CN104813760B - A kind of radiating subassembly and electronic equipment - Google Patents
A kind of radiating subassembly and electronic equipment Download PDFInfo
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- CN104813760B CN104813760B CN201480003087.6A CN201480003087A CN104813760B CN 104813760 B CN104813760 B CN 104813760B CN 201480003087 A CN201480003087 A CN 201480003087A CN 104813760 B CN104813760 B CN 104813760B
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- 229910052802 copper Inorganic materials 0.000 claims abstract description 57
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- 229910000861 Mg alloy Inorganic materials 0.000 description 3
- 239000006260 foam Substances 0.000 description 3
- 239000007770 graphite material Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The present invention, which provides a kind of radiating subassembly and electronic equipment, the radiating subassembly, to be included：Shielding element, offers a through hole on shielding element, and the ground copper of shielding element and pcb board is electrically connected, and pcb board is provided with heat-generating electronic elements；Heat pipe, positioned on through hole, heat pipe is electrically connected with shielding element, wherein, heat pipe, pcb board and shielding element form an electro-magnetic shielding cover for being used to accommodate heat-generating electronic elements；Elastic thermal interfacial material, is arranged between heat pipe and heat-generating electronic elements, and is bonded to each other with heat pipe and heat-generating electronic elements.In above-mentioned technical proposal, the thermal interfacial material being fitted on heat-generating electronic elements is bonded with heat pipe by the through hole being arranged on shielding element, so that the heat of heat-generating electronic elements can be passed to heat pipe by thermal interfacial material, reduce the thermal resistance of radiating subassembly and shorten the heat-transfer path between heat-generating electronic elements and heat pipe.
Description
Technical field
The present invention relates to technical field of heat dissipation, more particularly to a kind of radiating subassembly and electronic equipment.
Background technology
With the rapid popularization of LTE (Long Term Evolution, Long Term Evolution) technology, mobile Internet will provide
Fine definition, high performance multimedia application so that mobile data services rapid growth, mobile terminal device power consumption also will significantly
Degree increase, the heat dissipation design into the confined space propose unprecedented challenge.
In the prior art, the radiating subassembly used for the euthermic chip in mobile terminal mainly includes：First hot interface
Material, radome/shielding box, the second thermal interfacial material and heat pipe, the first thermal interfacial material, radome/shielding box, the second hot boundary
Plane materiel material and heat pipe are overlayed on euthermic chip successively.Heat-transfer path between euthermic chip and heat pipe is：Euthermic chip → the first
Thermal interfacial material → radome/shielding box → second thermal interfacial material → heat pipe.Thermal resistance is very big during due to being contacted with each other between solid,
Dissipated so prior art has used two panels heat conductive pad i.e. the first thermal interfacial material and the second thermal interfacial material with reducing thermal resistance, strengthening
The pyroconductivity of hot component.
However, heat conductive pad thermal conductivity factor k itself<30W/m-K, it is conventional for 1~3W/m-K, use core after two panels heat conductive pad
Piece heat is passed to heat transfer circuit path length during heat pipe, and the heat of incoming heat pipe is still seldom, so radiating subassembly of the prior art
The poor technical problem of heat dispersion still be present.
The content of the invention
The embodiment of the present invention provides a kind of radiating subassembly and electronic equipment, to solve existing for radiating subassembly in the prior art
The poor technical problem of heat dispersion, improve the heat dispersion of radiating subassembly.
In a first aspect, the embodiment of the present application provides a kind of radiating subassembly, the radiating subassembly includes：
Shielding element, a through hole is offered on the shielding element, the ground copper of the shielding element and pcb board electrically connects
Connect, the pcb board is provided with heat-generating electronic elements；
Heat pipe, on the through hole, the heat pipe and the shielding element are electrically connected, wherein, it is the heat pipe, described
Pcb board and the shielding element form an electro-magnetic shielding cover for being used to accommodate the heat-generating electronic elements；
First elastic thermal interfacial material, between the heat pipe and the heat-generating electronic elements, and with the heat pipe and
The heat-generating electronic elements are bonded to each other.
With reference in a first aspect, in the first possible implementation, the heat pipe is electrically connected with the shielding element,
Specially：The heat pipe is electrically connected with the shielding element by electroconductive elastic sheet or conductive interface material.
With reference to the first mode that may implement of first aspect, in second of possible implementation, the component
Also include：The conductive interface material, enclose and be located at the through hole surrounding, be bonded to each other with the shielding element and the heat pipe.
With reference to the first mode that may implement of first aspect, in the third possible implementation, the shielding
Element includes the electroconductive elastic sheet, and the electroconductive elastic sheet, which encloses, is located at the through hole surrounding, and the shell fragment electrically connects with the heat pipe
Connect.
With reference in a first aspect, in the 4th kind of possible implementation, the first elastic thermal interfacial material is specially：Bullet
Property conduction thermal interfacial material or elastic insulated thermal interfacial material, the first elastic thermal interfacial material pass through the through hole and institute
Heat pipe is stated to be bonded to each other.
, can at the 5th kind with reference to the first of first aspect and first aspect to any mode that may implement in the 4th kind
In the implementation of energy, the component also includes：
Second elastic thermal interfacial material, is bonded to each other with the heat pipe；
Heat-conducting metal block, be arranged between the described second elastic thermal interfacial material and the pcb board, and with second bullet
Property thermal interfacial material is bonded to each other, wherein, the heat-conducting metal block passes through the heat-conducting layer on the pcb board and the heating electronics
Element is connected.
With reference to the 5th kind of mode that may implement of first aspect, in the 6th kind of possible implementation, described second
Elastic thermal interfacial material is specially：Elastic conduction thermal interfacial material or elastic insulated thermal interfacial material.
Second aspect, the embodiment of the present application provide a kind of radiating subassembly, and the radiating subassembly includes：
Heat-conducting metal block, is arranged on pcb board, passes through the heating electric set on the heat-conducting layer of the PCB and the pcb board
Subcomponent is connected；
Elastic thermal interfacial material, it is fitted on the heat-conducting metal block；
Heat pipe, it is fitted on the elastic thermal interfacial material.
With reference to second aspect, in the mode that the first may be implemented, the heat-conducting layer is specially：The pcb board surface
The first layers of copper, and/or the second layers of copper inside the pcb board.
The mode that may implement with reference to the first of second aspect or second aspect, in the mode that second may implement
In, the component also includes：Shielding element, a through hole is offered on the shielding element, the heat pipe is located on the through hole,
The shielding element is electrically connected with the heat pipe, and the heat pipe, the pcb board and the shielding element form one and be used to accommodate
The electro-magnetic shielding cover of the heat-generating electronic elements and the heat-conducting metal block.
With reference to second of mode that may implement of second aspect, in the mode that the third may be implemented, the shielding
Element is electrically connected with the heat pipe, is specially：The heat pipe passes through electroconductive elastic sheet or thermal interface material with the shielding element
Material electrical connection.
With reference to the third mode that may implement of second aspect, in the mode that the 4th kind may implement, the component
Also include：The conductive interface material, enclose and be located at the through hole surrounding, be bonded to each other with the shielding element and the heat pipe.
With reference to the third mode that may implement of second aspect, in the mode that the 5th kind may implement, the shielding
Element includes the electroconductive elastic sheet, and the electroconductive elastic sheet, which encloses, is located at the through hole surrounding, and the shell fragment electrically connects with the heat pipe
Connect.
The third aspect, the embodiment of the present application provide a kind of radiating subassembly, and the radiating subassembly includes：
Shielding element, it is located on the heat-generating electronic elements of pcb board, the ground layers of copper of the shielding element and the pcb board
Electrical connection；
Heat pipe, on the shielding element, wherein, the heat pipe is first with the shielding by way of welding or being bonded
Part connects；
First elastic thermal interfacial material, is fitted between the heat-generating electronic elements and the shielding element.
With reference to the third aspect, in the mode that the first may be implemented, the component also includes：
Heat-conducting metal block, be arranged on the pcb board, wherein, the heat-conducting metal block by described ground layers of copper with it is described
Heat-generating electronic elements are connected；
Second elastic thermal interfacial material, between the heat-conducting metal block and the heat pipe, with the heat-conducting metal block
It is bonded to each other with the heat pipe.
Fourth aspect, the embodiment of the present application provide a kind of electronic equipment, including：
Housing；
Radiating subassembly, in the housing, the radiating subassembly includes shielding element, heat pipe, the first elastic hot interface
Material；
Wherein, a through hole, the ground copper electrical connection of the shielding element and pcb board, institute are offered on the shielding element
State pcb board and be provided with heat-generating electronic elements；The heat pipe is located on the through hole, and the heat pipe electrically connects with the shielding element
Connect, wherein, the heat pipe, the pcb board and the shielding element form an electromagnetism for being used to accommodate the heat-generating electronic elements
Radome；The first elastic thermal interfacial material between the heat pipe and the heat-generating electronic elements, and with the heat pipe
It is bonded to each other with the heat-generating electronic elements.
With reference to fourth aspect, in the mode that the first may be implemented, the heat pipe is electrically connected with the shielding element,
Specially：The heat pipe is electrically connected with the shielding element by electroconductive elastic sheet or conductive interface material.
With reference to the first mode that may implement of fourth aspect, in the mode that second may implement, the radiating
Component also includes：The conductive interface material, enclose and be located at the through hole surrounding, mutually pasted with the shielding element and the heat pipe
Close.
With reference to the first mode that may implement of fourth aspect, in the mode that the third may be implemented, the shielding
Element includes the electroconductive elastic sheet, and the electroconductive elastic sheet, which encloses, is located at the through hole surrounding, and the shell fragment electrically connects with the heat pipe
Connect.
With reference to the third mode that may implement of fourth aspect, in the mode that the 4th kind may implement, described first
Elastic thermal interfacial material is specially：Elastic conduction thermal interfacial material or elastic insulated thermal interfacial material, first elastic hot
Boundary material is bonded to each other by the through hole and the heat pipe.
, can at the 5th kind with reference to the first of fourth aspect and fourth aspect to any mode that may implement in the 4th kind
In the mode that can implement, the radiating subassembly also includes：
Second elastic thermal interfacial material, is bonded to each other with the heat pipe；
Heat-conducting metal block, be arranged between the described second elastic thermal interfacial material and the pcb board, and with second bullet
Property thermal interfacial material is bonded to each other, wherein, the heat-conducting metal block passes through the heat-conducting layer on the pcb board and the heating electronics
Element is connected.
With reference to the 5th kind of mode that may implement of fourth aspect, in the mode that the 6th kind may implement, described second
Elastic thermal interfacial material is specially：Elastic conduction thermal interfacial material or elastic insulated thermal interfacial material.
With reference to fourth aspect, in a kind of possible embodiment, the electronic equipment also includes：Thermal bracket, it is located at
In the housing, the thermal bracket is connected with the heat pipe.
5th aspect, the embodiment of the present application provide a kind of electronic equipment, including：
Housing；
Radiating subassembly, in the housing, the radiating subassembly includes heat-conducting metal block, elastic thermal interfacial material and heat
Pipe；Wherein, the heat-conducting metal block is arranged on pcb board, passes through the hair set on the heat-conducting layer of the PCB and the pcb board
Thermoelectric elements are connected；The elastic thermal interfacial material is fitted on the heat-conducting metal block；The heat pipe is fitted in the bullet
On property thermal interfacial material.
With reference to the 5th aspect, in the mode that the first may be implemented, the heat-conducting layer is specially：The pcb board surface
The first layers of copper, and/or the second layers of copper inside the pcb board.
With reference to the 5th aspect or the first mode that may implement of the 5th aspect, in the mode that second may implement
In, the radiating subassembly also includes：Shielding element, a through hole is offered on the shielding element, the heat pipe is positioned at described logical
Kong Shang, the shielding element are electrically connected with the heat pipe, and the heat pipe, the pcb board and the shielding element form one and used
In the electro-magnetic shielding cover for accommodating the heat-generating electronic elements and the heat-conducting metal block.
With reference to second of mode that may implement of the 5th aspect, in the mode that the third may be implemented, the shielding
Element is electrically connected with the heat pipe, is specially：The heat pipe passes through electroconductive elastic sheet or thermal interface material with the shielding element
Material electrical connection.
With reference to the third mode that may implement of the 5th aspect, in the mode that the 4th kind may implement, the radiating
Component also includes：The conductive interface material, enclose and be located at the through hole surrounding, mutually pasted with the shielding element and the heat pipe
Close.
With reference to the third mode that may implement of the 5th aspect, in the mode that the 5th kind may implement, the shielding
Element includes the electroconductive elastic sheet, and the electroconductive elastic sheet, which encloses, is located at the through hole surrounding, and the shell fragment electrically connects with the heat pipe
Connect.
With reference to the 5th aspect, a kind of possible embodiment, the electronic equipment also includes：Thermal bracket, positioned at described
In housing, the thermal bracket is connected with the heat pipe.
6th aspect, the embodiment of the present application provide a kind of electronic equipment, including：
Housing；
Radiating subassembly, in the housing, the radiating subassembly includes shielding element, heat pipe and the first elastic hot interface
Material, wherein, the shielding element is located on the heat-generating electronic elements of pcb board, the ground of the shielding element and the pcb board
Layers of copper is electrically connected；The heat pipe is located on the shielding element, wherein, the heat pipe is by way of welding or being bonded and institute
State shielding element connection；The first elastic thermal interfacial material be fitted in the heat-generating electronic elements and the shielding element it
Between.
With reference to the 6th aspect, in the mode that the first may be implemented, the radiating subassembly also includes：
Heat-conducting metal block, be arranged on the pcb board, wherein, the heat-conducting metal block by described ground layers of copper with it is described
Heat-generating electronic elements are connected；
Second elastic thermal interfacial material, between the heat-conducting metal block and the heat pipe, with the heat-conducting metal block
It is bonded to each other with the heat pipe.
With reference to the 6th aspect, a kind of possible embodiment, the electronic equipment also includes：Thermal bracket, positioned at described
In housing, the thermal bracket is connected with the heat pipe.
Said one or multiple technical schemes in the embodiment of the present application, at least have the advantages that：In shielding member
Through hole is opened up on part, is bonded the thermal interfacial material being fitted on heat-generating electronic elements with heat pipe by the through hole so that heating
The heat of electronic component can be passed to heat pipe by thermal interfacial material, reduce the thermal resistance of radiating subassembly and shorten heating electronics
Heat-transfer path between element and heat pipe, so as to solve the poor skill of heat dispersion existing for radiating subassembly in the prior art
Art problem, improve the heat dispersion of radiating subassembly.
Brief description of the drawings
Fig. 1 is the diagrammatic cross-section for the first radiating subassembly that the embodiment of the present application one provides；
Fig. 2 is the diagrammatic cross-section for second of radiating subassembly that the embodiment of the present application one provides；
Fig. 3 is the diagrammatic cross-section for the third radiating subassembly that the embodiment of the present application one provides；
Fig. 4 is the diagrammatic cross-section for the 4th kind of radiating subassembly that the embodiment of the present application one provides；
Fig. 5 is the diagrammatic cross-section for the 5th kind of radiating subassembly that the embodiment of the present application one provides；
Fig. 6 is the diagrammatic cross-section for the first radiating subassembly that the embodiment of the present application two provides；
Fig. 7 is the diagrammatic cross-section for second of radiating subassembly that the embodiment of the present application two provides；
Fig. 8 is the diagrammatic cross-section for the first radiating subassembly that the embodiment of the present application three provides；
Fig. 9 is the diagrammatic cross-section for second of radiating subassembly that the embodiment of the present application three provides；
Figure 10 is the diagrammatic cross-section for the third radiating subassembly that the embodiment of the present application three provides；
Figure 11 is the diagrammatic cross-section for the first radiating subassembly that the embodiment of the present application four provides；
Figure 12 is the diagrammatic cross-section for the first radiating subassembly that the embodiment of the present application four provides；
Figure 13 is the diagrammatic cross-section for a kind of electronic equipment that the embodiment of the present application five provides；
Figure 14 is the diagrammatic cross-section for a kind of electronic equipment that the embodiment of the present application six provides；
Figure 15 is the diagrammatic cross-section for a kind of electronic equipment that the embodiment of the present application seven provides.
Embodiment
In order to solve the poor technical problem of the radiating subassembly heat dispersion that occurs in the prior art, the embodiment of the present invention
A kind of radiating subassembly and electronic equipment are provided.
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention
In accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is
Part of the embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art
The every other embodiment obtained under the premise of creative work is not made, belongs to the scope of protection of the invention.
The preferred embodiment of the present invention is described in detail below in conjunction with the accompanying drawings.
Embodiment one
Fig. 1 is refer to, the embodiment of the present application provides a kind of radiating subassembly, and the radiating subassembly includes：
Shielding element 11, a through hole 11c, the shielding element 11 and pcb board 16 are offered on the shielding element 11
Ground copper electrical connection, the pcb board 16 are provided with heat-generating electronic elements 15；
Heat pipe 12, on the through hole 11c, the heat pipe 12 and the shielding element 11 are electrically connected, wherein, it is described
Heat pipe 12, the pcb board 16 and the shielding element 11 form an electromagnetic shielding for being used to accommodate the heat-generating electronic elements 15
Cover；
First elastic thermal interfacial material 13, between the heat pipe 12 and the heat-generating electronic elements 15, and with it is described
Heat pipe 12 and the heat-generating electronic elements 15 are bonded to each other.
Fig. 2 is refer to, shielding element 11 can include radome 11a and mask frame 11b, wherein, radome 11a is welded on
On mask frame 11b, mask frame 11b and pcb board 16 ground copper are electrically connected.It is understood that mask frame 11b and radome
11a can be formed in one structure, as shown in figure 1, the ground copper of shielding element 11 and pcb board 16 is electrically connected.Wherein, shielding member
Part 11 can be covered on heat-generating electronic elements 15, and the heat-generating electronic elements 15 are specifically as follows the main heat generating core on electronic equipment
Piece, such as：Power amplifier, application processor (CPU, Central Processing Unit), or power management chip (PMIC,
Power Management IC) etc..
The electromagnetic interference that shielding element 11 can be used between shield heating electronic component 15 and other components.Due to screen
Cover and through hole 11c is offered on element 11, so the electromagnetic interference of the containment portion of shielding element 11 will pass through through hole 11c interference shieldings
The heat-generating electronic elements 15 of the inside cavity of element 11, electromagnetic field caused by heat-generating electronic elements 15 will also be disturbed by through hole 11c
Outside component.In order to avoid this electromagnetic interference situation occurs, heat pipe 12 is covered in shielding element by the embodiment of the present application
On 11 through hole 11c, and heat pipe 12 and shielding element 11 are electrically connected, that is, allow between heat pipe 12 and shielding element 11 and keep phase
The state that mutually can electrically turn on so that heat pipe 12, pcb board 16 and shielding element 11 form one and be used to accommodate heat-generating electronic elements 15
Electro-magnetic shielding cover, and then shield heating electronic component 15 is to the electromagnetic interference of other components.
It can be connected between shielding element 11 and heat pipe 12 by conducting foam, electroconductive elastic sheet or conductive interface material,
So that shielding element 11 is electrically connected with heat pipe 12.
Optionally, as shown in Fig. 2 shielding element 11 also includes an electroconductive elastic sheet 14b, electroconductive elastic sheet 14b, which encloses, is located at shielding
The through hole surrounding of element 11.Electroconductive elastic sheet 14b contacts with heat pipe 12, and is formed and be electrically connected with heat pipe 12.
It is understood that shielding element 11 can also not include electroconductive elastic sheet 14b, radiating subassembly can also be led including one
Interface material 14a, as shown in Figure 1.Conductive interface material 14a includes but is not limited to conductive rubber, conducting foam etc..Conductive boundary
Plane materiel material 14a encloses the through hole 11c surroundings for being located at shielding element 11, is bonded to each other with shielding element 11 and heat pipe 12 so that shielding
Between element 11 and heat pipe 12 formed electrical connection, and then formed radome, more preferable shield heating electronic component 15 and other
Electromagnetic interference between component.
