CN218217969U - Heat dissipation assembly for chip, controller and operation machine - Google Patents
Heat dissipation assembly for chip, controller and operation machine Download PDFInfo
- Publication number
- CN218217969U CN218217969U CN202222305915.6U CN202222305915U CN218217969U CN 218217969 U CN218217969 U CN 218217969U CN 202222305915 U CN202222305915 U CN 202222305915U CN 218217969 U CN218217969 U CN 218217969U
- Authority
- CN
- China
- Prior art keywords
- heat
- chip
- heat dissipation
- upper cover
- heat conduction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model relates to the technical field of heat dissipation devices, and provides a heat dissipation assembly, a controller and an operation machine for a chip, wherein the chip is positioned in a cavity enclosed by an upper cover and a lower cover, the heat dissipation assembly for the chip comprises a heat conduction buffer part, a heat dissipation pipe structure and a graphene coating, and the heat conduction buffer part is arranged on one side of the chip; the heat radiation pipe structure is closely contacted with one side of the heat conduction buffer part far away from the chip; and the radiating tube structure is connected with the upper cover through the tin paste layer. The utility model provides a heat radiation component, a controller and an operation machine for a chip, wherein a heat radiation pipe structure is fixedly connected with an upper cover through a tin paste layer, so that the heat conduction capability between the heat radiation pipe structure and a metal shell is enhanced; in addition, the outer surface of the upper cover is provided with the graphene coating, so that the heat radiation capability of the product can be improved.
Description
Technical Field
The utility model relates to a heat abstractor technical field especially relates to a radiator unit, controller and operation machinery for chip.
Background
Along with the requirement for intelligent control of engineering machinery vehicles is higher and higher, a large amount of heat can be generated when the chip runs, wherein the heat dissipated by the chip on a printed circuit board in the controller is higher and higher, when the temperature is too high, the chip can open a protection mechanism of the chip, so that the processing capacity is reduced, and even the controller is halted seriously, so that the use is influenced.
Because the air convection in the cavity is weak due to the high protection design requirement of the electrical equipment of the engineering machinery, the built-in fan cannot be used for removing heat, and therefore, heat can be dissipated only by heat conduction.
However, in the prior art, a heat sink is often provided on the surface of the chip, but a gap is usually left between the heat sink and the controller case, which results in low heat dissipation efficiency.
SUMMERY OF THE UTILITY MODEL
The utility model provides a radiator unit, controller and operation machinery for the chip for solve the defect that the radiator unit's that is used for the chip among the prior art radiating efficiency is low, realize improving the radiating efficiency, ensure the normal work of chip.
The utility model provides a radiator unit for chip, the chip is located the cavity that upper cover and lower cover enclose, include:
the heat conduction buffer piece is arranged on one side of the chip;
the heat dissipation tube structure is in close contact with one side of the heat conduction buffer part, which is far away from the chip; and the heat dissipation tube structure is connected with the upper cover through a tin paste layer.
According to the utility model provides a pair of a radiator unit for chip, the cooling tube structure includes:
the heat dissipation base is in close contact with one side, far away from the chip, of the heat conduction buffer piece;
the radiating pipe is arranged on the other side of the radiating base and is connected with the upper cover through a tin paste layer.
According to the utility model provides a pair of a radiating component for chip, the cooling tube has many, and many the cooling tube can extend to each edge of upper cover.
According to the utility model provides a pair of a radiating component for chip, the cooling tube with the area of contact of upper cover is greater than the cross-sectional area of heat dissipation base.
According to the utility model provides a pair of a radiator unit for chip, the heat dissipation base includes:
one side of the mounting part is in close contact with one side of the heat-conducting buffering part far away from the chip, and the other side of the mounting part is connected with the radiating pipe;
and the fixing parts are integrally connected to two sides of the first installation part and are used for being connected with the upper cover.
According to the utility model provides a pair of a radiating component for chip, the cooling tube is L type or U type.
According to the utility model provides a pair of a radiator unit for chip, the surface of upper cover is provided with the graphite alkene coating.
According to the utility model provides a pair of a radiator unit for chip, the radiator pipe structure is copper radiator pipe structure, the heat conduction bolster is heat conduction silicone piece or heat conduction silicone grease.
The utility model also provides a controller, include as above a radiator unit for chip.
The utility model also provides a working machine, include as above the controller.
The heat radiation component for the chip provided by the utility model can fill the gap through the heat conduction buffer member, and can open the heat channel between the chip and the heat radiation pipe structure, thereby effectively improving the heat conduction efficiency and playing the roles of insulation, shock absorption and sealing; the heat dissipation tube structure is fixedly connected with the upper cover through a tin paste layer in a heating mode, and the heat conduction capacity between the heat dissipation tube structure and the metal shell is enhanced; in addition, the surface of upper cover is provided with graphite alkene coating, can improve the heat radiation ability of product.
The utility model discloses a controller, owing to include as above the radiator unit who is used for the chip, consequently possess as above various advantages.
The utility model discloses a working machine, because the indirect radiator unit who is used for the chip that includes as above, consequently possess as above various advantages.
Drawings
In order to more clearly illustrate the technical solutions of the present invention or the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a sectional view of a mounting structure of a heat dissipation assembly for a chip according to the present invention;
fig. 2 is a schematic view of an installation structure of a heat dissipation assembly for a chip according to the present invention;
reference numerals:
1. a chip; 2. an upper cover; 3. a lower cover; 4. a thermally conductive buffer; 5. a heat dissipation tube structure; 51. a heat dissipation base; 511. an installation part; 512. a fixed part; 52. a heat radiation pipe.
Detailed Description
To make the objects, technical solutions and advantages of the present invention clearer, the drawings of the present invention are combined to clearly and completely describe the technical solutions of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
In the description of the embodiments of the present invention, it should be noted that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings, which are merely for convenience of description and simplification of the description of the embodiments of the present invention, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore, should not be construed as limiting the embodiments of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the embodiments of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "connected" and "connected" should be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the embodiments of the present invention can be understood by those of ordinary skill in the art according to specific situations.
In the description of the present specification, references to the description of "one embodiment," "some embodiments," "an example," "a specific example," or "some examples" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the embodiments of the present invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
The heat dissipation assembly, the controller and the working machine for a chip according to the present invention are described below with reference to fig. 1 to 2.
As shown in fig. 1, the present invention provides a heat dissipation assembly for a chip, wherein the chip 1 is located in a cavity enclosed by an upper cover 2 and a lower cover 3, and includes a heat conduction buffer 4, a heat dissipation tube structure 5 and a graphene coating, the heat conduction buffer 4 is disposed on one side of the chip 1; the radiating tube structure 5 is closely contacted with one side of the heat conducting buffer piece 4 far away from the chip 1; and the radiating pipe structure 5 is connected with the upper cover 2 through a tin paste layer.
The heat radiation component for the chip provided by the utility model can fill gaps through the heat conduction buffering part 4, and can open a heat channel between the chip 1 and the heat radiation pipe structure 5, thereby effectively improving the heat conduction efficiency and simultaneously playing the roles of insulation, shock absorption and sealing; the heat pipe structure 5 is fixedly connected with the upper cover 2 through a tin paste layer in a heating mode, and the heat conduction capacity between the heat pipe structure 5 and the upper cover 2 is enhanced.
Generally speaking, upper cover 2 and lower cover 3 all set up and adopt the metal material to make, because the coefficient of heat conductivity of metal is high, set up upper cover 2 and lower cover 3 into the metal material, can ensure the heat conductivility of upper cover 2 and lower cover 3, are favorable to the heat dissipation of chip. Of course, plastic shells may also be used where the heating value is not high in special cases.
In the embodiment of the present invention, the heat dissipation pipe structure 5 includes a heat dissipation base 51 and a heat dissipation pipe 52, the heat dissipation base 51 is in close contact with a side of the heat conductive buffer 4 away from the chip 1; the heat generated by the chip 1 in the working process is transferred to the heat dissipation base 51 through the heat conduction buffer 4; the heat pipe 52 is disposed at the other side of the heat base 51, and the heat pipe 52 is connected to the upper cover 2 through the solder paste layer, and the heat transferred to the heat base 51 is dissipated through the heat pipe 52, and transferred to the upper cover 2 through the solder paste layer and dissipated.
