CN205071566U - Heat dissipation buffering shielding composite structure of mobile electronic device - Google Patents
Heat dissipation buffering shielding composite structure of mobile electronic device Download PDFInfo
- Publication number
- CN205071566U CN205071566U CN201520682019.9U CN201520682019U CN205071566U CN 205071566 U CN205071566 U CN 205071566U CN 201520682019 U CN201520682019 U CN 201520682019U CN 205071566 U CN205071566 U CN 205071566U
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- heat
- metal sheet
- conductive metal
- thermal conductive
- electronic
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- 230000003139 buffering effect Effects 0.000 title claims abstract description 21
- 239000002131 composite material Substances 0.000 title claims abstract description 10
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 6
- 229910052751 metal Inorganic materials 0.000 claims abstract description 25
- 239000002184 metal Substances 0.000 claims abstract description 25
- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 21
- 238000010276 construction Methods 0.000 claims abstract description 9
- 230000005855 radiation Effects 0.000 claims description 30
- 230000000694 effects Effects 0.000 claims description 12
- 238000002955 isolation Methods 0.000 claims description 12
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 6
- 229920000742 Cotton Polymers 0.000 claims description 6
- 230000004308 accommodation Effects 0.000 claims description 5
- 239000006185 dispersion Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 239000003292 glue Substances 0.000 claims description 2
- 239000000741 silica gel Substances 0.000 claims description 2
- 229910002027 silica gel Inorganic materials 0.000 claims description 2
- 238000013021 overheating Methods 0.000 abstract description 3
- 238000009413 insulation Methods 0.000 abstract 2
- 229910000861 Mg alloy Inorganic materials 0.000 abstract 1
- SNAAJJQQZSMGQD-UHFFFAOYSA-N aluminum magnesium Chemical compound [Mg].[Al] SNAAJJQQZSMGQD-UHFFFAOYSA-N 0.000 abstract 1
- 239000006260 foam Substances 0.000 abstract 1
- 239000011469 building brick Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model provides a heat dissipation buffering shielding composite construction of mobile electronic device which characterized in that: the middle shell support uses an aluminum-magnesium alloy embedded high-heat-conduction metal sheet as a longitudinal heat transfer and electromagnetic shielding medium, the problem of poor heat conduction of the middle shell support is improved, heat emitted by a chip is continuously transmitted out along the longitudinal direction, then the heat transmitted from the chip is longitudinally transmitted to a heat conduction film through an insulating radiating fin and the high-heat-conduction metal sheet, and then the heat conduction film is transversely and parallelly spread, so that the electronic equipment is changed from local overheating into uniform heat dissipation, moreover, a heat insulation film is arranged on the outer side of the heat conduction film, the heat can be prevented from being continuously diffused to the outside of a shell, so that the user is prevented from having overheating bad use experience, a foam layer is arranged on the outer side of the heat insulation film, the liquid crystal display module is protected through a buffering effect, therefore, the three functions of heat dissipation, buffering and electronic shielding are combined.
Description
Technical field
The utility model is the radiator structure about a kind of electronic apparatus, and espespecially a kind of combination heat radiation, buffering, electronic shield three functions are in the composite construction of one.
Background technology
The electronic apparatus such as smart mobile phone, panel computer, it has been developed into the process chip of more and more high operation frequency by double-core, four cores, eight cores etc.; And the development of electronic apparatus is with short and small frivolous for designer trends, therefore for can reach high operation efficiency and short and small frivolous double requirements, the radiating efficiency of electronic apparatus is important increasingly.
Secondary person, the radiating mode of current electronic apparatus, mainly utilize the modes such as simple perforate, heat conduction, thermal convection, but those radiating modes are with cannot the load heat energy that produces of high-effect chip now, therefore the problem of accumulated heat is had, heat energy cannot uniformly dispersing, causes the radiating efficiency reducing electronic apparatus inside.
Press again, the chip of usual electronic equipment is operationally main heating source, heat radiation is not only to reduce chip own temperature to ensure that it normally can work in the temperature range required, can not cause housing local overheating simultaneously, cause bad experience to consumer when also will take into account heat radiation.
Be with, the novel M of TaiWan, China No. 496156 patent, disclose a kind of electronic apparatus radiator structure, it comprises a upper cover 11, liquid crystal display module 12 and back of the body lid 16 and a heat-conductive assembly 15, this liquid crystal display module 12 side is provided with a substrate 14, this substrate 14 is provided with at least one electronic building brick 141, this back of the body lid 16 has an accommodation space 161, this liquid crystal display module 12 side is sticked a center 13, this substrate 14 is embedded on this center 13, this heat-conductive assembly 15 is arranged between described electronic building brick 141 and back of the body lid 16, the described electronic building brick 141 of this heat-conductive assembly 15 side correspondence contact, the described back of the body lid 16 of opposite side correspondence contact, scatter so as to helping the uniform thermal power of this electronic building brick 121 and do not produce accumulated heat.But look into; after its heat-conductive assembly 15 as heat radiation manufactures respectively with back of the body lid 16; again heat-conductive assembly 15 is binded at back of the body lid 16 inner edge surface; therefore its radiating efficiency or electronic shield function still have weak point; in addition it does not disclose the buffer structure of this liquid crystal display module 12 of protection, is therefore still improved space.
Therefore solve the problems referred to above point of traditional electronic apparatus, it is major subjects of the present utility model.
Utility model content
Technical problem underlying to be solved in the utility model is, overcome the above-mentioned defect that prior art exists, and a kind of heat radiation buffering electrically conductive shield structure of electronic apparatus is provided, it combines heat radiation, buffering, electronic shield three merits for one, there is the reliability that can keep electronic apparatus, effect that again can be cost-saving.
The utility model solves the technical scheme that its technical problem adopts:
A heat radiation buffering electrically conductive shield structure for electronic apparatus, comprising: a upper cover, has a transparency carrier; One liquid crystal display module, is located at below this upper cover; One mesochite support, is located at the below of this liquid crystal display module; One circuit board, is located at the below of this mesochite support, and it is at least provided with an electronic building brick; One battery, is located at the below of this mesochite support; And one carries on the back lid, be relatively combined in this upper cover root edge, it has an accommodation space, in order to receive aforesaid component;
It is characterized in that: this mesochite support, in order to form radome, upwards fix this liquid crystal display module simultaneously, fix this circuit board downwards, and this mesochite support is provided with a high-thermal conductive metal sheet; This circuit board is provided with an insulating radiation sheet, in order to provide this heat dissipation of electronic chip, intercepts this high-thermal conductive metal sheet simultaneously and contacts with this electronic chip, play insulating effect; And this electronic chip contacts this insulating radiation sheet, in order to the heat of this electronic chip is vertically upwards transmitted, the heat of this electronic chip output is passed; Be provided with one deck heat conducting film above this high-thermal conductive metal sheet, by the heat transmitted by this high-thermal conductive metal sheet transversely horizontal dispersion go out; The top of this heat conducting film is provided with one deck thermal isolation film, in order to stop the outside radiations heat energy of this heat conducting film; And the outside of this thermal isolation film is provided with a foamed cotton layer, for this liquid crystal display module buffering.
By on take off technological means, the utility model inlays high-thermal conductive metal sheet as longitudinally conducting heat and electromagnetic shielding medium using this mesochite support, improve the problem that this mesochite support heat conduction is bad, and the heat sent by chip continues longitudinally to pass, and then the heat transmitted from electronic chip is longitudinally sent to this heat conducting film by this fin and high-thermal conductive metal sheet, then reach Homogeneouslly-radiating by horizontal parallel the spreading out of this heat conducting film; Moreover outside heat conducting film, be provided with a thermal isolation film; heat can be stoped to continue to housing outdiffusion; overheated bad experience is caused with exempt from customs examination user; and with the foamed cotton layer outside this thermal isolation film; play cushioning effect protection liquid crystal display module, whereby, the utility model combination heat radiation, buffering, electronic shield three merits are used for one; there is the reliability that can keep electronic apparatus, effect that again can be cost-saving.
The beneficial effects of the utility model are, it combines heat radiation, buffering, electronic shield three merits for one, has the reliability that can keep electronic apparatus, effect that again can be cost-saving.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is further illustrated.
Figure 1A is the exploded perspective view of existing a kind of electronic apparatus radiator structure.
Figure 1B is the combination stereogram of existing a kind of electronic apparatus radiator structure.
Fig. 1 C is the cutaway view of existing a kind of electronic apparatus radiator structure.
Fig. 1 D is the enlarged drawing shown in 1D in Fig. 1 C.
Fig. 2 is the exploded perspective view of the utility model preferred embodiment.
Fig. 3 is the combination stereogram of the utility model preferred embodiment.
Fig. 4 is the cutaway view of the utility model preferred embodiment.
Fig. 5 is the enlarged drawing in Fig. 4 shown in 5.
Number in the figure illustrates:
20 upper covers
21 transparency carriers
30 liquid crystal display modules
40 mesochite supports
50 circuit boards
51 electronic chips
60 batteries
70 back of the body lids
71 accommodation spaces
81 high-thermal conductive metal sheets
82 insulating radiation sheets
83 heat conducting films
84 thermal isolation film
85 foamed cotton layers
Embodiment
First, refer to shown in Fig. 2 ~ Fig. 5, the heat radiation damping screen shield structure of the electronic apparatus disclosed by the utility model, one possible embodiments comprises: a upper cover 20, has a transparency carrier 21; One liquid crystal display module (LCD) 30, is located at below this upper cover 20; One mesochite support 40, is located at the below of this liquid crystal display module 30; One circuit board 50, is located at the below of this mesochite support 40, it is at least provided with an electronic chip 51; One battery 60, is located at the below of this mesochite support 40; And one carries on the back lid 70, be relatively combined in this upper cover 20 root edge, it has an accommodation space 71, in order to receive aforesaid component; But, above take off component and belong to prior art (PriorArt), non-patent object of the present utility model, hold and do not repeat.
Principal character of the present utility model is: this mesochite support 40, in order to form radome, upwards fix this liquid crystal display module 30 simultaneously, fix this circuit board 50 downwards, this mesochite support 40 is provided with a high-thermal conductive metal sheet 81, and this high-thermal conductive metal sheet 81 is pasted by heat-conducting glue, also can inlay and be matched with in this mesochite support 40; In the present embodiment, this mesochite support 40 can be made up of almag, in order to form electronic shield, reach the anti-electronics interference requirement of electronic chip 51, upwards fix this liquid crystal display module 30 simultaneously, fix this circuit board 50 downwards, in the present embodiment, this high-thermal conductive metal sheet 81 can be made up of copper, but is not limited to this, and the metal of equivalence also can be implemented.
Hold, this circuit board 50 is provided with an insulating radiation sheet (thermalpad) 82, and it by can be made up of the aluminium oxide adding silica gel, can dispel the heat in order to provide this electronic chip 51, intercept this high-thermal conductive metal sheet 81 to contact with electronic chip 51 simultaneously, reach insulating effect.And this electronic chip 51 contacts insulating radiation sheet 82, its effect is that the heat of electronic chip 51 is vertically upwards transmitted (heat conduction), is passed by the heat that this electronic chip 51 sends.
Further, above high-thermal conductive metal sheet 81, cover one deck heat conducting film 83, this heat conducting film 83 can by the heat transmitted from high-thermal conductive metal sheet 81 transversely horizontal dispersion go out, reach the effect of consistent heat generation.
In addition, cover above this heat conducting film 83 and be provided with one deck thermal isolation film 84, this thermal isolation film 84 in order to stop this heat conducting film 83 outwards radiations heat energy, in case user's feel is overheated.
Moreover, be provided with one deck foamed cotton layer 85 in the outside of this thermal isolation film 84, in order to protect this liquid crystal display module 30, reach effect of buffering.
By on take off technological means, the utility model inlays high-thermal conductive metal sheet 81 as longitudinally conducting heat and electromagnetic shielding medium using this mesochite support 40, improve the problem that this mesochite support 40 heat conduction is bad, and the heat sent by electronic chip 51 continues longitudinally to pass, and then the heat transmitted from electronic chip 51 is longitudinally sent to this heat conducting film 83 by this insulating radiation sheet 82 and high-thermal conductive metal sheet 81, then come by the horizontal parallel distribution of this heat conducting film 83, reach Homogeneouslly-radiating; Moreover outside heat conducting film 83, be provided with a thermal isolation film 84, heat can be stoped to continue to housing outdiffusion, cause overheated bad experience with exempt from customs examination user, and with the foamed cotton layer 85 outside this thermal isolation film 84, cushioning effect is provided, protects this liquid crystal display module 30; Whereby, the utility model has combination heat radiation, buffering, electronic shield three merits for one, both can keep the reliability of electronic apparatus, effect that again can be cost-saving.
The above, it is only preferred embodiment of the present utility model, not any pro forma restriction is done to the utility model, every above embodiment is done according to technical spirit of the present utility model any simple modification, equivalent variations and modification, all still belong in the scope of technical solutions of the utility model.
In sum, the utility model is in structural design, use practicality and cost benefit, meet completely needed for industry development, and the structure disclosed also is have unprecedented innovative structure, there is novelty, creativeness, practicality, meet the regulation about utility model patent important document, therefore mention application in accordance with the law.
Claims (6)
1. a heat radiation buffering shielding composite construction for electronic apparatus, comprising:
One upper cover, has a transparency carrier;
One liquid crystal display module, is located at below this upper cover;
One mesochite support, is located at the below of this liquid crystal display module;
One circuit board, is located at the below of this mesochite support, and it is at least provided with an electronic chip;
One battery, is located at the below of this mesochite support; And
One back of the body lid, be relatively combined in this upper cover root edge, it has an accommodation space, in order to receive aforesaid component; It is characterized in that:
Described mesochite support, in order to form radome, upwards fixes this liquid crystal display module simultaneously, fix this circuit board downwards, and this mesochite support is provided with a high-thermal conductive metal sheet;
This circuit board is provided with an insulating radiation sheet, for this heat dissipation of electronic chip, intercepts this high-thermal conductive metal sheet simultaneously and contacts with this electronic chip, play insulating effect; And this electronic chip contacts this insulating radiation sheet, in order to the heat of this electronic chip is vertically upwards transmitted, the heat of this electronic chip output is passed;
Be provided with one deck heat conducting film above this high-thermal conductive metal sheet, by the heat transmitted by this high-thermal conductive metal sheet transversely horizontal dispersion go out;
The top of this heat conducting film is provided with one deck thermal isolation film, in order to stop the outside radiations heat energy of this heat conducting film; And
The outside of this thermal isolation film is provided with a foamed cotton layer, for this liquid crystal display module buffering.
2. the heat radiation buffering shielding composite construction of electronic apparatus according to claim 1, it is characterized in that, described mesochite support can be made up of almag.
3. the heat radiation buffering shielding composite construction of electronic apparatus according to claim 1, it is characterized in that, described high-thermal conductive metal sheet can be made up of copper.
4. the heat radiation buffering shielding composite construction of electronic apparatus according to claim 3, it is characterized in that, described high-thermal conductive metal sheet is pasted and fixed in this mesochite support by heat-conducting glue.
5. the heat radiation buffering shielding composite construction of electronic apparatus according to claim 3, it is characterized in that, described high-thermal conductive metal sheet is matched with in this mesochite support by inlaying.
6. the heat radiation buffering shielding composite construction of electronic apparatus according to claim 1, it is characterized in that, described insulating radiation sheet can be made up of the aluminium oxide adding silica gel.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104212114U TWM519359U (en) | 2015-07-28 | 2015-07-28 | Heat dissipation buffer shield composite structure of mobile electronic device |
| TW104212114 | 2015-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205071566U true CN205071566U (en) | 2016-03-02 |
Family
ID=55398061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520682019.9U Expired - Fee Related CN205071566U (en) | 2015-07-28 | 2015-09-02 | Heat dissipation buffering shielding composite structure of mobile electronic device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN205071566U (en) |
| TW (1) | TWM519359U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105873417A (en) * | 2016-04-29 | 2016-08-17 | 广东欧珀移动通信有限公司 | Chip, circuit board and mobile terminal |
| CN107846827A (en) * | 2017-12-05 | 2018-03-27 | 匀加速科技有限公司 | capillary radiating mobile phone |
| CN108924278A (en) * | 2018-06-01 | 2018-11-30 | Oppo广东移动通信有限公司 | Electronic device and its manufacturing method |
| CN112739154A (en) * | 2020-12-09 | 2021-04-30 | 维沃移动通信有限公司 | Wearable device |
| CN113905560A (en) * | 2021-10-09 | 2022-01-07 | 深圳科赛威科技有限公司 | Vehicle-mounted navigation system adopting fluid circulation vibration reduction |
-
2015
- 2015-07-28 TW TW104212114U patent/TWM519359U/en unknown
- 2015-09-02 CN CN201520682019.9U patent/CN205071566U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105873417A (en) * | 2016-04-29 | 2016-08-17 | 广东欧珀移动通信有限公司 | Chip, circuit board and mobile terminal |
| CN107846827A (en) * | 2017-12-05 | 2018-03-27 | 匀加速科技有限公司 | capillary radiating mobile phone |
| CN107846827B (en) * | 2017-12-05 | 2019-10-29 | 南通沃特光电科技有限公司 | Capillary heat dissipation mobile phone |
| CN108924278A (en) * | 2018-06-01 | 2018-11-30 | Oppo广东移动通信有限公司 | Electronic device and its manufacturing method |
| CN112739154A (en) * | 2020-12-09 | 2021-04-30 | 维沃移动通信有限公司 | Wearable device |
| CN113905560A (en) * | 2021-10-09 | 2022-01-07 | 深圳科赛威科技有限公司 | Vehicle-mounted navigation system adopting fluid circulation vibration reduction |
| CN113905560B (en) * | 2021-10-09 | 2023-04-28 | 深圳科赛威科技有限公司 | Vehicle navigation system adopting fluid circulation vibration reduction |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM519359U (en) | 2016-03-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210422 Address after: 703, block B, Changxing building, 4002 Huaqiang North Road, Yuanling street, Futian District, Shenzhen, Guangdong 518000 Patentee after: Shenzhen Weishi New Material Technology Co.,Ltd. Address before: 523420, 19 Ling Ling Road, floating bamboo village, Liaobu Town, Dongguan, Guangdong, China Patentee before: DONGGUAN QIANFENG SPECIAL ADHESIVE PRODUCTS Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160302 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |