108646891A (en) | 2018-06-11 | 2018-06-11 | A kind of radiating subassembly and electronic device |
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| Publication Number | Publication Date |
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| CN108646891A true CN108646891A (en) | 2018-10-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810597237.0A Pending CN108646891A (en) | 2018-06-11 | 2018-06-11 | A kind of radiating subassembly and electronic device |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112467272A (en) * | 2019-08-21 | 2021-03-09 | 华为技术有限公司 | Heat dissipation assembly and electronic equipment |
| CN113691268A (en) * | 2021-08-16 | 2021-11-23 | 合肥水泥研究设计院有限公司 | Data transmission and receiving device |
| EP3965541A4 (en) * | 2019-06-12 | 2022-06-15 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Housing and electronic device |
| CN115087295A (en) * | 2021-03-12 | 2022-09-20 | 北京小米移动软件有限公司 | Middle frame assembly, manufacturing method of middle frame assembly and mobile terminal |
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| CN105357932A (en) * | 2015-10-14 | 2016-02-24 | 小米科技有限责任公司 | Terminal equipment and radiating structure thereof |
| CN206181699U (en) * | 2016-11-14 | 2017-05-17 | 北京珠穆朗玛移动通信有限公司 | It constructs and mobile terminal to lead hot junction |
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| CN105357932A (en) * | 2015-10-14 | 2016-02-24 | 小米科技有限责任公司 | Terminal equipment and radiating structure thereof |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3965541A4 (en) * | 2019-06-12 | 2022-06-15 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Housing and electronic device |
| US11641728B2 (en) | 2019-06-12 | 2023-05-02 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Housing and electronic device |
| CN112467272A (en) * | 2019-08-21 | 2021-03-09 | 华为技术有限公司 | Heat dissipation assembly and electronic equipment |
| CN112467272B (en) * | 2019-08-21 | 2023-01-06 | 华为技术有限公司 | Heat dissipation assembly and electronic equipment |
| CN115087295A (en) * | 2021-03-12 | 2022-09-20 | 北京小米移动软件有限公司 | Middle frame assembly, manufacturing method of middle frame assembly and mobile terminal |
| CN113691268A (en) * | 2021-08-16 | 2021-11-23 | 合肥水泥研究设计院有限公司 | Data transmission and receiving device |
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Application publication date: 20181012 |
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