The solder paste layer can be understood as a material layer formed after the solder paste passes through soldering. Solder paste is a new type of soldering material produced along with SMT (Surface Mount Technology), and is a paste mixture formed by mixing solder powder, flux, other surfactants, thixotropic agents, and the like. The method is mainly used for welding electronic element devices such as Printed Circuit Board (PCB) surface resistance and capacitance in the SMT industry.
The heat conducting capacity between the heat pipe 52 and the upper cover 2 can be enhanced by connecting the heat pipe with the upper cover 2 through a solder paste layer, that is, by heating and curing the solder paste.
In the embodiment of the present invention, the heat dissipation pipes 52 have a plurality of heat dissipation pipes 52, and the plurality of heat dissipation pipes 52 can be extended to each edge of the upper cover 2. The radiating pipes 52 are uniformly distributed in the cavity between the upper cover 2 and the lower cover 3, increasing the radiating area and being beneficial to improving the radiating efficiency. For example, the upper cover 2 and the lower cover 3 are square, one end of the plurality of radiating pipes 52 is connected to the radiating base 51, and the other end extends to the edges of the four rims of the upper cover 2 and the lower cover 3, wherein the extension of the radiating pipes 52 can be distributed in the cavity in any shape, so as to increase the radiating area of the radiating pipes 52 in the limited space of the upper cover 2 and the lower cover 3.
In the embodiment of the present invention, the contact area between the heat dissipation tube 52 and the upper cover 2 is larger than the cross-sectional area of the heat dissipation base 51, so as to increase the heat dissipation area and improve the heat dissipation efficiency.
In the embodiment of the present invention, the heat dissipation tube structure 5 is a copper heat dissipation tube structure. Copper is a reddish-red metal that is somewhat hard, very tough, wear resistant, has good ductility, good thermal conductivity, electrical conductivity, and corrosion resistance. As shown in fig. 2, the heat dissipation base 51 and the heat dissipation pipe 52 are made of copper material, which has good heat conduction efficiency, and further improves the heat dissipation capability. Of course, the material of the heat pipe structure 5 includes but is not limited to copper material, and other materials with good heat conductivity may also be used.
As shown in fig. 2, in the embodiment of the present invention, the heat-dissipating base 51 includes a mounting portion 511 and a fixing portion 512, one side of the mounting portion 511 is in close contact with a side of the heat-conducting buffer 4 away from the chip 1, one side of the mounting portion 511 is used for receiving heat transferred by the heat-conducting buffer 4, and the other side is in close contact with the fixing portion 512, so as to transfer the heat of the mounting portion 511 to the fixing portion 512; the fixing portions 512 are integrally connected to both sides of the mounting portion 511, and the fixing portions 512 are used to connect with the upper cover 2, so that heat is transferred to the upper cover 2 to dissipate heat.
That is, the heat generated from the chip 1 is transferred from the heat-conductive cushion 4 to the mounting portion 511, then to the fixing portion 512 and the heat pipe 52, and then to the upper cover 2.
Additionally, the utility model discloses an in the embodiment, the surface of upper cover 2 is provided with the graphite alkene coating, can improve the heat radiation ability of product.
Wherein, heat conduction bolster 4 adopts heat conduction silica gel piece or heat conduction silicone grease, and heat conduction silica gel piece or heat conduction silicone grease have high conductivity, increase heat transfer efficiency. The heat-conducting silica gel sheet is a heat-conducting medium material synthesized by a special process by taking silica gel as a base material and adding various auxiliary materials such as metal oxides and the like, is also called a heat-conducting silica gel pad, a heat-conducting silica gel sheet, a heat-conducting silica gel gasket and the like in the industry, can fill gaps, can get through a heat channel between a heating part and a radiating part, effectively improves the heat transfer efficiency, has the effects of insulation, shock absorption, sealing and the like, can meet the design requirements of miniaturization and ultra-thinness of equipment, and has public welfare and usability and wide thickness application range.
The heat-conducting silicone grease is an organic silicon material with high heat conductivity and insulation, can keep a grease state for a long time at the temperature of between 50 ℃ below zero and 230 ℃, has excellent electrical insulation and heat conductivity, can be widely applied to contact surfaces between heating bodies and heat dissipation facilities in various electronic products and electrical equipment, and has the functions of heat transfer media and the performances of moisture prevention, dust prevention, corrosion prevention, shock prevention and the like. The heat-conducting silicone grease has excellent heat-conducting effect, and is applied between the chip 1 and the radiating tube structure 5, so that the heat-conducting efficiency is improved.
In the embodiment of the present invention, the heat dissipation pipe 52 is L-shaped or U-shaped, and the heat dissipation pipe 52 can be set to any shape, so as to increase the heat dissipation area of the heat dissipation pipe 52 on the premise of not affecting the layout of other components.
The utility model provides a radiating component for chip, chip 1 are located the cavity that upper cover 2 and lower cover 3 enclose, including heat conduction bolster 4, set up in one side of chip 1, heat conduction bolster 4 can adopt high conductivity's heat conduction silica gel piece or heat conduction silicone grease, and heat conduction bolster 4 is used for transmitting the heat that chip 1 produced to cooling tube structure 5. The heat pipe structure 5 is for radiating heat transferred from the heat conductive buffer 4 to the upper cover 2, thereby achieving rapid heat radiation of the chip 1. The heat dissipation tube structure 5 may include a heat dissipation base 51 and a heat dissipation tube 52, wherein the heat dissipation base 51 is in close contact with a side of the heat conductive buffer 4 away from the chip 1; the heat pipe 52 is disposed on the other side of the heat pipe base 51, and the heat pipe 52 is connected to the upper cover 2 through a solder paste layer. The heat dissipation base 51 comprises a mounting portion 511 and a fixing portion 512, wherein one side of the mounting portion 511 is in close contact with one side of the heat conduction buffer 4 away from the chip 1, and the other side of the mounting portion is connected with the heat dissipation pipe 52; the fixing portions 512 are integrally connected to both sides of the mounting portion, and the fixing portions 512 are used for connecting with the upper cover 2. The heat dissipation tube 52 is L-shaped or U-shaped, or any other shape, the heat dissipation tube 52 is uniformly distributed in the cavity to increase the heat dissipation area, and the heat dissipation tube 52 and the upper lid 2 are fixedly connected by a tin paste layer to enhance the heat conduction capability between the heat dissipation tube 52 and the upper lid 2. In addition, the surface of the upper cover 2 is sprayed with a graphene coating, so that the heat radiation capability of the product can be improved.
The embodiment of the other aspect of the present invention also provides a controller, which includes the heat dissipation assembly for the chip 1 as described above.
The utility model discloses a controller, owing to include as above a radiator unit for chip, through being provided with the tin cream layer between cooling tube structure 5 and the upper cover 2, improved chip 1's heat-sinking capability, be provided with the graphite alkene coating through the surface at upper cover 2, improved product heat radiation ability.
Another aspect of the present invention provides a working machine, including the controller as described above.
The utility model discloses an operation machinery, because indirectly including as above be used for the radiator unit of chip, through being provided with the tin cream layer between cooling tube structure 5 and the upper cover 2, improved chip 1's heat-sinking capability, be provided with the graphite alkene coating through the surface at upper cover 2, improved product heat radiation ability.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (10)
1. A heat dissipation assembly for a chip, the chip being located in a cavity defined by an upper cover and a lower cover, comprising:
the heat conduction buffer piece is arranged on one side of the chip;
the heat radiation tube structure is closely contacted with one side of the heat conduction buffer part far away from the chip; and the heat dissipation tube structure is connected with the upper cover through a tin paste layer.
2. The heat dissipation assembly for a chip of claim 1, wherein the heat dissipation tube structure comprises:
the heat dissipation base is in close contact with one side, far away from the chip, of the heat conduction buffer piece;
the radiating pipe, set up in the opposite side of heat dissipation base, just the radiating pipe with connect through the tin cream layer between the upper cover.
3. The heat dissipating module for a chip as claimed in claim 2, wherein there are a plurality of heat dissipating tubes, and a plurality of heat dissipating tubes can extend to each edge of the upper cover.
4. The heat dissipating module for a chip as claimed in claim 2, wherein the contact area of the heat dissipating pipe and the top cover is larger than the cross-sectional area of the heat dissipating base.
5. The heat dissipation assembly for a chip of claim 2, wherein the heat dissipation base comprises:
one side of the mounting part is in close contact with one side of the heat conduction buffering part far away from the chip, and the other side of the mounting part is connected with the radiating pipe;
the fixing part is integrally connected to two sides of the mounting part and is used for being connected with the upper cover.
6. The heat dissipating assembly for a chip as claimed in claim 2, wherein the heat dissipating tube is L-shaped or U-shaped.
7. The heat dissipation assembly for a chip of claim 1, wherein an outer surface of the upper cover is provided with a graphene coating.
8. The heat dissipation assembly for a chip of claim 1, wherein the heat dissipation tube structure is a copper heat dissipation tube structure; the heat conduction buffer piece is a heat conduction silica gel sheet or heat conduction silicone grease.
9. A controller comprising the heat dissipating assembly for a chip of any one of claims 1-8.
10. A work machine comprising the controller of claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222305915.6U CN218217969U (en) | 2022-08-31 | 2022-08-31 | Heat dissipation assembly for chip, controller and operation machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222305915.6U CN218217969U (en) | 2022-08-31 | 2022-08-31 | Heat dissipation assembly for chip, controller and operation machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218217969U true CN218217969U (en) | 2023-01-03 |
Family
ID=84628902
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222305915.6U Active CN218217969U (en) | 2022-08-31 | 2022-08-31 | Heat dissipation assembly for chip, controller and operation machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218217969U (en) |
-
2022
- 2022-08-31 CN CN202222305915.6U patent/CN218217969U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7623349B2 (en) | Thermal management apparatus and method for a circuit substrate | |
| US7495915B2 (en) | Heat dissipation system | |
| GB2341230A (en) | Plate type heat pipe and cooling structure using it | |
| JP2003188321A (en) | Heat sink | |
| WO2005043619A1 (en) | Variable denisty graphite foam heat sink | |
| US20060227515A1 (en) | Cooling apparatus for electronic device | |
| JP2928236B1 (en) | Heat dissipating member for heating element | |
| CN218217969U (en) | Heat dissipation assembly for chip, controller and operation machine | |
| JP2019075538A (en) | Semiconductor thermal-conductive heat sink structure | |
| WO1999053256A1 (en) | Plate type heat pipe and its installation structure | |
| JP2023159853A (en) | Heat-absorbing chassis for fan-less electronic component | |
| CN215834516U (en) | Heat conducting device for electronic element | |
| CN211580514U (en) | Heat dissipation device and electronic equipment | |
| CN214046113U (en) | High-thermal-conductivity aluminum-based copper-clad plate | |
| WO2021233241A1 (en) | Power conversion apparatus | |
| JPH08204072A (en) | Device for cooling electronic parts | |
| CN212115767U (en) | Circuit board assembly and electronic device | |
| CN207398124U (en) | A kind of radiator structure of semiconductor components and devices | |
| CN111132524A (en) | Radiator for electronic product | |
| CN215991724U (en) | Circuit board with heat dissipation function | |
| JPH0677347A (en) | Substrate | |
| CN212970579U (en) | Radiator with graphite sheet and electronic device radiating structure | |
| TWI828976B (en) | Heat dissipation element for semiconductor power devices and circuit board having the same | |
| CN214507721U (en) | Heat radiation structure for power device | |
| CN220044012U (en) | Electronic equipment heat abstractor and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |