TWM496156U - Heat dissipating structure of mobile electronic device - Google Patents

Description

Mobile electronic device heat dissipation structure

The present invention relates to a mobile electronic device heat dissipation structure that can help the thermal energy of the electronic component to be evenly distributed without generating heat accumulation, and to achieve rapid heat dissipation inside the mobile electronic device.

In the development of electronic devices, the increasingly higher computing performance and processing chips with high computing clocks have become the trend of today. In addition, the development of electronic devices needs to be designed with lightness and thinness, but at the same time, it must achieve high computing efficiency. Under the trend of light and short design, the relative heat dissipation efficiency of the electronic device is relatively more difficult.

When the prior art electronic device is in operation, and the internal wafer or processor is operated or processed, the temperature of the wafer or the processor itself is increased, thereby generating excess heat, for example, for a thin mobile device, such as Handheld mobile devices, such as ultra-thin notebook computers, tablet computers, smart phones, etc., have mainly used simple opening, heat conduction, thermal convection, etc., but these heat dissipation methods can not load today's high-performance chips or The heat generated by the processor.

However, as the current handheld mobile devices become more efficient, their internal central processing units move toward dual-core or quad-core and even higher performance, and the faster the processing power of the central processing unit is, the faster the heat is generated. It is also bound to become higher and higher, so the conventional hand-held mobile device has a problem of heat accumulation, and the heat energy cannot be uniformly distributed, resulting in a reduction in heat dissipation efficiency inside the hand-held mobile device.

As mentioned above, the conventional disadvantages have the following disadvantages:

1. Thermal energy cannot be evenly distributed;

2. There will be heat accumulation problems;

3. Reduce the internal heat dissipation efficiency of the mobile electronic device.

Therefore, how to solve the above problems and problems in the past, that is, the creators of the case and the relevant manufacturers engaged in this industry are eager to study the direction of improvement.

Therefore, in order to effectively solve the above problems, the main purpose of the present invention is to provide a heat dissipation structure of a mobile electronic device that can help the thermal energy of the electronic component to be uniformly distributed without generating heat.

The second objective of this creation is to provide a heat dissipation structure for mobile electronic devices that can greatly improve the rapid heat dissipation inside the mobile electronic device.

In order to achieve the above object, the present invention provides a heat dissipation structure for a mobile electronic device, comprising a liquid crystal display module, a back cover and at least one heat conducting component, and a substrate is disposed on one side of the liquid crystal display module, and the substrate is provided with at least An electronic component, the back cover has an accommodating space, the liquid crystal display module is disposed opposite to the accommodating space, and the heat conducting component is disposed between the electronic component and the back cover, and the heat conducting component side corresponds to The electronic component is contacted, and the other side is in contact with the back cover.

Through the design of the structure of the present invention, one side of the heat conducting element is in contact with the electronic component, and the other side is correspondingly connected to the back cover. Through the arrangement of the heat conducting element, the heat energy generated by the electronic component can be assisted. Uniform conduction to the back cover for heat dissipation, there is no problem of heat accumulation, in addition, it can also achieve the effect of improving the rapid heat dissipation inside the mobile electronic device.

1‧‧‧LCD module

11‧‧‧ middle frame

12‧‧‧Substrate

13‧‧‧Electronic components

2‧‧‧Back cover

21‧‧‧ accommodating space

22‧‧‧ Groove

23‧‧‧ Fixed Department

3‧‧‧thermal element

31‧‧‧ first side

32‧‧‧ second side

33‧‧‧ holes

4‧‧‧Upper cover

5‧‧‧Transparent substrate

6‧‧‧Locker

1 is an exploded perspective view of a first embodiment of a heat dissipation structure of a creative mobile electronic device;

2 is a three-dimensional combination diagram of the first embodiment of the heat dissipation structure of the creation mobile electronic device;

3 is a combined sectional view of the first embodiment of the heat dissipation structure of the authoring mobile electronic device;

4 is an enlarged cross-sectional view showing a first embodiment of the heat dissipation structure of the electronic device of the authoring action;

Figure 5 is a perspective exploded view of the second embodiment of the heat dissipation structure of the electronic device of the authoring action;

Figure 6 is a perspective exploded view of the third embodiment of the heat dissipation structure of the electronic device of the authoring action;

Figure 7 is a perspective exploded view of a fourth embodiment of the heat dissipation structure of the electronic device of the authoring action;

Figure 8 is a perspective exploded view of the fifth embodiment of the heat dissipation structure of the electronic device of the authoring action;

Figure 9 is a perspective exploded view of the sixth embodiment of the heat dissipation structure of the authoring mobile electronic device;

Figure 10 is a perspective exploded view of a seventh embodiment of the heat dissipation structure of the electronic device of the present invention;

Figure 11 is an exploded perspective view showing an eighth embodiment of the heat dissipation structure of the electronic device of the present invention;

Figure 12 is a perspective exploded view of the ninth embodiment of the heat dissipation structure of the authoring mobile electronic device.

The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.

