CN106413336A - Heat dissipation buffering shielding composite structure of mobile electronic device - Google Patents
Heat dissipation buffering shielding composite structure of mobile electronic device Download PDFInfo
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- CN106413336A CN106413336A CN201510567801.0A CN201510567801A CN106413336A CN 106413336 A CN106413336 A CN 106413336A CN 201510567801 A CN201510567801 A CN 201510567801A CN 106413336 A CN106413336 A CN 106413336A
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- Prior art keywords
- heat
- liquid crystal
- display module
- crystal display
- electronic
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- 230000003139 buffering effect Effects 0.000 title claims abstract description 16
- 239000002131 composite material Substances 0.000 title claims abstract description 7
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 5
- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 19
- 230000000694 effects Effects 0.000 claims abstract description 12
- 229920000742 Cotton Polymers 0.000 claims abstract description 7
- 239000004033 plastic Substances 0.000 claims abstract description 4
- 229920003023 plastic Polymers 0.000 claims abstract description 4
- 238000002955 isolation Methods 0.000 claims description 11
- 230000005855 radiation Effects 0.000 claims description 11
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 6
- 238000010276 construction Methods 0.000 claims description 6
- 230000004308 accommodation Effects 0.000 claims description 5
- 238000012546 transfer Methods 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 238000001746 injection moulding Methods 0.000 claims description 2
- 239000000741 silica gel Substances 0.000 claims description 2
- 229910002027 silica gel Inorganic materials 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 239000012528 membrane Substances 0.000 abstract 5
- 239000011469 building brick Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000005030 aluminium foil Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Abstract
A heat dissipating, cushioning, and shielding composite structure for a mobile electronic device, comprising: an upper cover; a liquid crystal display module; a middle shell support; a circuit board; and a back cover; the middle shell bracket is made of a plastic part, and a shielding cover is embedded and fixed on the middle shell bracket; the heat that sends the electronic chip continues to be carried away along vertically, and then the heat that will transmit from the chip vertically conveys a heat conduction membrane through an insulating fin and a shield cover, then spread out through heat conduction membrane horizontal parallel, make electronic equipment become even heat dissipation from local overheat, moreover be equipped with a heat insulating membrane outside heat conduction membrane, can prevent the heat to continue to spread outward to the casing, in order to avoid causing overheated bad use to experience for the user, be equipped with a bubble cotton layer in the outside of heat insulating membrane, play the cushioning effect and protect the liquid crystal display module assembly, therefore, combine the heat dissipation, buffering, three functions of electronic shielding in an organic whole, have the reliability that can keep moving electron device, can practice thrift the efficiency of cost again.
Description
Technical field
The present invention is about a kind of radiator structure of electronic apparatus, espespecially a kind of combine radiating,
Buffering, three functions of electronic shield are in the composite construction of one.
Background technology
The electronic apparatus such as smart mobile phone, panel computer, its by double-core, four cores,
Eight cores etc. develop into the process chip of more and more high operation frequency；And electronic apparatus send out
Exhibition with short and small frivolous as designer trends, therefore frivolous dual with short and small for high operation efficiency can be reached
Require, the radiating efficiency of electronic apparatus is increasingly important.
Secondary person, the radiating mode of current electronic apparatus, mainly use simple perforate, lead
The modes such as heat, thermal convection current, but those radiating modes with cannot load high-effect chip is produced now
Heat energy, therefore have the problem of accumulated heat, heat energy cannot uniformly dispersing, lead to reduce mobile electron
Radiating efficiency within device.
Also, the chip of usual electronic equipment is operationally main heating source, radiating is not only for fall
Low chip own temperature with ensure its can within the temperature range of requiring normal work, simultaneously also will and
Housing hot-spot can not be caused when turning round and look at radiating, cause bad experience to consumer.
