CN215834516U - Heat conducting device for electronic element - Google Patents
Heat conducting device for electronic element Download PDFInfo
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- CN215834516U CN215834516U CN202121786618.7U CN202121786618U CN215834516U CN 215834516 U CN215834516 U CN 215834516U CN 202121786618 U CN202121786618 U CN 202121786618U CN 215834516 U CN215834516 U CN 215834516U
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Abstract
A heat conduction device for electronic components comprises: a substrate on which an electronic element is disposed; a metal heat sink having a first surface and a second surface opposite to the first surface, wherein the first surface faces the upper part of the electronic component; wherein, the first surface of the metal heat sink is plated with an anti-corrosion layer; and a high heat conduction heat dissipation layer with a non-liquid structure formed by heat conduction paste is arranged between the metal heat dissipation part and the electronic element. Therefore, the utility model can solve the defects caused by the existing liquid metal heat dissipation material; the high heat-conducting heat-dissipating layer with a non-liquid structure can be arranged on chips of electronic devices such as computers, mobile phones and the like, so that the multiple effects of high heat-conducting coefficient, good heat dissipation, ideal buffering property, safety and stability and the like are improved.
Description
Technical Field
The present invention relates to a heat conduction device for electronic components, and more particularly, to a heat conduction device having a "non-liquid structure" high thermal conduction heat dissipation layer.
Background
In recent years, development of semiconductor devices such as a high-power Central Processing Unit (CPU) and a Graphics Processing Unit (GPU) has been accelerated. Electronic devices tend to be more light, thin and multiplex, and due to the fact that the density and frequency of electronic components are increased, local overheating occurs after long-term use, chips of electronic devices are generally used as main heat sources during operation, heat dissipation is not only to reduce the temperature of the chips so as to ensure the chips to work normally within a required temperature range, meanwhile, the heat dissipation method of the present electronic device mainly utilizes the simple methods of opening holes, heat conduction, heat convection, etc., however, these heat dissipation methods cannot meet the heat generated by the high-performance chip, so that there is an overheating problem, and the heat cannot be uniformly distributed, which results in a decrease in the heat dissipation efficiency inside the mobile electronic device, and further causes a frequency reduction or over-slow down of the mobile phone command.
At present, graphite film materials are widely used in heat dissipation and heat-resistant sealing materials for electronic products in current industrial applications due to their excellent characteristics, including high thermal conductivity, heat resistance, corrosion resistance and high electrical conductivity. The current heat dissipation technology is mainly characterized in that graphite heat dissipation fins are directly connected with a heating part, but the heat dissipation fins and the heating part are good in contact, but some discontinuous point contacts exist really, gaps of contact surfaces are filled with air or adhesive, and the heat conductivity coefficient of the air is only 0.1W/mk; the thickness of the coated adhesive layer is usually 5-15 micrometers, and the adhesive layer can greatly influence the heat dissipation, so that the interface thermal resistance is very high.
The liquid metal is a low-melting-point alloy which is liquid at normal temperature, and the main components of the liquid metal are gallium indium tin alloy, indium bismuth zinc alloy and the like; since it is stable and has excellent thermal and electrical conductivity, there are many manufacturers who use liquid metal instead of graphite film material to solve the above problems. However, the use of liquid metal as a heat sink material is not without disadvantages; for example, in the prior art, liquid metal and a heat-conducting film are compounded, and when the heat-conducting film is used, the liquid metal is melted along with the rise of the temperature of a heat source and is tightly attached to the interface of the heat source and a radiator, so that the thermal contact resistance between the heat source and the radiator is obviously reduced. However, the liquid metal and the heat sink are often in direct contact, which also results in a shortened service life and may be separated from each other over time; in addition, the liquid metal is liquid, so that leakage is easy to occur, and short circuit is caused.
In view of the above problems, the present inventors further propose a solution to the disadvantages caused by the liquid metal heat dissipation material.
SUMMERY OF THE UTILITY MODEL
Accordingly, the present invention is directed to a heat conductive device for electronic components, which can solve the disadvantages caused by liquid metal heat dissipation materials, and a non-liquid high thermal conductivity heat dissipation layer can be disposed on the chip of electronic devices such as computer and mobile phone, so as to achieve the enhancement of high thermal conductivity, buffering property, and safety and stability.
To achieve the above object, the technical means adopted by the present invention comprises: a substrate, on which an electronic element is arranged; a metal heat sink having a first surface and an opposite second surface, wherein the first surface faces the top of the electronic component; wherein, the first surface of the metal heat sink is plated with an anti-corrosion layer; and a high heat-conducting heat-dissipating layer with a non-liquid structure formed by heat-conducting paste is arranged between the metal heat-dissipating member and the electronic element.
According to the above-mentioned features, the heat dissipation layer with high thermal conductivity may include a non-liquid layer structure formed by paste or glue solid.
According to the above-mentioned features, the substrate can be a printed circuit board, and the electronic component is a semiconductor chip.
According to the above-mentioned features, the metal heat sink can be a flat plate.
According to the above-mentioned features, the second surface of the flat heat sink may further have a plurality of heat dissipation fins.
According to the above-disclosed features, the corrosion-resistant layer may be comprised of nickel metal.
According to the above-mentioned features, the electronic device further includes a frame disposed on the substrate and surrounding the electronic device.
By the technical means disclosed above, the present invention can solve the disadvantages caused by the existing "liquid metal" heat dissipation material; the high heat-conducting heat-dissipating layer with a non-liquid structure can be arranged on chips of electronic devices such as computers, mobile phones and the like, so that the multiple effects of high heat-conducting coefficient, good heat dissipation, ideal buffering property, safety and stability and the like are improved.
Drawings
FIG. 1 is an exploded perspective view of a first embodiment of the present invention.
Fig. 2 is a combined cross-sectional view of a first embodiment of the utility model.
Fig. 3 is a combined cross-sectional view of a second embodiment of the utility model.
List of reference numerals: 10-a substrate; 20-an electronic component; 30-a metal heat sink; 31-a first surface; 32-a second surface; 33-heat dissipating fins; 40-an anti-corrosion layer; 50-high thermal conductivity heat dissipation layer; and 60-frame body.
Detailed Description
First, referring to fig. 1-2, a first embodiment of a "heat conduction device of an electronic device" of the present invention includes:
a substrate 10, on which an electronic device 20 is disposed on the substrate 10; in this embodiment, the substrate 10 is a Printed Circuit Board (PCB), and the electronic component 20 is a semiconductor chip.
A metal heat sink 30 having a first surface 31 and an opposite second surface 32, wherein the first surface 31 faces the top of the electronic component 20; in the present embodiment, the metal heat sink 30 is a flat plate, but is not limited thereto. The above structure is a Prior Art (color Art), which is not the subject of the present invention and will not be described in detail.
The utility model is characterized in that the first surface 31 of the metal heat sink 30 is plated with a corrosion layer 40; and a high thermal conductivity heat dissipation layer 50 with a non-liquid structure formed by thermal conductive paste is disposed between the metal heat dissipation member 30 and the electronic component 20. In this embodiment, the heat dissipation layer 50 with high thermal conductivity includes a Paste (Paste) or a Glue Solid (Glue Solid) non-liquid layered structure type composed of an insulating silicone material, but is not limited thereto; non-liquid layer structure type such as Paste (Paste) or Glue Solid (Glue Solid) composed of metal, metal alloy, etc. with high thermal conductivity can also be implemented.
In this embodiment, the thermal conductivity of the high thermal conductivity heat dissipation layer 50 can reach 8.0W/mk or more, so that the heat dissipation layer has an excellent heat dissipation function. More importantly, the heat dissipation layer 50 with high thermal conductivity is a paste or a glue solid at room temperature, which is completely different from the conventional "liquid metal" heat dissipation material, so that there is no concern about the short circuit caused by liquid leakage, and the efficacy of safety and stability is enhanced. Moreover, the heat dissipation layer 50 with high thermal conductivity is Paste (Paste) or Glue Solid (Glue Solid), and is not a rigid body or a Solid body, so that it has elasticity, and is disposed between the electronic component 20 and the metal heat dissipation member 30, so that the interface between the heat source of the electronic component 20 and the heat dissipation member 30 can be tightly attached, and the thermal contact resistance between the heat source and the metal heat dissipation member can be significantly reduced; because of its elasticity, an elastic buffer force is provided between the electronic component 20 and the metal heat sink 30, so that the electronic component 20 is not easily damaged by the pressure of the metal heat sink 30.
In the present embodiment, the corrosion protection layer 40 may be made of nickel metal, but is not limited thereto. Nickel metal has excellent corrosion resistance and can be attached to the first surface 31 of the metal heat spreader 30 by plating or coating techniques. Therefore, the metal heat dissipation member 30 is not easily corroded by the material of the high thermal conductivity heat dissipation layer 50, and the service life and reliability thereof can be ensured.
In this embodiment, the electronic device further includes a frame 60 disposed on the substrate 10 and surrounding the electronic component 20. Although the heat dissipation layer 50 of the present invention is in the form of Paste (Paste) or Glue Solid (Glue Solid), it is not easy to leak liquid and cause short circuit. However, for the sake of safety, if the electronic component 20 is overheated due to abnormality, such that the heat dissipation layer 50 with high thermal conductivity is softened, the frame 60 can ensure that the liquid will not leak out and cause short circuit. Has the advantages of double security guarantee,
fig. 3 is a combined cross-sectional view of a second preferred embodiment of the present invention, which has the same structure as the first embodiment and is indicated by the same reference numerals, and the difference is that the flat heat sink 30 further has a plurality of heat dissipation fins 33 on a second surface 32 thereof.
By the technical means disclosed above, the present invention can solve the disadvantages caused by the existing "liquid metal" heat dissipation material; the heat dissipation layer 50 with high thermal conductivity, which is a non-liquid structure, can be disposed on the chip of electronic devices such as computers and mobile phones, so as to achieve the enhancement of multiple effects such as high thermal conductivity, good heat dissipation, ideal buffering property and safety and stability.
It should be understood, however, that the drawings and detailed description thereto are merely exemplary of the utility model, and that various modifications and equivalent arrangements included within the spirit and scope of the present invention will be apparent to those skilled in the art from this disclosure.
Claims (7)
1. A heat conduction device for electronic components comprises:
a substrate, on which an electronic element is arranged;
a metal heat sink having a first surface and an opposite second surface, wherein the first surface faces the top of the electronic component; the method is characterized in that:
the first surface of the metal heat dissipation piece is plated with an anti-corrosion layer; and
a high heat-conducting heat-dissipating layer with a non-liquid structure formed by heat-conducting paste is arranged between the metal heat-dissipating member and the electronic component.
2. The heat transfer device of an electronic component according to claim 1, wherein: the high heat-conducting heat-dissipating layer is in a non-liquid layered structure form composed of paste or glue solid.
3. The heat transfer device of an electronic component according to claim 1, wherein: the substrate is a printed circuit board, and the electronic component is a semiconductor chip.
4. The heat transfer device of an electronic component according to claim 1, wherein: the metal heat sink is a flat plate.
5. The heat transfer device of an electronic component according to claim 4, wherein: the second surface of the flat heat sink is also provided with a plurality of heat dissipation fins.
6. The heat transfer device of an electronic component according to claim 1, wherein: the anti-corrosion layer is composed of nickel metal.
7. The heat transfer device of an electronic component according to claim 1, wherein: further includes a frame disposed on the substrate and surrounding the electronic device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121786618.7U CN215834516U (en) | 2021-08-02 | 2021-08-02 | Heat conducting device for electronic element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121786618.7U CN215834516U (en) | 2021-08-02 | 2021-08-02 | Heat conducting device for electronic element |
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| Publication Number | Publication Date |
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| CN215834516U true CN215834516U (en) | 2022-02-15 |
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| CN202121786618.7U Active CN215834516U (en) | 2021-08-02 | 2021-08-02 | Heat conducting device for electronic element |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114501961A (en) * | 2022-03-21 | 2022-05-13 | 联想(北京)有限公司 | Electronic device and method for manufacturing the same |
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2021
- 2021-08-02 CN CN202121786618.7U patent/CN215834516U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114501961A (en) * | 2022-03-21 | 2022-05-13 | 联想(北京)有限公司 | Electronic device and method for manufacturing the same |
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