CN106455411A - Heat dissipation buffering conductive composite forming structure of mobile electronic device - Google Patents
Heat dissipation buffering conductive composite forming structure of mobile electronic device Download PDFInfo
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- CN106455411A CN106455411A CN201510564601.XA CN201510564601A CN106455411A CN 106455411 A CN106455411 A CN 106455411A CN 201510564601 A CN201510564601 A CN 201510564601A CN 106455411 A CN106455411 A CN 106455411A
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- shell support
- radiating
- film
- buffering
- electronic apparatus
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- 230000003139 buffering effect Effects 0.000 title claims abstract description 27
- 239000002131 composite material Substances 0.000 title claims abstract description 21
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 8
- 238000000465 moulding Methods 0.000 claims abstract description 24
- 230000000694 effects Effects 0.000 claims abstract description 11
- 150000001875 compounds Chemical class 0.000 claims description 26
- 239000004973 liquid crystal related substance Substances 0.000 claims description 21
- 238000002955 isolation Methods 0.000 claims description 15
- 230000005855 radiation Effects 0.000 claims description 12
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 9
- 239000011148 porous material Substances 0.000 claims description 9
- 238000012546 transfer Methods 0.000 claims description 6
- 230000004308 accommodation Effects 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229920000742 Cotton Polymers 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000005030 aluminium foil Substances 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 239000006185 dispersion Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 abstract description 4
- 239000002699 waste material Substances 0.000 abstract description 3
- 238000009413 insulation Methods 0.000 abstract 1
- 239000012528 membrane Substances 0.000 abstract 1
- 239000010408 film Substances 0.000 description 59
- 210000003660 reticulum Anatomy 0.000 description 9
- 239000000872 buffer Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000011469 building brick Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000011324 bead Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
A heat dissipation buffering conductive composite molding structure of a mobile electronic device comprises: especially indicate a collection heat dissipation buffering electrically conductive composite forming structure in an organic whole, it includes that a transparent substrate and back lid combine relatively through a mesochite support, its characterized in that: the composite diaphragm is integrally molded (insert molding) with the middle shell support to form the composite diaphragm which is integrally molded and embedded and fixed on the middle shell support, so that the thickness in the Z-axis direction is reduced, an assembly work station is reduced, the assembly labor is saved, the assembly time is shortened, and the assembly cost is reduced; the waste of the membrane caused by poor assembly can be reduced, and the assembly yield is improved; and the mobile electronic device integrates the functions of heat dissipation, buffering, electric conduction and heat insulation, and has the effects of keeping the reliability of the mobile electronic device and saving the cost.
Description
Technical field
The present invention is the conductive composite molding structure of radiating buffering about a kind of electronic apparatus, especially
Refer to a kind of combination radiating, buffering, conductive, heat-insulated four functions in the composite molding structure of one.
Background technology
The electronic apparatus such as smart mobile phone, panel computer, its by double-core, four cores,
Eight cores etc. develop into the process chip of more and more high operation frequency；And electronic apparatus send out
Exhibition be with short and small frivolous as designer trends, therefore frivolous double with short and small for high operation efficiency can be reached
Important ask, the radiating efficiency of electronic apparatus is increasingly important.
Secondary person, the radiating mode of current electronic apparatus, mainly use simple perforate, lead
The modes such as heat, thermal convection current, but those radiating modes with cannot load high-effect chip is produced now
Heat energy, therefore have the problem of accumulated heat, heat energy cannot uniformly dispersing, lead to reduce mobile electron
Radiating efficiency within device.
Press, the chip of usual electronic equipment is operationally main heating source again, radiating not only for
Reduce chip own temperature with ensure its can within the temperature range of requiring normal work, simultaneously also will
Take into account and housing hot-spot during radiating, can not be caused, cause bad experience to consumer.
Therefore No. 496156 patent of the new M of TaiWan, China, disclose a kind of electronic apparatus radiating
Structure, it includes a fore shell support 11, liquid crystal display module 12 and a bonnet 16 and a heat-conductive assembly
15, this liquid crystal display module 12 side is provided with a substrate 14, and this substrate 14 is provided with least one electricity
Sub-component 141, this bonnet 16 has an accommodation space 161, and this liquid crystal display module 12 side is sticked
One center 13, this substrate 14 is embedded on this center 13, and this heat-conductive assembly 15 is arranged at described electronics
Between assembly 141 and bonnet 16, this heat-conductive assembly 15 side is corresponding to contact described electronic building brick 141,
Opposite side is corresponding to contact described bonnet 16；Uniform thermal power so as to helping this electronic building brick 121 spreads not
Produce accumulated heat.But look into, after it is manufactured with bonnet 16 respectively as the heat-conductive assembly 15 radiating, then will
Heat-conductive assembly 15 binds still to be had in bonnet 16 inner edge surface, therefore its radiating efficiency or electronic shield function
Weak point, it does not disclose the buffer structure protecting this liquid crystal display module 12 in addition, therefore still has
Improve space.
Additionally, in current mobile phones design, in order to protect LCD be subject in use impulsive force not by
Damage, solve heating during LCD uses excessively affects performance simultaneously, and traditional design is patch below LCD
Dress foam is used for cushion impact forces, and attachment conducting film is used for radiating, but, so need to arrange one
Special assembling station, assembly cost is higher, increases Z-direction thickness.
Therefore solving the problems referred to above point of traditional electronic apparatus, it is the major subjects of the present invention.
Content of the invention
Technical problem underlying to be solved by this invention is, overcomes the above-mentioned of prior art presence to lack
Fall into, and provide a kind of radiating of electronic apparatus to buffer conductive composite molding structure, it combines and dissipates
Heat, buffering, conductive, heat-insulated four work(are used for one, and one build-in are scheduled on fore shell support,
There is saving group device (man power vehicle), shorten built-up time, reduce assembly cost, improve assembling yield, fall
Effect of low Z-direction thickness；It combines radiating, buffering, conductive three work(for one, tool
There is the reliability that can keep electronic apparatus, and can be cost-effective.
The technical solution adopted for the present invention to solve the technical problems is：
A kind of radiating buffering conductive composite molding structure of electronic apparatus, including：One transparent base
Plate；One liquid crystal display module, is located at the lower section of this transparency carrier；Shell support in one, is located at this liquid
The lower section of brilliant display module；One circuit board, is located at the lower section of shell support in this, thereon at least provided with
One electronic chip；Battery, is located at the lower section of shell support in this；And a bonnet, relatively combine and exist
The root edge of shell support in this, it has an accommodation space, in order to receive aforesaid component；
It is characterized in that：One compound film sheet, by a cushion, a thermal isolation film and a conductive radiator film
From top to bottom overlapping constituted, this compound film sheet and this in shell support single moulded piece (insert
Molding), form this compound film sheet build-in to be scheduled on shell support in this, and this conduction of lower floor dissipates
The surface of hotting mask at least exposes at conductive radiator face surface of shell support in this.
According to front taking off feature, in possible embodiments, this compound film sheet be located in this shell support with should
Between liquid crystal display module, form the upper surface that this compound film sheet build-in is scheduled on shell support in this, and
In this, the surface book office of shell support is provided with a perforate, and this perforate exposes leading of this conductive radiator film
Electric radiating surface, for radiating, this cushion supplies this liquid crystal display module to buffer and in this, shell props up simultaneously
Between frame and this electronic chip last together with heat resistant layer be used.
In another possible embodiments, this compound film sheet is located at shell support and this this liquid crystal display mode in this
Between, and in this, the surface of shell support is no open-celled structure, forms this compound film sheet build-in and is scheduled on this
The lower surface of middle shell support.
According to front taking off feature, in this, shell support is constituted by a plastic parts, fixes this liquid upwards simultaneously
Brilliant display module, fixes downwards this circuit board；It is provided with surface mount technology (SMT) on this circuit board
One radome (shielding can), the cover of this radome (shielding can) contacts this and leads
The conductive radiator face of electric heat dissipation film；The electronic chip of this circuit board is provided with an insulating radiation piece, uses
To provide this heat dissipation of electronic chip, intercept this radome simultaneously and contact with this electronic chip, play absolutely
Edge acts on；And this electronic chip contacts this insulating radiation piece, in order to by the heat edge of this electronic chip
Vertical direction is communicated up, and the heat transfer of this electronic chip output is gone out, and so that this radome is passed
The heat coming transversely go out by horizontal dispersion, and stops this outside spoke of conductive radiator film with this thermal isolation film
Penetrate heat.
According to front taking off feature, this insulating radiation piece can be made up of the aluminium oxide adding silica gel；This is led
Electric heat dissipation film is Copper Foil, aluminium foil or graphite flake；This cushion is foamed cotton layer, rubber layer or Thin Elastic
Film layer；This thermal isolation film can be a flat film having microcellular structure or on the basis of this flat film
It is machined with the perforated film of several pores, pore space structure.
By above taking off technological means, traditional injection lid is changed to be molded into being integrally formed by the present invention,
That is, it, first by the up of three layers compound film sheet of this cushion, thermal isolation film and conductive radiator film, is placed on
In mould with this in shell support be integrally formed, according to this reduce one assembling station, saving group device (man power vehicle),
Shorten built-up time, reduce assembly cost, reduce Z-direction thickness；And can reduce because of assembling
The bad diaphragm bringing wastes, and improves effect of assembling yield.And it combines and radiates, buffers, leading
Electric, heat-insulated four work(are used for one, have the reliability that can keep electronic apparatus, and energy
Cost-effective effect.
The invention has the beneficial effects as follows, its combination radiating, buffering, conductive, heat-insulated four work(are used for
Integrally, and by one build-in it is scheduled on fore shell support, there is saving group device (man power vehicle), shorten built-up time,
Reduce assembly cost, improve assembling yield, reduce effect of Z-direction thickness；Its combination radiating,
Buffering, conductive three work(are used for one, have the reliability that can keep electronic apparatus, and
Can be cost-effective.
Brief description
The present invention is further described with reference to the accompanying drawings and examples.
Figure 1A is a kind of exploded perspective view of existing electronic apparatus radiator structure.
Figure 1B is a kind of combination stereogram of existing electronic apparatus radiator structure.
Fig. 1 C is a kind of sectional view of existing electronic apparatus radiator structure.
Fig. 1 D is the enlarged drawing shown in 1D in Fig. 1 C.
Fig. 2 is the exploded perspective view of the present invention first possible embodiments.
Fig. 3 is the combination stereogram of the present invention first possible embodiments.
Fig. 4 is the sectional view of the present invention first possible embodiments.
Fig. 5 is the exploded perspective view of the present invention second possible embodiments.
Fig. 6 is the combination stereogram of the present invention second possible embodiments.
Fig. 7 is the sectional view of the present invention second possible embodiments.
Fig. 8 is the enlarged drawing of 8 indications in Fig. 7.
Fig. 9 is the exploded perspective view of the present invention the 3rd possible embodiments.
Figure 10 is the combination stereogram of the present invention the 3rd possible embodiments.
Figure 11 is the sectional view of the present invention the 3rd possible embodiments.
Figure 12 is the exploded perspective view of the present invention the 4th possible embodiments.
Figure 13 is the combination stereogram of the present invention the 4th possible embodiments.
Figure 14 is the sectional view of the present invention the 4th possible embodiments.
Figure 15 is the enlarged drawing of 15 indications in Figure 14.
In figure label declaration：
20 transparency carriers
21 Printing Zones
22nd, shell support in 22a, 22b, 22c, 22d
221 perforates
222 inside casing faces
223 neighborings
30 liquid crystal display modules
40 circuit boards
41 electronic chips
50 batteries
60 bonnets
61 accommodation spaces
70 compound film sheets
71 cushions
72 thermal isolation film
721 pores, pore space structure
73 conductive radiator films
80 radomes
81 covers
90 insulating radiation pieces
Specific embodiment
First, refer to shown in Fig. 2～Fig. 4, disclosed herein electronic apparatus radiating
The conductive composite molding structure of buffering, its first possible embodiments includes：One transparency carrier 20, its periphery
One nontransparent Printing Zone 21 can be provided with edge, but be not limited to this；One liquid crystal display module 30,
It is located at the lower section of this transparency carrier 20；Shell support 22 in one, is located under this liquid crystal display module 30
Side；One circuit board 40, is located at the lower section of shell support 22 in this, thereon at least provided with an electronic chip
41；One battery 50, is located at the lower section of shell support 22 in this；And a bonnet 60, by shell in this
Support 22a combines relatively in this transparency carrier 20 root edge, and it has an accommodation space 61, in order to receive
Aforesaid component；But, above take off component and belong to prior art (Prior Art), the patent mesh of non-invention
, hold and do not repeat.