Therefore No. 496156 patent of the new M of TaiWan, China, disclose a kind of electronic apparatus radiating
Structure, it includes lid 11, liquid crystal display module 12 and a back-cover 16 and a heat-conductive assembly 15 on one,
This liquid crystal display module 12 side is provided with a substrate 14, and this substrate 14 is provided with least one electronics group
Part 141, this back-cover 16 has an accommodation space 161, and this liquid crystal display module 12 side is sticked in one
Frame 13, this substrate 14 is embedded on this center 13, and this heat-conductive assembly 15 is arranged at described electronic building brick
Between 141 and back-cover 16, the described electronic building brick 141 of the corresponding contact in this heat-conductive assembly 15 side, another
Side is corresponding to contact described back-cover 16；Uniform thermal power so as to helping this electronic building brick 121 spreads and does not produce
Accumulated heat.But look into, its as radiating heat-conductive assembly 15 manufacture respectively with back-cover 16 after, then by heat conduction
Assembly 15 binds still has deficiency in back-cover 16 inner edge surface, therefore its radiating efficiency or electronic shield function
Part, it does not disclose the buffer structure protecting this liquid crystal display module 12 in addition, therefore still has improvement
Space.
Therefore solving the problems referred to above point of traditional electronic apparatus, it is the major subjects of the present invention.
Content of the invention
Technical problem underlying to be solved by this invention is, overcomes the above-mentioned of prior art presence to lack
Fall into, and provide a kind of radiating of electronic apparatus to buffer electrically conductive shield structure, its combination radiating,
Buffering, three work(of electronic shield are used for one, have the reliability that can keep electronic apparatus,
Cost-effective effect of energy again.
The technical solution adopted for the present invention to solve the technical problems is：
A kind of radiating buffering electrically conductive shield structure of electronic apparatus, including：Cover on one, have
One transparency carrier；One liquid crystal display module, is located at below lid on this；Shell support in one, is located at this
The lower section of liquid crystal display module；One circuit board, is located at the lower section of shell support in this, at least sets thereon
There is an electronic building brick；One battery, is located at the lower section of shell support in this；And a back-cover, relatively tie
It is combined in lid root edge on this, it has an accommodation space, in order to receive aforesaid component；
It is characterized in that：Shell support in this, is constituted by a working of plastics, which is provided with a radome
(shielding can), and fix this liquid crystal display module upwards simultaneously, fix downwards this circuit board；
This circuit board is provided with an insulating radiation piece, and in order to provide this heat dissipation of electronic chip, intercept should simultaneously
Radome is contacted with this electronic chip, plays insulating effect；And this electronic chip contacts this insulation and dissipates
Backing, in order to be vertically communicated up the heat of this electronic chip, this electronic chip is produced
The heat transfer going out is gone out；It is provided with one layer of heat conducting film above this radome, will be transmitted by this radome
Heat transversely horizontal dispersion is gone out；The top of this heat conducting film is provided with one layer of thermal isolation film, in order to hinder
Stop the outside radiations heat energy of this heat conducting film；And the outside of this thermal isolation film is provided with a foamed cotton layer, for this liquid
Brilliant display module buffering is used.
By above taking off technological means, present invention shell support using in this inlays radome as longitudinal heat transfer
With electromagnetic shielding medium, improve the bad problem of shell support heat conduction in this, and the heat that chip is sent
Amount continues along longitudinally passing, so by the heat transmitting from electronic chip pass through this fin and
Radome is longitudinally sent to this heat conducting film, then passes through horizontally-parallel the spreading out of this heat conducting film and reaches all
Even radiating；Furthermore the thermal isolation film outside this heat conducting film, can stop heat from continuing to housing external diffusion,
Overheated bad experience is caused with exempt from customs examination user, and with the foamed cotton layer outside this thermal isolation film,
Play cushioning effect protection liquid crystal display module, whereby, the present invention combines radiating, buffering, electrical screen
Cover three work(for one, there is the reliability that can keep electronic apparatus, can save into again
This effect.
The invention has the beneficial effects as follows, its combination radiating, buffering, three work(of electronic shield are used for one
Body, has the reliability that can keep electronic apparatus, and the cost-effective effect of energy.
Brief description
The present invention is further described with reference to the accompanying drawings and examples.
Figure 1A is a kind of exploded perspective view of existing electronic apparatus radiator structure.
Figure 1B is a kind of combination stereogram of existing electronic apparatus radiator structure.
Fig. 1 C is a kind of sectional view of existing electronic apparatus radiator structure.
Fig. 1 D is the enlarged drawing shown in 1D in Fig. 1 C.
Fig. 2 is the exploded perspective view of present pre-ferred embodiments.
Fig. 3 is the combination stereogram of present pre-ferred embodiments.
Fig. 4 is the sectional view of present pre-ferred embodiments.
Fig. 5 is the enlarged drawing shown in 5 in Fig. 4.
In figure label declaration：
Cover on 20
21 transparency carriers
30 liquid crystal display modules
Shell support in 40
50 circuit boards
51 electronic chips
60 batteries
70 back-cover
71 accommodation spaces
81 radomes
82 insulating radiation pieces
83 heat conducting films
84 thermal isolation film
85 foamed cotton layers
Specific embodiment
First, refer to shown in Fig. 2～Fig. 5, disclosed herein electronic apparatus radiating
Buffering shielding construction, one possible embodiments include：Cover 20 on one, there is a transparency carrier 21；One
Liquid crystal display module (LCD) 30, is located at below lid 20 on this；Shell support 40 in one, is located at this liquid crystal
The lower section of display module 30；One circuit board 50, is located at the lower section of shell support 40 in this, thereon at least
It is provided with an electronic chip 51；One battery 60, is located at the lower section of shell support 40 in this；And a back-cover
70, relatively combine and 20 root edges are covered on this, it has an accommodation space 71, aforesaid in order to receive
Component；But, above take off component and belong to prior art (Prior Art), the patent purpose of non-invention, hold
Do not repeat.
The present invention is characterized in：Shell support 40 in this, is constituted by a working of plastics, thereon
It is provided with a radome (shielding can) 81, and fix this liquid crystal display module 30 simultaneously upwards,
Fix downwards this circuit board 40；In the present embodiment, this radome 81 passes through injection molding (insert
Molding) fix in shell support 40 in this, it can be made up of materials such as foreign copper-nickel alloy, rustless steels.
And shell support 40 can be made up of (PA+GF) material in this, in order to form electronic shield, reach electronics
The anti-electronics interference requirement of chip 51.
Hold, this circuit board 50 is provided with an insulating radiation piece (thermal pad) 82, it can be by adding
Plus the aluminium oxide of silica gel is constituted, in order to provide this electronic chip 51 to radiate, intercept this shielding simultaneously
Cover 81 is contacted with electronic chip 51, or waits other material insulating radiation pieces of same-action to reach insulation work
With.And this electronic chip 51 contacts this insulating radiation piece 82, its effect is by the heat of electronic chip 51
Amount is vertically communicated up (heat conduction), and the heat transfer that this electronic chip 51 is sent is gone out.
Further, cover one layer of heat conducting film 83 above this radome 81, this heat conducting film 83 can be by
The heat transmitting from this radome 81 transversely go out by horizontal dispersion, reaches the effect of consistent heat generation,
In the present embodiment, this heat conducting film 83 can be made up of Copper Foil or aluminium foil.
Additionally, cover above this heat conducting film 83 being provided with one layer of thermal isolation film 84, this thermal isolation film 84 is used
To stop this outside radiations heat energy of heat conducting film 83, in case user feel is overheated.
Furthermore, it is provided with one layer of foamed cotton layer 85 in the outside of this thermal isolation film 84, in order to protect this liquid crystal
Show module 30, reach effect of buffering.
By above taking off technological means, present invention shell support 40 using in this inlays radome 81 as longitudinal direction
Heat transfer and electromagnetic shielding medium, improve the bad problem of shell support 40 heat conduction in this, and by electronics core
The heat that piece 51 sends continues to pass along longitudinal, and then the heat that will transmit from electronic chip 51
This heat conducting film 83 is longitudinally sent to by this insulating radiation piece 82 and radome 81, is then led by this
Hotting mask 83 is horizontally-parallel to be spread out, and reaches Homogeneouslly-radiating；Furthermore this heat conducting film 83 outside is heat-insulated
Film 84, can stop heat from continuing to housing external diffusion, caused overheated bad with exempt from customs examination user
Experience, and the foamed cotton layer 85 with this thermal isolation film 84 outside, provide cushioning effect, protect this liquid
Brilliant display module 30；Whereby, the present invention has with reference to radiating, buffering, three functions of electronic shield
In one, the reliability of electronic apparatus both can be kept, and the cost-effective effect of energy.
The above, be only presently preferred embodiments of the present invention, and not the present invention is made with any shape
Restriction in formula, it is any simple that every technical spirit according to the present invention is made to above example
Modification, equivalent variations and modification, all still fall within the range of technical solution of the present invention.
In sum, the present invention, in structure design, using in practicality and cost benefit, accords with completely
Close needed for industry development, and disclosed structure is also to have unprecedented innovative structure, has
Novelty, creativeness, practicality, meet the regulation about patent of invention important document, therefore lift in accordance with the law
Application.
Claims (3)
1. the radiating buffering shielding composite construction of a kind of electronic apparatus, including：
Cover on one, there is a transparency carrier；
One liquid crystal display module, is located at below lid on this；
Shell support in one, is located at the lower section of this liquid crystal display module；
One circuit board, is located at the lower section of shell support in this, thereon at least provided with an electronic chip；
One battery, is located at the lower section of shell support in this；And
One back-cover, combines lid root edge on this, it has an accommodation space, before receiving relatively
The component stated；It is characterized in that：
Described middle shell support, is a working of plastics, which is provided with a radome, and fix upwards simultaneously
This liquid crystal display module, fixes downwards this circuit board；
This circuit board is provided with an insulating radiation piece, in order to provide this heat dissipation of electronic chip, hinders simultaneously
Contact with this electronic chip every this radome, play insulating effect；And this electronic chip to contact this exhausted
Edge fin, in order to be vertically communicated up the heat of this electronic chip, by this electronics core
The heat transfer of piece output is gone out；
It is provided with one layer of heat conducting film, by the heat being transmitted by this radome transversely water above this radome
Put down and spread out；
The top of this heat conducting film is provided with one layer of thermal isolation film, in order to stop the outside radiations heat energy of this heat conducting film；
And
The outside of this thermal isolation film is provided with a foamed cotton layer, is used for this liquid crystal display module buffering.
2. the radiating buffering shielding composite construction of electronic apparatus according to claim 1, its
It is characterised by, described radome is inlayed by injection molding and is fixed in shell support in this.
3. the radiating buffering shielding composite construction of electronic apparatus according to claim 1,
It is characterized in that, described insulating radiation piece is made up of the aluminium oxide adding silica gel.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104124381 | 2015-07-28 | ||
| TW104124381A TW201705851A (en) | 2015-07-28 | 2015-07-28 | Heat radiating, buffering and shielding composite structure of mobile electronic device capable of combining three functions of heat radiating, buffering and shielding together and ensuring the reliability of the mobile electronic device and reducing the cost |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106413336A true CN106413336A (en) | 2017-02-15 |
Family
ID=58007738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510567801.0A Pending CN106413336A (en) | 2015-07-28 | 2015-09-08 | Heat dissipation buffering shielding composite structure of mobile electronic device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106413336A (en) |
| TW (1) | TW201705851A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107172872A (en) * | 2017-06-26 | 2017-09-15 | 上海传英信息技术有限公司 | The heat abstractor and electric terminal of electric terminal |
| CN107249061A (en) * | 2017-05-24 | 2017-10-13 | 天津工业大学 | A kind of semiconductor chilling plate controls the canning of mobile phone temp |
| CN109327997A (en) * | 2017-08-01 | 2019-02-12 | 东莞市普威玛精密工业有限公司 | The connection of the heat pipe and metal shell of electronic apparatus constructs |
| CN110198624A (en) * | 2019-05-29 | 2019-09-03 | 浙江康廷电子科技有限公司 | Heat-insulated thermally conductive suction wave material of one kind and preparation method thereof |
| WO2020051901A1 (en) * | 2018-09-14 | 2020-03-19 | 深圳市柔宇科技有限公司 | Foldable electronic device |
| CN111837171A (en) * | 2019-02-20 | 2020-10-27 | 京东方科技集团股份有限公司 | Display device and method for manufacturing the same |
| CN112639927A (en) * | 2018-09-14 | 2021-04-09 | 深圳市柔宇科技股份有限公司 | Flexible display device |
| CN109451103B (en) * | 2018-11-06 | 2021-04-30 | Oppo广东移动通信有限公司 | Electronic device |
| CN114976567A (en) * | 2022-07-18 | 2022-08-30 | 蚌埠学院 | Antenna module and antenna device provided with same |
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| JP2012160503A (en) * | 2011-01-31 | 2012-08-23 | Kaneka Corp | Composite film, device and method for producing composite film |
| CN202979570U (en) * | 2012-11-26 | 2013-06-05 | 华为终端有限公司 | Shielding case and electronic product thereof |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107249061A (en) * | 2017-05-24 | 2017-10-13 | 天津工业大学 | A kind of semiconductor chilling plate controls the canning of mobile phone temp |
| CN107172872A (en) * | 2017-06-26 | 2017-09-15 | 上海传英信息技术有限公司 | The heat abstractor and electric terminal of electric terminal |
| CN107172872B (en) * | 2017-06-26 | 2024-02-13 | 上海传英信息技术有限公司 | Heat abstractor and electronic terminal of electronic terminal |
| CN109327997A (en) * | 2017-08-01 | 2019-02-12 | 东莞市普威玛精密工业有限公司 | The connection of the heat pipe and metal shell of electronic apparatus constructs |
| WO2020051901A1 (en) * | 2018-09-14 | 2020-03-19 | 深圳市柔宇科技有限公司 | Foldable electronic device |
| CN112639927A (en) * | 2018-09-14 | 2021-04-09 | 深圳市柔宇科技股份有限公司 | Flexible display device |
| CN112673717A (en) * | 2018-09-14 | 2021-04-16 | 深圳市柔宇科技股份有限公司 | Foldable electronic device |
| CN109451103B (en) * | 2018-11-06 | 2021-04-30 | Oppo广东移动通信有限公司 | Electronic device |
| CN111837171B (en) * | 2019-02-20 | 2022-07-01 | 京东方科技集团股份有限公司 | Display device and method for manufacturing the same |
| CN111837171A (en) * | 2019-02-20 | 2020-10-27 | 京东方科技集团股份有限公司 | Display device and method for manufacturing the same |
| CN110198624A (en) * | 2019-05-29 | 2019-09-03 | 浙江康廷电子科技有限公司 | Heat-insulated thermally conductive suction wave material of one kind and preparation method thereof |
| CN110198624B (en) * | 2019-05-29 | 2021-07-13 | 浙江康廷电子科技有限公司 | Heat-insulation heat-conduction wave-absorbing material and preparation method thereof |
| CN114976567A (en) * | 2022-07-18 | 2022-08-30 | 蚌埠学院 | Antenna module and antenna device provided with same |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201705851A (en) | 2017-02-01 |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20210423 Address after: 703, block B, Changxing building, 4002 Huaqiang North Road, Yuanling street, Futian District, Shenzhen, Guangdong 518000 Applicant after: Shenzhen Weishi New Material Technology Co.,Ltd. Address before: 523420, 19 Ling Ling Road, floating bamboo village, Liaobu Town, Dongguan, Guangdong, China Applicant before: DONGGUAN QIANFENG SPECIAL ADHESIVE PRODUCTS Co.,Ltd. |
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| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170215 |