CN105682418A - Heat emission structure for mobile electronic equipment - Google Patents
Heat emission structure for mobile electronic equipment Download PDFInfo
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- CN105682418A CN105682418A CN201410674963.XA CN201410674963A CN105682418A CN 105682418 A CN105682418 A CN 105682418A CN 201410674963 A CN201410674963 A CN 201410674963A CN 105682418 A CN105682418 A CN 105682418A
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- electronic device
- mobile electronic
- radiator structure
- heat
- device radiator
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Abstract
The invention provides a heat emission structure for mobile electronic equipment. The heat emission structure comprises a liquid crystal display module, a back cover and at least one heat-conducting element, wherein a substrate is arranged at one side of the liquid crystal display module; at least one electronic element is arranged on the substrate; an accommodating space is formed in the back cover; the liquid crystal display module is oppositely arranged in the accommodating space; the heat-conducting elements are arranged between the electronic elements and the back cover; one side of each heat-conducting element is in contact with the electronic elements; and the other side is in contact with the back cover correspondingly. Through the design of the heat emission structure, heat of the electronic elements can be evenly emitted and is not accumulated by the heat-conducting elements; and the effect of improving the heat emission speed in the mobile electronic equipment is achieved.
Description
Technical field
The present invention relates to a kind ofly help the heat energy uniformly dispersing of this electronic component and do not produce accumulated heat problem, and reach and promote the inner mobile electronic device radiator structure of heat radiation rapidly of action electronic device.
Background technology
In electronic installation development, more and more high operation efficiency has been trend now with the process chip with high computing clock pulse; In addition the development of electronic installation more need to be taking compact as designer trends, but must reach under high operation efficiency and compact designer trends simultaneously, also more relative difficulty of the radiating efficiency of its relative electronic installation.
The electronic installation of prior art is in the time of running, and its inner chip or processor carry out computing or process time, the temperature of chip or processor itself can raise, thereby produce unnecessary heat, if for frivolous running gear, such as ultra-thin mobile computer, tablet PC, intelligent mobile phone etc. hand held device, be mainly previously to utilize the modes such as simple perforate, heat conduction, thermal convection current to set about, but those radiating modes are with the heat energy that high-effect chip or processor produced now of cannot loading.
But, along with existing hand held device usefulness is more and more higher, its central interior processing unit march toward double-core or the even higher usefulness of four cores, and the faster heat that it produces of the treatment efficiency processing speed of central processing unit also certainly will be more and more higher, therefore existing hand held device has the problem of accumulated heat, heat energy cannot uniformly dispersing, causes reducing the radiating efficiency of hand held device inside.
The above, prior art has following shortcoming:
1. heat energy cannot uniformly dispersing;
2. can produce accumulated heat problem;
3. reduce action electronic device internal heat dissipating efficiency.
Therefore, how to solve above-mentioned existing problem and disappearance, the inventor who is this case desires most ardently to the relevant manufacturer that is engaged in the industry the direction place that research improves.
Summary of the invention
Therefore,, for effectively solving the above problems, main purpose of the present invention is to provide a kind of mobile electronic device radiator structure that helps the heat energy uniformly dispersing of this electronic component not produce accumulated heat.
Secondary objective of the present invention, is to provide a kind of and can significantly promotes the inner mobile electronic device radiator structure of heat radiation rapidly of action electronic device.
For reaching above-mentioned purpose, the invention provides a kind of mobile electronic device radiator structure, comprising: a LCD MODULE, this LCD MODULE one side is provided with a substrate, is provided with at least one electronic component on this substrate; One back of the body lid, has an accommodation space, and this LCD MODULE is relatively arranged in this accommodation space; And at least one heat conducting element, be arranged between described electronic component and back of the body lid the described electronic component of this corresponding contact of heat conducting element one side, the described back of the body lid of the corresponding contact of opposite side.
This LCD MODULE one side center that is more sticked, described substrate is embedded on this center.
This heat conducting element has one first side and one second side, the described electronic component of the corresponding contact of this first side, the described back of the body lid of the corresponding contact of this second side.
This accommodation space has more a groove, and the second side of described heat conducting element is to be embedded in this groove.
It is wherein arbitrary that this heat conducting element can be heat pipe or temperature-uniforming plate or high heat-conducting.
It is wherein arbitrary that the shape of this heat pipe can be U-shaped or L-type or S type or its alloytype shape.
This back of the body covers and is provided with a upper cover, this this LCD MODULE of upper cover cover cap and cover corresponding group with the described back of the body and establish.
This upper cover position has a transparency carrier, and this transparency carrier relatively lid is established described LCD MODULE.
Four corners of this heat conducting element are more formed with at least one hole, and described back of the body lid is to being formed with a fixed part in hole place, and at least one locking part runs through described hole and fixed part.
By the design of this structure of the present invention, utilize the described electronic component of the corresponding contact of described heat conducting element one side, opposite side is the described back of the body lid of corresponding contact, by the setting of described heat conducting element, can help heat energy that this electronic component produces evenly to conduct to back of the body lid dispels the heat, do not have the problem of accumulated heat, in addition, also can reach and promote the inner effect of heat radiation rapidly of action electronic device.
Brief description of the drawings
Fig. 1 is the three-dimensional exploded view of mobile electronic device radiator structure the first embodiment of the present invention;
Fig. 2 is the three-dimensional combination figure of mobile electronic device radiator structure the first embodiment of the present invention;
Fig. 3 is the assembled sectional view of mobile electronic device radiator structure the first embodiment of the present invention;
Fig. 4 is the profile of mobile electronic device radiator structure the first embodiment of the present invention;
Fig. 5 is the three-dimensional exploded view of mobile electronic device radiator structure the second embodiment of the present invention;
Fig. 6 is the three-dimensional exploded view of mobile electronic device radiator structure the 3rd embodiment of the present invention;
Fig. 7 is the three-dimensional exploded view of mobile electronic device radiator structure the 4th embodiment of the present invention;
Fig. 8 is the three-dimensional exploded view of mobile electronic device radiator structure the 5th embodiment of the present invention;
Fig. 9 is the three-dimensional exploded view of mobile electronic device radiator structure the 6th embodiment of the present invention;
Figure 10 is the three-dimensional exploded view of mobile electronic device radiator structure the 7th embodiment of the present invention;
Figure 11 is the three-dimensional exploded view of mobile electronic device radiator structure the 8th embodiment of the present invention;
Figure 12 is the three-dimensional exploded view of mobile electronic device radiator structure the 9th embodiment of the present invention.
Symbol description
LCD MODULE 1
Center 11
Substrate 12
Electronic component 13
The back of the body covers 2
Accommodation space 21
Groove 22
Fixed part 23
Heat conducting element 3
The first side 31
The second side 32
Hole 33
Upper cover 4
Transparency carrier 5
Locking part 6
Detailed description of the invention
Below with reference to drawing, detailed annotation embodiments of the invention:
Characteristic in above-mentioned purpose of the present invention and structure thereof and function, will be explained according to the preferred embodiment of institute's accompanying drawing.
Refer to Fig. 1 and 2 and 3 and 4, for three-dimensional exploded view and three-dimensional combination figure and assembled sectional view and the profile of the first embodiment of mobile electronic device radiator structure of the present invention, as shown in the figure, a kind of mobile electronic device radiator structure, comprise that a LCD MODULE 1 and a back of the body cover 2 and at least one heat conducting element 3, the described LCD MODULE 1 one sides substrate 12 that has been sticked, is provided with at least one electronic component 13 on this substrate 12;
The described LCD MODULE 1 one sides center 11 that more can be sticked, this substrate 12 is embedded on this center 11;
Described back of the body lid 2 has an accommodation space 21, and this LCD MODULE 1 is relatively arranged in this accommodation space 21;
Described heat conducting element 3 is arranged at described electronic component 13 and the back of the body covers between 2, this heat conducting element 3 has one first side 31 and one second side 32, the described electronic component 13 of this first side 31 corresponding contact, the described back of the body lid 2 of this second side 32 corresponding contact, wherein, in the first embodiment, this heat conducting element 3 explains with heat pipe, and being shaped as of this heat pipe is U-shaped, S type, L-type heat pipe or its alloytype shape are regardless of;
Wherein, be provided with this LCD MODULE 1 of upper cover 4 cover caps on aforesaid back of the body lid 2, and cover 2 corresponding groups with the described back of the body and establish, these upper cover 4 positions have a transparency carrier 512 again, and this transparency carrier 512 relatively lid is established described LCD MODULE 1.
By the design of this structure of the present invention, utilize the described electronic component 13 of the first side 31 corresponding attaching of described heat conducting element 3, and the described back of the body lid 2 of the second side 32 corresponding attaching of this heat conducting element 3, thus, after the heat energy producing by described heat conducting element 3 these electronic components 13 of absorption, heat energy evenly can be conducted to described back of the body lid 2 and dispel the heat, not have the generation of accumulated heat problem, and then solve the problem of action electronic device heat radiation; In addition, also can be in the confined space of stressing now light, thin, short, little action electronic device can quick heat radiating, enter significantly to promote the radiating efficiency of action electronic device inside.
Refer to Fig. 5, for the three-dimensional exploded view of the second embodiment of mobile electronic device radiator structure of the present invention, described mobile electronic device radiator structure portion of element and interelement corresponding pass are identical with aforesaid mobile electronic device radiator structure, therefore do not repeat them here, only this mobile electronic device radiator structure and aforementioned topmost difference are, the accommodation space 21 of described back of the body lid 2 has more a groove 22, the second side 32 of described heat conducting element 3 is embedded in this groove 22, similarly, utilize the described electronic component 13 of the first side 31 corresponding attaching of described heat conducting element 3, this second side 32 is embedded in this groove 22, absorb the heat energy of this electronic component 13 by this heat conducting element 3, heat energy can be scattered uniformly, do not produce accumulated heat problem, and then the problem of solution action electronic device heat radiation, and can in the confined space, reach quick heat radiating, enter significantly to promote the radiating efficiency of action electronic device inside.
Refer to Fig. 6 and 7, for the three-dimensional exploded view of the 3rd and four embodiment of mobile electronic device radiator structure of the present invention, described mobile electronic device radiator structure portion of element and interelement corresponding pass are identical with aforesaid mobile electronic device radiator structure, therefore do not repeat them here, only this mobile electronic device radiator structure and aforementioned topmost difference are, described heat conducting element 3 explains with heat pipe equally, and the shape of this heat pipe can be L-type heat pipe (as shown in Figure 4) or S type heat pipe (as shown in Figure 5), that is to say, described heat pipe can use according to the difference of the electronic component of action electronic device inside 13 configuration modes the heat pipe of difformity, whereby, can make the heat energy of this electronic component 13 more can scatter uniformly, improve accumulated heat problem, solve the problem of action electronic device heat radiation, and can in the confined space, reach quick heat radiating, enter significantly to promote the radiating efficiency of action electronic device inside.
Refer to Fig. 8 and 9, for the three-dimensional exploded view of the 5th and six embodiment of mobile electronic device radiator structure of the present invention, described mobile electronic device radiator structure portion of element and interelement corresponding pass are identical with aforesaid mobile electronic device radiator structure, therefore do not repeat them here, only this mobile electronic device radiator structure and aforementioned topmost difference are, described heat conducting element 3 is chosen as temperature-uniforming plate, similarly, can utilize the described electronic component 13 of the corresponding attaching of the first side 31 of temperature-uniforming plate, and the described back of the body lid 2 of described the second side 32 corresponding attaching, after the heat energy that so can produce by described heat conducting element 3 these electronic components 13 of absorption, heat energy is evenly conducted to described back of the body lid 2 to dispel the heat, do not have the generation of accumulated heat problem, and then the problem of solution action electronic device heat radiation, in addition, can form described groove 22 (as shown in Figure 9) in the accommodation space of described back of the body lid 2 21, described temperature-uniforming plate is embedded in this groove 22 relatively, by this structure, equally also can reach aforesaid effect.
The continuous Figure 10 that refers to, for the three-dimensional exploded view of the 7th embodiment of mobile electronic device radiator structure of the present invention, described mobile electronic device radiator structure portion of element and interelement corresponding pass are identical with aforesaid mobile electronic device radiator structure, therefore do not repeat them here, only this mobile electronic device radiator structure and aforementioned topmost difference are, four corners of described heat conducting element 3 are more formed with at least one hole 33, 2 pairs, described back of the body lid should be formed with a fixed part 23 in hole 33 places, at least one locking part 6 runs through described hole 33 and fixed part 23, in the present embodiment, described heat conducting element 3 utilizes riveted mode that heat conducting element 3 is fixed on described back of the body lid 2 by this locking part 6, by this structure, equally also can reach aforementioned fixing effect.
Finally, refer to Figure 11 and 12, for the three-dimensional exploded view of the 8th and nine embodiment of mobile electronic device radiator structure of the present invention, described mobile electronic device radiator structure portion of element and interelement corresponding pass are identical with aforementioned mobile electronic device radiator structure, therefore do not repeat them here, only this mobile electronic device radiator structure and aforementioned topmost difference are, described heat conducting element 3 is chosen as high heat-conducting (such as copper, aluminium, graphite, gold, silver or other alloys etc.), similarly, can utilize the described electronic component 13 of the corresponding attaching of the first side 31 of the element of this high heat-conducting, and the described back of the body lid 2 of described the second side 32 corresponding attaching, after the heat energy that so can produce by described heat conducting element 3 these electronic components 13 of absorption, heat energy is evenly conducted to described back of the body lid 2 to dispel the heat, do not have the generation of accumulated heat problem, and then the problem of solution action electronic device heat radiation, in addition, can form described groove 22 (as shown in figure 12) in the accommodation space of described back of the body lid 2 21, the elements relative of described high heat-conducting is embedded in this groove 22, by this structure, equally also can reach aforesaid effect.
The above, the present invention has following advantages compared to prior art:
1. can make the heat energy uniformly dispersing of electronic component;
2. do not produce accumulated heat;
3. significantly promote action electronic device internal heat dissipating efficiency.
Although embodiment of the present invention are open as above, but it is not restricted to listed utilization in description and embodiment, it can be applied to various applicable the field of the invention completely, for those skilled in the art, can easily realize other amendment, therefore do not deviating under the universal that claim and equivalency range limit, the present invention is not limited to specific details and illustrates here and the legend of describing.
Claims (9)
1. a mobile electronic device radiator structure, comprising:
One LCD MODULE, this LCD MODULE one side is provided with a substrate, on this substrate, be provided with toA few electronic component;
One back of the body lid, has an accommodation space, and this LCD MODULE is relatively arranged in this accommodation space;And
At least one heat conducting element, is arranged between described electronic component and back of the body lid this heat conducting element one side pairShould contact described electronic component, the described back of the body lid of the corresponding contact of opposite side.
2. mobile electronic device radiator structure as claimed in claim 1, wherein this LCD MODULE oneThe side center that is more sticked, described substrate is embedded on this center.
3. mobile electronic device radiator structure as claimed in claim 1, wherein this heat conducting element has oneThe first side and one second side, the described electronic component of the corresponding contact of this first side, the corresponding contact of this second side instituteState back of the body lid.
4. mobile electronic device radiator structure as claimed in claim 3, wherein this accommodation space has moreOne groove, the second side of described heat conducting element is embedded in this groove.
5. mobile electronic device radiator structure as claimed in claim 4, wherein this heat conducting element can be heatPipe or temperature-uniforming plate or high heat-conducting are wherein arbitrary.
6. mobile electronic device radiator structure as claimed in claim 5, wherein the shape of this heat pipe can beU-shaped or L-type or S type or its alloytype shape are wherein arbitrary.
7. mobile electronic device radiator structure as claimed in claim 1, wherein this back of the body covers and is provided with oneUpper cover, this this LCD MODULE of upper cover cover cap and cover corresponding group with the described back of the body and establish.
8. mobile electronic device radiator structure as claimed in claim 7, wherein this upper cover position hasOne transparency carrier, this transparency carrier relatively lid is established described LCD MODULE.
9. mobile electronic device radiator structure as claimed in claim 5, wherein four corners of this heat conducting elementMore be formed with at least one hole, described back of the body lid is to being formed with a fixed part in hole place, at least one lockingPart runs through described hole and fixed part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410674963.XA CN105682418B (en) | 2014-11-20 | 2014-11-20 | Mobile electronic device radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410674963.XA CN105682418B (en) | 2014-11-20 | 2014-11-20 | Mobile electronic device radiator structure |
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| Publication Number | Publication Date |
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| CN105682418A true CN105682418A (en) | 2016-06-15 |
| CN105682418B CN105682418B (en) | 2018-09-25 |
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| CN201410674963.XA Active CN105682418B (en) | 2014-11-20 | 2014-11-20 | Mobile electronic device radiator structure |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106455422A (en) * | 2016-09-21 | 2017-02-22 | 奇鋐科技股份有限公司 | Heat dissipation structure of handheld device |
| CN107664453A (en) * | 2016-07-29 | 2018-02-06 | 双鸿科技股份有限公司 | Electronic installation with loop hot-pipe |
| CN107979942A (en) * | 2016-10-21 | 2018-05-01 | 东莞爵士先进电子应用材料有限公司 | The thermal dispersant coatings structure of portable electronic devices |
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| CN104039115A (en) * | 2014-05-14 | 2014-09-10 | 中山伟强科技有限公司 | Mobile phone heat dissipation module |
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| CN203327470U (en) * | 2013-07-23 | 2013-12-04 | 奇鋐科技股份有限公司 | Heat radiation structure of hand-held mobile device |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107664453A (en) * | 2016-07-29 | 2018-02-06 | 双鸿科技股份有限公司 | Electronic installation with loop hot-pipe |
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| CN107979942A (en) * | 2016-10-21 | 2018-05-01 | 东莞爵士先进电子应用材料有限公司 | The thermal dispersant coatings structure of portable electronic devices |
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| CN105682418B (en) | 2018-09-25 |
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