CN105228410A - A kind of heat abstractor of terminal and terminal - Google Patents
A kind of heat abstractor of terminal and terminal Download PDFInfo
- Publication number
- CN105228410A CN105228410A CN201410499526.9A CN201410499526A CN105228410A CN 105228410 A CN105228410 A CN 105228410A CN 201410499526 A CN201410499526 A CN 201410499526A CN 105228410 A CN105228410 A CN 105228410A
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- heat
- terminal
- metal forming
- heat abstractor
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Abstract
The present invention relates to mobile communication technology field, provide a kind of heat dissipation of terminal device, comprising: metal forming, fit on the surface of pyrotoxin parts; Heat Conduction Material, between metal forming and cooling stand, and is covered in metal forming; Cooling stand, is contacted with Heat Conduction Material by heat pipe.Meanwhile, present invention also offers a kind of terminal, employ above-mentioned heat abstractor.This terminal in use, the heat that inner pyrotoxin parts produce, by metal forming absorb by Heat Conduction Material, then diffuse to whole cooling stand by heat pipe, reach the object of heat radiation rapidly.
Description
Technical field
The present invention relates to mobile communication technology field, especially a kind of heat abstractor of terminal and terminal.
Background technology
The propensity to consume that portable type electronic product is general comprises following two aspects: require not only light but also thin in profile; Then requiring that performance constantly promotes interior.Along with these terminals, especially the CPU (central processing unit) of smart mobile phone is towards multinuclear development, and while performance constantly promotes, platform power consumption is also more and more higher, the processor of equipment and display and the heating of other internal parts more and more serious; And in order to meet appearance requirement, equipment is towards ultra-thin future development, heat-dissipating space is more and more less, and this makes equipment in use more and more hotter, even hot.Thus when wishing outward appearance and performance gets both, a heat radiation critical problem often.The heat sink conception of conventional terminal generally adopts metallic support or graphite film to help heat radiation, but along with CPU power consumption more and more higher, these heat dissipation design not can solve equipment heating problem.
Because general handheld terminal can not dispel the heat with fan, so its heat dissipation design is based on passive heat loss through conduction, current conventional heat sink conception adopts metal or graphite film, due to common metal (aluminium, copper) the highest ability 300W/mK is many for conductive coefficient, the highest ability 1000W/mK is many for graphite film, when CPU power consumption is more and more higher time, these materials obviously can not meet the requirement of equipment cooling, usual equipment surface temperature when running large program load can exceed the comfort temperature of human perception, affect testing with body of consumer, also can reduce the useful life of terminal simultaneously.
Summary of the invention
For overcoming the too high problem causing affecting consumer's body and test and shorten service life of equipment of terminal temperature in prior art, the embodiment of the invention discloses a kind of heat abstractor of terminal, comprising metal forming, Heat Conduction Material, cooling stand; Metal forming, fits on the surface of pyrotoxin parts; Heat Conduction Material, between metal forming and cooling stand, and is covered in metal forming; Cooling stand, by heat pipe and Heat Conduction Material tight.
On the other hand, the embodiment of the invention also discloses a kind of terminal, this terminal comprises above-mentioned heat abstractor, substrate and is located at the pyrotoxin parts on this substrate; This terminal also comprises the electrostatic shielding cover being located at pyrotoxin parts periphery, and electrostatic screen covers in heat abstractor relevant position and offers hollow-out parts; The metal forming of this heat abstractor is located at described hollow-out parts and is fitted on the surface of pyrotoxin parts.
The beneficial effect that the present invention adopts above-mentioned technical solution to reach is:
Because the embodiment of the present invention adopts metal forming, Heat Conduction Material and heat pipe by the delivered heat of pyrotoxin parts and diffuses to the technical scheme of cooling stand, utilize the high thermal conductivity coefficient of heat pipe, overcome the problem that the heat radiation of terminal inner pyrotoxin parts is difficult, and then be conducive to the efficient performance of terminal capabilities, also can reduce terminal end surface temperature further simultaneously, improve Consumer's Experience, extend the useful life of terminal.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, below the accompanying drawing used required in describing embodiment is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of the first embodiment of heat abstractor of the present invention.
Fig. 2 is the structural representation of the second embodiment of heat abstractor of the present invention.
Fig. 3 is the structural representation of the 3rd embodiment of heat abstractor of the present invention.
Fig. 4 is the cross section structural map of Fig. 3.