The present invention is characterized in：One compound film sheet 70, is a cushion 71, a thermal isolation film
72 and one conductive radiator film 73 from top to bottom overlap and constituted, this compound film sheet 70 with this in shell support
22 single moulded pieces (insert molding), form this compound film sheet 70 build-in and are scheduled on shell in this
On support 22, and the surface of this conductive radiator film 73 at least exposes a conductive radiator face 731 in this
The surface book office of shell support 22.In the present embodiment, in this, shell support 22 is formed in one and has
The middle shell support 22a of the unitary type in one inside casing face 222.
Fig. 4 is the sectional view of the present invention first possible embodiments, and this transparency carrier 20 is located at shell in this and props up
On the inside casing face 222 of frame 22a, this compound film sheet 70 is located at shell support 22a and this liquid crystal display mode in this
Between group 30, form the upper surface that this compound film sheet 70 build-in is scheduled on shell support 22a in this, and in this
The surface book office of shell support 22a is provided with a perforate 221, and this perforate 221 exposes this conductive radiator film
73 conductive radiator face 731, with for radiating, this cushion 71 is for this liquid crystal display module 30 simultaneously
Buffering and last between shell support 22a and this electronic chip 41 in this together with heat resistant layer.
Fig. 5～Fig. 8 is the present invention second possible embodiments, and it is same as the structure of the first possible embodiments
Make and represented with same reference numbers, its difference is only that：In this, shell support 22b includes combining one in its periphery
The framework 23 of independent molding is constituted.That is, in the first possible embodiments, in this, shell support 22a is
It is integrally formed and has simultaneously the inside casing face 222 of framework function, and in the present embodiment, this framework 23 is
Independent molding is fixed in shell support 22b in this again and props up the middle shell support 22 being constituted on neighboring 223,
As shown in Figure 7.
Refer to shown in Fig. 9～Figure 11, it discloses the present invention the 3rd possible embodiments, it is same as the
The structure of one possible embodiments is represented with same reference numbers, and its difference is only that：This compound film sheet 70
In this between shell support 22 and this this circuit board 40, in the present embodiment, in this, shell support 22 is table
The middle shell support 22 of face no open-celled structure forms this compound film sheet 70 build-in and is scheduled on shell support 22c in this
Lower surface.
Shown in Figure 12～Figure 15, it is to disclose the present invention the 4th possible embodiments, and it is same as the 3rd can
The structure of row embodiment is represented with same reference numbers, and its difference is only that：In this, shell support 22d includes
Its periphery is constituted with reference to the framework 23 of an independent molding, and this framework 23 is fixed in for independent molding again
On the neighboring 223 of shell support 22d in this, as shown in figure 14.
On take off in embodiment, in this, shell support 22 can be constituted by a plastic parts, fix upwards simultaneously
This liquid crystal display module 30, fixes downwards this circuit board 40；With surface mount on this circuit board 40
Technology (SMT) is provided with a radome (shielding can) 80, this radome (shielding
Can) 80 cover 81 contacts the conductive radiator face 731 of this conductive radiator film 73；This circuit board 40
It is provided with an insulating radiation piece 90, in order to provide this electronic chip 41 to radiate, intercept this shielding simultaneously
Cover 80 is contacted with this electronic chip 41, plays insulating effect；And the contact of this electronic chip 41 this is exhausted
Edge fin 90, in order to be vertically communicated up the heat of this electronic chip 41, by this electricity
The heat transfer of sub- chip 41 output is gone out, and makes the heat transversely level that this radome 80 transmits
Spread out, and this outside radiations heat energy of conductive radiator film 73, this reality are stoped with this thermal isolation film 72
Apply in example, this insulating radiation piece 90 can be made up of the aluminium oxide adding silica gel, but is not limited to this.
Hold, this conductive radiator film 73, in order to lateral transport heat, reaches Homogeneouslly-radiating, this enforcement
In example, this conductive radiator film of this conductive radiator film 73 is Copper Foil, aluminium foil or graphite flake, but does not limit
In this.
Additionally, cover above this conductive radiator film 73 being provided with one layer of thermal isolation film 72, in order to stop
This outside radiations heat energy of conductive radiator film 73, in case user feel is overheated, in the present embodiment, should
Thermal isolation film 72 is that have the heat-insulated of microcellular structure with what PET material interpolation hollow glass bead foamed
Thin film, or process and have the thin film of heat insulating function using other materials or technique, it both may be used
Be plane can also be through perforation processing, to there are several gas on the basis of this flat film
Hole, the thin film of pore space structure 721, its thermal resistance principle mainly uses the air layer in its internal capillary
And after air layer in the hole that adds condensing air, using the big characteristic of air conduction coefficient
Form thermoresistance layer, this thermoresistance layer can affect heat direction of transfer, enable heat uniformly dispersing and control
To stop heat further to housing external diffusion in thermoresistance layer, but it is not limited to this.
Furthermore, the outside of this thermal isolation film 72 be provided with one layer of cushion 71 (material can for rubber,
The elastomeric cushion materials such as foam), in order to protect this liquid crystal display module 30, reach buffering and prevent
Heat transfer effect to outside housing, in the present embodiment, this cushion 721 is foamed cotton layer, rubber layer
Or elastic film layer, but it is not limited to this.
Please simultaneously referring again to the enlarged drawing shown in Fig. 8 and Figure 15, this compound film sheet 70 build-in is scheduled in this
Shell support 20, as longitudinally heat transfer and electromagnetic shielding medium, improves shell support 20 heat conduction in this bad
Problem, and the heat that this electronic chip 41 is sent continues along longitudinally passing, and then will be from this
The heat that electronic chip 41 transmits passes through this insulating radiation piece 90 and this radome 80 is longitudinally sent to this
The conductive radiator film 73 of compound film sheet 70, then passing through this, conductive radiator film 73 is horizontally-parallel spread out
Come, reach Homogeneouslly-radiating；Furthermore in this thermal isolation film 72, its both can be plane can also be
Through perforation processing there are several pores on the basis of this flat film, pore space structure 721 thin
Film, its effect can stop heat from continuing to housing external diffusion, and it is overheated to be caused with exempt from customs examination user
Bad experience, and with this cushion 71, provide cushioning effect to have concurrently heat-insulated, protect this liquid crystal
Display module 30；Whereby, the present invention has with reference to radiating, buffering, conductive, heat-insulated four functions
In one, the reliability of electronic apparatus both can be kept, and the cost-effective effect of energy.
By above taking off technological means, traditional injection lid is changed to by the present invention with shell support 22 in this
It is molded into being integrally formed, that is, it is first by the three of this cushion 71, thermal isolation film 72 and conductive radiator film 73
Layer composition compound film sheet 70, put in a mold with this in shell support 22 be integrally formed, to reduce one
Assembling station, saving group device (man power vehicle), shortens built-up time, reduces assembly cost, reduce Z-direction
Thickness；And can reduce because of assembly failure (diaphragm off normal or deformation need to tear to re-assembly)
The diaphragm bringing wastes, and improves assembling yield.
The above, be only presently preferred embodiments of the present invention, and not the present invention is made with any shape
Restriction in formula, it is any simple that every technical spirit according to the present invention is made to above example
Modification, equivalent variations and modification, all still fall within the range of technical solution of the present invention.
In sum, the present invention, in structure design, using in practicality and cost benefit, accords with completely
Close needed for industry development, and disclosed structure is also to have unprecedented innovative structure, has
Novelty, creativeness, practicality, meet the regulation about patent of invention important document, therefore lift in accordance with the law
Application.
Claims (10)
1. the conductive composite molding structure of radiating buffering of a kind of electronic apparatus, including：
One transparency carrier, can be provided with a Printing Zone thereon；
One liquid crystal display module, is located at the lower section of this transparency carrier；
Shell support in one, is located at the lower section of this liquid crystal display module；
One circuit board, is located at the lower section of shell support in this, thereon at least provided with an electronic chip；
One battery, is located at the lower section of shell support in this；And
One bonnet, combines the root edge of shell support in this, it has an accommodation space relatively, in order to
Receive aforesaid component；It is characterized in that：
One compound film sheet, is from top to bottom overlapped by a cushion, a thermal isolation film and a conductive radiator film
Form, this compound film sheet with this in shell support single moulded piece, form this compound film sheet build-in fixed
On shell support in this, and the surface of this conductive radiator film of lower floor at least exposes a conductive radiator
At the surface of shell support in this of face.
2. the radiating buffering conductive composite molding knot of electronic apparatus according to claim 1
Structure it is characterised in that described compound film sheet be located at this between shell support and this liquid crystal display module,
Form the upper surface that this compound film sheet build-in is scheduled on shell support in this, and in this shell support surface pre-
Determine place and be provided with a perforate, this perforate exposes the conductive radiator face of this conductive radiator film, for radiating,
Simultaneously this cushion supply this liquid crystal display module buffering and in this between shell support and this electronic chip
One heat resistant layer is used afterwards.
3. the radiating buffering conductive composite molding knot of electronic apparatus according to claim 2
Structure is it is characterised in that described middle shell support is additionally included in its periphery and is provided with a framework.
4. the radiating buffering conductive composite molding knot of electronic apparatus according to claim 1
Structure it is characterised in that described compound film sheet be located at this between shell support and this this circuit board, and
In this, the surface of shell support is no open-celled structure, forms this compound film sheet build-in and is scheduled on shell support in this
Lower surface.
5. the radiating buffering conductive composite molding knot of electronic apparatus according to claim 4
Structure is it is characterised in that described middle shell support is additionally provided with a framework in its periphery.
6. the radiating buffering of the electronic apparatus according to Claims 1 to 5 item any of which item
Conductive composite molding structure is it is characterised in that described middle shell support is a plastic parts, upwards simultaneously
Fix this liquid crystal display module, fix downwards this circuit board；This circuit board is provided with a radome,
The cover of this radome contacts the conductive radiator face of this conductive radiator film；It is exhausted that this circuit board is provided with one
Edge fin, for this heat dissipation of electronic chip, is intercepted this radome simultaneously and is contacted with this electronic chip,
Play insulating effect；And this electronic chip contacts this insulating radiation piece, in order to by this electronic chip
Heat is vertically communicated up, and the heat transfer of this electronic chip output is gone out, and makes this screen
Transversely horizontal dispersion is gone out to cover the heat that cover transmits, and stops this conductive radiator film with this thermal isolation film
Outwards radiations heat energy.
7. the radiating buffering conductive composite molding knot of electronic apparatus according to claim 6
Structure is it is characterised in that described insulating radiation piece can be made up of the aluminium oxide adding silica gel.
8. the radiating buffering conductive composite molding knot of electronic apparatus according to claim 1
Structure is it is characterised in that described conductive radiator film is Copper Foil, aluminium foil or graphite flake.
9. the radiating buffering conductive composite molding knot of electronic apparatus according to claim 1
Structure is it is characterised in that described cushion is foamed cotton layer, rubber layer or elastic film layer.
10. the radiating buffering conductive composite molding knot of electronic apparatus according to claim 1
Structure is it is characterised in that described thermal isolation film is a flat film having microcellular structure or in this flat thin
It is machined with the perforated film of several pores, pore space structure on the basis of film.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104126372 | 2015-08-13 | ||
| TW104126372A TWI672582B (en) | 2015-08-13 | 2015-08-13 | Thermal buffered conductive composite forming structure of mobile electronic device (3) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106455411A true CN106455411A (en) | 2017-02-22 |
Family
ID=58093930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510564601.XA Pending CN106455411A (en) | 2015-08-13 | 2015-09-07 | Heat dissipation buffering conductive composite forming structure of mobile electronic device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106455411A (en) |
| TW (1) | TWI672582B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109362217A (en) * | 2018-09-30 | 2019-02-19 | 联想(北京)有限公司 | Electronic equipment and electronic equipment processing method |
| WO2021031114A1 (en) * | 2019-08-20 | 2021-02-25 | 矽统科技股份有限公司 | Heat dissipation patch, eletronic product, method for fabricating heat dissipation patch |
| CN112767838A (en) * | 2021-01-19 | 2021-05-07 | Oppo（重庆）智能科技有限公司 | Flexible display screen and electronic equipment |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI710878B (en) * | 2019-03-22 | 2020-11-21 | 友達光電股份有限公司 | Display assembly having shock-absorbing structure |
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| CN201585231U (en) * | 2009-09-14 | 2010-09-15 | 正文科技股份有限公司 | Electronic device with heat insulation structure |
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| TW201706767A (en) | 2017-02-16 |
| TWI672582B (en) | 2019-09-21 |
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