It should be noted that because the surface of solid has very more pits, it is mutual when being contacted between solid and solid
The Area comparison of fitting is small, so thermal resistance is larger when being contacted between solid.Reduce thermal resistance, Ke Yi to increase its contact area
The elastic thermal interfacial material 13 of pad first between solid and solid, so can between filled solid pit increase contact area from
And reduce thermal resistance.Wherein, the first elastic thermal interfacial material 13 includes but is not limited to elastic conducting heat pad, thermally conductive gel, heat of transformation circle
Plane materiel material, silicone grease etc..So the embodiment of the present application opens up through hole 11c on shielding element 11 so that heat pipe 12 can be by logical
Hole 11c is directly bonded to each other with the first elastic thermal interfacial material 13 being fitted on heat-generating electronic elements 15, both ensure that heat pipe
Fully contacting between 12 and heat-generating electronic elements 15, cause the main heat dissipation path contracting between heat-generating electronic elements 15 and heat pipe 12 again
It is short to be：Elastic 13 → the heat pipe of thermal interfacial material 12 of heat-generating electronic elements 15 → the first, so as to substantially increase dissipating for radiating subassembly
Hot property.When radiating subassembly installation in the electronic device when, be not connected with the first elastic thermal interfacial material 13 in heat pipe 12 one
End can be fixedly connected with the thermal bracket on electronic equipment so that the heat on heat pipe 12 can rapidly be passed to thermal bracket
And scatter.
In specific implementation process, the first elastic thermal interfacial material 13 is specifically as follows elastic insulated thermal interfacial material,
Can be elastic conduction thermal interfacial material, the first elastic thermal interfacial material 13 is bonded to each other by through hole 11c and heat pipe 12.
Fig. 3 is refer to, the radiating subassembly that the embodiment of the present application provides can also include：The second elastic He of thermal interfacial material 18
Heat-conducting metal block 17, the second elastic thermal interfacial material 18 are bonded to each other with the heat pipe 12, heat-conducting metal block 17, are arranged on second
Between elastic thermal interfacial material 18 and pcb board 16, and it is bonded to each other with the second elastic thermal interfacial material 18, wherein, heat-conducting metal
Block 17 is connected by the heat-conducting layer 16a on pcb board 16 with heat-generating electronic elements 15.Heat-generating electronic elements 15 are arranged on pcb board 16
On, the heat of heat-generating electronic elements 15 can also pass to the heat-conducting layer 16a on pcb board 16, wherein heat-conducting layer 16a for example：Can
Think the layers of copper inside the surface layers of copper of pcb board 16 and/or pcb board 16.
When pcb board 16 heat-conducting layer be pcb board 16 surface layers of copper when, heat-conducting metal block 17 can directly with pcb board 16
The electrical connection of surface layers of copper.
When pcb board 16 heat-conducting layer for layers of copper inside pcb board 16 when, the heat-conducting metal block 17 that is arranged on pcb board 16
It can be electrically connected by the layers of copper inside hot hole (such as heat through-hole, hot buried via hole or hot blind hole) and pcb board 16.
Heat-conducting metal block 17 is set on the pcb board 16 of neighbouring heat-generating electronic elements 15, and wherein heat-conducting metal block 17 can be with
For the higher element of thermal conductivity factor, such as copper billet or aluminium block, heat caused by such electronic component 15 can also pass through heat conduction
Layer 16a, heat-conducting metal block 17 and the second elastic thermal interfacial material 18 for being fitted on heat-conducting metal block 17 produce electronic component 15
Raw heat is transmitted to heat pipe 12, and then further reduces the temperature of heat-generating electronic elements 15, plays more preferable thermolysis.
In specific implementation process, the electronic equipment higher to thickness requirement, such as ultra thin handset, in order to not increase electronics
The thickness of equipment, refer to Fig. 4, and heat pipe 12 can be bent into two parts：A part is covered in the first elastic thermal interfacial material 13
On, another part is covered on the second elastic thermal interfacial material 18.The heat pipe 12 being covered on the second elastic thermal interfacial material 18
It can be embedded in the through hole of the support of electronic equipment, can so reduce the thickness of electronic equipment.
Stacked according to product and device layout design requirement, heat-conducting metal block 17 can be arranged on the cavity of shielding element 11
It is interior, outside the cavity that shielding element 11 can also be set.Fig. 5 is refer to, when heat-conducting metal block 17 is arranged on the chamber of shielding element 11
When internal, the first elastic 13 and second elastic thermal interfacial material 18 of thermal interfacial material of the radiating subassembly that the embodiment of the present application provides
Can be formed in one structure, as shown in Figure 5.First elastic 13 and second elastic thermal interfacial material 18 of thermal interfacial material is integrated
During molding structure, elastic thermal interfacial material is specifically as follows 3D heat conductive pads, thermally conductive gel etc..When heat-conducting metal block 17 is arranged on screen
When covering outside the cavity of element 11, the first elastic thermal interfacial material 13 and second for including of radiating subassembly that the embodiment of the present application provides
Elastic thermal interfacial material 18 is two independent elements, as shown in Figure 3 and Figure 4.
Embodiment two
Fig. 6 is refer to, the embodiment of the present application provides a kind of radiating subassembly, and the radiating subassembly includes：
Shielding element 11, a through hole 11c, the shielding element 11 and pcb board 16 are offered on the shielding element 11
Ground copper electrical connection, the pcb board 16 are provided with heat-generating electronic elements 15；
Elastic conduction thermal interfacial material 19, on the through hole 11c, it is bonded to each other with the shielding element 11, wherein,
The elastic conduction thermal interfacial material 19, the pcb board 16 and the shielding element 11 form one and are used to accommodate the heating electric
The electro-magnetic shielding cover of subcomponent 15；
Heat pipe 12, on the elastic conduction thermal interfacial material 19, and with the phase of elastic conduction thermal interfacial material 19
Mutually fitting.
As shown in fig. 6, elastic conduction thermal interfacial material 19 can be fitted on heat-generating electronic elements 15, now generate heat electronics
The heat of element 15 is transmitted to heat pipe 12 by elastic conduction thermal interfacial material 19, shorten heat-generating electronic elements 15 to heat pipe 12 it
Between heat-transfer path, so as to improve the heat dispersion of radiating subassembly.When radiating subassembly is installed in the electronic device, heat pipe 12
In one end for not being connected with elastic conduction thermal interfacial material 19 can be fixedly connected with the thermal bracket on electronic equipment so that heat
Heat on pipe 12 can rapidly be passed to thermal bracket and scatter.
Fig. 7 is refer to, the radiating subassembly that the embodiment of the present application provides can also include：Elastic thermal interfacial material 20 and heat conduction
Metal derby 17, elastic thermal interfacial material 20 are bonded to each other with the heat pipe 12, heat-conducting metal block 17, are arranged on elastic hot interface material
Between material 20 and pcb board 16, and it is bonded to each other with elastic thermal interfacial material 20, wherein, heat-conducting metal block 17 passes through on pcb board 16
Heat-conducting layer 16a be connected with heat-generating electronic elements 15.Heat-generating electronic elements 15 are arranged on pcb board 16, heat-generating electronic elements 15
Heat can also pass to heat-conducting layer 16a on pcb board 16, wherein heat-conducting layer 16a is for example：It can be pcb board surface layers of copper
And/or the layers of copper inside pcb board.
When the heat-conducting layer 16a of pcb board 16 is the surface layers of copper of pcb board 16, heat-conducting metal block 17 can directly and pcb board
16 surface layers of copper electrical connection.
When the heat-conducting layer 16a of pcb board 16 is the layers of copper inside pcb board 16, the heat-conducting metal block that is arranged on pcb board 16
17 can be electrically connected by the layers of copper inside hot hole (such as heat through-hole, hot buried via hole or hot blind hole) and pcb board 16.
Heat-conducting metal block 17 is set on the pcb board 16 of neighbouring heat-generating electronic elements 15, and wherein heat-conducting metal block 17 can be with
For the higher element of thermal conductivity factor, such as copper billet or aluminium block, heat caused by such electronic component 15 can also pass through heat conduction
Layer 16a, heat-conducting metal block 17 and the elastic thermal interfacial material 20 that is fitted on heat-conducting metal block 17 are by caused by electronic component 15
Heat is transmitted to heat pipe 12, and then further reduces the temperature of euthermic chip, plays more preferable thermolysis.
It is understood that heat-conducting metal block 17 and elastic thermal interfacial material 20 can be located in shielding element 11, also may be used
With not in shielding element 11.The embodiment of the present invention is not defined to this.
Embodiment three
Fig. 8 is refer to, the embodiment of the present application provides a kind of radiating subassembly, and the radiating subassembly includes：
Heat-conducting metal block 17, it is arranged on pcb board 16, by the heat-conducting layer 16a on the PCB and the pcb board 16
The heat-generating electronic elements 15 of setting are connected；
Elastic thermal interfacial material 18, it is fitted on the heat-conducting metal block 17；
Heat pipe 12, it is fitted on the elastic thermal interfacial material 13.
In actual application, because being provided with many layers of copper and hot hole on pcb board 16, many electronics members of generating heat
Most heat transfers of part 15 have given pcb board 16.Therefore the embodiment of the present application, pcb board 16 is passed to for major heat
Situation, heat-conducting metal block 17, the wherein heat conduction of heat-conducting metal block 17 are set on the pcb board 16 of neighbouring heat-generating electronic elements 15
Coefficients comparison is high, and heat-conducting metal block 17 is connected with heat-generating electronic elements 15 by heat-conducting layer 16a, and wherein heat-conducting layer 16a specifically may be used
Think the second layers of copper inside first layers of copper and/or pcb board 16 on the surface of pcb board 16；When heat-conducting layer 16a is the surface of pcb board 16
The first layers of copper when, heat-conducting metal block 17 directly can be electrically connected with first layers of copper on the surface of pcb board 16；As heat-conducting layer 16a
For the second layers of copper inside pcb board 16 when, being arranged on heat-conducting metal block 17 on pcb board 16 can be (such as hot logical by hot hole
Hole, hot buried via hole or hot blind hole) it is electrically connected with the second layers of copper inside pcb board.Therefore, pass through the heat-conducting layer on pcb board 16
16a, heat-conducting metal block 17, the elastic thermal interfacial material 18 being fitted on heat-conducting metal block 17, by the heat of heat-generating electronic elements 15
Amount leads heat pipe 12, to shorten euthermic chip to the heat-transfer path between heat pipe 12, improves the heat dispersion of radiating subassembly.When scattered
The installation of hot component in the electronic device when, one end for not being connected with elastic thermal interfacial material in heat pipe 12 can with electronic equipment
Metallic support be fixedly connected so that the heat on heat pipe 12 can rapidly be passed to metallic support and scatter.
Optionally, the radiating subassembly that the embodiment of the present application provides also includes shielding element 21, is located at heat-generating electronic elements
On 15, and it is electrically connected with the ground copper of pcb board 16.As shown in figure 8, heat-conducting metal block 17 can be located at the cavity of shielding element 21
Outside.Certainly, heat-conducting metal block 17 not may be positioned only at outside the cavity of shielding element 11, can also be arranged on the chamber of shielding element 11
In vivo.
Fig. 9 and Figure 10 are referred to, radiating subassembly also includes：Shielding element 11.A through hole is offered on shielding element 11
11c, heat pipe 12 are located on through hole 11c, and shielding element 11 is electrically connected with heat pipe 12, wherein, heat pipe 12, pcb board 16 and shielding
Element 11 is formed with an electro-magnetic shielding cover for accommodating heat-generating electronic elements 15 and heat-conducting metal block 17.
Optionally, shielding element 11 also includes electroconductive elastic sheet 14b.Electroconductive elastic sheet 14b encloses the through hole for being located at shielding element 11
11c surroundings.Electroconductive elastic sheet 14b contacts with heat pipe 12, is formed and is electrically connected with heat pipe 12.Optionally, shielding element 11 can also
As shown in figure 9, not including electroconductive elastic sheet 14b, now radiating subassembly also includes a conductive interface material 14a.Conductive interface material
14a includes but is not limited to conductive rubber, conducting foam etc..Conductive interface material 14a encloses the through hole 11c tetra- for being located at shielding element 11
In week, it is bonded to each other with shielding element 11 and heat pipe 12 so that electrical connection, and then shape are formed between shielding element 11 and heat pipe 12
Electromagnetic interference between radome shield heating electronic component 15 and other components.
Example IV
Figure 11 is refer to, the embodiment of the present application provides a kind of radiating subassembly, and the component includes：
Shielding element 21, it is located on the heat-generating electronic elements 15 of pcb board 16, the ground copper of shielding element 21 and pcb board 16
Layer electrical connection；
Heat pipe 12, on the shielding element 11, wherein, heat pipe 12 can be by way of welding or being bonded and shielding
Element 11 connects；
First elastic thermal interfacial material 13, it is fitted between the heat-generating electronic elements 15 and the shielding element 21.
It should be understood that because very more pits, the face being bonded to each other when being contacted between solid be present in the surface of solid
Product is smaller, so thermal resistance is larger when being contacted between solid.Reduce thermal resistance to increase its contact area, while reduce radiating subassembly
Heat-transfer path, the embodiment of the present application is by heat pipe 12 and shielding element 21 by together with welding or bonding connection.Due to welding
The atom between heat pipe 12 and shielding element 21 together interpenetrates combination, and its thermal resistance greatly reduces, while causes heating
The heat-transfer path of electronic component 15 is shorten to：Elastic 13 → the shielding element of thermal interfacial material 21 of heat-generating electronic elements 15 → the first →
Heat pipe 12, so as to improve the heat dispersion of radiating subassembly.Likewise, between the heat pipe 12 and shielding element 21 that bond together
Surface crater be glued agent filling, its thermal resistance greatly reduces, while the heat-transfer path of heat-generating electronic elements 15 is shortened, from
And improve the heat dispersion of radiating subassembly.When radiating subassembly installation in the electronic device when, in heat pipe 12 not with elastic hot circle
One end of plane materiel material connection is fixedly connected with the thermal bracket on electronic equipment so that the heat on heat pipe 12 can be passed rapidly
Enter thermal bracket and scatter.
Likewise, refer to Figure 12, the radiating subassembly can also include：The elastic hot interface material of heat-conducting metal block 17 and second
Material 18.Heat-conducting metal block 17 is arranged on the pcb board 16, and heat-conducting metal block 17 passes through the ground layers of copper 16b on the pcb board 16
It is connected with the heat-generating electronic elements 15.Second elastic thermal interfacial material 18 between heat-conducting metal block 17 and heat pipe 12, with
Heat-conducting metal block 17 and heat pipe 12 are bonded to each other.Thus, radiating subassembly can also by ground layers of copper 16b, heat-conducting metal block 17 and
The heat of heat-generating electronic elements 15 is transmitted to heat pipe 12 by the second elastic thermal interfacial material 18 so that radiating subassembly can more by
The heat outflow of euthermic chip, further improve the heat dispersion of radiating subassembly.
Embodiment five
Figure 13 and Fig. 1 are refer to, the embodiment of the present application also provides a kind of electronic equipment, and the electronic equipment includes：
Housing 132；
Radiating subassembly 130, in the housing 132, the radiating subassembly 130 includes shielding element 11, heat pipe 12, the
One elastic thermal interfacial material 13；
Wherein, a through hole 11c, the ground copper electricity of the shielding element 11 and pcb board 16 are provided with the shielding element 11
Gas connects, and the pcb board 16 is provided with heat-generating electronic elements 15；The heat pipe 12 is located on the through hole 11c, wherein described
Heat pipe 12, the pcb board 16 and the shielding element 11 form an electromagnetic shielding for being used to accommodate the heat-generating electronic elements 15
Cover；The first elastic thermal interfacial material 13 is arranged between the heat pipe 12 and the heat-generating electronic elements 15, and with it is described
Heat pipe 12 and the heat-generating electronic elements 15 are bonded to each other.
Optionally, the electronic equipment can also include：Thermal bracket 131, in the housing 132；The heat conduction
Support 131 can be connected with the heat pipe 12.
It should be noted that thermal bracket 131 can be metallic support, such as the metal material such as aluminium, copper, magnesium alloy makes
Metallic support, certain thermal bracket 131 can also be surface have heat conducting film made of graphite material.
Optionally, the heat pipe 12 is electrically connected with the shielding element 11, is specially：The heat pipe 12 and the shielding
Element 11 is connected by electroconductive elastic sheet or conductive interface material.
Optionally, the radiating subassembly 130 that the embodiment of the present application provides also includes：The conductive interface material, enclose and be located at institute
Through hole 11c surroundings are stated, are bonded to each other with the shielding element 11 and the heat pipe 12.
Optionally, the shielding element 11 includes the electroconductive elastic sheet, and the electroconductive elastic sheet, which encloses, is located at the through hole 11c tetra-
Week, the shell fragment are electrically connected with the heat pipe 12.
Optionally, the described first elastic thermal interfacial material 13 is specially：Elastic conduction thermal interfacial material is elastic insulated
Thermal interfacial material, the first elastic thermal interfacial material 13 are bonded to each other by the through hole 11c and the heat pipe 12.
Optionally, the radiating subassembly 130 also includes：Second elastic thermal interfacial material 18, is mutually pasted with the heat pipe 12
Close；Heat-conducting metal block 17, it is arranged between the described second elastic thermal interfacial material 18 and the pcb board 16, and with described second
Elastic thermal interfacial material 18 is bonded to each other, wherein, 17 pieces of the heat-conducting metal by the heat-conducting layer on the pcb board 16 with it is described
Heat-generating electronic elements 15 are connected.
Optionally, the described second elastic thermal interfacial material 18 is specially：Elastic conduction thermal interfacial material or elastic insulated heat
Boundary material.
Various change mode in radiating subassembly and instantiation in earlier figures 1~Fig. 5 embodiments are equally applicable to this
The electronic equipment of embodiment, by the foregoing detailed description to radiating subassembly, those skilled in the art are clear that this
The implementation of electronic equipment in embodiment, thus it is succinct for specification, it will not be described in detail herein.
Embodiment six
Figure 14 is refer to, the embodiment of the present application provides a kind of electronic equipment, and the electronic equipment includes：
Housing 142；
Radiating subassembly 140, in the housing 142, radiating subassembly 140 includes heat-conducting metal block 17, elastic hot interface
Material 13 and heat pipe 12；Wherein, the heat-conducting metal block 17 is arranged on pcb board 16, passes through the heat-conducting layer 16a on the PCB
It is connected with the heat-generating electronic elements 15 set on the pcb board 16；The elastic thermal interfacial material 18 is fitted in the heat conduction gold
Belong on block 17；The heat pipe 12 is fitted on the elastic thermal interfacial material 18.
Optionally, the electronic equipment, in addition to：Thermal bracket 141, in the housing 142；The heat pipe and institute
Thermal bracket 141 is stated to be connected.
It should be noted that thermal bracket 141 can be metallic support, such as the metal material such as aluminium, copper, magnesium alloy makes
Metallic support, certain thermal bracket 141 can also be surface have heat conducting film made of graphite material graphite holders.
Optionally, the heat-conducting layer 16a is specially：First layers of copper on the pcb board surface, and/or inside the pcb board
The second layers of copper.
Optionally, the radiating subassembly 140 that the embodiment of the present application provides also includes：Shielding element, open on the shielding element
Provided with a through hole, the heat pipe 12 is located on the through hole, and the shielding element is electrically connected with the heat pipe 12, the heat pipe
12nd, the pcb board 16 and the shielding element form one and are used to accommodate the heat-generating electronic elements 15 and the heat-conducting metal block
Electro-magnetic shielding cover.
Optionally, the shielding element is electrically connected with the heat pipe 12, is specially：The heat pipe 12 and the shielding member
Part is connected by electroconductive elastic sheet or conductive interface material.
Optionally, the radiating subassembly 140 also includes：The conductive interface material, enclose and be located at the through hole surrounding, with institute
State shielding element and the heat pipe 12 is bonded to each other.
Optionally, the shielding element includes the electroconductive elastic sheet, and the electroconductive elastic sheet, which encloses, is located at the through hole surrounding, institute
Shell fragment is stated to be electrically connected with the heat pipe.
Various change mode in radiating subassembly and instantiation in earlier figures 8~Figure 10 embodiments are equally applicable to this
The electronic equipment of embodiment, by the foregoing detailed description to radiating subassembly, those skilled in the art are clear that this
The implementation of electronic equipment in embodiment, thus it is succinct for specification, it will not be described in detail herein.
Embodiment seven
Figure 15 is refer to, the embodiment of the present application also provides a kind of electronic equipment, and the electronic equipment includes：
Housing 152；
Radiating subassembly 150, in the housing 152, the radiating subassembly 150 include shielding element 21, heat pipe 12 and
First elastic thermal interfacial material 13；Wherein, the shielding element 11 is located on the heat-generating electronic elements 15 of pcb board 16, described
The ground layers of copper of shielding element 21 and the pcb board 16 is electrically connected；The heat pipe 12 is located on the shielding element 21, wherein,
The heat pipe 12 is connected by way of welding or being bonded with the shielding element 21；The first elastic thermal interfacial material 13 pastes
Close between the heat-generating electronic elements 15 and the shielding element 21.
Optionally, the electronic equipment, in addition to：Thermal bracket 151, in the housing 152；The heat pipe 12 with
The thermal bracket 151 is connected.
It should be noted that thermal bracket 151 can be metallic support, such as the metal material such as aluminium, copper, magnesium alloy makes
Metallic support, certain thermal bracket 151 can also be surface have heat conducting film made of graphite material graphite holders.
Optionally, the radiating subassembly 150 that the embodiment of the present application provides also includes：Heat-conducting metal block, it is arranged on the pcb board
On 16, wherein, the heat-conducting metal block is connected by the ground layers of copper on the pcb board 16 with the heat-generating electronic elements 15；The
Two elastic thermal interfacial materials, between the heat-conducting metal block and the heat pipe 12, with the heat-conducting metal block and the heat
Pipe 12 is bonded to each other.
Various change mode and instantiation in radiating subassembly in earlier figures 11 and Figure 12 embodiments are equally applicable to
The electronic equipment of the present embodiment, by the foregoing detailed description to radiating subassembly, those skilled in the art are clear that
The implementation of electronic equipment in the present embodiment, thus it is succinct for specification, it will not be described in detail herein.
One or more embodiments of the invention, it can at least realize following technique effect：Opened up on shielding element logical
Hole, the thermal interfacial material being fitted on heat-generating electronic elements is directly bonded with heat pipe by the through hole so that heating electronics member
The heat of part only can be passed to heat pipe by one layer of thermal interfacial material, reduce the thermal resistance of radiating subassembly and shorten heating electronics
Heat-transfer path between element and heat pipe, so as to solve the poor technology of heat dispersion existing for radiating subassembly in the prior art
Problem, substantially increase the heat dispersion of radiating subassembly.
It is understood that the electronic equipment in above-described embodiment can be mobile phone, router, Wearable, modulation
Demodulator, TV or set top box etc..
Although preferred embodiments of the present invention have been described, but those skilled in the art once know basic creation
Property concept, then can make other change and modification to these embodiments.So appended claims be intended to be construed to include it is excellent
Select embodiment and fall into having altered and changing for the scope of the invention.
Obviously, those skilled in the art can carry out various changes and modification without departing from this hair to the embodiment of the present invention
The spirit and scope of bright embodiment.So, if these modifications and variations of the embodiment of the present invention belong to the claims in the present invention
And its within the scope of equivalent technologies, then the present invention is also intended to comprising including these changes and modification.
Claims (22)
- A kind of 1. radiating subassembly, it is characterised in that including：Shielding element, a through hole, the ground copper electrical connection of the shielding element and pcb board, institute are offered on the shielding element State pcb board and be provided with heat-generating electronic elements；Heat pipe, on the through hole, the heat pipe is electrically connected with the shielding element, wherein, the heat pipe, the PCB Plate and the shielding element form an electro-magnetic shielding cover for being used to accommodate the heat-generating electronic elements；First elastic thermal interfacial material, between the heat pipe and the heat-generating electronic elements, and with the heat pipe and described Heat-generating electronic elements are bonded to each other；Second elastic thermal interfacial material, is bonded to each other with the heat pipe；Heat-conducting metal block, be arranged between the described second elastic thermal interfacial material and the pcb board, and with second elastic hot Boundary material is bonded to each other, wherein, the heat-conducting metal block passes through the heat-conducting layer on the pcb board and the heat-generating electronic elements It is connected, the heat-conducting metal block is located in the shielding element, the first elastic thermal interfacial material and second elastic hot Boundary material is formed in one structure.
- 2. component as claimed in claim 1, it is characterised in that the heat pipe is electrically connected with the shielding element, is specially：The heat pipe is electrically connected with the shielding element by electroconductive elastic sheet or conductive interface material.
- 3. component as claimed in claim 2, it is characterised in that the component also includes：The conductive interface material, enclose and be located at the through hole surrounding, be bonded to each other with the shielding element and the heat pipe.
- 4. component as claimed in claim 2, it is characterised in that the shielding element includes the electroconductive elastic sheet, the conduction Shell fragment, which encloses, is located at the through hole surrounding, and the shell fragment is electrically connected with the heat pipe.
- 5. component as claimed in claim 1, it is characterised in that the first elastic thermal interfacial material is specially：Elastic conduction Thermal interfacial material or elastic insulated thermal interfacial material, the first elastic thermal interfacial material pass through the through hole and the heat pipe It is bonded to each other.
- 6. component as claimed in claim 1, it is characterised in that the second elastic thermal interfacial material is specially：Elastic conduction Thermal interfacial material or elastic insulated thermal interfacial material.
- A kind of 7. radiating subassembly, it is characterised in that including：Heat-conducting metal block, is arranged on pcb board, passes through the heating electronics member set on the heat-conducting layer of the PCB and the pcb board Part is connected；Elastic thermal interfacial material, it is fitted on the heat-conducting metal block；Heat pipe, it is fitted on the elastic thermal interfacial material；Shielding element, offer a through hole on the shielding element, the heat pipe is located on the through hole, the shielding element with The heat pipe electrical connection, the heat pipe, the pcb board and the shielding element form one and are used to accommodate the heating electronics member The electro-magnetic shielding cover of part and the heat-conducting metal block.
- 8. component as claimed in claim 7, it is characterised in that the heat-conducting layer is specially：First bronze medal on the pcb board surface Layer, and/or the second layers of copper inside the pcb board.
- 9. component as claimed in claim 7, it is characterised in that the shielding element is electrically connected with the heat pipe, is specially：The heat pipe is electrically connected with the shielding element by electroconductive elastic sheet or conductive interface material.
- 10. component as claimed in claim 9, it is characterised in that the component also includes：The conductive interface material, enclose and be located at the through hole surrounding, be bonded to each other with the shielding element and the heat pipe.
- 11. component as claimed in claim 9, it is characterised in that the shielding element includes the electroconductive elastic sheet, the conduction Shell fragment, which encloses, is located at the through hole surrounding, and the shell fragment is electrically connected with the heat pipe.
- A kind of 12. radiating subassembly, it is characterised in that including：Shielding element, it is located on the heat-generating electronic elements of pcb board, the ground layers of copper of the shielding element and the pcb board is electric Connection；Heat pipe, on the shielding element, wherein, the heat pipe is connected by way of welding with the shielding element；Its In, the mode of the welding is used to reduce the thermal resistance between the heat pipe and the shielding element；First elastic thermal interfacial material, is fitted between the heat-generating electronic elements and the shielding element；Heat-conducting metal block, it is arranged on the pcb board, wherein, the heat-conducting metal block passes through described ground layers of copper and the heating Electronic component is connected；Second elastic thermal interfacial material, between the heat-conducting metal block and the heat pipe, with the heat-conducting metal block and institute Heat pipe is stated to be bonded to each other.
- 13. a kind of electronic equipment, it is characterised in that including：Housing；Radiating subassembly, in the housing, the radiating subassembly includes shielding element, heat pipe, the first elastic thermal interfacial material；Wherein, a through hole, the ground copper electrical connection of the shielding element and pcb board, the PCB are offered on the shielding element Plate is provided with heat-generating electronic elements；The heat pipe is located on the through hole, and the heat pipe is electrically connected with the shielding element, its In, the heat pipe, the pcb board and the shielding element form an electromagnetic shielding for being used to accommodate the heat-generating electronic elements Cover；The first elastic thermal interfacial material between the heat pipe and the heat-generating electronic elements, and with the heat pipe and institute Heat-generating electronic elements are stated to be bonded to each other；The radiating subassembly also includes：Second elastic thermal interfacial material, is bonded to each other with the heat pipe；Heat-conducting metal block, be arranged between the described second elastic thermal interfacial material and the pcb board, and with second elastic hot Boundary material is bonded to each other, wherein, the heat-conducting metal block passes through the heat-conducting layer on the pcb board and the heat-generating electronic elements It is connected, the heat-conducting metal block is located in the shielding element, the first elastic thermal interfacial material and second elastic hot Boundary material is formed in one structure.
- 14. electronic equipment as claimed in claim 13, it is characterised in that the heat pipe is electrically connected with the shielding element, Specially：The heat pipe is electrically connected with the shielding element by electroconductive elastic sheet or conductive interface material.
- 15. electronic equipment as claimed in claim 13, it is characterised in that the electronic equipment also includes：Thermal bracket, it is located at In the housing, the thermal bracket is connected with the heat pipe.
- 16. electronic equipment as claimed in claim 13, it is characterised in that the second elastic thermal interfacial material is specially：Bullet Property conduction thermal interfacial material or elastic insulated thermal interfacial material.
- 17. a kind of electronic equipment, it is characterised in that including：Housing；Radiating subassembly, in the housing, the radiating subassembly includes heat-conducting metal block, elastic thermal interfacial material and heat pipe； Wherein, the heat-conducting metal block is arranged on pcb board, passes through the heating electric set on the heat-conducting layer of the PCB and the pcb board Subcomponent is connected；The elastic thermal interfacial material is fitted on the heat-conducting metal block；The heat pipe is fitted in the elastic hot On boundary material；The radiating subassembly also includes：Shielding element, offer a through hole on the shielding element, the heat pipe is located on the through hole, the shielding element with The heat pipe electrical connection, the heat pipe, the pcb board and the shielding element form one and are used to accommodate the heating electronics member The electro-magnetic shielding cover of part and the heat-conducting metal block.
- 18. electronic equipment as claimed in claim 17, it is characterised in that the heat-conducting layer is specially：The pcb board surface The second layers of copper inside first layers of copper, and/or the pcb board.
- 19. electronic equipment as claimed in claim 17, it is characterised in that the shielding element is electrically connected with the heat pipe, Specially：The heat pipe is electrically connected with the shielding element by electroconductive elastic sheet or conductive interface material.
- 20. electronic equipment as claimed in claim 17, it is characterised in that the electronic equipment also includes：Thermal bracket, it is located at In the housing, the thermal bracket is connected with the heat pipe.
- 21. a kind of electronic equipment, it is characterised in that including：Housing；Radiating subassembly, in the housing, the radiating subassembly includes shielding element, heat pipe and the first elastic hot interface material Material, wherein, the shielding element is located on the heat-generating electronic elements of pcb board, the ground copper of the shielding element and the pcb board Layer electrical connection；The heat pipe is located on the shielding element, wherein, the heat pipe is first with the shielding by way of welding Part connects, and the mode of the welding is used to reduce the thermal resistance between the heat pipe and the shielding element；First elastic hot Boundary material is fitted between the heat-generating electronic elements and the shielding element；Heat-conducting metal block, it is arranged on the pcb board, wherein, the heat-conducting metal block passes through described ground layers of copper and the heating Electronic component is connected；Second elastic thermal interfacial material, between the heat-conducting metal block and the heat pipe, with the heat-conducting metal block and institute Heat pipe is stated to be bonded to each other.
- 22. electronic equipment as claimed in claim 21, it is characterised in that the electronic equipment also includes：Thermal bracket, it is located at In the housing, the thermal bracket is connected with the heat pipe.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2014/073633 WO2015139213A1 (en) | 2014-03-18 | 2014-03-18 | Heat dissipation assembly and electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104813760A CN104813760A (en) | 2015-07-29 |
| CN104813760B true CN104813760B (en) | 2018-02-02 |
Family
ID=53696578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480003087.6A Active CN104813760B (en) | 2014-03-18 | 2014-03-18 | A kind of radiating subassembly and electronic equipment |
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| Country | Link |
|---|---|
| US (3) | US10103087B2 (en) |
| EP (1) | EP3107361B1 (en) |
| JP (1) | JP6284654B2 (en) |
| CN (1) | CN104813760B (en) |
| WO (1) | WO2015139213A1 (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| US10497641B2 (en) | 2019-12-03 |
| EP3107361B1 (en) | 2020-10-28 |
| CN104813760A (en) | 2015-07-29 |
| WO2015139213A1 (en) | 2015-09-24 |
| US20190027423A1 (en) | 2019-01-24 |
| EP3107361A1 (en) | 2016-12-21 |
| JP6284654B2 (en) | 2018-02-28 |
| EP3107361A4 (en) | 2017-03-29 |
| US20170098592A1 (en) | 2017-04-06 |
| US20200083144A1 (en) | 2020-03-12 |
| JP2017515300A (en) | 2017-06-08 |
| US10103087B2 (en) | 2018-10-16 |
| US10756000B2 (en) | 2020-08-25 |
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Effective date of registration: 20171027 Address after: Metro Songshan Lake high tech Industrial Development Zone, Guangdong Province, Dongguan City Road 523808 No. 2 South Factory (1) project B2 -5 production workshop Applicant after: HUAWEI terminal (Dongguan) Co., Ltd. Address before: 518129 Longgang District, Guangdong, Bantian HUAWEI base B District, building 2, building No. Applicant before: Huawei Device Co., Ltd. |
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Address after: 523808 Southern Factory Building (Phase I) Project B2 Production Plant-5, New Town Avenue, Songshan Lake High-tech Industrial Development Zone, Dongguan City, Guangdong Province Patentee after: Huawei Device Co., Ltd. Address before: 523808 Southern Factory Building (Phase I) Project B2 Production Plant-5, New Town Avenue, Songshan Lake High-tech Industrial Development Zone, Dongguan City, Guangdong Province Patentee before: HUAWEI terminal (Dongguan) Co., Ltd. |