Description of reference numerals: 1. pyrotoxin parts, 2. metal forming, 3. Heat Conduction Material, 4. heat pipe, 5. cooling stand, 6. substrate, 7. electrostatic shielding cover, 8. battery.
Embodiment
In the following detailed description, propose a large amount of specific detail with provide to described embodiment based on the overall understanding of concept.But it will be apparent to those skilled in the art that described embodiment can be put into practice without the need to these specific detail some or all of.In other situations, process steps well known is not described in detail to avoid the unnecessary interference to basic conception.
In describing the invention, it will be appreciated that, term " longitudinal direction ", " radial direction ", " length ", " width ", " thickness ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", orientation or the position relationship of the instruction such as " outward " are based on orientation shown in the drawings or position relationship, only the present invention for convenience of description and simplified characterization, instead of indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore limitation of the present invention can not be interpreted as.In describing the invention, except as otherwise noted, the implication of " multiple " is two or more.
In describing the invention, it should be noted that, unless otherwise clearly defined and limited, term " installation ", " being connected ", " connection " should be interpreted broadly, and such as, can be fixedly connected with, also can be removably connect, or connect integratedly; Can be mechanical connection, also can be electrical connection; Can be directly be connected, also indirectly can be connected by intermediary, can be the connection of two element internals.For the ordinary skill in the art, concrete condition above-mentioned term concrete meaning in the present invention can be understood.
First embodiment:
Please refer to Fig. 1, it is the structural representation of the heat abstractor of a kind of terminal described in the embodiment of the present invention, and as shown in the figure, this heat abstractor, comprising: metal forming 2, fits on the surface of pyrotoxin parts 1; Heat Conduction Material 3, between metal forming 2 and cooling stand 5, and is covered in this metal forming; Cooling stand 5, is contacted with Heat Conduction Material by heat pipe 4.
According to above-mentioned heat abstractor, described heat pipe 4 is flat.Consider that terminal mostly is slim, its heat abstractor adopts flat heat pipe, if ultrathin heat pipe etc. is as heat pipe 4.Because the Equivalent Thermal Conductivities of heat pipe is all at more than 10000W/mK, heat conduction efficiency compares the lifting that conventional thermal conductive material has matter.
According to above-mentioned heat abstractor, cooling stand 5 is metallic support, it offers the groove for all or part of embedding of described heat pipe 4.Cooling stand 5 does etch processes by local and produces this groove, and this heat pipe 4 is embedded.This metallic support can be the material that aluminium alloy or other rigidity are stronger.
According to above-mentioned heat abstractor, the connected mode of heat pipe and the groove of this metallic support is for weld or bonding.
According to above-mentioned heat abstractor, described metal forming 2 is Copper Foil.Because Copper Foil has good tack and antistatic effect.
According to above-mentioned heat abstractor, described Heat Conduction Material 3 is heat conductive silica gel, for reducing the contact heat resistance between metal forming and cooling stand 5.
The embodiment of the present invention have employed the radiator structure of Copper Foil, heat conductive silica gel, flat heat pipe and metallic support, drastically increases the radiating efficiency of terminal.Heat pipe is embedded into inside metallic support; utilize the high thermal conductivity coefficient of heat pipe and dispelled the heat rapidly by metallic support on the one hand; the Rigidity and strength protection heat pipe on the other hand utilizing metallic support good, avoids heat pipe to lose efficacy by external force deformation, and is conducive to electronic equipment and does thin further.
Second embodiment:
Please refer to Fig. 2, it is the structural representation of a kind of terminal described in the embodiment of the present invention, and as shown in the figure, described terminal, comprises heat abstractor, substrate 6, is located at the pyrotoxin parts 1 on this substrate; Described terminal also comprises the electrostatic shielding cover 7 being located at pyrotoxin parts 1 periphery, and described electrostatic shielding cover 7 offers hollow-out parts in described heat abstractor relevant position; Heat abstractor as described for the first embodiment: metal forming 2 is located at described hollow-out parts and is fitted on the surface of heat generating components; Heat Conduction Material 3, between metal forming 2 and cooling stand 5, and is covered in metal forming 2 described in this; Cooling stand 5, is contacted with Heat Conduction Material 3 by heat pipe 4.
Pyrotoxin parts 1 are positioned at substrate 6 i.e. printed circuit board (PCB) (FlexiblePrintedCircuitboard, FPC) on, electrostatic shielding cover 7 is located at the periphery of pyrotoxin parts 1, and offering hollow-out parts in the relevant position of heat abstractor, metal forming 2 is located at described hollow-out parts and is fitted on the surface of pyrotoxin parts 1.Then in metal forming 2, paste Heat Conduction Material 3, can select heat conductive silica gel, this Heat Conduction Material 3 mainly reduces the contact heat resistance between metal forming 2 and cooling stand 5, is transmitted to fully above cooling stand 5 by the heat of pyrotoxin parts 1.
According to above-mentioned terminal, pyrotoxin parts 1 are central processing unit, and electrostatic shielding cover 7 offers hollow-out parts in central processing unit end face, and the metal forming 2 of heat abstractor is located at described hollow-out parts and is fitted on the surface of pyrotoxin parts.This metal forming 2 can adopt Copper Foil, and Copper Foil can play good shielding action on the one hand, and Copper Foil is also the good conductor of heat on the other hand, the heat of central processing unit can be led open fast.
The embodiment of the present invention by the heat abstractor practice described in the first embodiment in heat dissipation of terminal solution, and electrostatic shielding cover 7 and this heat abstractor are combined closely, by this total solution, the heat of central processing unit or other pyrotoxin parts is transmitted on cooling stand 5 rapidly, dispel the heat rapidly finally by large-area cooling stand 5, the heat of terminal entirety is more evenly distributed, the situation avoiding focus to concentrate causing equipment temperatures at localized regions too high.Meanwhile, this simple structure is compact, the shape requirement that the equipment that ensure that is light and thin, is the first-selection of handheld terminal higher-end platform heat sink conception.
3rd embodiment:
The present embodiment is further optimized on the basis of the second embodiment.Please refer to Fig. 3 and Fig. 4, Fig. 3 for described in the present embodiment a kind of structural representation of terminal, Fig. 4 is the cross section structural map of Fig. 3.As shown in Figure 3, this terminal, comprises heat abstractor, and the central processing unit on this substrate is located at by substrate 6; This terminal also comprises the electrostatic shielding cover 7 being located at central processing unit periphery, and described electrostatic shielding cover 7 offers hollow-out parts in central processing unit end face.Heat abstractor comprises metal forming 2 and is located at described hollow-out parts and fits on the surface of pyrotoxin parts 1; Heat Conduction Material 3, between metal forming 2 and cooling stand 5, and is covered in metal forming 2 described in this; Cooling stand 5, is contacted with Heat Conduction Material 3 by heat pipe 4.This terminal also comprises battery, and this battery swells in described heat pipe 4 relevant position, to form the cavity for accommodating heat pipe 4.
A kind of effect that battery 8 swells in heat pipe 4 relevant position is shown in Fig. 4.
For mobile phone, battery 8 is designed to arc along mobile phone Width, the space that can make full use of in the middle of arc forms cavity in heat pipe 4 relevant position, ensures the contactless state of heat pipe and battery.When mobile phone battery cover is designed with radian, can make full use of the space of interior of mobile phone, realization can be dispelled the heat efficiently, additionally can not increase thickness again.
The enforcement of the technical program, the heat abstractor described in preceding embodiment is coordinated with battery 8, the cavity of accommodating heat pipe 4 is formed, has both made heat pipe 4 avoid pressurized and affect its heat conduction efficiency, turn avoid the abnormal heating causing battery 8 due to heat pipe 4 and the contact of battery 8.Add the miscellaneous part coordinating terminal, as the improvement of battery cover etc., terminal can be made to do further thin, to meet the demand in market.
Many feature and advantage of the present invention are apparent from written explanation, and therefore claims intention covers all these the features and advantages of the present invention.In addition, owing to being easy to carry out a large amount of modifications and variations to those skilled in the art, so the present invention should not be limited to precision architecture that is illustrated and that describe and operation.Therefore, all suitable modification and equivalent can be thought and fall within the scope of the present invention.
Claims (9)
1. a heat abstractor for terminal, comprising: metal forming, Heat Conduction Material, cooling stand, it is characterized in that,
Described metal forming, fits on the surface of pyrotoxin parts;
Described Heat Conduction Material, between described metal forming and described cooling stand, and is covered in described metal forming;
Described cooling stand, is contacted with described Heat Conduction Material by heat pipe.
2. heat abstractor according to claim 1, is characterized in that, described heat pipe is flat.
3. heat abstractor according to claim 2, is characterized in that, described cooling stand is metallic support, it offers the groove for all or part of embedding of described heat pipe.
4. heat abstractor according to claim 3, is characterized in that, the connected mode of described heat pipe and the groove of described metallic support is for weld or bonding.
5. according to the heat abstractor one of Claims 1-4 Suo Shu, it is characterized in that, described metal forming is Copper Foil.
6. according to the heat abstractor one of Claims 1-4 Suo Shu, it is characterized in that, described Heat Conduction Material is heat conductive silica gel, for reducing the contact heat resistance between metal forming and cooling stand.
7. a terminal, comprises heat abstractor, substrate, is located at the pyrotoxin parts on this substrate; It is characterized in that, described terminal also comprises the electrostatic shielding cover being located at pyrotoxin parts periphery, and described electrostatic screen covers in described heat abstractor relevant position and offers hollow-out parts;
Described heat abstractor is the heat abstractor described in one of claim 1 to 6, and the metal forming of described heat abstractor is located at described hollow-out parts and is fitted on the surface of described pyrotoxin parts.
8. terminal according to claim 7, it is characterized in that, described pyrotoxin parts are central processing unit, and described electrostatic screen covers in central processing unit end face and offers hollow-out parts, and the metal forming of described heat abstractor is located at described hollow-out parts and is fitted on the surface of described pyrotoxin parts.
9. terminal according to claim 8, is characterized in that, described terminal also comprises battery, and described battery swells in described heat pipe relevant position, to form the cavity for accommodating heat pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410499526.9A CN105228410A (en) | 2014-09-25 | 2014-09-25 | A kind of heat abstractor of terminal and terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410499526.9A CN105228410A (en) | 2014-09-25 | 2014-09-25 | A kind of heat abstractor of terminal and terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105228410A true CN105228410A (en) | 2016-01-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410499526.9A Pending CN105228410A (en) | 2014-09-25 | 2014-09-25 | A kind of heat abstractor of terminal and terminal |
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| Country | Link |
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| CN (1) | CN105228410A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106211553A (en) * | 2016-07-28 | 2016-12-07 | 广东欧珀移动通信有限公司 | Pcb board assembly and there is its mobile terminal |
| CN106774665A (en) * | 2016-12-16 | 2017-05-31 | 歌尔科技有限公司 | A kind of virtual helmet radiator structure |
| CN108770294A (en) * | 2018-06-11 | 2018-11-06 | Oppo广东移动通信有限公司 | A kind of radiating subassembly and electronic device |
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| US20090151899A1 (en) * | 2007-12-17 | 2009-06-18 | Cheng-Yi Chang | Cooling apparatus |
| CN102378554A (en) * | 2010-08-26 | 2012-03-14 | 张方荣 | Circuit board with heating-conducting and heat-radiating structure |
| CN103037040A (en) * | 2012-09-28 | 2013-04-10 | 共青城赛龙通信技术有限责任公司 | Mobile phone centralized type heat dissipation mechanism |
| CN103702549A (en) * | 2013-12-26 | 2014-04-02 | 苏州天脉导热科技有限公司 | Heat tube for ultrathin electronic product |
| CN104039115A (en) * | 2014-05-14 | 2014-09-10 | 中山伟强科技有限公司 | Mobile phone heat dissipation module |
-
2014
- 2014-09-25 CN CN201410499526.9A patent/CN105228410A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090151899A1 (en) * | 2007-12-17 | 2009-06-18 | Cheng-Yi Chang | Cooling apparatus |
| CN102378554A (en) * | 2010-08-26 | 2012-03-14 | 张方荣 | Circuit board with heating-conducting and heat-radiating structure |
| CN103037040A (en) * | 2012-09-28 | 2013-04-10 | 共青城赛龙通信技术有限责任公司 | Mobile phone centralized type heat dissipation mechanism |
| CN103702549A (en) * | 2013-12-26 | 2014-04-02 | 苏州天脉导热科技有限公司 | Heat tube for ultrathin electronic product |
| CN104039115A (en) * | 2014-05-14 | 2014-09-10 | 中山伟强科技有限公司 | Mobile phone heat dissipation module |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106211553A (en) * | 2016-07-28 | 2016-12-07 | 广东欧珀移动通信有限公司 | Pcb board assembly and there is its mobile terminal |
| CN106211553B (en) * | 2016-07-28 | 2019-04-19 | Oppo广东移动通信有限公司 | Pcb board component and mobile terminal with it |
| CN106774665A (en) * | 2016-12-16 | 2017-05-31 | 歌尔科技有限公司 | A kind of virtual helmet radiator structure |
| CN108770294A (en) * | 2018-06-11 | 2018-11-06 | Oppo广东移动通信有限公司 | A kind of radiating subassembly and electronic device |
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Application publication date: 20160106 |
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