CN104039115A - Mobile phone heat dissipation module - Google Patents
Mobile phone heat dissipation module Download PDFInfo
- Publication number
- CN104039115A CN104039115A CN201410204181.XA CN201410204181A CN104039115A CN 104039115 A CN104039115 A CN 104039115A CN 201410204181 A CN201410204181 A CN 201410204181A CN 104039115 A CN104039115 A CN 104039115A
- Authority
- CN
- China
- Prior art keywords
- mobile phone
- heat
- padded coaming
- hot
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000017525 heat dissipation Effects 0.000 title abstract description 8
- 239000000463 material Substances 0.000 claims abstract description 15
- 239000000843 powder Substances 0.000 claims description 18
- 239000000919 ceramic Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 9
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 239000000428 dust Substances 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 239000010439 graphite Substances 0.000 claims description 5
- 229910002804 graphite Inorganic materials 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 4
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 3
- 229910021502 aluminium hydroxide Inorganic materials 0.000 claims description 3
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 claims description 3
- 239000000292 calcium oxide Substances 0.000 claims description 3
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims description 3
- 229910010272 inorganic material Inorganic materials 0.000 claims description 3
- 239000011147 inorganic material Substances 0.000 claims description 3
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 3
- 239000000347 magnesium hydroxide Substances 0.000 claims description 3
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 3
- 239000000395 magnesium oxide Substances 0.000 claims description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 235000012239 silicon dioxide Nutrition 0.000 claims description 3
- 239000002904 solvent Substances 0.000 claims description 3
- 239000004408 titanium dioxide Substances 0.000 claims description 3
- 229910017083 AlN Inorganic materials 0.000 claims description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229960004643 cupric oxide Drugs 0.000 claims description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims 1
- 239000004411 aluminium Substances 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 abstract 4
- 238000010521 absorption reaction Methods 0.000 abstract 2
- 230000000694 effects Effects 0.000 description 6
- 238000005338 heat storage Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a mobile phone heat dissipation module, which mainly comprises a heating chip, a flat heat pipe and a thermal buffer material, wherein the heating chip is arranged on a circuit board; one end of the flat heat pipe is a heat absorption section, and the other end of the flat heat pipe is a heat dissipation section, wherein the heat absorption section is attached above the heating chip and is used for conducting the heat energy of the heating chip to the heat dissipation section at the other end rapidly; the heat buffer material is attached to or covers the heat dissipation section of the flat heat pipe, and the outer surface of the heat buffer material can be in contact with the mobile phone shell, so that heat energy conducted to the heat dissipation section is absorbed and gradually released to the mobile phone shell.
Description
Technical field
The present invention relates to mobile phone radiator structure field, in particular, relate to a kind of mobile phone radiating module.
Background technology
Existing people is used in heat pipe the heat radiation of mobile phone in recent years; but because the past is used the experience of heat pipe in laptop computer (Laptop computer), usually one end of heat pipe can be added to a radiating fin (heat sink) is arranged at an opening part and with a fan, hot blow to this opening part is dispelled the heat.But because present smart mobile phone requires waterproof and dustproof, add and require the ultra-thin superelevation specification requirements such as design, cause the heat dissipation design of past laptop computer directly to be moved on mobile phone and being used, therefore must use other heat dissipation design.
The radiating mode of existing smart mobile phone is to adopt punched metal sheet, graphite or both to arrange in pairs or groups to realize, though can very soon heat energy be left, but this can allow user feel hot uncomfortable, and along with mobile telephone power consumption is more and more higher, the radiating mode of this kind of design can not meet the demand of following higher power consumption.
Summary of the invention
The object of the invention is to overcome shortcoming of the prior art with not enough, make to provide a kind of simple in structure and have more the mobile phone radiating module of heat radiation function.
In order to achieve the above object, the present invention is achieved by following technical proposals:
Mobile phone radiating module provided by the present invention is mainly comprised of euthermic chip, flat hot pipe and hot padded coaming, and wherein said euthermic chip is arranged at a circuit board; Described flat hot pipe one end is endotherm section, and the other end is radiating segment, and wherein said endotherm section is attached at the top of described euthermic chip, makes to conduct to rapidly the radiating segment place of the other end for conducting the heat energy of described euthermic chip; Described hot padded coaming attaches or envelopes the radiating segment of described flat hot pipe, and the outer surface of described hot padded coaming can contact with hand set machine shell, makes Assimilation and conductivity to the heat energy at described radiating segment place, and is released into gradually described hand set machine shell;
Wherein, described hot padded coaming is by 20 ~ 100 parts of ceramic powders or metal dusts; 50 ~ 100 parts of epoxy resin; The institutes such as 1 ~ 20 part, curing agent and other a small amount of composition ground curing accelerator, powder surface inorganic agent, flexibilizer form, and use solvent to form making it solidify after these material blendings.
In mobile phone radiating module of the present invention, described euthermic chip is the arithmetic processor of integrated circuit.
In mobile phone radiating module of the present invention, described ceramic powders is that one or more in the inorganic material powder such as aluminium oxide, aluminium nitride, cupric oxide, titanium dioxide, iron oxide, silicon dioxide, magnesium oxide, calcium oxide, carborundum, aluminium hydroxide, magnesium hydroxide and graphite are combined.Described metal dust or the particle diameter of ceramic powders are 0.1 μ m-50 μ m.Described mobile phone radiating module material is in the temperature range of using (below 150 ℃, more than-60 ℃) be can not produce phase change, the scope of described hot padded coaming specific heat capacity C is 1000 ~ 3000J/kg*K, and best specific heat capacitance is 2000 ~ 3000J/kg*K.
In mobile phone radiating module of the present invention, described hot padded coaming also can be other high specific heat capacitance materials.
In mobile phone radiating module of the present invention, for the endotherm section of described euthermic chip contact, can be located at the interlude place of described flat hot pipe, the place, two ends that supplies described hot padded coaming attaching or coated radiating segment to be located at described flat hot pipe.
Of the present inventionly be designed to meet present smart mobile phone requirement waterproof and dustproof and ultra-thin design specification, therefore the one end that is less than the flat hot pipe of 0.6mm with thickness is attached to the top of euthermic chip, and the other end imposes thermal compensation mode and designs a hot padded coaming and attach or envelope.
Compared with prior art, because hot padded coaming used in the present invention has higher heat storage capacity than the single metal of commonly using or graphite, so can be widely used in the mobile device of higher power consumption, do not need large area or fan to strengthen thermal convection effect, therefore not only radiating effect is good in the present invention, and it also can reach and show the effect reducing in manufacturing cost.
Accompanying drawing explanation
Fig. 1 is mobile phone radiating module structure figure.
Fig. 2 is that radiating module is in the application drawing of mobile phone.
Temperature rise figure when Fig. 3 is mobile phone operation.
Fig. 4 is the heat-transfer path of radiating module.
Fig. 5 is the A-A cutaway view of Fig. 2, is the heat radiation schematic diagram under standby status of mobile phone.With.
Fig. 6 is the another kind of example structure figure of mobile phone radiating module.
embodiment:
Refer to shown in Fig. 1 and Fig. 2, the disclosed mobile phone radiating module of the present invention is mainly consisted of euthermic chip 1, flat hot pipe 2 and hot padded coaming 3, and wherein said euthermic chip 1 refers to the arithmetic processor of being located at the integrated circuit on mobile phone interior circuit board; Described flat hot pipe 2 one end are endotherm section 21, and the other end is radiating segment 22, and wherein said endotherm section 21 is attached at the top of described euthermic chip 1, make to conduct to rapidly radiating segment 22 places of the other end for conducting the heat energy of described euthermic chip 1; Described hot padded coaming 3 attaches or envelopes radiating segment 22 places of described flat hot pipe 2, the outer surface of another described hot padded coaming 3 can contact with hand set machine shell 4, make Assimilation and conductivity to the heat energy at described radiating segment 22 places, and be released into gradually described hand set machine shell 4.
Described flat hot pipe 2 is the ultrathin heat pipes that adopt below 1.0mm, and its bending shape can be adjusted arbitrarily according to the position of the euthermic chips such as CPU, charging IC, power management chip.
Described hot padded coaming 3 is materials of a kind of high thermal conductivity coefficient k, high specific heat C, is the composite material of being combined with epoxy resin by metal dust or ceramic powders.The advantage of this hot padded coaming 3 is, the high capacity of heat transmission of metal or ceramic powders can spread heat rapidly, all distinguish and be distributed in hot padded coaming surface, and the high specific heat value of epoxide resin material can be by a large amount of heat storages, make mobile phone CPU and the skin temperature can too high (not as shown in Figure 3).Be Q=m.C. Δ T
q=ρ .V.C. Δ T, when volume V, density p and the heat Q of material are fixedly time, C is larger, and temperature rise Δ T is just less.When volume V, density p and the temperature rise Δ T of material are fixedly time, C is larger, and the heat storing is just more.
Described hot padded coaming 3 is by 20 ~ 90 parts of ceramic powders; 20 ~ 90 parts of epoxy resin; The institutes such as 1 ~ 20 part, curing agent and other a small amount of composition ground curing accelerator, powder surface inorganic agent, flexibilizer form, and use solvent to form making it solidify after these material blendings.
Described ceramic powders is that one or more in the inorganic material powder such as aluminium oxide, oxidized aluminum nitride copper, titanium dioxide, iron oxide, silicon dioxide, magnesium oxide, calcium oxide, carborundum, aluminium hydroxide, magnesium hydroxide and graphite are combined, and described metal dust or the particle diameter of ceramic powders are 0.1 μ m-50 μ m.Described mobile phone radiating module material is in the temperature range of using (below 150 ℃, more than-60 ℃) be can not produce phase change, the scope of described hot padded coaming specific heat capacity C is 1000 ~ 3000J/kg*K, and best specific heat capacitance is 2000 ~ 3000J/kg*K.
Certainly, described hot padded coaming 3 also can be other high specific heat value materials and forms.
The heat radiation approach of this mobile phone radiating module integral body is passed to hot padded coaming 3 places by the heat of CPU fast for the high conduction ability by flat hot pipe 2, the high heat storage ability of the hot padded coaming 3 that recycling is described stores (as shown in Figure 4) by heat, when cell phone standby or low power operation, by phone housing 4, heat is slowly dissipated (as shown in Figure 5).
In addition, as shown in Figure 6, for the endotherm section 21 of described euthermic chip 1 contact, can be located at the interlude place of described flat hot pipe 2, supply 3 attachings of described hot padded coaming or coated radiating segment 22 to be located at the place, two ends of described flat hot pipe 2.
Because described hot padded coaming has higher heat storage capacity, so can be widely used in the mobile device of higher power consumption, do not need large area or fan to strengthen thermal convection effect, thus the present invention not only radiating effect is good, it also can reach and show the effect reducing in manufacturing cost.
Above-described embodiment is to be preferred embodiment of the present invention; but embodiments of the present invention are not restricted to the described embodiments; other are any deviates from change, the modification done under Spirit Essence of the present invention and principle, substitute, combination, simplification etc. all should be equivalent substitute mode, and it all should be included in protection scope of the present invention.
Claims (5)
1. a mobile phone radiating module, comprises:
One euthermic chip, is arranged at a circuit board;
One flat hot pipe, described flat hot pipe one end is endotherm section, and the other end is radiating segment, and wherein said endotherm section is attached at the top of described euthermic chip, makes to conduct to rapidly the radiating segment place of the other end for conducting the heat energy of described euthermic chip; With
One hot padded coaming, attaches or envelopes the radiating segment of described flat hot pipe, and the outer surface of described hot padded coaming can contact with hand set machine shell, makes Assimilation and conductivity to the heat energy at described radiating segment place, and is released into gradually described hand set machine shell;
Wherein, described hot padded coaming is by 20 ~ 90 parts of ceramic powders or metal dusts; 20 ~ 90 parts of epoxy resin; The institutes such as 1 ~ 20 part, curing agent and other a small amount of composition ground curing accelerator, powder surface inorganic agent, flexibilizer form, and use solvent to form making it solidify after these material blendings.
2. according to the mobile phone radiating module described in claim 1, it is characterized in that: described euthermic chip is the arithmetic processor of integrated circuit.
3. according to the mobile phone radiating module described in claim 1, it is characterized in that: described ceramic powders is that one or more in the inorganic material powder such as aluminium oxide, aluminium nitride, cupric oxide, titanium dioxide, iron oxide, silicon dioxide, magnesium oxide, calcium oxide, carborundum, aluminium hydroxide, magnesium hydroxide and graphite are combined, described metal dust is that one or more in the metal dusts such as copper powder, aluminium powder, iron powder and magnesium powder are combined; Described ceramic powders or the particle diameter of metal dust are 0.1 μ m-50 μ m, and the scope of described hot padded coaming specific heat capacity C is 1000 ~ 3000J/kg*K.
4. the mobile phone radiating module as described in claim 1, is characterized in that: described hot padded coaming also can be other high specific heat capacitance materials.
5. the mobile phone radiating module as described in claim 1, it is characterized in that: for the endotherm section of described euthermic chip contact, can be located at the interlude place of described flat hot pipe, the place, two ends that supplies described hot padded coaming attaching or coated radiating segment to be located at described flat hot pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410204181.XA CN104039115B (en) | 2014-05-14 | 2014-05-14 | Mobile phone heat dissipation module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410204181.XA CN104039115B (en) | 2014-05-14 | 2014-05-14 | Mobile phone heat dissipation module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104039115A true CN104039115A (en) | 2014-09-10 |
| CN104039115B CN104039115B (en) | 2016-09-21 |
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| CN201410204181.XA Active CN104039115B (en) | 2014-05-14 | 2014-05-14 | Mobile phone heat dissipation module |
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| CN (1) | CN104039115B (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104980534A (en) * | 2014-09-17 | 2015-10-14 | 广东欧珀移动通信有限公司 | Device and method for adjusting temperature of shell of mobile terminal |
| CN105228410A (en) * | 2014-09-25 | 2016-01-06 | 维沃移动通信有限公司 | A kind of heat abstractor of terminal and terminal |
| CN105682418A (en) * | 2014-11-20 | 2016-06-15 | 奇鋐科技股份有限公司 | Heat emission structure for mobile electronic equipment |
| CN105744822A (en) * | 2016-04-29 | 2016-07-06 | 广东欧珀移动通信有限公司 | Shielding cover, circuit board and mobile terminal |
| CN105744810A (en) * | 2016-04-29 | 2016-07-06 | 广东欧珀移动通信有限公司 | Housing of terminal and mobile terminal |
| CN106455452A (en) * | 2016-11-25 | 2017-02-22 | 华为技术有限公司 | Single board radiator and communication equipment |
| CN106470538A (en) * | 2015-08-19 | 2017-03-01 | 株式会社藤仓 | Portable electric appts heat sink |
| CN106774665A (en) * | 2016-12-16 | 2017-05-31 | 歌尔科技有限公司 | A kind of virtual helmet radiator structure |
| CN110248527A (en) * | 2019-07-19 | 2019-09-17 | 江西耐乐铜业有限公司 | The production method and mobile phone heat pipe of mobile phone heat pipe oxygen-free copper pipe |
| US11284537B2 (en) | 2018-03-26 | 2022-03-22 | Huawei Technologies Co., Ltd. | Heat-conducting assembly and terminal |
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| CN101211869A (en) * | 2006-12-27 | 2008-07-02 | 仁宝电脑工业股份有限公司 | Radiating module and its heat conduction pipe |
| TW201314398A (en) * | 2011-09-30 | 2013-04-01 | Quanta Comp Inc | Electronic device and temperature modulation method |
| US20130329368A1 (en) * | 2012-06-08 | 2013-12-12 | Apple Inc. | Fasteners and dual-thickness thermal stages in electronic devices |
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Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104980534A (en) * | 2014-09-17 | 2015-10-14 | 广东欧珀移动通信有限公司 | Device and method for adjusting temperature of shell of mobile terminal |
| CN105228410A (en) * | 2014-09-25 | 2016-01-06 | 维沃移动通信有限公司 | A kind of heat abstractor of terminal and terminal |
| CN105682418A (en) * | 2014-11-20 | 2016-06-15 | 奇鋐科技股份有限公司 | Heat emission structure for mobile electronic equipment |
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| CN106470538A (en) * | 2015-08-19 | 2017-03-01 | 株式会社藤仓 | Portable electric appts heat sink |
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| CN105744810A (en) * | 2016-04-29 | 2016-07-06 | 广东欧珀移动通信有限公司 | Housing of terminal and mobile terminal |
| CN105744810B (en) * | 2016-04-29 | 2018-12-11 | 广东欧珀移动通信有限公司 | A kind of shell and mobile terminal of terminal |
| CN105744822A (en) * | 2016-04-29 | 2016-07-06 | 广东欧珀移动通信有限公司 | Shielding cover, circuit board and mobile terminal |
| CN105744822B (en) * | 2016-04-29 | 2019-06-14 | Oppo广东移动通信有限公司 | Shielding case, circuit board and mobile terminal |
| CN106455452A (en) * | 2016-11-25 | 2017-02-22 | 华为技术有限公司 | Single board radiator and communication equipment |
| CN106455452B (en) * | 2016-11-25 | 2019-02-26 | 华为技术有限公司 | Single plate radiator and communication equipment |
| CN106774665A (en) * | 2016-12-16 | 2017-05-31 | 歌尔科技有限公司 | A kind of virtual helmet radiator structure |
| US11284537B2 (en) | 2018-03-26 | 2022-03-22 | Huawei Technologies Co., Ltd. | Heat-conducting assembly and terminal |
| US11839055B2 (en) | 2018-03-26 | 2023-12-05 | Huawei Technologies Co., Ltd. | Heat-conducting assembly and terminal |
| CN110248527A (en) * | 2019-07-19 | 2019-09-17 | 江西耐乐铜业有限公司 | The production method and mobile phone heat pipe of mobile phone heat pipe oxygen-free copper pipe |
| CN110248527B (en) * | 2019-07-19 | 2023-11-07 | 江西耐乐铜业有限公司 | Production method of oxygen-free copper tube for mobile phone heat tube and mobile phone heat tube |
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| Publication number | Publication date |
|---|---|
| CN104039115B (en) | 2016-09-21 |
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