Please refer to Figures 1 and 2 and Figures 3 and 4, which are perspective exploded view, combined sectional view and enlarged cross-sectional view of the first embodiment of the heat dissipation structure of the electronic device for creating a mobile device, as shown in the figure, a mobile electronic device. The heat dissipation structure of the device includes a liquid crystal display module 1 and a back cover 2 and at least one heat-conducting component 3, and a substrate 12 is disposed on one side of the liquid crystal display module 1, and at least one electronic component 13 is disposed on the substrate 12. ;

The middle of the liquid crystal display module 1 is further disposed with a middle frame 11 , and the substrate 12 is embedded on the middle frame 11;

The back cover 2 has an accommodating space 21, and the liquid crystal display module 1 is disposed opposite to the accommodating space 21;

The heat conducting component 3 is disposed between the electronic component 13 and the back cover 2 . The heat conducting component 3 has a first side 31 and a second side 32 . The first side 31 corresponds to the electronic component 13 . The second side 32 corresponds to the back cover 2, wherein in the first embodiment, the heat conducting element 3 is described by a heat pipe, and the shape of the heat pipe is U-shaped, S-shaped, L-shaped heat pipe or other shapes. ;

The back cover 2 is provided with an upper cover 4 to cover the liquid crystal display module 1 and is disposed corresponding to the back cover 2, and the upper cover 4 has a transparent substrate 5 at the position of the upper cover 4, and the transparent substrate 5 is opposite. The liquid crystal display module 1 is covered.

The first side 31 of the heat conducting element 3 is correspondingly attached to the electronic component 13 by the design of the structure, and the second side 32 of the heat conducting component 3 is correspondingly attached to the back cover 2, thus After the thermal energy generated by the electronic component 13 is absorbed by the heat conducting component 3, heat energy can be uniformly transmitted to the back cover 2 for heat dissipation, and no heat accumulation problem occurs, thereby solving the problem of heat dissipation of the mobile electronic device; In addition, it can quickly dissipate heat in the limited space of mobile electronic devices that are light, thin, short, and small, and greatly improve the heat dissipation efficiency inside the mobile electronic device.

Please refer to FIG. 5 , which is a perspective exploded view of a second embodiment of the heat dissipation structure of the mobile electronic device, and the corresponding relationship between the components and components of the heat dissipation structure of the mobile electronic device and the foregoing mobile electronic device. The heat dissipation structure is the same, so it will not be described here. However, the main difference between the heat dissipation structure of the mobile electronic device and the foregoing is that the accommodating space 21 of the back cover 2 further has a recess 22, and the heat conducting component 3 is The two sides 32 are embedded in the recess 22, and the first side 31 of the heat conducting component 3 is correspondingly attached to the electronic component 13. The second side 32 is embedded in the recess 22, By absorbing the thermal energy of the electronic component 13 through the heat conducting component 3, the thermal energy can be uniformly distributed without generating heat accumulation problem, thereby solving the problem of heat dissipation of the mobile electronic device, and achieving rapid heat dissipation in a limited space, thereby greatly increasing the action. Heat dissipation efficiency inside the electronic device.

Please refer to FIG. 6 and FIG. 7 , which are perspective exploded views of the third and fourth embodiments of the heat dissipation structure of the mobile electronic device, and the corresponding relationship between the components and components of the heat dissipation structure of the mobile electronic device and the foregoing The heat dissipation structure of the mobile electronic device is the same, so it will not be described here. However, the main difference between the heat dissipation structure of the mobile electronic device and the foregoing is that the heat conduction element 3 is also described by a heat pipe, and the shape of the heat pipe can be An L-shaped heat pipe (as shown in Fig. 6) or an S-type heat pipe (as shown in Fig. 7), that is, the heat pipe system can use different shapes according to the arrangement of the electronic components 13 inside the mobile electronic device. The heat pipe can thereby make the thermal energy of the electronic component 13 more evenly distributed, improve the heat accumulation problem, solve the problem of heat dissipation of the mobile electronic device, and achieve rapid heat dissipation in a limited space, thereby greatly improving the mobile electronic device. Internal heat dissipation efficiency.

Please refer to FIGS. 8 and 9 for an exploded perspective view of the fifth and sixth embodiments of the heat dissipation structure of the mobile electronic device. The corresponding relationship between the components and components of the heat dissipation structure of the mobile electronic device is as described above. The heat dissipation structure of the mobile electronic device is the same, so it will not be described here. However, the main difference between the heat dissipation structure of the mobile electronic device and the foregoing is that the heat conduction element 3 is selected as a temperature equalization plate, and similarly, the temperature equalization plate can be utilized. The first side 31 is correspondingly attached to the electronic component 13 , and the second side 32 is correspondingly attached to the back cover 2 , so that the heat energy generated by the electronic component 13 can be absorbed by the heat conducting component 3 . The heat is uniformly transmitted to the back cover 2 for heat dissipation, and no heat accumulation problem occurs, thereby solving the problem of heat dissipation of the mobile electronic device. In addition, the groove can be formed in the accommodating space 21 of the back cover 2 22 (as shown in FIG. 9), the temperature equalizing plate is relatively embedded in the recess 22, and the same effect can be achieved by transmitting the structure.

Continuing to refer to FIG. 10 , which is a perspective exploded view of a seventh embodiment of the heat dissipation structure of the electronic device of the present invention, the corresponding relationship between components and components of the heat dissipation structure of the mobile electronic device and the aforementioned mobile electronic The heat dissipation structure of the device is the same, so it will not be described here. However, the main difference between the heat dissipation structure of the mobile electronic device and the foregoing is that at least one hole 33 is formed in the fourth heat conducting component 3, and the back cover 2 corresponds to the hole. A fixing portion 23 is formed at 33, and at least one fastener 6 extends through the hole 33 and the fixing portion 23. In the embodiment, the heat conducting element 3 is fixed to the heat conducting element 3 through the locking member 6 by riveting. With the structure, the back cover 2 can also achieve the aforementioned effect of fixing.

Finally, please refer to the 11th and 12th drawings, which are perspective exploded views of the eighth and ninth embodiments of the heat dissipation structure of the mobile electronic device, and the corresponding components of the heat dissipation structure of the mobile electronic device and the corresponding relationship between the components The heat dissipation structure of the mobile electronic device is the same as that of the above-mentioned mobile electronic device, and therefore, the main difference between the heat dissipation structure of the mobile electronic device and the foregoing is that the thermal conductive component 3 is selected as a high thermal conductive material (such as copper, aluminum, graphite). , gold, silver or other alloys, etc., similarly, the first side 31 of the element of the high thermal conductivity material can be attached to the electronic component 13 correspondingly, and the second side 32 is correspondingly attached to the back cover 2. After the thermal energy generated by the electronic component 13 is absorbed by the heat conducting component 3, the heat energy is uniformly transmitted to the back cover 2 for heat dissipation, and no heat accumulation problem occurs, thereby solving the heat dissipation of the mobile electronic device. In addition, the recess 22 (shown in FIG. 12) may be formed in the accommodating space 21 of the back cover 2, and the components of the high thermal conductive material are relatively embedded in the recess 22, The structure, the same It can also achieve the aforementioned effects.

As mentioned above, this creation has the following advantages over the prior art:

1. The thermal energy of the electronic component can be evenly distributed;

2. No heat build-up;

3. Significantly improve the internal heat dissipation efficiency of mobile electronic devices.

The present invention has been described in detail above, but the above description is only a preferred embodiment of the present invention, and the scope of the present invention cannot be limited. That is, all changes and modifications made in accordance with the scope of this creation application shall remain covered by the patents of this creation.

1‧‧‧LCD module

11‧‧‧ middle frame

12‧‧‧Substrate

13‧‧‧Electronic components

2‧‧‧Back cover

21‧‧‧ accommodating space

3‧‧‧thermal element

31‧‧‧ first side

32‧‧‧ second side

4‧‧‧Upper cover

5‧‧‧Transparent substrate

Claims (9)

[Item 1] A mobile electronic device heat dissipation structure includes:
A liquid crystal display module is disposed on one side of the liquid crystal display module, and the substrate is provided with at least one electronic component; a back cover has an accommodating space, and the liquid crystal display module is oppositely disposed in the accommodating space And the at least one heat conducting component is disposed between the electronic component and the back cover, the conductive element side correspondingly contacting the electronic component, and the other side correspondingly contacting the back cover. [Item 2] The heat dissipation structure of the mobile electronic device of claim 1, wherein a side of the liquid crystal display module is further disposed on a side of the liquid crystal display module, and the substrate is embedded in the middle frame. [Item 3] The mobile electronic device heat dissipation structure according to claim 1, wherein the heat conduction element has a first side and a second side, the first side correspondingly contacting the electronic component, and the second side correspondingly contacting the Back cover. [Item 4] The mobile electronic device heat dissipation structure of claim 3, wherein the accommodating space further has a recess, and the second side of the heat conducting component is embedded in the recess. [Item 5] The heat dissipation structure of the mobile electronic device according to claim 4, wherein the heat conduction component is any one of a heat pipe or a temperature equalization plate or a high thermal conductivity material. [Item 6] The mobile electronic device heat dissipation structure according to claim 5, wherein the shape of the heat pipe is U-shaped or L-shaped or S-shaped or other shapes. [Item 7] The mobile electronic device heat dissipation structure of claim 1, wherein the back cover is provided with an upper cover, the upper cover covers the liquid crystal display module and is disposed corresponding to the back cover. [Item 8] The mobile electronic device heat dissipation structure of claim 7, wherein the upper cover has a transparent substrate, and the transparent substrate is opposite to the liquid crystal display module. [Item 9] The mobile electronic device heat dissipation structure of claim 5, wherein the heat conduction element is further formed with at least one hole, and the back cover is formed with a fixing portion corresponding to the hole, and at least one fastener passes through the hole. And fixed parts.