CN215991724U - Circuit board with heat dissipation function - Google Patents
Circuit board with heat dissipation function Download PDFInfo
- Publication number
- CN215991724U CN215991724U CN202122143124.3U CN202122143124U CN215991724U CN 215991724 U CN215991724 U CN 215991724U CN 202122143124 U CN202122143124 U CN 202122143124U CN 215991724 U CN215991724 U CN 215991724U
- Authority
- CN
- China
- Prior art keywords
- heat
- heat dissipation
- plate
- circuit board
- metal copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 76
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 29
- 229910052802 copper Inorganic materials 0.000 claims abstract description 29
- 239000010949 copper Substances 0.000 claims abstract description 29
- 229910052751 metal Inorganic materials 0.000 claims abstract description 27
- 239000002184 metal Substances 0.000 claims abstract description 27
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000000741 silica gel Substances 0.000 claims abstract description 10
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 10
- 238000009413 insulation Methods 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 8
- 239000006096 absorbing agent Substances 0.000 claims description 4
- 238000010521 absorption reaction Methods 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 12
- 230000002035 prolonged effect Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 5
- 229920001296 polysiloxane Polymers 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to the technical field of circuit boards, and discloses a circuit board with a heat dissipation function, which comprises a circuit board body and a heat dissipation device, wherein the heat dissipation device comprises a heat conduction insulating plate, a metal copper heat absorption plate, a first heat dissipation plate and a second heat dissipation plate, the bottom of the circuit board body is fixedly arranged on the inner wall of the heat conduction insulating plate, the heat conduction insulating plate is concave, the first heat dissipation plate comprises heat dissipation fins and a heat dissipation silica gel gasket, the heat conduction insulating plate is used for facilitating heat conduction of the circuit board body, the metal copper heat absorption plate is used for facilitating heat absorption of the conducted heat, the first heat dissipation plate and the second heat dissipation plate are used for dissipating the heat on the metal copper heat absorption plate, and the heat dissipation is facilitated, the service life is prolonged, and the heat dissipation effect is achieved.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a circuit board with a heat dissipation function.
Background
The circuit board has the name: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, printed (copper etching technology) circuit board, etc. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout.
With the continuous development of electronic technology, the integration level of a circuit board is higher and higher, the number of electronic components on the circuit board is higher and higher, the power is higher and higher, and the temperature of the surface of the circuit board is also increased, so that the requirement on the heat dissipation effect of the circuit board is higher and higher, and as electronic products enter the times of component miniaturization, high-density installation and high-heat-generation assembly, if the heat dissipation is performed only by the surfaces of components with very small surface areas, the heat dissipation is not enough, and once the problem of non-ideal heat dissipation occurs, serious negative effects can be brought to the work.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a circuit board with a heat dissipation function, and the purpose of convenient use is achieved.
In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a circuit board with heat dissipation function, includes circuit board body and heat abstractor, heat abstractor is including heat conduction insulation board, metal copper absorber plate, first heating panel and second heating panel, the bottom of circuit board body and the inner wall fixed mounting of heat conduction insulation board, the shape of heat conduction insulation board is concave type form, first heating panel is including radiating fin and heat dissipation silica gel gasket.
Preferably, the bottom of the inner wall of the heat-conducting insulating plate is provided with a heat-conducting hole, the heat-conducting insulating plate is convenient for conducting heat to the circuit board body, and the heat-conducting hole is formed in the heat-conducting insulating plate, so that the heat-conducting strength is enhanced.
Preferably, the bottom of the heat-conducting insulating plate is fixedly mounted with the top of the metal copper heat-absorbing plate, and the metal copper heat-absorbing plate is arranged to absorb heat conveniently from the conducted heat.
Preferably, the bottom of the metal copper heat absorbing plate is fixedly mounted with the top of the first heat dissipating plate.
Preferably, the bottom of the first heat dissipation plate and the top of the second heat dissipation plate are fixedly installed.
Preferably, the radiating fins are arranged between the bottom of the metal copper heat absorbing plate and the top of the first radiating plate, the radiating silica gel gasket is arranged between the bottom of the first radiating plate and the top of the second radiating plate, and the radiating fins and the radiating silica gel gasket are arranged, so that the radiating capacity of the circuit board is improved, and the stability and the reliability of the working operation of the circuit board are ensured.
Preferably, the second heat dissipation plate is provided with heat dissipation holes which are arranged at equal intervals.
The utility model provides a circuit board with a heat dissipation function. The method has the following beneficial effects:
(1) the heat-conducting insulating plate is arranged, the metal copper heat-absorbing plate is arranged, the first heat-dissipating plate and the second heat-dissipating plate are arranged, the heat-conducting insulating plate is used for conducting heat to the circuit board body conveniently, the metal copper heat-absorbing plate is used for absorbing heat conducted out conveniently, and the first heat-dissipating plate and the second heat-dissipating plate are used for dissipating heat on the metal copper heat-absorbing plate, so that the heat can be dissipated quickly, the service life is prolonged, and the heat-dissipating effect is achieved.
(2) The heat-conducting holes are formed in the heat-conducting insulating plate, so that the heat-conducting strength is enhanced, the heat-radiating capacity of the circuit board is improved by arranging the heat-radiating fins and the heat-radiating silica gel gaskets, the stability and the reliability of the working operation of the circuit board are ensured, and the heat-radiating holes are arranged at equal intervals, so that the heat-radiating effect is achieved, and the heat-radiating effect is achieved.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of a first heat dissipation plate according to the present invention;
fig. 3 is a schematic diagram of a second heat dissipation plate structure according to the present invention.
In the figure: the circuit board comprises a circuit board body 1, a heat dissipation device 2, a heat conduction insulating plate 201, a heat conduction hole 202, a metal copper heat absorption plate 203, a first heat dissipation plate 204, a heat dissipation fin 2041, a heat dissipation silica gel gasket 2042, a second heat dissipation plate 205 and a heat dissipation hole 206.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the utility model and are not to be construed as limiting the utility model.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the utility model and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the utility model.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
As shown in fig. 1-3, the present invention provides a technical solution: a circuit board with heat dissipation function comprises a circuit board body 1 and a heat dissipation device 2, wherein the heat dissipation device 2 comprises a heat conduction insulating plate 201, a metal copper heat absorption plate 203, a first heat dissipation plate 204 and a second heat dissipation plate 205, the bottom of the circuit board body 1 is fixedly installed with the inner wall of the heat conduction insulating plate 201, the heat conduction insulating plate 201 is concave, the bottom of the inner wall of the heat conduction insulating plate 201 is provided with a heat conduction hole 202, the bottom of the heat conduction insulating plate 201 is fixedly installed with the top of the metal copper heat absorption plate 203, the bottom of the metal copper heat absorption plate 203 is fixedly installed with the top of the first heat dissipation plate 204, the bottom of the first heat dissipation plate 204 is fixedly installed with the top of the second heat dissipation plate 205, the heat conduction insulating plate 201, the metal copper heat absorption plate 203, the first heat dissipation plate 204 and the second heat dissipation plate 205 are arranged, the heat conduction insulating plate 20 is used for facilitating heat conduction of the circuit board body, and the metal copper heat absorption plate 203 is used, the first heat dissipation plate 204 comprises heat dissipation fins 2041 and a heat dissipation silicone gasket 2402, the heat dissipation fins 2041 are arranged between the bottom of the metal copper heat absorption plate 203 and the top of the first heat dissipation plate 204, the heat dissipation silicone gasket 2402 is arranged between the bottom of the first heat dissipation plate 204 and the top of the second heat dissipation plate 205, the second heat dissipation plate 205 is provided with heat dissipation holes 206, the heat dissipation holes 206 are arranged at equal intervals, the heat conduction strength is enhanced by arranging heat conduction holes 202 on the heat conduction insulating plate 201, the heat dissipation capability of the circuit board is improved by arranging the heat dissipation fins 2041 and the heat dissipation silicone gasket 2402, and the stability and the reliability of the working and the running of the circuit board are ensured, through setting up louvre 206, because louvre 206 is the equidistance and arranges to play the radiating effect of being convenient for, reached radiating effect.
When using, use heat conduction insulation board 20, be convenient for to carry out the heat conduction to the circuit board body, use metal copper absorber plate 203, be convenient for absorb the heat to the heat that derives, use first heating panel 204 and second heating panel 205, come to dispel the heat on the metal copper absorber plate 203, be favorable to saying fast that the heat dissipates away, improve life, through seting up heat conduction hole 202 on heat conduction insulation board 201, strengthen heat conduction intensity, through setting up radiating fin 2041, heat dissipation silica gel gasket 2402, the radiating ability of circuit board is improved, circuit board work operation's stability and reliability have been guaranteed, through setting up louvre 206, because louvre 206 is the equidistance and arranges, thereby played the radiating effect of being convenient for.
In conclusion, by arranging the heat-conducting insulating plate 201, the metal copper heat-absorbing plate 203, the first heat-dissipating plate 204 and the second heat-dissipating plate 205, the heat-conducting insulating plate 20 is used, heat conduction to the circuit board body is facilitated, the metal copper heat-absorbing plate 203 is used, heat absorption to the conducted heat is facilitated, the first heat-dissipating plate 204 and the second heat-dissipating plate 205 are used for dissipating the heat on the metal copper heat-absorbing plate 203, heat dissipation is facilitated, the service life is prolonged, and the heat dissipation effect is achieved.
Through set up heat conduction hole 202 on heat conduction insulation board 201, reinforcing heat conduction intensity through setting up radiating fin 2041, heat dissipation silica gel gasket 2402, improves the radiating ability of circuit board, has guaranteed the stability and the reliability of circuit board work operation, through setting up louvre 206, because louvre 206 is the equidistance and arranges to play the radiating effect of being convenient for, reached radiating effect.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Finally, it should be noted that: the above embodiments are merely preferred embodiments of the present invention, and not intended to limit the scope of the present invention, so that equivalent changes in structure, shape and principle of the present invention are all covered by the present invention.
Claims (7)
1. The utility model provides a circuit board with heat dissipation function, includes circuit board body (1) and heat abstractor (2), its characterized in that: heat abstractor (2) is including heat conduction insulation board (201), metal copper absorber plate (203), first heating panel (204) and second heating panel (205), the bottom of circuit board body (1) and the inner wall fixed mounting of heat conduction insulation board (201), the shape of heat conduction insulation board (201) is the concave type form, first heating panel (204) are including radiating fin (2041) and heat dissipation silica gel gasket (2402).
2. The circuit board with the heat dissipation function according to claim 1, wherein: the bottom of the inner wall of the heat-conducting insulating plate (201) is provided with a heat-conducting hole (202).
3. The circuit board with the heat dissipation function according to claim 1, wherein: the bottom of the heat-conducting insulating plate (201) is fixedly arranged with the top of the metal copper heat-absorbing plate (203).
4. The circuit board with the heat dissipation function according to claim 1, wherein: the bottom of the metal copper heat absorbing plate (203) is fixedly arranged with the top of the first heat dissipating plate (204).
5. The circuit board with the heat dissipation function according to claim 1, wherein: the bottom of the first heat dissipation plate (204) and the top of the second heat dissipation plate (205) are fixedly arranged.
6. The circuit board with the heat dissipation function according to claim 1, wherein: the radiating fins (2041) are arranged between the bottom of the metal copper heat absorbing plate (203) and the top of the first radiating plate (204), and the radiating silica gel gasket (2402) is arranged between the bottom of the first radiating plate (204) and the top of the second radiating plate (205).
7. The circuit board with the heat dissipation function according to claim 1, wherein: the second heat dissipation plate (205) is provided with heat dissipation holes (206), and the heat dissipation holes (206) are arranged at equal intervals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122143124.3U CN215991724U (en) | 2021-09-07 | 2021-09-07 | Circuit board with heat dissipation function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122143124.3U CN215991724U (en) | 2021-09-07 | 2021-09-07 | Circuit board with heat dissipation function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215991724U true CN215991724U (en) | 2022-03-08 |
Family
ID=80467245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122143124.3U Expired - Fee Related CN215991724U (en) | 2021-09-07 | 2021-09-07 | Circuit board with heat dissipation function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215991724U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115802585A (en) * | 2022-10-25 | 2023-03-14 | 苏州东岱电子科技有限公司 | A circuit board heat dissipation structure and its processing technology |
-
2021
- 2021-09-07 CN CN202122143124.3U patent/CN215991724U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115802585A (en) * | 2022-10-25 | 2023-03-14 | 苏州东岱电子科技有限公司 | A circuit board heat dissipation structure and its processing technology |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201104378Y (en) | Shielding and Heat Dissipation | |
| CN213847398U (en) | Circuit board heat dissipation structure and electrical equipment | |
| CN215991724U (en) | Circuit board with heat dissipation function | |
| JP4728522B2 (en) | heatsink | |
| CN209170729U (en) | A new type of LED circuit board | |
| CN218825441U (en) | Computer mainboard radiator | |
| CN215871957U (en) | Fine circuit flexible circuit board combining thick gold, immersion gold and OSP | |
| CN217064199U (en) | Heat radiation structure of motor controller | |
| CN211580514U (en) | Heat dissipation device and electronic equipment | |
| JPH11237193A (en) | Plate type heat pipe and mounting structure using it | |
| CN209861447U (en) | Heat radiation structure of motor controller | |
| CN210072029U (en) | Test circuit board of large screen | |
| CN220733091U (en) | Double-sided radiating PCB circuit board | |
| CN219478432U (en) | Power conversion device with heat dissipation structure | |
| CN223157294U (en) | A circuit board heat dissipation structure | |
| CN223108882U (en) | A heat dissipation structure at the bottom of a chip | |
| CN221727100U (en) | A high power density power component with integrated heat sink and plug-and-play function | |
| CN220139990U (en) | power converter | |
| CN216930400U (en) | A stable home appliance circuit board that can quickly dissipate heat | |
| CN222089821U (en) | Printed circuit board heat radiation structure | |
| CN219372670U (en) | Be applied to quick installation radiator unit of PCB plug-in components pin | |
| CN222531885U (en) | A waterproof and pressure-resistant circuit board | |
| CN222234660U (en) | A power module | |
| CN218217969U (en) | Heat dissipation assembly for chip, controller and operation machine | |
| CN219697996U (en) | Heat radiation structure of patch power MOS tube on PCB |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220308 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |